Resistor material cutting device for chip resistor production

Abstract

The invention discloses a resistor material cutting device for chip resistor production, and relates to the technical field of chip resistor production. The transfer device is transversely arranged on the workbench; the first moving device is longitudinally arranged on one side of the workbench; the second moving device is longitudinally arranged on the other side of the workbench, is symmetrical to the first moving device and is the same as the first moving device in structure; the resistor fixing device is sequentially clamped at the tops of the first moving device and the second moving device; the positioning frame is fixed at the top of the workbench; the first cutting device is movably arranged on the positioning frame and located above the first moving device; and the second cutting device is movably arranged on the positioning frame and located above the second moving device. In the cutting process, material pressing and positioning and scrap blowing are synchronously achieved, the cleanliness of the cutting face is ensured, the cutting requirements of resistors of different specifications can be met, and the equipment applicability is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip resistor production, and more particularly to a resistor material cutting device for chip resistor production. Background Art

[0002] In the production process of chip resistors, the cutting accuracy of the resistor material directly affects the product performance parameters. Traditional cutting devices generally have the following technical bottlenecks: the material is easily displaced during cutting, resulting in dimensional deviation, the accumulation of cutting debris affects the accuracy of the equipment, a single cut cannot meet the requirements of multi-dimensional size adjustment, and a lot of manual intervention leads to low production efficiency. Although there are some solutions that use negative pressure fixation in the existing technology, there are problems such as a single adsorption point and incomplete debris cleaning. At the same time, there is a lack of a precise control mechanism for the cutting path, making it difficult to achieve a composite adjustment of the length and width of the resistor, resulting in limited product consistency and production efficiency. Therefore, it is necessary to provide a resistor material cutting device for chip resistor production to solve the problems raised in the above background technology. Summary of the Invention

[0003] To achieve the above-mentioned object, the present invention provides the following technical solution: a resistor material cutting device for chip resistor production, comprising:

[0004] Workbench;

[0005] A transfer device, arranged horizontally on the workbench;

[0006] A first moving device is longitudinally arranged on one side of the workbench;

[0007] The second moving device is longitudinally arranged on the other side of the workbench, is symmetrical with the first moving device, and has the same structure;

[0008] a resistor fixing device, which is sequentially clamped on top of the first movable device and the second movable device;

[0009] Positioning frame, fixed on the top of the workbench;

[0010] a first cutting device, movably arranged on the positioning frame and located above the first moving device;

[0011] The second cutting device is movably arranged on the positioning frame and is located above the second moving device.

[0012] Furthermore, preferably, the transfer device includes:

[0013] A transversely movable slide rail is laterally fixed to the front side of the workbench;

[0014] The movable clamping assembly is movably arranged on the transverse movable slide rail and corresponds to the resistor fixing device.

[0015] Further, as a preference, the first moving device comprises:

[0016] Longitudinal slide rails are linearly arranged and longitudinally fixed on the workbench.

[0017] The moving cross plate is longitudinally movably arranged on the longitudinal slide rails and has a clamping seat for the resistance fixing device in the middle.

[0018] Further, as a preference, the resistance fixing device comprises:

[0019] The negative pressure collecting base is clamped on the moving device and corresponds to the transferring device, and a plurality of negative pressure chip removal openings are arranged on the negative pressure collecting base.

[0020] The moving seats are symmetrically arranged and longitudinally movably arranged at two ends of the negative pressure collecting base.

[0021] The longitudinal slide blocks are symmetrically arranged in front and back, each group is linearly arranged and slidably arranged on the negative pressure collecting base.

[0022] The transverse slide blocks are linearly arranged and slidably arranged on the moving seats.

[0023] The negative pressure suction members are fixed at the centers of the longitudinal slide blocks, the transverse slide blocks and the negative pressure collecting base.

[0024] Further, as a preference, the positioning frame comprises:

[0025] The vertical plates are transversely arranged and vertically fixed on the workbench to separate the moving devices.

[0026] The first transverse rails are fixed on the top of the vertical plates and above the first moving device.

[0027] The fixing ring is fixed on the top of the vertical plates and fixedly connected with the first transverse rails.

[0028] The second transverse rails are arranged in the fixing ring and above the second moving device, and the outer side is rotatably connected with the fixing ring through a rotating circular surface.

[0029] Further, as a preference, the first cutting device and the second cutting device are symmetrically arranged and have the same structure.

[0030] Further, as a preference, the first cutting device comprises:

[0031] The moving block is transversely movably arranged on the positioning frame.

[0032] The lifting assembly is fixed on one side of the bottom of the moving block.

[0033] The buffer positioning assembly is fixed on the lower part of the lifting assembly.

[0034] A fixed track, arranged longitudinally, is fixed to the other side of the bottom of the moving block;

[0035] The lifting and cutting assembly is movably arranged on a fixed track and corresponds to the buffer positioning assembly.

[0036] Furthermore, preferably, the buffer positioning component includes:

[0037] The connecting frame is fixedly connected to the front and rear sides of the lifting assembly;

[0038] The fixed frame is arranged longitudinally and fixedly connected to the lower part of the connecting frame body, and a plurality of blowing ports are provided on the side corresponding to the lifting and cutting assembly;

[0039] A plurality of spacers are provided along the longitudinal direction of the fixing frame, fixed in the middle of the fixing frame, and having a height less than that of the fixing frame;

[0040] The buffer chip removal mechanism is fixed between the spacer plates, with a top plane flush with the top plane of the fixed frame and a bottom plane lower than the bottom plane of the fixed frame.

[0041] Furthermore, preferably, the buffering and chip removal mechanism includes:

[0042] a buffer spring, the middle portion of which is fixed in the middle between the spacer plates;

[0043] A positioning block is fixed to the bottom of the buffer spring and is provided with a slot on a side corresponding to the air outlet, wherein the slot is provided with a communicating hole corresponding to the air outlet;

[0044] The air pressure chamber is fixed on the top of the buffer spring, and a connecting plug is fixed on the bottom of one side corresponding to the slot. The connecting plug is provided with air holes corresponding to the communicating holes on the slot.

[0045] Furthermore, preferably, the lifting and cutting assembly includes:

[0046] The movable cylinder is arranged on a fixed track for longitudinal movement;

[0047] A connecting piece is fixed on the bottom shaft of the moving cylinder;

[0048] A cutter, fixed to the bottom of the connector;

[0049] The movable turntable is rotatably arranged on a side of the connecting member close to the buffer positioning assembly and is located above the fixed frame;

[0050] A plurality of positioning protrusions are provided in an annular distribution and fixed on the outer ring of the movable turntable, respectively corresponding to the tops of the air pressure chambers.

[0051] Compared with the prior art, the present invention has the following beneficial effects:

[0052] In the present invention, the coordinated arrangement of the negative pressure collection base and multiple groups of negative pressure adsorption parts achieves stable adsorption of the resistor material at multiple points, effectively avoiding material displacement during the cutting process, improving cutting accuracy, and promptly separating the cut part from the resistor material body to avoid accumulation of waste materials.

[0053] The linkage design of the buffer positioning component and the lifting and cutting component can simultaneously realize material compression positioning and debris blowing during the cutting process. Combined with the negative pressure chip discharge port at the bottom, a double debris cleaning mechanism is formed to ensure the cleanliness of the cutting surface.

[0054] The symmetrical layout of the first and second moving devices and the automatic switching of the transfer device enable the resistor material to be accurately transferred between the two cutting stations, reducing manual intervention.

[0055] The L-shaped cutting path is designed with two composite cuts, first determining the length longitudinally and then the width transversely. The two paths partially overlap to ensure right-angle closure, significantly improving the flexibility of size adjustment and product consistency.

[0056] By cooperating with the rotatable second transverse track and the fixed ring, the transverse cutting position can be quickly switched to meet the cutting requirements of resistors of different specifications and improve the applicability of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 This is a schematic diagram of the overall structure of a resistor material cutting device for chip resistor production;

[0058] Figure 2 It is a schematic diagram of the structure of the transfer device, the moving device and the positioning frame;

[0059] Figure 3 Schematic diagram of the resistor fixing device structure Figure 1 ;

[0060] Figure 4 Schematic diagram of the resistor fixing device structure Figure 2 ;

[0061] Figure 5 Schematic diagram of the cutting device structure;

[0062] Figure 6 This is a schematic diagram of the buffer positioning component structure;

[0063] Figure 7 Schematic diagram of the buffer chip blowing mechanism Figure 1 ;

[0064] Figure 8 Schematic diagram of the buffer chip blowing mechanism Figure 2 ;

[0065] Figure 9It is a schematic diagram of the lifting and cutting component structure;

[0066] In the figure: 1. Workbench; 2. Transfer device; 3. First moving device; 4. Second moving device; 5. Resistor fixing device; 6. Positioning frame; 7. First cutting device; 8. Second cutting device; 21. Transverse moving slide rail; 22. Mobile clamping assembly; 31. Longitudinal slide rail; 32. Moving horizontal plate; 33. Card seat; 51. Negative pressure collecting base; 52. Moving seat; 53. Longitudinal slide; 54. Transverse slide; 55. Negative pressure adsorption element; 61. Vertical plate; 62. First transverse rail; 63. Fixing ring; 64. Second transverse rail; 65. Rotating Round surface; 71, moving block; 72, lifting assembly; 73, buffer positioning assembly; 74, fixed track; 75, lifting and cutting assembly; 511, negative pressure chip removal port; 731, connecting frame; 732, fixed frame; 733, partition plate; 734, buffer chip removal mechanism; 751, moving cylinder; 752, connecting piece; 753, cutter; 754, moving turntable; 755, positioning protrusion; 7321, air outlet; 7341, buffer spring; 7342, positioning block; 7343, slot; 7344, air pressure chamber; 7345, connecting plug-in. DETAILED DESCRIPTION

[0067] See also Figures 1 to 9 ,In an embodiment of the present invention, a resistance material cutting device for chip resistor production includes a workbench 1;

[0068] The transfer device 2 is arranged horizontally on the workbench 1;

[0069] A first moving device 3 is longitudinally arranged on one side of the workbench 1;

[0070] The second moving device 4 is longitudinally arranged on the other side of the workbench 1, symmetrical to the first moving device 3, and has the same structure;

[0071] The resistor fixing device 5 is sequentially clamped on the top of the first moving device 3 and the second moving device 4;

[0072] A positioning frame 6 is fixed on the top of the workbench 1;

[0073] The first cutting device 7 is movably arranged on the positioning frame 6 and is located above the first moving device 3;

[0074] The second cutting device 8 is movably arranged on the positioning frame 6 and is located above the second moving device 4 .

[0075] In this embodiment, the transfer device 2 includes:

[0076] A transverse movable slide rail 21 is laterally fixed to the front side of the workbench 1;

[0077] The movable clamping assembly 22 is movably arranged on the transverse movable slide rail 21 and corresponds to the resistor fixing device 5 .

[0078] In this embodiment, the first mobile device 3 includes:

[0079] Two longitudinal slide rails 31 are arranged in a straight line and are longitudinally fixed on the workbench 1;

[0080] The movable transverse plate 32 is arranged on the longitudinal slide rail 31 for longitudinal movement, and a clamping seat 33 for the resistor fixing device 5 is provided in the middle.

[0081] That is to say, under the action of the mobile clamping assembly 22, the resistor fixing device 5 is clamped and moved, and the resistor fixing device 5 is driven by the transverse moving slide rail 21 to switch in sequence between the first moving device 3 and the second moving device 4, and the mobile clamping assembly 22 pushes the resistor fixing device 5 to the holder 33 on the mobile transverse plate 32 to fix the position, and the longitudinal slide rail 31 drives the mobile transverse plate 32 to move, and moves the resistor fixing device 5 to the bottom of the cutting device to cut the resistor material.

[0082] In this embodiment, the resistor fixing device 5 includes:

[0083] The negative pressure collecting base 51 is stuck on the moving device and corresponds to the transfer device 2. The negative pressure collecting base 51 is provided with a plurality of negative pressure chip discharge ports 511;

[0084] Two movable seats 52 are symmetrically distributed and longitudinally movable at both ends of the negative pressure collecting base 51;

[0085] The longitudinal sliders 53 are symmetrically distributed in two groups, each group having a plurality of sliders distributed in a straight line, and are slidably arranged on the negative pressure collecting base 51;

[0086] A plurality of transverse sliders 54 are linearly distributed and slidably disposed on the movable seat 52;

[0087] The negative pressure adsorption member 55 is fixed at the center of the longitudinal slider 53 , the transverse slider 54 and the negative pressure collecting base 51 .

[0088] That is to say, multiple negative pressure adsorption parts 55 adsorb and fix the resistor material, so that the resistor material is fixed on the resistor fixing device 5, effectively preventing displacement during the cutting process and affecting the cutting accuracy. In addition, the arrangement of multiple negative pressure adsorption parts 55 means that after the cutting device cuts the resistor material, the cut resistor material can be moved and detached by the longitudinal slider 53 and the transverse slider 54. The debris generated during the cutting process is collected and cleaned by the negative pressure collection base 51 through the negative pressure chip discharge port 511.

[0089] In this embodiment, the positioning frame 6 includes:

[0090] Vertical plate 61, three pieces are vertically fixed on the workbench 1, and separate the moving device;

[0091] The first horizontal rail 62 is fixed on the top of the vertical plate 61 and above the first moving device 3;

[0092] The fixed ring 63 is fixed on the top of the vertical plate 61 and fixedly connected with the first horizontal rail 62;

[0093] The second horizontal rail 64 is arranged in the fixed ring 63 and above the second moving device 4, and the outer side is rotatably connected with the fixed ring 63 through the rotating disc 65.

[0094] That is, under the action of the first horizontal rail 62, the first cutting device 7 is driven to move horizontally, and the resistance material on the resistance fixing device 5 is cut to select the length position of the resistance material and perform the first vertical cutting, that is, longitudinal cutting, to adjust the resistance length. Under the action of the second horizontal rail 64, the second cutting device 8 is driven to move horizontally to adjust the longitudinal cutting position in the second L-shaped cutting to further determine the resistance length. Then, the second horizontal rail 64 is driven to rotate counterclockwise by 90° in the fixed ring 63 through the rotating disc 65, and the second horizontal rail 64 is used again to determine the horizontal cutting position in the second L-shaped cutting to determine the resistance width, and the two cutting paths partially overlap to ensure the right angle closure.

[0095] In the embodiment, the first cutting device 7 and the second cutting device 8 are symmetrically arranged and have the same structure.

[0096] That is, after the first cutting device 7 cuts one end of the resistance material, the second cutting device 8 cuts the other end of the resistance material, and the length of the resistance material is accurately positioned through the cutting of the two ends to improve the accuracy.

[0097] In the embodiment, the first cutting device 7 comprises:

[0098] The moving block 71 is horizontally arranged on the positioning frame 6;

[0099] The lifting assembly 72 is fixed on one side of the bottom of the moving block 71;

[0100] The buffer positioning assembly 73 is fixed on the lower part of the lifting assembly 72;

[0101] The fixed rail 74 is longitudinally arranged and fixed on the other side of the bottom of the moving block 71;

[0102] The lifting cutting assembly 75 is movably arranged on the fixed rail 74 and corresponds to the buffer positioning assembly 73.

[0103] That is to say, when cutting the resistor material, the cutting position is adjusted by moving the moving block 71 on the horizontal slide rail, and then the lifting assembly 72 and the lifting and cutting assembly 75 move downward synchronously. The lifting assembly 72 is fixed to the retained part of the resistor material through the buffer positioning assembly 73, and then the lifting and cutting assembly 75 moves longitudinally on the fixed rail 74 to cut the resistor material and preliminarily determine the length of the resistor material.

[0104] In this embodiment, the buffer positioning component 73 includes:

[0105] The connecting frame 731 is fixedly connected to the front and rear sides of the lifting assembly 72;

[0106] The fixed frame 732 is arranged longitudinally and fixedly connected to the lower part of the connecting frame 731, and a plurality of blowing ports 7321 are provided on the side corresponding to the lifting and cutting assembly 75;

[0107] A plurality of spacers 733 are provided longitudinally along the fixed frame 732 and fixed in the middle of the fixed frame 732 , and the height of the spacers 733 is less than the height of the fixed frame 732 ;

[0108] The buffering chip removal mechanism 734 is fixed between the spacer plates 733 , with its top plane flush with the top plane of the fixed frame 732 and its bottom plane lower than the bottom plane of the fixed frame 732 .

[0109] That is, under the action of the lifting assembly 72 , the fixing frame 732 and the buffer chip removal mechanism 734 are driven downward through the connecting frame 731 to fix the resistance material.

[0110] In this embodiment, the buffering and chip removal mechanism 734 includes:

[0111] Buffer spring 7341, the middle portion of which is fixed in the middle portion between the spacer plates 733;

[0112] The positioning block 7342 is fixed to the bottom of the buffer spring 7341 and has a slot 7343 on the side corresponding to the air outlet 7321. The slot 7343 has a communication hole corresponding to the air outlet 7321.

[0113] The air pressure chamber 7344 is fixed to the top of the buffer spring 7341 , and a connecting plug-in 7345 is fixed to the bottom of the side corresponding to the slot 7343 . The connecting plug-in 7345 is provided with air holes corresponding to the connecting holes on the slot 7343 .

[0114] That is to say, when the lifting assembly 72 drives the buffer positioning assembly 73 to move downward to fix the resistor material, the positioning block 7342 contacts the resistor material, and then in the process of continuous downward movement, the buffer spring 7341 is compressed, and the positioning block 7342 moves toward the inside of the fixed frame 732, so that the connecting hole on the slot 7343 corresponds to the air outlet 7321 on the fixed frame 732. When the lifting and cutting assembly 75 moves to cut the resistor material, it pushes the air pressure chamber 7344 at the corresponding position downward to compress the upper part of the buffer spring 7341, and then the air hole on the connecting plug-in 7345 is connected to the connecting hole in the slot 7343, and air is blown to the cutting position to blow off the cutting debris to prevent the debris from affecting the cutting accuracy and causing safety hazards.

[0115] In this embodiment, the lifting and cutting assembly 75 includes:

[0116] The movable cylinder 751 is arranged on the fixed rail 74 for longitudinal movement;

[0117] The connecting member 752 is fixed on the bottom shaft of the moving cylinder 751;

[0118] Cutter 753, fixed to the bottom of the connecting member 752;

[0119] The movable turntable 754 is rotatably arranged on a side of the connecting member 752 close to the buffer positioning assembly 73 and is located above the fixed frame 732;

[0120] There are multiple positioning protrusions 755 distributed in an annular shape and fixed on the outer ring of the movable turntable 754 , corresponding to the top of the air pressure chamber 7344 respectively.

[0121] That is to say, after the buffer chip removal mechanism 734 fixes the top of the resistor material, the movable cylinder 751 pushes the cutter 753 to move downward, and then the movable cylinder 751 moves longitudinally on the fixed track 74 to cut the resistor material vertically. While the cutter 753 is moving and cutting, the movable turntable 754 rotates above the fixed frame 732 through the positioning protrusion 755, and presses down the air pressure chamber 7344 corresponding to the cutting position in turn, so that the corresponding blowing port 7321 on the side of the fixed frame 732 is blown to blow out the debris generated during the cutting process to the outside, keeping the resistor material clean and tidy after cutting, and preventing the cutting accuracy from being affected and causing safety hazards. After the cutting is completed, the movable cylinder 751 drives the cutter 753 to move upward and reset. At the same time, the buffer positioning assembly 73 keeps the resistor material fixed so that the cutter 753 can quickly detach to avoid sticking. After the cutter 753 detaches, the fixed frame 732 moves upward, the buffer spring 7341 rebounds and resets, driving the positioning block 7342 to detach from the resistor material.

[0122] During the specific implementation, first, when performing the first vertical cut, it is used to preliminarily adjust the resistance value. The resistor fixing device 5 and the resistor material are pushed to the holder 33 of the movable horizontal plate 32 in the first movable device 3 through the movable clamping component 22 in the transfer device 2. Then the longitudinal slide rail 31 drives the resistor fixing device 5 to move, so that the resistor material moves to the bottom of the first cutting device 7. Then the moving block 71 moves on the first horizontal rail 62, so that the first cutting device 7 moves to the right end of the resistor material, and preliminarily determines the length of the resistor material. Then, the lifting component 72 drives the buffer positioning component 73 to move downward to fix the resistor material. The positioning block 7342 contacts the retained resistor material, and then in the process of continuous downward movement, the buffer spring 7341 is The compression is performed, and the positioning block 7342 moves toward the inside of the fixed frame 732, so that the connecting hole on the slot 7343 corresponds to the air blowing port 7321 on the fixed frame 732. Then, when the cutter 753 in the lifting and cutting assembly 75 moves downward to cut the resistor material, the movable turntable 754 rotates above the fixed frame 732 through the positioning protrusion 755, and presses down the air pressure cavity 7344 corresponding to the cutting part in turn, compressing the upper part of the buffer spring 7341, and then the air hole on the connecting plug 7345 is connected with the connecting hole in the slot 7343, so that the corresponding air blowing port 7321 on the side of the fixed frame 732 is blown to blow out the debris generated during the cutting process to the outside, and at the same time, the negative pressure collecting base 51 at the bottom of the resistor material is The negative pressure chip removal port 511 on the upper portion continuously generates suction to collect and process the fallen debris to prevent the debris from affecting the cutting accuracy and causing safety hazards. After the first vertical cut is completed, the movable cylinder 751 drives the cutter 753 to move up and reset. At the same time, the buffer positioning assembly 73 keeps the resistor material fixed so that the cutter 753 can quickly separate to avoid sticking. After the cutter 753 separates, the fixed frame 732 moves up, and the buffer spring 7341 rebounds and resets, driving the positioning block 7342 to separate from the resistor material. At the same time, the horizontal slider 54 on the right side of the resistor fixing device 5 drives the removed resistor material to actively separate from the resistor material body, and then the movable clamping assembly 22 moves the resistor fixing device 5 to the movable horizontal plate 32 in the second movable device 4. On the holder 33, the second moving device 4 moves the resistor fixing device 5 to the bottom of the second cutting device 8 to perform a second L-shaped cutting to achieve fine-tuning. The second cutting process is divided into two steps: first, the longitudinal cutting is completed to determine the resistor length, and then the transverse cutting is performed to determine the resistor width. First, the moving block 71 moves on the second transverse track 64 to move the second cutting device 8 to the left end of the resistor material to determine the length of the resistor material. Then, the lifting component 72 drives the buffer positioning component 73 to move downward to fix the retained resistor material body. Then, the lifting and cutting component 75 moves downward and moves longitudinally on the fixed track 74 to cut the resistor material. In addition, the negative pressure chip removal port 511 on the negative pressure collection base 51 continues to work.The air blow port 7321 on the side of the fixed frame 732 assists in cleaning debris. After the cutting is completed, the lifting and cutting assembly 75 and the buffer positioning assembly 73 are reset in sequence. Then, the second transverse track 64 is driven by the rotating disk 65 to rotate 90 degrees counterclockwise within the fixed ring 63. The transverse cutting position in the second L-shaped cut is determined by the second transverse track 64 again, and the resistor width is determined. The two cutting paths partially overlap to ensure right-angle closure. After the transverse cut is completed, the longitudinal slider 53 on the front side of the negative pressure collection base 51 and the movable seat 52 on the left end move forward, driving the front part of the removed resistor material to separate from the main body of the resistor material. Then, the negative pressure adsorption member 55 on the top of the longitudinal slider 53 separates from the removed resistor material. The removed resistor material is driven by the transverse slider 54 on the left end to move to the left, completely separated from the main body of the resistor material. Only the negative pressure adsorption members 55 in the middle and rear sides retain the cut resistor material.

[0123] The above is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A resistor material cutting device for chip resistor production, characterized by: include: Workbench (1); A transfer device (2) is arranged horizontally on the workbench (1); A first moving device (3) is longitudinally arranged on one side of the workbench (1); A second moving device (4) is longitudinally arranged on the other side of the workbench (1), is symmetrical with the first moving device (3), and has the same structure; The resistor fixing device (5) is sequentially clamped on the top of the first movable device (3) and the second movable device (4); A positioning frame (6) is fixed on the top of the workbench (1); A first cutting device (7) is movably arranged on the positioning frame (6) and is located above the first moving device (3); The second cutting device (8) is movably arranged on the positioning frame (6) and is located above the second moving device (4).

2. The device for cutting resistor materials for chip resistor production according to claim 1, characterized in that: The transfer device (2) comprises: A transverse movable slide rail (21) is laterally fixed to the front side of the workbench (1); The movable clamping assembly (22) is movably arranged on the transverse movable slide rail (21) and corresponds to the resistor fixing device (5).

3. The device for cutting resistor materials for chip resistor production according to claim 1, characterized in that: The first moving device (3) comprises: Two longitudinal slide rails (31) are arranged in a straight line and are longitudinally fixed on the workbench (1); The movable transverse plate (32) is arranged on the longitudinal slide rail (31) for longitudinal movement, and a holder (33) for the resistor fixing device (5) is provided in the middle thereof.

4. The resistance material cutting device for chip resistor production according to claim 1, characterized in that: The resistor fixing device (5) comprises: A negative pressure collecting base (51) is clamped on the moving device and corresponds to the transfer device (2), and a plurality of negative pressure chip removal ports (511) are provided on the negative pressure collecting base (51); Two movable seats (52) are symmetrically distributed and longitudinally movable at both ends of the negative pressure collecting base (51); Two groups of longitudinal sliders (53) are symmetrically distributed front and back, with a plurality of sliders distributed linearly in each group, and are slidably arranged on the negative pressure collection base (51); A plurality of transverse sliders (54) are linearly distributed and slidably arranged on the movable seat (52); The negative pressure adsorption member (55) is fixed at the center of the longitudinal slider (53), the transverse slider (54) and the negative pressure collection base (51).

5. The resistance material cutting device for chip resistor production according to claim 1, characterized in that: The positioning frame (6) includes: Three vertical plates (61) are arranged horizontally and fixed vertically on the workbench (1) to separate the moving devices; A first transverse rail (62) is fixed to the top of the vertical plate (61) and is located above the first moving device (3); A fixed ring (63) is fixed to the top of the vertical plate (61) and is fixedly connected to the first transverse rail (62); The second transverse track (64) is arranged in the fixed ring (63) and is located above the second moving device (4). The outer side of the track is provided with a rotating circular surface (65) which is rotatably connected to the fixed ring (63).

6. The resistance material cutting device for chip resistor production according to claim 1, characterized in that: The first cutting device (7) and the second cutting device (8) are symmetrically arranged and have the same structure.

7. The device for cutting resistor materials for chip resistor production according to claim 6, characterized in that: The first cutting device (7) comprises: A moving block (71) is arranged to move laterally on the positioning frame (6); A lifting assembly (72) is fixed to one side of the bottom of the moving block (71); A buffer positioning assembly (73) is fixed to the lower portion of the lifting assembly (72); A fixed track (74), arranged longitudinally and fixed to the other side of the bottom of the moving block (71); The lifting and cutting assembly (75) is movably arranged on the fixed track (74) and corresponds to the buffer positioning assembly (73).

8. The resistance material cutting device for chip resistor production according to claim 7, characterized in that: The buffer positioning component (73) comprises: A connecting frame (731) is fixedly connected to the front and rear sides of the lifting assembly (72); A fixed frame (732) is arranged longitudinally and fixedly connected to the lower portion of the connecting frame (731), and a plurality of air blowing ports (7321) are provided on a side corresponding to the lifting and cutting assembly (75); A plurality of spacer plates (733) are longitudinally distributed along the fixed frame (732), fixed in the middle of the fixed frame (732), and have a height less than that of the fixed frame (732); The buffering chip removal mechanism (734) is fixed between the spacer plates (733), with a top plane flush with the top plane of the fixed frame (732) and a bottom plane lower than the bottom plane of the fixed frame (732).

9. The device for cutting resistor materials for producing chip resistors according to claim 8, characterized in that: The buffering and chip removal mechanism (734) comprises: A buffer spring (7341), the middle portion of which is fixed in the middle portion between the spacer plates (733); A positioning block (7342) is fixed to the bottom of the buffer spring (7341), and a slot (7343) is provided on a side corresponding to the air blowing port (7321), and a communication hole corresponding to the air blowing port (7321) is provided on the slot (7343); The air pressure chamber (7344) is fixed to the top of the buffer spring (7341), and a connecting plug (7345) is fixed to the bottom of the side corresponding to the slot (7343). The connecting plug (7345) is provided with an air hole corresponding to the connecting hole on the slot (7343).

10. The device for cutting resistor materials for producing chip resistors according to claim 9, characterized in that: The lifting and cutting assembly (75) comprises: A movable cylinder (751) is disposed on a fixed track (74) for longitudinal movement; A connecting member (752) is fixed to the bottom shaft of the moving cylinder (751); A cutter (753) is fixed to the bottom of the connecting member (752); A movable turntable (754) is rotatably arranged on a side of the connecting member (752) close to the buffer positioning assembly (73) and located above the fixed frame (732); A plurality of positioning protrusions (755) are provided in an annular distribution and are fixed to the outer ring of the movable turntable (754), respectively corresponding to the tops of the air pressure chambers (7344).

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