Wafer detection mechanism and wafer loading device

Abstract

The application discloses a wafer detection mechanism and a wafer loading device, which comprise a wafer feeding mechanism, a first detection mechanism and a turnover detection mechanism, the wafer feeding mechanism is used for conveying wafers to the first detection mechanism, the first detection mechanism conveys the wafers to the turnover detection mechanism after detecting the wafers, and the turnover detection mechanism performs turnover detection on the wafers; the first detection mechanism comprises a first visual detection camera and a supporting platform, the first visual detection camera is located above the supporting platform, a first light source is arranged above the supporting platform, a second light source is arranged below the supporting platform, and the brightness of the first light source is greater than that of the second light source. The wafer surface damage is more clearly shown, so that the identification is more clear, and the problem that the existing visual camera can only supplement light on one side and it is difficult to shoot small damage, thereby leading to poor detection effect is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a wafer detection mechanism and wafer loading device. BACKGROUND

[0002] In the production process of wafers, the wafers are generally stored in wafer boxes, and the wafer box is composed of a support frame and a box cover. A plurality of wafer slots for clamping wafers are sequentially arranged on the support frame of the wafer box from bottom to top. The wafers are clamped in the wafer slots through the edge part, and then stacked on the support frame from bottom to top, and then the box cover is covered for sealing. When storing the wafers, an automatic wafer clamping device is used for clamping and storing. During this process, if the wafers in the wafer box are stacked, tilted, missing, or protruding from the support frame, there is a risk of wafer damage.

[0003] The existing patent CN116190278B discloses a wafer detection mechanism and wafer loading device. The wafer detection mechanism is used to detect the wafers in the wafer box. The wafer detection mechanism includes a detection assembly, which includes a first pair of shot sensors and a second pair of shot sensors. The first pair of shot sensors is used to detect the single wafer, left and right tilt, and missing wafer conditions. The second pair of shot sensors cooperates with the first pair of shot sensors to detect the wafer stacking, protruding from the wafer box, and front and rear tilt conditions. The detection assembly is arranged on a lifting assembly, and the lifting assembly drives the detection assembly to move up and down. The two pairs of shot sensors scan the wafers in the wafer box from bottom to top under the driving of the lifting assembly to detect whether the wafers in the wafer box are stacked, tilted, missing, or protruding from the wafer box.

[0004] Although the existing technology can detect wafers, it uses a pair of shot sensors to mainly detect wafer defects, which is difficult to detect wafer surface damage. Therefore, we propose a wafer detection mechanism and wafer loading device. SUMMARY

[0005] The present application aims to provide a wafer detection mechanism and wafer loading device to solve the problems in the prior art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a wafer detection mechanism, comprising a wafer feeding mechanism, a first detection mechanism, and a flip detection mechanism,

[0007] The wafer feeding mechanism is used to convey the wafers to the first detection mechanism. The first detection mechanism detects the wafers and then conveys them to the flip detection mechanism. The flip detection mechanism detects the wafers by flipping them.

[0008] The first detection mechanism comprises a first visual detection camera and a supporting platform, the first visual detection camera is located above the supporting platform, a first light source is arranged above the supporting platform, a second light source is arranged below the supporting platform, and the brightness of the first light source is greater than that of the second light source.

[0009] The turnover detection mechanism comprises a conveying line, a second visual detection camera and a turnover assembly, and the second visual detection camera and the turnover assembly are sequentially arranged on the conveying line.

[0010] Preferably, the wafer loading mechanism comprises a conveying frame, a driving roller is rotatably installed at one end of the conveying frame, fixing plates are slidably installed on both sides of the other end of the conveying frame, the conveying frame is provided with a tension adjusting part for adjusting the fixing plates, a driven roller is rotatably installed between the two fixing plates, a transmission belt is sleeved outside the driving roller and the driven roller, a first driving assembly for driving the driving roller to rotate is installed on one side of the conveying frame, and a partition baffle is installed above the transmission belt of the conveying frame.

[0011] Preferably, the wafer detection mechanism comprises a detection frame, two first linear modules are installed in parallel on the top of the detection frame, the second linear module is driven to reciprocate by the two first linear modules, the third linear module is driven by the second linear module, and the first visual detection camera and the suction cup are driven to move up and down by the third linear module.

[0012] Preferably, the turnover assembly comprises a support, a turnover cylinder is installed on the support, a buffer limiting part for limiting the turnover cylinder is installed on the support, the turnover cylinder drives the lifting cylinder to rotate, and the lifting cylinder drives the first suction cup assembly to move.

[0013] A wafer loading device uses the wafer detection mechanism, and comprises a loading mechanism and a bearing frame, the loading mechanism comprises a support frame, an insertion assembly is installed in the middle of the support frame, a lifting adjusting assembly is installed on the support frame at the insertion assembly, horizontal moving assemblies are installed on both sides of the support frame at the insertion assembly, and a support plate is installed on the support frame at the horizontal moving assemblies.

[0014] Preferably, the lifting adjusting assembly comprises a base, a first sliding frame is installed on the base, a lifting supporting frame is slidably installed on the first sliding frame, the lifting supporting frame is provided with an avoiding hole for avoiding the insertion assembly, a third photoelectric sensor for sensing the wafer is installed on the top of the lifting supporting frame, and support columns are installed at four corners of the top of the lifting supporting frame.

[0015] The first sliding frame is rotationally installed with a lead screw, the lifting support frame is installed with a nut matched with the lead screw, one end of the lead screw is installed with a driven bevel gear, the base is installed with a second driving assembly, the second driving assembly is driven with a driving bevel gear matched with the driven bevel gear of the lead screw;

[0016] The first sliding frame is installed with a first photoelectric sensor and a second photoelectric sensor on one side, the lifting support frame is installed with a first sensing plate matched with the first photoelectric sensor and the second photoelectric sensor;

[0017] The lifting support frame is installed with a fourth photoelectric sensor on the side away from the first sensing plate, the first sliding frame is installed with a second sensing plate matched with the fourth photoelectric sensor, and a plurality of notches are formed at equal intervals in the second sensing plate.

[0018] Preferably, the insertion assembly comprises a base, two parallel side plates are installed on the top of the base, a rotating shaft is installed between the two side plates, a second synchronous pulley is installed at both ends of the rotating shaft, a first synchronous pulley is installed in the middle of the rotating shaft, and a third driving assembly is installed on the top of the base; a plurality of lower guide wheels are installed on the lower part of each side plate, a plurality of transmission shafts are installed on the upper part of each side plate, a transmission wheel and a silica gel wheel are installed at both ends of the transmission shaft, a plurality of upper guide wheels are installed on the middle and upper part of each side plate, and the second synchronous pulley, the transmission wheel, the upper guide wheel and the lower guide wheel are connected through a synchronous belt.

[0019] Preferably, the horizontal moving assembly comprises a bottom plate and a top plate, the bottom plate and the top plate are connected through a guide assembly, a jacking cylinder for driving the lifting of the top plate is installed on the top of the bottom plate, two parallel sliding plates are installed on the top of the top plate, a second sliding frame is slidingly installed between the two sliding plates, a limiting block is installed on the top of the second sliding frame, and a push-pull cylinder for driving the reciprocating movement of the second sliding frame is installed on the top of the top plate.

[0020] Preferably, the bearing frame comprises a frame main body, limiting plates are installed on the three side plates of the frame main body, a plurality of limiting protrusions are arranged at equal intervals on the limiting plates, limiting clamping grooves are formed between adjacent limiting protrusions, and movable rods for protecting wafers are rotationally installed on the side of the frame main body without limiting plates through a pin shaft.

[0021] Preferably, the frame main body is installed with a stop rod on both sides of the limiting plate, the limiting plate and the limiting protrusion are installed with a protective pad at the limiting clamping groove, the movable rod is installed with a magnet at the end away from the pin shaft, and the frame main body is provided with a magnetic block matched with the magnet.

[0022] Compared with the prior art, the present application has the following advantages:

[0023] 1. The wafer feeding mechanism is used to transport the wafer to the first detection mechanism, the first detection mechanism detects the wafer and then transports the wafer to the flip detection mechanism, and the flip detection mechanism performs flip detection on the wafer; a first light source is arranged above the supporting platform, and a second light source is arranged below the supporting platform, the brightness of the first light source is greater than that of the second light source, by adopting the first light source and the second light source, the wafer surface damage can be more clearly displayed, so that the identification is more clear, and the problem that the existing vision camera can only single-side light compensation and the small damage is difficult to shoot, thereby leading to poor detection effect is solved.

[0024] 2. A second vision detection camera and a flip assembly are sequentially arranged on the conveying line, the flip assembly receives the wafer from the suction cup of the wafer detection mechanism, and the wafer is flipped by the flip assembly to prepare for the detection of the other side.

[0025] 3. The conveying frame is installed with a separation baffle above the transmission belt, the transmission belt can be separated by the separation baffle, two columns of wafers can be transmitted at the same time, the efficiency is higher, the conveying of multiple columns of wafers is realized without increasing the conveying line, and the overall equipment occupies space without increasing.

[0026] 4. The first sliding frame is slidably installed with a lifting supporting frame, the lifting supporting frame is lifted to drive the bearing frame to rise, thereby realizing the insertion of the wafers one by one, the lifting supporting frame is provided with a avoiding hole for avoiding the insertion assembly, so as to avoid the influence of the insertion assembly on the lifting of the lifting supporting frame, and the third photoelectric sensor is installed on the top of the lifting supporting frame to sense the wafers, so as to confirm whether the wafers are inserted.

[0027] 5. The first sliding frame is installed with a second sensing plate of the fourth photoelectric sensor, a plurality of notches are equally spaced on the second sensing plate, and the plurality of notches mainly cooperate with the insertion slots of the bearing frame to realize sensing one by one. The third driving assembly can drive the silica gel wheel to rotate, thereby realizing the horizontal movement of the wafer, the middle part of the side plate is an inner recess structure, which is mainly used for cooperating with the lifting of the lifting supporting frame. The top cylinder drives the top plate to rise, which can lift the bearing frame on the supporting plate, so that the bearing frame is separated from the supporting plate, and then the push-pull cylinder drives the second sliding frame to move, which can send the bearing frame to the lifting supporting frame of the lifting adjusting assembly, thereby being used for the loading of the wafer.

[0028] 6. The limiting plate and the limiting protrusion are installed with a protective pad at the limiting clamping groove, the protective pad can protect the edge of the wafer, so as to avoid the damage of the edge of the wafer, the magnet is installed on the end of the movable rod away from the pin shaft, and the frame main body is provided with a magnetic block matched with the magnet; when the movable rod is rotated to the vertical state, the movable rod can block the opening end of the bearing frame, so as to avoid the wafer from sliding off the opening end, the safety of the wafer is higher, and the existing bearing frame is an opening structure without protection for the wafer. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0030] Figure 1 This is a schematic diagram of the structure of the present invention;

[0031] Figure 2 This is a schematic diagram of the wafer loading mechanism of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the first detection mechanism of the present invention;

[0033] Figure 4 This is a schematic diagram of the structure of the flipping component of the present invention;

[0034] Figure 5 This is a schematic diagram of the loading mechanism of the present invention;

[0035] Figure 6 This is a schematic diagram of the structure of the lifting adjustment component, the insertion component, and the horizontal movement component of the present invention;

[0036] Figure 7 This is a schematic diagram of the lifting adjustment component and the insertion component of the present invention;

[0037] Figure 8 This is a schematic diagram of the lifting and adjusting assembly of the present invention;

[0038] Figure 9 This is a schematic diagram of the structure of the insertion component of the present invention;

[0039] Figure 10 This is a schematic diagram of the structure of the horizontal moving component of the present invention;

[0040] Figure 11 This is a schematic diagram of the structure of the load-bearing frame of the present invention;

[0041] Figure 12 This is a schematic diagram of the limiting plate of the present invention.

[0042] In the figure: 1, wafer loading mechanism; 2, first detection mechanism; 3, turnover detection mechanism; 4, loading mechanism; 5, bearing frame; 11, conveying frame; 12, tension adjusting piece; 13, fixed plate; 14, driven roller; 15, conveying belt; 16, separation baffle; 17, first driving assembly; 21, detection frame; 22, first linear module; 23, first visual detection camera; 24, second linear module; 25, supporting platform; 26, third linear module; 31, conveying line; 32, second visual detection camera; 33, turnover assembly; 331, support; 332, turnover cylinder; 333, buffer limiting piece; 334, lifting cylinder; 335, first suction cup assembly; 41, supporting frame; 42, lifting adjusting assembly; 43, insertion assembly; 44, supporting plate; 45, horizontal moving assembly; 4201, base; 4202, first sliding frame; 4203, first photoelectric sensor; 4204, lead screw; 4205, first induction plate; 4206, second photoelectric sensor; 4207, supporting column; 4208, third photoelectric sensor; 4209, second driving assembly; 4210, second induction plate; 4211, fourth photoelectric sensor; 4212, lifting supporting frame; 4301, base; 4302, third driving assembly; 4303, rotating shaft; 4304, first synchronous pulley; 4305, second synchronous pulley; 4306, lower guide wheel; 4307, side plate; 4308, synchronous belt; 4309, upper guide wheel; 4310, transmission wheel; 4311, transmission shaft; 4312, silica gel wheel; 451, bottom plate; 452, top plate; 453, jacking cylinder; 454, guide assembly; 455, sliding plate; 456, limiting block; 457, second sliding frame; 458, push-pull cylinder; 51, frame body; 52, blocking rod; 53, limiting plate; 54, limiting protrusion; 55, movable rod; 56, protective pad. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application.

[0044] Please refer to Figure 1The wafer detection mechanism and the wafer loading device, which comprise a wafer feeding mechanism 1, a first detection mechanism 2 and a turnover detection mechanism 3; the wafer feeding mechanism 1 is used for conveying the wafer to the first detection mechanism 2, the first detection mechanism 2 conveys the wafer to the turnover detection mechanism 3 after detecting the wafer, and the turnover detection mechanism 3 performs turnover detection on the wafer.

[0045] As Figure 2 The first detection mechanism 2 comprises a first visual detection camera 23 and a supporting platform 25, the first visual detection camera 23 is located above the supporting platform 25, a first light source is arranged above the supporting platform 25, a second light source is arranged below the supporting platform 25, the brightness of the first light source is greater than that of the second light source, by adopting the first light source and the second light source, the wafer surface damage can be more clearly displayed, so that the identification is more clear, and the problem that the existing visual camera can only single-sided light compensation and the small damage is difficult to shoot, thereby leading to poor detection effect is solved.

[0046] As Figure 2 The wafer detection mechanism comprises a detection frame 21, two first linear modules 22 are arranged in parallel on the top of the detection frame 21, the second linear module 24 is driven to reciprocate by the two first linear modules 22, the third linear module 26 is driven by the second linear module 24, and the first visual detection camera 23 and the suction cup are driven to move up and down by the third linear module 26, the movement of the first visual detection camera 23 and the suction cup in the three-dimensional space can be realized by the first linear module 22, the second linear module 24 and the third linear module 26, and the wafer can be transmitted to the turnover assembly 33 by the suction cup.

[0047] As Figure 1 The turnover detection mechanism 3 comprises a conveying line 31, a second visual detection camera 32 and a turnover assembly 33, the second visual detection camera 32 and the turnover assembly 33 are sequentially arranged on the conveying line 31, the turnover assembly 33 receives the wafer from the suction cup of the wafer detection mechanism, and the wafer is turned over by the turnover assembly 33, so as to prepare for the detection of the other side.

[0048] As Figure 2The wafer loading mechanism 1 comprises a conveying frame 11, one end of the conveying frame 11 is rotatably provided with a driving roller, both sides of the other end of the conveying frame 11 are slidably provided with fixed plates 13, the conveying frame 11 is provided with a tension adjusting part 12 for adjusting the fixed plates 13, two fixed plates 13 are rotatably provided with driven rollers 14, the outer sides of the driving roller and the driven rollers 14 are provided with a conveying belt 15, one side of the conveying frame 11 is provided with a first driving assembly 17 for driving the driving roller to rotate, the conveying frame 11 is provided with a separation baffle 16 above the conveying belt 15, the conveying belt 15 can be separated by the separation baffle 16, and two rows of wafers can be simultaneously conveyed, and the efficiency is higher.

[0049] As Figure 1 And 4 The turnover assembly 33 comprises a support 331, the support 331 is provided with a turnover cylinder 332, the support 331 is provided with a buffer limiting part 333 for limiting the turnover cylinder 332, the turnover cylinder 332 drives a lifting cylinder 334 to rotate, and the lifting cylinder 334 drives a first suction disc assembly 335 to move.

[0050] As Figures 5-7 A wafer loading device uses the wafer detection mechanism, and comprises a loading mechanism 4 and a bearing frame 5, the loading mechanism 4 comprises a support frame 41, the support frame 41 can support the bearing frame 5, a middle part of the support frame 41 is provided with an inserting assembly 43, the inserting assembly 43 can insert the detected wafer into the bearing frame 5 at a lifting adjusting assembly 42, the support frame 41 is provided with the lifting adjusting assembly 42 at the inserting assembly 43, both sides of the support frame 41 are provided with horizontal moving assemblies 45 at the inserting assembly 43, the horizontal moving assemblies 45 can realize feeding and discharging of the bearing frame 5, and the support frame 41 is provided with a support plate 44 at the horizontal moving assemblies 45, and the bearing frame 5 can be supported through the support plate 44.

[0051] As Figure 8 The lifting adjusting assembly 42 comprises a base 4201, the base 4201 is provided with a first sliding frame 4202, the first sliding frame 4202 is slidably provided with a lifting support frame 4212, the lifting support frame 4212 can drive the bearing frame 5 to ascend, so that the wafers are inserted one by one, the lifting support frame 4212 is provided with an avoiding hole for avoiding the inserting assembly 43, so as to avoid that the inserting assembly 43 affects the lifting of the lifting support frame 4212, the lifting support frame 4212 is provided with a third photoelectric sensor 4208 at the top for sensing the wafer, so as to confirm whether the wafer is inserted, and the lifting support frame 4212 is provided with support columns 4207 at four corners of the top, and the support columns 4207 are used for supporting and limiting the bearing frame 5;

[0052] The first sliding frame 4202 is rotatably mounted with a lead screw 4204, and the lifting support frame 4212 is mounted with a nut that cooperates with the lead screw 4204. One end of the lead screw 4204 is mounted with a driven bevel gear, and the base 4201 is mounted with a second drive assembly 4209. The second drive assembly 4209 drives a driving bevel gear that meshes with the driven bevel gear of the lead screw 4204. The lifting and lowering of the lifting support frame 4212 can be realized through the second drive assembly 4209.

[0053] like Figure 8 The first sliding frame 4202 is equipped with a first photoelectric sensor 4203 and a second photoelectric sensor 4206 on one side, and the lifting support frame 4212 is equipped with a first sensing plate 4205 that cooperates with the first photoelectric sensor 4203 and the second photoelectric sensor 4206; the highest and lowest positions of the lifting support frame 4212 are limited.

[0054] like Figure 8 The lifting support frame 4212 is equipped with a fourth photoelectric sensor 4211 on the side away from the first sensing plate 4205. The first sliding frame 4202 is equipped with a second sensing plate 4210 that is connected to the fourth photoelectric sensor 4211. The second sensing plate 4210 has multiple notches at equal intervals. The multiple notches mainly cooperate with each slot of the bearing frame 5 to realize the sensing one by one.

[0055] like Figure 9 The insertion assembly 43 includes a base 4301, with two parallel side plates 4307 mounted on the top of the base 4301. A rotating shaft 4303 is installed between the two side plates 4307. Second synchronous pulleys 4305 are mounted at both ends of the rotating shaft 4303, and a first synchronous pulley 4304 is mounted in the middle of the rotating shaft 4303. A third drive assembly 4302 is mounted on the top of the base 4301. Multiple lower guide wheels 4306 are mounted on the lower part of each side plate 4307, and multiple transmission wheels are mounted on the upper part of each side plate 4307. The drive shaft 4311 has a drive wheel 4310 and a silicone wheel 4312 installed at both ends. Each side plate 4307 has multiple upper guide wheels 4309 installed in the upper middle part. The second synchronous belt pulley 4305, the drive wheel 4310, the upper guide wheel 4309 and the lower guide wheel 4306 are connected by a synchronous belt 4308. The silicone wheel 4312 can be driven to rotate by the third drive assembly 4302, thereby realizing the horizontal movement of the wafer. The middle part of the side plate 4307 has a concave structure, which is mainly used to cooperate with the lifting support 4212 for lifting.

[0056] like Figure 10The horizontal moving assembly 45 comprises a bottom plate 451 and a top plate 452 which are movably connected through a guide assembly 454, a jacking cylinder 453 is installed on the top of the bottom plate 451 and drives the top plate 452 to ascend and descend, two sliding plates 455 are installed on the top of the top plate 452 in parallel, a second sliding frame 457 is slidably installed between the two sliding plates 455, a limiting block 456 is installed on the top of the second sliding frame 457, a push-pull cylinder 458 is installed on the top of the top plate 452 and drives the second sliding frame 457 to move back and forth, the jacking cylinder 453 drives the top plate 452 to ascend, so that the load bearing frame 5 on the supporting plate 44 can be lifted and separated from the supporting plate 44, then the push-pull cylinder 458 drives the second sliding frame 457 to move, so that the load bearing frame 5 can be sent to the lifting support frame 4212 of the lifting adjusting assembly 42, thereby being used for loading the wafer.

[0057] As Figure 11 The load bearing frame 5 comprises a frame body 51, limiting plates 53 are installed on three side plates 4307 of the frame body 51, a plurality of limiting protrusions 54 are arranged at equal intervals on the limiting plates 53, limiting clamping grooves are formed between adjacent limiting protrusions 54, movable rods 55 for protecting the wafer are rotatably installed on the side of the frame body 51 without the limiting plate 53 through a pin shaft, blocking rods 52 are installed on the two sides of the frame body 51 located on the limiting plate 53, protective pads 56 are installed on the limiting plate 53 and the limiting protrusion 54 located at the limiting clamping groove, the protective pad 56 can protect the edge of the wafer and avoid damage to the edge of the wafer, a magnet is installed on the end of the movable rod 55 away from the pin shaft, and the frame body 51 is provided with a magnetic block matched with the magnet, when the movable rod 55 is rotated to the vertical state, the movable rod 55 can block the opening end of the load bearing frame 5, so as to avoid the wafer from sliding off the opening end, and the safety of the wafer is higher, and the existing load bearing frame is of an opening structure and does not have the protection function for the wafer.

[0058] Finally, it should be noted that: the above only describes the preferred embodiments of the present application and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement for some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer loading device, characterized by: Wafer detection mechanism is used, including loading mechanism (4) and bearing frame (5), the loading mechanism (4) includes support frame (41), the middle part of the support frame (41) is provided with insertion assembly (43), the support frame (41) is provided with lifting adjusting assembly (42) at insertion assembly (43), the support frame (41) is provided with horizontal moving assembly (45) on both sides of insertion assembly (43), the support frame (41) is provided with support plate (44) at horizontal moving assembly (45); The lifting adjusting assembly (42) includes a base (4201), the base (4201) is provided with a first sliding frame (4202), the first sliding frame (4202) is slidably provided with a lifting support frame (4212), the lifting support frame (4212) is provided with an avoiding hole for avoiding the insertion assembly (43), the lifting support frame (4212) is provided with a third photoelectric sensor (4208) on the top for sensing the wafer, and the lifting support frame (4212) is provided with a support column (4207) on the four corners of the top; The first sliding frame (4202) is rotatably provided with a lead screw (4204), the lifting support frame (4212) is provided with a nut matched with the lead screw (4204), one end of the lead screw (4204) is provided with a driven bevel gear, the base (4201) is provided with a second driving assembly (4209), and the second driving assembly (4209) is driven with a driving bevel gear matched with the driven bevel gear of the lead screw (4204); The first sliding frame (4202) is provided with a first photoelectric sensor (4203) and a second photoelectric sensor (4206) on one side, and the lifting support frame (4212) is provided with a first sensing plate (4205) matched with the first photoelectric sensor (4203) and the second photoelectric sensor (4206); The lifting support frame (4212) is provided with a fourth photoelectric sensor (4211) away from the first sensing plate (4205) on one side, and the first sliding frame (4202) is provided with a second sensing plate (4210) matched with the fourth photoelectric sensor (4211), and the second sensing plate (4210) is provided with a plurality of notches at equal intervals; The inserting assembly (43) comprises a base (4301), two parallel side plates (4307) are mounted on the top of the base (4301), a rotating shaft (4303) is mounted between the two side plates (4307), second synchronous pulleys (4305) are mounted at the two ends of the rotating shaft (4303), a first synchronous pulley (4304) is mounted at the middle of the rotating shaft (4303), and a third driving assembly (4302) is mounted on the top of the base (4301); a plurality of lower guide wheels (4306) are mounted on the lower part of each side plate (4307), a plurality of transmission shafts (4311) are mounted on the upper part of each side plate (4307), transmission wheels (4310) and silica gel wheels (4312) are mounted at the two ends of the transmission shaft (4311), a plurality of upper guide wheels (4309) are mounted on the middle upper part of each side plate (4307), and the second synchronous pulleys (4305), the transmission wheels (4310), the upper guide wheels (4309) and the lower guide wheels (4306) are connected through synchronous belts (4308).

2. The wafer loading apparatus according to claim 1, wherein: The horizontal moving assembly (45) comprises a bottom plate (451) and a top plate (452), the bottom plate (451) and the top plate (452) are connected through a guide assembly (454), a jacking cylinder (453) for driving the top plate (452) to ascend and descend is mounted on the top of the bottom plate (451), two parallel sliding plates (455) are mounted on the top of the top plate (452), a second sliding frame (457) is slidably mounted between the two sliding plates (455), a limiting block (456) is mounted on the top of the second sliding frame (457), and a push-pull cylinder (458) for driving the second sliding frame (457) to move back and forth is mounted on the top of the top plate (452).

3. The wafer loading apparatus of claim 1, wherein: The bearing frame (5) comprises a frame body (51), limiting plates (53) are mounted on the three side plates (4307) of the frame body (51), a plurality of limiting protrusions (54) are arranged at equal intervals on the limiting plates (53), limiting clamping grooves are formed between adjacent limiting protrusions (54), and movable rods (55) for protecting wafers are rotatably mounted on the side of the frame body (51) without the limiting plates (53) through pin shafts.

4. The wafer loading apparatus according to claim 3, wherein: The frame body (51) is mounted with blocking rods (52) on the two sides of the limiting plates (53), the limiting plates (53) and the limiting protrusions (54) are mounted with protective pads (56) at the limiting clamping grooves, the movable rods (55) are mounted with magnets at the ends away from the pin shafts, and the frame body (51) is provided with magnetic blocks matched with the magnets.

5. The wafer loading apparatus of claim 1, wherein: The wafer detection mechanism comprises a wafer feeding mechanism (1), a first detection mechanism (2) and a turnover detection mechanism (3); The wafer feeding mechanism (1) is used for conveying wafers to the first detection mechanism (2), the first detection mechanism (2) conveys the wafers to the turnover detection mechanism (3) after detecting the wafers, and the turnover detection mechanism (3) performs turnover detection on the wafers; The first detection mechanism (2) comprises a first visual detection camera (23) and a supporting platform (25), the first visual detection camera (23) is located above the supporting platform (25), a first light source is arranged above the supporting platform (25), a second light source is arranged below the supporting platform (25), and the brightness of the first light source is greater than that of the second light source; The turnover detection mechanism (3) comprises a conveying line (31), a second visual detection camera (32) and a turnover assembly (33), and the second visual detection camera (32) and the turnover assembly (33) are sequentially arranged on the conveying line (31).

6. The wafer loading apparatus of claim 5, wherein: The wafer loading mechanism (1) comprises a conveying frame (11), one end of the conveying frame (11) is rotatably provided with a driving roller, both sides of the other end of the conveying frame (11) are slidably provided with fixed plates (13), the conveying frame (11) is provided with a tension adjusting part (12) for adjusting the fixed plates (13), a driven roller (14) is rotatably arranged between the two fixed plates (13), the outer sides of the driving roller and the driven roller (14) are sleeved with a transmission belt (15), one side of the conveying frame (11) is provided with a first driving assembly (17) for driving the driving roller to rotate, and the conveying frame (11) is provided above the transmission belt (15) with a separation baffle (16).

7. The wafer loading apparatus of claim 5, wherein: The wafer detection mechanism comprises a detection frame (21), the top of the detection frame (21) is provided with two first linear modules (22) arranged in parallel, the two first linear modules (22) jointly drive a second linear module (24) to move reciprocatingly, the second linear module (24) drives a third linear module (26), and the third linear module (26) drives the first visual detection camera (23) and the suction cup to move up and down.

8. The wafer loading apparatus of claim 5, wherein: The turnover assembly (33) comprises a support (331), the support (331) is provided with a turnover cylinder (332), the support (331) is provided with a buffer limiting part (333) for limiting the turnover cylinder (332), the turnover cylinder (332) drives a lifting cylinder (334) to rotate, and the lifting cylinder (334) drives a first suction cup assembly (335) to move.

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