Laser cutting apparatus and cutting process

Abstract

The present application belongs to the technical field of cutting machine tools, and particularly relates to a laser cutting device and a cutting process. The laser cutting device comprises a work platform, a driving mechanism, a bearing tray and a laser cutting mechanism. The first negative pressure suction pipeline is arranged at the bottom of the box body. When the laser cutting is performed, the smoke and dust generated by the cutting is directly sucked from the bottom of the material plate, the amount of the smoke and dust rising to the laser light path is reduced, the total amount of the smoke and dust adhering to the lens is reduced, and the lens is prevented from overheating. Meanwhile, when the electric drive shielding part moves away from the cutting area, only the air inlet hole and the air outlet hole corresponding to the cutting area are exposed, the negative pressure suction force is concentrated on the real-time processing area, the suction effect of the smoke and dust is improved, the amount of the smoke and dust rising to the laser light path is further reduced, and the lens is prevented from overheating.

Description

Technical Field

[0001] This invention belongs to the field of cutting machine tool technology, specifically relating to equipment for laser cutting, and more particularly to a laser cutting device and cutting process. Background Technology

[0002] Laser cutting equipment generates a large amount of high-temperature fumes when processing material plates.

[0003] The cutting equipment in related technologies mainly extracts fumes by setting an adsorption hood on the top of the material plate. The floating fumes easily adhere to the lens of the laser cutting mechanism. The contaminants will adhere to the lens surface. When the high-energy laser beam passes through the contaminated lens, the energy will be locally focused, causing the lens to overheat or even burn. At the same time, the scattering and absorption of the laser by the metal fumes are significant, forcing the equipment to increase its power, resulting in a surge in energy consumption.

[0004] Therefore, how to avoid damage to the lens when the adsorption hood extracts dust from the top of the material plate is a technical problem that urgently needs to be solved.

[0005] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Summary of the Invention

[0006] This disclosure provides at least one laser cutting device and its cutting process.

[0007] In a first aspect, embodiments of this disclosure provide a laser cutting apparatus, comprising:

[0008] Work platform;

[0009] The drive mechanism is mounted on the working platform;

[0010] A support tray is mounted on the drive mechanism and is used to support the material plate.

[0011] A laser cutting mechanism is disposed above the drive mechanism and is used to cut the material plate on the support tray;

[0012] The carrying pallet includes:

[0013] The box body has a cavity in its inner wall, and the top of the box body has multiple air inlets and the bottom of the box body has multiple air outlets.

[0014] The cavity is provided with two opposing electric drive shielding parts;

[0015] The first negative pressure adsorption pipeline is connected to the air outlet at the bottom of the box body.

[0016] a control module configured to control the two electrically-driven shielding parts to move away from each other to connect the air inlet hole and the air outlet hole corresponding to the area to be cut on the material plate, and control the external negative pressure source to draw air through the first negative pressure suction pipeline to suck the smoke and dust generated during the cutting of the material plate by the laser cutting mechanism.

[0017] In an optional embodiment, the electrically-driven shielding part comprises:

[0018] a sliding plate arranged in the cavity and abutting against the upper top wall and the lower bottom wall of the cavity;

[0019] a driving cylinder arranged in the cavity and used to drive the sliding plate to slide in the cavity;

[0020] the top and the bottom of the sliding plate are connected to the inner walls of the cavity through corresponding shielding plates;

[0021] the control module adjusts the position of the sliding plate through the driving cylinder to connect the air inlet hole and the air outlet hole corresponding to the area to be cut on the material plate.

[0022] In an optional embodiment, the shielding plate is an elastic sealing plate;

[0023] and the elastic sealing plate is in the shape of an organ.

[0024] When the driving cylinder drives the sliding plate to slide, the shielding plate is driven to connect or close the corresponding air inlet hole and air outlet hole.

[0025] In an optional embodiment, the bottom of the cavity is provided with a collection groove;

[0026] the collection groove is arranged in the middle of the cavity;

[0027] After the cutting is completed, the control module is further configured to control the two electrically-driven shielding parts to move towards each other, and push the waste generated in the bottom of the cavity into the collection groove through the electrically-driven shielding parts.

[0028] In an optional embodiment, the bottom of the collection groove is provided with a chip removal hole;

[0029] the chip removal hole is connected to the first negative pressure suction pipeline.

[0030] In an optional embodiment, the laser cutting device further comprises:

[0031] a second negative pressure suction pipeline;

[0032] An adsorption cover is arranged above the box body and communicates with the second negative pressure adsorption pipeline;

[0033] The control module is further configured to control the external negative pressure source to adsorb air through the second negative pressure adsorption pipeline to the adsorption cover to adsorb the smoke and dust on the top of the material plate.

[0034] In an optional embodiment, the top of the adsorption cover is provided with an opening;

[0035] The ray outlet of the laser cutting mechanism is arranged above the opening;

[0036] The second negative pressure adsorption pipeline communicates with the side wall of the adsorption cover.

[0037] In an optional embodiment, the adsorption force in the first negative pressure adsorption pipeline is greater than the adsorption force in the second negative pressure adsorption pipeline.

[0038] In an optional embodiment, the driving mechanism comprises:

[0039] A first direction driving part is arranged on the working platform;

[0040] A second direction driving part is arranged on the first direction driving part;

[0041] The carrying tray is arranged on the second direction driving part;

[0042] The control module is further configured to adjust the position of the carrying tray through the first direction driving part and the second direction driving part, so as to facilitate the laser cutting mechanism to cut the material plate.

[0043] In a second aspect, the embodiments of the present disclosure further provide a cutting process applied to the laser cutting device as described above, and the cutting process comprises:

[0044] The control module controls the driving mechanism to convey the carrying tray carrying the material plate to below the laser cutting mechanism;

[0045] The control module controls the two electrically-driven shielding parts to move away from each other to communicate the area to be cut of the material plate with the air inlet hole and the air outlet hole corresponding to the box body;

[0046] The external negative pressure source provides negative pressure for the first negative pressure adsorption pipeline;

[0047] The control module drives the laser cutting mechanism to cut the material plate, and drives the driving mechanism to move the material plate according to the preset cutting route, at this time, the first negative pressure adsorption pipeline adsorbs the smoke and dust generated during cutting of the material plate from the bottom of the material plate through the air inlet hole.

[0048] The beneficial effects of the present application are that the laser cutting device and the cutting process directly suck the smoke and dust caused by cutting from the bottom of the material plate during laser cutting, reduce the amount of smoke and dust upwelling to the laser light path, reduce the total amount of smoke and dust attached to the lens, avoid overheating of the lens, and at the same time, when the electric drive shielding part moves away during cutting, only the air inlet hole and the air outlet hole corresponding to the cutting area are exposed, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the suction force of the negative pressure on the cutting area, improving the adsorption effect of the smoke and dust, further reducing the amount of smoke and dust upwelling to the laser light path, and avoiding overheating of the lens.

[0049] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the description and the drawings.

[0050] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the preferred embodiments are described in detail below, and the accompanying drawings are described as follows. BRIEF DESCRIPTION OF DRAWINGS

[0051] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0052] Figure 1 The structural schematic diagram of the laser cutting device provided by the embodiment of the present disclosure is shown in the figure.

[0053] Figure 2 The sectional view of the partial structure of the bearing tray provided by the embodiment of the present disclosure is shown in the figure.

[0054] Figure 3 The sectional view of the partial structure of the bearing tray provided by the embodiment of the present disclosure is shown in the figure.

[0055] Figure 4 The state schematic diagram of the bearing tray when cleaning the waste is shown in the figure.

[0056] Figure 5 The structural schematic diagram of the laser cutting device provided by the embodiment of the present disclosure is shown in the figure.

[0057] Figure 6 The electrical control principle diagram of the laser cutting device provided by the embodiment of the present disclosure is shown in the figure.

[0058] Figure 7A flowchart of a cutting process of a laser cutting apparatus provided by embodiments of the present disclosure.

[0059] In the figure: 100, work platform; 200, driving mechanism; 210, first direction driving part; 220, second direction driving part; 300, bearing tray; 310, box body; 311, cavity; 312, electrically-driven shielding part; 3121, sliding plate; 3122, driving cylinder; 3123, shielding plate; 313, air inlet hole; 314, air outlet hole; 315, collection groove; 316, chip removal hole; 320, first negative pressure adsorption pipeline; 330, second negative pressure adsorption pipeline; 400, laser cutting mechanism; 500, material plate; 600, adsorption cover; 610, opening. DETAILED DESCRIPTION

[0060] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be described below in connection with the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0061] In this document, when it is mentioned that a first component is located on a second component, it can mean that the first component can be directly formed on the second component, or a third component can be interposed between the first component and the second component. In addition, in the drawings, in order to effectively describe the technical content, the thickness of the components can be exaggerated or reduced.

[0062] In this document, when an element or layer is referred to as "on", "joined to", "connected to", "attached to", or "coupled to" another element or layer, it can be directly on, joined, connected, attached, or coupled to the other element or layer, or there can be an intermediate element or layer. In contrast, when an element is referred to as "directly on", "directly joined to", "directly connected to", "directly attached to", or "directly coupled to" another element or layer, there can be no intermediate element or layer. Other words used to describe the relationship between elements should be interpreted in a similar manner (for example, "between" versus "directly between", "adjacent" versus "directly adjacent", etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0063] In this document, example embodiments of the disclosure will be described in greater detail. As used herein, expressions such as "at least one of," when preceding a list of two or more items, modify the entire list of items and do not modify the list of items as a whole. For example, the expression "at least one of a, b, and c" should be understood to mean, a alone; b alone; c alone; two of the three, such as a and b together; a and c together; b and c together; or all of a, b, and c together.

[0064] The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular articles "a," "an," and "the" can be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order

[0065] As used herein, the phrases "in an embodiment," "according to an embodiment," "in some embodiments," and the like, generally mean the particular feature, structure, or characteristic following the phrase can be included in at least one embodiment of the present disclosure. Thus, appearances of such phrases in various places throughout this specification do not necessarily all refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like, mean "serving as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other implementations, aspects, or designs. Rather, the use of the terms "example," "exemplary," and the like, is intended to present concepts in a concrete manner.

[0066] It is found through research that, in order to avoid smoke pollution of the lens, the related cutting equipment adopts a top adsorption cover to extract smoke when cutting a material plate. The escaped smoke is easy to adhere to the lens, and the pollutants will adhere to the surface of the lens. When a high-energy laser beam passes through the contaminated lens, the energy will be locally focused, causing the lens to overheat or even ablate. In addition, in order to avoid the influence of smoke on the light path of the laser beam, the adsorption cover is generally arranged away from the laser path of the laser beam. In order to avoid too much escaped smoke when the adsorption cover adsorbs the smoke, the adsorption force of the adsorption cover needs to be increased, thereby increasing the energy consumption.

[0067] Based on the above research, the embodiment of the present disclosure provides a laser cutting device and a cutting process. A first negative pressure suction pipeline 320 is arranged at the bottom of the box body 310. When laser cutting, the smoke and dust caused by cutting is directly sucked from the bottom of the material plate 500, thereby reducing the amount of smoke and dust flowing up to the laser light path. On the one hand, it avoids the attachment of smoke and dust on the lens, and on the other hand, it reduces the amount of smoke and dust entering the laser light path, thereby reducing the total amount of smoke and dust attached to the lens and avoiding overheating of the lens.

[0068] The defects of the above solutions are the results of the inventors after practice and careful research, therefore, the discovery process of the above problems and the solutions proposed by the present disclosure to the above problems should be the contributions of the inventors to the present disclosure in the process of the present disclosure.

[0069] It should be noted that similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0070] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

[0071] Please refer to Figure 1 and Figure 2 , the embodiment of the present disclosure provides a laser cutting device, which comprises: a workbench 100; a driving mechanism 200 arranged on the workbench 100; a bearing tray 300 arranged on the driving mechanism 200 and used for supporting a material plate 500; and a laser cutting mechanism 400 arranged above the driving mechanism 200 and used for cutting the material plate 500 on the bearing tray 300. The bearing tray 300 comprises: a box body 310, an inner wall of which is provided with a cavity 311; a plurality of air inlet holes 313 are arranged at the top of the box body 310; and a plurality of air outlet holes 314 are arranged at the bottom of the box body 310. Two oppositely arranged electric drive shielding parts 312 are arranged in the cavity 311. A first negative pressure suction pipeline 320 is in communication with the air outlet holes 314 at the bottom of the box body 310.

[0072] As shown in Figure 3 , a control module is configured to control the two electric drive shielding parts 312 to move in opposite directions (as shown by the direction of F1 in Figure 2 ) to connect the air inlet holes 313 and the air outlet holes 314 corresponding to the cutting area of the material plate 500 and the box body 310, and control an external negative pressure source to suck air through the first negative pressure suction pipeline 320 (the air suction direction is as shown by the arrow of F2 in Figure 2As shown in F3, the dust from the laser cutting mechanism 400 cutting the material plate 500 is drawn from the bottom of the material plate 500.

[0073] By setting a first negative pressure adsorption pipe 320 at the bottom of the box body 310, the smoke and dust generated during laser cutting are directly absorbed from the bottom of the material plate 500, reducing the amount of smoke and dust rising to the laser beam path and reducing the total amount of smoke and dust adhering to the lens, thus preventing the lens from overheating. At the same time, when the electric drive shielding part 312 is controlled to move in opposite directions during cutting, only the air inlet 313 and air outlet 314 corresponding to the area to be cut are exposed, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the negative pressure suction force on the cutting area, improving the adsorption effect of smoke and dust, further reducing the amount of smoke and dust rising to the laser beam path, and further preventing the lens from overheating.

[0074] Please see Figure 2 and Figure 3 The electrically driven shielding part 312 includes: a sliding plate 3121, which is disposed in the cavity 311 and abuts against the upper top wall and lower bottom wall of the cavity 311; a driving cylinder 3122, which is disposed in the cavity 311 and is used to drive the sliding plate 3121 to slide in the cavity 311; the top and bottom of the sliding plate 3121 are connected to the corresponding inner wall of the cavity 311 through corresponding shielding plates 3123; the control module adjusts the position of the sliding plate 3121 through the driving cylinder 3122 to connect the area to be cut of the material plate 500 with the air inlet 313 and air outlet 314 at the corresponding position of the box body 310.

[0075] By providing baffles 3123 connected to the inner wall of cavity 311 at both the top and bottom of sliding plate 3121, air pressure leakage in non-cutting areas is reduced, thereby increasing the adsorption force between the two sliding plates 3121.

[0076] Please continue reading. Figure 2 and Figure 3 The baffle plate 3123 is an elastic sealing plate; and the elastic sealing plate is accordion-shaped; when the driving cylinder 3122 drives the sliding plate 3121 to slide, it drives the baffle plate to connect or close the corresponding air inlet 313 and air outlet 314.

[0077] The accordion-shaped elastic sealing plate automatically deforms as the sliding plate 3121 extends and retracts. When it contracts, it can tightly abut against the top and bottom walls of the cavity 311, further improving the sealing performance between the elastic sealing plate and the cavity 311 and reducing air pressure leakage in non-cutting areas.

[0078] Please see Figure 2 and Figure 4, the bottom of the cavity 311 is provided with a collection groove 315; the collection groove 315 is opened in the middle of the cavity 311; after cutting is completed, the control module is further configured to: when the two electrically-driven shielding parts 312 move towards each other (the direction of movement is as shown by the arrow F2), the debris at the bottom of the cavity 311 is pushed into the collection groove 315 by the electrically-driven shielding part. Figure 2

[0079] The bottom of the collection groove 315 is provided with a debris discharge hole 316; the debris discharge hole 316 is in communication with the first negative pressure suction pipeline 320.

[0080] After each cutting is completed, the control module controls the debris to be cleaned when the electrically-driven shielding part 312 moves towards each other, the debris at the bottom of the cavity 311 is pushed into the collection groove 315, so that the secondary smoke dust generated by the debris is avoided, and meanwhile, the debris is discharged from the debris discharge hole 316 through negative pressure, so that the next cutting is not affected.

[0081] Please refer to Figure 1 and Figure 5 The laser cutting device further comprises a second negative pressure suction pipeline 330; a suction cover 600 is arranged above the box body 310 and is in communication with the second negative pressure suction pipeline 330; the control module is further configured to: control the external negative pressure source to perform suction on the suction cover 600 through the second negative pressure suction pipeline 330, so as to suck the smoke dust at the top of the material plate 500.

[0082] Specifically, the top of the suction cover 600 is provided with an opening 610; the ray outlet of the laser cutting mechanism 400 is arranged above the opening 610; the second negative pressure suction pipeline 330 is in communication with the side wall of the suction cover 600.

[0083] It should be noted that the suction force in the first negative pressure suction pipeline 320 is greater than the suction force in the second negative pressure suction pipeline 330.

[0084] The double-negative pressure suction system is adopted to respectively suck the smoke dust at the top and the bottom of the material plate 500, and the suction force of the first negative pressure pipeline is greater than the suction force of the second negative pressure pipeline, most of the smoke dust is sucked from the bottom of the material plate 500 through the first negative pressure pipeline with a large suction force, and a small amount of escaped smoke dust is sucked from the side wall of the suction cover 600 through the second negative pressure pipeline, so as to avoid the laser light path, reduce the amount of smoke dust attached to the lens of the laser cutting mechanism 400 on the basis of not increasing the energy consumption of the external negative pressure source, and avoid overheating of the lens, so that the laser light path can be directly shot into the opening 610 of the suction cover 600, without the need to avoid the laser light path.

[0085] Please refer to Figure 1 ​, the driving mechanism 200 comprises: a first direction driving part 210 arranged on the work platform 100; a second direction driving part 220 arranged on the first direction driving part 210; the bearing tray 300 is arranged on the second direction driving part 220; the control module is further configured to adjust the position of the bearing tray 300 through the first direction driving part 210 and the second direction driving part 220, so as to facilitate the laser cutting mechanism to cut the material plate 500.

[0086] The position of the material plate 500 is adjusted through the linkage of the first direction driving part 210 (X axis) and the second direction driving part 220 (Y axis), so that the area to be cut of the material plate 500 (such as Figure 2 The solid line shown in the middle black) is always communicated with the air inlet hole 313 and the air outlet hole 314, thereby improving the adsorption effect of the smoke.

[0087] Please refer to Figure 7 At least one embodiment also provides a cutting process applied to the laser cutting device as described above. By arranging the first negative pressure adsorption pipeline 320 at the bottom of the box body 310, the smoke caused by cutting is directly sucked from the bottom of the material plate 500 during laser cutting, thereby reducing the amount of smoke rising to the laser light path, reducing the total amount of smoke adhering to the lens, avoiding overheating of the lens, and at the same time, controlling the two electrically driven shielding parts 312 to move in opposite directions during cutting, thereby exposing only the air inlet hole 313 and the air outlet hole 314 corresponding to the area to be cut, so that the negative pressure adsorption force is concentrated on the real-time processing area, thereby concentrating the suction force of the negative pressure on the cutting area, improving the adsorption effect of the smoke, and further reducing the amount of smoke rising to the laser light path, thereby avoiding overheating of the lens.

[0088] Specifically, the cutting process comprises:

[0089] S110: The control module controls the driving mechanism 200 to convey the bearing tray 300 supporting the material plate 500 to the lower side of the laser cutting mechanism 400;

[0090] S120: The control module controls the two electrically driven shielding parts 312 to move in opposite directions to communicate the air inlet hole 313 and the air outlet hole 314 corresponding to the area to be cut of the material plate 500 with the box body 310;

[0091] S130: The control module controls the external negative pressure source to provide negative pressure for the first negative pressure adsorption pipeline 320;

[0092] S140: The control module drives the laser cutting mechanism 400 to cut the material plate 500, and drives the driving mechanism 200 to move the material plate 500 according to the preset cutting route, at this time, the first negative pressure adsorption pipeline 320 sucks the smoke generated during cutting of the material plate 500 from the bottom of the material plate 500.

[0093] In summary, the present application provides a kind of laser cutting equipment and cutting process, wherein, laser cutting equipment, including: work platform 100;Driving mechanism 200, it is set on the work platform 100;Bearing tray 300, it is set on the driving mechanism 200, and it is used to support material plate 500;Laser cutting mechanism 400, it is set on the driving mechanism 200, and it is used to cut material plate 500 on the bearing tray 300;Wherein, bearing tray 300 includes: box body 310, the inner wall of which is provided with cavity 311, and, the top of the box body 310 is provided with multiple air inlet holes 313, and the bottom of the box body 310 is provided with multiple air outlet holes 314;Two oppositely arranged electric drive shielding parts 312 are arranged in the cavity 311;First negative pressure suction pipeline 320, which is communicated with the air outlet hole 314 at the bottom of the box body 310;Control module, it is configured to: control two the electric drive shielding parts 312 are opposite movement to make the cutting area of material plate 500 and the air inlet hole 313 and the air outlet hole 314 at the corresponding place of box body 310 are communicated, and control external negative pressure source to suck air through the first negative pressure suction pipeline 320 to the air inlet hole 313, to suck the smoke and dust from the bottom of material plate 500 when the laser cutting mechanism 400 cuts material plate 500. By setting the first negative pressure suction pipeline 320 at the bottom of the box body 310, the smoke and dust caused by cutting is directly sucked from the bottom of the material plate 500 during laser cutting, the amount of smoke and dust upwelling to the laser light path is reduced, the total amount of smoke and dust adhering to the lens is reduced, overheating of the lens is avoided, and at the same time, when the electric drive shielding parts 312 are controlled to move in opposite directions during cutting, only the air inlet hole 313 and the air outlet hole 314 corresponding to the cutting area are exposed, so that the negative pressure suction force is concentrated on the real-time processing area, thereby concentrating the suction force of the negative pressure on the cutting area, improving the adsorption effect of the smoke and dust, further reducing the amount of smoke and dust upwelling to the laser light path, and avoiding overheating of the lens.

[0094] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected;It can be mechanically connected, or it can be electrically connected;It can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to specific circumstances.

[0095] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are intended to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, terms such as "first", "second" and other numerical terms are used herein and do not imply order or sequence unless expressly indicated herein. Therefore, the first element, component, region, layer or section discussed above can be referred to as the second element, component, region, layer or section without departing from the teachings of the example embodiments.

[0096] Spatially relative terms, such as "inner", "outer", "below", "below", "lower", "above", "upper", and the like, can be used herein to facilitate the description of the relationship of one element or feature to another element or feature as illustrated in the drawings. In addition to the orientation depicted in the drawings, the spatially relative terms can be intended to encompass different orientations of the device in use or operation. For example, if the device in the drawings is turned over, the element described as "below" or "under" the other element or feature will be oriented "above" the other element or feature. Therefore, the example term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0097] In the above discussion, unless otherwise stated, the terms "about", "approximately", "substantially" and the like, when used in describing a numerical value, mean a variation of + / - 10% of the value.

[0098] With the above ideal embodiments according to the present application as the inspiration, through the above description, relevant personnel can certainly make various changes and modifications within the scope of not deviating from the technical idea of the present application. The technical scope of the present application is not limited to the content in the specification, and must be determined according to the scope of claims.

Claims

1. A laser cutting device, characterized in that, include: Work platform (100); A drive mechanism (200) is disposed on the working platform (100); A support tray (300) is disposed on the drive mechanism (200) and is used to support the material plate (500); A laser cutting mechanism (400) is disposed above the drive mechanism (200) and is used to cut the material plate (500) on the support tray (300); The carrier pallet (300) includes: The box body (310) has a cavity (311) on its inner wall, and the top of the box body (310) has a plurality of air inlets (313) and the bottom of the box body (310) has a plurality of air outlets (314). Two opposing electric drive shielding parts (312) are provided inside the cavity (311). The first negative pressure adsorption pipeline (320) is connected to the air outlet (314) at the bottom of the box body (310); The control module is configured to: control the two electric drive shielding parts (312) to move in opposite directions to connect the air inlet (313) and air outlet (314) at the corresponding positions of the cutting area of ​​the material plate (500) and the box body (310), and control the external negative pressure source to draw air into the air inlet (313) through the first negative pressure adsorption pipe (320) to draw the smoke and dust from the bottom of the material plate (500) when the laser cutting mechanism (400) cuts the material plate (500); The electric drive shield (312) includes: A sliding plate (3121) is disposed in the cavity (311) and abuts against the upper top wall and lower bottom wall of the cavity (311); A drive cylinder (3122) is disposed in the cavity (311) and is used to drive the sliding plate (3121) to slide in the cavity (311); The top and bottom of the sliding plate (3121) are connected to the inner wall of the cavity (311) through corresponding baffles (3123); The control module adjusts the position of the sliding plate (3121) by driving the cylinder (3122) to connect the area to be cut on the material plate (500) with the air inlet (313) and air outlet (314) at the corresponding position on the box body (310).

2. The laser cutting equipment as described in claim 1, characterized in that, The baffle plate (3123) is an elastic sealing plate; Furthermore, the elastic sealing plate is gusseted. When the driving cylinder (3122) drives the sliding plate (3121) to slide, it drives the baffle plate to connect or close the corresponding air inlet (313) and air outlet (314).

3. The laser cutting equipment as described in claim 1, characterized in that, A collection groove (315) is provided at the bottom of the cavity (311). The collection trough (315) is located in the middle of the cavity (311); After the cutting is completed, the control module is also configured to: when the two electric drive shielding parts (312) move towards each other, push the waste at the bottom of the cavity (311) into the collection groove (315) through the electric drive shielding parts.

4. The laser cutting equipment as described in claim 3, characterized in that, The bottom of the collection tank (315) is provided with a chip removal hole (316). The chip removal hole (316) is connected to the first negative pressure adsorption pipeline (320).

5. The laser cutting equipment as described in claim 1, characterized in that, The laser cutting equipment also includes: Second negative pressure adsorption pipeline (330); An adsorption cover (600) is disposed above the box body (310) and is connected to the second negative pressure adsorption pipeline (330); The control module is also configured to control an external negative pressure source to draw air from the adsorption hood (600) through the second negative pressure adsorption pipeline (330) to draw in the dust on the top of the material plate (500).

6. The laser cutting equipment as described in claim 5, characterized in that, The top of the adsorption cover (600) is provided with an opening (610). The ray outlet of the laser cutting mechanism (400) is located above the opening (610); The second negative pressure adsorption pipeline (330) is connected to the side wall of the adsorption cover (600).

7. The laser cutting equipment as described in claim 5, characterized in that, The adsorption force in the first negative pressure adsorption pipeline (320) is greater than the adsorption force in the second negative pressure adsorption pipeline (330).

8. The laser cutting equipment as described in claim 1, characterized in that, The drive mechanism (200) includes: A first directional drive unit (210) is provided on the working platform (100). The second direction drive unit (220) is disposed on the first direction drive unit (210); The carrying tray (300) is disposed on the second direction drive unit (220); The control module is also configured to adjust the position of the support tray (300) via the first direction drive unit (210) and the second direction drive unit (220) so that the laser cutting mechanism can cut the material plate (500).

9. A cutting process applied to the laser cutting equipment as described in claim 1, characterized in that, The cutting process includes: The control module controls the drive mechanism (200) to transport the support tray (300) supporting the material plate (500) to below the laser cutting mechanism (400); The control module controls the two electric drive shielding parts (312) to move in opposite directions to connect the area to be cut on the material plate (500) with the air inlet (313) and air outlet (314) at the corresponding position on the box body (310); Control the external negative pressure source to provide negative pressure to the first negative pressure adsorption pipeline (320); The control module drives the laser cutting mechanism (400) to cut the material plate (500), and moves the material plate (500) according to the preset cutting line through the drive mechanism (200). At this time, the first negative pressure adsorption tube sucks up the smoke and dust from the bottom of the material plate (500) through the air inlet (313).

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