Bamboo fiber silicon carbide reinforced epoxy resin composite material and preparation method thereof

Abstract

The invention discloses a bamboo fiber / silicon carbide reinforced epoxy resin composite material and a preparation method thereof, and relates to the technical field of composite materials. The composite material is composed of epoxy resin, a curing agent, three layers of plain woven bamboo fiber cloth and silicon carbide particles, the optimal addition amount of silicon carbide is 6 wt%, the mass ratio of bamboo fiber to epoxy resin is 1: (1.5-2.0), and the mass ratio of epoxy resin to curing agent is 10: 1. The preparation method comprises the following steps: mechanically stirring and mixing the silicon carbide particles and the epoxy resin, adding the curing agent, coating on the surface of the bamboo fiber cloth, stacking layer by layer, rolling to remove bubbles, curing at room temperature for 24 hours, and curing at 80 DEG C for 2 hours. According to the composite material, when the addition amount of silicon carbide is 6wt%, the impact strength is improved by 59.4%, the tensile strength is improved by 30.7%, the thermal expansion coefficient is remarkably reduced, the glass-transition temperature is improved to 120-130 DEG C, the porosity is only 1.64%, interface bonding is tight, and the composite material is suitable for the high-temperature and high-load fields of aerospace, automobiles, electronic packaging and the like.

Description

Technical Field

[0001] The invention relates to the technical field of epoxy resin composite materials, and in particular to a bamboo fiber silicon carbide reinforced epoxy resin composite material and a preparation method thereof. Background Art

[0002] Natural fiber-reinforced epoxy resin composites have attracted significant attention in the engineering field in recent years due to their lightweight, biodegradable, and environmentally friendly properties. Bamboo fiber, with its high specific strength, low cost, and renewable nature, is considered an ideal alternative to traditional synthetic fibers. However, bamboo fiber has significant drawbacks when combined with an epoxy resin matrix. At high temperatures, the fiber-matrix interface is susceptible to thermal degradation, resulting in a sharp drop in the composite's interlaminar shear strength. Furthermore, the impact resistance and thermal expansion stability of pure bamboo fiber composites struggle to meet the demanding operating conditions required in aviation, automotive, and other fields.

[0003] To improve the above defects, the industry has tried to introduce ceramic particles as functional fillers. Silicon carbide particles are often used to improve the thermomechanical properties of composite materials due to their high hardness, low thermal expansion coefficient and excellent thermal conductivity. However, the introduction of silicon carbide in existing technologies is often accompanied by new contradictions: when added in excess, the particles tend to agglomerate in the resin matrix, which not only hinders the full infiltration of the resin into the fiber, but also causes stress concentration at the interface, which in turn weakens the fracture toughness of the composite material; on the other hand, silicon carbide has poor interfacial compatibility with the organic matrix. If the dispersion process is not appropriate, phase separation is likely to occur at high temperatures, which greatly reduces the effect of improving thermal stability.

[0004] Current preparation technologies often focus on optimizing a single performance metric, failing to balance mechanical strength, energy absorption efficiency, and thermal expansion behavior. In particular, under the coupled dynamic loads and thermal cycling conditions, existing bamboo fiber composites often experience premature failure due to insufficient storage modulus and suboptimal damping properties. This performance imbalance severely restricts the large-scale application of these environmentally friendly materials in advanced applications. Summary of the Invention

[0005] In response to the above technical problems, the present application solves the problems of thermal degradation of the fiber and matrix interface, insufficient impact resistance and thermal expansion stability of bamboo fiber reinforced epoxy resin composites under high temperature and dynamic load and thermal cycle coupling conditions.

[0006] In order to achieve the above purpose, the technical solution adopted in this application is: the composition of bamboo fiber silicon carbide reinforced epoxy resin composite material

[0007] Matrix: Araldite LY-556 epoxy resin and Aradur HY-951 curing agent are used in a mass ratio of 10:1. This system has excellent bond strength and mechanical properties after curing, providing a stable load-bearing matrix for bamboo fiber and silicon carbide particles.

[0008] Enhanced body:

[0009] Three-layer plain weave bamboo fiber cloth: surface density 250-400GSM, a uniform fiber network is formed through the plain weave process, providing high specific strength and tear resistance.

[0010] Silicon carbide particles: Particle size 36 μm, added in an amount of 0-12 wt% of the epoxy resin. As a second reinforcement phase, the silicon carbide particles fill the pores of the resin matrix and form a "particle-fiber" synergistic reinforcement effect with the bamboo fibers.

[0011] Key ratios:

[0012] The optimal silicon carbide addition is 6wt%: at this time, the impact strength is increased by 59.4%, the tensile strength is increased by 30.7%, the coefficient of thermal expansion (CTE) is reduced by 40%, the glass transition temperature (Tg) is increased to 120-130°C, and the porosity is only 1.64%.

[0013] The mass ratio of bamboo fiber to epoxy resin is 1:1.5-2.0: ensure that the resin fully infiltrates the fiber surface to form a tight interface bond.

[0014] 2. Preparation Method

[0015] Step S1: Mixing and dispersion

[0016] The silicon carbide particles and epoxy resin are uniformly dispersed through mechanical stirring (speed 500-800 rpm, time 15-20 minutes) to form a stable particle / resin suspension. This process breaks up particle agglomerates through shear force and utilizes the viscosity of the resin to achieve physical adsorption on the particle surface, ensuring uniform distribution of the particles in the matrix.

[0017] Step S2: Lamination

[0018] Apply the mixed liquid on the surface of bamboo fiber cloth (coating amount 200-300g / m 2 ), stacked layer by layer to form a three-layer structure, and then rolled (pressure 2-3MPa) to remove air bubbles between the layers. The rolling process not only eliminates porosity but also strengthens the interface between the fiber and the resin through mechanical meshing.

[0019] Step S3: Curing

[0020] A step-by-step curing process is employed, with room temperature curing for 24 hours followed by a post-curing at 80°C for 2 hours. The room temperature curing stage forms a preliminary cross-linking network, while the high-temperature post-curing further promotes complete cross-linking of the resin, enhancing the thermal stability and creep resistance of the composite material.

[0021] 1. Dispersion and synergistic enhancement of silicon carbide particles

[0022] Mechanical stirring combined with ultrasound-assisted dispersion technology was used to achieve preliminary dispersion of the particles at a rotation speed of 500-800 r / min, and then 300 W ultrasonic treatment (frequency 40 kHz, time 10 min) was used to further break up the micron-sized agglomerates.

[0023] The particle surface is pretreated with a silane coupling agent (KH-550). One end of the coupling agent molecule reacts with the hydroxyl group on the silicon carbide surface, and the other end forms a chemical bond with the epoxy resin, thereby enhancing the interfacial compatibility between the particle and the resin.

[0024] Evenly dispersed silicon carbide particles fill the pores of the resin matrix and reduce stress concentration areas;

[0025] The particles and bamboo fibers form a "rigid particles-flexible fibers" composite reinforcement system, which dissipates energy through the crack deflection of the particles and the bridging effect of the fibers under impact loads.

[0026] When 6wt% silicon carbide is added, the impact strength increases from 32.5J / m 2 Increased to 52.3J / m 2 , tensile strength increased from 29.8MPa to 38.9MPa;

[0027] The porosity decreased from 3.12% to 1.64%, and SEM showed no obvious pores or fiber pullout at the interface.

[0028] 2. Interface optimization between bamboo fiber and resin

[0029] Before use, the bamboo fiber cloth was treated with NaOH solution (concentration 5wt%, temperature 60℃, time 30min) to remove surface wax and pectin and increase fiber surface roughness and hydroxyl content;

[0030] The "dipping-rolling" process is used to control the resin impregnation degree to ensure that a resin transition layer with a thickness of about 5-10μm is formed on the fiber surface.

[0031] Chemical treatment increases the polarity of the fiber surface and strengthens the chemical bond with epoxy resin;

[0032] The resin transition layer acts as a stress buffer area to relieve the interface stress generated by the difference in thermal expansion coefficient between the fiber and the matrix.

[0033] The interlaminar shear strength is increased by 45%, and the glass transition temperature (Tg) is increased to 120-130℃;

[0034] Thermomechanical analysis (TMA) shows that the thermal expansion rate at 100℃ is reduced by 55% compared to pure bamboo fiber composite materials.

[0035] 3. Dynamic mechanical property regulation

[0036] The crosslinking density of the resin is regulated by optimizing the curing process parameters (such as heating rate, holding time);

[0037] The introduction of silicon carbide particles changes the damping properties of the composite material, forming a "particle-resin" interface friction energy dissipation mechanism.

[0038] The high crosslinking density resin matrix provides high storage modulus (1.8 GPa, 1 Hz), ensuring the stiffness of the composite material under dynamic load;

[0039] The friction energy dissipation at the particle-resin interface narrows the peak width of the loss factor (tan δ), and the energy absorption efficiency is increased by 30%.

[0040] The dynamic mechanical properties of the composite material at 10 Hz frequency are better than those of the existing technology of bamboo fiber / epoxy resin composite material;

[0041] After thermal cycling (-40℃ to 120℃, 100 cycles), the performance attenuation rate is less than 10%.

[0042] The core distinguishing features of the invention are:

[0043] Multi-scale reinforcement structure: bamboo fiber cloth provides a macroscopic load-bearing skeleton, and silicon carbide particles fill the microscopic pores, forming a "fiber-particle" synergistic reinforcement system, breaking through the performance bottleneck of single reinforcement phase in the existing technology.

[0044] Stepwise curing process: by combining room temperature pre-curing and high temperature post-curing, the gradient optimization of the resin crosslinking network is realized, solving the problem of insufficient thermal stability caused by incomplete curing in the existing technology.

[0045] In the existing technology, the addition of silicon carbide particles more than 6wt% is easy to form agglomeration, and the present invention successfully realizes the uniform dispersion of 6wt% particles through the combination process of mechanical stirring and ultrasonic dispersion;

[0046] The interface thermal degradation problem of bamboo fiber and resin is common in the existing technology, and the present invention realizes the significant improvement of interface bonding strength through NaOH treatment and coupling agent modification.

[0047] The prior art does not disclose the specific implementation method of the "particle-fiber" synergistic reinforcement mechanism. The present invention optimizes the particle size (36 μm) and the fiber weaving method (three-layer plain weave) to achieve the energy dissipation synergistic effect of the two under dynamic load for the first time.

[0048] The parameter design of the step-by-step curing process (room temperature for 24 hours + 80°C for 2 hours) is based on in-depth research on the cross-linking dynamics of the resin. The existing technology mostly uses a single temperature curing, which cannot achieve the thermal stability improvement effect of the present invention.

[0049] The technical solution provided by the present invention has the following beneficial effects compared with the prior art:

[0050] 1. By optimizing the addition amount of silicon carbide particles (optimal at 6wt%), the present invention improves the impact strength of the composite material by 59.4%, the tensile strength by 30.7%, and the hardness by 5.9%. This solves the problem of insufficient impact resistance of existing bamboo fiber reinforced composite materials and meets the stringent requirements of the engineering field for the mechanical properties of materials.

[0051] 2. In the present invention, the addition of 6wt% silicon carbide increases the glass transition temperature (Tg) of the composite material to 120-130°C, reduces the thermal expansion coefficient by 40%, and reduces the thermal expansion rate by 55% at 100°C compared with the pure bamboo fiber / epoxy resin composite material. This effectively overcomes the defects of easy degradation of the fiber-matrix interface and poor thermal expansion stability under high temperature environments, and expands the application range of the material under high temperature conditions.

[0052] 3. Through a reasonable preparation process and component ratio, the present invention achieves a composite material with a porosity of only 1.64% when 6 wt% silicon carbide is added. Scanning electron microscopy shows no pores or fiber pullout at the interface, solving the problems of agglomeration, interfacial stress concentration, and phase separation caused by excessive addition of silicon carbide particles, thereby improving the structural stability and durability of the material.

[0053] 4. The preparation method of this invention utilizes conventional processes such as mechanical mixing, layer-by-layer stacking and rolling, and step-by-step curing. This eliminates the need for complex equipment and facilitates industrial production. Furthermore, the use of bamboo fiber as reinforcement is less expensive than traditional synthetic fibers, and optimized silicon carbide particle addition to 6wt% maximizes performance, balancing material performance with production costs.

[0054] 5. This invention breaks through the limitations of the existing technology of single performance optimization and achieves a synergistic improvement in mechanical strength, energy absorption efficiency and thermal expansion behavior, so that the composite material can still maintain good performance under the coupling of dynamic loads and thermal cycles. It can be widely used in high-end fields such as automotive brake pads, electronic heat dissipation substrates and aviation structural parts, with significant economic and environmental benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0056] Figure 1 It is a process flow chart of the present invention. DETAILED DESCRIPTION

[0057] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0058] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0059] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0060] In the description of this application, it should be noted that if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the product of the application is usually placed when in use. It is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, it cannot be understood as a limitation on this application. In addition, if the terms "first", "second", etc. appear in the description of this application, they are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0061] Furthermore, the use of terms such as "horizontal" and "vertical" in the description of this application does not necessarily imply that a component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical" and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0062] It should also be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. A person of ordinary skill in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0063] like Figure 1 As shown, the present invention discloses a bamboo fiber / silicon carbide reinforced epoxy resin composite material, comprising epoxy resin, curing agent, three layers of plain woven bamboo fiber cloth and silicon carbide particles;

[0064] The surface density of the bamboo fiber cloth is 250-400GSM;

[0065] The particle size of the silicon carbide particles is 36 μm, and the addition amount of the silicon carbide particles is 0-12 wt % of the weight of the epoxy resin.

[0066] The added amount of the silicon carbide particles is 6 wt % of the weight of the epoxy resin.

[0067] The mass ratio of the bamboo fiber cloth to the epoxy resin is 1:1.5-2.0.

[0068] The epoxy resin is Araldite LY-556, and the curing agent is Aradur HY-951.

[0069] The mass ratio of the epoxy resin to the curing agent is 10:1.

[0070] The present invention discloses a method for preparing a bamboo fiber / silicon carbide reinforced epoxy resin composite material, which is used to prepare the above composite material. The preparation method comprises the following steps:

[0071] Step S1, mixing silicon carbide particles and epoxy resin evenly, then adding a curing agent and stirring evenly;

[0072] Step S2, applying the mixture obtained in step S1 to the surface of the bamboo fiber cloth, stacking the bamboo fiber cloth layer by layer to form a laminated structure, and rolling to remove bubbles;

[0073] Step S3, curing the laminated structure obtained in step S2 to obtain a bamboo fiber / silicon carbide reinforced epoxy resin composite material.

[0074] In step S3, the curing treatment includes curing at room temperature for 24 hours and then post-curing at 80°C for 2 hours.

[0075] In the step S1, the silicon carbide particles and the epoxy resin are mixed by mechanical stirring until they are uniformly dispersed.

[0076] In step S2, the bamboo fiber cloth is a three-layer plain woven bamboo fiber cloth.

[0077] Quantification of the technical effect of the present invention

[0078] Performance indicators Pure bamboo fiber composite material Composite material of the present invention (6wt% SiC) Improvement <![CDATA[冲击强度(J / m 2 )]]> 32.5 52.3 59.4％ Tensile strength (MPa) 29.8 38.9 30.7％ Glass transition temperature (℃) 92 125 35.9％ Thermal expansion coefficient (ppm / ℃) 85 51 40.0％ Porosity (%) 3.12 1.64 47.4％ Storage modulus (1Hz) 1.2GPa 1.8GPa 50.0％

[0079] Example 1: Control group (0% silicon carbide)

[0080] Material ratio:

[0081] Epoxy resin (Araldite LY-556): 100 parts by weight;

[0082] Curing agent (Aradur HY-951): 10 parts by weight (resin: curing agent = 10:1);

[0083] Bamboo fiber cloth (3-layer plain weave, surface density 250 gsm): 100 parts by weight (bamboo fiber: epoxy resin = 1:1.5).

[0084] Preparation steps:

[0085] Mixing and dispersion: Mechanically stir the epoxy resin and curing agent at a speed of 500r / min for 15 minutes until uniform.

[0086] Lamination molding: Apply the mixed liquid on the surface of bamboo fiber cloth (coating amount 200g / m 2 ), stacked layer by layer to form a three-layer structure, and rolled (pressure 2MPa) to remove bubbles.

[0087] Curing treatment: Curing at room temperature for 24 hours, then curing at 80℃ for 2 hours.

[0088] Test results:

[0089] Impact strength: 32.5J / m 2 ;

[0090] Tensile strength: 29.8MPa;

[0091] Glass transition temperature (Tg): 92°C;

[0092] Coefficient of thermal expansion (CTE): 85ppm / °C (25-100°C);

[0093] Porosity: 3.12%.

[0094] Effect analysis:

[0095] Pure bamboo fiber composite materials have weak interface bonding, are prone to thermal degradation at high temperatures, and have insufficient impact resistance, making them unable to meet the stringent requirements of aerospace and other fields.

[0096] Example 2: 3% silicon carbide addition

[0097] Material ratio:

[0098] Epoxy resin: 100 parts by weight;

[0099] Curing agent: 10 parts by weight;

[0100] Silicon carbide particles (particle size 36 μm): 3 parts by weight (3% of the weight of the epoxy resin);

[0101] Bamboo fiber cloth (area density 300 GSM): 100 parts by weight (bamboo fiber: epoxy resin = 1:1.8).

[0102] Preparation steps:

[0103] Mixing and dispersion: The silicon carbide particles and epoxy resin were mechanically stirred at 800 r / min for 20 min, and then ultrasonically treated (300 W, 10 min) to eliminate agglomerates.

[0104] Lamination and curing: Same as Example 1.

[0105] Test results:

[0106] Impact strength: 41.2J / m 2 (26.8% improvement compared to the control group);

[0107] Tensile strength: 34.5MPa (increased by 15.8%);

[0108] Tg: 105°C (increased by 14.1%);

[0109] CTE: 68ppm / °C (reduced by 20%);

[0110] Porosity: 2.45% (21.5% decrease).

[0111] Effect analysis:

[0112] 3% silicon carbide particles initially form a "particle-fiber" synergistic reinforcement effect by filling the resin pores, but there is still local agglomeration in the particle dispersion, resulting in limited performance improvement.

[0113] Example 3: 6% silicon carbide addition (optimal ratio)

[0114] Material ratio:

[0115] Epoxy resin: 100 parts by weight;

[0116] Curing agent: 10 parts by weight;

[0117] Silicon carbide particles: 6 parts by weight;

[0118] Bamboo fiber cloth (area density 400 GSM): 100 parts by weight (bamboo fiber: epoxy resin = 1:2.0).

[0119] Preparation steps:

[0120] Interface treatment: The bamboo fiber cloth was treated with 5 wt% NaOH solution (60°C, 30 min), then soaked with KH-550 coupling agent (concentration 0.5%, pH = 4) for 10 min, and dried for later use.

[0121] Mixing and dispersion: The silicon carbide particles and epoxy resin were mechanically stirred at a speed of 800 r / min for 20 min and ultrasonically treated (300 W, 10 min) until they were uniformly dispersed.

[0122] Lamination and curing: Same as Example 1.

[0123] Test results:

[0124] Impact strength: 52.3J / m 2 (Increase by 59.4%);

[0125] Tensile strength: 38.9 MPa (increased by 30.7%);

[0126] Tg: 125°C (increased by 35.9%);

[0127] CTE: 51ppm / °C (40% reduction);

[0128] Porosity: 1.64% (47.4% decrease);

[0129] Dynamic mechanical properties: Storage modulus 1.8GPa (1Hz), loss factor (tanδ) peak width narrowed, energy absorption efficiency increased by 30%.

[0130] Effect analysis:

[0131] 6% silicon carbide particles are evenly dispersed in the resin matrix, forming a "rigid particle-flexible fiber" synergistic reinforcement system with bamboo fibers. NaOH treatment and coupling agent modification significantly enhance interfacial bonding strength, with SEM demonstrating no fiber pullout at the interface. At high temperatures, the silicon carbide particles inhibit thermal expansion of the resin while also enhancing impact resistance through crack deflection.

[0132] Example 4: 9% silicon carbide addition

[0133] Material ratio:

[0134] Epoxy resin: 100 parts by weight;

[0135] Curing agent: 10 parts by weight;

[0136] Silicon carbide particles: 9 parts by weight;

[0137] Bamboo fiber cloth: 100 parts by weight.

[0138] Preparation step: same as Example 3.

[0139] Test results:

[0140] Impact strength: 45.8 J / m 2 (12.4% lower than the 6% group);

[0141] Tensile strength: 35.2 MPa (9.5% lower);

[0142] Porosity: 3.08% (87.8% higher).

[0143] Effect analysis:

[0144] 9% silicon carbide particles due to the limitation of dispersion process, stress concentration is caused at the interface, resulting in performance decline. Particle agglomeration hinders resin infiltration of fibers, porosity increases significantly, which verifies the contradiction of too high silicon carbide addition amount in the prior art.

[0145] Example 5: 12% silicon carbide addition amount

[0146] Material ratio:

[0147] Epoxy resin: 100 parts by weight;

[0148] Curing agent: 10 parts by weight;

[0149] Silicon carbide particles: 12 parts by weight;

[0150] Bamboo fiber cloth: 100 parts by weight.

[0151] Preparation step: same as Example 3.

[0152] Test results:

[0153] Impact strength: 42.1 J / m 2 (19.5% lower than the 6% group);

[0154] Tensile strength: 32.7 MPa (15.9% lower);

[0155] Porosity: 4.05% (147% higher).

[0156] Effect analysis:

[0157] 12% SiC particles agglomerate severely, leading to defects within the composite material and a significant decrease in mechanical properties. This result is consistent with the prior art conclusion that excessive addition weakens fracture toughness, highlighting the non-obviousness of the 6% addition in the present invention.

[0158] Comparative Experiment and Creativity Demonstration

[0159] The key role of dispersion process:

[0160] Example 3 uses a combined process of "mechanical stirring + ultrasonic treatment" to ensure uniform dispersion of 6% silicon carbide particles (porosity 1.64%), while Examples 4 and 5 suffer from performance deterioration due to particle agglomeration, proving that the dispersion process is the core means to resolve the contradictions in the existing technology.

[0161] The present invention achieves dual reinforcement of the fiber-resin interface through NaOH treatment (increasing fiber surface hydroxyl groups) and KH-550 coupling agent (forming Si-O-Si chemical bonds), and the interlaminar shear strength is increased by 45%.

[0162] The storage modulus (1.8 GPa) and loss factor peak width of Example 3 are optimized, indicating that its energy absorption efficiency under dynamic load is significantly better than that of existing bamboo fiber composite materials (storage modulus 1.2 GPa).

[0163] This effect is due to the synergistic effect of silicon carbide particles and bamboo fibers, while the existing technology does not involve the coordinated regulation of dynamic properties, highlighting the innovative dimension of the present invention.

[0164] Aerospace:

[0165] After thermal cycling (90 times) from -40°C to 120°C, the performance attenuation rate of the composite material of Example 3 is less than 10%, which meets the stability requirements of the UAV fuselage in extreme environments.

[0166] auto industry:

[0167] When used as a brake pad matrix, a 6% silicon carbide addition improves the friction coefficient stability by 30% and reduces the wear rate by 40%, which is better than existing resin-based brake pads.

[0168] Electronic packaging:

[0169] As a packaging material for 5G base station RF modules, its CTE (51ppm / °C) is highly matched with the chip substrate (CTE 48ppm / °C), avoiding solder joint failure caused by thermal mismatch.

[0170] The application realizes the synergistic improvement of mechanical properties, thermal stability and dynamic response capability in the bamboo fiber / epoxy resin system through multi-scale reinforced structure design and interface synergistic control technology. The 6% silicon carbide addition amount of example 3 is the optimal ratio, the performance index far exceeds the prior art, and the technical obstacle of too high silicon carbide addition amount is overcome through dispersion process and interface treatment, which provides a new paradigm for the application of natural fiber composites in high temperature and high load field.

[0171] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. Bamboo fiber / silicon carbide reinforced epoxy resin composite material, characterized in that: Includes epoxy resin, curing agent, three layers of plain woven bamboo fiber cloth and silicon carbide particles; The surface density of the bamboo fiber cloth is 250-400GSM; The particle size of the silicon carbide particles is 36 μm, and the addition amount of the silicon carbide particles is 0-12 wt % of the weight of the epoxy resin.

2. The bamboo fiber / silicon carbide reinforced epoxy resin composite material according to claim 1, characterized in that: The added amount of the silicon carbide particles is 6 wt % of the weight of the epoxy resin.

3. The bamboo fiber / silicon carbide reinforced epoxy resin composite material according to claim 1, characterized in that: The mass ratio of the bamboo fiber cloth to the epoxy resin is 1:1.5-2.

0.

4. The bamboo fiber / silicon carbide reinforced epoxy resin composite material according to claim 1, characterized in that: The epoxy resin is Araldite LY-556, and the curing agent is Aradur HY-951.

5. The bamboo fiber / silicon carbide reinforced epoxy resin composite material according to claim 4, characterized in that: The mass ratio of the epoxy resin to the curing agent is 10:

1.

6. A method for preparing a bamboo fiber / silicon carbide reinforced epoxy resin composite material, characterized in that: For preparing the composite material according to any one of claims 1 to 5, the preparation method comprises the following steps: Step S1, mixing silicon carbide particles and epoxy resin evenly, then adding a curing agent and stirring evenly; Step S2, applying the mixture obtained in step S1 to the surface of the bamboo fiber cloth, stacking the bamboo fiber cloth layer by layer to form a laminated structure, and rolling to remove bubbles; Step S3, curing the laminated structure obtained in step S2 to obtain a bamboo fiber / silicon carbide reinforced epoxy resin composite material.

7. The preparation method according to claim 6, characterized in that In step S3, the curing treatment includes curing at room temperature for 24 hours and then post-curing at 80°C for 2 hours.

8. The preparation method according to claim 6, characterized in that In the step S1, the silicon carbide particles and the epoxy resin are mixed by mechanical stirring until they are uniformly dispersed.

9. The preparation method according to claim 6, characterized in that In step S2, the bamboo fiber cloth is a three-layer plain woven bamboo fiber cloth.

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