Slow drainage device and semiconductor substrate processing equipment

Abstract

The invention relates to the technical field of semiconductor wet process equipment, in particular to a slow drainage device and semiconductor substrate processing equipment. The slow liquid discharging device comprises a drying container and a cleaning liquid inlet and outlet pipeline system. The drying container comprises an inner container and an outer container, the outer container is connected to the outer wall of the top of the inner container, and an overflow collecting structure is defined by the outer container and the outer wall of the inner container; the cleaning liquid inlet and outlet pipeline system comprises a liquid inlet pipe, a low-speed discharging flow path, an inner groove liquid discharging pipe and an outer groove liquid discharging pipe, the liquid inlet pipe is connected to the inner container, the low-speed discharging flow path is connected to the inner container and the outer container, the inner groove liquid discharging pipe is connected to the inner container, and the outer groove liquid discharging pipe is connected to the outer container. When the inner container discharges liquid slowly, cleaning liquid in the inner container is discharged upwards into the overflow collecting structure through the slow discharge flow path, the direct influence of gravity on the drainage rate is effectively counteracted, and meanwhile, when the cleaning liquid enters the outer container through the slow discharge flow path, the outer container cannot be filled with the cleaning liquid, so that the siphonage phenomenon is effectively avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wet process equipment, and in particular to a slow liquid discharge device and semiconductor substrate processing equipment. Background Art

[0002] Marangoni dryers are commonly used in wafer cleaning and drying processes. They utilize the Marangoni effect, a flow phenomenon caused by differences in liquid surface tension. When surface tension differs across a liquid, it triggers flow. This effect effectively removes residual moisture or solvent from the wafer surface, achieving a water-mark-free, contamination-free drying process.

[0003] In a typical wafer cleaning and drying process, the wafers are first immersed in a cleaning solution within a drying tank for preliminary cleaning. Subsequently, IPA (isopropyl alcohol) gas is introduced into the drying tank, creating an IPA atmosphere above the water surface. As the water slowly drains, the wafers gradually separate from the water surface. Because the surface tension of IPA is much lower than that of water, a surface tension gradient is generated at the surface of the sloping water flow, leading to Marangoni convection. At this point, moisture is "drawn back" to the water surface, effectively removing moisture from the wafer surface and achieving a drying effect. This ensures that no water marks remain on the wafer surface, meeting high cleanliness requirements.

[0004] However, in existing technology, to control the slow drainage speed of the drying trough, an electromagnetic pump and multiple valves of varying diameters are typically installed on the drain pipe connected to the drying trough. These valves are then manually adjusted to precisely control the drainage speed. However, manual adjustment often lacks the desired precision, making it difficult to precisely control the drainage speed, which in turn affects the stability of the drying effect. Furthermore, this design increases operational complexity and places higher demands on the operator's technical skills. Summary of the Invention

[0005] The object of the present invention is to provide a slow liquid discharge device and a semiconductor substrate processing device to solve the technical problem in the prior art that electromagnetic pumps and multiple valves with different calibers have poor control accuracy through manual adjustment.

[0006] In a first aspect, the present invention provides a slow liquid discharge device for use in semiconductor substrate processing equipment, the slow liquid discharge device comprising: a drying container and a cleaning liquid inlet and outlet piping system connected to the drying container; The drying container includes an inner container and an outer container, wherein the outer container is connected to the top outer wall of the inner container and forms an overflow collection structure with the outer wall of the inner container so that the cleaning liquid overflowing from the inner container flows into the overflow collection structure; The cleaning liquid inlet and outlet pipeline system includes an inlet pipe, a slow discharge flow path, an inner tank drain pipe and an outer tank drain pipe. The inlet pipe is connected to the inner container and is used to inject cleaning liquid into the inner container. The slow discharge flow path is connected to the inner container and the outer container and is used to discharge the cleaning liquid in the inner container to the overflow collection structure. The inner tank drain pipe is connected to the inner container and is used to discharge the cleaning liquid in the inner container. The outer tank drain pipe is connected to the outer container and is used to discharge the cleaning liquid in the overflow collection structure.

[0007] In an optional embodiment, the liquid inlet pipe is disposed in the inner container and is located at the bottom of the inner container; The bottom outer wall of the inner container is provided with a liquid inlet connection port, and the liquid inlet pipe is connected to the liquid inlet connection port; The tube wall of the liquid inlet pipe is provided with a liquid inlet.

[0008] In an optional embodiment, a plurality of liquid inlets are provided.

[0009] In an optional embodiment, the liquid inlet faces the inner area of ​​the inner container.

[0010] In an optional embodiment, a flow guide structure is provided on the outer side of the top opening of at least one side wall of the inner container, and an overflow gap is provided between the flow guide structure and the side wall of the outer container, so that the cleaning liquid overflowing from the inner container flows into the overflow collection structure through the overflow gap; A liquid distribution device is correspondingly provided above the guide structure, and a distribution port is provided on the liquid distribution device. The first solution is applied to the guide structure through the distribution port, and then guided to the liquid surface in the inner container through the guide structure to form a first solution film.

[0011] In an optional embodiment, a gap is provided between the liquid inlet pipe and the bottom of the inner container.

[0012] In an optional embodiment, a flow balancing component is provided in the inner container, and the flow balancing component is located at the bottom of the inner container and above the liquid inlet pipe.

[0013] In an optional embodiment, the slow discharge flow path is connected to a second pump, a first valve and a discharge flow meter, and the second pump and the discharge flow meter are electrically connected to a controller so that the controller controls the flow rate of the second pump based on the signal feedback of the liquid flow rate in the slow discharge flow path from the discharge flow meter.

[0014] In an optional embodiment, one end of the slow discharge flow path is connected to the bottom of the inner container, and the other end is connected to the top outer wall of the outer container; The outer tank drain pipe is connected to the bottom of the outer container.

[0015] In a second aspect, the present invention provides a semiconductor substrate processing device, comprising the slow liquid discharge device described in any one of the aforementioned embodiments.

[0016] Compared with the prior art, the slow liquid discharge device and semiconductor substrate processing equipment provided by the present invention have the following technical advantages: The slow liquid discharge device provided by the present invention is used for semiconductor substrate processing equipment. The slow liquid discharge device includes: a drying container and a cleaning liquid inlet and outlet pipeline system connected to the drying container; the drying container includes an inner container and an outer container, the outer container is connected to the top outer wall of the inner container, and forms an overflow collection structure with the outer wall of the inner container, so that the cleaning liquid overflowing from the inner container flows into the overflow collection structure; the cleaning liquid inlet and outlet pipeline system includes a liquid inlet pipe, a slow discharge flow path, an inner tank drain pipe and an outer tank drain pipe, the liquid inlet pipe is connected to the inner container and is used to inject cleaning liquid into the inner container, the slow discharge flow path is connected to the inner container and the outer container, and is used to discharge the cleaning liquid in the inner container to the overflow collection structure, the inner tank drain pipe is connected to the inner container and is used to discharge the cleaning liquid in the inner container, and the outer tank drain pipe is connected to the outer container and is used to discharge the cleaning liquid in the overflow collection structure.

[0017] When the inner container is slowly drained, the cleaning liquid in the inner container is discharged upward to the overflow collection structure through the slow discharge flow path, effectively offsetting the direct influence of gravity on the drainage rate. At the same time, when the cleaning liquid enters the outer container through the slow discharge flow path, the cleaning liquid will not fill the outer container, effectively avoiding the siphon phenomenon, further avoiding fluctuations in the drainage speed, and ensuring the accuracy and stability of the discharge speed through structural design, avoiding errors caused by manual adjustment, thereby improving the cleaning effect and the stability of the subsequent drying process.

[0018] The semiconductor substrate processing equipment provided by the present invention includes the above-mentioned slow liquid discharge device. Therefore, the technical advantages and effects achieved by it include the technical advantages and effects achieved by the above-mentioned slow liquid discharge device, which will not be elaborated here.

[0019] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1A schematic structural diagram of a semiconductor substrate processing device provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of a drying container provided in an embodiment of the present invention; Figure 3 A cross-sectional view of a drying container from a first perspective provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of an automatic opening and closing mechanism provided in an embodiment of the present invention; Figure 5 A partial exploded view of the automatic opening and closing mechanism from a first perspective provided by an embodiment of the present invention; Figure 6 A partial exploded view of the automatic opening and closing mechanism from a second perspective provided by an embodiment of the present invention; Figure 7 A schematic diagram of the inside of an automatic opening and closing mechanism provided in an embodiment of the present invention; Figure 8 A partial exploded view of the inner side of the automatic opening and closing mechanism provided by an embodiment of the present invention; Figure 9 A schematic diagram of the cylinder structure provided by an embodiment of the present invention; Figure 10 A schematic structural diagram of a lifting mechanism with a carrier provided by an embodiment of the present invention; Figure 11 A schematic structural diagram of a lifting mechanism without a carrier provided by an embodiment of the present invention; Figure 12 A schematic diagram of the upper structure of a carrier bracket provided in an embodiment of the present invention; Figure 13 A schematic diagram of the lower structure of a carrier bracket provided in an embodiment of the present invention; Figure 14 A schematic structural diagram of an exhaust confluence device provided in an embodiment of the present invention; Figure 15 A schematic diagram of a semiconductor substrate processing equipment pipeline provided by an embodiment of the present invention; Figure 16 The embodiment of the present invention provides Figure 15 Enlarged view of point A in the middle; Figure 17 The embodiment of the present invention provides Figure 15 Enlarged view of point B in the middle; Figure 18 A schematic diagram of the lifting mechanism structure provided by an embodiment of the present invention; Figure 19 A schematic structural diagram of a second mounting plate assembly provided in an embodiment of the present invention; Figure 20 The embodiment of the present invention provides Figure 19 Schematic diagram of part of the structure.

[0022] Icons: 1-main body; 11-exhaust confluence device; 111-factory exhaust system connector; 112-exhaust adjustment plate; 113-exhaust port; 114-first exhaust valve; 115-second exhaust valve; 116-third exhaust valve; 117-fourth exhaust valve; 118-exhaust connector; 2-drying container; 21-inner container; 211-flow guide structure; 212-liquid inlet pipe; 213-inner tank drain pipe; 214-flow equalizing component; 215-support structure; 216-liquid inlet connection port; 22-outer container; 221-overflow collection structure; 222-outer tank drain pipe; 23-outer tank cover; 231-lifting perforation; 232-detection sensor; 24-liquid distribution device; 3-automatic opening and closing mechanism; 31- Slot cover; 311-Integrated gas distribution channel; 3111-Gas connector; 312-Gas outlet; 313-Elastic sealing structure; 314-Guide component; 32-Cylinder mounting box; 321-Cylinder; 3211-Throttle valve; 3212-Position sensor; 3213-Buffer; 322-Cylinder connecting plate; 33-Guide rail mounting box; 331-Linear guide rail; 332-Guide rail connecting plate; 34-Slot cover; 35-Water receiving plate; 36-Gas supply pipe; 361-Gas filter; 362-First stage pressure regulating valve; 37-Second gas pipe; 371-Fourth valve; 372-Gas heating device; 373-Flow controller; 374-Temperature sensor; 38-Slot cover connecting plate; 4-Pressure supply Supply system; 41-liquid supply pipe; 411-fifth valve; 412-second valve; 413-first solution flowmeter; 42-first gas pipe; 421-third valve; 43-pressure relief valve; 44-safety valve; 45-liquid infusion pipe; 451-first pump; 452-first solution filter; 5-slow discharge flow path; 51-second pump; 52-first valve; 53-discharge flowmeter; 6-carrier bracket; 61-support plate; 611-support element; 612-positioning member; 613-first hollow hole; 614-positioning groove; 62-support plate; 621-support part; 6211-inclined surface; 622-pillar; 623-second hollow hole; 7-liquid level gauge; 71-air pressure transmission component; 711-secondary regulation Pressure valve; 712-intake flow regulating valve; 72-pressure differential detection assembly; 8-lifting mechanism; 81-electric slide; 811-slider; 812-first mounting plate group; 813-second mounting plate group; 8131-first mounting plate; 8131a-first bending plate; 8132-second mounting plate; 8132a-second bending plate; 8132b-long round hole; 8133-third mounting plate; 8133a-third bending plate; 8133b-first limiting bolt; 8133c-second limiting bolt; 8133d-universal bearing; 814-pulling plate; 815-support frame; 8151-support member; 8151a-support block; 8151b-positioning block; 9-carrier; 91-semiconductor substrate. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0026] In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0027] The present invention will be further described in detail below through specific implementation examples in conjunction with the accompanying drawings.

[0028] Specific structure such as Figures 1 to 20 shown.

[0029] This embodiment provides a semiconductor substrate cleaning and drying assembly for use in semiconductor substrate processing equipment. The semiconductor substrate processing equipment includes a main body 1. The semiconductor substrate cleaning and drying assembly includes: a drying container 2 connected to the main body 1 and a liquid dispensing device 24 for applying a first solution. The drying container 2 includes an inner container 21 and an outer container 22. The outer container 22 is connected to the top outer wall of the inner container 21 and, together with the outer wall of the inner container 21, forms an overflow collection structure 221. A pair of opposing side walls of the inner container 21 are each provided with a guide structure 211 disposed outside the top opening. An overflow gap is defined between the guide structure 211 and the side wall of the outer container 22 to allow cleaning liquid overflowing from the inner container 21 to flow through the overflow gap into the overflow collection structure 221. A liquid dispensing device 24 is disposed above each of the pair of guide structures 211. The liquid dispensing device 24 has a dispensing port. The first solution is applied to the guide structure 211 through the dispensing port and then directed by the guide structure 211 to the liquid surface within the inner container 21 to form a thin film of the first solution.

[0030] In this embodiment, a liquid first solution is used to directly form a first solution film on the liquid surface in the inner container 21 through the guide structure 211, thereby overcoming the problems of uneven diffusion of the gaseous first solution and condensation to form droplets, and the consistency of the film thickness is much higher than that of the gaseous first solution, effectively reducing the presence of water marks on the semiconductor substrate 91. Since the liquid first solution directly forms a film, there is no need for a phase change process, and the response speed is faster. At the same time, it supports a drying mode in which the semiconductor substrate 91 and the carrier are not distinguished, thereby avoiding damage to the semiconductor substrate 91 during transportation, and is compatible with semiconductor substrates 91 of various materials, specifications, and thicknesses.

[0031] In this embodiment, the guide structure 211 can be an inclined guide plate, an inclined guide groove, or other structures that meet the diversion function. The first solution can be an IPA solution, or other solutions with a surface tension lower than that of water. The liquid distribution device 24 can be a tube, a trough, etc., as long as it can meet the distribution requirements. The guide structure 211 is provided on the outside of the top opening of at least one side wall of the inner container 21, that is, the guide structure 211 can be provided on the outside of the top opening of one side wall, or the guide structures 211 can be provided on the outside of the top openings of multiple side walls.

[0032] The optional technical solution of this embodiment further includes a liquid storage device for storing the first solution and a liquid supply device for delivering the first solution in the liquid storage device to the liquid dispensing device. The liquid storage device can be a liquid storage tank, a liquid storage bottle, or a liquid storage box, as long as it meets the liquid storage requirements.

[0033] In the optional technical solution of this embodiment, the liquid storage device includes a pressure supply system 4 for storing the first solution, and the liquid supply device includes a liquid supply pipe 41. The pressure supply system 4 is arranged outside the drying container 2 and is connected to the liquid distribution device 24 through the liquid supply pipe 41. The liquid supply pipe 41 is provided with a fifth valve 411, a second valve 412, and a first solution flow meter 413. The first solution flow meter 413 is used to monitor the flow rate of the first solution during application; the fifth valve 411 is used to regulate the flow rate of the first solution; and the second valve 412 is a pneumatic valve for controlling the application of the first solution. It has a simple structure and, compared with the existing bubbling method and steam method, the problems of open system explosion risk and high first solution consumption can be effectively solved by storing the first solution through the pressure supply system 4. This not only avoids volatilization, reduces the consumption of the first solution, and saves costs, but also improves the safety factor.

[0034] In an optional technical solution of this embodiment, the pressure supply system 4 is connected to a first gas pipe 42 for filling the pressure supply system 4 with gas. The gas maintains a predetermined pressure within the pressure supply system 4 to transport the first solution to the liquid dispensing device 24. A third valve 421 is provided on the first gas pipe 42. The third valve 421 is a valve that provides gas pressurization to the pressure supply system 4 and is normally open, ensuring that the set pressure is maintained within the pressure supply system 4. When the second valve 412 is opened, the first solution in the pressure supply system 4, driven by gas pressure, enters the liquid dispensing device 24 through the liquid supply pipe 41 and is sprayed from the dispensing port to the guide structure 211. The first solution flows evenly along the guide plate to the upper layer of the liquid surface, forming a thin film of the first solution. Due to the gas pressurization, contamination of the gas environment within the drying container 2 is avoided.

[0035] In an optional technical solution of this embodiment, pressure supply system 4 is equipped with a pressure relief valve 43 and a safety valve 44. When the pressure within pressure supply system 4 unexpectedly exceeds the safety set point, the internal pressure will push open safety valve 44, automatically releasing the pressure. The closed pressure supply system 4 design and the dynamic pressure relief of safety valve 44 (response time ≤ 0.1s) prevent leakage of the first solution.

[0036] In an optional technical solution of this embodiment, the pressure supply system 4 is connected to a refill tube 45 for replenishing the first solution into the pressure supply system 4 to raise the liquid level within the pressure supply system 4 above a predetermined level L. A first pump 451 and a first solution filter 452 are sequentially provided along the flow direction of the first solution within the refill tube 45. Before replenishing the pressure supply system 4, the third valve 421 must be closed and the pressure relief valve 43 opened to relieve pressure. The first solution is then pumped from the liquid supply bottle by the first pump 451, filtered through the first solution filter 452, and then enters the pressure supply system 4, raising the liquid level within the pressure supply system 4 above the predetermined level L, thereby meeting operational requirements.

[0037] In an alternative technical solution to this embodiment, multiple distribution openings are provided along the axial direction of the liquid distribution device 24. This ensures effective and uniform application. Alternatively, a single distribution opening is provided along the axial direction of the liquid distribution device 24. In this case, the distribution opening is elongated, achieving the same aforementioned effects.

[0038] In an optional technical solution of this embodiment, the dispensing port faces the outside of the top opening of the inner container 21. This effectively ensures that the first solution is applied to the guide structure 211 and then flows evenly along the guide structure 211 to form a first solution film on the liquid surface in the inner container 21.

[0039] In an optional technical solution of this embodiment, the flow guiding structure 211 is located above the top opening of the inner container 21. This effectively ensures the flow guiding effect of the flow guiding structure 211 and prevents the unevenness of the first solution caused by excessive flow rate.

[0040] This embodiment is not limited to the method of gas pressurization to supply liquid to the liquid storage device, but the liquid storage device can also supply liquid to the liquid distribution device through natural gravity, and the liquid in the liquid storage device can also be supplied to the liquid distribution device by setting a pump on the liquid supply pipe.

[0041] In the optional technical solution of this embodiment, the semiconductor substrate cleaning and drying assembly also includes a cleaning liquid inlet and outlet pipeline system connected to the drying container 2; the cleaning liquid inlet and outlet pipeline system includes a liquid inlet pipe 212, a slow discharge flow path 5, an inner tank drain pipe 213 and an outer tank drain pipe 222, the liquid inlet pipe 212 is connected to the inner container 21, and is used to inject cleaning liquid into the inner container 21, the slow discharge flow path 5 is connected to the inner container 21 and the outer container 22, and is used to discharge the cleaning liquid in the inner container 21 to the overflow collection structure 221, the inner tank drain pipe 213 is connected to the inner container 21, and is used to discharge the cleaning liquid in the inner container 21, and the outer tank drain pipe 222 is connected to the outer container 22, and is used to discharge the cleaning liquid in the overflow collection structure 221. In this embodiment, when the inner container 21 is slowly drained, the cleaning liquid in the inner container 21 is discharged upward to the overflow collection structure 221 through the slow discharge flow path 5, effectively offsetting the direct influence of gravity on the drainage rate. At the same time, when the cleaning liquid enters the outer container 22 through the slow discharge flow path 5, since the cleaning liquid will not fill the outer container 22, the siphon phenomenon is effectively avoided, and the fluctuation of the drainage speed is further avoided. The structural design ensures the accuracy and stability of the discharge speed, avoids the errors caused by manual adjustment, and thus improves the cleaning effect and the stability of the subsequent drying process.

[0042] In an optional technical solution of this embodiment, a liquid inlet pipe 212 is disposed within the inner container 21 and is located at the bottom of the inner container 21. A liquid inlet connection port 216 is provided on the bottom outer wall of the inner container 21, and the liquid inlet pipe 212 is connected to the liquid inlet connection port 216. The wall of the liquid inlet pipe 212 is provided with a liquid inlet. Liquid is introduced upward from the bottom of the inner container 21, thereby avoiding splashing and ensuring an overflow effect.

[0043] In an alternative technical solution of this embodiment, multiple liquid inlets are provided in a row along the axial direction of the liquid inlet tube 212 to ensure liquid inlet efficiency and uniformity. Alternatively, a single liquid inlet is provided along the axial direction of the liquid inlet tube 212, in which case the liquid inlet is elongated, achieving the same aforementioned effects.

[0044] In an optional technical solution of this embodiment, two rows of liquid inlets are provided along the circumference of the liquid inlet pipe 212 to improve liquid inlet efficiency.

[0045] In an optional technical solution of this embodiment, the two rows of liquid inlets face opposite sides of the bottom of the inner container 21 to avoid affecting the liquid inlet effect by facing the bottom of the inner container 21.

[0046] In an optional technical solution of this embodiment, a gap is provided between the liquid inlet pipe 212 and the bottom of the inner container 21 to further ensure the liquid inlet effect.

[0047] In an optional technical solution of this embodiment, a plurality of liquid inlet pipes 212 are provided. Preferably, two liquid inlet pipes 212 are provided and are located on both sides of the inner container 21 respectively.

[0048] In an optional technical solution of this embodiment, a flow balancing member 214 is provided within inner container 21. Flow balancing member 214 is located at the bottom of inner container 21 and above liquid inlet pipe 212. Flow balancing member 214 is provided with multiple flow-disturbing holes. This serves to disrupt the flow of liquid, ensuring the stability of the liquid surface and preventing debris from falling from above from clogging and damaging the pipe. A support structure 215 is provided at the bottom of inner container 21, and flow balancing member 214 is mounted on this support structure to ensure its stability.

[0049] In the optional technical solution of this embodiment, the slow discharge flow path 5 is connected to a second pump 51, a first valve 52 and a drainage flow meter 53. The second pump 51 and the drainage flow meter 53 are both electrically connected to a controller so that the controller controls the flow rate of the second pump 51 according to the signal feedback of the drainage flow meter 53 on the liquid flow rate in the slow discharge flow path 5. In this embodiment, the controller is connected to the main body 1. During the slow drainage process, the inner tank drainage pipe 213 is closed, and the cleaning liquid in the inner container 21 begins to be discharged through the slow discharge flow path 5. The first valve 52 is opened, and the drainage flow meter 53 monitors the flow rate of the cleaning liquid in the slow discharge flow path 5 in real time and feeds the data back to the controller. The controller automatically adjusts the flow rate of the second pump 51 according to the feedback information to achieve precise control of the cleaning liquid discharge rate. Compared with the prior art that requires manual adjustment of multiple valves to control the drainage speed, the present application adopts an automated control method, which can improve the convenience of operation and ensure the accuracy and stability of the discharge speed, avoid the errors caused by manual adjustment, and thus improve the cleaning effect and the stability of the subsequent drying process.

[0050] This embodiment is not limited to the second pump 51 and the discharge flow meter 53 cooperating to realize closed-loop flow control, and the regulating valve and the discharge flow meter 53 can also cooperate to realize closed-loop flow control.

[0051] It should be noted that slow drainage refers to the process of slowly lowering the liquid level in the inner container 21 by precisely controlling the drainage speed. This control method can maintain an appropriate contact time between the liquid level and the surface of the semiconductor substrate 91, thereby avoiding excessively fast water flow affecting the cleaning effect.

[0052] In an optional technical solution of this embodiment, one end of the slow discharge flow path 5 is connected to the bottom of the inner container 21, and the other end is connected to the top outer wall of the outer container 22; the outer tank drain pipe 222 is connected to the bottom of the outer container 22. This is convenient to connect and has a good drainage effect.

[0053] In an optional technical solution of this embodiment, the semiconductor substrate cleaning and drying assembly further includes: an automatic opening and closing mechanism 3 disposed at the top opening of the drying container 2, and the automatic opening and closing mechanism 3 is connected to the main body 1; the automatic opening and closing mechanism 3 includes a pair of drive assemblies and a pair of slot cover plates 31 respectively connected to the pair of drive assemblies, the pair of drive assemblies driving the pair of slot cover plates 31 to dock to close the top opening or separate to open the top opening; an integrated gas distribution channel 311 is provided on the upper side of the slot cover plates 31, and a gas outlet 312 is provided on the lower side of the slot cover plates 31, and the gas outlet 312 passes through the slot cover plates 31 and is connected to the integrated gas distribution channel 311. The automatic opening and closing mechanism 3 closes and opens the top opening by driving the pair of slot cover plates 31 respectively by the pair of drive assemblies, resulting in a simple structure and easy opening and closing.

[0054] In an optional technical solution of this embodiment, the drive assembly includes a cylinder 321 and a linear guide 331; both cylinder 321 and linear guide 331 are connected to the slot cover 31, with the cylinder 321 driving the slot cover 31 and the linear guide 331 guiding the movement of the slot cover 31. This provides a simple structure and stable drive. However, this is not limiting. The cylinder 321 can also be replaced with a linear motor, electric cylinder, slide, etc., or the drive assembly can simply include the cylinder 321, or a linear motor, electric cylinder, slide, etc.

[0055] Specifically, the automatic opening and closing mechanism 3 also includes a slot cover plate 34, a water receiving plate 35, and a relatively arranged cylinder mounting box 32 and a guide rail mounting box 33; the cylinder 321 is arranged in the cylinder mounting box 32, and the slider 811 of the cylinder 321 is connected to the cylinder connecting plate 322, the linear guide rail 331 is arranged in the guide rail mounting box 33, and the slider 811 of the linear guide rail 331 is connected to the guide rail connecting plate 332; a slot cover connecting plate 38 is connected between the cylinder connecting plate 322 and the guide rail connecting plate 332, and the slot cover plate 31 is connected to the lower side of the slot cover connecting plate 38; the slot cover plate 34 is covered on the integrated gas distribution channel 311, and one end is connected to the docking end of the slot cover plate 31, and the other end is connected to the upper side of the slot cover connecting plate 38; the two ends of the water receiving plate 35 are respectively connected to the cylinder mounting box 32 and the guide rail mounting box 33. The water receiving plate 35 is used to prevent liquid from dripping onto the equipment when the main equipment manipulator passes over it, causing corrosion and rust. In this embodiment, one cylinder mounting box 32 is provided, and a pair of guide rail mounting boxes 33 are provided. A bracket is installed on the guide rail mounting box 33, and the bracket is connected to the main body 1.

[0056] The cylinder 321 of this embodiment is a rodless cylinder 321, and its core function is to drive the opening and closing of the slot cover 31; a throttle valve 3211 is provided on the cylinder 321, and the exhaust speed of the cylinder 321 is controlled by adjusting the air flow rate of the exhaust port 113 of the cylinder 321, thereby accurately controlling the movement speed of the cylinder 321 to perform the opening or closing action. Each cylinder 321 is equipped with two throttle valves 3211, which independently control the opening speed and the closing speed, and the operating speeds of the two cylinders 321 must be kept synchronized by adjusting their respective throttle valves 3211; a position sensor 3212 is also provided on the cylinder 321 for detecting The position of the piston of the cylinder 321 is measured to provide feedback signals of the end points of the stroke when it is fully opened and fully closed. A buffer 3213 is also provided on the cylinder 321 and installed in the threaded holes at both ends of the cylinder 321. Its adjusting screw presses against the slider 811 inside the cylinder 321 to provide a buffering and shock-absorbing effect to absorb the impact and reduce noise when the switch movement of the cylinder 321 approaches the end point. At the same time, the extension and contraction amount of its screw can be adjusted by rotating the buffer 3213, thereby achieving fine-tuning of the effective stroke of the cylinder 321 (screwing in shortens the stroke, and screwing out extends the stroke). The adjusted end position of the screw of the buffer 3213 also serves as a precise mechanical hard limit.

[0057] In an optional technical solution of this embodiment, an elastic sealing structure 313 is provided at the butt end of the slot cover 31 to ensure airtightness when the slot cover 31 is closed. The elastic sealing structure 313 can be a sealing gasket or other structure that can achieve sealing through elasticity.

[0058] In an optional technical solution of this embodiment, a guide member 314 is provided on the underside of the slot cover 31 to guide the movement of the slot cover 31. The guide member 314 cooperates with the top opening to ensure the stability of the movement of the slot cover 31. The guide member 314 can be a guide block, a guide groove, or other component capable of achieving a guiding function.

[0059] In an optional technical solution of this embodiment, a gas connector 3111 is connected to the integrated gas distribution channel 311; the interior of the integrated gas distribution channel 311 is hollow, and the gas outlet 312 and the gas connector 3111 are both connected to the hollow interior of the integrated gas distribution channel 311. Gas is supplied to the integrated gas distribution channel 311 through the gas connector 3111 and then ejected through the gas outlet 312, that is, the integrated gas distribution channel 311 forms a communicating vessel, on which multiple gas outlets 312 can be installed. Preferably, multiple integrated gas distribution channels 311 are provided on each slot cover plate 31, and each integrated gas distribution channel 311 is provided with multiple nozzle mounting portions. The gas outlet 312 can be selectively connected to the nozzle mounting portion according to needs, and the gas outlet 312 can be selected with different calibers. Specifically, the position and caliber of the gas outlet 312 can be adjusted according to the shape and position of the carrier 9 to control the focus of hot gas drying. For locations where liquid residue is likely to remain or where the carrier 9 is far away from the automatic opening and closing mechanism 3, a gas outlet 312 with a larger caliber is used and installed in the corresponding position to ensure drying efficiency.

[0060] The optional technical solution of this embodiment also includes a gas supply pipe 36 for providing gas. A second gas pipe 37 is connected between the gas supply pipe 36 and the slot cover plate 31, and the gas outlet 312 is connected to the second gas pipe 37. The gas supply pipe 36 is provided with a gas filter 361 and a first-stage pressure regulating valve 362. The gas filter 361 purifies the gas required for the entire machine. The first-stage pressure regulating valve 362 is used to set the main intake pressure in the gas supply pipe 36. The second gas pipe 37 is provided with a fourth valve 371 and a gas heating device 372 for controlling the on / off of the blowing gas. The gas heating device 372 heats the gas in the second gas pipe 37, and the heated gas is ejected into the drying container 2 through the gas outlet 312, thereby heating and drying the semiconductor substrate 91. The heated gas can quickly remove trace moisture remaining on the surface of the semiconductor substrate 91 and effectively reduce moisture retention in the inner container 21, ensuring a thorough and water-free drying process.

[0061] In an optional technical solution of this embodiment, the second gas pipe 37 is further equipped with a flow controller 373 for monitoring and regulating gas flow, and a temperature sensor 374 for monitoring the gas temperature at the outlet of the gas heating device 372. The gas heating device 372, flow controller 373, and temperature sensor 374 are all electrically connected to a controller, enabling the controller to lock the activation of the gas heating device 372 based on feedback from the flow controller 373 and to control the power of the gas heating device 372 based on feedback from the temperature sensor 374. The flow controller 373 precisely regulates the gas flow rate. The temperature sensor 374 monitors the temperature at the outlet of the gas heating device 372 in real time and feeds this data back to the controller. The controller automatically adjusts the heating power based on this temperature feedback, forming a feedback control mechanism for precise temperature control. When the flow controller 373 detects that the gas flow rate is below a set value, the system locks the activation of the gas heating device 372 to prevent dry burning. The gas heating device 372 also has a built-in over-temperature protection device. When the internal temperature exceeds a safety threshold, a contactor automatically cuts off the power supply, achieving a safety interlock. The over-temperature protection device utilizes existing technology and will not be further described here.

[0062] In this embodiment, the coordinated design of the modular automatic opening and closing mechanism 3 and the integrated gas distribution channel 311 achieves the following comprehensive advantages: First, the opening and closing action of the slot cover 311 is highly integrated with the gas delivery function, reducing reliance on external piping. Second, the coordination between the elastic sealing structure 313 and the motion guide component 314 ensures long-term sealing reliability under high-frequency opening and closing. Third, the flow controller 373, gas heating device 372, and temperature sensor 374 form a temperature-controlled gas supply system that is configured to dynamically adjust gas temperature and flow according to preset process parameters. The decoupling of the temperature-controlled gas supply system from the cover structure facilitates adaptation to different process gas requirements.

[0063] In this embodiment, the slow discharge flow path can be a pipeline, but it can also be a flow path with other structures as long as it meets the requirements. The flow controller 373 can be a device capable of controlling the flow rate, such as a pump or valve. The gas heating device 372 can be a device capable of heating the gas, such as a heater or heat exchanger.

[0064] In the optional technical solution of this embodiment, the semiconductor substrate cleaning and drying assembly also includes: a lifting mechanism 8 for lifting the carrier 9 into the drying container 2, and the lifting mechanism 8 is connected to the main body 1; an outer groove cover 23 is provided on the drying container 2, and the outer groove cover 23 is provided with a top opening and a lifting through-hole 231, the automatic opening and closing mechanism 3 is provided at the top opening, and the lifting mechanism 8 is passed through the lifting through-hole 231; a detection sensor 232 is provided on the inner side of the outer groove cover 23, and the detection sensor 232 is located on the movement path of the carrier 9, and the lifting mechanism 8, the automatic opening and closing mechanism 3 and the detection sensor 232 are all electrically connected to the controller, so that the controller controls the working state of the automatic opening and closing mechanism 3 and the lifting mechanism 8 according to the opening and closing state of the automatic opening and closing mechanism 3 and the signal feedback of the detection sensor 232. When the automatic opening and closing mechanism 3 is in the closed state and the lifting mechanism 8 is ascending, if the detection sensor 232 is blocked by the carrier 9 and detects the presence of material, the lifting mechanism 8 will automatically stop. At this point, the automatic opening and closing mechanism 3 must be manually opened before the lifting mechanism 8 can resume its ascent. This design, through a mandatory manual confirmation mechanism, prevents collisions between the carrier 9 and the automatic opening and closing mechanism 3, which could cause debris and equipment damage. When the automatic opening and closing mechanism 3 is in the open state, if the carrier 9 has not moved out of the detection range of the detection sensor 232 (i.e., the detection sensor 232 continuously detects the presence of material), the controller will prohibit the automatic opening and closing mechanism 3 from closing. Only when the lifting mechanism 8 descends out of the detection range of the detection sensor 232 or the carrier 9 is removed will the lock be released and the automatic opening and closing mechanism 3 closed. This design, verified by physical space, avoids the risk of the automatic opening and closing mechanism 3 pinching the carrier 9 when closing, causing debris. The outer container 22 is provided with an outer tank cover 23.

[0065] In this embodiment, an upper limit sensor and a lower limit sensor may be further provided in the drying container 2. The upper limit sensor cooperates with the lifting mechanism 8 to limit the lifting mechanism 8 to only be lifted to a preset upper limit position, and the lower limit sensor cooperates with the lifting mechanism 8 to limit the lifting mechanism 8 to only be lowered to a preset lower limit position.

[0066] An optional technical solution of this embodiment also includes an alarm device electrically connected to the controller. A high-precision infrared detection sensor 232 is installed at the top of the drying container 2 to monitor the position of the carrier 9 in real time. If the carrier 9 does not move out of the range of the detection sensor 232, the controller automatically locks the automatic opening and closing mechanism 3 and triggers the alarm device. If the lifting mechanism 8 does not reach a safe position, the rotation mechanism of the semiconductor substrate cleaning and drying assembly and the automatic opening and closing mechanism 3 are both disabled to prevent mechanical collisions. The alarm device is an audible and visual alarm, providing a clear warning effect.

[0067] In an optional technical solution of this embodiment, the lifting mechanism 8 includes an electric slide 81 connected to the main body 1, a first mounting plate group 812 connected to the slider 811 of the electric slide 81, a second mounting plate group 813 connected to the end of the first mounting plate group 812 away from the slider 811, a pull plate 814 connected to the end of the second mounting plate group 813 away from the first mounting plate group 812, and a support frame 815 connected to the pull plate 814 away from the second mounting plate group 813. The pull plate 814 is inserted through the lifting hole 231. The lifting mechanism 8 utilizes the existing electric slide 81 and slider 811. The electric slide 81 drives the slider 811 to move, achieving synchronous lifting and lowering of the support frame 815. When the electric slide 81 drives the slider 811 up and down, the slider 811 transmits its motion step by step through the first mounting plate group 812, the second mounting plate group 813, and the pull plate 814, causing the support frame 815 to rise and fall smoothly. Two opposite inner side walls of the support frame 815 are respectively connected with support members 8151 . The support members 8151 include a support block 8151 a connected to the support frame 815 via fasteners and a positioning block 8151 b connected to the support block 8151 a .

[0068] The second mounting plate group 813 includes a first mounting plate 8131 connected to the first mounting plate group 812, a second mounting plate 8132 connected to the end of the first mounting plate 8131 away from the first mounting plate group 812, and a third mounting plate 8133 connected to the end of the second mounting plate 8132 away from the first mounting plate 8131, and the pulling plate 814 is connected to the third mounting plate 8133; both sides of the first mounting plate 8131 are bent to form a first bent plate 8131a, both sides of the second mounting plate 8132 are bent to form a second bent plate 8132a, and both sides of the third mounting plate 8133 are bent to form a third bent plate 8133a; the second bent plate 8132a is against the outer side of the first bent plate 8131a, the first bent plate 8131a is provided with a plurality of threaded holes, and the second bent plate 8132a is provided with a plurality of oblong holes 8132b matching the threaded holes. The second mounting plate 8132 is bent on both sides to form second bent plates 8132a, which are in close contact with the outer sides of the first bent plates 8131a of the first mounting plate 8131. The threaded holes in the first bent plates 8131a mate with the oblong holes 8132b in the second bent plates 8132a, allowing the second mounting plate 8132 to be adjusted along the length of the oblong holes 8132b (which also extends along the length of the second mounting plate 8132). The third mounting plate 8133 is connected to the second mounting plate 8132 via multiple fasteners. Multiple first limiting bolts 8133b are threadedly connected to the third mounting plate 8133, one end of which abuts against the second mounting plate 8132, to adjust the spacing between the third mounting plate 8133 and the second mounting plate 8132. Multiple second limiting bolts 8133c are threadedly connected to the third bent plate 8133a, one end of which abuts against the outer wall of the second bent plate 8132a, to adjust the spacing between the third bent plate 8133a and the second bent plate 8132a. The third mounting plate 8133 is connected to the second mounting plate 8132 via multiple fasteners, and the spacing between the third mounting plate 8133 and the second mounting plate 8132 is adjusted by multiple first limiting bolts 8133b. One end of the first limiting bolt 8133b rests on the second mounting plate 8132. After rotation and adjustment, the relative position of the third mounting plate 8133 and the second mounting plate 8132 can be changed. Finally, the third mounting plate 8133 and the second mounting plate 8132 are connected by multiple fasteners.

[0069] At the same time, the third bent plate 8133a engages with the outer wall of the second bent plate 8132a via second limiting bolts 8133c. One end of each of the second limiting bolts 8133c abuts against the outer wall of the second bent plate 8132a. By rotating and adjusting the second limiting bolts 8133c, the spacing between the third bent plate 8133a and the second bent plate 8132a can be adjusted. By combining and adjusting the oblong holes 8132b, the first limiting bolts 8133b, and the second limiting bolts 8133c, the position of the support frame 815 can be precisely fine-tuned in three vertical directions. In some embodiments, fasteners may be connected between the first mounting plate 8131 and the second mounting plate 8132 to further secure the position of the first mounting plate 8131 and the second mounting plate 8132. A universal bearing 8133d is connected between the third mounting plate 8133 and the second mounting plate 8132. The universal bearing 8133d can ensure the relative connection relationship between the third mounting plate 8133 and the second mounting plate 8132, and facilitate the adjustment of the position relationship between the third mounting plate 8133 and the second mounting plate 8132 through the first limiting bolt 8133b and the second limiting bolt 8133c.

[0070] The present embodiment provides a carrier bracket 6 for use in a semiconductor substrate cleaning and drying assembly, wherein the carrier bracket 6 includes: a support plate 61 disposed in a support frame 815 and used to support the carrier 9, and a support plate 62 movably disposed on the support plate 61; a plurality of support portions 621 for supporting the semiconductor substrates 91 in the carrier 9 are disposed on the support plate 62, wherein the support portions 621 have a contact structure, and the contact structure extends along the arrangement direction of the semiconductor substrates 91 in the carrier 9 so that the contact structure is in point contact or line contact with the semiconductor substrates 91 in the carrier 9; the support plate 61 and the support plate 62 are configured to trigger relative movement between the support plate 61 and the support plate 62 in response to contact with the bottom of the drying container 2 during the descent of the carrier bracket 6 to lift the semiconductor substrates 91 in the carrier 9.

[0071] Specifically, the support plate 62 is provided with a plurality of support parts 621 for supporting the semiconductor substrate 91 in the carrier 9 and a plurality of pillars 622 for supporting the support plate 62. The support part 621 has a contact structure, and the contact structure extends along the arrangement direction of the semiconductor substrate 91 in the carrier 9 so that the contact structure is in point contact or line contact with the semiconductor substrate 91 in the carrier 9. The pillars 622 are passed through the support plate 61 and can be abutted against the bottom of the drying container 2 so that the support plate 62 and the support plate 61 move relative to each other to lift the semiconductor substrate 91 in the carrier 9. During the cleaning process, the carrier bracket 6 can be placed in the support frame 815 of the lifting mechanism 8, and the carrier 9 with the semiconductor substrate 91 can be placed on the support plate 61. The lifting mechanism 8 slowly lifts the carrier 9 with the semiconductor substrate 91 into the drying container 2 of the semiconductor substrate cleaning and drying assembly. During the descent of the carrier 9, the contact structure of the support portion 621 on the support plate 62 does not contact the semiconductor substrate 91 until the pillar 622 contacts the bottom of the drying container 2 and continues to descend. The support plate 61 continues to descend with the lifting mechanism 8 and separates from the support plate 62. The contact structure of the support portion 621 on the support plate 62 contacts the semiconductor substrate 91 and lifts the semiconductor substrate 91 in the carrier 9. Since the contact structure is in point contact or line contact with the semiconductor substrate 91 in the carrier 9, the contact area is relatively small, which maximizes the cleaning exposure area on the surface of the semiconductor substrate 91, effectively solving the problem of incomplete local cleaning caused by the large contact area in the prior art, and improving the cleaning quality of the semiconductor substrate 91 and the subsequent process yield. At the same time, the carrier bracket 6 on the support frame 815 is a pick-and-place replacement, and does not require positioning adjustment. It can be compatible with semiconductor substrates 91 of different sizes at the same time. The support plate 62 is movably set on the support plate 61, and the two are integrated into one body, which is relatively convenient to install and adjust. When in use, it is only necessary to drag the semiconductor substrate 91 to a certain height in the carrier 9. The semiconductor substrate 91 does not need to be separated from the carrier 9 during the entire drying process, that is, the contact between the semiconductor substrate 91 and the carrier 9 is reduced to the point that the first solution film can enter between the semiconductor substrate 91 and the carrier 9 for dehydration. This makes it compatible with a wider range, and the fragmentation rate and bending degree are greatly reduced.

[0072] In this embodiment, the support 622 is only provided as a way to trigger the relative movement between the support plate 61 and the support plate 62. It can also be achieved through other structures, such as setting levers, inclined planes, hydraulics and other mechanisms to achieve relative movement between the support plate 61 and the support plate 62.

[0073] In an optional technical solution of this embodiment, a plurality of supporting elements 611 for supporting the carrier 9 are connected to the support plate 61 , and the supporting elements 611 enable the carrier 9 to form an inclined posture.

[0074] Specifically, the height of the support element 611 extending from the upper side of the support plate 61 is adjustable; the height of all the support elements 611 extending from the upper side of the support plate 61 decreases successively, so that the carrier 9 forms a tilted posture. After the carrier 9 is placed on the support element 611, it can be tilted to avoid water accumulation. Specifically, the support element 611 can be a pointed set screw, which is installed in the screw hole of the support plate 61, with the pointed head facing upward to support the carrier 9, and the height is adjustable. Each carrier 9 is equipped with four and the installation heights are different. After the carrier 9 is placed on it, it is in a tilted state front, back, left and right. The tilt angle of the carrier 9 is changed by adjusting the pointed set screw. The angle range of the front, back, left and right is adjustable from 0 to 10 degrees. Such a tilt can prevent water from accumulating on the plane of the carrier 9. The locking nut is connected to the pointed set screw from the bottom side of the support plate 61 to prevent the pointed set screw from rotating.

[0075] This embodiment is not limited thereto, and the supporting element 611 may also be implemented in other forms to cause the carrier 9 to form an inclined posture. For example, the supporting element 611 may be implemented using a wedge block or an angled mounting surface.

[0076] In an optional technical solution of this embodiment, after the relative movement between the supporting plate 61 and the supporting plate 62 , the supporting plate 62 can cause the semiconductor substrate 91 in the carrier 9 to form an inclined posture.

[0077] Specifically, the height at which the struts 622 extend from the underside of the support plate 62 is adjustable, and the height of all struts 622 extending from the underside of the support plate 62 decreases sequentially, so that the semiconductor substrate 91 within the carrier 9 forms an inclined posture identical to the tilt of the carrier 9, ensuring cleaning effectiveness and positional stability between the carrier 9 and the semiconductor substrate 91. The struts 622 are threaded and height-adjustable. Each support plate 62 is provided with four struts 622, and the height of the four struts 622 is adjusted according to the tilt angle of the carrier 9, so that the support plate 62 remains parallel to the carrier 9 when supporting the semiconductor substrate 91.

[0078] This embodiment is not limited thereto. After the relative movement between the support plate 61 and the support plate 62 , the support plate 62 may cause the semiconductor substrate 91 in the carrier 9 to form an inclined posture that is different from the inclined posture of the carrier 9 .

[0079] In the optional technical solution of this embodiment, the contact structure is located at the top of the support part 621, and the support part 621 includes a guide structure. The guide structure is configured to guide the liquid to flow in a direction away from the contact area between the semiconductor substrate 91 in the carrier 9 and the support part 621 when the support part 621 supports the semiconductor substrate 91 in the carrier 9.

[0080] Specifically, one side of the support portion 621 is a vertical surface, and the other side is an inclined surface 6211. The inclined surface 6211 forms a diversion structure, and the intersection of the top of the vertical surface and the top of the inclined surface 6211 forms a contact structure. The inclined surface 6211 serves as a diversion mechanism, guiding and draining away water droplets at the contact point between the semiconductor substrate 91 and the contact structure of the support portion 621 during the slow drainage process.

[0081] It should be noted that both sides of the support portion 621 can also be inclined surfaces 6211, that is, both sides of the support portion 621 have a flow-guiding structure. The flow-guiding structure is not limited to the inclined surface 6211 and can also be a curved surface or a groove. In addition, the contact structure can be a tooth-like structure, a linear structure, or a dot-like structure along the arrangement direction of the semiconductor substrate 91 in the carrier 9, and is not limited to being located at the top of the support portion 621. It can also be located at other locations as long as the requirements are met.

[0082] In the optional technical solution of this embodiment, a plurality of positioning parts 612 that cooperate with the carrier 9 are connected to the upper side of the support plate 61. These positioning parts 612 are distributed around the carrier 9 and can effectively limit the movement of the carrier 9, ensuring that the position of the carrier 9 is stable during the lifting process without offset or shaking.

[0083] In an optional technical solution of this embodiment, a first hollow hole 613 is provided on the supporting plate 61 to reduce weight and facilitate drainage.

[0084] In an optional technical solution of this embodiment, a second hollow hole 623 is provided on the support plate 62 to reduce weight and facilitate drainage.

[0085] In an optional technical solution of this embodiment, a guide sleeve is provided between the pillar 622 and the support plate 61. The guide sleeve is a guide sleeve of the pillar 622, which plays a lubricating role and prevents the support plate 61 and the support plate 62 from getting stuck when they move relative to each other.

[0086] A semiconductor substrate drying process provided in this embodiment is implemented using a semiconductor substrate cleaning and drying assembly. The semiconductor substrate drying process includes the following steps: placing a carrier 9 on a support plate 61 and immersing it in a cleaning liquid, lifting the semiconductor substrate 91 through the relative movement of the support plate 62 and the support plate 61, so that the contact structure between the semiconductor substrate 91 and the support portion 621 forms point contact or line contact, applying a first solution to the liquid surface of the cleaning liquid to form a first solution film, controlling the liquid level of the cleaning liquid to descend at a uniform speed, and replenishing the first solution during the descent process.

[0087] In an optional technical solution of this embodiment, the support plate 61 is provided with a positioning slot 614 that extends through the support plate 61 and engages with the positioning block 8151b. The positioning slot 614 on the support plate 61 passes through the positioning block 8151b, providing support for the support plate 61, thereby ensuring its stable position within the support frame 815. When the lifting mechanism 8 descends, the support plate 61 moves with the support frame 815 until the carrier 9 is accurately positioned in the cleaning and drying position.

[0088] It should be noted that, in this embodiment, the support plate 62 may be installed on the support plate 61 to realize the support function, or the support plate 62 may not be installed when the support function is not needed.

[0089] In an optional technical solution of this embodiment, the semiconductor substrate cleaning and drying assembly further includes a liquid level gauge 7 . The liquid level gauge 7 is disposed within the inner container 21 and includes a pressure transmission component 71 connected to the gas supply pipe 36 and a pressure differential detection component 72 electrically connected to the controller. The outlet of the pressure transmission component 71 is located at the bottom of the inner container 21 , and the pressure differential detection component 72 is disposed on the pressure transmission component 71 . The controller uses the pressure differential detection component 72 to detect the pressure difference between the surface of the cleaning liquid within the inner container 21 and the outlet of the pressure transmission component 71 to determine the liquid level of the cleaning liquid within the inner container 21 . Using the liquid level gauge 7 to control the flow of liquid provides high accuracy and is unaffected by flow rate factors. The differential pressure output by the differential pressure detection component 72 is proportional to the liquid level and offsets the effects of gas pressure fluctuations. Low-pressure gas (typical pressure 0.25 bar) is continuously introduced into the pressure transmission component 71, causing microbubbles to form at the gas outlet of the pressure transmission component 71, preventing liquid from flowing back or crystallizing and clogging the pressure transmission component 71. In addition, the gas acts as an inert gas to prevent oxidation or contamination of the liquid, making it particularly suitable for ultra-pure chemicals.

[0090] This embodiment is not limited to the liquid level gauge 7; other liquid level gauges can also be used, such as submersible static pressure level gauges, ultrasonic level gauges, radar level gauges, photoelectric level gauges, and float level gauges. However, compared to other level measurement technologies, the liquid level gauge 7 excels in the following aspects: 1. Corrosion and blockage resistance. Semiconductor cleaning fluids are highly corrosive. The air pressure transmission component 71 of the liquid level gauge 7 is made of corrosion-resistant, high-purity materials, and gas purging prevents direct liquid contact with the sensor core, resulting in a significantly longer lifespan than submersible static pressure level gauges. Grinding fluids contain particles and are prone to sedimentation. Continuous gas purging maintains a clear pipeline, while the probes of ultrasonic or radar level gauges are easily interfered with by attachments. 2. High purity assurance. Due to the non-contact measurement method, only the gas contacts the liquid, preventing metal ion contamination from photoelectric / float sensors and meeting semiconductor-grade purity requirements (ppt level). Furthermore, there is no risk of penetration, and compared to capacitive sensors (which require electrode contact), medium penetration and failure are eliminated. 3. Adaptability to complex working conditions: Suitable for sealed pressure vessels, directly compatible with nitrogen-sealed storage tanks (a common design in semiconductor processes). The differential pressure principle naturally offsets the effects of air pressure fluctuations. Suitable for high-temperature / high-pressure environments, withstanding a wide temperature range (-40~125°C), and capable of pressures up to 40 bar, it outperforms plastic floats or photoelectric sensors. 4. Accuracy and reliability: Full temperature range compensation is possible, and the diffused silicon sensor has built-in temperature compensation with an accuracy of ±0.5%FS, avoiding ultrasonic signal scattering caused by steam / foam. Furthermore, there are no mechanical moving parts, unlike magnetostrictive or float-type sensors, which carry the risk of jamming. With no moving parts, maintenance is low. 5. Real-time monitoring, multi-point control, and real-time feedback from the level gauge.

[0091] In an optional technical solution of this embodiment, the air pressure transmission component 71 is provided with a secondary pressure regulating valve 711 to adjust the inlet pressure of the air pressure transmission component 71. The air pressure transmission component 71 is also provided with an inlet flow regulating valve 712 to precisely adjust the outlet rate by controlling the speed at which gas enters the air pressure transmission component 71.

[0092] When water accumulates in inner container 21, air pressure transmission component 71 forms bubbles within the water. Airflow regulation by inlet flow control valve 712 directly influences the frequency of bubble generation. A faster flow rate results in a more sensitive response from liquid level gauge 7 (increased liquid level fluctuations), while a slower flow rate results in a delayed response (a more stable liquid level). The outlet of air pressure transmission component 71 is provided with a beveled cutout to prevent contact with the flat surface at the bottom of inner container 21, causing blockage. Inner container 21 is provided with a fixed structure to which air pressure transmission component 71 is affixed. The fixed structure can be a fixed block, plate, or other suitable structure. Air pressure transmission component 71 can be a metal tube, air pipe, or other suitable structure. Liquid level gauge 7 monitors the liquid level within inner container 21 in real time. The liquid level data it provides is connected to the PLC system. Predetermined liquid level thresholds trigger process sequence switching nodes, enabling automated closed-loop control of the entire process, including water filling and drainage. Slow drainage control: Set the liquid level value - set the slow drainage flow rate - slow drainage begins - reach the set liquid level - start slow drainage - the controller activates the second pump 51 according to the set flow rate - the drainage flow meter 53 monitors the flow rate in real time and feeds it back to the controller. The controller automatically calculates and adjusts the power of the second pump 51 based on the flow rate feedback from the drainage flow meter 53 to achieve the set flow rate, forming a closed-loop control. When the next liquid level node is reached, the controller automatically adjusts the power of the second pump 51 based on the flow rate feedback from the drainage flow meter 53 to achieve the flow rate at this node until the slow drainage end liquid level node is reached, at which point the slow drainage ends and the next step is entered. The entire slow drainage process can have multiple speed change nodes.

[0093] In an optional technical solution of this embodiment, the air pressure transmission component 71 is provided through the flow balancing component 214, and the air outlet end of the air pressure transmission component 71 is located between the flow balancing component 214 and the bottom of the inner container 21, thereby ensuring detection accuracy.

[0094] It should be noted that, in some embodiments of the present application, the drying container 2 may also be a drying container 2 in the prior art, for example, the drying container 2 includes a first container connected to the main body 1 and a second container connected to the top outer wall of the first container, the second container and the outer wall of the first container are surrounded by an overflow collection structure 221, so that the cleaning liquid overflowing from the first container flows into the overflow collection structure 221, and the bottom of the overflow collection structure 221 is connected to a second drain pipe; the liquid inlet pipe 212 is connected to the side wall of the first container, the first drain pipe is connected to the bottom wall of the first container, the first solution bubbling box is connected to the side wall of the second container, and the box opening of the first solution bubbling box is higher than the top opening of the first container, the groove The cover is connected to the top of the second container, the first discharge pipe includes a first section connected to the first container, a second section connected to an end of the first section away from the first container, and a third section connected to an end of the second section away from the first section and used to discharge the cleaning liquid in the first container to the outside of the main body 1, the second pump 51, the first valve 52 and the flow meter are connected to the second section, the first discharge pipe is connected to a sixth pipe, one end of the sixth pipe is connected to the intersection of the first section and the second section, and the other end is connected to the intersection of the second section and the third section, the sixth pipe is connected to a ninth valve, the highest point of the second section is higher than the top of the first container, and the inner diameter of the third section gradually increases from the end close to the second section to the tail end of the third section.

[0095] This embodiment provides an exhaust confluence device 11 for use in semiconductor substrate processing equipment. The exhaust confluence device 11 is hollow inside and connected to the main body 1. A plant exhaust system connector 111 is provided on the first side of the exhaust confluence device 11. An adjustment slot, an exhaust adjustment plate 112, and an exhaust port 113 are provided on the second side of the exhaust confluence device 11. The exhaust adjustment plate 112 is provided at the exhaust port 113 and connected to the adjustment slot by screws. The exhaust adjustment plate 112 adjusts the connection position through the adjustment slot to change the opening of the exhaust port 113. The plant exhaust system connector 111 of the exhaust confluence device 11 is connected to the interface of the plant exhaust system, making one-to-one connection convenient. At the same time, the exhaust port 113 can promptly exhaust the air within the main body 1 of the semiconductor substrate processing equipment to avoid pollution and also reduce the temperature.

[0096] In the optional technical solution of this embodiment, the exhaust ports 113 are arranged in a row vertically; both ends of the row of exhaust ports 113 are provided with adjustment long holes, and the two ends of the exhaust adjustment plate 112 are respectively connected to the adjustment long holes. The exhaust ports 113 can be moved forward and backward to open or close, thereby improving the exhaust effect, and are arranged vertically, occupying a small area. The third side of the exhaust converging device 11 is provided with a first exhaust valve 114 with a manually adjustable opening. The first exhaust valve 114 is connected to the lifting mechanism 8 through a first hose to exhaust the area of ​​the lifting mechanism 8. The fourth side of the exhaust converging device 11 is provided with a second exhaust valve 115 with a manually adjustable opening and a third exhaust valve 116 with a manually adjustable opening. The second exhaust valve 115 is connected to the exhaust boxes on both sides of the drying container 2 through a second hose, and the third exhaust valve 116 is connected to the exhaust boxes through a third hose to exhaust the exhaust boxes. A fourth exhaust valve 117 with a manually adjustable opening is installed on the fourth side of the exhaust confluence device 11. This valve is connected to the three-way valve on the drain line of the drying container 2 via a fourth hose to vent the drying container 2. A multifunctional area is also provided on the first side of the exhaust confluence device 11, housing multiple exhaust connectors 118. At least one exhaust connector 118 is connected via an air pipe to an exhaust negative pressure gauge, which is used to monitor the exhaust pressure within the exhaust confluence device 11. At least one exhaust connector 118 is connected via an air pipe to the cylinder mounting box 32 to vent the cylinder mounting box 32. At least one exhaust connector 118 is connected via an air pipe to the guide rail mounting box 33 to vent the guide rail mounting box 33. At least one exhaust connector 118 is connected via an air pipe to the pressure supply system 4 to vent the pressure supply system 4. The entire exhaust confluence device 11 has a simple structure and can meet the overall exhaust requirements of semiconductor substrate processing equipment.

[0097] It should be noted that the first exhaust valve 114, the second exhaust valve 115, the third exhaust valve 116 and the fourth exhaust valve 117 are all provided with an adjustment plate that can be rotated 90°. The valve opening can be adjusted by manually rotating the plate to control the exhaust volume of the area. The structure is simple and the operation is convenient.

[0098] This embodiment provides a semiconductor substrate processing device, including the above-mentioned semiconductor substrate cleaning and drying assembly. Therefore, the technical advantages and effects achieved by the semiconductor substrate processing device include the technical advantages and effects achieved by the above-mentioned semiconductor substrate cleaning and drying assembly, which will not be repeated here.

[0099] This embodiment provides a semiconductor substrate 91 cleaning and drying process, which is implemented using the above-mentioned semiconductor substrate processing equipment. Therefore, the technical advantages and effects achieved by the semiconductor substrate 91 cleaning and drying process include the technical advantages and effects achieved by the above-mentioned semiconductor substrate processing equipment, which will not be repeated here.

[0100] The semiconductor substrate 91 cleaning and drying process includes the following steps: The semiconductor substrate 91 is in a standby state before cleaning: the liquid inlet pipe 212 slowly injects cleaning liquid into the inner container 21. The cleaning liquid in the inner container 21 is full and slowly overflowing. The overflowing cleaning liquid enters the overflow collection structure 221 and is discharged through the outer tank drain pipe 222. The lifting height of the lifting mechanism 8 is in the standby position, the automatic opening and closing mechanism 3 is in the closed state, the gas outlet 312 on the automatic opening and closing mechanism 3 blows gas into the drying container 2, the liquid level in the pressure supply system 4 is higher than the predetermined L level, and the first gas pipe 42 fills the pressure supply system 4 with gas. Cleaning of the semiconductor substrate 91: When the cleaning liquid level in the inner container 21 reaches the overflow level and the temperature at the outlet of the gas heating device 372 reaches the predetermined temperature, the gas outlet 312 on the automatic opening and closing mechanism 3 stops blowing gas into the drying container 2, the automatic opening and closing mechanism 3 opens, and the carrier 9 is placed on the lifting mechanism 8. The lifting mechanism 8 descends to the cleaning position, and the semiconductor substrate 91 in the carrier 9 is immersed in the cleaning liquid in the inner container 21. The automatic opening and closing mechanism 3 closes; the liquid inlet pipe 212 rapidly injects cleaning liquid into the inner container 21. When the cleaning liquid in the inner container 21 is full and about to overflow, the liquid inlet pipe 212 stops injecting cleaning liquid into the inner container 21; Slow liquid discharge: the first valve 52 and the second pump 51 are opened, and the slow discharge flow path 5 starts to slowly discharge liquid; in the process of the liquid level dropping, when the liquid level gauge 7 detects that the liquid level has reached the first predetermined position, the first valve 52 and the second pump 51 are closed, and a first predetermined amount of the first solution is injected into the liquid distribution device 24, and the first solution is applied to the guide structure 211 through the distribution port, and then guided to the liquid surface in the inner container 21 by the guide structure 211 to form a first solution film; after the injection of the first solution into the liquid distribution device 24 is stopped, the first valve 52 and the second pump 51 are opened, and the slow discharge flow path 5 continues to slowly discharge liquid; each time the liquid level gauge 7 detects that the liquid level has reached the position for replenishing the first solution, a second predetermined amount of the first solution is injected into the liquid distribution device 24; when the liquid level gauge 7 detects that the liquid level has reached the second predetermined position, the first valve 52 and the second pump 51 are closed; Quick drainage: The inner tank drain pipe 213 quickly drains the cleaning liquid. When the liquid level gauge 7 detects that the liquid level has reached the third predetermined position, the lifting mechanism 8 rises to the second intermediate position. After all the cleaning liquid in the inner container 21 is drained, the inner tank drain pipe 213 stops draining after a set time has passed. Drying of the semiconductor substrate 91: The gas supply pipe 36 and the second gas pipe 37 supply gas to the gas outlet 312 on the automatic opening and closing mechanism 3. Simultaneously, the gas heating device 372 is turned on to heat the gas, allowing the hot gas ejected from the gas outlet 312 to dry the semiconductor substrate 91 and the carrier 9. After the set drying time, the lifting mechanism 8 rises to the first intermediate position, the gas heating device 372 is turned off, and the gas supply pipe 36 and the second gas pipe 37 continue to supply gas at a low flow rate to the gas outlet 312 on the automatic opening and closing mechanism 3. The process ends: the gas supply pipe 36 and the second gas pipe 37 stop supplying gas to the gas outlet 312 on the automatic opening and closing mechanism 3, the automatic opening and closing mechanism 3 opens, the lifting mechanism 8 rises to the standby position, the liquid inlet pipe 212 slowly injects the cleaning liquid into the inner container 21, the carrier 9 on the lifting mechanism 8 is removed, the automatic opening and closing mechanism 3 is closed, and when the liquid level of the cleaning liquid in the inner container 21 reaches the fourth predetermined position, the liquid inlet pipe 212 quickly injects the cleaning liquid into the inner container 21. When the liquid level of the cleaning liquid in the inner container 21 reaches the fifth predetermined position, the liquid inlet pipe 212 slowly injects the cleaning liquid into the inner container 21, so that the cleaning liquid in the inner container 21 is in a full and slowly overflowing state; Among them, the lifting height points of the lifting mechanism 8 are, from high to low, the following: standby position, first intermediate position, second intermediate position and cleaning position.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A slow liquid discharge device for semiconductor substrate processing equipment, characterized in that: The slow liquid discharge device comprises: a drying container (2) and a cleaning liquid inlet and outlet pipeline system connected to the drying container (2); The drying container (2) comprises an inner container (21) and an outer container (22), wherein the outer container (22) is connected to the top outer wall of the inner container (21) and forms an overflow collection structure (221) with the outer wall of the inner container (21), so that the cleaning liquid overflowing from the inner container (21) flows into the overflow collection structure (221); The cleaning liquid inlet and outlet pipe system comprises a liquid inlet pipe (212), a slow discharge flow path (5), an inner tank drain pipe (213) and an outer tank drain pipe (222); the liquid inlet pipe (212) is connected to the inner container (21) and is used to inject cleaning liquid into the inner container (21); the slow discharge flow path (5) is connected to the inner container (21) and the outer container (22) and is used to discharge the cleaning liquid in the inner container (21) to the overflow collection structure (221); the inner tank drain pipe (213) is connected to the inner container (21) and is used to discharge the cleaning liquid in the inner container (21); and the outer tank drain pipe (222) is connected to the outer container (22) and is used to discharge the cleaning liquid in the overflow collection structure (221).

2. The slow liquid discharge device according to claim 1, characterized in that: The liquid inlet pipe (212) is arranged in the inner container (21) and is located at the bottom of the inner container (21); The bottom outer wall of the inner container (21) is provided with a liquid inlet connection port (216), and the liquid inlet pipe (212) is connected to the liquid inlet connection port (216); The wall of the liquid inlet pipe (212) is provided with a liquid inlet.

3. The slow liquid discharge device according to claim 2, characterized in that: There are multiple liquid inlets.

4. The slow liquid discharge device according to claim 2, characterized in that: The liquid inlet faces the inner area of ​​the inner container (21).

5. The slow liquid discharge device according to claim 1, characterized in that: A flow guide structure (211) is provided outside the top opening of at least one side wall of the inner container (21), and an overflow gap is provided between the flow guide structure (211) and the side wall of the outer container (22), so that the cleaning liquid overflowing from the inner container (21) flows into the overflow collection structure (221) through the overflow gap; A liquid distribution device (24) is correspondingly provided above the guide structure (211), and a distribution port is provided on the liquid distribution device (24). The first solution is applied to the guide structure (211) through the distribution port, and then guided to the liquid surface in the inner container (21) through the guide structure (211) to form a first solution film.

6. The slow liquid discharge device according to claim 2, characterized in that: A gap is provided between the liquid inlet pipe (212) and the bottom of the inner container (21).

7. The slow liquid discharge device according to claim 2, characterized in that: A flow balancing component (214) is provided in the inner container (21), and the flow balancing component (214) is located at the bottom of the inner container (21) and above the liquid inlet pipe (212).

8. The slow liquid discharge device according to any one of claims 1 to 7, characterized in that: The slow discharge flow path (5) is connected to a second pump (51), a first valve (52) and a liquid discharge flow meter (53). The second pump (51) and the liquid discharge flow meter (53) are both electrically connected to a controller, so that the controller controls the flow rate of the second pump (51) according to the signal feedback of the liquid flow rate in the slow discharge flow path (5) from the liquid discharge flow meter (53).

9. The slow liquid discharge device according to any one of claims 1 to 7, characterized in that: One end of the slow discharge flow path (5) is connected to the bottom of the inner container (21), and the other end is connected to the top outer wall of the outer container (22); The outer tank drain pipe (222) is connected to the bottom of the outer container (22).

10. A semiconductor substrate processing device, characterized in that: The invention comprises the slow liquid discharge device according to any one of claims 1 to 9.

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