Wiring body and display device

Abstract

This wiring body is provided with a base material, a mesh-shaped conductor layer provided on the base material, and a resin layer covering the conductor layer, the resin layer having a first resin layer and a second resin layer in this order from the base material side, and the conductor layer penetrating the first resin layer.

Description

Technical Field

[0001] The present disclosure relates to a wiring body and a display device. Background Art

[0002] Currently, a wiring structure comprising a substrate, a mesh-shaped conductive pattern provided on the substrate, and a resin layer provided on the substrate is known (e.g., Japanese Patent Publication No. 2021-163571). Grooves are formed in the resin layer, and conductive lines of the conductive pattern are formed within the grooves. The lower surface of the conductive line is located at a position separated from the main surface of the substrate. Summary of the Invention

[0003] Here, in the wiring body described above, by exposing the conductive wires on the surface of the resin layer, the surface flatness of the wiring body is improved, and the sheet resistance of the conductive layer of the wiring body is reduced.

[0004] Therefore, an object of the present disclosure is to provide a wiring body and a display device capable of improving the flatness of the wiring body and reducing the sheet resistance.

[0005] A wiring body according to one aspect of the present disclosure includes: a base material; a mesh-shaped conductive layer provided on the base material; and a resin layer covering the conductive layer, wherein the resin layer includes a first resin layer and a second resin layer in this order from the base material side, and the conductive layer penetrates the first resin layer.

[0006] A display device according to one aspect of the present disclosure includes the above-mentioned wiring body.

[0007] Effects of the Invention

[0008] According to one aspect of the present disclosure, it is possible to provide a wiring body and a display device capable of improving the flatness of the wiring body and reducing the sheet resistance. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a plan view showing one embodiment of a conductive film including wiring bodies.

[0010] Figure 2 It is along Figure 1 Cross-sectional view along line II-II.

[0011] Figure 3 It is a cross-sectional view of a conductive film showing a modified example.

[0012] Figure 4 It is a cross-sectional view showing one embodiment of a display device.

[0013] Figure 5 This is a top view of an antenna including a wiring body.

[0014] Figure 6This is a cross-sectional view of a wiring body.

[0015] Figure 7 Yes Figure 6 An enlarged cross-sectional view of the structure near the conductive line is shown.

[0016] Figure 8 This is a diagram for explaining the derivation method of formula (1).

[0017] Figure 9 This is a graph for explaining the derivation method of formula (1).

[0018] Description of Reference Numerals

[0019] 1 ...light-transmitting substrate (substrate), 5 ...conductive layer, 7 ...first resin layer, 8 ...second resin layer, 9 ...resin layer, 50 ...conductive wire, 100 ...display device, 200 ...wiring body. DETAILED DESCRIPTION

[0020] Several embodiments of the present disclosure are described in detail below, but the present disclosure is not limited to the following embodiments.

[0021] Figure 1 1 is a plan view showing a conductive film including a wiring body 200 according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 The conductive film 20 includes an antenna 300 , and the antenna 300 includes a wiring body 200 . Figure 1 and Figure 2 The conductive film 20 shown includes: a film-shaped light-transmitting substrate 1 (substrate), a conductor layer 5 provided on one main surface 1S of the light-transmitting substrate 1, and a resin layer 9 covering the conductor layer 5. The conductor layer 5 includes: a conductor portion 3, which extends in the direction along the main surface 1S of the light-transmitting substrate 1 and includes a portion having a pattern including a plurality of openings 3a. The resin layer 9 includes a first resin layer 7 and a second resin layer 8 in that order from the light-transmitting substrate 1 side. The first resin layer 7 is provided on one main surface 1S of the light-transmitting substrate 1. The first resin layer 7 includes an insulating resin portion 7A embedded in the opening 3a of the conductor portion 3, and a light-transmitting resin layer 7B provided on the outer peripheral side of the conductor portion 3. The second resin layer 8 is provided to cover the first resin layer and the conductor layer 5. Figure 2 In FIG. 5 , the conductor layer 5 is shown in a deformed state, and the width of the conductor portion 3 is emphasized. In addition, the thickness of each layer is also shown in a deformed state. The details of the thickness of each layer will be described later. Figure 1 In the example shown, the conductive layer 5 is formed near one short side of the conductive film 20 . However, the position where the conductive layer 5 is formed is not particularly limited, and the conductive layer 5 may be formed near a long side.

[0022] The light-transmitting substrate 1 has a light transmittance that is required when the conductive film 20 is incorporated into a display device. Specifically, the light-transmitting substrate 1 may have a total light transmittance of 90 to 100%. The light-transmitting substrate 1 may have a haze of 0 to 5%.

[0023] The light-transmitting substrate 1 may be, for example, a transparent resin film, examples of which include films of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI). Alternatively, the light-transmitting substrate 1 may be a glass substrate.

[0024] For example, Figure 3 As shown, the light-transmitting substrate 1 may be a laminate comprising a light-transmitting support film 11, an intermediate resin layer 12, and a base layer 13 sequentially provided on the support film 11. The support film 11 may be the transparent resin film described above. The base layer 13 is provided for forming the conductor portion 3 by chemical plating or the like. When forming the conductor portion 3 by other methods, the base layer 13 may not necessarily be provided. The intermediate resin layer 12 may not be provided between the support film 11 and the base layer 13.

[0025] The thickness of the light-transmitting substrate 1 or the supporting film 11 constituting the light-transmitting substrate 1 may be 10 μm or more, 20 μm or more, or 35 μm or more, or 500 μm or less, 200 μm or less, or 100 μm or less.

[0026] The intermediate resin layer 12 can improve the adhesion between the support film 11 and the base layer 13. When the base layer 13 is not provided, the intermediate resin layer 12 can be provided between the support film 11 and the light-transmitting resin layer 7B to improve the adhesion between the support film 11 and the light-transmitting resin layer 7B.

[0027] The intermediate resin layer 12 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the intermediate resin layer 12 is acrylic resin. An example of the inorganic filler is silica.

[0028] The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, or 10 μm or less, 5 μm or less, or 2 μm or less.

[0029] The base layer 13 may also be a layer containing a catalyst and a resin. The resin may also be a cured product of a curable resin composition. Examples of curable resins contained in the curable resin composition include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dichloroprene resins, benzocyclobutene resins, episulfide resins, enethiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and ultraviolet curing resins containing functional groups that undergo polymerization reactions caused by ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0030] The catalyst contained in the base layer 13 may also be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from the group consisting of Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, or may be Pd. The catalyst may be a single species or a combination of two or more species. Typically, the catalyst is dispersed in the resin as catalyst particles.

[0031] The content of the catalyst in the base layer 13 may be 3 mass % or more, 4 mass % or more, or 50 mass % or less, 40 mass % or less, or 25 mass % or less, based on the total amount of the base layer 13 .

[0032] The thickness of the base layer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, or 500 nm or less, 300 nm or less, or 150 nm or less.

[0033] The light-transmitting substrate 1 may further include a protective layer provided on the main surface of the support film 11 opposite to the light-transmitting resin layer 7B and the conductor portion 3. The provision of the protective layer prevents damage to the support film 11. The protective layer can be the same layer as the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or greater, 50 nm or greater, or 500 nm or greater, and may also be 10 μm or less, 5 μm or less, or 2 μm or less.

[0034] The conductor portion 3 constituting the conductor layer 5 includes a portion having a pattern including openings 3a. The pattern including openings 3a is a mesh-like pattern formed by a plurality of intersecting linear portions, comprising a plurality of regularly arranged openings 3a. The conductor portion 3 having a mesh-like pattern can function effectively as, for example, a radiation conductor and a power supply line for the antenna 300. Alternatively, the conductor portion 3 may include a planar pattern without openings 3a, functioning as a terminal or ground pad. Details of the structure of the pattern of the conductor portion 3 in the conductor layer 5 will be described later.

[0035] Conductor portion 3 may also contain a metal. Conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, and may also contain copper. Conductor portion 3 may also be a plated metal formed by a plating method. Conductor portion 3 may also contain non-metallic elements such as phosphorus within a range that maintains appropriate conductivity.

[0036] The conductor portion 3 may also be a laminate composed of multiple layers. In addition, the conductor portion 3 may also have a blackened layer as a surface layer portion opposite to the light-transmitting substrate 1. The blackened layer can contribute to improving the visibility of a display device incorporating the conductive film.

[0037] The insulating resin portion 7A is formed of a light-transmitting resin and is provided so as to fill the opening 3 a of the conductor portion 3 .

[0038] The light-transmitting resin layer 7B is formed of a light-transmitting resin. The total light transmittance of the light-transmitting resin layer 7B may be 90 to 100%. The haze of the light-transmitting resin layer 7B may be 0 to 5%.

[0039] The difference in refractive index between the light-transmitting substrate 1 (or the refractive index of the supporting film constituting the light-transmitting substrate 1) and the light-transmitting resin layer 7B may also be 0.1 or less. This makes it easier to further ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or greater, or 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflective spectrophotometer. From the perspective of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may also have substantially the same thickness.

[0040] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may also be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, examples of which include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dichloroprene resins, benzocyclobutene resins, episulfide resins, enethiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo polymerization reactions induced by ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0041] The resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B may be the same. When the insulating resin portion 7A and the light-transmitting resin layer 7B are formed from the same resin, their refractive indices are equal, thereby further improving the uniformity of the optical path length through the conductive film 20. When the resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B are the same, the insulating resin portion 7A and the light-transmitting resin layer 7B can be easily formed simultaneously by patterning a single curable resin layer using a coining method or the like.

[0042] The resin forming second resin layer 8 can be selected from the resins cited as the materials for insulating resin portion 7A and light-transmitting resin layer 7B of first resin layer 7. The optical properties of second resin layer 8, such as light transmittance and refractive index, can also be within the same ranges as those exemplified for light-transmitting resin layer 7B. Furthermore, first resin layer 7 and second resin layer 8 can be made of the same resin material. However, first resin layer 7 and second resin layer 8 can also be made of different resin materials.

[0043] The conductive film 20 can be manufactured, for example, by a method involving pattern formation using an imprinting method. One example method for manufacturing the conductive film 20 includes: preparing a light-transmitting substrate 1 having a support film and a base layer containing an intermediate resin layer and a catalyst disposed on one main surface of the support film; forming a curable resin layer on the main surface 1S of the light-transmitting substrate 1 on the base layer side; forming a groove through which the base layer is exposed by an imprinting method using a mold having protrusions; forming a conductor portion 3 filling the groove by an electroless plating method in which a metal plating layer grows from the base layer; and forming a second resin layer 8 so as to cover the first resin layer 7 and the conductor layer 5. By curing the curable resin layer while the mold is pressed into the curable resin layer, an insulating resin portion 7A having a pattern including openings having the inverse shape of the molded protrusions and a light-transmitting resin layer 7B are simultaneously formed. The method for forming the insulating resin portion 7A having a pattern including openings is not limited to the imprinting method; any method such as photolithography can be applied.

[0044] The conductive member described above as an example can be incorporated into a display device as, for example, a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic EL display device. Figure 4 This is a cross-sectional view showing one embodiment of a display device incorporating a conductive film. Figure 4 The display device 100 shown in the figure includes: an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a cover glass 40. The conductive film 20, the polarizing plate 30, and the cover glass 40 are stacked in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The structure of the display device is not limited to Figure 4 The polarizer 30 and the cover glass 40 can be used as components commonly used in display devices. The polarizer 30 and the cover glass 40 may not necessarily be provided. The light for image display emitted from the image display area 10S of the image display unit 10 passes through a path having a highly uniform optical path length including the conductive film 20. Thus, a good image display with highly uniform moiré patterns can be performed.

[0045] Next, refer to Figure 5 , the structure of the conductor layer 5 and its surroundings will be described in more detail. Figure 5 It is a plan view of the antenna 300 including the wiring body 200 . Figure 5 A portion of the conductor layer 5 is shown in an enlarged manner. In the following description, the XY coordinates are set on a plane parallel to the main surface 1S. The Y axis direction is the direction along the main surface 1S. Figure 1 In the example shown, it corresponds to the direction perpendicular to the edge of the conductive film 20. The center side of the conductive film 20 is set as the positive side of the Y-axis direction, and the outer peripheral side of the conductive film 20 is set as the negative side of the Y-axis direction. The X-axis direction is the direction perpendicular to the Y-axis direction along the main surface 1S. Figure 1 In the example shown, this corresponds to the direction in which the side of the conductive film 20 extends. The side in which the side of the conductive film 20 extends is defined as the positive side in the X-axis direction, and the other side is defined as the negative side in the X-axis direction. Furthermore, the direction perpendicular to the X-axis and Y-axis directions is defined as the Z-axis direction. The side of the light-transmitting substrate 1 on which the resin layer 9 is provided is defined as the positive side in the Z-axis direction.

[0046] like Figure 5As shown, the mesh-like pattern of the conductor layer 5 includes a plurality of first conductive lines 51 and a plurality of second conductive lines 52. The first conductive lines 51 are linear conductor portions 3 extending parallel to the Y-axis direction. The plurality of first conductive lines 51 are arranged so as to be spaced apart from each other in the X-axis direction. The plurality of first conductive lines 51 are arranged so as to be spaced apart at equal intervals. The second conductive lines 52 are linear conductor portions 3 extending parallel to the X-axis direction. The plurality of second conductive lines 52 are arranged so as to be spaced apart from each other in the Y-axis direction. The plurality of second conductive lines 52 are arranged so as to be spaced apart at equal intervals. The thickness of the conductive lines 51 and 52 is not particularly limited and can be set to, for example, 1 to 3 μm. The spacing between the conductive lines 51 and 52 is also not particularly limited and can be set to, for example, 100 to 300 μm. Furthermore, if the first conductive lines 51 extend in the Y-axis direction, they do not need to be parallel to the Y-axis direction, and if the second conductive lines 52 extend in the X-axis direction, they do not need to be parallel to the X-axis direction. When the conductive lines 51 and 52 are not described in distinction, they may be referred to as the conductive line 50. Figure 5 In FIG. 5 , the conductive lines 51 and 52 are shown through the second resin layer 8 and are therefore shown as hidden lines.

[0047] The conductive layer 5 includes a radiating element 5A and a power supply 5B. The radiating element 5A is the region that radiates signals as an antenna. The radiating element 5A has a rectangular shape with two sides parallel to the Y-axis and two sides parallel to the X-axis. The power supply 5B supplies power to the radiating element 5A. The power supply 5B has a strip-like shape extending parallel to the Y-axis. The power supply 5B is connected to the negative side of the radiating element 5A in the Y-axis direction. The power supply 5B is connected to a terminal (not shown).

[0048] Next, in addition to the reference Figure 5 In addition, refer to Figure 6 , the structures of the resin layer 9 and the conductor layer 5 are described in more detail. Figure 6 This is a cross-sectional view of the wiring body 200. In the following description, the words "up" and "down" are used for explanation, but this does not limit the posture when the wiring body 200 is used. Sometimes the positive side in the Z-axis direction is set as "up" and the negative side is set as "down". As mentioned above, Figure 6 As shown, the first resin layer 7 is provided on the light-transmitting substrate 1. The first resin layer 7 is provided to cover the main surface 1S on the positive side in the Z-axis direction of the light-transmitting substrate 1. The first resin layer 7 has an upper surface 7a on the positive side in the Z-axis direction and a lower surface 7b on the negative side. The lower surface 7b on the negative side is provided to contact the main surface 1S of the light-transmitting substrate 1.

[0049] The first resin layer 7 is provided with mesh-like grooves 60 that penetrate the first resin layer 7 in the Z-axis direction (thickness direction). The mesh-like grooves 60 extend from the upper surface 7a on the positive side in the Z-axis direction to the lower surface 7b on the negative side. The conductive wires 50 of the conductor layer 5 are arranged in the mesh-like grooves 60. Figure 5 As shown, the mesh-like groove 60 includes: a first groove 61 in which the first conductive line 51 is arranged, and a second groove 62 in which the second conductive line 52 is arranged. The first groove 61 is arranged with a pitch and width corresponding to the first conductive line 51 described above. The second groove 62 is arranged with a pitch and width corresponding to the second conductive line 52 described above. In other words, the first groove 61 is a straight groove extending parallel to the Y-axis direction. The plurality of first grooves 61 are arranged to be spaced apart from each other in the X-axis direction. The plurality of first grooves 61 are arranged to be spaced apart at equal intervals. The second groove 62 is a straight groove extending parallel to the X-axis direction. The plurality of second grooves 62 are arranged to be spaced apart from each other in the Y-axis direction. The plurality of second grooves 62 are arranged to be spaced apart at equal intervals.

[0050] With this structure, the conductor layer 5 is formed to penetrate the first resin layer 7. That is, the conductive line 50 extends from the upper surface 7a on the positive side of the first resin layer 7 to the lower surface 7b on the negative side. The upper surface 50a of the conductive line 50 extends to the same position as the upper surface 7a of the first resin layer 7 or a position near the upper surface 7a. The lower surface 50b of the conductive line 50 is in contact with the main surface 1S of the light-transmitting substrate 1 (see also Figure 7 ). In addition, the state in which the conductor layer 5 penetrates the first resin layer 7 means that the conductive wire 50 is arranged in the groove 60 of the first resin layer 7 and reaches the main surface 1S of the light-transmitting substrate 1. Therefore, the upper surface 50a of the conductive wire 50 does not need to reach the upper surface 7a of the first resin layer 7, and may be arranged on the negative side of the upper surface 7a in the Z-axis direction.

[0051] The second resin layer 8 is provided on the first resin layer 7 and the conductor layer 5. The lower surface 8b of the second resin layer 8 is arranged to be in contact with the upper surface 7a of the first resin layer 7 and the upper surface 50a of the conductive line 50. At this time, the upper surface 8a of the second resin layer 8 becomes the uppermost surface of the wiring body 200. Figure 5As shown, the second resin layer 8 not only covers the entirety of the radiating element portion 5A and the power supply portion 5B of the conductive layer 5, but also covers the light-transmitting resin layer 7B in the area outside of these radiating element portion 5A and the power supply portion 5B. Furthermore, if the terminal connected to the power supply portion 5B is formed in the wiring body 200, the terminal is not covered by the second resin layer 8. In this case, the area on the side connected to the terminal of the power supply portion 5B is also not covered by the second resin layer 8. Furthermore, the area on the side connected to the terminal of the power supply portion 5B not covered by the second resin layer 8 may be approximately half of the power supply portion 5B in the Y-axis direction.

[0052] Next, refer to Figure 7 , a more detailed structure of the conductive wire 50 is described. Figure 7 Yes Figure 6 An enlarged cross-sectional view of the structure near the conductive line 50 is shown. Figure 7 In the figure, as the conductive line 50, a cross section of a first conductive line 51 extending in the Y-axis direction is illustrated, but a second conductive line 52 extending in the X-axis direction and its surroundings also have the same structure. Figure 7 As shown, the conductive wire 50 has side surfaces 56A and 56B that face each other in the width direction (here, the X-axis direction). Side surface 56A is located on one side in the width direction (the negative side in the X-axis direction), and side surface 56B is located on the other side in the width direction (the positive side in the X-axis direction). As shown in the figure, the upper surface 50a of the conductive wire 50 may also be curved so as to protrude upward. In addition, the groove 60 has inner surfaces 60a and 60b that face each other in the width direction. The side surfaces 56A and 56B of the conductive wire 50 are in surface contact with the inner surfaces 60a and 60b of the groove 60.

[0053] The width of the conductive wire 50 (the dimension in the X-axis direction) may also become wider as it moves toward one side in the height direction (the positive side in the Z-axis direction). That is, the width dimension W2 of the upper surface 50a of the conductive wire 50 is greater than the width dimension W1 of the lower surface 50b. The side surfaces 56A and 56B have a tapered shape that is inclined so that the distance between each other in the X-axis direction increases as it moves toward one side in the height direction (the positive side in the Z-axis direction). The width of the tapered conductive wire 50 is defined by the maximum dimension of the width of the conductive wire 50. In addition, the height H1 of the conductive wire 50 and the thickness T1 of the first resin layer 7 (the dimension in the height direction) may also be 1.5 to 5.0 μm. In this embodiment, the height H1 (the dimension in the height direction) of the conductive wire 50 is greater than the width (the dimension in the X-axis direction). The aspect ratio (height / width) obtained by dividing the height H1 of the conductive wire 50 by the width is greater than 1. The aspect ratio may also be greater than 2. The width W2 of the upper surface 50 a of the conductive line 50 may be 110 to 200% of the width W1 of the lower surface 50 b .

[0054] The first resin layer 7 has raised portions 66A and 66B that protrude from both sides of the groove 60 toward the side in the height direction (positive side in the Z-axis direction) of the upper surface 7a of the first resin layer 7. The raised portions 66A and 66B are portions of the first resin layer 7 that are raised near the corners between the side surfaces 56A and 56B and the upper surface 50a, gradually increasing in height toward the side in the height direction of the upper surface 7a of the first resin layer 7. The relationship between the height of the top of the curved surface of the upper surface 50a of the conductive wire 50 and the height of the upper surface 7a of the first resin layer 7 and the upper end portions of the raised portions 66A and 66B is not particularly limited. The raised portions 66A and 66B cover a portion of both ends of the upper surface 50a of the conductive wire 50 in the width direction, with the inner periphery 66a of the raised portions 66A and 66B covering them.

[0055] With the above-described structure, the first resin layer 7 covers the side surfaces 56A, 56B and a portion of the top surface 50a of the conductive wires 50 that constitute the conductor layer 5. Furthermore, the second resin layer 8 covers the first resin layer 7 and another portion of the top surface 50a of the conductive wires 50. The other portion of the top surface 50a refers to the portion of the top surface 50a that is exposed from the raised portions 66A, 66B of the first resin layer 7 and is located near the center of the width direction of the top surface 50a. The area of ​​the top surface 50a covered by the first resin layer 7 is smaller than the area of ​​the portion exposed from the first resin layer 7. Therefore, the area of ​​the top surface 50a of the conductive wires 50 covered by the second resin layer 8 is larger than the area of ​​the top surface 50a covered by the first resin layer 7. While the overall area of ​​the top surface 50a is assumed to be 100%, the second resin layer 8 may cover a range of 0 to 80% of the top surface 50a.

[0056] Next, the thickness of the second resin layer 8 is described. When the thickness of the second resin layer 8 is set to X and the resin refractive index of the resin layer 9 (here, the resin refractive index of the second resin layer 8) is set to Y, formula (1) can also be satisfied. The right side of formula (1) is the lower limit value of the thickness X at which the recognizability of the conductive wire 50 does not change when observed from the upper surface 8a side of the second resin layer 8. That is, even if the thickness X of the second resin layer 8 is larger than the right side of formula (1), the recognizability will not be improved, only the thickness will increase. Therefore, the thickness X can be set to a range that satisfies the conditions of formula (1). In addition, the lower limit value of the thickness X of the second resin layer 8 is not particularly limited, and the thickness X can also be greater than 0.5μm.

[0057] X≦-5.43×Y+11.664…(1)

[0058] The above formula (1) is further explained. Figure 8As shown in (a), for a model without the second resin layer 8, the identification line when the conductive line 50 is observed from an oblique angle of 45° is described. Here, the thickness of the first resin layer 7 (the height of the conductive line 50) is 3 μm, and the refractive index of the first resin layer 7 is 1.5. Figure 8 As shown in (a), the position P1 of the lower surface 50b of the conductive wire 50 is observed from the viewpoint VP at an angle of 45°. Figure 9 The relationship between the incident angle θ1 and the refraction angle θ2 shown in (a) is that the incident angle θ1 of the light from the position P1 of the lower surface 50b toward the viewpoint VP becomes 28°. According to the geometric relationship shown in Figure 8 (a), the virtual image of the position P1 of the lower surface 50b is observed from the viewpoint VP at the position P2. The position P1 of the lower surface 50b is the lowest position of the conductive wire 50, so the range VE that can be identified from the viewpoint VP is the range from the upper surface 50a of the conductive wire 50 to the position P2, which is about 1.6μm. Figure 8 As shown in (b), when the second resin layer 8 is provided, the position P2 of the virtual image of the position P1 of the lower surface 50b is arranged at a position larger than that of the lower surface 50b. Figure 8 The position P2 of (a) is high. The thickness of the second resin layer 8 is gradually increased. When the position P2 reaches the position of the upper surface 50a of the conductive line 50, the conductive line 50 cannot be observed from the viewpoint VP. The thickness of the second resin layer 8 at this time is about 3.4μm. Even if the thickness of the second resin layer 8 is increased to more than this, the visibility from the viewpoint VP does not change. In this way, the relationship between the thickness of the second resin layer 8 and the refractive index when the visibility does not change is plotted on Figure 9 (b) An approximate line NL is set for the plotted points. The approximate line NL is "y=-5.43x+11.664". Based on the approximate line NL, the formula (1) for the thickness of the second resin layer 8 is obtained.

[0059] Next, the functions and effects of the wiring body 200 and the display device 100 according to this embodiment will be described.

[0060] The wiring body 200 of this embodiment includes: a light-transmitting substrate 1 (substrate), a mesh-shaped conductor layer 5 arranged on the light-transmitting substrate 1, and a resin layer 9 covering the conductor layer 5, the resin layer 9 having a first resin layer 7 and a second resin layer 8 in sequence from the side of the light-transmitting substrate 1, and the conductor layer 5 penetrates the first resin layer 7.

[0061] According to the wiring body 200, the mesh-shaped conductor layer 5 provided on the light-transmitting substrate 1 is covered with a multilayer resin layer 9 composed of a first resin layer 7 and a second resin layer 8. Therefore, the height difference that may be generated by the conductor layer 5 on the surface of the wiring body 200 can be absorbed by the resin layer 9. Therefore, the flatness of the surface of the wiring body 200 can be improved. In the embodiment, the upper surface 8a of the second resin layer 8 becomes the surface of the wiring body 200. In addition, the conductor layer 5 passes through the first resin layer 7 on the side of the light-transmitting substrate 1. Therefore, the thickness of the line width of the conductive line 50 of the conductor layer 5 can be suppressed, and the volume of the conductor can be ensured. Therefore, the sheet resistance of the wiring body 200 can be reduced. According to the above, the flatness of the wiring body 200 can be improved and the sheet resistance can be reduced.

[0062] The second resin layer 8 may be thinner than the first resin layer 7. In this case, by thinning the second resin layer 8 that contributes to planarization, the surface of the wiring body 200 can be planarized while suppressing an increase in thickness.

[0063] The first resin layer 7 and the second resin layer 8 may be made of the same resin material. In this case, it is possible to suppress the influence on the visibility of the conductor layer 5 that may be caused by using multiple resin layers.

[0064] Alternatively, the aspect ratio obtained by dividing the height of the conductive wires 50 constituting the conductive layer 5 by the width may be greater than 1. In this case, by thinning the conductive wires 50, the visibility of the conductive layer 5 can be suppressed from increasing, and by ensuring the height of the conductive wires 50, the volume of the conductor can be ensured, thereby reducing the sheet resistance.

[0065] Alternatively, the first resin layer 7 may cover the side surfaces 56A, 56B and a portion of the upper surface 50a of the conductive wire 50 constituting the conductor layer 5, and the second resin layer 8 may cover the first resin layer 7 and another portion of the upper surface 50a of the conductive wire 50. In this case, the corners between the upper surface 50a and the side surfaces 56A, 56B of the conductive wire 50 are covered by the first resin layer 7. Therefore, the interfaces between the side surfaces 56A, 56B of the conductive wire 50 and the first resin layer 7, and the interface between the upper surface 50a of the conductive wire 50 and the second resin layer 8, can be prevented from being continuous, thereby preventing peeling.

[0066] Alternatively, the area of ​​the second resin layer 8 covering the upper surface 50a of the conductive wire 50 may be larger than the area of ​​the first resin layer 7 covering the upper surface 50a of the conductive wire 50. In this case, when the groove formed in the first resin layer 7 on the upper surface 50a (the space formed by the raised portion 66A, the raised portion 66B, and the upper surface 50a) is filled with the second resin layer 8, the width of the second resin layer 8 can be ensured. This ensures close adhesion between the resin layers due to the anchoring effect.

[0067] Alternatively, formula (1) may be satisfied when the thickness of the second resin layer 8 is set to X and the refractive index of the resin layer 9 is set to Y. In this case, the thickness of the second resin layer 8 is set to a range that suppresses the influence on the visibility of the conductor layer 5, and the second resin layer 8 is thicker than necessary, thereby suppressing the wiring body 200 from being enlarged.

[0068] X≦-5.43×Y+11.664…(1)

[0069] A display device 100 according to one aspect of the present disclosure includes the wiring body 200 described above.

[0070] According to the display device 100 described above, the same operations and effects as those of the wiring body 200 described above can be obtained.

[0071] The present disclosure is not limited to the above-described embodiments.

[0072] For example, the shapes of the conductive wire 50 and the resin layer 9 are not limited to Figure 7 The shapes shown can be modified as appropriate without departing from the spirit of the present disclosure. The height dimensions of the various components, the relationship between their width dimensions, and the relationship between their aspect ratios are not limited to those in the above-described embodiment and can be modified as appropriate. For example, the raised portions 66A and 66B may not be formed, and the entire upper surface 50a may be in contact with the second resin layer 8.

[0073] [Method 1]

[0074] A wiring body, wherein

[0075] have:

[0076] substrate;

[0077] a mesh-shaped conductor layer disposed on the substrate; and

[0078] a resin layer covering the conductor layer,

[0079] The resin layer includes a first resin layer and a second resin layer in this order from the substrate side.

[0080] The conductor layer penetrates the first resin layer.

[0081] [Method 2]

[0082] The wiring body according to embodiment 1, wherein

[0083] The second resin layer is thinner than the first resin layer.

[0084] [Method 3]

[0085] The wiring body according to embodiment 1 or 2, wherein

[0086] The first resin layer and the second resin layer are made of the same resin material.

[0087] [Method 4]

[0088] The wiring body according to any one of aspects 1 to 3, wherein

[0089] The aspect ratio of the conductive lines constituting the conductive layer, obtained by dividing the height by the width, is greater than 1.

[0090] [Method 5]

[0091] The wiring structure according to any one of aspects 1 to 4, wherein

[0092] The first resin layer covers the side surfaces and a portion of the upper surface of the conductive wires constituting the conductive layer.

[0093] The second resin layer covers the first resin layer and another portion of the upper surface of the conductive line.

[0094] [Method 6]

[0095] The wiring body according to embodiment 5, wherein

[0096] An area of ​​the upper surface of the conductive wire covered by the second resin layer is larger than an area of ​​the upper surface of the conductive wire covered by the first resin layer.

[0097] [Method 7]

[0098] The wiring structure according to any one of aspects 1 to 6, wherein

[0099] When the thickness of the second resin layer is set to X and the resin refractive index of the resin layer is set to Y, the formula (1) is satisfied,

[0100] X≦-5.43×Y+11.664…(1).

[0101] [Method 8]

[0102] A display device includes the wiring body according to any one of aspects 1 to 7.

Claims

1. A wiring body, wherein: have: substrate; a mesh-shaped conductor layer disposed on the substrate; and a resin layer covering the conductor layer, The resin layer includes a first resin layer and a second resin layer in this order from the substrate side. The conductor layer penetrates the first resin layer.

2. The wiring body according to claim 1, wherein The second resin layer is thinner than the first resin layer.

3. The wiring body according to claim 1, wherein The first resin layer and the second resin layer are made of the same resin material.

4. The wiring body according to claim 1, wherein The aspect ratio of the conductive lines constituting the conductive layer, obtained by dividing the height by the width, is greater than 1.

5. The wiring body according to claim 1, wherein The first resin layer covers the side surfaces and a portion of the upper surface of the conductive wires constituting the conductive layer. The second resin layer covers the first resin layer and another portion of the upper surface of the conductive line. The wiring body according to claim 5 , wherein An area of ​​the upper surface of the conductive wire covered by the second resin layer is larger than an area of ​​the upper surface of the conductive wire covered by the first resin layer.

7. The wiring body according to claim 1, wherein When the thickness of the second resin layer is set to X and the resin refractive index of the resin layer is set to Y, the formula (1) is satisfied, X≦-5.43×Y+11.664…(1). 8 . A display device comprising the wiring body according to claim 1 .

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