Molding device for 3D printing equipment and 3D printing equipment

Abstract

The application provides a forming device for a 3D printing device and the 3D printing device. The forming device for the 3D printing device comprises a substrate, a heating assembly, a plurality of temperature sensors and a controller. The heating assembly is in thermal conduction contact with the substrate. The heating assembly comprises a plurality of array-distributed heating blocks. The substrate comprises a central heating area and an edge heating area. The plurality of heating blocks comprises a plurality of first heating blocks and a plurality of second heating blocks. The first heating blocks are arranged correspondingly to the central heating area, and the second heating blocks are arranged correspondingly to the edge heating area. The heating temperature of the second heating blocks is higher than that of the first heating blocks. The temperature sensors are arranged on the substrate and correspondingly to the heating blocks. The controller is electrically connected to the temperature sensors and the heating blocks, and is used for adjusting the output power of the corresponding heating blocks according to the detection results of the temperature sensors, improving the temperature uniformity of the substrate, and further improving the temperature uniformity of the printing layer.

Description

Technical Field

[0001] This application relates to the field of 3D printing technology, and more specifically, to a molding apparatus for 3D printing equipment and 3D printing equipment. Background Technology

[0002] In metal additive manufacturing (such as selective laser melting, SLM), the metal powder cools rapidly after laser melting, resulting in temperature differences between different areas of the printed layer. This can easily generate thermal stress, causing the printed part to warp or crack. Therefore, how to slow down the cooling rate of the printed part and improve the temperature uniformity of the printed layer during the printing process has become an urgent technical problem to be solved. Summary of the Invention

[0003] This application provides a molding apparatus and a 3D printing device for use in 3D printing equipment to solve the aforementioned technical problems.

[0004] The embodiments of this application are implemented as follows: A molding apparatus for a 3D printing device, comprising: A substrate having a first surface and a second surface along its thickness direction; A heating assembly is stacked with the substrate and in thermal conductive contact with the second surface. The heating assembly includes a plurality of arrayed heating blocks. The first surface of the substrate includes a central heating area and an edge heating area, with the edge heating area surrounding the central heating area. The plurality of heating blocks include a plurality of first heating blocks and a plurality of second heating blocks. Along the thickness direction of the substrate, the first heating blocks are corresponding to the central heating area, and the second heating blocks are corresponding to the edge heating areas. The heating temperature of the second heating blocks is higher than that of the first heating blocks. Multiple temperature sensors are disposed on the substrate, and the multiple temperature sensors are correspondingly disposed with multiple heating blocks; The controller is electrically connected to the temperature sensor and the heating block.

[0005] Thus, the molding apparatus of this application heats the substrate with multiple heating blocks, slowing down the cooling rate of the printed parts and reducing stress accumulation. It also heats the central and edge regions of the substrate at different temperatures with the first and second heating blocks respectively, and detects and adjusts the heating temperature of the corresponding heating blocks in real time through the controller and temperature sensor, so that the heating temperature of the edge region is higher than that of the central region. This compensates for the significant temperature difference between the edge and center of the substrate caused by the rapid heat loss in the edge region, and at the same time realizes the adjustment of the local heating temperature of the substrate, which fully improves the temperature uniformity of the substrate, thereby improving the temperature uniformity of the printed layer, reducing the problem of warping and cracking of the printed parts, and improving the printing quality of the printed parts.

[0006] In one possible implementation: the area within a predetermined distance D from the edge of the first surface is the edge heating zone, and the edge heating zone includes a plurality of sequentially distributed temperature compensation zones in the direction from the edge of the first surface toward the center heating zone; the heating temperature of the second heating block corresponding to the plurality of temperature compensation zones gradually decreases in the direction from the edge of the first surface toward the center heating zone.

[0007] In one possible implementation: the controller is used to acquire data from multiple temperature sensors at preset time intervals, compare the data from each temperature sensor with the corresponding preset target temperature, and adjust the output power of the corresponding first heating block or second heating block individually according to the comparison result.

[0008] In one possible implementation: the heating assembly further includes a first heating plate and a second heating plate, the first heating plate being fixedly connected to the second surface of the substrate, and a plurality of heating blocks being disposed between the first heating plate and the second heating plate, and the heating blocks being thermally connected to the first heating plate and the second heating plate.

[0009] In one possible implementation: the second heating plate has a receiving groove on the side facing the first heating plate, and a plurality of heating blocks are disposed in the receiving groove, with the open end of the receiving groove abutting the first heating plate; the heating assembly further includes a heat-conducting element disposed between the heating blocks and the inner wall of the receiving groove.

[0010] In one possible implementation: the molding apparatus further includes a molding cylinder, the substrate and the heating assembly are movably disposed in the inner cavity of the molding cylinder; the molding cylinder includes an inner wall and an outer wall, the inner wall is disposed around the inner cavity, the outer wall is spaced apart from the inner wall, and an isolation cavity is formed between the inner wall and the outer wall.

[0011] In one possible implementation: the thermal conductivity of the inner wall is greater than that of the outer wall.

[0012] In one possible implementation: the substrate is in thermal contact with the inner wall.

[0013] In one possible implementation: the heating assembly further includes a seal disposed between the first heating plate and the second heating plate, and the seal is in sealing engagement with the inner wall.

[0014] An embodiment of this application also provides a 3D printing device, including a molding device and a printing chamber as described in the above embodiments, wherein the molding device is disposed in the printing chamber. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a molding apparatus for a 3D printing device according to an embodiment of this application.

[0017] Figure 2 for Figure 1 An exploded view of the forming device shown.

[0018] Figure 3 for Figure 1 A schematic cross-sectional view of the forming device shown.

[0019] Figure 4 for Figure 1 An exploded view of the substrate and heating assembly in the molding apparatus shown.

[0020] Figure 5 for Figure 1 A schematic diagram of the forming cylinder in the forming device shown.

[0021] Figure 6 for Figure 5 The diagram shows a cross-sectional view of the forming cylinder.

[0022] Figure 7 This is a simplified schematic diagram of the molding apparatus in one embodiment.

[0023] Figure 8 This is a simplified structural diagram of a 3D printing device in one embodiment.

[0024] Explanation of key component symbols: Molding device 100 Substrate 10 First surface 11 Central heating zone 111 Edge heating zone 112 Second surface 12 Heating component 20 Heating block 21 First heating block 211 Second heating block 212 First heating plate 22 Second heating plate 23 Reception tank 231 Thermal conductive component 24 Seal 25 Molding cylinder 30 Inner cavity 31 Inner wall 32 outer wall 33 Isolation cavity 34 Reinforcing rib 341 First flange 35 Second flange 36 Controller 40 Temperature sensor 50 3D printing equipment 200 Printing Room 201 The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0025] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0026] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] Some embodiments of this application are described in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0029] See Figures 1 to 7This embodiment provides a molding apparatus 100 for a 3D printing device 200, including a substrate 10, a heating assembly 20, multiple temperature sensors 50, and a controller 40. Along the thickness direction of the substrate 10, the substrate 10 has a first surface 11 and a second surface 12. The heating assembly 20 is stacked with the substrate 10 and is in thermal conductive contact with the second surface 12. The heating assembly 20 includes multiple arrayed heating blocks 21. The first surface 11 of the substrate 10 includes a central heating region 111 and an edge heating region 112, with the edge heating region 112 surrounding the central heating region 111. The multiple heating blocks 21 include multiple first heating blocks 211 and multiple second heating blocks 212. Along the thickness direction of the substrate 10, the first heating blocks 211 are correspondingly arranged with the central heating region 111, and the second heating blocks 212 are correspondingly arranged with the edge heating regions 112. The heating temperature of the second heating blocks 212 is higher than the heating temperature of the first heating blocks 211. Multiple temperature sensors 50 are disposed on the substrate 10, and the multiple temperature sensors 50 are correspondingly disposed with respect to the heating blocks 21. The controller 40 is electrically connected to the temperature sensors 50 and the heating blocks 21, and is used to adjust the output power of the corresponding heating blocks 21 according to the detection results of the temperature sensors 50, so as to achieve the effect of local temperature adjustment of the substrate 10.

[0030] The molding apparatus 100 of this application heats the substrate 10 using multiple heating blocks 21 to slow down the cooling rate of the printed part and reduce stress accumulation. It also heats the central and edge regions of the substrate 10 at different temperatures using the first heating block 211 and the second heating block 212, and detects and adjusts the heating temperature of the corresponding heating block 21 in real time using the controller 40 and the temperature sensor 50, so that the heating temperature of the edge region is higher than that of the central region. This compensates for the significant temperature difference between the edge and center of the substrate 10 caused by the rapid heat loss in the edge region. At the same time, it realizes the adjustment of the local heating temperature of the substrate 10, which fully improves the temperature uniformity of the substrate 10, thereby improving the temperature uniformity of the printed layer, reducing the problems of warping and cracking of the printed part, and improving the printing quality of the printed part.

[0031] In the embodiments of this application, multiple temperature sensors 50 can be set one-to-one with the local heating areas of the heating block 21. In other embodiments, multiple temperature sensors 50 can also be set one temperature sensor 50 to correspond to multiple heating areas of the heating block 21, or multiple temperature sensors 50 to correspond to one heating area of ​​the heating block 21, as long as the design requirements are met. This application is not limited to this.

[0032] In the embodiments of this application, the target heating temperature of the central heating zone 111 on the substrate 10 is A, which can be a set target temperature. The target heating temperature of the edge heating zone 112 is B, and the temperature difference between A and B is a preset temperature difference C. The controller 40 can also adjust the output power of the second heating block 212 according to the target temperature A and the preset temperature difference C set for the central heating zone 111, thereby adjusting the edge heating temperature so that the temperature of the edge heating zone 112 is higher than the temperature of the central heating zone, and the higher temperature value is within the control range. Taking advantage of the rapid heat dissipation at the edges of the substrate 10, setting a higher target temperature for the edge heating zone 112 can compensate for the problem of excessive temperature difference between the edge and central regions caused by rapid heat loss in the edge region, thus improving the overall thermal field of the molding apparatus 100.

[0033] In some embodiments, the controller 40 is further configured to acquire data from multiple temperature sensors 50 at preset time intervals, compare the data from each temperature sensor 50 with a corresponding preset target temperature, and adjust the output power of the corresponding first heating block 211 or second heating block 212 individually based on the comparison result. This enables real-time adjustment of the local temperature.

[0034] Specifically, if the sensor detects a temperature lower than the target value in the central heating zone 111, the controller 40 increases the output power of the corresponding first heating block 211 according to the detection signal, so that the local heating temperature in the central heating zone 111 moves closer to the target temperature. If the sensor detects a temperature higher than the target value in the central heating zone 111, the controller 40 decreases the output power of the corresponding first heating block 211 according to the detection signal, so that the local heating temperature in the central heating zone 111 moves closer to the target temperature.

[0035] In one embodiment, the preset interval for the controller 40 to acquire data from the temperature sensor 50 is preferably 50 milliseconds to achieve rapid temperature response and regulation. In other embodiments, the preset interval can be any value between 20 and 80 milliseconds, as long as it meets the design requirements; this application is not limited to this.

[0036] Similarly, if the sensor detects a temperature lower than the target value in the edge heating zone 112, the controller 40 increases the output power of the corresponding second heating block 212 according to the detection signal, so that the local heating temperature in the edge heating zone 112 moves closer to the target temperature. If the sensor detects a temperature higher than the target value in the edge heating zone 112, the controller 40 decreases the output power of the corresponding second heating block 212 according to the detection signal, so that the local heating temperature in the edge heating zone 112 moves closer to the target temperature.

[0037] In one embodiment, the controller 40 can independently control each heating block 21 and set corresponding control coefficients to adjust the output power of the heating block 21. The control coefficients include: a proportional coefficient kp, ranging from 0.8 to 1.2 (W / ℃), used to determine the responsiveness to the current temperature deviation; an integral coefficient ki, ranging from 0.05 to 0.15 (W / (℃·s)), used to eliminate long-term steady-state errors; and a derivative coefficient kd, ranging from 0.01 to 0.03 (W·s / ℃), used to predict temperature change trends. The specific values ​​of the proportional coefficient kp, integral coefficient ki, and derivative coefficient kd can be set according to actual usage requirements.

[0038] After each acquisition of the detected temperature from the temperature sensor 50, the controller 40 calculates the difference between the detected temperature and the target temperature, calculates the total cumulative error, and calculates the error change rate, and then comprehensively calculates the output power required by the heating block 21.

[0039] The formula for calculating the difference between the current temperature and the target temperature is: Current error e(t) = T 目标温度 -T 当前温度 The unit is ℃.

[0040] The formula for the sum of cumulative errors is: ∑e(t)=∫e(t)d(t), with the unit being ℃·s.

[0041] The formula for calculating the rate of change of error is: The unit is ℃ / s. Δt is the preset interval time or control cycle, which is a constant and represents the temperature error per unit time.

[0042] The controller 40 is also used to adjust the temperature of the heating block 21 based on the calculation results of the current error, cumulative error, and error change rate. The specific formula is: The required output power of heating block 21 = kp × current error + ki × cumulative error + kd × error change rate, in W.

[0043] Subsequently, the controller 40 increases or decreases the output power of the heating block 21 according to the calculation results, thereby raising or lowering the local temperature of the substrate 10, maintaining the target temperature while ensuring the uniformity of the thermal field of the substrate 10.

[0044] In one embodiment, the specific formula for converting the output power of the heating block 21 to its temperature is as follows: In one embodiment of this application, the surface area A of the heating region can be the surface area of ​​the heating region of the substrate 10 corresponding to a single heating block 21. Tj can specifically be the temperature value detected by the corresponding temperature sensor 50. Other parameters in the formula are constants. After the required output power of the heating block 21 is calculated, it can be substituted into the above formula to obtain the adjusted current temperature T of the heating plate through mathematical calculation. The controller 40 can also verify whether the output power meets the requirements based on the comparison between the calculated temperature and the target temperature.

[0045] In other embodiments, the conversion formula between output power and heating temperature may not be calculated. The controller 40 adjusts the output power of the corresponding heating block 21 in real time based on the detection results of the temperature sensor 50.

[0046] In some embodiments, the area within a predetermined distance D from the edge of the first surface 11 is the edge heating zone 112. From the edge of the first surface 11 toward the central heating zone 111, the edge heating zone 112 includes a plurality of sequentially distributed temperature compensation zones. From the edge of the first surface 11 toward the central heating zone 111, the heating temperature of the second heating block 212 corresponding to the plurality of temperature compensation zones gradually decreases.

[0047] Specifically, in one embodiment, from the edge of the first surface 11 towards the central heating area 111, the edge heating area 112 may include a first temperature compensation area, a second temperature compensation area, a third temperature compensation area, and a fourth temperature compensation area arranged sequentially. The target heating temperature of the first temperature compensation area is B, and the difference between it and the target heating temperature A of the central heating area 111 is C. The difference between the target heating temperature of the second temperature compensation area and the target heating temperature A of the central heating area 111 is (80%-70%)C. The difference between the target heating temperature of the third temperature compensation area and the target heating temperature A of the central heating area 111 is (55%-45%)C. The difference between the target heating temperature of the fourth temperature compensation area and the target heating temperature A of the central heating area 111 is (30%-20%)C. That is, the closer to the edge of the first surface 11, the higher the target heating temperature, and the greater the output power of the corresponding second heating block 212. In this way, temperature compensation can be further performed to address the rapid heat dissipation characteristics of the edge area, thereby improving the thermal uniformity of the substrate 10.

[0048] In one embodiment, the area within 20 mm of the edge of the first surface 11 is designated as the edge heating zone 112. Temperature compensation zones are defined according to the edge distance. The target heating temperature of the central heating zone 111 is set to A = 200°C, and the target heating temperature of the edge heating zone 112 is set to B = 205°C. The area within 0-5 mm of the edge is the first temperature compensation zone, with a compensation rate of 100%, meaning the target heating temperature of this zone is 205°C. The area within 5-10 mm of the edge is the second temperature compensation zone, with a compensation rate of 75%, meaning the target heating temperature of this zone is 203.75°C. The area within 10-15 mm of the edge is the third temperature compensation zone, with a compensation rate of 50%, meaning the target heating temperature of this zone is 202.5°C. The area within 15-20 mm of the edge is the fourth temperature compensation zone, with a compensation rate of 25%, meaning the target heating temperature of this zone is 201.25°C.

[0049] Please see Figure 3 and Figure 4 In some embodiments, the heating assembly 20 further includes a first heating plate 22 and a second heating plate 23. The first heating plate 22 is fixedly connected to the second surface 12 of the substrate 10. A plurality of heating blocks 21 are disposed between the first heating plate 22 and the second heating plate 23, and the heating blocks 21 are thermally connected to the first heating plate 22 and the second heating plate 23. Thus, the arrayed heating blocks 21 can be fixed between the first heating plate 22 and the second heating plate 23, reducing the entry of external powder or other impurities into the gaps between the heating blocks 21 and affecting the heating effect. The heat generated by the heating blocks 21 can be transferred to the substrate 10 through the first heating plate 22 and the second heating plate 23, thereby heating the substrate 10. Furthermore, the arrangement of the first heating plate 22 and the second heating plate 23 can also provide support for the substrate 10, resisting the mechanical stress generated by the thermal expansion of the substrate 10 and maintaining its flatness. The second heating plate 23 can also be used to connect a lifting mechanism to move the substrate 10 up and down to meet printing requirements. The second heating plate 23 can also be used to provide rigid support to resist the dynamic load of the lifting mechanism.

[0050] In some embodiments, the second heating plate 23 has a receiving groove 231 on the side facing the first heating plate 22, and a plurality of heating blocks 21 are disposed in the receiving groove 231, with the open end of the receiving groove 231 abutting against the first heating plate 22. In this way, the receiving groove 231 can provide installation space for the heating blocks 21, simplifying the installation process, and can also encapsulate a plurality of heating blocks 21 between the first heating plate 22 and the second heating plate 23, facilitating the overall installation of the heating assembly 20 and the substrate 10.

[0051] Furthermore, the heating assembly 20 also includes a heat-conducting element 24, which is disposed between the heating block 21 and the inner wall 32 of the receiving groove 231. This reduces the gap between the heating block 21 and the heating plate, allowing the heating block 21 to fully contact the first heating plate 22, and maximizing the heat transfer of the heating block 21.

[0052] Please see Figures 1 to 6 In some embodiments, the molding apparatus 100 further includes a molding cylinder 30, wherein the substrate 10 and the heating assembly 20 are movably disposed in the inner cavity 31 of the molding cylinder 30. The molding cylinder 30 includes an inner wall 32 and an outer wall 33, the inner wall 32 being disposed around the inner cavity 31, and the outer wall 33 being spaced apart from the inner wall 32, forming an isolation cavity 34 between the inner wall 32 and the outer wall 33.

[0053] In this application, the substrate 10, heating assembly 20, and forming cylinder 30 work together. The heating assembly 20 performs zoned heating of the substrate 10, improving the temperature uniformity of the substrate 10 and thus reducing thermal deformation caused by temperature unevenness. The forming cylinder 30 is assembled with the substrate 10, improving both the temperature uniformity of the substrate 10 and the temperature balance within the cavity 31 of the forming cylinder 30. Consequently, the deformation of the forming cylinder 30 is reduced, which helps improve printing accuracy and reduces the problem of misalignment of printed layers during printing. Furthermore, in this application, an isolation cavity 34 is provided between the inner wall 32 and the outer wall 33 of the forming cylinder 30. Air, insulation materials, etc., can be placed in the isolation cavity 34, giving the forming cylinder 30 excellent insulation performance, helping to reduce heat loss. Combined with the compensatory heating of the edge areas of the substrate 10 by the heating assembly 20, the total power consumption of the heating assembly 20 can be reduced. The insulation structure design of the forming cylinder 30 also reduces the time it takes for the substrate 10 to heat to the specified temperature, achieving optimized matching with the fast response control of the controller 40, further improving the uniformity of the thermal field of the substrate 10.

[0054] In some embodiments, the thermal conductivity of the inner wall 32 is greater than that of the outer wall 33. Thus, heat from the base and heating assembly 20 can be rapidly transferred through the inner wall 32, improving the thermal stability of the cavity 31 of the forming cylinder 30, reducing the temperature difference between the printing powder and the printed part on the substrate 10, and thereby improving print quality.

[0055] In one embodiment, the inner wall 32 can be made of a material with high thermal conductivity, such as aluminum alloy. The outer wall 33 can be made of a high-rigidity structural material, such as stainless steel, to resist mechanical stress.

[0056] In one embodiment, the molding cylinder 30 is further provided with a first flange 35 and a second flange 36 at both ends. The first flange 35 connects one end of the inner wall 32 and the outer wall 33, and the second flange 36 connects the other end of the inner wall 32 and the outer wall 33, so that the isolation cavity 34 between the inner wall 32 and the outer wall 33 forms a sealed structure, preventing the air, insulation material and other materials in the isolation cavity 34 from being affected by the outside world, and improving the insulation effect of the molding cylinder 30.

[0057] In one embodiment, the isolation cavity 34 may also be provided with a reinforcing rib 341 or other structure. The reinforcing rib 341 may be connected to the inner wall 32 or the outer wall 33 to improve the bending stiffness of the forming cylinder 30.

[0058] In some embodiments, the substrate 10 is in thermal contact with the inner wall 32, thereby enabling the heating assembly 20 to indirectly heat the molding cylinder 30, further improving the thermal stability of the inner cavity 31 of the molding cylinder 30.

[0059] In some embodiments, the heating assembly 20 further includes a sealing member 25 disposed between the first heating plate 22 and the second heating plate 23, and the sealing member 25 is in a sealing fit with the inner wall 32. Thus, the sealing member 25 can form an airtight seal at the edge of the substrate 10 and the heating assembly 20, preventing leakage of inert gas within the forming cylinder 30, and contributing to further improvement in printing quality. Furthermore, the sealing member 25 can be locked to the first heating plate 22 and the second heating plate 23 using high-strength bolts or other fasteners to suppress deformation caused by thermal expansion of the heating plates, thereby reducing deformation of the substrate 10 assembled with the heating assembly 20. It also isolates powder, preventing powder from entering the interior of the heating assembly 20.

[0060] Please see Figure 8 The embodiments of this application also provide a 3D printing device 200, including the molding device 100 and the printing chamber 201 described in the above embodiments, wherein the molding device 100 is disposed in the printing chamber 201.

[0061] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A molding apparatus for 3D printing equipment, characterized in that, include: A substrate having a first surface and a second surface along its thickness direction; A heating assembly is stacked with the substrate and in thermal conductive contact with the second surface. The heating assembly includes a plurality of arrayed heating blocks. The first surface of the substrate includes a central heating area and an edge heating area, with the edge heating area surrounding the central heating area. The plurality of heating blocks include a plurality of first heating blocks and a plurality of second heating blocks. Along the thickness direction of the substrate, the first heating blocks are correspondingly disposed to the central heating area, and the second heating blocks are correspondingly disposed to the edge heating areas. The heating temperature of the second heating blocks is higher than that of the first heating blocks. The heating assembly also includes a first heating plate and a second heating plate. The first heating plate is fixedly connected to the second surface of the substrate, and the plurality of heating blocks are disposed between the first heating plate and the second heating plate, and the heating blocks are thermally connected to the first heating plate and the second heating plate. The area within 20mm of the edge of the first surface is the edge heating zone. From the edge of the first surface toward the center heating zone, the edge heating zone includes a first temperature compensation zone, a second temperature compensation zone, a third temperature compensation zone, and a fourth temperature compensation zone arranged sequentially. The area within 0-5mm from the edge is the first temperature compensation area, the target heating temperature of the first temperature compensation area is B, and the difference between the target heating temperature A of the central heating area is C. The area within 5-10mm from the edge is the second temperature compensation area, and the difference between the target heating temperature of the second temperature compensation area and the target heating temperature A of the central heating area is (80%-70%)C; the area within 10-15mm from the edge is the third temperature compensation area, and the difference between the target heating temperature of the third temperature compensation area and the target heating temperature A of the central heating area is (55%-45%)C; the area within 15-20mm from the edge is the fourth temperature compensation area, and the difference between the target heating temperature of the fourth temperature compensation area and the target heating temperature A of the central heating area is (30%-20%)C. Multiple temperature sensors are disposed on the substrate, and the multiple temperature sensors are correspondingly disposed with multiple heating blocks; The controller is electrically connected to the temperature sensor and the heating block; A molding cylinder, wherein the substrate and the heating assembly are movably disposed within the inner cavity of the molding cylinder; the molding cylinder includes an inner wall and an outer wall, the inner wall surrounding the inner cavity, the outer wall being spaced apart from the inner wall, and an isolation cavity being formed between the inner wall and the outer wall; the thermal conductivity of the inner wall is greater than that of the outer wall; the substrate is in thermal transfer contact with the inner wall; the heating assembly further includes a sealing member, the sealing member being disposed between the first heating plate and the second heating plate, and the sealing member being in a sealing fit with the inner wall.

2. The molding apparatus for 3D printing equipment according to claim 1, characterized in that: The controller is used to acquire data from multiple temperature sensors at preset time intervals, compare the data from each temperature sensor with the corresponding preset target temperature, and adjust the output power of the corresponding first heating block or second heating block individually based on the comparison result.

3. The molding apparatus for 3D printing equipment according to claim 1, characterized in that: The second heating plate has a receiving groove on the side facing the first heating plate, and a plurality of heating blocks are disposed in the receiving groove, with the open end of the receiving groove abutting the first heating plate; The heating assembly further includes a heat-conducting element disposed between the heating block and the inner wall of the receiving groove.

4. A 3D printing device, characterized in that, include: The molding apparatus for 3D printing equipment according to any one of claims 1-3; and, The printing chamber, wherein the forming device is located within the printing chamber.

Images