Half-hole machining device for PCB production

Abstract

The invention relates to the technical field of PCB machining equipment, in particular to a semi-hole machining device for PCB production. Comprising a supporting frame, a two-dimensional translation table, a drilling machine and an electric sliding table, the two-dimensional translation table is installed on the supporting frame, the drilling machine is installed on a sliding block of the two-dimensional translation table, and the electric sliding table is further installed on the supporting frame. According to the method, the colloid formed by adhering the hot melt adhesive to the side face of the PCB in advance is used as a supporting structure during drilling, so that the drilling position can be arranged close to the edge of the PCB, the situation that a through hole is moved inwards to guarantee the mechanical strength like a traditional process is not needed, and the drilling efficiency is improved by melting and recycling the colloid on the side face of the PCB subsequently. A standard semi-hole structure can be directly formed without subsequent milling, the problem that a large number of base materials are cut off in the traditional process is solved, an expensive precise numerical control milling machine does not need to be relied on, and therefore the equipment investment cost is remarkably reduced, the flatness and appearance quality of the section of the semi-hole are ensured, and the machining efficiency is improved. And the product yield and reliability are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing equipment, and in particular to a half-hole processing device for PCB board production. Background Art

[0002] Printed circuit boards (PCBs) are the core carriers for electrical interconnection and component support in modern electronic devices. Their structural design and manufacturing process directly affect the performance, size and reliability of electronic products. With the rapid development of products such as smart terminals, wearable devices and IoT modules towards lightweight, miniaturization and high integration, higher requirements are placed on the space utilization and edge connection capabilities of PCBs. Against this background, half-hole technology has emerged and has been gradually promoted and applied. Half-hole refers to a partially exposed metallized hole structure formed at the edge or near-edge area of ​​the PCB board. Part of the hole is located inside the board for electrical connection, and the other part is exposed at the edge of the board. It can be used as a welding terminal to directly connect to other circuits or modules, thereby effectively saving space, improving wiring density and simplifying the assembly process.

[0003] At present, the mainstream PCB half-hole processing technology generally adopts the two-step method of "drilling through holes first, then milling to form". Specifically, a complete through hole is first drilled at a predetermined position near the edge of the PCB substrate, and the hole wall is metallized through chemical copper deposition and electroplating processes; then, high-precision CNC milling equipment is used to cut off half of the through hole along the preset center line together with the surrounding substrate, leaving the other half to form the required half-hole structure; however, this method has many technical bottlenecks and process defects: First, in order to avoid the risk of mechanical damage during the drilling process, the drilling position often needs to be appropriately moved inward in actual production to ensure sufficient material support, but this directly leads to the subsequent The subsequent milling process must remove more base material to form a standard half-hole structure, resulting in serious waste of raw materials, reducing material utilization, and generating a large amount of non-metallic waste, which increases the cost of environmental protection treatment; secondly, the subsequent milling must strictly cut along the diameter center line of the through hole, which places extremely high demands on the positioning accuracy, tool path control and clamping stability of the equipment, and relies on high-cost precision CNC equipment, which increases production investment. Even so, it is still difficult to completely avoid cutting offset, uneven cross-section and other problems caused by tool vibration, wear or uneven feed during the cutting process; in addition, the edges of the half-hole after milling often have defects such as chipping and burrs, affecting the appearance quality. Summary of the Invention

[0004] In view of this, the present invention provides a half-hole processing device for PCB board production, which can solve the problem in the prior art that, when processing half-holes on PCB boards, a large amount of base material needs to be cut off to form a standard half-hole structure, resulting in serious waste of raw materials. In addition, the subsequent milling has extremely high requirements on the positioning accuracy, tool path control and clamping stability of the equipment, resulting in high costs. In addition, the cross-section after cutting is prone to unevenness, chipped edges, burrs and other shortcomings that affect the appearance.

[0005] The technical implementation scheme of the present invention is: a half-hole processing device for PCB board production, including a support frame, a two-dimensional translation stage, a drilling machine and an electric slide, the support frame is equipped with a two-dimensional translation stage, the drilling machine is equipped on the slider of the two-dimensional translation stage, the support frame is also equipped with an electric slide, the slider of the electric slide is equipped with a support plate for supporting the PCB board, the slider of the electric slide is provided with fixed blocks at intervals, the fixed block is provided with an electric push rod, the telescopic rod of the electric push rod is connected to a blocking frame, a pressure block for pressing the PCB board is slidably provided on the blocking frame, a spring is connected between the pressure block and the blocking frame, a liquid storage barrel for storing hot melt adhesive is installed on the fixed block, the liquid storage barrel is provided with an output mechanism and a recovery mechanism, the output mechanism is used to input the hot melt adhesive melted in the liquid storage barrel into the blocking frame, and the recovery mechanism is used to recover the hot melt adhesive melted in the blocking frame into the liquid storage barrel, and a heating mechanism and a cooling mechanism are provided on the pressure block, the heating mechanism is used to heat the hot melt adhesive in the blocking frame, and the cooling mechanism is used to cool the hot melt adhesive in the blocking frame.

[0006] Optionally, the output mechanism includes a liquid infusion tube and a control valve. The liquid storage barrel and the blocking frame are connected by a liquid infusion tube, and the control valve is provided on the liquid infusion tube.

[0007] Optionally, the recovery mechanism includes a pump and a reflux pipe. The pump is installed on the side of the blocking frame. The feed port of the pump is connected to the blocking frame. The discharge port of the pump is connected to the liquid storage barrel via a reflux pipe.

[0008] Optionally, the heating mechanism includes a first electric heater and a second electric heater. The first electric heater for heating the hot melt adhesive is installed on the side of the liquid storage barrel, and the second electric heater is installed on the pressing block. The second electric heater is used to heat the pressing block.

[0009] Optionally, the cooling mechanism includes a water storage barrel, a water pump, a cooling pipe, a first connecting pipe, a second connecting pipe, a cooling box and a third connecting pipe. The water storage barrel and the cooling box are installed on the fixed block. A water pump is provided on the side of the water storage barrel. The water inlet of the water pump is connected to the water storage barrel. A cooling pipe is provided in the pressing block. One end of the cooling pipe is connected to the water outlet of the water pump via a first connecting pipe, the other end of the cooling pipe is connected to the water inlet of the cooling box via a second connecting pipe, and the water outlet of the cooling box is connected to the water storage barrel via a third connecting pipe.

[0010] Optionally, a filter frame is further included. The filter frame is slidably provided on the liquid storage barrel and is used to filter the recovered liquid hot melt adhesive.

[0011] Optionally, a limiting mechanism is also included, which includes a first magnetic block and a second magnetic block. The first magnetic block is installed on the side of the liquid storage barrel, and the second magnetic block is installed on the filter frame. The second magnetic block is adsorbed on the first magnetic block to limit the filter frame.

[0012] Optionally, an insulation pipe is also included. The outer sides of the infusion pipe and the return pipe are both sheathed with the insulation pipe, and the insulation pipe is used to insulate the liquid hot melt adhesive inside the infusion pipe and the return pipe.

[0013] The beneficial effects of the present invention are as follows: 1. By pre-adhering hot melt adhesive to form a colloid on the side of the PCB board as a support structure during drilling, the present invention allows the drilling position to be set close to the edge of the PCB board, eliminating the need to move the through hole inward to ensure mechanical strength as in traditional processes. Subsequently, by melting and recycling the colloid on the side of the PCB board, a standard half-hole structure can be directly formed without subsequent milling processing, avoiding the problem of a large amount of substrate being removed in traditional processes. In addition, there is no need to rely on expensive precision CNC milling machines, thereby significantly reducing equipment investment costs, ensuring the flatness and appearance quality of the half-hole cross-section, and improving product yield and reliability.

[0014] 2. The present invention is equipped with a hot melt adhesive output and recovery system. The colloid is melted by heating and then recovered to the liquid storage barrel by a pump. Impurities are removed through a filter frame, thereby realizing the reuse of the hot melt adhesive. This design not only reduces the cost of consumables, but also reduces waste emissions, which is in line with the development trend of green manufacturing.

[0015] 3. The heat preservation pipe of the present invention insulates the infusion pipe and the return pipe, preventing the hot melt adhesive from cooling and solidifying during the transportation process, avoiding pipe blockage, and ensuring long-term stable operation of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0017] Figure 2 It is a schematic diagram of the three-dimensional structure of the support plate, the fixing block and the electric push rod of the present invention.

[0018] Figure 3 It is a schematic diagram of the three-dimensional structure of the blocking frame, the pressing block and the spring of the present invention.

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the spring, liquid storage tank and first electric heater of the present invention.

[0020] Figure 5 It is a schematic diagram of the three-dimensional structure of the output mechanism and the recovery mechanism of the present invention.

[0021] Figure 6 It is a schematic diagram of the three-dimensional structure of the second electric heater, water storage tank and water pump of the present invention.

[0022] Figure 7 It is a schematic diagram of the three-dimensional structure of the water storage tank, water pump and cooling pipe of the present invention.

[0023] Figure 8 It is a schematic diagram of the three-dimensional structure of the cooling mechanism of the present invention.

[0024] Figure 9 It is a schematic diagram of the three-dimensional structure of the liquid storage barrel, filter frame and insulation pipe of the present invention.

[0025] Figure 10 It is a schematic diagram of the three-dimensional structure of the first magnetic block, the second magnetic block and the insulation tube of the present invention.

[0026] Figure 11 It is a schematic diagram of the three-dimensional structure of the limiting mechanism of the present invention.

[0027] Markings in the accompanying drawings: 1. support frame, 2. two-dimensional translation stage, 3. drilling machine, 4. electric slide, 5. support plate, 6. fixed block, 7. electric push rod, 8. blocking frame, 9. pressure block, 10. spring, 11. liquid storage barrel, 1301. infusion tube, 1302. control valve, 1401. suction pump, 1402. reflux pipe, 1501. first electric heater, 1502. second electric heater, 1601. water storage barrel, 1602. water pump, 1603. cooling pipe, 1604. first connecting pipe, 1605. second connecting pipe, 1606. cooling box, 1607. third connecting pipe, 17. filter frame, 18. first magnetic block, 19. second magnetic block, 20. insulation pipe. DETAILED DESCRIPTION

[0028] Embodiment: A half hole processing device for PCB board production, see Figure 1-Figure 7 As shown, it includes a support frame 1, a two-dimensional translation stage 2, a drilling machine 3 and an electric slide 4; the two-dimensional translation stage 2 is installed on the upper front side of the support frame 1, and the two-dimensional translation stage 2 can drive the slider thereon to translate left and right and up and down; the drilling machine 3 is installed on the front side of the slider of the two-dimensional translation stage 2, and the drilling machine 3 is used to drill holes in the PCB board; the electric slide 4 is installed on the lower side of the support frame 1, and the electric slide 4 can drive the slider thereon to translate forward and backward; The PCB board on the top of the support plate 5 is surrounded by a spring 10, a spring 10, a liquid storage barrel 11, an output mechanism, a recovery mechanism, a heating mechanism and a cooling mechanism; a support plate 5 is installed in the middle of the top of the slider of the electric slide 4, and the support plate 5 is used to support the PCB board; four fixed blocks 6 are evenly spaced on the top of the slider of the electric slide 4, and the four fixed blocks 6 are distributed in the front, back, left and right; two electric push rods 7 are installed on the fixed block 6; the blocking frame 8 includes a fixing frame and a baffle, and a fixing frame is connected between the telescopic rods of the two electric push rods 7 on the same fixing block 6, and the fixing frame is symmetrically provided with baffles on one side of the support plate 5, and a "mouth" shaped structure can be formed by contacting the baffles of the four blocking frames 8 to enclose the PCB board on the top of the support plate 5; a pressing block 9 is slidingly provided on the upper side of the fixing frame of the blocking frame 8, and the pressing block 9 is used to press the PCB board for limiting. The side where the four pressing blocks 9 are close to each other is provided with an inclined surface, and the pressing block 9 is made of heat-conducting material; the top of the pressing block 9 is connected to the blocking frame 8. Two springs 10 are connected between the upper sides of the fixing frame of the baffle frame 8; a liquid storage barrel 11 is installed in the middle of the top of the fixing block 6, and a barrel cover is provided on the top of the liquid storage barrel 11. By removing the barrel cover, hot melt adhesive can be added to the liquid storage barrel 11 for storage; an output mechanism and a recovery mechanism are provided on the liquid storage barrel 11. The output mechanism is used to input the melted hot melt adhesive in the liquid storage barrel 11 into the space between the baffle frame 8 and the side of the PCB board, so that the melted hot melt adhesive contacts the side of the PCB board, so that the hot melt adhesive forms a colloid adhered to the side of the PCB board after cooling; the recovery mechanism is used to recover the melted hot melt adhesive between the baffle frame 8 and the side of the PCB board into the liquid storage barrel 11 so that the hot melt adhesive can be recycled; a heating mechanism and a cooling mechanism are provided on the pressing block 9. The heating mechanism is used to heat the hot melt adhesive in the liquid storage barrel 11 and the side of the PCB board so that the hot melt adhesive melts into a liquid state; the cooling mechanism is used to cool the hot melt adhesive between the baffle frame 8 and the side of the PCB board so that the hot melt adhesive forms a colloid adhered to the side of the PCB board after cooling.

[0029] See Figure 3-Figure 5 As shown, the output mechanism includes an infusion tube 1301 and a control valve 1302; an infusion tube 1301 is connected between the lower part of the side of the liquid storage barrel 11 and the fixed frame of the blocking frame 8, and the infusion tube 1301 is used to introduce the liquid hot melt adhesive in the liquid storage barrel 11 into the space between the blocking frame 8 and the side of the PCB board; a control valve 1302 is provided on the infusion tube 1301.

[0030] See Figure 3-Figure 5 As shown, the recovery mechanism includes a pump 1401 and a reflux pipe 1402; the pumps 1401 are installed on the side of the four blocking frames 8 away from each other; the feed port of the pump 1401 is connected to the blocking frame 8, and the reflux pipe 1402 is connected between the discharge port of the pump 1401 and the barrel cover of the liquid storage barrel 11.

[0031] See Figure 3-Figure 7As shown, the heating mechanism includes a first electric heater 1501 and a second electric heater 1502; the first electric heater 1501 is installed on the lower side of the liquid storage barrel 11, and the first electric heater 1501 is used to heat the hot melt adhesive in the liquid storage barrel 11 to melt the hot melt adhesive into a liquid state; the second electric heater 1502 is installed on the top of the pressing block 9, and the second electric heater 1502 is used to heat the pressing block 9, so that the pressing block 9 heats the hot melt adhesive on the side of the PCB board through heat transfer.

[0032] See Figure 6 and Figure 7 As shown, the cooling mechanism includes a water storage barrel 1601, a water pump 1602, a cooling pipe 1603, a first connecting pipe 1604, a second connecting pipe 1605, a cooling box 1606 and a third connecting pipe 1607; the water storage barrel 1601 and the cooling box 1606 are installed on the top of the fixed block 6, and the water storage barrel 1601 and the cooling box 1606 are respectively located on both sides of the liquid storage barrel 11. A barrel cover is provided on the top of the water storage barrel 1601. By removing the barrel cover, the coolant can be added to the water storage barrel 1601 for storage; the side of the water storage barrel 1601 is provided with a cooling box 1606. A water pump 1602 is provided at the lower part of the surface, and the water inlet of the water pump 1602 is connected to the water storage barrel 1601; a cooling pipe 1603 is provided on the inner side of the pressing block 9, and the cooling pipe 1603 is a copper pipe, which is convenient for heat conduction; a first connecting pipe 1604 is connected between one end of the cooling pipe 1603 and the water outlet of the water pump 1602; a second connecting pipe 1605 is connected between the other end of the cooling pipe 1603 and the water inlet of the cooling box 1606; a third connecting pipe 1607 is connected between the water outlet of the cooling box 1606 and the water storage barrel 1601.

[0033] When in use, first remove the barrel covers of the liquid storage barrel 11 and the water storage barrel 1601, then add hot melt glue into the liquid storage barrel 11, and then add coolant into the water storage barrel 1601, then put the barrel covers of the liquid storage barrel 11 and the water storage barrel 1601 back to their original places, and then place the PCB board on the top of the support plate 5, and then drive the blocking frame 8 to move to the side close to the PCB board through the electric push rod 7, so that the blocking frame 8 drives the pressing block 9 to move to the side close to the PCB board. When the PCB board contacts the inclined surface of the pressing block 9, the inclined surface of the pressing block 9 will squeeze the PCB board to move on the top of the support plate 5, thereby adjusting the position of the PCB board, until the inclined surfaces of the four pressing blocks 9 are in contact with the PCB board, so that the PCB board is centered on the top of the support plate 5, and the PCB board is limited so that the PCB The CB board stops moving, and then when the blocking frame 8 continues to move toward the side close to the PCB board, the PCB board will squeeze the pressing block 9 to move upward, and the spring 10 is compressed, so that the pressing block 9 gradually moves into the top of the PCB board, and then the pressing block 9 presses the PCB board on the top of the support plate 5, and when the blocking frame 8 continues to move toward the side close to the PCB board, the baffle on the blocking frame 8 will contact the side of the PCB board. When the fixing frame of the blocking frame 8 contacts the side of the support plate 5, the blocking frame 8 is driven by the electric push rod 7 to stop moving. In this way, the four blocking frames 8 can form a "mouth"-shaped structure to enclose the PCB board on the top of the support plate 5, and a cavity can be formed by the closure of the baffle of the blocking frame 8, the fixing frame, the support plate 5, the side of the PCB board and the pressing block 9. The baffle of the blocking frame 8, the fixing frame and the side of the PCB board form the side of the cavity, the support plate 5 forms the bottom of the cavity, and the pressing block 9 forms the top of the cavity), and then the hot melt adhesive in the liquid storage barrel 11 is heated by the first electric heater 1501 until the hot melt adhesive melts into a liquid state, and then the control valve 1302 is opened to allow the liquid hot melt adhesive in the liquid storage barrel 11 to flow into the cavity through the infusion pipe 1301, so that the liquid hot melt adhesive fills the cavity until the liquid hot melt adhesive completes the filling of the cavity, and then the control valve 1302 is closed, and the water pump 1602 and the cooling box 1606 are turned on, so that the water pump 1602 draws the coolant in the water storage barrel 1601 into the cooling pipe 1603 through the first connecting pipe 1604, and then the cooling pipe 1606 is opened. 03 The coolant is sent into the cooling box 1606 through the second connecting pipe 1605. After being cooled in the cooling box 1606, the coolant is sent back to the water storage barrel 1601 through the third connecting pipe 1607, so that the coolant circulates among the water storage barrel 1601, the water pump 1602, the cooling pipe 1603, the first connecting pipe 1604, the second connecting pipe 1605, the cooling box 1606 and the third connecting pipe 1607. When the coolant passes through the cooling pipe 1603, the coolant cools the pressing block 9 through the heat transfer of the cooling pipe 1603, so that the pressing block 9 cools the liquid hot melt adhesive in the cavity until the liquid hot melt adhesive forms a colloid after cooling and adheres to the side of the PCB board. In this way, the four sides of the PCB board can be adhered with colloid.Then turn off the water pump 1602 and the cooling box 1606; Then, according to the next hole position to be processed on the PCB board, the corresponding electric push rod 7 is controlled to drive the corresponding blocking frame 8 to move to the side away from the PCB board and reset, so that the baffle on the blocking frame 8 is separated from the PCB board and the colloid on its side, and the blocking frame 8 drives the pressure block 9 to move to the side away from the PCB board and reset, so that the pressure block 9 does not block the next hole position to be processed on the PCB board. During this period, when the pressure block 9 is separated from the colloid on the side of the PCB board, the spring 10 returns to its original state, and the spring 10 drives the pressure block 9 to move downward and reset, and then the drilling machine 3 is driven to move left or right by the two-dimensional translation table 2 to adjust the position of the drilling machine 3, and at the same time, the support plate 5 is driven forward or backward by the electric slide 4 to move, thereby driving the PCB board forward or backward to adjust the position of the PCB board until the next hole position to be processed on the PCB board is aligned with the drilling machine 3 (the position to be drilled is set at the position where the PCB board contacts the colloid, so that the PCB board provides half a hole, and then the colloid provides half a hole), then the drilling machine 3 is started, and the drilling machine 3 is driven to move forward by the two-dimensional translation table 2 After the hole is drilled, the PCB is moved to the bottom of the support plate 5 and the colloid is moved to the bottom of the support plate 5. The PCB is moved to the bottom of the support plate 5 and the colloid is moved to the bottom of the support plate 5. The PCB is moved to the bottom of the support plate 5 and the colloid is moved to the bottom of the support plate 5. The PCB is moved to the bottom of the support plate 5 and the colloid is moved to the bottom of the support plate 5. The PCB is moved to the bottom of the support plate 5 and the colloid is moved to the bottom of the support plate 5. Repeat the above operation to complete the drilling of all the holes to be processed on the other three sides of the PCB board. When all the holes to be processed on the PCB board are completed, the second electric heater 1502 is used to heat the pressing block 9, so that the pressing block 9 heats the colloid on the side of the PCB board in the cavity through heat transfer, thereby melting the colloid on the side of the PCB board into liquid, and then exposing the outer part of the through-hole on the side of the PCB board to form a semi-hole structure. Then, the liquid hot melt adhesive in the cavity is returned to the liquid storage barrel 11 through the return pipe 1402 by the pump 1401, so as to recycle the hot melt adhesive. After the liquid hot melt adhesive in the cavity is completely extracted, the electric push rod 7 drives the blocking frame 8 to move and reset to the side away from the PCB board, so that the blocking frame 8 drives the pressing block 9 to move and reset to the side away from the PCB board, so that the pressing block 9 no longer presses the PCB board, and finally the PCB board with the semi-hole processing completed can be taken out from the top of the support plate 5.

[0034] See Figures 9-11 As shown, a filter frame 17 is also included; a filter frame 17 is slidably provided on the upper side of the liquid storage barrel 11, and the filter frame 17 is used to filter the recovered liquid hot melt adhesive.

[0035] By setting up the filter frame 17, when the liquid hot melt adhesive in the cavity flows back into the liquid storage barrel 11 through the reflux pipe 1402, the filter frame 17 will filter the liquid hot melt adhesive flowing back into the liquid storage barrel 11, so that the liquid hot melt adhesive passes through the filter frame 17 and falls into the bottom of the liquid storage barrel 11, and the impurities in the liquid hot melt adhesive remain in the filter frame 17. In this way, the filter frame 17 can be used to filter out the impurities in the liquid hot melt adhesive, thereby improving the purity of the hot melt adhesive for next use; when it is necessary to clean the impurities in the filter frame 17, the filter frame 17 is slid out of the liquid storage barrel 11, and then the impurities in the filter frame 17 are cleaned, and then the filter frame 17 is put back into the liquid storage barrel 11.

[0036] See Figure 10 and Figure 11 As shown, it also includes a limiting mechanism, which includes a first magnetic block 18 and a second magnetic block 19; the first magnetic block 18 is symmetrically installed on the upper side of the liquid storage barrel 11; the second magnetic block 19 is also symmetrically installed on the filter frame 17, and the second magnetic block 19 is used to adsorb the first magnetic block 18, thereby limiting the filter frame 17.

[0037] By setting a limiting mechanism, when the filter frame 17 is slid out of the liquid storage barrel 11, the filter frame 17 will drive the first magnetic block 18 and the second magnetic block 19 to separate. When the filter frame 17 is put back into the liquid storage barrel 11, the filter frame 17 will drive the first magnetic block 18 to contact the second magnetic block 19, so that the second magnetic block 19 adsorbs the first magnetic block 18, thereby limiting the filter frame 17 and preventing the filter frame 17 from sliding and falling accidentally.

[0038] See Figure 9 and Figure 10 As shown, an insulation tube 20 is also included; the outer sides of the infusion tube 1301 and the return tube 1402 are both sheathed with the insulation tube 20, and the insulation tube 20 is used to insulate the liquid hot melt adhesive inside the infusion tube 1301 and the return tube 1402.

[0039] By setting up the insulation tube 20, the insulation tube 20 can be used to insulate the liquid hot melt adhesive in the infusion tube 1301 and the return tube 1402, thereby ensuring the temperature of the liquid hot melt adhesive and preventing the liquid hot melt adhesive from solidifying due to cooling in the infusion tube 1301 and the return tube 1402, thereby avoiding blockage in the infusion tube 1301 and the return tube 1402.

Claims

1. A half-hole processing device for PCB board production, comprising a support frame (1), a two-dimensional translation stage (2), a drilling machine (3) and an electric slide (4), wherein the two-dimensional translation stage (2) is mounted on the support frame (1), the drilling machine (3) is mounted on the slider of the two-dimensional translation stage (2), and the electric slide (4) is also mounted on the support frame (1), wherein: A support plate (5) for supporting a PCB board is installed on the slider of the electric slide (4), a fixed block (6) is arranged at intervals on the slider of the electric slide (4), an electric push rod (7) is installed on the fixed block (6), a blocking frame (8) is connected to the telescopic rod of the electric push rod (7), a pressing block (9) for pressing the PCB board is slidably arranged on the blocking frame (8), a spring (10) is connected between the pressing block (9) and the blocking frame (8), a liquid storage barrel (11) for storing hot melt adhesive is installed on the fixed block (6), an output mechanism and a recovery mechanism are arranged on the liquid storage barrel (11), the output mechanism is used to input the hot melt adhesive melted in the liquid storage barrel (11) into the blocking frame (8), and the recovery mechanism is used to recover the hot melt adhesive melted in the blocking frame (8) into the liquid storage barrel (11), and a heating mechanism and a cooling mechanism are arranged on the pressure block (9), the heating mechanism is used to heat the hot melt adhesive in the blocking frame (8), and the cooling mechanism is used to cool the hot melt adhesive in the blocking frame (8).

2. A half-hole processing device for PCB production according to claim 1, characterized in that: The output mechanism comprises a liquid infusion tube (1301) and a control valve (1302). The liquid storage barrel (11) and the blocking frame (8) are connected via the liquid infusion tube (1301), and the control valve (1302) is provided on the liquid infusion tube (1301).

3. A half-hole processing device for PCB production according to claim 2, characterized in that: The recovery mechanism comprises a pump (1401) and a reflux pipe (1402). The pump (1401) is installed on the side of the blocking frame (8). The feed port of the pump (1401) is connected to the blocking frame (8). The reflux pipe (1402) is connected between the discharge port of the pump (1401) and the liquid storage barrel (11).

4. A half-hole processing device for PCB production according to claim 1, characterized in that: The heating mechanism includes a first electric heater (1501) and a second electric heater (1502). The first electric heater (1501) for heating the hot melt adhesive is installed on the side of the liquid storage barrel (11). The second electric heater (1502) is installed on the pressing block (9). The second electric heater (1502) is used to heat the pressing block (9).

5. A half-hole processing device for PCB production according to claim 1, characterized in that: The cooling mechanism includes a water storage barrel (1601), a water pump (1602), a cooling pipe (1603), a first connecting pipe (1604), a second connecting pipe (1605), a cooling box (1606) and a third connecting pipe (1607). The water storage barrel (1601) and the cooling box (1606) are installed on the fixed block (6). The water pump (1602) is provided on the side of the water storage barrel (1601). The water inlet of the water pump (1602) is connected to the water storage barrel (1601). 601), a cooling pipe (1603) is provided in the pressing block (9), one end of the cooling pipe (1603) is connected to the water outlet of the water pump (1602) via a first connecting pipe (1604), the other end of the cooling pipe (1603) is connected to the water inlet of the cooling box (1606) via a second connecting pipe (1605), and the water outlet of the cooling box (1606) is connected to the water storage barrel (1601) via a third connecting pipe (1607).

6. A half-hole processing device for PCB production according to claim 1, characterized in that: It also includes a filter frame (17), which is slidably provided on the liquid storage barrel (11), and the filter frame (17) is used to filter the recovered liquid hot melt adhesive.

7. A half-hole processing device for PCB production according to claim 6, characterized in that: The invention also includes a limiting mechanism, which includes a first magnetic block (18) and a second magnetic block (19). The first magnetic block (18) is installed on the side of the liquid storage barrel (11), and the second magnetic block (19) is installed on the filter frame (17). The second magnetic block (19) is adsorbed on the first magnetic block (18) and is used to limit the filter frame (17).

8. A half-hole processing device for PCB production according to claim 3, characterized in that: The invention also includes an insulation pipe (20), which is sleeved on the outside of the infusion pipe (1301) and the return pipe (1402). The insulation pipe (20) is used to insulate the liquid hot melt adhesive on the inside of the infusion pipe (1301) and the return pipe (1402).

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