Electroplating device, electroplating system and electroplating method

Abstract

The invention discloses an electroplating device, an electroplating system and an electroplating method. The electroplating device comprises an electroplating bath, an anode and a cathode, and the anode and the cathode are located in the electroplating bath and are oppositely arranged in the first direction; the first coil is located in the electroplating bath, and the included angle between the magnetic field direction of a first magnetic field generated after the first coil is powered on and the first direction is 0-10 degrees; the second coil is located in the electroplating bath and located on the side close to the cathode, and a second magnetic field generated after the second coil is powered on at least partially covers the cathode; the included angle between the magnetic field direction of a second magnetic field generated after the second coil is electrified and the second direction is 0-10 degrees, and the second direction is straight to the first direction and is parallel to the bottom surface of the electroplating bath. When the electroplating device is used for preparing the graphene conductor, uniform and ordered electroplating can be realized.

Description

Technical Field

[0001] The present invention relates to an electroplating device, an electroplating system and an electroplating method. Background Art

[0002] Graphene has numerous advantages, including high electrical and thermal conductivity, high strength, high flexibility, strong chemical inertness, and excellent gas barrier properties, making it a promising material for numerous applications. By incorporating graphene into metal coatings, it is possible to create composite graphene conductors with superior performance.

[0003] Conventional methods typically use electroplating, vapor deposition, or powder mixing to prepare composite graphene-copper conductors, where graphene and copper are uniformly mixed to form a composite material. However, these existing preparation methods all cause some degree of structural damage to the graphene layer. While electroplating methods involve minimal external forces during the preparation process, they cannot prevent graphene agglomeration in the plating solution, resulting in the inclusion of aggregated graphene in the plated layer.

[0004] CN118957712A discloses an electroplating device and method. By providing an energized coil within the electroplating device, the device promotes the uniform distribution of graphene in the electroplating solution. When energized, the first coil generates a first magnetic field roughly parallel to the direction of the current. During the electroplating process, the flow of current in the electroplating solution relies on ion transport. When ions encounter obstacles, such as graphene, during their movement, the local direction of ion motion changes, generating a current that is non-parallel to the original current direction. Under the action of the first magnetic field, new magnetic flux lines are generated. Under the action of the Lorentz force, eddy currents are generated near the graphene obstacle, achieving localized stirring of the electroplating solution near the graphene. This stirring not only disperses the graphene but also promotes its uniform distribution within the electroplating solution, improving the dispersion stability of the graphene in the electroplating solution. Furthermore, a third coil is set near the cathode (perpendicular to the current direction and perpendicular to the bottom of the slot). The third coil generates a magnetic field during the power-on process. When the metal ions obtain electrons and are reduced to metal, the magnetic field is applied from different directions of the cathode, which can not only further refine the metal grains, but also enable the metal ions to obtain electrons and be reduced to the metal, so that the metal is arranged in the order of optimal conductivity.

[0005] However, in the above method, the distribution angle of the graphene sheets after migrating to the cathode is greatly offset, resulting in the graphene sheets being arranged in a relatively chaotic manner in the coating, and the graphene sheets are distributed at a large angle between the graphene sheets and the parts to be plated due to the migration time difference, resulting in the graphene being unable to maximize its own advantages. Therefore, how to prepare a graphene copper coating by electroplating so that the graphene is evenly and orderly distributed in the coating is still a difficult problem studied at this stage. Due to the randomness of the graphite distribution in the coating, the performance of the graphene conductor obtained by electroplating using this method is also unstable, with large differences between batches. Summary of the Invention

[0006] To address the existing problem of electroplating methods for preparing graphene composite conductors, which prevents the graphene from being uniformly and orderly distributed in the coating, the present invention provides an electroplating device, an electroplating system, and an electroplating method. The electroplating device, electroplating system, and electroplating method of the present invention achieve uniform and orderly distribution of graphene in the coating.

[0007] The present invention solves the above technical problems through the following technical solutions.

[0008] The present invention provides an electroplating device, comprising:

[0009] an electroplating tank, the electroplating tank being used to contain an electroplating solution;

[0010] an anode and a cathode, the anode and the cathode being located in the electroplating tank and arranged opposite to each other along a first direction;

[0011] a first coil, the first coil being located in the electroplating tank, wherein the angle between the direction of a first magnetic field generated by the first coil when energized and the first direction is 0-10°; and

[0012] A second coil is located in the electroplating tank and on a side close to the cathode. When the second coil is energized, the second magnetic field generated at least partially covers the cathode; the magnetic field direction of the second magnetic field generated when the second coil is energized has an angle of 0-10° with the second direction, wherein the second direction is perpendicular to the first direction and parallel to the bottom surface of the electroplating tank.

[0013] In the present invention, the angle between the magnetic field direction of the first magnetic field generated when the first coil is energized and the first direction is, for example, 5°.

[0014] In the present invention, optionally, the first coil is located between the anode and the cathode.

[0015] In the present invention, optionally, the first coil is located on a side of the anode away from the cathode.

[0016] In the present invention, optionally, the number of the first coils is one or more.

[0017] In some embodiments of the present invention, there are multiple first coils, and the multiple first coils are arranged along the first direction.

[0018] In some embodiments of the present invention, there are multiple first coils, and the multiple first coils are arranged along the second direction.

[0019] In the present invention, optionally, the first coil, the anode and the cathode are located on the same plane.

[0020] In the present invention, optionally, the ratio of the vertical distance between the center of the first coil and the anode to the vertical distance between the center of the first coil and the cathode is 1:(0.5-0.9), for example, 1:0.8. The center of the first coil refers to a position on the axis of the cylinder formed by winding the first coil that is equidistant from both sides of the first coil.

[0021] In the present invention, optionally, the ratio of the depth of the center of the first coil to the depth of the bottom of the anode is (1-2):1, for example, 1.5:1. The depth of the center of the first coil refers to the vertical distance from the center of the first coil to the bottom of the electroplating tank, and the depth of the bottom of the anode refers to the vertical distance from the bottom of the anode to the bottom of the electroplating tank.

[0022] In the present invention, the angle between the magnetic field direction of the second magnetic field generated when the second coil is energized and the second direction is, for example, 5°.

[0023] In the present invention, optionally, the number of the second coils is one or more.

[0024] In some embodiments of the present invention, there are multiple second coils, and the multiple second coils are arranged in parallel along the extension direction of the cathode.

[0025] In some embodiments of the present invention, there are multiple second coils, and the multiple second coils are arranged in parallel along the first direction.

[0026] In some embodiments of the present invention, there are a plurality of second coils, and the plurality of second coils are arranged on both sides of the cathode in pairs along the second direction.

[0027] In the present invention, optionally, the second coil and the cathode are located on the same plane.

[0028] In the present invention, optionally, the ratio of the depth of the center of the second coil to the depth of the bottom of the cathode is (0.5-1.5):1, for example, 0.8:1. The depth of the center of the second coil refers to the vertical distance from the center of the second coil to the bottom of the electroplating tank, and the depth of the bottom of the cathode refers to the vertical distance from the bottom of the cathode to the bottom of the electroplating tank.

[0029] In the present invention, the electroplating device may further include a first power supply, and the first power supply is used to connect to the first coil.

[0030] In the present invention, the electroplating device may further include a second power supply, and the second power supply is used to connect to the second coil.

[0031] In the present invention, the electroplating device may further include a third power supply, and the third power supply is used to connect the anode and the cathode.

[0032] In the present invention, the anode optionally includes a consumable component. The consumable component can be conventional in the art, such as one or more of copper, nickel, silver, tin, palladium, and chromium. The consumable component reacts during the electroplating process to form cations that dissolve in the electroplating solution. The cations migrate to the cathode and react to form a single substance. The consumable component can ensure a stable cation concentration in the electroplating solution during the electroplating process.

[0033] In certain specific embodiments of the present invention, the anode further comprises an inert anode, which does not react during the electroplating process. The inert anode can be conventional in the art.

[0034] In the present invention, optionally, the cathode includes an object to be plated. The object to be plated can be conventional in the art, and can be metal, non-metal or composite material, such as one or more of copper, aluminum, iron, copper alloy, aluminum alloy and iron alloy.

[0035] In certain specific embodiments of the present invention, the cathode further comprises an inert cathode, which does not react during the electroplating process. The inert cathode can be conventional in the art.

[0036] The present invention also provides an electroplating system, which includes the electroplating device and electroplating solution as described above, and the electroplating solution includes metal salt and graphene.

[0037] Optionally, the metal salt includes one or more of copper salt, nickel salt, silver salt, tin salt, palladium salt and chromium salt.

[0038] Optionally, the copper salt includes one or more of cuprous cyanide, copper sulfate, copper chloride and amino copper sulfate.

[0039] Optionally, the nickel salt includes one or more of nickel sulfate, nickel chloride and nickel nitrate.

[0040] Optionally, the silver salt includes one or more of silver nitrate, silver chloride and aminosilver nitrate.

[0041] Optionally, the tin salt includes one or more of tin chloride, tin sulfate and tin aminosulfate.

[0042] Wherein, optionally, the palladium salt includes one or more of palladium chloride, palladium sulfate, palladium nitrate and palladium acetate.

[0043] Optionally, the chromium salt includes sodium chromate and / or chromic anhydride.

[0044] Wherein, optionally, the mass concentration of the graphene is 0.5-3 g / L, further optionally 0.5-1.5 g / L, for example 1.0 g / L.

[0045] In some preferred embodiments of the present invention, the metal salt comprises a copper salt.

[0046] In the above embodiment, the mass concentration of the copper salt is 5-380 g / L, preferably 50-70 g / L, such as 60 g / L.

[0047] In the above embodiment, the electroplating solution further includes an anode activator, and the anode activator is preferably potassium sodium tartrate; the mass concentration of the anode activator is preferably 15-30 g / L, for example, 20 g / L.

[0048] In the above embodiment, the electroplating solution further includes KCN, and the mass concentration of KCN is preferably 100-130 g / L, for example 120 g / L.

[0049] In the above embodiment, the electroplating solution further comprises KOH, and the mass concentration of KOH is preferably 10-20 g / L, for example 15 g / L. In the above embodiment, the pH of the electroplating solution may be 8.2-8.8, for example 8.5.

[0050] In the above embodiment, the temperature of the electroplating solution is 20-30°C, for example 25°C.

[0051] In some specific embodiments of the present invention, the electroplating solution includes cuprous cyanide, potassium sodium tartrate, KCN and KOH.

[0052] In a more specific embodiment of the present invention, the electroplating solution includes graphene, cuprous cyanide, KCN, KOH, and potassium sodium tartrate at a mass concentration of 1 g / L, 60 g / L, 120 g / L, 15 g / L, and 20 g / L, with a pH of 8.5.

[0053] In the present invention, the electroplating system may further include a control device; the control device includes the computer-readable storage medium as described above, the computer program product as described above, or the electronic device as described above.

[0054] The present invention provides an electroplating method, which is performed using the electroplating system as described above, and comprises the following steps:

[0055] S1. Placing an electroplating solution in an electroplating tank, immersing the anode, the cathode, the first coil, and the second coil in the electroplating solution; wherein the cathode includes a workpiece to be plated; and the electroplating solution includes a metal salt and graphene;

[0056] S2. The first coil is energized for a first time to generate a first magnetic field, the second coil is energized for a second time to generate a second magnetic field, and the anode and the cathode are energized for a third time to form a composite coating on the surface of the workpiece to be plated; wherein the voltage of the first energization is a pulse voltage, and the magnitude of the first energization voltage is 250-260V; the voltage of the second energization is a constant current voltage, and the magnitude of the second energization voltage is 260-280V.

[0057] In the present invention, optionally, the first energization and the second energization are performed in an intermittent complementary cycle.

[0058] In the present invention, when power is supplied, the magnetic fields generated by the adjacent ends of the first coil and the second coil are in opposite directions.

[0059] In the present invention, the magnitude of the voltage of the first power supply is, for example, 255V.

[0060] In the present invention, optionally, the magnetic field strength of the first magnetic field is 3-5T, for example, 4T.

[0061] In the present invention, optionally, the frequency of the pulse voltage is 4-6 Hz, for example, 5 Hz.

[0062] In the present invention, optionally, the duration of a single first power-on is 3-5 seconds, for example, 4 seconds; the interval between the first power-ons is 3-5 seconds, for example, 4 seconds. The interval refers to the time interval between two adjacent power-ons.

[0063] In the present invention, the voltage of the second current supply is, for example, 270V.

[0064] In the present invention, optionally, the magnetic field strength of the second magnetic field is 4-6T, for example, 5T.

[0065] In the present invention, optionally, the duration of a single second power-on is 3-5 seconds, for example, 4 seconds; and the interval between the second power-ons is 3-5 seconds, for example, 4 seconds. The interval refers to the interval between two adjacent power-ons.

[0066] In some specific embodiments of the present invention, the voltage of the first power-on is a pulse voltage with a frequency of 5 Hz, the voltage of the first power-on is 255 V, the magnetic field strength of the first magnetic field is 4 T, the single power-on duration of the first power-on is 4 s, and the interval duration of the first power-on is 4 s; the voltage of the second power-on is a constant current voltage, the voltage of the second power-on is 270 V, the magnetic field strength of the second magnetic field is 5 T, the single power-on duration of the second power-on is 4 s, and the interval duration of the second power-on is 4 s.

[0067] In the present invention, optionally, the current density formed by the third energization is 0.1-2 A.dm -2 , preferably 0.3-0.8A.dm -2 , for example 0.4A.dm -2 .

[0068] The present invention also provides an electroplating control method for controlling the electroplating device as described above, which comprises the following steps:

[0069] Outputting a first voltage control instruction to control the first coil to be energized for the first time to generate a first magnetic field; wherein the voltage of the first energization is a pulse voltage, and the magnitude of the first energization voltage is 250-260V;

[0070] Outputting a second voltage control instruction to control the second coil to be energized for a second time to generate a second magnetic field, wherein the voltage of the second channel is a constant current voltage, and the magnitude of the second energization voltage is 260-280V;

[0071] A third voltage control instruction is output to control third energization of the anode and the cathode.

[0072] In the present invention, optionally, the first energization and the second energization are performed in an intermittent complementary cycle.

[0073] In the present invention, when power is supplied, the magnetic fields generated by the adjacent ends of the first coil and the second coil are in opposite directions.

[0074] In the present invention, the magnitude of the voltage of the first power supply is, for example, 255V.

[0075] In the present invention, optionally, the magnetic field strength of the first magnetic field is 3-5T, for example, 4T.

[0076] In the present invention, optionally, the frequency of the pulse voltage is 4-6 Hz, for example, 5 Hz.

[0077] In the present invention, optionally, the duration of a single first power-on is 3-5 seconds, for example, 4 seconds; the interval between the first power-ons is 3-5 seconds, for example, 4 seconds. The interval refers to the time interval between two adjacent power-ons.

[0078] In the present invention, the voltage of the second current supply is, for example, 270V.

[0079] In the present invention, optionally, the magnetic field strength of the second magnetic field is 4-6T, for example, 5T.

[0080] In the present invention, optionally, the duration of a single second power-on is 3-5 seconds, for example, 4 seconds; and the interval between the second power-ons is 3-5 seconds, for example, 4 seconds. The interval refers to the interval between two adjacent power-ons.

[0081] In some specific embodiments of the present invention, the voltage of the first power-on is a pulse voltage with a frequency of 5 Hz, the voltage of the first power-on is 255 V, the magnetic field strength of the first magnetic field is 4 T, the single power-on duration of the first power-on is 4 s, and the interval duration of the first power-on is 4 s; the voltage of the second power-on is a constant current voltage, the voltage of the second power-on is 270 V, the magnetic field strength of the second magnetic field is 5 T, the single power-on duration of the second power-on is 4 s, and the interval duration of the second power-on is 4 s.

[0082] In the present invention, optionally, the current density formed by the third energization is 0.1-2 A.dm -2 , preferably 0.3-0.8A.dm -2 , for example 0.4A.dm -2 .

[0083] The present invention also provides a computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the steps of the electroplating control method as described above are implemented.

[0084] The present invention also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the steps of the electroplating control method as described above are implemented.

[0085] The present invention also provides an electronic device, which includes the computer program product as described above.

[0086] On the basis of conforming to the common sense in this field, the above-mentioned preferred conditions can be arbitrarily combined to obtain the preferred embodiments of the present invention.

[0087] The reagents and raw materials used in the present invention are commercially available.

[0088] The positive progress effect of the present invention is:

[0089] By specifically arranging coils in the electroplating apparatus, the combined effects of the first and second coils ensure that the majority of graphene flakes are evenly and regularly distributed within the coating. This results in a graphene conductor with excellent electrical and thermal conductivity. Furthermore, the resulting graphene conductor exhibits stable performance with minimal batch-to-batch variability. BRIEF DESCRIPTION OF THE DRAWINGS

[0090] Figure 1 It is a structural schematic diagram of the electroplating device of the present invention.

[0091] Reference numerals:

[0092] 10 - electroplating tank, 11 - electroplating solution, 12 - electroplating solution surface, 21 - anode, 22 - cathode, 31 - first coil, 32 - second coil, 41 - first power supply, 42 - second power supply, 43 - third power supply. DETAILED DESCRIPTION

[0093] The present invention is further illustrated by way of examples below, but the present invention is not limited to the scope of the examples. Experimental methods in the following examples where specific conditions are not specified were performed according to conventional methods and conditions, or selected according to the product specifications.

[0094] Example 1

[0095] The structural diagram of the electroplating device of Example 1 is as follows Figure 1 As shown, the electroplating device includes:

[0096] The electroplating tank 10 is used to contain the electroplating solution 11;

[0097] An anode 21 and a cathode 22, and a third power supply 43 connected to the anode and the cathode; the anode 21 and the cathode 22 are located in the electroplating tank 10 and are arranged opposite to each other along a first direction; the anode 21 is a consumable copper electrode, and the cathode 22 is a copper rod to be plated;

[0098] A first coil 31 and a first power supply 41 connected to the first coil 31; the first coil 31 is located in the electroplating tank 10 and is located between the anode 21 and the cathode 22. The direction of the first magnetic field generated by the first coil 31 after power is applied is parallel to the first direction (i.e., the angle with the first direction is 0°, and the first direction is the direction of current); the ratio of the vertical distance between the center of the first coil 31 and the anode 21 to the vertical distance between the center of the first coil 31 and the cathode 22 is 1:0.8, and the ratio of the depth of the center of the first coil 31 to the depth of the bottom end of the anode 21 is 1.5:1.

[0099] A second coil 32 and a second power supply 42 connected to the second coil 32; the second coil 32 is located in the electroplating tank 10, on the side close to the cathode 22, and is located on the same plane as the cathode 22; the second magnetic field generated by the second coil 32 after being energized at least partially covers the cathode 22, and the magnetic field direction of the second magnetic field is parallel to the second direction (that is, the angle with the second direction is 0°, the second direction is perpendicular to the first direction and parallel to the bottom surface of the electroplating tank 10 and the plating liquid surface 12); the ratio of the depth of the center of the second coil 32 to the depth of the bottom end of the cathode 22 is 0.8:1.

[0100] The electroplating system of embodiment 1 comprises:

[0101] The above-mentioned electroplating device and electroplating solution;

[0102] The electroplating solution includes graphene with a mass concentration of 1 g / L, cuprous cyanide of 60 g / L, KCN of 120 g / L, KOH of 15 g / L, and sodium potassium tartrate of 20 g / L, with a pH of 8.5.

[0103] The electroplating method using the electroplating system comprises the following steps:

[0104] S1. Place the electroplating solution 11 at 25° C. in the electroplating tank 10, and immerse the anode 21, cathode 22, first coil 31 and second coil 32 in the electroplating solution 11;

[0105] S2: Power is applied to the anode 21 and cathode 22 to form a current density of 0.4A.dm -2 , and the first coil 31 is energized for a first time to generate a first magnetic field, and the second coil 32 is energized for a second time to generate a second magnetic field, and the first energization and the second energization are intermittently and complementaryly performed in a cycle to form a graphene copper composite coating on the surface of the workpiece to be plated;

[0106] The voltage of the first power-on is a pulse voltage with a frequency of 5 Hz, the voltage of the first power-on is 255 V, the magnetic field strength of the first magnetic field generated by the first coil 31 is 4 T, the single power-on duration of the first power-on is 4 s, and the interval duration of the first power-on is 4 s;

[0107] Among them, the voltage of the second power-on is a constant current voltage, the voltage of the second power-on is 270V, the magnetic field strength of the second magnetic field generated by the second coil 32 is 5T, the single power-on time of the second power-on is 4s, and the interval time of the second power-on is 4s.

[0108] A composite conductor is prepared by the electroplating method, which includes a base layer (i.e., copper to be plated) and a graphene-copper composite coating located on one surface of the base layer, wherein graphene is evenly and orderly distributed in the graphene-copper composite coating.

[0109] Example 2

[0110] The electroplating device of Example 2 differs from the electroplating device of Example 1 only in that the angle between the magnetic field direction of the first magnetic field generated after the first coil 31 is 5° and the first direction; the other conditions are the same as those of Example 1.

[0111] The electroplating solution and electroplating method of Example 2 are the same as those of Example 1. A composite conductor is prepared by this electroplating method, comprising a base layer (i.e., the copper to be plated) and a graphene-copper composite coating on one surface of the base layer, wherein the graphene is uniformly and orderly distributed in the graphene-copper composite coating.

[0112] Example 3

[0113] The electroplating device of Example 3 differs from the electroplating device of Example 1 only in that the angle between the magnetic field direction of the first magnetic field generated after the first coil 31 is 10° and the first direction; the other conditions are the same as those of Example 1.

[0114] The electroplating solution and electroplating method of Example 3 are the same as those of Example 1. A composite conductor is prepared by this electroplating method, comprising a base layer (i.e., the copper to be plated) and a graphene-copper composite coating on one surface of the base layer, wherein the graphene is uniformly and orderly distributed in the graphene-copper composite coating.

[0115] Example 4

[0116] The electroplating device of Example 4 differs from the electroplating device of Example 1 only in that the angle between the magnetic field direction of the second magnetic field generated after the second coil 32 is 5° and the second direction; the other conditions are the same as those of Example 1.

[0117] The electroplating solution and electroplating method of Example 4 are the same as those of Example 1. A composite conductor is prepared by this electroplating method, comprising a base layer (i.e., the copper to be plated) and a graphene-copper composite coating located on one surface of the base layer, wherein the graphene is uniformly and orderly distributed in the graphene-copper composite coating.

[0118] Example 5

[0119] The electroplating device of Example 5 differs from the electroplating device of Example 1 only in that the angle between the magnetic field direction of the second magnetic field generated after the second coil 32 is 10° and the second direction; the other conditions are the same as those of Example 1.

[0120] The electroplating solution and electroplating method of Example 5 are the same as those of Example 1. A composite conductor is prepared by this electroplating method, comprising a base layer (i.e., the copper to be plated) and a graphene-copper composite coating located on one surface of the base layer, wherein the graphene is uniformly and orderly distributed in the graphene-copper composite coating.

[0121] Comparative Example 1

[0122] The electroplating device of Comparative Example 1 differs from the electroplating device of Example 1 in that the angle between the magnetic field direction of the first magnetic field generated by the first coil 31 after power is applied and the first direction is 15°. The other conditions are the same as those of Example 1.

[0123] The electroplating solution and electroplating method of Comparative Example 1 are the same as those of Example 1.

[0124] Comparative Example 2

[0125] The electroplating device of Comparative Example 2 differs from the electroplating device of Example 1 in that the angle between the magnetic field direction of the second magnetic field generated by the second coil 32 after power is applied and the second direction is 15°. The other conditions are the same as those of Example 1.

[0126] The electroplating solution and electroplating method of Comparative Example 2 are the same as those of Example 1.

[0127] Comparative Example 3

[0128] In Comparative Example 3, a conventional electroplating device is used, that is, the first coil 31 and the second coil 32 are not provided; the remaining conditions are the same as those in Example 1.

[0129] The electroplating solution of Comparative Example 3 is the same as that of Example 1.

[0130] The electroplating method using the electroplating system comprises the following steps:

[0131] S1. Place a 25°C electroplating solution in an electroplating tank, and immerse the anode and cathode in the electroplating solution;

[0132] S2. Power is applied to the anode and cathode, and the resulting current density is 0.4A.dm -2 , so as to form a graphene copper composite coating on the surface of the part to be plated.

[0133] Comparative Example 4

[0134] In Comparative Example 4, in step S2 of the electroplating method, the voltage of the second power-on is 240V, and the magnetic field strength of the second magnetic field generated by the second coil by the second power-on is 0.5T; the other conditions are the same as those in Example 1.

[0135] Comparative Example 5

[0136] In Comparative Example 5, in step S2 of the electroplating method, the voltage of the second power-on is a pulse voltage; the other conditions are the same as those in Example 1.

[0137] Effect Example 1

[0138] The electrical conductivity and thermal conductivity of the composite conductors prepared in the above examples and comparative examples were tested. The electrical conductivity was tested using a four-probe method, and the thermal conductivity was tested using a steady-state method (hot wire method).

[0139] The above test results are listed in Table 1:

[0140] Table 1 serial number Metal in the coating Conductivity%IACS Thermal conductivity W / (m•K) Example 1 copper 128 428 Example 2 copper 127 425 Example 3 copper 125 417 Example 4 copper 126 423 Example 5 copper 125.5 421 Comparative Example 1 copper 122.4 407 Comparative Example 2 copper 123 409 Comparative Example 3 copper 114 393 Comparative Example 4 copper 120.7 401 Comparative Example 5 copper 121 404

[0141] As shown in Table 1, the electroplating apparatus and method of the present invention can significantly improve the electrical conductivity (above 125% IACS) and thermal conductivity (above 415 W / (m·k)) of the plated layer. The present invention employs a specific arrangement of first and second coils within the electroplating apparatus. The first coil, positioned approximately parallel to the direction of the current, generates magnetic flux lines that control the migration of graphene in the plating solution toward the cathode. Upon encountering migrating metal ions, the graphene sheet, due to adsorption of some metal ions, migrates more slowly than the metal ions. After colliding with the metal ions, the sheet moves away from the direction of the current. The strong magnetic field generated by the first coil drives the graphene sheet back into the direction of the current flow or toward a smaller angle. The second coil generates a magnetic field on the cathode surface. The direction of the magnetic field is roughly perpendicular to the direction of current flow and roughly parallel to the bottom of the electroplating tank. The surface of the graphene sheet adsorbs metal ions. When part of the graphene sheet reaches the surface of the cathode to be plated first, and the other part has not arrived, the graphene sheet forms a closed conductive loop with the cathode and the plating solution. Under the action of the magnetic field of the second coil, a closed coil is formed to cut the magnetic flux lines and move, which will generate a weak voltage and drive the graphene sheet to move quickly to the cathode surface, avoiding the graphene sheet from being distributed at a large angle with the cathode to be plated due to the migration time difference. In summary, through the synergistic effect of the first coil and the second coil, most of the graphene sheets can be evenly and regularly distributed in the plating layer, so that the prepared graphene conductor has excellent electrical conductivity and thermal conductivity.

[0142] Examples 1-5 of the present invention demonstrate that when the direction of the magnetic field generated by energizing the first coil is at an angle of 0-10° with the first direction, and the direction of the magnetic field generated by energizing the second coil is at an angle of 0-10° with the second direction, copper composite conductors with high electrical conductivity (above 125% IACS) and high thermal conductivity (above 415 W / (m•k)) can be produced, significantly exceeding the composite conductor obtained without the coils (e.g., Comparative Example 3). In Example 1, the direction of the magnetic field generated by energizing the first coil is parallel to the first direction (current direction), and the direction of the magnetic field generated by energizing the second coil is parallel to the second direction. This results in the optimal electrical and thermal conductivity of the resulting copper composite conductor. Comparative Example 3, using a conventional electroplating apparatus without the first and second coils, yields the lowest electrical and thermal conductivity. Comparative Examples 1 and 2 demonstrate that if the direction of the magnetic field generated by energizing the first coil is significantly offset from the first direction, or if the direction of the magnetic field generated by energizing the second coil is significantly offset from the second direction, the high electrical and thermal conductivity of the present invention cannot be achieved. Comparative Example 4 demonstrates that when the electroplating apparatus of the present invention is used for electroplating, if the second current voltage is low, the electrical and thermal conductivities also decrease significantly. Furthermore, Comparative Example 5 demonstrates that when the electroplating apparatus of the present invention is used for electroplating, the second current voltage must be controlled to a constant current voltage. Using a pulsed voltage significantly reduces the electrical and thermal conductivities.

[0143] In addition, the graphene conductor obtained by the present invention has stable performance and small differences between batches.

[0144] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An electroplating device, characterized in that: The electroplating device comprises: an electroplating tank, the electroplating tank being used to contain an electroplating solution; an anode and a cathode, the anode and the cathode being located in the electroplating tank and arranged opposite to each other along a first direction; a first coil, the first coil being located in the electroplating tank, wherein the angle between the direction of a first magnetic field generated by the first coil when energized and the first direction is 0-10°; and A second coil is located in the electroplating tank and on a side close to the cathode. When the second coil is energized, the second magnetic field generated at least partially covers the cathode; the magnetic field direction of the second magnetic field generated when the second coil is energized has an angle of 0-10° with the second direction, wherein the second direction is perpendicular to the first direction and parallel to the bottom surface of the electroplating tank.

2. The electroplating device according to claim 1, characterized in that The first coil is located between the anode and the cathode; And / or, the first coil is located on a side of the anode away from the cathode; and / or, the first coil, the anode, and the cathode are located on the same plane; and / or, the second coil and the cathode are located on the same plane; And / or, the cathode includes an object to be plated.

3. The electroplating device according to claim 1, wherein: The number of the first coils is one or more; And / or, the number of the second coils is one or more.

4. The electroplating device according to claim 3, characterized in that: There are multiple first coils, and the multiple first coils are arranged along the first direction; Alternatively, there are multiple first coils, and the multiple first coils are arranged along the second direction.

5. The electroplating device according to claim 3, characterized in that: There are multiple second coils, and the multiple second coils are arranged in parallel along the extension direction of the cathode; Alternatively, there are multiple second coils, and the multiple second coils are arranged in parallel along the first direction; Alternatively, there are a plurality of second coils, and the plurality of second coils are arranged on both sides of the cathode in pairs along the second direction.

6. The electroplating device according to claim 1, characterized in that The electroplating device further includes a first power supply, wherein the first power supply is used to connect to the first coil; The electroplating device further includes a second power supply, wherein the second power supply is used to connect to the second coil; The electroplating device further includes a third power supply, which is used to connect the anode and the cathode.

7. An electroplating system, characterized in that: The electroplating system comprises the electroplating device and an electroplating solution according to any one of claims 1 to 5, wherein the electroplating solution comprises a metal salt and graphene.

8. The electroplating system according to claim 7, characterized in that: The metal salt includes one or more of copper salt, nickel salt, silver salt, tin salt, palladium salt and chromium salt; And / or, the mass concentration of the graphene is 0.5-1.5 g / L.

9. An electroplating method, which is performed using the electroplating system according to claim 7, characterized in that: It includes the following steps: S1. Placing the electroplating solution in the electroplating tank, immersing the anode, the cathode, the first coil, and the second coil in the electroplating solution; wherein the cathode includes the workpiece to be plated; S2. The first coil is energized for a first time to generate a first magnetic field, the second coil is energized for a second time to generate a second magnetic field, and the anode and the cathode are energized for a third time to form a composite coating on the surface of the workpiece to be plated; wherein the voltage of the first energization is a pulse voltage, and the magnitude of the first energization voltage is 250-260V; the voltage of the second energization is a constant current voltage, and the magnitude of the second energization voltage is 260-280V.

10. The electroplating method according to claim 9, wherein: The electroplating method satisfies one or more of the following conditions (1)-(5): (1) The first energization and the second energization are performed intermittently and in a complementary cycle; Preferably, the single power-on duration of the first power-on is 3-5s, and the intermittent duration of the first power-on is 3-5s; Preferably, the single power-on duration of the second power-on is 3-5s, and the intermittent duration of the second power-on is 3-5s; (2) The frequency of the first power supply is 4-6 Hz; (3) The magnetic field strength of the first magnetic field is 3-5T; (4) The magnetic field strength of the second magnetic field is 4-6T; (5) The current density formed by the third energization is 0.1-2A.dm -2 , preferably 0.3-0.8A.dm -2 .

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