Lifting mechanism and lifting method for chip manufacturing

Abstract

This invention belongs to the field of electrical component manufacturing technology, specifically relating to an apparatus suitable for handling wafers in semiconductor processing, and particularly to a lifting mechanism and method for chip manufacturing. The lifting mechanism for chip manufacturing includes a frame, an outer sleeve, and an inner core rod, with an umbrella-shaped ejector pin and a driving component at the top of the inner core rod. The umbrella-shaped ejector pin expands radially and supports the four right angles of the die, concentrating the peeling force in the right-angle area rather than the entire die surface, avoiding micro-cracks at the die edges caused by lifting the entire surface, and ensuring the integrity of the subsequent chip structure. Heat from the heating block is transferred to the adhesive at the contact point only through the umbrella-shaped ejector pin, significantly reducing the heat-affected zone and preventing accidental detachment of adjacent die adhesives due to softening. Simultaneously, the umbrella-shaped ejector pin initiates peeling from the right angle of the die, and the adhesive melting area gradually expands from the outside in, avoiding violent rebound caused by the instantaneous detachment of the blue film, thereby eliminating the risk of displacement of surrounding die particles.

Description

Technical Field

[0001] This invention belongs to the field of electrical component manufacturing technology, specifically relating to an apparatus particularly suitable for handling wafers in semiconductor processing, and more particularly to a lifting mechanism and lifting method for chip manufacturing. Background Technology

[0002] During chip manufacturing, each die on the wafer is cut and separated to form an independent chip. The die removal process requires peeling the target die off the carrier blue film.

[0003] In related technologies, adhesive is used to fix the wafer to the blue film. During die separation, a pin the same size as the die heats the blue film, accelerating the detachment of the die from the blue film. However, this lifting mechanism has the following problems:

[0004] First, when separating the die from the wafer, the die is pushed by the ejector pin. When the die separates from the blue film, the blue film instantly separates from the entire back side of the die. The peeling force can easily cause cracks at the right angles of the brittle die edges, affecting the chip quality.

[0005] Secondly, since the ejector pin abuts against the entire back of the grain, the blue film needs to be lifted to a higher height during separation, which causes the blue film to be stretched, thus affecting the positioning of the adjacent grains. At the same time, when the blue film rebounds, it will cause the surrounding grains to be misaligned, increasing the difficulty of lifting subsequent grains.

[0006] Third, because the ejector pin heats the adhesive in the contact area, the area outside the contact area will also be heated by residual heat, which reduces the adhesion between the adjacent grains and the blue film. During the rebound process of the blue film, the adjacent grains may accidentally fall off.

[0007] Therefore, how to avoid damaging the right angle of the grain edge when the grain separates from the blue film, while avoiding the deformation of the blue film affecting the initial position of the remaining grains, is a technical problem that urgently needs to be solved.

[0008] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0009] This disclosure provides at least one lifting mechanism and lifting method for chip manufacturing.

[0010] In a first aspect, embodiments of this disclosure provide a lifting mechanism for chip manufacturing, comprising:

[0011] frame;

[0012] Outer tube, which is disposed at the top of the frame;

[0013] The inner core rod passes through the outer sleeve and extends into the frame, and the top of the inner core rod is provided with an umbrella-shaped pin;

[0014] The inner core rod is provided with a heating block at the top, the umbrella-shaped pin is made of a heat-conducting material, and the umbrella-shaped pin is used to transfer the heat generated by the heating block to the umbrella-shaped pin.

[0015] A driving component is used to drive the inner core rod to rise so that the umbrella-shaped ejector pin extends out of the through hole at the top of the outer sleeve. The umbrella-shaped ejector pin opens radially outward to support the four right angles of the wafer grains above the blue film and melts the glue corresponding to the contact point between the umbrella-shaped ejector pin and the blue film, so as to separate the grains from the wafer.

[0016] In one alternative embodiment, the umbrella-shaped ejector pin includes:

[0017] The needle bar has its bottom elastically connected to the top surface of the inner core rod via a buffer spring;

[0018] Four top claws are rotatably disposed on the top of the needle bar and arranged circumferentially along the needle bar;

[0019] After the umbrella-shaped ejector pin extends from the through hole at the top of the outer sleeve, the four ejector claws open radially outward to support the four right angles of the wafer grains above the blue film.

[0020] In one alternative embodiment, the lower end of the top claw is provided with a slot;

[0021] The top of the needle bar is provided with an insertion block;

[0022] The insertion block of the needle bar is connected to the slot of the top claw via a first rotating shaft.

[0023] In one alternative implementation, the drive element includes:

[0024] A linear drive unit is disposed within the frame;

[0025] A sliding part is provided on the linear drive unit.

[0026] The inner core rod is disposed at the top of the sliding part;

[0027] When the linear drive unit moves the sliding part up and down, it simultaneously moves the inner core rod up and down.

[0028] In one alternative embodiment, a guide rod is also provided at the top of the frame;

[0029] The bottom of the outer sleeve is fitted onto the guide rod and is slidably connected to the frame through the guide rod;

[0030] The inner wall of the frame is provided with a linkage component;

[0031] When the sliding part rises, the linkage is triggered to drive the outer sleeve to rise, so that the umbrella-shaped ejector pins are driven to retract radially inward through the outer sleeve, so that the blue film opposite the umbrella-shaped ejector pins is gradually separated from the four right angles of the grain inward.

[0032] In one alternative embodiment, the linkage is configured to amplify the rising distance of the sliding part and transmit it to the outer tube, so that the rising speed V1 of the outer tube is greater than the rising speed V2 of the inner core rod.

[0033] In one optional implementation, the linkage includes:

[0034] Support frame;

[0035] The V-shaped lever plate is rotatably connected to the support frame via a second rotating shaft;

[0036] The first arm of the V-shaped lever plate is positioned toward the sliding part, and the second arm of the V-shaped lever plate abuts against the bottom of the outer sleeve.

[0037] Furthermore, the length of the first arm plate is less than the length of the second arm plate.

[0038] In one optional embodiment, a negative pressure pipeline is provided inside the wall of the outer sleeve;

[0039] One end of the negative pressure pipeline is connected to an external negative pressure source, and the other end is connected to the outside through a through hole in the outer sleeve where the umbrella-shaped pin is not installed, so that negative pressure is generated between the top surface of the outer sleeve and the blue film.

[0040] Secondly, this disclosure also provides a lifting method for a chip manufacturing lifting mechanism as described above, the lifting method comprising:

[0041] The blue film with the wafer attached is placed above the lifting mechanism used in chip production via an external conveying mechanism.

[0042] The position of the frame is adjusted by external position adjustment structure so that the umbrella-shaped pins of the inner core rod are aligned with the corresponding grains;

[0043] The heating block begins to heat up and transfers the heat to the umbrella-shaped apex.

[0044] The driving component drives the inner core rod to rise, so that the umbrella-shaped ejector pin extends out of the through hole at the top of the outer tube. The umbrella-shaped ejector pin opens radially outward and supports the four right angles of the grain.

[0045] The adhesive at the contact point between the umbrella-shaped ejector pin and the blue film is melted by the umbrella-shaped ejector pin, and the ejector pin continues to rise through the drive until the grain separates and falls off the wafer.

[0046] In one alternative implementation, the drive element includes:

[0047] A linear drive unit is disposed within the frame;

[0048] A sliding part is provided on the linear drive unit.

[0049] The inner core rod is disposed at the top of the sliding part;

[0050] When the linear drive unit drives the sliding part to rise and fall, it simultaneously drives the inner core rod to rise and fall.

[0051] A guide rod is also provided at the top of the frame;

[0052] The bottom of the outer sleeve is fitted onto the guide rod and is slidably connected to the frame through the guide rod;

[0053] The inner wall of the frame is provided with a linkage component;

[0054] The step of the driving component driving the inner core rod to rise, so that the umbrella-shaped ejector pin extends out of the through hole at the top of the outer sleeve, and the umbrella-shaped ejector pin opens radially outward and supports the four right angles of the grain, further includes:

[0055] When the sliding part rises, the linkage is triggered to drive the outer sleeve to rise, so that the umbrella-shaped ejector pins are driven to retract radially inward through the outer sleeve, so that the blue film opposite the umbrella-shaped ejector pins is gradually separated from the four right angles of the grain inward.

[0056] The beneficial effects of this invention are that the lifting mechanism and method used in chip manufacturing, by radially expanding umbrella-shaped ejector pins, supports the four right angles of the die, concentrating the peeling force in the right-angle area rather than the entire die surface. This avoids micro-cracks at the die edges caused by lifting the entire surface, ensuring the integrity of the subsequent chip structure. The heat from the heating block is transferred to the adhesive at the contact point only through the ejector pins, significantly reducing the heat-affected zone and preventing accidental detachment of adjacent die adhesives due to softening. Simultaneously, the umbrella-shaped ejector pins initiate peeling from the right angles of the die, and the adhesive melting area gradually expands from the outside in, avoiding violent rebound caused by the instantaneous detachment of the blue film, thereby eliminating the risk of displacement of surrounding die surfaces.

[0057] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention are realized and obtained through the structures particularly pointed out in the description and the drawings.

[0058] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0059] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0060] Figure 1 This is a schematic diagram of the structure of a lifting mechanism for chip manufacturing provided in an embodiment of this disclosure;

[0061] Figure 2 A cross-sectional view of a lifting mechanism for chip manufacturing provided in an embodiment of this disclosure;

[0062] Figure 3 This is a schematic diagram showing the connection between the sliding part and the inner rod provided in an embodiment of this disclosure;

[0063] Figure 4 A schematic diagram showing the state of the umbrella-shaped ejector pin extending from the through hole according to an embodiment of this disclosure;

[0064] Figure 5 A schematic diagram of the state when the chip manufacturing lifting mechanism lifts the die according to an embodiment of this disclosure;

[0065] Figure 6 A flowchart of a lifting method for a chip manufacturing lifting mechanism provided in an embodiment of this disclosure;

[0066] Figure 7 This is a schematic diagram of the bonding of a wafer and a blue film according to an embodiment of this disclosure.

[0067] In the diagram: 100, frame; 110, guide rod; 120, linkage component; 121, support frame; 122, V-shaped lever plate; 123, second rotating shaft; 200, outer sleeve; 210, through hole; 220, negative pressure pipeline; 300, inner core rod; 310, umbrella-shaped ejector pin; 311, ejector claw; 3111, slot; 312, needle bar; 3121, insert block; 313, first rotating shaft; 314, buffer spring; 320, heating block; 400, driving component; 410, linear drive part; 420, sliding part; 500, blue film; 600, grain. Detailed Implementation

[0068] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0069] In this document, when it is mentioned that a first component is located on a second component, this can mean that the first component can be directly formed on the second component, or that a third component can be inserted between the first and second components. Furthermore, in the accompanying drawings, the thickness of the components may be exaggerated or reduced for the purpose of effectively describing the technical content.

[0070] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0071] In this document, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as “at least one of…” modify the entire list of elements when following a list of elements, rather than individual elements in the list. For example, the expression “at least one of a, b, and c” should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0072] The terminology used herein is for the purpose of describing specific exemplary configurations only and is not intended to be limiting. As used herein, the singular articles “a,” “an,” and “the” may also be intended to include plural forms unless otherwise expressly stated herein. The terms “comprising,” “including,” and “having” are inclusive and thus specify the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as requiring them to be performed in the specific order discussed or shown, unless specifically identified as such. Additional or alternative steps may be employed.

[0073] As used herein, the phrases “in one embodiment,” “according to one embodiment,” “in some embodiments,” etc., generally refer to the fact that a particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of this disclosure. Therefore, a particular feature, structure, or characteristic can be included in more than one embodiment of this disclosure, such that these phrases do not necessarily refer to the same embodiment. As used herein, the terms “example,” “exemplary,” etc., are used to “serve as an example, instance, or illustration.” Any implementation, aspect, or design described herein as “example” or “exemplary” is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. Rather, the use of the terms “example,” “exemplary,” etc., is intended to present concepts in a specific manner.

[0074] Research has revealed that the size of the ejector pin in the existing technology is the same as the size of the grain. When separating the grain from the blue film, the blue film instantly detaches from the entire back side of the grain. The peeling force easily causes right-angle cracks to form on the edges of the brittle grain. At the same time, when the ejector pin heats the glue area of ​​the blue film, it easily melts the glue area of ​​the surrounding grain, which leads to a decrease in the adhesion of the adjacent grain. When the blue film deforms, grain misalignment or detachment is likely to occur.

[0075] Based on the above research, this disclosure provides a lifting mechanism and lifting method for chip manufacturing. After the umbrella-shaped ejector pins 310 are radially expanded, they support the four right angles of the die 600, avoiding micro-cracks at the edge of the die 600 caused by full-surface lifting, thus ensuring the integrity of the subsequent chip structure. At the same time, the heat from the heating block 320 is only transferred to the adhesive at the contact point through the ejector claws 311, significantly reducing the heat-affected zone and preventing accidental detachment of adjacent dies 600 due to softening of the adhesive.

[0076] The shortcomings of the above solutions are the result of the inventor's practical experience and careful research. Therefore, the discovery process of the above problems and the solutions proposed in this disclosure should be considered as the inventor's contribution to this disclosure.

[0077] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0078] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0079] Please see Figure 1 and Figure 2 At least one embodiment provides a lifting mechanism for chip manufacturing, comprising: a frame 100; an outer tube 200 disposed on the top of the frame 100; an inner core rod 300 extending into the frame 100 after passing through the outer tube 200, and an umbrella-shaped ejector pin 310 disposed on the top of the inner core rod 300; wherein a heating block 320 is disposed on the top of the inner core rod 300, the umbrella-shaped ejector pin 310 is made of a thermally conductive material, and the umbrella-shaped ejector pin is used to generate heat from the heating block 320. The heat is transferred to the umbrella-shaped ejector pin 310; the driving member 400 is used to drive the inner core rod 300 to rise so that the umbrella-shaped ejector pin 310 extends out of the through hole 210 at the top of the outer sleeve 200. The umbrella-shaped ejector pin 310 opens radially outward to support the four right angles of the wafer grains 600 above the blue film 500, and melts the glue corresponding to the contact point between the umbrella-shaped ejector pin 310 and the blue film 500, so as to separate the grains 600 from the wafer.

[0080] The schematic diagram of the bonding between the wafer and the blue film 500 is shown below. Figure 7 As shown, the blue film model is Nitto No. 319Y-4M, and the peeling temperature of the blue film is 100-120℃.

[0081] After the umbrella-shaped ejector pins 310 expand radially, they support the four right angles of the die 600, concentrating the peeling force in the right-angle areas rather than the center of the die 600. This avoids micro-cracks at the edges of the die 600 caused by lifting the entire surface, ensuring the integrity of the subsequent chip structure. The heat from the heating block 320 is transferred to the adhesive at the contact point only through the ejector pins 311, significantly reducing the heat-affected zone and preventing accidental detachment of adjacent die 600s due to softening of the adhesive. At the same time, the umbrella-shaped ejector pins 310 initiate peeling from the right angles of the die 600, and the adhesive melting area gradually expands from the outside to the inside, avoiding violent rebound caused by the sudden detachment of the blue film 500, thereby eliminating the risk of displacement of surrounding die 600s.

[0082] It should be noted that the heating block 320 is equipped with multiple resistance wires, which heat the heating block 320 and transfer the heat to the top claw 311 to heat the adhesive between the blue film 500 and the crystal 600.

[0083] Please continue reading. Figure 1 and Figure 2 The umbrella-shaped ejector pin 310 includes: a needle bar 312, the bottom of which is elastically connected to the top surface of the inner core rod 300 via a buffer spring 314; four ejector claws 311, which are rotatably disposed on the top of the needle bar 312 and arranged circumferentially along the needle bar 312; after the umbrella-shaped ejector pin 310 extends out of the through hole 210 at the top of the outer sleeve 200, the four ejector claws 311 open radially outward (opening direction as shown in the figure). Figure 1 As shown in Figure F), the four right angles of the wafer grains 600 above the blue film 500 are supported, and the support state is as follows. Figure 4 As shown.

[0084] Along the inner core rod 300 Figure 4 When the tube rises in the direction shown by F1, the umbrella-shaped ejector pin 310 extends from the through hole 210 of the outer sleeve 200, at which time the ejector claw 311 moves along... Figure 4 Expand in the direction shown by F2.

[0085] It should be noted that the opening angle of the claw 311 is adapted to the size of the die 600, and the separation requirements of dies 600 of different sizes can be met by replacing the umbrella-shaped claws 310 of different sizes. The opening angle of the claw 311 can be limited by the cooperation of the limiting block and the limiting groove.

[0086] Through the elastic connection design of the buffer spring 314, when the top claw 311 contacts the grain 600 at a right angle, the buffer spring 314 absorbs the impact energy, avoiding the rigid support from causing the brittle grain 600 to shatter.

[0087] Please continue reading. Figure 1 The lower end of the top claw 311 is provided with a slot 3111; the top of the needle bar 312 is provided with an insertion block 3121; the insertion block 3121 of the needle bar and the slot 3111 of the top claw 311 are connected by a first rotating shaft 313.

[0088] It should be noted that the dimensions of the four top claws 311 after opening are adapted to the dimensions of the 600-cell die.

[0089] In a preferred embodiment, a limiting block and a limiting groove can be provided on the mating surfaces of the slot 3111 and the insert 3121 respectively, thereby limiting the opening angle of the top claw 311.

[0090] Please see Figure 2 and Figure 3A linear drive unit 410 is disposed within the frame 100; a sliding part 420 is disposed on the linear drive unit 410, wherein the inner core rod 300 is disposed on the top of the sliding part 420; the linear drive unit 410 drives the sliding part 420 to move up and down (the direction of movement is as follows). Figure 2 When (as shown in Figure F), the inner core rod 300 is simultaneously raised and lowered.

[0091] The frame 100 is provided with a guide rod 110 at its top; the bottom of the outer sleeve 200 is fitted onto the guide rod 110 and is slidably connected to the frame 100 through the guide rod 110; the inner wall of the frame 100 is provided with a linkage 120; when the sliding part 420 rises, the linkage 120 is triggered to drive the outer sleeve 200 to rise, so that the umbrella-shaped pin 310 is driven to retract radially inward through the outer sleeve, so that the blue film 500 opposite the umbrella-shaped pin 310 is gradually separated from the four right angles of the grain 600 inward.

[0092] Along the inner core rod 300 Figure 5 When the grain is pushed 600 in the direction shown by F1, the linkage 120 enlarges the sliding part 420 to force the umbrella rib pin to contract radially (as shown by F1). Figure 5 As shown in F2, the blue film 500 adhesive layer is separated from the right angle inwards, and peeled off gradually to reduce the deformation of the blue film 500, eliminate the rebound caused by instantaneous detachment and the damage to the right angle edge of the grain 600.

[0093] It should be noted that after the blue film 500 separates from the grain 600, the blue film still maintains its integrity.

[0094] Specifically, the linkage 120 is configured to amplify the rising distance of the sliding part 420 and transmit it to the outer tube 200, so that the rising speed V1 of the outer tube 200 is greater than the rising speed V2 of the inner core rod 300.

[0095] Since the lifting mechanism used in chip manufacturing has a relatively compact structure and it is not advisable to add an additional drive source, in a preferred embodiment, the linkage 120 includes: a support frame 121; a V-shaped lever plate 122, which is rotatably connected to the support frame 121 via a second rotating shaft 123; the first arm plate of the V-shaped lever plate 122 is disposed toward the sliding part 420, and the second arm plate of the V-shaped lever plate 122 abuts against the bottom of the outer sleeve 200; and the length of the first arm plate is less than the length of the second arm plate.

[0096] Linkage component 120 uses a lever structure to amplify the stroke, along the sliding part 420. Figure 4 When it rises in the direction shown by F1, it touches the first arm of the V-shaped lever plate 122, causing the V-shaped lever plate 122 to move along... Figure 4 The rotation shown in F3 drives the outer tube 200, thereby achieving differential motion between the outer tube 200 and the inner core rod 300 using a single drive unit 400, reducing the need for a drive source.

[0097] It should be noted that the structural strength of the linkage 120 meets the lifting requirements of the supporting outer sleeve 200.

[0098] Please see Figure 2 The outer tube 200 is provided with a negative pressure pipeline 220 inside its wall; one end of the negative pressure pipeline 220 is connected to an external negative pressure source, and the other end is connected to the outside through a through hole 210 in the outer tube 200 where the umbrella-shaped pin 310 is not installed, so that a negative pressure is generated between the top surface of the outer tube 200 and the blue film 500.

[0099] By applying negative pressure through the through hole 210 where the umbrella-shaped ejector pin is not installed, the top surface of the outer sleeve 200 generates an adsorption force on the blue film 500, which suppresses the overall fluctuation of the blue film 500 during the peeling process. At the same time, it also increases the adsorption force for the peeling of the blue film 500, accelerates the separation of the blue film 500 from the grains 600, and reduces the deformation of the blue film 500.

[0100] This disclosure also provides a lifting method for a lifting mechanism used in chip manufacturing as described above. By using umbrella-shaped ejector pins 310 to radially expand and support the four right angles of the die 600, the peeling force is concentrated in the right-angle area rather than the center of the die 600. This avoids micro-cracks at the edges of the die 600 caused by lifting the entire surface, ensuring the integrity of the subsequent chip structure. Heat from the heating block 320 is transferred to the adhesive at the contact point only through the ejector claws 311, significantly reducing the heat-affected zone and preventing accidental detachment of adjacent dies 600 due to adhesive softening. Simultaneously, the umbrella-shaped ejector pins 310 initiate peeling from the right angles of the die 600, and the adhesive melting area gradually expands from the outside in, avoiding violent rebound caused by the instantaneous detachment of the blue film 500, thereby eliminating the risk of displacement of surrounding dies 600.

[0101] Specifically, please refer to Figure 6 The lifting method includes:

[0102] S110: The blue film 500 with the wafer attached is placed above the lifting mechanism for chip production by an external conveying mechanism;

[0103] S120: The position of the frame 100 is adjusted by the external position adjustment structure so that the umbrella-shaped pins 310 of the inner core rod 300 are aligned with the corresponding grains 600.

[0104] S130: The heating block 320 starts heating and transfers the heat to the umbrella-shaped ejector pin 310;

[0105] S140: The driving component 400 drives the inner core rod 300 to rise, so that the umbrella-shaped ejector pin 310 extends out of the through hole 210 at the top of the outer tube 200. The umbrella-shaped ejector pin 310 opens radially outward and supports the four right angles of the grain 600.

[0106] S150: The adhesive corresponding to the contact point between the umbrella-shaped ejector pin 310 and the blue film 500 is melted by the umbrella-shaped ejector pin 310, and the drive unit 400 continues to drive the umbrella-shaped ejector pin 310 to rise until the die 600 separates from the wafer.

[0107] It should be noted that after step S150, the crystal 600 is picked up by the crystal picking device set on the top of the crystal 600 to complete the removal of the crystal 600. At the same time, the driving member 400 drives the inner core rod 300 to descend, so that the umbrella-shaped ejector pin 310 is reset.

[0108] After the die 600 on the blue film 500 is removed, the blue film 500 is removed from the external support frame, and the next wafer is placed in the external support frame to continue the material removal process.

[0109] Step S140 further includes: when the sliding part 420 rises, triggering the linkage 120 to drive the outer sleeve 200 to rise, so as to retract the umbrella-shaped pin 310 radially inward, so as to gradually separate the blue film 500 opposite the umbrella-shaped pin 310 from the four right angles of the grain 600 inward.

[0110] In summary, this invention provides a lifting mechanism and lifting method for chip manufacturing. The lifting mechanism includes: a frame 100; an outer tube 200 disposed at the top of the frame 100; and an inner core rod 300 that passes through the outer tube 200 and extends into the frame 100, with an umbrella-shaped pin 310 at its top. A heating block 320 is also disposed at the top of the inner core rod 300. The umbrella-shaped pin 310 is made of a thermally conductive material and is used to lift the chip... The heat generated by the heating block 320 is transferred to the umbrella-shaped ejector pin 310. The driving member 400 drives the inner core rod 300 to rise, causing the umbrella-shaped ejector pin 310 to extend from the through-hole 210 at the top of the outer sleeve 200. The umbrella-shaped ejector pin 310 opens radially outward to support the four right angles of the die 600 on the wafer above the blue film 500, and melts the adhesive corresponding to the contact points between the umbrella-shaped ejector pin 310 and the blue film 500, facilitating the separation and detachment of the die 600 from the wafer. By supporting the four right angles of the die 600 after the umbrella-shaped ejector pin 310 expands radially, the peeling force is concentrated in the right-angle area rather than the center of the die 600, avoiding micro-cracks at the edges of the die 600 caused by lifting the entire surface, thus ensuring the integrity of the subsequent chip structure. Heat from the heating block 320 is transferred to the adhesive at the contact point only through the push claw 311, significantly reducing the heat-affected zone and preventing accidental detachment of adjacent grains 600 due to adhesive softening. Simultaneously, the umbrella-shaped push pin 310 initiates peeling from the right angle of the grain 600, and the adhesive melting area gradually expands from the outside in, avoiding violent rebound caused by the sudden detachment of the blue film 500, thus eliminating the risk of displacement of surrounding grains 600.

[0111] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0112] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence unless expressly indicated herein. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed above may be referred to as a second element, component, region, layer, or segment.

[0113] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “below” other elements or features would be oriented as “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0114] In the above discussion, unless otherwise stated, when used to describe numerical values, the terms “about,” “approximately,” “basically,” etc., indicate a change of + / - 10% in that value.

[0115] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A lifting mechanism for chip manufacturing, characterized in that, include: Frame (100); Outer tube (200), which is disposed on top of the frame (100); The inner core rod (300) passes through the outer sleeve (200) and extends into the frame (100), and the top of the inner core rod (300) is provided with an umbrella-shaped pin (310). The inner core rod (300) is provided with a heating block (320) at the top. The umbrella-shaped pin (310) is made of a heat-conducting material and is used to transfer the heat generated by the heating block (320) to the umbrella-shaped pin (310). A drive unit (400) is used to drive the inner core rod (300) to rise so that the umbrella-shaped ejector pin (310) extends out of the through hole (210) at the top of the outer sleeve (200). The umbrella-shaped ejector pin (310) opens radially outward to support the four right angles of the wafer grains (600) above the blue film (500) and melt the glue corresponding to the contact point between the umbrella-shaped ejector pin (310) and the blue film (500) so as to separate the grains (600) from the wafer. The umbrella-shaped apex (310) includes: The needle bar (312) is elastically connected at its bottom to the top surface of the inner core rod (300) via a buffer spring (314); Four top claws (311) are rotatably disposed on the top of the needle bar (312) and arranged along the circumference of the needle bar (312); After the umbrella-shaped pin (310) extends from the through hole (210) at the top of the outer sleeve (200), the four pin claws (311) open radially outward to support the four right angles of the wafer grains (600) above the blue film (500). The lower end of the top claw (311) is provided with a slot (3111). The top of the needle bar (312) is provided with an insert (3121). The insertion block (3121) of the needle bar and the slot (3111) of the top claw (311) are connected by a first rotating shaft (313).

2. The lifting mechanism for chip manufacturing as described in claim 1, characterized in that, The drive unit (400) includes: A linear drive unit (410) is disposed within the frame (100); A sliding part (420) is provided on the linear drive part (410). The inner core rod (300) is disposed on the top of the sliding part (420); When the linear drive unit (410) drives the sliding unit (420) to rise and fall, it simultaneously drives the inner core rod (300) to rise and fall.

3. The lifting mechanism for chip manufacturing as described in claim 2, characterized in that, The top of the frame (100) is also provided with a guide rod (110). The bottom of the outer sleeve (200) is fitted onto the guide rod (110) and is slidably connected to the frame (100) through the guide rod (110); The inner wall of the frame (100) is provided with a linkage (120). When the sliding part (420) rises, the linkage (120) is triggered to drive the outer tube (200) to rise, so that the umbrella-shaped pin (310) is driven to retract radially inward through the outer tube, so that the blue film (500) opposite the umbrella-shaped pin (310) is gradually separated from the four right angles of the grain (600) inward.

4. The lifting mechanism for chip manufacturing as described in claim 3, characterized in that, The linkage (120) is configured to amplify the rising distance of the sliding part (420) and transmit it to the outer tube (200) so that the rising speed V1 of the outer tube (200) is greater than the rising speed V2 of the inner core rod (300).

5. The lifting mechanism for chip manufacturing as described in claim 4, characterized in that, The linkage (120) includes: Support frame (121); V-shaped lever plate (122) is rotatably connected to the support frame (121) via a second rotating shaft (123); The first arm of the V-shaped lever plate (122) is disposed toward the sliding part (420), and the second arm of the V-shaped lever plate (122) abuts against the bottom of the outer sleeve (200); Furthermore, the length of the first arm plate is less than the length of the second arm plate.

6. The lifting mechanism for chip manufacturing as described in claim 1, characterized in that, The outer sleeve (200) is provided with a negative pressure pipeline (220) inside its wall. One end of the negative pressure pipeline (220) is connected to an external negative pressure source, and the other end is connected to the outside through a through hole (210) in the outer tube (200) where the umbrella-shaped pin (310) is not installed, so that negative pressure is generated between the top surface of the outer tube (200) and the blue film (500).

7. A lifting method applied to the lifting mechanism for chip manufacturing as described in claim 1, characterized in that, The lifting method includes: The blue film (500) with the wafer attached is placed above the lifting mechanism for chip production by an external conveying mechanism; The position of the frame (100) is adjusted by adjusting the external position structure so that the umbrella-shaped pins (310) of the inner core rod (300) are opposite to the corresponding grains (600); The heating block (320) begins to heat up and transfers the heat to the umbrella-shaped apex (310); The driving element (400) drives the inner core rod (300) to rise so that the umbrella-shaped ejector pin (310) extends out of the through hole (210) at the top of the outer tube (200), the umbrella-shaped ejector pin (310) opens radially outward and supports the four right angles of the grain (600); The adhesive corresponding to the contact point between the umbrella-shaped ejector pin (310) and the blue film (500) is melted by the umbrella-shaped ejector pin (310), and the umbrella-shaped ejector pin (310) continues to rise through the drive unit (400) until the die (600) separates and falls off from the wafer.

8. The lifting method of the lifting mechanism for chip manufacturing as described in claim 7, characterized in that, The drive unit (400) includes: A linear drive unit (410) is disposed within the frame (100); A sliding part (420) is provided on the linear drive part (410). The inner core rod (300) is disposed on the top of the sliding part (420); When the linear drive unit (410) drives the sliding unit (420) to rise and fall, it simultaneously drives the inner core rod (300) to rise and fall. The top of the frame (100) is also provided with a guide rod (110). The bottom of the outer sleeve (200) is fitted onto the guide rod (110) and is slidably connected to the frame (100) through the guide rod (110); The inner wall of the frame (100) is provided with a linkage (120). The step of the drive member (400) driving the inner core rod (300) to rise so that the umbrella-shaped ejector pin (310) extends out of the through hole (210) at the top of the outer tube (200), and the umbrella-shaped ejector pin (310) opens radially outward and supports the four right angles of the grain (600) further includes: When the sliding part (420) rises, the linkage (120) is triggered to drive the outer tube (200) to rise, so that the umbrella-shaped pin (310) is driven to retract radially inward through the outer tube, so that the blue film (500) opposite the umbrella-shaped pin (310) is gradually separated from the four right angles of the grain (600) inward.

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