Flexible clamp and image detection combined flexible circuit board processing system and process

Abstract

The invention relates to the technical field of flexible circuit boards, in particular to a flexible clamp and image detection combined flexible circuit board processing system and process, and the system comprises a main control unit, a flexible clamp and an identification unit. The process comprises the following steps: A, clamping a flexible circuit board by using a flexible clamp, and transmitting data of each sensor to a main control unit; b, the main control unit calculates the deformation condition of the flexible circuit board according to the data of each sensor, and adjusts the pressure of the flexible clamp for clamping the flexible circuit board according to the deformation condition; c, acquiring a three-dimensional image of the flexible circuit board through the identification unit and transmitting the three-dimensional image to the main control unit; d, the main control unit analyzes the three-dimensional image and calculates deformation data of the flexible circuit board; and E, in combination with the deformation data and a pre-input machining position, calculating to obtain an actual machining position. The clamping force can be adjusted according to the stress distribution of the flexible circuit board, and the machining position is compensated and adjusted after three-dimensional image analysis.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and in particular to a flexible circuit board processing system and process combining a flexible fixture with image detection. Background Art

[0002] Flexible printed circuits (FPCs), also known as flexible circuit boards, are widely used in high-density electronic products such as mobile devices and wearables due to their excellent flexibility and thinness. However, during automated optical inspection (AOI), the flexible nature of FPCs can easily cause the substrate to warp, wrinkle, or locally deform due to mechanical clamping or temperature fluctuations. This can lead to distorted solder joint imaging, making it difficult to determine offset or cold solder joints, and affecting product inspection accuracy.

[0003] To address this situation, existing technologies offer some correction solutions for fixtures and imaging. However, most of these solutions are limited to single-aspect compensation when dealing with FPC deformation, and lack a technical solution that can comprehensively consider fixture adaptability, deformation perception, and image compensation. Summary of the Invention

[0004] In response to the problems of the prior art, the present invention provides a flexible circuit board processing system and process combining a flexible clamp with image detection, which can adjust the clamping force according to the force distribution of the flexible circuit board and compensate and adjust the processing position through three-dimensional image analysis.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions: The present invention provides a system comprising a main control unit, a flexible clamp, and an identification unit. The clamp comprises a support member, a pressing member, and a clamping drive mechanism. The support member and the pressing member cooperate to fix the flexible circuit board. The clamping drive mechanism drives the pressing member and the support member toward or away from each other. The support member and the pressing member each have a contact surface made of elastic material, and a plurality of sensors are disposed within the contact surface. The sensors and the clamping drive mechanism are both connected to the main control unit by signal. The recognition unit is used to obtain a three-dimensional image of the flexible circuit board clamped by the flexible clamp, and the recognition unit is connected to the main control unit by signal; The main control unit is used to adjust the holding force of the holding member on the flexible circuit board according to the data transmitted by the sensor; and to infer the deformation of the flexible circuit board based on the three-dimensional image of the flexible circuit board to determine the actual processing position of the flexible circuit board.

[0006] Furthermore, the support member includes a support body and several positioning modules arranged on the support body, the contact surface is arranged on the support body, the positioning module is used to adjust the position according to the hole position of the flexible circuit board to insert into the hole position of the flexible circuit board; the holding member is provided with a positioning hole for accommodating the positioning module.

[0007] Furthermore, the positioning module includes a moving block, a positioning column and a translation driver. The support body is provided with a clearance hole, and the ratio of the inner diameter of the clearance hole to the outer diameter of the positioning column is k, 1<k≤1.3; the positioning column is arranged at the top of the moving block, the positioning column is located in the support body and protrudes to the top of the support body through the clearance hole, and the translation driver is used to drive the moving block to move; the inner diameter of the positioning hole is adapted to the inner diameter of the clearance hole.

[0008] Furthermore, it also includes a visual device, which is used to capture an image of the flexible circuit board to be placed on the supporting body. The main control unit obtains the image captured by the visual device and analyzes the hole coordinates of the flexible circuit board from the image.

[0009] Furthermore, the pressing member includes a pressing body and an airbag member arranged at the bottom of the pressing body, the contact surface is arranged at the bottom of the airbag member, and the airbag member is connected to an air supply module, which is used to inflate and deflate the airbag to control the air pressure value inside the airbag.

[0010] The present invention also provides a process based on the above system, comprising the following steps: A. Use a flexible fixture to clamp the flexible circuit board and transmit the data of each sensor to the main control unit; B. The main control unit calculates the deformation of the flexible circuit board based on the data from each sensor and adjusts the pressure of the flexible clamp holding the flexible circuit board according to the deformation; C. Obtain a three-dimensional image of the flexible circuit board through the recognition unit and transmit it to the main control unit; D. The main control unit analyzes the 3D image and calculates the deformation data of the flexible circuit board; E. Combine the deformation data and the pre-input processing position to calculate the actual processing position.

[0011] Furthermore, step A specifically includes: Acquire an image of one side of the flexible circuit board; Analyze the image to obtain the hole position information of the flexible circuit board; According to the hole position information of the flexible circuit board, each translation driver is controlled to move so that each positioning post is aligned with each hole position one by one; Place the flexible circuit board on the support member, and insert the positioning posts into the holes in a one-to-one correspondence manner; The clamping drive mechanism drives the holding member down to a specific height, and then the air supply module supplies air to the airbag member to expand the airbag member, and the airbag member is used to press the flexible circuit board to the support member; The hole information of the flexible circuit board includes the hole quantity, hole coordinates and hole diameter.

[0012] Furthermore, the sensor is a pressure sensor; the main control unit calculates the deformation of the flexible circuit board based on the data of each sensor, specifically including: Generate a force distribution diagram of the flexible circuit board based on the pressure values ​​transmitted by each pressure sensor; Obtain performance parameters of flexible circuit boards; Combining the performance parameters of the flexible circuit board and the force distribution diagram, the deformation of the flexible circuit board is obtained; Among them, the performance parameters of the flexible circuit board include the substrate thickness of the flexible circuit board, the copper foil thickness and the temperature of the flexible circuit board.

[0013] Furthermore, adjusting the pressure of the flexible clamp holding the flexible circuit board according to the deformation condition specifically includes: B 'determines whether the deformation of the flexible circuit board is within a preset range, if so, proceed directly to step C, otherwise execute B''; B''. Control the air supply module to deflate the airbag until the deformation of the flexible circuit board is within a preset range, and then execute step C.

[0014] Furthermore, step E specifically includes: E1. Using the deformation data of the flexible printed circuit board, calculate the deformation compensation matrix using the B-spline interpolation algorithm; E2. Process the preset ideal flexible circuit board image using the deformation compensation matrix to obtain an imaging result; E3. Obtain the processing position on the imaging result and mark the processing position on the flexible circuit board.

[0015] Beneficial effects of the present invention: The present invention achieves stable clamping of the flexible circuit board through a flexible clamp, and utilizes the sensor of the flexible clamp to obtain the deformation of the flexible circuit board, thereby adjusting the clamping pressure; in addition, the present invention also utilizes an identification unit to obtain a three-dimensional image of the flexible circuit board, and utilizes three-dimensional image analysis to obtain the actual processing position of the flexible circuit board, thereby improving the accuracy and reliability of solder joint detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention.

[0017] Figure 2 Schematic diagram of the interior of the support member of the present invention.

[0018] Figure 3 It is a process flow chart of the present invention.

[0019] Figure numerals: 1—flexible clamp, 2—identification unit, 3—support member, 4—pressing member, 5—clamping drive mechanism, 6—contact surface, 7—sensor, 30—clearance hole, 31—support body, 32—positioning module, 33—moving block, 34—positioning column, 35—translation driver, 36—visual device, 40—positioning hole, 41—pressing body, 42—airbag member. DETAILED DESCRIPTION

[0020] In order to facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the embodiments and the accompanying drawings. The contents mentioned in the embodiments are not intended to limit the present invention. The present invention will be described in detail below with reference to the accompanying drawings.

[0021] Example 1 This embodiment provides a flexible circuit board processing system that combines a flexible fixture with image detection, including a main control unit, a flexible fixture 1, and an identification unit 2. The fixture includes a support member 3, a holding member 4, and a clamping drive mechanism 5. The support member 3 and the holding member 4 cooperate to fix the flexible circuit board, and the clamping drive mechanism 5 is used to drive the holding member 4 and the support member 3 toward or away from each other. The support member 3 and the holding member 4 each have a contact surface 6 made of elastic material, and multiple sensors 7 are disposed within the contact surface 6. The sensors 7 and the clamping drive mechanism 5 are both connected to the main control unit by signal. The recognition unit 2 is used to obtain a three-dimensional image of the flexible circuit board clamped by the flexible clamp 1, and the recognition unit 2 is connected to the main control unit by signal; The main control unit is used to adjust the holding force of the holding member 4 on the flexible circuit board according to the data transmitted by the sensor 7; and to infer the deformation of the flexible circuit board based on the three-dimensional image of the flexible circuit board to determine the actual processing position of the flexible circuit board.

[0022] It should be noted that the elastic material described in this embodiment is preferably a commonly used material with a certain elasticity, such as silicone, so as to ensure that the elasticity will not cause damage to the surface of the soft circuit board.

[0023] The present invention adopts a flexible clamp 1, specifically a contact surface 6 of the flexible clamp 1 that contacts the flexible circuit board, and uses multiple sensors 7 embedded in the contact surface 6 to provide feedback on the pressure applied to the flexible circuit board (based on Newton's third law), so that the main control unit can draw a force distribution diagram of the flexible circuit board according to the data fed back by each sensor 7. The deformation of the flexible circuit board can be inferred based on the force distribution diagram of the flexible circuit board, and the clamping drive mechanism 5 is adjusted according to the deformation to increase / decrease the clamping force of the holding member 4 on the flexible circuit board, thereby ensuring stable clamping of the flexible circuit board while minimizing the deformation of the flexible circuit board.

[0024] The recognition unit 2 is preferably a camera that uses binocular stereo vision technology to achieve three-dimensional scanning of the flexible circuit board, thereby obtaining an actual stereo image of the flexible circuit board. The deformation position, deformation amplitude, etc. of the flexible circuit board are analyzed based on the actual stereo image, and these data are combined with a preset image. The actual processing position of the flexible circuit board can be effectively obtained, thereby achieving the effect of improving the processing accuracy.

[0025] That is to say, the present invention achieves the effect of adjusting the force of clamping the flexible circuit board based on the clamping and pressure feedback of the flexible clamp 1 on the flexible circuit board, which is beneficial to reducing the deformation of the flexible circuit board caused by clamping; the image of the flexible circuit board is directly obtained through the recognition unit 2, and the deformation position, deformation amplitude and other parameters of the flexible circuit board are compared with the pre-stored image of the ideal state, so as to fine-tune the processing position of the flexible circuit board to ensure that the processing position obtained after the deformation is more accurate.

[0026] Due to defects in existing processes, there will be a small error in the hole position of the flexible circuit board. This error will cause the flexible circuit board to be pulled or squeezed when the positioning module 32 of the fixture is inserted into the hole, thereby causing deformation of the flexible circuit board and changes in internal stress.

[0027] Based on this, in this embodiment, the support member 3 includes a support body 31 and a plurality of positioning modules 32 arranged on the support body 31, the contact surface 6 is arranged on the support body 31, and the positioning module 32 is used to adjust the position according to the hole position of the flexible circuit board to insert into the hole position of the flexible circuit board; the holding member 4 is provided with a positioning hole 40 for accommodating the positioning module 32.

[0028] That is, the positioning module 32 has a movable effect, and the position of the positioning module 32 can be fine-tuned according to the actual position of the hole of the flexible circuit board to ensure that the positioning module 32 can be accurately inserted into the hole without pulling the flexible circuit board, and cooperate with the clamping drive mechanism 5 to control the pressure applied by the pressing part 4 to further reduce the deformation of the flexible circuit board.

[0029] Specifically, the positioning module 32 includes a moving block 33, a positioning column 34 and a translation driver 35. The support body 31 is provided with a clearance hole 30. The ratio of the inner diameter of the clearance hole 30 to the outer diameter of the positioning column 34 is k, 1<k≤1.3; the positioning column 34 is arranged at the top of the moving block 33, the positioning column 34 is located in the support body 31 and protrudes to the top of the support body 31 through the clearance hole 30, and the translation driver 35 is used to drive the moving block 33 to move; the inner diameter of the positioning hole 40 is adapted to the inner diameter of the clearance hole 30.

[0030] In actual use, the clamping drive mechanism 5 is preferably a linear motor, and the translation drive 35 is preferably a linear drive module with movement in the X-axis and Y-axis directions, so as to have a high-precision linear drive effect and avoid excessive movement amplitude.

[0031] After determining the specific position of the hole of the flexible circuit board, the main control unit will match the positioning module 32 with the hole, and then control the positioning module 32 to move an appropriate amplitude to just insert it into the hole of the flexible circuit board to avoid pulling the flexible circuit board due to deviation.

[0032] It's important to note that typically, the hole position deviation of a flexible circuit board (FPCB) should not be excessively large, as this would affect the FPCB's performance and typically result in scrapping. Therefore, the inner diameter of the clearance hole 30 provided in the present invention, which allows for positioning post 34, is only slightly larger than that of the post 34, allowing the post 34 to move and adapt to the hole position of the FPCB. This clearance hole 30's inner diameter does not leave an excessive gap with the post 34, thus preventing the FPCB from deforming significantly when clamped.

[0033] In the above-mentioned "determining the specific position of the hole position of the flexible circuit board", it can be obtained through the recognition unit 2, or in the following manner: this embodiment also includes a visual device 36, which is used to capture an image of the flexible circuit board to be placed on the support body 31. The main control unit obtains the image captured by the visual device 36 and analyzes the hole position coordinates of the flexible circuit board from the image.

[0034] That is, a special visual device 36 (camera) is used to obtain an image of the flexible circuit board, and the image is analyzed to obtain the specific position of the required hole.

[0035] In this embodiment, the pressing member 4 includes a pressing body 41 and an airbag member 42 arranged at the bottom of the pressing body 41, the contact surface 6 is arranged at the bottom of the airbag member 42, and the airbag member 42 is connected to an air supply module, which is used to inflate and deflate the airbag to control the air pressure value inside the airbag.

[0036] Specifically, the holding element 4 uses the airbag 42 to hold the flexible circuit board. This ensures flexible contact with the flexible circuit board without causing significant deformation. The internal air pressure of the airbag 42 can be adjusted via the air supply module, which, in conjunction with the clamping drive mechanism 5, achieves a two-stage adjustment effect, thereby achieving high-precision adjustment of the holding force on the flexible circuit board.

[0037] It should be noted that the number of airbag components 42 should not exceed three. In this embodiment, there are three airbag components 42, and positioning holes 40 are formed between adjacent airbag components 42. When multiple airbag components 42 are used, the three airbag components 42 should be connected simultaneously using the contact surface 6 supported by the elastic material. The advantage of this method is that the air pressure value of each airbag component 42 can be adjusted accordingly according to the pressure value at different positions, achieving a higher precision effect.

[0038] Example 2 This embodiment provides a process for a flexible circuit board processing system based on the flexible clamp 1 described in Example 1 combined with image detection, characterized in that it includes the following steps: A. Use the flexible clamp 1 to clamp the flexible circuit board and transmit the data of each sensor 7 to the main control unit; B. The main control unit calculates the deformation of the flexible circuit board based on the data from each sensor 7 and adjusts the pressure of the flexible clamp 1 holding the flexible circuit board according to the deformation; C. Obtaining a three-dimensional image of the flexible circuit board through the recognition unit 2 and transmitting it to the main control unit; D. The main control unit analyzes the 3D image and calculates the deformation data of the flexible circuit board; E. Combine the deformation data and the pre-input processing position to calculate the actual processing position.

[0039] The process of this embodiment is specifically applied to the system described in Example 1. By using the system described in Example 1, specific compensation adjustment for the actual processing position of the flexible circuit board is achieved, thereby ensuring that the processing position does not deviate too much from the expected position.

[0040] In this embodiment, step A specifically includes: Acquire an image of one side of the flexible circuit board through the visual device 36; Analyze the image to obtain the hole position information of the flexible circuit board; According to the hole position information of the flexible circuit board, each translation driver 35 is controlled to move so that each positioning post 34 is aligned with each hole position one by one; Place the flexible circuit board on the support 3, and insert each positioning post 34 into each hole in a one-to-one correspondence; The clamping drive mechanism 5 drives the holding member 4 down to a specific height, and then the air supply module supplies air to the airbag member 42 to expand the airbag member 42, and the airbag member 42 is used to press the flexible circuit board to the support member 3; The hole information of the flexible circuit board includes the hole quantity, hole coordinates and hole diameter.

[0041] That is, for the flexible circuit board, after the visual device 36 obtains its image, the shape of the flexible circuit board is extracted from the image, and a rectangular pattern is made with the shape as the center. Then, the lower left corner of the rectangular pattern is used as the zero point component plane rectangular coordinate system, and then the center point of each hole is generated in the plane rectangular coordinate system; then the translation driver 35 moves the corresponding positioning column 34 according to the center point coordinate, so that the center point of the positioning column 34 coincides with the center point of the hole, which can ensure that the positioning column 34 is inserted into the hole without causing pulling on the hole, so as to reduce the internal stress change and deformation degree of the flexible circuit board.

[0042] In this embodiment, the sensor 7 is a pressure sensor; the main control unit calculates the deformation of the flexible circuit board based on the data of each sensor 7, specifically including: Generate a force distribution diagram of the flexible circuit board based on the pressure values ​​transmitted by each pressure sensor; Obtain performance parameters of flexible circuit boards; Combining the performance parameters of the flexible circuit board and the force distribution diagram, the deformation of the flexible circuit board is obtained; Among them, the performance parameters of the flexible circuit board include the substrate thickness of the flexible circuit board, the copper foil thickness and the temperature of the flexible circuit board.

[0043] Before processing, staff are required to input the performance parameters that affect the deformation of the flexible circuit board into the main control unit, which will then adapt it. Then, when the pressure sensor feeds back the sensed pressure to the main control unit, the main control unit can obtain the deformation of the flexible circuit board based on the force distribution diagram and the performance parameters. Based on the deformation and the force distribution diagram, the pressure value applied by the holding part 4 can be adjusted, thereby minimizing the deformation of the flexible circuit board while ensuring stable clamping.

[0044] Specifically, adjusting the pressure of the flexible clamp 1 holding the flexible circuit board according to the deformation condition includes: B 'determines whether the deformation of the flexible circuit board is within a preset range, if so, proceed directly to step C, otherwise execute B''; B''. Control the air supply module to deflate the airbag member 42 until the deformation of the flexible circuit board is within a preset range, and then execute step C.

[0045] That is, by inflating and deflating the airbag 42 , the pressure value can be effectively adjusted to control the deformation of the flexible circuit board to be within the preset range calculated by the force distribution diagram, so as to facilitate subsequent processing.

[0046] In this embodiment, step E specifically includes: E1. Using the deformation data of the flexible printed circuit board, calculate the deformation compensation matrix using the B-spline interpolation algorithm; E2. Process the preset ideal flexible circuit board image using the deformation compensation matrix to obtain an imaging result; E3. Obtain the processing position on the imaging result and mark the processing position on the flexible circuit board.

[0047] In actual use, the B-spline interpolation algorithm, deformation compensation matrix, etc. can be experimentally derived by those skilled in the art based on corresponding technologies. Since the specific implementation plans adopted by different flexible circuit boards may be different, they will not be described in detail here.

[0048] By using a three-dimensional image of a stably clamped flexible circuit board, the actual shape of the flexible circuit board can be effectively determined, such as the location and number of bends and wrinkles. These information cannot be directly derived from the force distribution diagram and can only be obtained through image analysis. After obtaining the actual shape of the flexible circuit board, these shapes can be numerically processed and then calculated to determine the difference between the actual shape of the flexible circuit board and the ideal shape. By processing these differences through a deformation compensation matrix, the deviation between the actual processing position and the ideal processing position can be determined. Therefore, the actual processing position can be manipulated during processing to ensure that the flexible circuit board is smoothly processed to the desired effect.

[0049] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are all within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A flexible circuit board processing system combining a flexible fixture and image detection, comprising a main control unit, a flexible fixture and an identification unit, characterized in that: The clamp includes a support member, a holding member, and a clamping drive mechanism. The support member and the holding member cooperate to fix the flexible circuit board, and the clamping drive mechanism is used to drive the holding member and the support member toward or away from each other. The support member and the holding member each have a contact surface made of elastic material, and multiple sensors are provided on the contact surface. The sensors and the clamping drive mechanism are both connected to the main control unit by signal. The recognition unit is used to obtain a three-dimensional image of the flexible circuit board clamped by the flexible clamp, and the recognition unit is connected to the main control unit by signal; The main control unit is used to adjust the holding force of the holding member on the flexible circuit board according to the data transmitted by the sensor; and to infer the deformation of the flexible circuit board based on the three-dimensional image of the flexible circuit board to determine the actual processing position of the flexible circuit board.

2. The flexible circuit board processing system combining a flexible fixture and image detection according to claim 1 is characterized in that: The support member includes a support body and several positioning modules arranged on the support body. The contact surface is arranged on the support body. The positioning modules are used to adjust their positions according to the holes of the flexible circuit board so as to be inserted into the holes of the flexible circuit board. The holding member is provided with positioning holes for accommodating the positioning modules.

3. The flexible circuit board processing system combining a flexible fixture and image detection according to claim 2 is characterized in that: The positioning module includes a moving block, a positioning column and a translation driver. The support body is provided with a clearance hole. The ratio of the inner diameter of the clearance hole to the outer diameter of the positioning column is k, 1<k≤1.3; the positioning column is arranged at the top of the moving block, the positioning column is located in the support body and protrudes to the top of the support body through the clearance hole. The translation driver is used to drive the moving block to move; the inner diameter of the positioning hole is adapted to the inner diameter of the clearance hole.

4. The flexible circuit board processing system combining a flexible fixture and image detection according to claim 2 is characterized in that: It also includes a visual device for capturing an image of the flexible circuit board to be placed on the supporting body. The main control unit acquires the image captured by the visual device and analyzes the hole coordinates of the flexible circuit board from the image.

5. The flexible circuit board processing system combining a flexible fixture and image detection according to claim 1 is characterized in that: The pressing member includes a pressing body and an airbag member arranged at the bottom of the pressing body. The contact surface is arranged at the bottom of the airbag member. The airbag member is connected to an air supply module, which is used to inflate and deflate the airbag to control the air pressure value in the airbag.

6. A process for a flexible circuit board processing system based on the flexible fixture according to any one of claims 1 to 5 combined with image detection, characterized in that: The following steps are involved: A. Use a flexible fixture to clamp the flexible circuit board and transmit the data of each sensor to the main control unit; B. The main control unit calculates the deformation of the flexible circuit board based on the data from each sensor and adjusts the pressure of the flexible clamp holding the flexible circuit board according to the deformation; C. Obtain a three-dimensional image of the flexible circuit board through the recognition unit and transmit it to the main control unit; D. The main control unit analyzes the 3D image and calculates the deformation data of the flexible circuit board; E. Combine the deformation data and the pre-input processing position to calculate the actual processing position.

7. The method according to claim 6, characterized in that Step A specifically includes: Acquire an image of one side of the flexible circuit board; Analyze the image to obtain the hole position information of the flexible circuit board; According to the hole position information of the flexible circuit board, each translation driver is controlled to move so that each positioning post is aligned with each hole position one by one; Place the flexible circuit board on the support member, and insert the positioning posts into the holes in a one-to-one correspondence manner; The clamping drive mechanism drives the holding member down to a specific height, and then the air supply module supplies air to the airbag member to expand the airbag member, and the airbag member is used to press the flexible circuit board to the support member; The hole information of the flexible circuit board includes the hole quantity, hole coordinates and hole diameter.

8. The method according to claim 6, characterized in that The sensor is a pressure sensor; the main control unit calculates the deformation of the flexible circuit board based on the data of each sensor, specifically including: Generate a force distribution diagram of the flexible circuit board based on the pressure values ​​transmitted by each pressure sensor; Obtain performance parameters of flexible circuit boards; Combining the performance parameters of the flexible circuit board and the force distribution diagram, the deformation of the flexible circuit board is obtained; Among them, the performance parameters of the flexible circuit board include the substrate thickness of the flexible circuit board, the copper foil thickness and the temperature of the flexible circuit board.

9. The process according to claim 8, characterized in that The adjusting the pressure of the flexible clamp holding the flexible circuit board according to the deformation specifically includes: B 'determines whether the deformation of the flexible circuit board is within a preset range, if so, proceed directly to step C, otherwise execute B''; B''. Control the air supply module to deflate the airbag until the deformation of the flexible circuit board is within a preset range, and then execute step C.

10. The process according to claim 8, characterized in that Step E specifically includes: E1. Using the deformation data of the flexible printed circuit board, calculate the deformation compensation matrix using the B-spline interpolation algorithm; E2. Process the preset ideal flexible circuit board image using the deformation compensation matrix to obtain an imaging result; E3. Obtain the processing position on the imaging result and mark the processing position on the flexible circuit board.

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