Gold plating method and system

Abstract

The invention provides an electroplating gold-plating method and system, and the method comprises the steps: obtaining a gold-plating target task, and obtaining the target data of a to-be-plated target based on the gold-plating target task; extracting gold plating weight data from a preset gold plating library based on the target data; determining the gold plating electric quantity of the to-be-gold-plated target based on the gold plating weight data Gold-plating the target to be gold-plated based on the gold-plating electric quantity, and storing the gold-plating electric quantity of the target to be gold-plated into a preset gold-plating library; in the continuous gold plating process, whether gold plating parameters of the to-be-gold-plated target are changed or not is detected, if the gold plating parameters are changed, the gold plating electric quantity is corrected, and the to-be-gold-plated target is gold-plated based on the corrected gold plating electric quantity; according to the method, the process of repeated weighing for multiple times can be omitted, and the weight accuracy and electroplating efficiency of electroplating production are improved.

Description

Technical Field

[0001] The invention belongs to the technical field of gold plating, and in particular relates to an electroplating gold plating method and system. Background Art

[0002] Gold electroplating has a history of over 200 years. Gold coatings have a golden appearance and exhibit excellent chemical stability, discoloration resistance, electrical conductivity, corrosion resistance, and oxidation resistance. Furthermore, they offer excellent solderability, low contact resistance, and thermocompression bonding properties, making them suitable for both decorative and functional applications. Consequently, gold electroplating is widely used in jewelry, watches, handicrafts, electronic instruments, instrumentation, aviation, and aerospace industries.

[0003] The traditional 3D hard gold production method uses simple rectifiers, gold plating tanks, hanging cages and other equipment, and the workers rely on their work experience to operate manually. The specific operating procedures are: they set the estimated current according to the type, specification and quantity of the product, and constantly observe the color of the product to determine whether the current is appropriate and make adjustments at any time; after the estimated electroplating period, the products are taken out and weighed one by one. Those with basically qualified weight are considered finished products; those with insufficient weight are put back to their original place and continue electroplating. After the workers estimate the electroplating period again, they take out the products and weigh them again, repeating the work of the first weighing. Those that exceed the weight are taken down for electrolysis to reduce the weight, and so on, until all products are plated. It generally takes about four weighings to complete the production of all products, and sometimes as many as six or seven times. This method is time-consuming, labor-intensive, has a low yield rate, and high losses. It requires high industry experience and technical level of the workers; In the prior art, gold plating is performed by determining the time required for electroplating, that is, by determining the time required for electroplating of a certain target to be gold-plated, and then electroplating is performed according to the required time for electroplating, without the need for repeated weighing. However, in actual situations, due to equipment failure and other external factors, the actual time required for electroplating may be greater than the calculated time required for electroplating, resulting in incomplete electroplating during the actual electroplating process, further affecting the electroplating efficiency. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides a gold electroplating method and system for solving the technical problems in the prior art.

[0005] In one aspect, the present invention provides the following technical solution: a gold electroplating method, comprising: Acquire a gold-plating target task, and acquire target data of a target to be gold-plated based on the gold-plating target task; Extracting gold plating weight data from a preset gold plating library based on the target data; Determining the gold plating quantity of the target to be gold plated based on the gold plating weight data; Gold-plating the target to be gold-plated based on the gold-plating quantity and storing the gold-plating quantity of the target to be gold-plated into the preset gold-plating library; During the continuous gold plating process, it is detected whether the gold plating parameters of the target to be gold plated change. If the gold plating parameters change, the gold plating power is corrected and the target to be gold plated is gold plated based on the corrected gold plating power. If the gold plating parameters do not change, the gold plating power pre-stored in a preset gold plating library is used to gold plate the target to be gold plated.

[0006] Compared with the prior art, the beneficial effects of the present invention are as follows: the present invention first obtains a gold plating target task, and obtains target data of the target to be gold-plated based on the gold plating target task; then, based on the target data, extracts gold plating weight data from a preset gold plating library; based on the gold plating weight data, determines the gold plating quantity of the target to be gold-plated; then, based on the gold plating quantity, the target to be gold-plated is gold-plated and the gold plating quantity of the target to be gold-plated is stored in the preset gold plating library; then, during the continuous gold plating process, it is detected whether the gold plating parameters of the target to be gold-plated change; if the gold plating parameters change, the gold plating quantity is corrected and the target to be gold-plated is gold-plated based on the corrected gold plating quantity; if the gold plating parameters do not change, the gold plating quantity pre-stored in the preset gold plating library is used to plate the target to be gold-plated; the present invention determines the quantity gold plating coefficient to reflect the relationship between the gold plating quantity and the weight of the gold-plated product, thereby determining the final gold plating quantity, and electroplating the product according to the gold plating quantity, which can save the process of repeated weighing and improve the weight accuracy and electroplating efficiency of electroplating production.

[0007] Preferably, the target data includes: product type, quantity to be processed, and product parameters corresponding to the product type.

[0008] Preferably, the step of extracting the gold plating weight data from the preset gold plating library based on the target data includes: Obtain target data of several historical gold-plated targets, and associate the target data of corresponding targets to obtain a preset gold-plated library; Extract gold plating feature data from the preset gold plating library according to the product type in the target data, and determine gold plating weight data based on the gold plating feature data: ; ; ; ; ; Where, For products and hangers, the weight of gold plating is required. The gold plating weight required for a single product. is the number of products, is the gold plating efficiency of the standard hanger in the standard solution, is the gold plating efficiency of the standard solution in the standard hanger, The gold plating efficiency of ordinary hangers in ordinary chemical solutions is: The gold plating efficiency of ordinary liquid in ordinary hangers is is the gold-plated weight of the standard hanger in the standard solution, is the gold plating weight of the product in the standard hanger and standard solution, The gold plating weight of the product in ordinary hangers and ordinary liquid medicine, It is the gold plating weight of ordinary hangers in ordinary liquid medicine.

[0009] Preferably, the step of determining the gold plating quantity of the target to be gold plated based on the gold plating weight data includes: Calculate the gold plating coefficient based on the gold plating weight data : ; Where, Gilding electricity for history, The combined weight of gold plating is required for the product and the hanger; Based on the gold plating coefficient Determine the gold plating quantity of the target to be gold plated : ; Where, The target gold plating amount.

[0010] Preferably, the step of gold-plating the target to be gold-plated based on the gold-plating quantity includes: The target to be gold-plated is gold-plated by a gold-plating device, and the real-time cumulative gold-plating power of the gold-plating device is continuously detected during the gold-plating process. If the real-time cumulative gold-plating power does not reach the gold-plating power, the gold-plating process is continued; if the real-time cumulative gold-plating power has reached the gold-plating power, the gold-plating process is completed.

[0011] Preferably, the step of detecting whether the gold plating parameters of the target to be gold-plated change during the continuous gold plating process, and if so, correcting the gold plating power and gold plating the target to be gold-plated based on the corrected gold plating power, and if the gold plating parameters do not change, using the gold plating power pre-stored in a preset gold plating library to gold plate the target to be gold-plated comprises: During the continuous gold plating process, it is detected whether the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have changed. If the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have changed, the hanger gold plating coefficient and the chemical liquid gold plating coefficient of the corresponding target to be gold-plated are corrected, and the corrected gold plating quantity is determined based on the corrected hanger gold plating coefficient and the chemical liquid gold plating coefficient. The target to be gold-plated is gold-plated based on the corrected gold plating quantity. If the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have not changed, the gold plating quantity pre-stored in the preset gold plating library is used to plate the target to be gold-plated.

[0012] In a second aspect, the present invention provides the following technical solution: an electroplating gold plating system, the system comprising: A data module is used to obtain a gold-plating target task, and obtain target data of a target to be gold-plated based on the gold-plating target task; An efficiency module, configured to extract gold plating weight data from a preset gold plating library based on the target data; A power module, configured to determine the gold plating power of the target to be gold plated based on the gold plating weight data; a gold plating module, configured to perform gold plating on the target to be gold plated based on the gold plating quantity and store the gold plating quantity of the target to be gold plated into the preset gold plating library; The correction module is used to detect whether the gold plating parameters of the target to be gold-plated change during the continuous gold plating process. If the gold plating parameters change, the gold plating power is corrected and the target to be gold-plated is gold-plated based on the corrected gold plating power.

[0013] Preferably, the power module includes: The first calculation submodule is used to calculate the gold plating coefficient based on the gold plating weight data : ; Where, Gold-plated electricity for history, It is the actual gold plating weight of a single product. is the number of products; The second calculation submodule is used to calculate the gold plating coefficient based on the power Determine the gold plating quantity of the target to be gold plated : ; Where, The weight of gold plating required for a single product.

[0014] In a third aspect, the present invention provides the following technical solution: a computer comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the above-mentioned electroplating gold plating method when executing the computer program.

[0015] In a fourth aspect, the present invention provides the following technical solution: a storage medium having a computer program stored thereon, wherein the computer program implements the above-mentioned electroplating gold plating method when executed by a processor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 Flowchart of the electroplating gold plating method provided in Example 1 of the present invention; Figure 2 A structural block diagram of a gold electroplating system provided in the second embodiment of the present invention; Figure 3 A schematic diagram of the hardware structure of a computer provided in another embodiment of the present invention.

[0018] The embodiments of the present invention will be further described below with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0020] Example 1 In the first embodiment of the present invention, Figure 1 As shown, a gold electroplating method includes: S1, obtaining a gold-plating target task, and obtaining target data of a target to be gold-plated based on the gold-plating target task; Specifically, before the gold plating process is carried out, it is necessary to first obtain the gold plating target task, and the target data of the target to be gold plated can be obtained from the gold plating target task, and the target data includes the product type, the quantity to be processed and the product parameters corresponding to the product type.

[0021] It should be noted that in the present application, the product type of each product, the product parameters corresponding to the product type, and the corresponding type of electroplating hanger can be identified, and the product type, the product parameters and the type of utensil can be input into the electroplating equipment as input information. In some optional embodiments, a product type-product parameter mapping table can be established in advance, and all product types in the market and the corresponding product parameters can be entered into the product type-product parameter mapping table. The product parameters corresponding to the product type can be determined by looking up the mapping table.

[0022] In this application, it is usually necessary to use electroplating racks to perform electroplating operations on products on the market, such as spring cages, wire cages or roller cages, and the selection of electroplating racks is usually determined by the product parameters of the product to be processed. Different electroplating racks can be selected according to different product parameters. It can be understood that the product information of the product to be processed can be provided by the supplier itself or measured by corresponding equipment.

[0023] S2. extracting gold plating weight data from a preset gold plating library based on the target data; Wherein, the step S2 includes: S21, obtaining target data of several historical gold-plated targets, and correlating the target data of corresponding targets to obtain a preset gold-plated library; Specifically, for the target data, it can be historical gold plating data, and the gold plating liquid state, hanger, gold plating product weight, product parameters and gold plating process parameters corresponding to the historical gold plating target electroplating are correspondingly associated and a database is constructed, and then a gold plating library is preset.

[0024] S22. Extract gold plating feature data from the preset gold plating database according to the product type in the target data, and determine gold plating weight data based on the gold plating feature data: ; ; ; ; ; Where, For products and hangers, the weight of gold plating is required. The gold plating weight required for a single product. is the number of products, is the gold plating efficiency of the standard hanger in the standard solution, is the gold plating efficiency of the standard solution in the standard hanger, The gold plating efficiency of ordinary hangers in ordinary chemical solutions is: The gold plating efficiency of ordinary liquid in ordinary hangers is is the gold-plated weight of the standard hanger in the standard solution, is the gold plating weight of the product in the standard hanger and standard solution, The gold plating weight of the product in ordinary hangers and ordinary liquid medicine, It is the gold plating weight of ordinary hangers in ordinary liquid medicine; Specifically, the calculation formula for the gold plating weight data only calculates the change in value. The gold plating weight data is related to the following influencing factors, including: the state of the plating solution, the type of plating rack, the degree of use of the plating rack, the type, parameters, quantity, weight or volume of the product; and the type of mold material. Therefore, the corresponding gold plating weight data will also be different according to the changes in the above influencing factors. In this embodiment, the corresponding liquid plating coefficient and rack plating coefficient will also be different according to the different gold plating solutions and racks. That is, in the above formula At the same time, the above-mentioned gold plating weight required for a single product can be obtained from the preset gold plating library and the corresponding tasks, which represents the weight of gold plating required for the single product. The liquid gold plating coefficient is specifically expressed as a characteristic parameter of the gold plating liquid, which changes according to the type and state of the gold plating liquid. The hanger gold plating coefficient specifically reflects the difference in hangers, which changes according to the type and state of the hanger.

[0025] S3, determining the gold plating quantity of the target to be gold plated based on the gold plating weight data; Wherein, the step S3 includes: S31, calculating the gold plating coefficient based on the gold plating weight data : ; Where, Gilding electricity for history, The combined weight of gold plating is required for the product and the hanger; Specifically, the above formula only calculates the change in numerical value, and the electricity gold plating coefficient specifically reflects the relationship between the actual gold plating electricity and the weight of the gold-plated product. The electricity gold plating coefficient can be calculated based on the historical gold plating electricity recorded by the same product in the same gold plating environment stored last time and the corresponding gold plating weight data. The same gold plating environment here specifically refers to the same liquid state, hanger characteristics, and gold plating weight data.

[0026] S32, based on the gold plating coefficient of the electricity Determine the gold plating quantity of the target to be gold plated : ; Where, The amount of gold plating for the target; Specifically, the above formula only calculates the change in numerical value. After fitting the relationship between the actual gold-plating power and the weight of the gold-plated product to obtain the power gold-plating coefficient, the corresponding gold-plating power can be obtained according to the power gold-plating coefficient. In the actual gold-plating process, it is only necessary to control the gold-plating process according to the actual required gold-plating power. When the power is reached, the corresponding gold-plating process can be completed. At the same time, the equipment automatically alarms and automatically turns off the power. This is different from the prior art method of estimating the time required for electroplating based on the weight of the product. As for the time required for electroplating, using traditional machine production, employees estimate the production time based on whether the product weight reaches the required weight, but repeated weighing is still required. In the actual production process, this time is affected by employee operation, equipment failure and other external environments, which will cause the actual required electroplating time to be longer than the estimated electroplating time. Therefore, once In actual production, if the estimated time required for electroplating is used, the electroplating may not be completed. However, the present application determines the relationship between the amount of electricity and the weight of the gold-plated product, and the electroplating electricity is not easily affected by external factors. Therefore, the actual gold plating is carried out according to the electroplating electricity, which effectively ensures that the electroplating process is completed smoothly and the error of the weight of the gold-plated product is within ±0.04g. At the same time, the production procedures and labor intensity are reduced, the labor time is shortened, the number of manpower is reduced, the production loss is reduced, and the production efficiency is improved. At the same time, the gold loss caused by multiple weighing in the middle is reduced to zero loss without weighing in the middle, reducing invalid gold plating and loss. At the same time, for traditional machines based on manual weighing estimation time production, the product weight difference is about ±0.2g, and the qualified rate is about 75%. However, the present application performs electroplating according to the gold plating electricity, so that the product weight difference is controlled within ±0.04g, and the qualified rate is 99%.

[0027] S4, performing gold plating on the target to be gold-plated based on the gold plating power and storing the gold plating power of the target to be gold-plated into the preset gold plating library; Wherein, the step S4 includes: The target to be gold-plated is gold-plated by a gold-plating device, and the real-time cumulative gold-plating power of the gold-plating device is continuously detected during the gold-plating process. If the real-time cumulative gold-plating power does not reach the gold-plating power, the gold-plating process is continued; if the real-time cumulative gold-plating power has reached the gold-plating power, the gold-plating process is completed.

[0028] Specifically, during the gold plating process, the current cumulative gold plating power will be detected in real time. When the cumulative gold plating power reaches the calculated gold plating power, the gold plating process is completed. At this time, the gold plating equipment will alarm and automatically stop the gold plating process. If the calculated gold plating power is not reached, the gold plating process can be continued until the calculated gold plating power is reached. It should be noted that after the gold plating electricity is calculated, the gold plating electricity is stored in the preset gold plating library, and the gold plating electricity is associated with the corresponding product and the corresponding product parameters. Therefore, in the next gold plating process, the gold plating electricity can be directly retrieved from the preset gold plating library without calculation.

[0029] S5. During the continuous gold plating process, whether the gold plating parameters of the target to be gold-plated change is detected. If the gold plating parameters change, the gold plating power is corrected and the target to be gold-plated is gold-plated based on the corrected gold plating power. If the gold plating parameters do not change, the target to be gold-plated is gold-plated using the gold plating power pre-stored in a preset gold plating library.

[0030] Wherein, the step S5 includes: During the continuous gold plating process, whether the target type, gold plating liquid characteristics, and hanger characteristics of the target to be gold-plated have changed is detected; if the target type, gold plating liquid characteristics, and hanger characteristics of the target to be gold-plated have changed, the hanger gold plating coefficient and the liquid gold plating coefficient of the corresponding target to be gold-plated are corrected; a corrected gold plating quantity is determined based on the corrected hanger gold plating coefficient and the liquid gold plating coefficient; the target to be gold-plated is gold-plated based on the corrected gold plating quantity; if the target type, gold plating liquid characteristics, and hanger characteristics of the target to be gold-plated have not changed, the target to be gold-plated is gold-plated using the gold plating quantity pre-stored in a preset gold plating library; Specifically, when different products are replaced, the corresponding target types, gold plating liquid characteristics, and hanger characteristics have changed. Therefore, it is necessary to calibrate the hanger gold plating coefficient and the liquid gold plating coefficient, and then calibrate the gold plating quantity. At the same time, when the same type of product is electroplated 5-10 times, the gold plating weight data here will also change, so the corresponding quantity gold plating coefficient will also change. Therefore, the above method is also needed for correction, and the gold plating quantity after correction also needs to be stored in the preset gold plating library.

[0031] The first embodiment of the present invention provides an electroplating gold plating method, which first obtains a gold plating target task, and obtains target data of a target to be gold-plated based on the gold plating target task; then extracts gold plating weight data from a preset gold plating library based on the target data; determines the gold plating quantity of the target to be gold-plated based on the gold plating weight data; then gold-plates the target to be gold-plated based on the gold plating quantity and stores the gold plating quantity of the target to be gold-plated in the preset gold plating library; then, during the continuous gold plating process, detects whether the gold plating parameters of the target to be gold-plated change; if the gold plating parameters change, the gold plating quantity is corrected and the target to be gold-plated is gold-plated based on the corrected gold plating quantity; if the gold plating parameters do not change, the gold plating quantity pre-stored in the preset gold plating library is used to plate the target to be gold-plated. The present invention determines a quantity gold plating coefficient to reflect the relationship between the gold plating quantity and the weight of the gold-plated product, thereby determining the final gold plating quantity, and electroplating the product according to the gold plating quantity, which can save the process of repeated weighing and improve the weight accuracy and electroplating efficiency of electroplating production.

[0032] Example 2 like Figure 2 As shown, in the second embodiment of the present invention, a gold electroplating system is provided, the system comprising: Data module 1, used for obtaining a gold-plating target task, and obtaining target data of a target to be gold-plated based on the gold-plating target task; Efficiency module 2, used for extracting gold plating weight data from a preset gold plating library based on the target data; The power module 3 is used to determine the gold plating power of the target to be gold plated based on the gold plating weight data; a gold plating module 4, configured to perform gold plating on the target to be gold plated based on the gold plating quantity and store the gold plating quantity of the target to be gold plated into the preset gold plating library; The correction module 5 is used to detect whether the gold plating parameters of the target to be gold plated change during the continuous gold plating process. If the gold plating parameters change, the gold plating power is corrected and the target to be gold plated is gold plated based on the corrected gold plating power.

[0033] The efficiency module 2 includes: The association submodule is used to obtain target data of several historical gold-plated targets and associate the target data of corresponding targets to obtain a preset gold-plated library; An efficiency submodule is configured to extract gold plating feature data from the preset gold plating library according to the product type in the target data, and determine gold plating weight data based on the gold plating feature data: ; ; ; ; ; Where, For products and hangers, the weight of gold plating is required. The gold plating weight required for a single product. is the number of products, is the gold plating efficiency of the standard hanger in the standard solution, is the gold plating efficiency of the standard solution in the standard hanger, The gold plating efficiency of ordinary hangers in ordinary chemical solutions is: The gold plating efficiency of ordinary liquid in ordinary hangers is is the gold-plated weight of the standard hanger in the standard solution, is the gold plating weight of the product in the standard hanger and standard solution, The gold plating weight of the product in ordinary hangers and ordinary liquid medicine, It is the gold plating weight of ordinary hangers in ordinary liquid medicine.

[0034] The power module 3 includes: The first calculation submodule is used to calculate the gold plating coefficient based on the gold plating weight data : ; Where, Gilding electricity for history, The combined weight of gold plating is required for the product and the hanger; The second calculation submodule is used to calculate the gold plating coefficient based on the power Determine the gold plating quantity of the target to be gold plated : ; Where, The target gold plating amount.

[0035] The gold-plated module 5 is specifically used for: The target to be gold-plated is gold-plated by a gold-plating device, and the real-time cumulative gold-plating power of the gold-plating device is continuously detected during the gold-plating process. If the real-time cumulative gold-plating power does not reach the gold-plating power, the gold-plating process is continued; if the real-time cumulative gold-plating power has reached the gold-plating power, the gold-plating process is completed.

[0036] The correction module 5 is specifically used for: During the continuous gold plating process, it is detected whether the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have changed. If the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have changed, the electrical quantity gold plating coefficient of the corresponding target to be gold-plated is corrected, and the corrected gold plating quantity is determined based on the corrected electrical quantity gold plating coefficient. The target to be gold-plated is gold-plated based on the corrected gold plating quantity. If the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have not changed, the gold plating quantity pre-stored in the preset gold plating library is used to plate the target to be gold-plated.

[0037] In other embodiments of the present invention, the embodiments of the present invention provide the following technical solutions: a computer, comprising a memory 102, a processor 101, and a computer program stored in the memory 102 and executable on the processor 101; the processor 101 implements the above-described electroplating gold plating method when executing the computer program.

[0038] Specifically, the processor 101 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured as one or more integrated circuits for implementing the embodiments of the present invention.

[0039] Memory 102 may include a large-capacity memory for data or instructions. By way of example, and not limitation, memory 102 may include a hard disk drive (HDD), a floppy disk drive, a solid-state drive (SSD), flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a Universal Serial Bus (USB) drive, or a combination of two or more of these. Where appropriate, memory 102 may include removable or non-removable (or fixed) media. Where appropriate, memory 102 may be internal or external to the data processing device. In certain embodiments, memory 102 is non-volatile memory. In certain embodiments, memory 102 includes read-only memory (ROM) and random access memory (RAM). Where appropriate, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically alterable ROM (EAROM) or a flash memory (FLASH), or a combination of two or more of these. Under appropriate circumstances, the RAM can be a static random access memory (SRAM) or a dynamic random access memory (DRAM), where the DRAM can be a fast page mode dynamic random access memory (FPMDRAM), an extended data output dynamic random access memory (EDODRAM), a synchronous dynamic random access memory (SDRAM), etc.

[0040] The memory 102 may be used to store or cache various data files that need to be processed and / or used for communication, as well as possible computer program instructions executed by the processor 101 .

[0041] The processor 101 reads and executes the computer program instructions stored in the memory 102 to implement the above-mentioned electroplating gold plating method.

[0042] In some embodiments, the computer may further include a communication interface 103 and a bus 100. Figure 3 As shown, the processor 101 , the memory 102 , and the communication interface 103 are connected via a bus 100 and communicate with each other.

[0043] The communication interface 103 is used to implement communication between the various modules, devices, units, and / or equipment in the embodiments of the present invention. The communication interface 103 can also implement data communication with other components such as external devices, image / data acquisition equipment, databases, external storage, and image / data processing workstations.

[0044] Bus 100 includes hardware, software, or both, and couples components of a computer device to each other. Bus 100 includes, but is not limited to, at least one of the following: a data bus, an address bus, a control bus, an expansion bus, and a local bus. By way of example and not limitation, bus 100 may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local Bus (VLB) bus, or other suitable buses, or a combination of two or more of these. Bus 100 may include one or more buses, where appropriate. Although embodiments of the present invention describe and illustrate a particular bus, the present invention contemplates any suitable bus or interconnect.

[0045] The computer can execute the electroplating gold plating method of the present invention based on the acquired electroplating gold plating system, thereby realizing electroplating gold plating.

[0046] In some further embodiments of the present invention, in combination with the above-mentioned electroplating gold plating method, the embodiments of the present invention provide the following technical solutions: a storage medium having a computer program stored thereon, and the computer program implements the above-mentioned electroplating gold plating method when executed by a processor.

[0047] Those skilled in the art will appreciate that the logic and / or steps represented in the flowcharts or otherwise described herein, for example, can be considered as a sequenced list of executable instructions for implementing logical functions, and can be embodied in any computer-readable medium for use by an instruction execution system, apparatus, or device (e.g., a computer-based system, a system including a processor, or other system that can fetch and execute instructions from an instruction execution system, apparatus, or device), or in conjunction with such instruction execution system, apparatus, or device. For purposes of this specification, "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by an instruction execution system, apparatus, or device, or in conjunction with such instruction execution system, apparatus, or device.

[0048] More specific examples (a non-exhaustive list) of computer-readable media include the following: an electrical connection with one or more wires (electronic devices), a portable computer disk cartridge (magnetic devices), a random access memory (RAM), a read-only memory (ROM), an erasable and programmable read-only memory (EPROM or flash memory), a fiber optic device, and a portable compact disc read-only memory (CDROM). In addition, the computer-readable medium may even be paper or other suitable medium on which the program is printed, since the program may be obtained electronically, for example, by optically scanning the paper or other medium, followed by editing, deciphering, or processing in another suitable manner as necessary, and then stored in a computer memory.

[0049] It should be understood that various components of the present invention may be implemented using hardware, software, firmware, or a combination thereof. In the aforementioned embodiments, multiple steps or methods may be implemented using software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented using hardware, as in another embodiment, any one or a combination of the following technologies known in the art may be used: a discrete logic circuit having logic gate circuits for implementing logic functions on data signals, an application-specific integrated circuit having suitable combinational logic gate circuits, a programmable gate array (PGA), a field-programmable gate array (FPGA), etc.

[0050] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above-described embodiments merely represent several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person of ordinary skill in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, and these variations and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A gold electroplating method, characterized in that: include: Acquire a gold-plating target task, and acquire target data of a target to be gold-plated based on the gold-plating target task; Extracting gold plating weight data from a preset gold plating library based on the target data; Determining the gold plating quantity of the target to be gold plated based on the gold plating weight data; Gold-plating the target to be gold-plated based on the gold-plating quantity and storing the gold-plating quantity of the target to be gold-plated into the preset gold-plating library; During the continuous gold plating process, it is detected whether the gold plating parameters of the target to be gold plated change. If the gold plating parameters change, the gold plating power is corrected and the target to be gold plated is gold plated based on the corrected gold plating power. If the gold plating parameters do not change, the gold plating power pre-stored in a preset gold plating library is used to gold plate the target to be gold plated.

2. The gold electroplating method according to claim 1, wherein: The target data includes: product type, quantity to be processed, and product parameters corresponding to the product type.

3. The gold electroplating method according to claim 1, wherein: The step of extracting the gold plating weight data from the preset gold plating library based on the target data includes: Obtain target data of several historical gold-plated targets, and associate the target data of corresponding targets to obtain a preset gold-plated library; Extract gold plating feature data from the preset gold plating library according to the product type in the target data, and determine gold plating weight data based on the gold plating feature data: ； ； ； ； ； Where, For products and hangers, the weight of gold plating is required. The gold plating weight required for a single product. is the number of products, is the gold plating efficiency of the standard hanger in the standard solution, is the gold plating efficiency of the standard solution in the standard hanger, The gold plating efficiency of ordinary hangers in ordinary chemical solutions is: The gold plating efficiency of ordinary liquid in ordinary hangers is is the gold-plated weight of the standard hanger in the standard solution, is the gold plating weight of the product in the standard hanger and standard solution, The gold plating weight of the product in ordinary hangers and ordinary liquid medicine, It is the gold plating weight of ordinary hangers in ordinary liquid medicine.

4. The gold electroplating method according to claim 1, wherein: The step of determining the gold plating quantity of the target to be gold plated based on the gold plating weight data comprises: Calculate the gold plating coefficient based on the gold plating weight data : ； Where, Gilding electricity for history, The combined weight of gold plating is required for the product and the hanger; Based on the gold plating coefficient Determine the gold plating quantity of the target to be gold plated : ； Where, The target gold plating amount.

5. The gold electroplating method according to claim 1, wherein: The step of gold-plating the target to be gold-plated based on the gold-plating quantity includes: The target to be gold-plated is gold-plated by a gold-plating device, and the real-time cumulative gold-plating power of the gold-plating device is continuously detected during the gold-plating process. If the real-time cumulative gold-plating power does not reach the gold-plating power, the gold-plating process is continued; if the real-time cumulative gold-plating power has reached the gold-plating power, the gold-plating process is completed.

6. The gold electroplating method according to claim 1, wherein: The step of detecting whether the gold plating parameters of the target to be gold-plated change during the continuous gold plating process, correcting the gold plating power and gold plating the target to be gold-plated based on the corrected gold plating power if the gold plating parameters change, and gold plating the target to be gold-plated using the gold plating power pre-stored in a preset gold plating library if the gold plating parameters do not change comprises: During the continuous gold plating process, it is detected whether the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have changed. If the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have changed, the hanger gold plating coefficient and the chemical liquid gold plating coefficient of the corresponding target to be gold-plated are corrected, and the corrected gold plating quantity is determined based on the corrected hanger gold plating coefficient and the chemical liquid gold plating coefficient. The target to be gold-plated is gold-plated based on the corrected gold plating quantity. If the target type, gold plating liquid characteristics and hanger characteristics of the target to be gold-plated have not changed, the gold plating quantity pre-stored in the preset gold plating library is used to plate the target to be gold-plated.

7. An electroplating gold plating system, characterized in that, The system comprises: A data module is used to obtain a gold-plating target task, and obtain target data of a target to be gold-plated based on the gold-plating target task; An efficiency module, configured to extract gold plating weight data from a preset gold plating library based on the target data; A power module, configured to determine the gold plating power of the target to be gold plated based on the gold plating weight data; a gold plating module, configured to perform gold plating on the target to be gold plated based on the gold plating quantity and store the gold plating quantity of the target to be gold plated into the preset gold plating library; The correction module is used to detect whether the gold plating parameters of the target to be gold-plated change during the continuous gold plating process. If the gold plating parameters change, the gold plating power is corrected and the target to be gold-plated is gold-plated based on the corrected gold plating power.

8. The gold electroplating system according to claim 7, characterized in that: The power module includes: The first calculation submodule is used to calculate the gold plating coefficient based on the gold plating weight data : ； Where, Gold-plated electricity for history, It is the actual gold plating weight of a single product. is the number of products; The second calculation submodule is used to calculate the gold plating coefficient based on the power Determine the gold plating quantity of the target to be gold plated : ； Where, The weight of gold plating required for a single product.

9. A computer comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the electroplating gold plating method according to any one of claims 1 to 6 is implemented.

10. A storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by the processor, the gold electroplating method according to any one of claims 1 to 6 is implemented.

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