Method for manufacturing circuit embedded board

Abstract

The purpose of the present invention is to provide a method for manufacturing a circuit-embedded substrate capable of improving the yield by improving the alignment accuracy of a circuit and an electrode pad. The method comprises: a film preparation step; a step for arranging two electrode pads on the thin film in a first direction; a step for forming a circuit comprising a conductive wire and embedding the circuit in the film using an ultrasonic welding machine, the circuit having a functional part of an arbitrary pattern, two wiring parts drawn out from both ends thereof, and two end parts extending in the first direction from the wiring parts so as to partially overlap the electrode pads; one end of each of the two end parts is arranged on the same side with respect to the two electrode pads in a plan view, and the ultrasonic welding machine has an amplitude transformer for embedding the conductive wire into the thin film by melting the contact surface between the thin film and the conductive wire through ultrasonic vibration, and the conductive wire led out through the interior of the amplitude transformer. The two end portions have a length that the absorption electrode pad is offset from a position of the circuit in the first direction.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a circuit-embedded substrate. Background Art

[0002] A thin film heater in which a single metal thin wire is embedded in a thin film in an arbitrary pattern is known (for example, see Patent Document 1). Figure 12 Such a thin film heater 100 comprises: a thin film 200; a quadrilateral first electrode pad 500 and a second electrode pad 600, which are arranged parallel to each other with a gap in the Y direction at the periphery of the thin film 200; and a circuit 400, which is composed of a metal thin wire 300 embedded in the thin film 200.

[0003] The circuit 400 includes a heating portion 450 having an arbitrary pattern; a first wiring portion 430 and a second wiring portion 440 extending from opposite ends of the heating portion 450; and a first end portion 410 and a second end portion 420 extending from the first wiring portion 430 and the second wiring portion 440, respectively, toward the side opposite to the heating portion 450 (the +X direction in the figure) and overlapping with the first electrode pad 500 and the second electrode pad 600, respectively. The circuit 400 is embedded by applying ultrasonic vibrations using an ultrasonic welder to melt the contact surface of the film 200 with the metal wire 300. For example, the circuit 400 can be embedded sequentially from the first end portion 410, followed by the first wiring portion 430, the heating portion 450, the second wiring portion 440, and the second end portion 420.

[0004] The first end portion 410 and the second end portion 420 extend across the first electrode pad 500 and the second electrode pad 600, respectively, in the X direction. The upper surfaces of the first electrode pad 500 and the second electrode pad 600 are electrically connected to the metal thin wire 300 connected to the upper surfaces of the first end portion 410 and the second end portion 420. When a voltage is applied to the first electrode pad 500 and the second electrode pad 600, a current is generated in the circuit 400, and the heating portion 450 generates heat.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-066706 Summary of the Invention

[0008] Technical problem to be solved by the invention

[0009] In the manufacturing method of the conventional thin film heater 100, the electrode pads 500 and 600 are first arranged on the thin film 200, and the corners of the thin film 200 are abutted against a fixture (not shown). Then, the metal wire 300 is embedded in the thin film 200 so that the first end 410 and the second end 420 overlap with the electrode pads 500 and 600. Since the configuration of the electrode pads 500 and 600 and the embedding of the metal wire 300 are different processes, the following positional offsets occur. That is, (1) positional offset of the electrode pads, (2) positional offset of the embedding of the metal wires, and (3) positional offset of the embedding of the electrode pads and the metal wires. In this manufacturing method, for example, if the configuration position of the electrode pads 500 and 600 is offset in the +Y direction of (a) of FIG. 13 , the embedding position of the metal wire 300 is correspondingly offset in the -Y direction of (a) of FIG. 13 . That is, in the conventional manufacturing method, there is a problem in that it is difficult to improve the yield rate due to the difficulty in aligning the positions of the electrode pads 500 and 600 with the circuit 400 .

[0010] The present invention is made to solve the above-mentioned technical problems, and its purpose is to provide a method for manufacturing a circuit-embedded substrate, which can improve the yield by improving the position alignment accuracy of the circuit and the electrode pad.

[0011] Technical solutions to technical problems

[0012] A first invention to achieve the above-mentioned object is a method for manufacturing a circuit-embedded substrate, comprising:

[0013] Preparation process, preparing the film;

[0014] an arranging step of arranging the first electrode pad and the second electrode pad in parallel with each other at intervals along a first direction on a peripheral portion of the first main surface of the film;

[0015] A circuit forming step of forming a circuit, wherein the circuit is arranged on the first main surface of the film and is composed of a conductive wire with an insulation coating on a metal thin wire, the circuit comprising: a functional portion having an arbitrary pattern; a first wiring portion extending from one of the two ends of the functional portion to the outside of the functional portion; a second wiring portion extending from the other of the two ends of the functional portion to the outside of the functional portion; a first end portion extending from the first wiring portion in a first direction in a manner partially overlapping with the first electrode pad and the second electrode pad; and a second end portion extending from the second wiring portion along the first end portion in a manner partially overlapping with the first electrode pad and the second electrode pad, and using an ultrasonic welding machine to embed portions of the functional portion, the first wiring portion, the second wiring portion, and the first end portion and the second end portion that do not overlap with the first electrode pad and the second electrode pad into the first main surface of the film to form the circuit;

[0016] a first connection step of removing the insulating coating of the conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad; and

[0017] The second connection process is to remove the insulating coating of the conductive wire on the second electrode pad and electrically connect the exposed metal wire to the second electrode pad.

[0018] One end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side relative to the first electrode pad and the second electrode pad in a plan view.

[0019] The ultrasonic welding machine comprises: a horn, which melts the contact surface between the film and the conductive wire by applying ultrasonic vibration, and embeds the conductive wire into the first main surface of the film; a conductive wire, which passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film.

[0020] The first end portion and the second end portion have a length sufficient to absorb positional displacement in the first direction between the first and second electrode pads and the circuit.

[0021] A second invention to achieve the above-mentioned object is a method for manufacturing a circuit-embedded substrate, comprising:

[0022] Preparation process, preparing the film;

[0023] an arranging step of arranging the first electrode pad and the second electrode pad in parallel with each other at intervals along a first direction on a peripheral portion of the first main surface of the film;

[0024] A circuit forming step of forming a circuit, wherein the circuit is arranged on the first main surface of the film and is composed of a conductive wire with an insulation coating on a metal thin wire, the circuit comprising: a functional portion having an arbitrary pattern; a first wiring portion extending from one of the two ends of the functional portion to the outside of the functional portion; a second wiring portion extending from the other of the two ends of the functional portion to the outside of the functional portion; a first end portion extending from the first wiring portion in a first direction in a manner partially overlapping with the first electrode pad and the second electrode pad; and a second end portion extending from the second wiring portion along the first end portion in a manner partially overlapping with the first electrode pad and the second electrode pad, and using an ultrasonic welding machine to embed portions of the functional portion, the first wiring portion, the second wiring portion, and the first end portion and the second end portion that do not overlap with the first electrode pad and the second electrode pad into the first main surface of the film to form the circuit;

[0025] a first connection step of removing the insulating coating of the conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad; and

[0026] The second connection process is to remove the insulating coating of the conductive wire on the second electrode pad and electrically connect the exposed metal wire to the second electrode pad.

[0027] One end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged across the first electrode pad and the second electrode pad in a plan view.

[0028] The ultrasonic welding machine comprises: a horn, which melts the contact surface between the film and the conductive wire by applying ultrasonic vibration, and embeds the conductive wire into the first main surface of the film; a conductive wire, which passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film.

[0029] The first end portion and the second end portion have a length sufficient to absorb positional displacement in the first direction between the first and second electrode pads and the circuit.

[0030] According to the manufacturing methods of the first and second inventions, even if the embedded positions of the first and second electrode pads are offset relative to the first end and second end in the first direction, the first end and second end each have a length sufficient to absorb the positional offset between the two electrode pads and the circuit in the first direction. Therefore, the first end and second end each have a portion overlapping the two electrode pads. Consequently, the alignment accuracy between the circuit and the two electrode pads is improved, thereby improving the yield rate.

[0031] A third invention to achieve the above-mentioned object is a method for manufacturing a circuit-embedded substrate, comprising:

[0032] Preparation process, preparing the film;

[0033] an arranging step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel with each other at intervals along a first direction on a peripheral portion of the first main surface of the film;

[0034] a first circuit forming step, forming a first circuit, wherein the first circuit is arranged on the first main surface of the film, and is composed of a first conductive wire with an insulation coating on a metal thin wire, wherein the first circuit has: a first functional portion having an arbitrary pattern; a first wiring portion extending from one of the two ends of the first functional portion to the outside of the first functional portion; a second wiring portion extending from the other of the two ends of the first functional portion to the outside of the first functional portion; a first end portion extending from the first wiring portion in a first direction in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; and a second end portion extending from the second wiring portion along the first end portion in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and an ultrasonic welding machine is used to embed portions of the first functional portion, the first wiring portion, the second wiring portion, the first end portion, and the second end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad into the first main surface of the film to form the first circuit;

[0035] a second circuit forming step of forming a second circuit, wherein the second circuit is arranged on the first main surface of the film and is composed of a second conductive wire with an insulation coating on the metal thin wire, the second circuit comprising: a second functional portion having an arbitrary pattern; a third wiring portion extending from one of the two ends of the second functional portion to the outside of the second functional portion; a fourth wiring portion extending from the other of the two ends of the second functional portion to the outside of the second functional portion; a third end portion extending from the third wiring portion in the first direction in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; and a fourth end portion extending from the fourth wiring portion along the third end portion in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and using an ultrasonic welding machine to embed portions of the second functional portion, the third wiring portion, the fourth wiring portion, the third end portion, and the fourth end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad into the first main surface of the film to form the second circuit;

[0036] a first connection step of removing the insulating coating of the first conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad;

[0037] a second connection step of removing the insulating coating of the first conductive wire on the second electrode pad and electrically connecting the exposed metal thin wire to the second electrode pad;

[0038] a third connecting step of removing the insulating coating of the second conductive wire on the third electrode pad and electrically connecting the exposed metal thin wire to the third electrode pad;

[0039] The fourth connection step is to remove the insulating coating of the second conductive wire on the fourth electrode pad and electrically connect the exposed metal wire to the fourth electrode pad.

[0040] One end of the first end portion connected to the first wiring portion, one end of the second end portion connected to the second wiring portion, one end of the third end portion connected to the third wiring portion, and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side relative to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view.

[0041] In the first circuit forming step, the ultrasonic welding machine includes: a horn that applies ultrasonic vibration to melt the contact surface between the film and the first conductive wire and embeds the first conductive wire into the first main surface of the film; the first conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film.

[0042] In the second circuit forming step, the ultrasonic welding machine includes: a horn that applies ultrasonic vibration to melt the contact surface between the film and the second conductive wire and embeds the second conductive wire into the first main surface of the film; the second conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film.

[0043] The first end portion, the second end portion, the third end portion, and the fourth end portion have lengths sufficient to absorb positional displacement in the first direction of the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit.

[0044] A fourth invention to achieve the above-mentioned object is a method for manufacturing a circuit-embedded substrate, comprising:

[0045] Preparation process, preparing the film;

[0046] an arranging step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel with each other at intervals along a first direction on a peripheral portion of the first main surface of the film;

[0047] a first circuit forming step of forming a first circuit, wherein the first circuit is arranged on the first main surface of the film and is composed of a first conductive wire with an insulation coating on a metal thin wire, wherein the first circuit comprises: a first functional portion having an arbitrary pattern; a first wiring portion extending from one of the two ends of the first functional portion to the outside of the first functional portion; a second wiring portion extending from the other of the two ends of the first functional portion to the outside of the first functional portion; a first end portion extending from the first wiring portion in a first direction in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; and a second end portion extending from the second wiring portion along the first end portion in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and an ultrasonic welding machine is used to embed portions of the first functional portion, the first wiring portion, the second wiring portion, the first end portion, and the second end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad into the first main surface of the film to form the first circuit;

[0048] a second circuit forming step of forming a second circuit, wherein the second circuit is arranged on the first main surface of the film and is composed of a second conductive wire with an insulation coating on the metal thin wire, the second circuit comprising: a second functional portion having an arbitrary pattern; a third wiring portion extending from one of the two ends of the second functional portion to the outside of the second functional portion; a fourth wiring portion extending from the other of the two ends of the second functional portion to the outside of the second functional portion; a third end portion extending from the third wiring portion in the first direction in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; and a fourth end portion extending from the fourth wiring portion along the third end portion in a manner partially overlapping with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and using an ultrasonic welding machine to embed portions of the second functional portion, the third wiring portion, the fourth wiring portion, the third end portion, and the fourth end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad into the first main surface of the film to form the second circuit;

[0049] a first connection step of removing the insulating coating of the first conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad;

[0050] a second connection step of removing the insulating coating of the first conductive wire on the second electrode pad and electrically connecting the exposed metal thin wire to the second electrode pad;

[0051] a third connecting step of removing the insulating coating of the second conductive wire on the third electrode pad and electrically connecting the exposed metal thin wire to the third electrode pad;

[0052] The fourth connection step is to remove the insulating coating of the second conductive wire on the fourth electrode pad and electrically connect the exposed metal wire to the fourth electrode pad.

[0053] One end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side relative to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view.

[0054] One end of the third end portion connected to the third wiring portion and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side relative to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view.

[0055] One end of each of the third end portion and the fourth end portion, and one end of each of the first end portion and the second end portion are arranged at positions sandwiching the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view.

[0056] In the first circuit forming step, the ultrasonic welding machine includes: a horn that applies ultrasonic vibration to melt the contact surface between the film and the first conductive wire and embeds the first conductive wire into the first main surface of the film; the first conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film.

[0057] In the second circuit forming step, the ultrasonic welding machine includes: a horn that applies ultrasonic vibration to melt the contact surface between the film and the second conductive wire and embeds the second conductive wire into the first main surface of the film; the second conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film.

[0058] The first end portion, the second end portion, the third end portion, and the fourth end portion have lengths sufficient to absorb positional displacement in the first direction of the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit.

[0059] According to the manufacturing methods of the third and fourth inventions, even if the embedded positions of the four electrode pads and the four end portions are offset relative to each other in the first direction, the first, second, third, and fourth end portions each have a length sufficient to absorb the positional offset in the first direction between the first and second circuits and the four electrode pads. Consequently, each of the four end portions has a portion overlapping the four electrode pads. Consequently, the alignment accuracy of the first and second circuits with the four electrode pads is improved, thereby improving the yield rate.

[0060] According to the method for manufacturing a circuit-embedded substrate of the present invention, the position alignment accuracy of the circuit and the electrode pad is improved, thereby achieving an improvement in the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] Figure 1 It is a schematic perspective view showing a first embodiment of a method for manufacturing a circuit-embedded substrate.

[0062] Figure 2 (a) is a partially enlarged view showing an example of the first end portion and the second end portion. Figure 2 (b) is Figure 2 AA cross-section of (a).

[0063] Figure 3 It is an enlarged view showing a state where the electrode pad is positionally displaced in the +X direction.

[0064] Figure 4 It is an enlarged view showing a state where the electrode pad is positionally displaced in the -X direction.

[0065] Figure 5 is a schematic cross-sectional view of a conductive line.

[0066] Figure 6 It is a schematic perspective view showing a second embodiment of the method for manufacturing a circuit-embedded substrate.

[0067] Figure 7 (a) is a partially enlarged view showing another example of the first end portion and the second end portion. Figure 7 (b) is Figure 7 AA cross-section of (a).

[0068] Figure 8 It is an enlarged view showing a state where the electrode pad is positionally displaced in the +X direction.

[0069] Figure 9 It is an enlarged view showing a state where the electrode pad is positionally displaced in the -X direction.

[0070] Figure 10 It is a schematic perspective view showing a third embodiment of the method for manufacturing a circuit-embedded substrate.

[0071] Figure 11 It is a schematic perspective view showing a fourth embodiment of a method for manufacturing a circuit-embedded substrate.

[0072] Figure 12 (a) is a schematic plan view showing a conventional thin film heater. Figure 12 (b) is Figure 12 AA cross-section of (a). DETAILED DESCRIPTION

[0073] <First embodiment>

[0074] (Overview of circuit-embedded substrate)

[0075] Reference Figure 1 (f) The circuit-embedded substrate 1 of the first embodiment includes a film 2 , a circuit 4 composed of conductive wires 3 arranged on a first main surface 2 a of the film 2 , first electrode pads 6 , and second electrode pads 7 .

[0076] The circuit 4 has a functional portion 45, a first wiring portion 43, a second wiring portion 44, a first end portion 41, and a second end portion 42. The functional portion 45 has an arbitrary pattern. The first wiring portion 43 is led out from one end 45a of the two ends of the functional portion 45. The second wiring portion 44 is led out from the other end 45b of the two ends of the functional portion 45. The first end portion 41 extends from the first wiring portion 43 in the +X direction (first direction) in a manner partially overlapping the first electrode pad 6 and the second electrode pad 7. The second end portion 42 extends from the second wiring portion 44 along the first end portion in a manner partially overlapping the first electrode pad 6 and the second electrode pad 7. And, referring to Figure 2 In (a), one end 41a of the first end portion 41 connected to the first wiring portion 43 and one end 42a of the second end portion 42 connected to the second wiring portion 44 are arranged on the same side relative to the first electrode pad 6 and the second electrode pad 7 in a plan view. In other words, one end 41a, 42a of the first end portion 41 and the second end portion 42 are each arranged closer to the -X direction than the two electrode pads 6, 7 in a plan view.

[0077] It should be noted that the boundary between the other end 45b of the functional portion 45 and the second wiring portion 44 may be as follows: Figure 1 It may be unclear like (f) in FIG. 1 , but may be clear like one end 45 a of the two ends of the functional portion 45 .

[0078] The functional portion 45, the first wiring portion 43, and the second wiring portion 44 are embedded in the first main surface 2a of the film 2. Figure 2 The portions of the first end portion 41 and the second end portion 42 that overlap with the electrode pads 6 and 7 are not embedded in the first main surface 2a, and the other portions are embedded. More specifically, the portion embedded in the film 2 is, for example, Figure 2 (b) as L d The portion not embedded in the film 2 is the portion connected to the upper surface of the electrode pads 6 and 7, and the portion between the upper surface of the electrode pads 6 and 7 and the embedded portion (L d ) between the inclined portion. Where the conductive wire 3 needs to cross the two electrode pads 6 and 7, it is difficult to embed it into the edge of the electrode pads 6 and 7 and cross the electrode pads 6 and 7, thus generating the following Figure 2 The inclined portion shown in (b) (the portion where the conductive wire 3 is not embedded in the film 2).

[0079] In this embodiment, the functional portion 45 is a heating portion, and the circuit embedded in the substrate 1 is a thin film heater. For example, by applying a positive voltage to the first electrode pad 6 and a negative voltage to the second electrode pad 7, a current is generated in the circuit 4 composed of the conductive wire 3, and the functional portion 45 generates heat. The functional portion 45 has two ends 45a and 45b connected to the first wiring portion 43 and the second wiring portion 44, respectively, and has a ring-shaped pattern shape. More specifically, the functional portion 45 is a pattern shape that extends from the connection portion 45a with the first wiring portion 43 in the +X direction, then extends in the +Y direction, -X direction, and -Y direction to reach the connection portion 45b with the second wiring portion 44. In this way, the functional portion 45 has connection portions 45a and 45b with the first wiring portion 43 and the second wiring portion 44, and has an arbitrary pattern extending from the connection portions 45a and 45b to the XY plane.

[0080] The film 2 can be set to any shape, and in this embodiment, it is rectangular. The film 2 can be a transparent, opaque or colored transparent film. As the material of the film 2, for example, thermoplastic resins such as ethylene resins, propylene resins, polyolefin resins, thermoplastic polyester resins, polyamide resins, polyvinyl chloride, polycarbonate, ABS resin, etc. can be used. It can also be a material containing two or more of these. Inorganic fine powder or organic filler, dispersant, antioxidant, compatibilizer, ultraviolet stabilizer, anti-blocking agent, antistatic agent, etc. can be appropriately added to the film 2. The thickness of the film 2 is, for example, 0.05mm to 1mm.

[0081] Reference Figure 5 Conductive wire 3 is a thin metal wire 33 covered with an insulating coating 34. Conductive materials such as copper, iron, gold, copper-nickel, nickel-chromium, and iron-nickel-chromium can be used for the thin metal wire 33. From the perspectives of electrical resistance, durability, and cost, copper or a copper alloy containing zinc, lead, tin, silver, aluminum, nickel, beryllium, zirconium, or the like, either alone or in combination, is preferably used. The diameter of the thin metal wire 33 is, for example, 0.01 mm to 0.5 mm.

[0082] The insulating coating 34 is an insulating resin, and for example, polyester, polyethylene, polyurethane, polyvinyl chloride, polyamide, polyimide, polyesterimide, polyamideimide, fluororesin, etc. The diameter of the conductive wire 3 is, for example, 0.05 mm to 0.3 mm.

[0083] Electrode pads 6 and 7 can be made of a conductive material such as copper, phosphor bronze, brass, Corson alloy, nickel, or molybdenum. Alternatively, these materials may be used as a base material, plated with nickel, tin, gold, silver, copper, or the like. Electrode pads 6 and 7 are, for example, 5 mm x 10 mm in size and 0.1 mm thick.

[0084] It should be noted that in this embodiment, the electrode pads 6 and 7 are quadrilaterals, but are not limited thereto and may be polygons other than quadrilaterals, circles, ellipses, L-shapes, etc.

[0085] (Method for Manufacturing Circuit-Embedded Substrate)

[0086] Reference Figure 1 An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described.

[0087] The manufacturing method of the circuit embedded substrate 1 comprises a preparation step (not shown) of preparing the film 2, a placement step (not shown) of placing the first electrode pad 6 and the second electrode pad 7 on the peripheral portion of the first main surface 2a of the film 2, and a placement step (not shown) of placing the first electrode pad 6 and the second electrode pad 7 on the peripheral portion of the first main surface 2a of the film 2. Figure 1 (a)) and a circuit forming step of forming the circuit 4 using an ultrasonic welding machine 8 ( Figure 1 (b)~ Figure 1 (e)), the first and second connecting steps of electrically connecting the first end 41 and the second end 42 of the circuit 4 to the electrode pads 6 and 7, respectively ( Figure 1 (f)).

[0088] In the preparation process, the film 2 can be fixed on a platform (not shown). In addition, in order to facilitate the position alignment of the film 2, a clamp (not shown) can also be used. In the configuration process, the first electrode pad 6 and the second electrode pad 7 are arranged on the peripheral portion of the first main surface 2a of the film 2. In other words, along a side parallel to the X direction (first direction) of the film 2, they are arranged side by side in the X direction. The two electrode pads 6 and 7 are quadrilaterals and are arranged parallel to each other with a gap along the X direction. The two electrode pads 6 and 7 serve as terminal portions of the circuit embedded in the substrate 1. The two electrode pads 6 and 7 can be fixed on the first main surface 2a, for example, using an adhesive.

[0089] Reference Figure 1 (b) The ultrasonic welding machine 8 used in the circuit forming step includes an oscillator (not shown) that generates ultrasonic vibrations, a horn 81 that transmits the ultrasonic vibrations from the oscillator, and the conductive wire 3. The horn 81 applies ultrasonic vibrations to melt the contact surface of the film 2 with the conductive wire 3, and can embed the conductive wire 3 into the first main surface 2a of the film 2. The conductive wire 3 passes through the interior of the horn 81 and is continuously led out from the front end 81a of the horn 81 to the first main surface 2a of the film 2.

[0090] In the circuit forming process, first, Figure 1As shown in (b), the conductive wire 3 is extended from the amplitude transformer 81 to a predetermined length while being embedded in the first main surface 2a of the film 2, crossing over the first electrode pad 6 and the second electrode pad 7 in the -X direction (first direction). The end point of the crossing is embedded in the first main surface 2a of the film 2 to form a first end portion 41. At this time, the conductive wire 3 overlapping the first electrode pad 6 and the second electrode pad 7 is not embedded in the first main surface 2a, but is in contact with the upper surfaces of the first electrode pad 6 and the second electrode pad 7.

[0091] Then, if Figure 1 As shown in (c) to (d), the conductive wire 3 is led out from the embedded terminal of the first end portion 41 toward the +Y direction while being embedded in the first main surface 2a to form the first wiring portion 43. Next, the conductive wire 3 is led out from the embedded terminal 43a of the first wiring portion 43 while being embedded in the first main surface 2a in an arbitrary pattern extending in the XY plane to form the functional portion 45. The embedded terminal 43a of the first wiring portion 43 becomes the starting end of the functional portion 45. In other words, the terminal 43a of the first wiring portion 43 becomes one end 45a of the two ends of the functional portion 45 (refer to Figure 1 (d)).

[0092] Then, if Figure 1 As shown in (e), the conductive wire 3 is extended from the horn 81 to a predetermined length, extending from the terminal 45b of the functional portion 45 in the -Y direction and embedded in the first main surface 2a, thereby forming the second wiring portion 44. The terminal of the functional portion 45 is the starting end of the second wiring portion 44 and forms the other end 45b of the functional portion 45. The conductive wire 3 is extended from the embedded terminal 44a of the second wiring portion 44 to a predetermined length, embedded along the first end 41 into the first main surface 2a, straddling above the first electrode pad 6 and the second electrode pad 7. The end of the span is embedded in the first main surface 2a of the film 2, thereby forming the second end 42. At this time, the conductive wire 3 overlapping the first electrode pad 6 and the second electrode pad 7 is not embedded in the first main surface 2a and contacts the upper surfaces of the first electrode pad 6 and the second electrode pad 7. After the second end 42 is formed, the conductive wire 3 is cut at the embedded terminal of the second end 42. As a cutting method, for example, a cutter or pliers can be used.

[0093] Finally, in the first and second connection steps, Figure 1As shown at point P in (f), the two electrode pads 6, 7 and the conductive wire 3 located above the two electrode pads 6, 7 (in contact with the upper surface) are electrically connected respectively. The connection can be made using known metal joining techniques, such as welding (resistance welding, ultrasonic welding, laser welding, etc.), soldering, hard soldering, etc. Through these connection methods, heat can be used to melt the insulating coating 34 of the first end 41 and the second end 42 to expose the metal wire 33, and the exposed metal wire 33 is electrically connected to the upper surface of each electrode pad 6, 7. It should be noted that the first connection process and the second connection process can be performed separately, but in order to improve production efficiency, it is preferably performed simultaneously.

[0094] By doing this, the circuit-embedded substrate 1 can be obtained.

[0095] Reference Figure 2 (a), the first end portion 41 and the second end portion 42 have a length L 41 and L 42 Here, as Figure 2 As shown in (b), the first end portion 41 spans across the electrode pads 6 and 7, and both ends thereof are embedded in the film 2. Since the electrode pads 6 and 7 cannot be arranged at the predetermined position where the conductive wire 3 is embedded, if the embedded length is set to L d , then the position deviation allowable length of each electrode pad 6, 7 is L 41 -2L d That is, the length L 41 -2L d This is the substantial length of the first end portion 41 that absorbs the positional displacement of the electrode pads 6 and 7 and the circuit 4 in the X direction (first direction). 42 Since the second electrode pad 7 cannot be arranged beyond one end 41a of the first end portion 41 in the -X direction, the actual position deviation allowable length is L 41 -2L d .

[0096] It should be pointed out that Figure 2 The state in which the first electrode pad 6 and the second electrode pad 7 and the first end portion 41 and the second end portion 42 are not positionally offset is shown.

[0097] For example, the widths W6 and W7 of the electrode pads 6 and 7 are 5 mm, respectively, and the interval S between the electrode pads 6 and 7 is 5 mm. P When the length L of the first end portion 41 is 2 mm, the length L of the first end portion 41 can be 41 Set the length L of the second end portion 42 to 22 mm. 42 Set to 27mm, the distance between the conductive lines S W Set to 5mm.

[0098] like Figure 3As shown, even when the positions of the electrode pads 6 and 7 are arranged to be offset by d in the +X direction, since the first end portion 41 and the second end portion 42 each have a length L greater than d, 41 、L 42 , so it can absorb the positional deviation of the electrode pads 6 and 7. It should be noted that the positional deviation of the first electrode pad 6 is strictly speaking the amount of the positional deviation of the first electrode pad 6 minus the embedded length L from d. d The value of (dL d ). Figure 3 For convenience, only the first electrode pad 6 after position shifting is shown by a solid line.

[0099] In addition, if Figure 4 As shown, even when the positions of the electrode pads 6 and 7 are arranged to be offset by d in the -X direction, since the first end portion 41 and the second end portion 42 each have a length L greater than d, 41 、L 42 , thus being able to absorb positional deviations of the electrode pads 6 and 7. Figure 4 For convenience, only the second electrode pad 7 after position shifting is shown by a solid line.

[0100] Thus, the first end portion 41 and the second end portion 42 each have a length L 41 、L 42 Even if the positions of the electrode pads 6 and 7 are offset by d relative to the film 2 in the X direction, the first end portion 41 and the second end portion 42 still overlap with the electrode pads 6 and 7. Therefore, the embedding positions of the first end portion 41 and the second end portion 42 do not need to take into account the positional offset of the electrode pads 6 and 7. In other words, the first end portion 41 and the second end portion 42 can be embedded in the same position each time the circuit-embedded substrate 1 is manufactured. Even without considering the positional offset of the electrode pads 6 and 7, the first end portion 41 and the second end portion 42 can be aligned with the electrode pads 6 and 7, thereby improving the yield rate.

[0101] <Second embodiment>

[0102] (Overview of circuit-embedded substrate)

[0103] Reference Figure 6 (f) The circuit embedded substrate 1 of the second embodiment includes a film 2, a circuit 4 composed of a conductive line 3 arranged on the first main surface 2a of the film 2, a first electrode pad 6, and a second electrode pad 7. The differences from the first embodiment are the pattern shape of the functional portion 45 and the positions of one end 41a of the first end portion 41 and one end 42a of the second end portion 42. The remaining components are the same as those described in the first embodiment and are therefore omitted for description. The following description focuses on the differences from the first embodiment.

[0104] In the second embodiment, the pattern shape of the functional portion 45 is a meandering shape. It should be noted that the boundary between one end 45a of the functional portion 45 and the first wiring portion 43, and the boundary between the other end 45b of the functional portion 45 and the second wiring portion 44 can be as follows: Figure 6 Although it is not clear as in (d), it can be made clear by using the two ends 45a and 45b as boundaries.

[0105] (Method for Manufacturing Circuit-Embedded Substrate)

[0106] Reference Figure 6 An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described.

[0107] The manufacturing method of the circuit embedded substrate 1 comprises a preparation step (not shown) of preparing the film 2, a placement step (not shown) of placing the first electrode pad 6 and the second electrode pad 7 on the peripheral portion of the first main surface 2a of the film 2, and a placement step (not shown) of placing the first electrode pad 6 and the second electrode pad 7 on the peripheral portion of the first main surface 2a of the film 2. Figure 6 (a)) and a circuit forming step of forming the circuit 4 using an ultrasonic welding machine 8 ( Figure 6 (b) to Figure 6 (e)), the first and second connecting steps of electrically connecting the first end 41 and the second end 42 of the circuit 4 to the electrode pads 6 and 7, respectively ( Figure 6 (f)). It should be noted that due to the preparation process, configuration process, part of the circuit formation process ( Figure 6 Ear (b)), and the first and second connection steps ( Figure 6 (f)) is the same as that of the first embodiment, so the description is omitted. Figure 6 (c) begins the description.

[0108] like Figure 6 As shown in (c) to (d), the conductive wire 3 is led out from the embedded terminal 41a of the first end portion 41 toward the +Y direction for a predetermined length while being embedded in the first main surface 2a to form the first wiring portion 43. Next, the conductive wire 3 is led out from the embedded terminal 43a of the first wiring portion 43 for a predetermined length while being embedded in the first main surface 2a in a serpentine shape extending in the XY plane to form the functional portion 45. The embedded terminal 43a of the first wiring portion 43 becomes the starting end of the functional portion 45. In other words, the terminal 43a of the first wiring portion 43 becomes one end 45a of the two ends of the functional portion 45 (refer to Figure 6 (d)).

[0109] Then, if Figure 6 As shown in (d), the conductive wire 3 is extended from the horn 81 by a predetermined length and then extends from the terminal end 45b of the functional portion 45 in the -Y direction and embedded in the first main surface 2a, thereby forming the second wiring portion 44. The terminal end of the functional portion 45 is the starting end of the second wiring portion 44 and forms the other end 45b of the functional portion 45.

[0110] Then, if Figure 6 As shown in (e), the conductive wire 3 is extended to a predetermined length from the embedded terminal 44a of the second wiring portion 44 while being embedded into the first main surface 2a along the first end portion 41, straddling above the first electrode pad 6 and the second electrode pad 7. The end point of the span is embedded into the first main surface 2a of the film 2, thereby forming the second end portion 42. At this time, the conductive wire 3 overlapping the first electrode pad 6 and the second electrode pad 7 is not embedded into the first main surface 2a and is in contact with the upper surfaces of the first electrode pad 6 and the second electrode pad 7. After the second end portion 42 is formed, the conductive wire 3 is cut at the embedded terminal of the second end portion 42.

[0111] Reference Figure 7 In (a), one end 41a of the first end portion 41 connected to the first wiring portion 43 and one end 42a of the second end portion 42 connected to the second wiring portion 44 are arranged in a plan view across the first electrode pad 6 and the second electrode pad 7. In other words, one end 41a of the first end portion 41 is arranged closer to the +X direction than the electrode pads 6 and 7 in a plan view, and one end 42a of the second end portion 42 is arranged closer to the -X direction than the electrode pads 6 and 7 in a plan view.

[0112] The first end portion 41 and the second end portion 42 each have a length L 41 and L 42 (L 41 <L 42 ). Here, if Figure 7 As shown in (b), the first end portion 41 spans across the electrode pads 6 and 7, and both ends thereof are embedded in the film 2. Since the electrode pads 6 and 7 cannot be arranged at the predetermined position where the conductive wire 3 is embedded, if the embedded length is set to L d , then the position deviation allowable length of each electrode pad 6, 7 is L 41 -2L d That is, the length L 41 -2L d This is the substantial length of the first end portion 41 that absorbs the positional displacement of the electrode pads 6 and 7 and the circuit 4 in the X direction (first direction). 42 Since the second electrode pad 7 cannot be arranged beyond one end 41a of the first end portion 41 in the -X direction, the actual position deviation allowable length is L 41 -2L d .

[0113] It should be pointed out that Figure 7 The state in which the first electrode pad 6 and the second electrode pad 7 and the first end portion 41 and the second end portion 42 are not positionally offset is shown.

[0114] For example, the widths W6 and W7 of the electrode pads 6 and 7 are 5 mm, respectively, and the interval S between the electrode pads 6 and 7 is 5 mm. P When the length L of the first end portion 41 is 2 mm, the length L of the first end portion 41 can be 41 Set the length L of the second end portion 42 to 22 mm. 42 Set to 27mm, the distance between the conductive lines S W Set to 5mm.

[0115] Figure 8 As shown, even when the positions of the electrode pads 6 and 7 are arranged to be offset by d in the +X direction, since the first end portion 41 and the second end portion 42 each have a length L greater than d, 41 、L 42 , thus being able to absorb positional deviations of the electrode pads 6 and 7. Figure 8 For convenience, only the first electrode pad 6 after position shifting is shown by a solid line.

[0116] Even when the positions of the electrode pads 6 and 7 are shifted by d in the -X direction, since the first end portion 41 and the second end portion 42 each have a length L greater than d, 41 、L 42 , so it can absorb the positional deviation of the electrode pads 6 and 7. It should be noted that, in this case, the positional deviation of the second electrode pad 7 is strictly speaking the amount of the positional deviation of the second electrode pad 7 minus the embedded length L from d. d The value of (dL d ). Figure 9 For convenience, only the second electrode pad 7 after position shifting is shown by a solid line.

[0117] Thus, the first end portion 41 and the second end portion 42 each have a length L 41 、L 42 Even if the positions of the electrode pads 6 and 7 are offset by d relative to the film 2 in the X direction, the first end portion 41 and the second end portion 42 still overlap with the electrode pads 6 and 7. Therefore, the embedding positions of the first end portion 41 and the second end portion 42 do not need to take into account the positional offset of the electrode pads 6 and 7. In other words, the first end portion 41 and the second end portion 42 can be embedded in the same position each time the circuit-embedded substrate 1 is manufactured. Even without considering the positional offset of the electrode pads 6 and 7, the first end portion 41 and the second end portion 42 can be aligned with the electrode pads 6 and 7, thereby improving the yield rate.

[0118] <Third embodiment>

[0119] (Overview of circuit-embedded substrate)

[0120] Reference Figure 10(f), the circuit embedded substrate 1 of the third embodiment comprises a film 2, a first circuit 4 composed of a first conductive line 31 arranged on the first main surface 2a of the film 2, a second circuit 5 composed of a second conductive line 32, a first electrode pad 6, a second electrode pad 7, a third electrode pad 9, and a fourth electrode pad 10.

[0121] The first circuit 4 includes a first functional portion 45, a first wiring portion 43, a second wiring portion 44, a first end portion 41, and a second end portion 42. The first functional portion 45 has an arbitrary pattern. The first wiring portion 43 is led out from one end 45a of the first functional portion 45. The second wiring portion 44 is led out from the other end 45b of the first functional portion 45. The first end portion 41 extends from the first wiring portion 43 in the +X direction (first direction) in a manner partially overlapping with the four electrode pads 6, 7, 9, and 10. The second end portion 42 extends from the second wiring portion 44 along the first end portion 41 in a manner partially overlapping with the four electrode pads 6, 7, 9, and 10.

[0122] The second circuit 5 includes a second functional portion 55, a third wiring portion 53, a fourth wiring portion 54, a third end portion 51, and a fourth end portion 52. The second functional portion 55 has an arbitrary pattern. The third wiring portion 53 is led out from one end 55a of the second functional portion 55. The fourth wiring portion 54 is led out from the other end 55b of the functional portion 55. The third end portion 51 extends from the third wiring portion 53 in the +X direction (first direction) in a manner partially overlapping with the four electrode pads 6, 7, 9, and 10. The fourth end portion 52 extends from the fourth wiring portion 54 along the third end portion 51 in a manner partially overlapping with the four electrode pads 6, 7, 9, and 10.

[0123] Furthermore, one end 41a of the first end portion 41 connected to the first wiring portion 43, one end 42a of the second end portion 42 connected to the second wiring portion 44, one end 51a of the third end portion 51 connected to the third wiring portion 53, and one end 52a of the fourth end portion 52 connected to the fourth wiring portion 54 are arranged on the same side relative to the four electrode pads 6, 7, 9, and 10 in a plan view. In other words, one end 41a, 42a, 51a, and 52a of each of the four end portions 41, 42, 51, and 52 are all arranged closer to the -X direction than the four electrode pads 6, 7, 9, and 10 in a plan view.

[0124] It should be noted that the boundary between the other end 55b of the second functional portion 55 and the fourth wiring portion 54 may be as follows: Figure 10 Although it is unclear as in (e), it may be clear as in one end 55 a of the two ends of the second functional portion 55 .

[0125] (Method for Manufacturing Circuit-Embedded Substrate)

[0126] Reference Figure 10 An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described.

[0127] The manufacturing method of the circuit embedded substrate 1 includes a preparation step (not shown) of preparing the film 2, a placement step (not shown) of placing the first electrode pad 6, the second electrode pad 7, the third electrode pad 9 and the fourth electrode pad 10 on the peripheral portion of the first main surface 2a of the film 2. Figure 10 (a)) A first circuit forming step of forming the first circuit 4 using an ultrasonic welding machine 8 ( Figure 10 (b) to Figure 10 (c)) A second circuit forming step of forming the second circuit 5 using an ultrasonic welding machine 8 ( Figure 10 (d) to Figure 10 (e)), first to fourth connection steps ( Figure 10 (f)). It should be noted that due to the preparation process, configuration process, first circuit formation process ( Figure 10 (b) to Figure 10 (c)), and the first to fourth connecting steps ( Figure 10 (f)) is the same as that of the first embodiment, and therefore the description thereof is omitted. The second circuit forming step ( Figure 10 (d) to Figure 10 (e)) is explained.

[0128] First, the second conductive wire 32 is extended from the horn 81 by a predetermined length and embedded in the first main surface 2a of the film 2, so as to span above the four electrode pads 6, 7, 9, and 10 in the -X direction (first direction). The end point of the span is embedded in the first main surface 2a of the film 2, thereby forming the third end portion 51. The third end portion 51 is formed parallel to the first end portion 41 and the second end portion 42.

[0129] Next, the second conductive wire 32 is led out from the embedded terminal of the third end portion 51 toward the +Y direction for a predetermined length while being embedded in the first main surface 2a, thereby forming the third wiring portion 53. Next, the second conductive wire 32 is led out from the embedded terminal 53a of the third wiring portion 53 for a predetermined length while being embedded in the first main surface 2a in an arbitrary pattern extending in the XY plane, thereby forming the second functional portion 55. The embedded terminal 53a of the third wiring portion 53 becomes the starting end of the second functional portion 55. In other words, the terminal 53a of the third wiring portion 53 becomes one end 55a of the two ends of the second functional portion 55 (see Figure 10 (e)).

[0130] Then, if Figure 10As shown in (e), the second conductive wire 32 is extended from the horn 81 by a predetermined length, extending from the terminal end 55b of the second functional portion 55 in the -Y direction and embedded in the first main surface 2a, thereby forming the fourth wiring portion 54. The terminal end of the second functional portion 55 is the starting end of the fourth wiring portion 54 and forms the other end 55b of the second functional portion 55. The second conductive wire 32 is extended by a predetermined length from the embedded terminal end 54a of the fourth wiring portion 54, embedded in the first main surface 2a along the third end portion 51, and straddles the four electrode pads 6, 7, 9, and 10 in the +X direction. The end point of the span is embedded in the first main surface 2a of the film 2, thereby forming the fourth end portion 52.

[0131] In the third embodiment, as in the first embodiment, one end 41a, 42a, 51a, 52a of each of the four end portions 41, 42, 51, 52 is positioned on the same side relative to the four electrode pads 6, 7, 9, 10 when viewed from above. Therefore, the same effects as in the first embodiment are achieved. Specifically, the four end portions 41, 42, 51, 52 can be embedded in the same position each time the circuit-embedded substrate 1 is manufactured. Even without considering the positional deviations of the four electrode pads 6, 7, 9, 10, the four end portions 41, 42, 51, 52 can be aligned with the four electrode pads 6, 7, 9, 10, thereby improving the yield rate.

[0132] <Fourth embodiment>

[0133] (Overview of circuit-embedded substrate)

[0134] Reference Figure 11 (f) The circuit embedded substrate 1 of the fourth embodiment includes a film 2, a first circuit 4 composed of a first conductive line 31 arranged on the first main surface 2a of the film 2, a second circuit 5 composed of a second conductive line 32, a first electrode pad 6, a second electrode pad 7, a third electrode pad 9, and a fourth electrode pad 10. The difference from the third embodiment is the position of the ends 41a and 42a of the two end portions 41 and 42 and the positions of the ends 51a and 52a of the two end portions 51 and 52. The other components are the same as those described in the third embodiment, so the description is omitted. The following description focuses on the differences from the third embodiment.

[0135] Reference Figure 11 (c), one end 41a of the first end portion 41 connected to the first wiring portion 43 and one end 42a of the second end portion 42 connected to the second wiring portion 44 are arranged closer to the +X direction than the four electrode pads 6, 7, 9, and 10 in a plan view. Figure 11In (f), one end 51a of the third end portion 51 connected to the third wiring portion 53 and one end 52a of the fourth end portion 52 connected to the fourth wiring portion 54 are arranged closer to the -X direction than the four electrode pads 6, 7, 9, and 10 in a plan view. In other words, one end 41a, 42a of the first end portion 41 and the second end portion 42 and one end 51a, 52a of the third end portion 51 and the fourth end portion 52 are arranged so as to sandwich the four electrode pads 6, 7, 9, and 10.

[0136] (Method for Manufacturing Circuit-Embedded Substrate)

[0137] Reference Figure 11 An embodiment of a method for manufacturing such a circuit-embedded substrate 1 will be described.

[0138] The manufacturing method of the circuit embedded substrate 1 comprises a step of arranging the first electrode pad 6, the second electrode pad 7, the third electrode pad 9 and the fourth electrode pad 10 on the peripheral portion of the first main surface 2a of the film 2 ( Figure 11 (a)) A first circuit forming step of forming the first circuit 4 using an ultrasonic welding machine 8 ( Figure 11 (b) to Figure 11 (c)) and a second circuit forming step of forming the second circuit 5 using an ultrasonic welding machine 8 ( Figure 11 (d) to Figure 11 (e)), first to fourth connection steps ( Figure 11 (f)). It should be noted that due to the preparation process, configuration process, and second circuit formation process ( Figure 11 (d) to Figure 11 (e)), and the first to fourth connecting steps ( Figure 11 (f)) is the same as that of the third embodiment, and therefore the description thereof is omitted. The first circuit forming step ( Figure 11 (b) to Figure 11 (c)) is explained.

[0139] First, the first conductive wire 31 is extended from the amplitude transformer 81 to a specified length and embedded in the first main surface 2a of the film 2, spanning above the four electrode pads 6, 7, 9, and 10 in the +X direction (first direction), and the first end portion 41 is formed by embedding the spanning end point into the first main surface 2a of the film 2.

[0140] Next, the first conductive wire 31 is extended from the embedded terminal of the first end portion 41 toward the +Y direction while being embedded in the first main surface 2a to form the first wiring portion 43. Next, the first conductive wire 31 is extended from the embedded terminal 43a of the first wiring portion 43 while being embedded in the first main surface 2a in an arbitrary pattern extending in the XY plane to form the first functional portion 45. The embedded terminal 43a of the first wiring portion 43 becomes the starting end of the first functional portion 45. In other words, the terminal 43a of the first wiring portion 43 becomes one end 45a of the two ends of the first functional portion 45 (see Figure 11 (b)).

[0141] Then, if Figure 11 As shown in (c), the first conductive wire 31 is extended from the horn 81 by a predetermined length, extending from the terminal end 45b of the first functional portion 45 in the -Y direction and embedded in the first main surface 2a, thereby forming the second wiring portion 44. The terminal end of the first functional portion 45 is the starting end of the second wiring portion 44 and forms the other end 45b of the first functional portion 45. The first conductive wire 31 is extended from the embedded terminal end 44a of the second wiring portion 44 by a predetermined length, embedded along the first end portion 41 in the first main surface 2a, and straddles the four electrode pads 6, 7, 9, and 10 in the -X direction. The end point of the span is embedded in the first main surface 2a of the film 2, thereby forming the second end portion 42. The second end portion 42 is formed parallel to the first end portion 41.

[0142] In the fourth embodiment, as in the second embodiment, one end 41a, 42a of each of the two end portions 41 and 42 is arranged on the same side (+X) relative to the four electrode pads 6, 7, 9, and 10 when viewed from above. In addition, one end 51a, 52a of each of the two end portions 51 and 52 is arranged on the same side (-X) relative to the four electrode pads 6, 7, 9, and 10 when viewed from above. In other words, one end of the two groups (41a, 42a and 51a, 52a) is arranged at a position separated by the four electrode pads 6, 7, 9, and 10 when viewed from above. Therefore, the same effect as the second embodiment is achieved. That is, the four end portions 41, 42, 51, and 52 can be embedded in the same position each time the circuit embedding substrate 1 is manufactured. Even without considering the positional offset of the four electrode pads 6, 7, 9, and 10, the positions of the four end portions 41, 42, 51, and 52 and the four electrode pads 6, 7, 9, and 10 can be aligned, thereby improving the yield rate.

[0143] Description of Reference Numerals

[0144] 1: Circuit embedded in substrate; 2: Film; 2a: First main surface; 3: Conductive wire; 31: First conductive wire; 32: Second conductive wire; 33: Metal thin wire; 34: Insulating coating; 4: (First) circuit; 41: First end; 42: Second end; 43: First wiring section; 44: Second wiring section; 45: (First) functional section; 5: Second circuit; 51: Third end; 52: Fourth end; 53: Third wiring section; 54: Fourth wiring section; 55: Second functional section Energy part; 6: First electrode pad; 7: Second electrode pad; 8: Ultrasonic welding machine; 81: Amplifier; 9: Third electrode pad; 10: Fourth electrode pad; 100: Thin film heater; 200: Thin film; 300: Metal wire; 400: Circuit; 410: First end portion; 420: Second end portion; 430: First wiring portion; 440: Second wiring portion; 450: Heating portion; 500: First electrode pad; 600: Second electrode pad; 700: Adhesive layer.

Claims

1. A method for manufacturing a circuit-embedded substrate, comprising: Preparation process, preparing the film; an arranging step of arranging a first electrode pad and a second electrode pad in parallel with each other at a distance therebetween along a first direction on a peripheral portion of the first main surface of the film; a circuit forming step of forming a circuit, the circuit being arranged on the first main surface of the film and being composed of conductive wires formed by insulating and coating metal thin wires, the circuit comprising: a functional portion having an arbitrary pattern; and a first wiring portion extending from one of two ends of the functional portion to the outside of the functional portion; a second wiring portion extending from the other end of the functional portion to the outside of the functional portion; a first end portion extending from the first wiring portion in the first direction so as to partially overlap with the first electrode pad and the second electrode pad; and a second end portion extending from the second wiring portion along the first end portion so as to partially overlap with the first electrode pad and the second electrode pad, wherein portions of the functional portion, the first wiring portion, the second wiring portion, the first end portion, and the second end portion that do not overlap with the first electrode pad and the second electrode pad are embedded into the first main surface of the film using an ultrasonic welder to form the circuit; a first connecting step of removing the insulating coating of the conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad; as well as a second connection step of removing the insulating coating of the conductive wire on the second electrode pad and electrically connecting the exposed metal thin wire to the second electrode pad; One end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side relative to the first electrode pad and the second electrode pad in a plan view. The ultrasonic welding machine includes: a horn, which melts the contact surface of the film and the conductive wire by applying ultrasonic vibration, and embeds the conductive wire into the first main surface of the film; the conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film. The first end portion and the second end portion have lengths that absorb positional displacement in the first direction between the first electrode pad, the second electrode pad, and the circuit.

2. A method for manufacturing a circuit-embedded substrate, comprising: Preparation process, preparing the film; an arranging step of arranging a first electrode pad and a second electrode pad in parallel with each other at a distance therebetween along a first direction on a peripheral portion of the first main surface of the film; a circuit forming step of forming a circuit, the circuit being arranged on the first main surface of the film and being composed of conductive wires formed by insulating and coating metal thin wires, the circuit comprising: a functional portion having an arbitrary pattern; and a first wiring portion extending from one of two ends of the functional portion to the outside of the functional portion; a second wiring portion extending from the other end of the functional portion to the outside of the functional portion; a first end portion extending from the first wiring portion in the first direction so as to partially overlap with the first electrode pad and the second electrode pad; and a second end portion extending from the second wiring portion along the first end portion so as to partially overlap with the first electrode pad and the second electrode pad, wherein portions of the functional portion, the first wiring portion, the second wiring portion, the first end portion, and the second end portion that do not overlap with the first electrode pad and the second electrode pad are embedded into the first main surface of the film using an ultrasonic welder to form the circuit; a first connecting step of removing the insulating coating of the conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad; as well as a second connection step of removing the insulating coating of the conductive wire on the second electrode pad and electrically connecting the exposed metal thin wire to the second electrode pad; One end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged across the first electrode pad and the second electrode pad in a plan view. The ultrasonic welding machine includes: a horn, which melts the contact surface between the film and the conductive wire by applying ultrasonic vibration, and embeds the conductive wire into the first main surface of the film; the conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film. The first end portion and the second end portion have lengths that absorb positional displacement in the first direction between the first electrode pad, the second electrode pad, and the circuit.

3. A method for manufacturing a circuit-embedded substrate, comprising: Preparation process, preparing the film; an arranging step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel with each other at intervals along a first direction on a peripheral portion of the first main surface of the film; A first circuit forming step is performed to form a first circuit, the first circuit being arranged on the first main surface of the film and being composed of a first conductive wire formed by insulating and coating a metal thin wire, the first circuit comprising: a first functional portion having an arbitrary pattern; and a first wiring portion extending from one of two ends of the first functional portion to the outside of the first functional portion; a second wiring portion extending from the other of the two ends of the first functional portion to the outside of the first functional portion; a first end portion extending from the first wiring portion in the first direction in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; a second end portion extending from the second wiring portion along the first end portion in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and an ultrasonic welding machine is used to embed portions of the first functional portion, the first wiring portion, the second wiring portion, the first end portion, and the second end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad into the first main surface of the film to form the first circuit; a second circuit forming step of forming a second circuit, the second circuit being disposed on the first main surface of the film and being composed of a second conductive wire formed by insulating and coating a metal thin wire, the second circuit comprising: a second functional portion having an arbitrary pattern; and a third wiring portion extending from one of two ends of the second functional portion to the outside of the second functional portion; a fourth wiring portion extending from the other end of the second functional portion to the outside of the second functional portion; The third end portion extends from the third wiring portion in the first direction in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; the fourth end portion extends from the fourth wiring portion along the third end portion in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and the second functional portion, the third wiring portion, the fourth wiring portion, the third end portion, and the fourth end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad are embedded into the first main surface of the film using the ultrasonic welding machine to form the second circuit; a first connecting step of removing the insulating coating of the first conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad; a second connecting step of removing the insulating coating of the first conductive wire on the second electrode pad and electrically connecting the exposed metal thin wire to the second electrode pad; a third connecting step of removing the insulating coating of the second conductive wire on the third electrode pad and electrically connecting the exposed metal thin wire to the third electrode pad; a fourth connecting step of removing the insulating coating of the second conductive wire on the fourth electrode pad and electrically connecting the exposed metal thin wire to the fourth electrode pad; One end of the first end portion connected to the first wiring portion, one end of the second end portion connected to the second wiring portion, one end of the third end portion connected to the third wiring portion, and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side relative to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view. In the first circuit forming step, the ultrasonic welding machine includes: a horn that applies ultrasonic vibration to melt the contact surface between the film and the first conductive wire and embeds the first conductive wire into the first main surface of the film; the first conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film. In the second circuit forming step, the ultrasonic welding machine includes: the horn, which applies ultrasonic vibration to melt the contact surface between the film and the second conductive wire and embeds the second conductive wire into the first main surface of the film; the second conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film. The first end portion, the second end portion, the third end portion, and the fourth end portion have lengths sufficient to absorb positional displacement in the first direction between the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit.

4. A method for manufacturing a circuit-embedded substrate, comprising: Preparation process, preparing the film; an arranging step of arranging a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad in parallel with each other at intervals along a first direction on a peripheral portion of the first main surface of the film; A first circuit forming step is performed to form a first circuit, the first circuit being arranged on the first main surface of the film and being composed of a first conductive wire formed by insulating and coating a metal thin wire, the first circuit comprising: a first functional portion having an arbitrary pattern; and a first wiring portion extending from one of two ends of the first functional portion to the outside of the first functional portion; a second wiring portion extending from the other of the two ends of the first functional portion to the outside of the first functional portion; a first end portion extending from the first wiring portion in the first direction in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; a second end portion extending from the second wiring portion along the first end portion in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and an ultrasonic welding machine is used to embed portions of the first functional portion, the first wiring portion, the second wiring portion, the first end portion, and the second end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad into the first main surface of the film to form the first circuit; a second circuit forming step of forming a second circuit, the second circuit being disposed on the first main surface of the film and being composed of a second conductive wire formed by insulating and coating a metal thin wire, the second circuit comprising: a second functional portion having an arbitrary pattern; and a third wiring portion extending from one of two ends of the second functional portion to the outside of the second functional portion; a fourth wiring portion extending from the other end of the second functional portion to the outside of the second functional portion; The third end portion extends from the third wiring portion in the first direction in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad; the fourth end portion extends from the fourth wiring portion along the third end portion in a manner partially overlapping the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad, and the second functional portion, the third wiring portion, the fourth wiring portion, the third end portion, and the fourth end portion that do not overlap with the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad are embedded into the first main surface of the film using the ultrasonic welding machine to form the second circuit; a first connecting step of removing the insulating coating of the first conductive wire on the first electrode pad and electrically connecting the exposed metal thin wire to the first electrode pad; a second connecting step of removing the insulating coating of the first conductive wire on the second electrode pad and electrically connecting the exposed metal thin wire to the second electrode pad; a third connecting step of removing the insulating coating of the second conductive wire on the third electrode pad and electrically connecting the exposed metal thin wire to the third electrode pad; a fourth connecting step of removing the insulating coating of the second conductive wire on the fourth electrode pad and electrically connecting the exposed metal thin wire to the fourth electrode pad; One end of the first end portion connected to the first wiring portion and one end of the second end portion connected to the second wiring portion are arranged on the same side relative to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view. One end of the third end portion connected to the third wiring portion and one end of the fourth end portion connected to the fourth wiring portion are arranged on the same side relative to the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view. The one end of each of the third end portion and the fourth end portion, and the one end of each of the first end portion and the second end portion are arranged at positions sandwiching the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad in a plan view. In the first circuit forming step, the ultrasonic welding machine includes: a horn that applies ultrasonic vibration to melt the contact surface between the film and the first conductive wire and embeds the first conductive wire into the first main surface of the film; the first conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film. In the second circuit forming step, the ultrasonic welding machine includes: the horn, which applies ultrasonic vibration to melt the contact surface between the film and the second conductive wire and embeds the second conductive wire into the first main surface of the film; the second conductive wire passes through the interior of the horn and is continuously led out from the front end of the horn to the first main surface of the film. The first end portion, the second end portion, the third end portion, and the fourth end portion have lengths sufficient to absorb positional displacement in the first direction between the first electrode pad, the second electrode pad, the third electrode pad, and the fourth electrode pad and the first circuit and the second circuit.

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