A die bonding device and method

Abstract

This invention relates to a die bonding apparatus and method. The die bonding apparatus is used for chip packaging on a mounting substrate, including a carrier platform and a substrate carrier device, a mounting head binding device, and a top-view positioning device mounted on the carrier platform. The substrate carrier device moves along the X and Y axes on the carrier platform, and the mounting head binding device moves above the substrate carrier device along the X, Y, and Z axes. The substrate carrier device has a hollow channel in the vertical direction, and the top-view positioning device moves along the Z axis within the hollow channel. The substrate carrier device has a substrate carrier platform for placing the mounting substrate. When the mounting substrate is placed on the substrate carrier platform, the support portion of the mounting substrate is detachably fixed to the substrate carrier platform. The mounting portion and the top-view alignment portion of the mounting substrate are located on the side closest to the mounting head binding device and the top-view positioning device, respectively. When the substrate carrier device moves, the substrate carrier platform and the mounting substrate move synchronously so that the top-view alignment portion and the support portion enter the recognition area of ​​the top-view positioning device.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a die bonding device and method. Background Technology

[0002] With the promotion of intelligent assisted driving, the demand for detectors is increasing rapidly. Currently, there is no fully automated chip packaging equipment with large-shell casing on the market. Human intervention is required in production, resulting in low production efficiency and yield, and difficulty in guaranteeing accuracy. Therefore, a casing packaging equipment is needed to improve production efficiency, increase the yield of the final product, and ensure accuracy. Summary of the Invention

[0003] To address the technical problems of low production efficiency and product yield in existing chip packaging equipment, as well as the difficulty in guaranteeing accuracy, this invention provides a die bonding device and method.

[0004] The present invention provides a die bonding apparatus for chip packaging on a mounting substrate. The mounting substrate has a mounting section, a support section, and a top-view alignment section connected in sequence. The die bonding apparatus includes a carrier platform and a substrate carrier device, a mounting head binding device, and a top-view positioning device mounted on the carrier platform. The substrate carrier device moves along the X and Y axes on the carrier platform, and the mounting head binding device moves above the substrate carrier device along the X, Y, and Z axes. The substrate carrier device has a hollow channel in the vertical direction, and the top-view positioning device moves along the Z axis within the hollow channel. The mounting head binding device has a bottom-view positioning module. The substrate carrier device has a substrate support for placing the mounting substrate. When the mounting base is placed on the base support platform, the support portion is detachably fixed to the base support platform. The mounting portion is located on the side closer to the mounting head binding device, and the top-view alignment portion is located on the side closer to the top-view positioning device. When the base support device moves, the base support platform and the mounting base move synchronously so that the top-view alignment portion and the support portion enter the recognition area of ​​the top-view positioning device. The top-view positioning device can recognize the top-view alignment portion and the support portion, perform bottom visual positioning of the mounting base, and transmit the recognition alignment signal to the mounting head binding device. The mounting head binding device, based on the bottom visual positioning recognition alignment signal, mounts circular or non-circular mounting elements to the mounting portion.

[0005] Preferably, the top alignment part is cylindrical in shape, and the side of the top alignment part facing the working end of the top positioning device is circular; the side of the top alignment part facing the top positioning device has a first identification point, and the side of the mounting part facing the mounting head device has a first mounting position, the first identification point corresponding to the first mounting position; after the top positioning device positions the first identification point, the mounting head device mounts the circular mounting element to the first mounting position.

[0006] Preferably, the support portion has two first through holes, which are symmetrically distributed on both sides of the upward alignment portion. The base support platform has a second through hole, and the first through hole, the second through hole, and the hollow channel are connected in sequence. The inner wall surface of the first through hole has a second identification point. After the upward positioning device positions the second identification point, it determines the second mounting position of the circular mounting element on the side facing the mounting head device in combination with the first identification point. The mounting head device mounts the non-circular mounting element to the second mounting position accordingly.

[0007] Preferably, the base support platform is detachably mounted on the base support device, and the base support platform is provided with a limiting component, the limiting component including a first limiting member and a second limiting member; the first limiting member and the second limiting member are closely disposed on the side of the support portion, and the first limiting member and the second limiting member are disposed opposite to each other, so as to detachably fix the mounting base to the base support platform.

[0008] Preferably, the downward positioning module is installed on the side of the mounting head binding device; the mounting head binding device is also provided with a height measuring module, which is used to detect the flatness of the mounting element on the mounting part, and the height measuring module is installed on the side of the mounting head binding device or the side of the downward positioning module; the downward positioning module and the height measuring module are located close to the working end of the mounting head binding device and move synchronously with the mounting head binding device.

[0009] Preferably, the die bonding equipment further includes a material platform device and a nozzle holder device installed on the support platform. The material platform device is used to store the mounting components, and the nozzle holder device is used to store the nozzles. The material platform device is located between the base support device and the nozzle holder device, and the working end of the mounting head binding device cooperates with the material platform device and the nozzle holder device respectively.

[0010] Preferably, the mounting head binding device is provided with an adhesive application module, which moves synchronously with the mounting head binding device; and / or, the die bonding equipment further includes an adhesive application device installed on the support platform, which is close to the base support device.

[0011] Preferably, after the upward positioning device identifies the upward alignment part and the support part, the mounting and binding device first mounts the circular mounting element to the first mounting position, and then mounts the non-circular mounting element to the second mounting position. The circular mounting element includes a ceramic part, and the non-circular mounting element includes a substrate and a chip bonded to the substrate. The substrate has bonding positions for the downward positioning module to perform top identification and positioning.

[0012] The present invention also provides a die bonding method applied to the above-mentioned die bonding equipment. The die bonding method includes the following steps: providing a mounting base and mounting elements, wherein the shape of the mounting elements includes circular and non-circular shapes; after the upward positioning device performs a first identification of the upward alignment portion, the mounting head device applies adhesive or dips adhesive to the mounting portion and attaches the circular mounting elements to the mounting portion accordingly; after the mounting head device applies adhesive or dips adhesive to the circular mounting elements, the upward positioning device performs a second identification of the upward alignment portion and the support portion, and the mounting head device attaches a non-circular mounting element to the mounting portion accordingly, wherein the mounting elements on the mounting portion are stacked; after the mounting head device applies adhesive or dips adhesive to the non-circular mounting elements, the downward positioning module performs a third identification of the non-circular mounting elements, and the mounting head device attaches another non-circular mounting element to the mounting portion accordingly.

[0013] Preferably, the die bonding equipment further includes a substrate baking device; after the mounting head device mounts the mounting element to the mounting part, the substrate baking device bakes the mounting substrate.

[0014] Compared with the prior art, the die bonding equipment and method provided by the present invention have the following advantages:

[0015] 1. This invention provides a die bonding device for chip packaging on a mounting substrate. The mounting substrate has a mounting section, a support section, and a top-view alignment section connected in sequence. A substrate support device, a mounting head binding device, and a top-view positioning device are integrated on a support platform. The substrate support device has a hollow channel in the vertical direction. The top-view positioning device moves within the hollow channel. The mounting head binding device is located above the substrate support device. The hollow channel provides independent movement space for the top-view positioning device, and its movement path does not interfere with that of the mounting head binding device. The substrate support device has a substrate support platform, which can be used to place several mounting substrates. When a mounting substrate is placed on the substrate support platform, it is detachably fixed to the substrate support platform by the support section. This allows for easy replacement of mounting substrates of different specifications to meet the packaging requirements of different types of chips and simplifies the maintenance process of the die bonding device.

[0016] Understandably, the base carrier moves along the X and Y axes on the carrier platform. This movement drives the base carrier platform and mounting base to move synchronously, ensuring that the top alignment part and support part enter the recognition area of ​​the top positioning device. This avoids relative displacement between the base carrier and the mounting base, preventing positioning deviations. The top positioning device moves along the Z axis within the hollow channel. By recognizing the top alignment part and support part of the mounting base, it performs bottom visual positioning of the mounting base, significantly improving the alignment accuracy between the mounting components and the mounting area. The bottom positioning module is mounted on the mounting tie-head device and moves synchronously with it. It identifies the specific mounting position of multiple mounting components when stacking them. Through the coordinated operation of the top and bottom positioning modules, the alignment accuracy of circular or non-circular mounting components and the mounting area is significantly improved without human intervention in production. This also improves the accuracy of the mounting tie-head device moving above the base carrier along the X, Y, and Z axes to mount the components to the mounting area, achieving chip packaging.

[0017] 2. In the die bonding equipment provided in this embodiment of the invention, the first identification point corresponds to the first mounting position, so that the positioning result of the top-view positioning device on the first identification point can be directly associated with the first mounting position located on the mounting part, establishing a precise correspondence between the positioning and the mounting position, and improving the alignment accuracy between the circular mounting element and the mounting part; the die bonding equipment performs bottom visual positioning of the mounting base through the top-view positioning device, and after positioning the first identification point, transmits the identification alignment signal to the mounting head device, which then mounts the circular mounting element to the mounting part, reducing errors in the positioning information transmission process and ensuring the accuracy and consistency of the mounting element being mounted to the first mounting position.

[0018] 3. In the die bonding equipment provided in this embodiment of the invention, two first through holes on the support are symmetrically distributed. The inner wall surface of the first through hole has a second identification point. Combined with the first identification point, the second mounting position on the circular mounting component can be accurately determined, meeting the high precision requirements of non-circular mounting components for mounting position and orientation, and improving the mounting accuracy of non-circular mounting components. The first through hole, the second through hole, and the hollow channel are connected in sequence, which can ensure that the upward positioning device is positioned at the second identification point without human intervention, providing a positioning basis for the accurate mounting of non-circular mounting components. By combining the second identification point with the first identification point to determine the second mounting position, the die bonding equipment can adapt to the mounting requirements of non-circular mounting components, improve the adaptability to mounting components of different shapes, and thus ensure mounting accuracy.

[0019] 4. In the die bonding equipment provided in this embodiment of the invention, the base carrier stage is detachably mounted on the base carrier device, which facilitates the replacement of base carrier stages of different specifications according to the chip packaging requirements, so that the die bonding equipment can realize different types of chip packaging; the limiting component includes a first limiting member and a second limiting member that are closely disposed on the side of the support portion. The first limiting member and the second limiting member are disposed opposite to each other. Through this design, the mounting base can be fixed on the base carrier stage. When the base carrier device moves along the X and Y axes on the carrier platform, driving the base carrier stage and the mounting base to move synchronously, it prevents relative displacement between the mounting base and the base carrier stage, thereby ensuring the positioning accuracy of the top-view positioning device; the mounting base is detachably fixed through the limiting component, which facilitates quick replacement of the mounting base, improves the production efficiency of the die bonding equipment, and meets the needs of mass production.

[0020] 5. In the die bonding equipment provided in this embodiment of the invention, the downward positioning module is located close to the working end of the mounting head binding device and moves synchronously with the mounting head binding device. It can acquire visual information of the mounting area in real time and at close range, reducing positioning errors caused by distance or relative displacement and improving the accuracy of downward visual positioning. The height measurement module can be used to detect the flatness of the mounted components on the mounting section, thereby ensuring mounting quality, avoiding packaging defects caused by uneven mounted components, and improving the yield of chip packaging on the mounting base. The height measurement module is installed on the side of the mounting head binding device or the side of the downward positioning module and moves synchronously with the working end. It can complete the flatness detection of the mounted components in real time during the mounting process of the mounting head binding device, improving detection efficiency without additional processes. The height measurement module is located close to the working end of the mounting head binding device, and both the downward positioning module and the height measurement module move synchronously with the mounting head binding device. This ensures that the downward positioning and flatness detection actions are closely coordinated with the mounting process, thereby improving the production efficiency and product yield of the die bonding equipment.

[0021] 6. In the die bonding equipment provided in this embodiment of the invention, the material stage device and the nozzle holder device are installed on the support platform, which enables the placement head binding device to perform a complete process of selecting nozzles, picking up placement components, and completing placement, thereby improving the automation level of the die bonding equipment and ensuring the continuity of batch production. The material stage device stores circular or non-circular placement components to achieve multi-chip placement, and the nozzle holder device can realize the replacement of various types of nozzles. The placement head binding device can replace the nozzles that are suitable for different types of placement components. The material stage device is located between the base support device and the nozzle holder device, which facilitates the efficient completion of the continuous actions of changing nozzles, picking up placement components, and placing placement components to the placement part by the working end of the placement head binding device, shortening the movement path and thus improving work efficiency.

[0022] 7. In the die bonding equipment provided in this embodiment of the invention, the adhesive application module and the mounting head binding device move synchronously, avoiding adhesive position deviation caused by relative displacement between the adhesive application module and the mounting head binding device, thereby ensuring the fixing effect of the mounted components to the mounting part; the adhesive application device is close to the base support device, which can shorten the path of the adhesive application process, reduce the shape change of the adhesive during the transfer process, and improve the continuity and efficiency of the adhesive application and mounting process; the die bonding equipment can select adhesive application and / or adhesive application methods according to different mounting requirements, improving the flexibility and applicability of the die bonding equipment in the adhesive processing stage.

[0023] 8. In the die bonding equipment provided in this embodiment of the invention, the first identification point is located on the side of the upper alignment part facing the upper positioning device, and the second identification point is located on the inner wall surface of the first through hole. The upper positioning device positions the first identification point and the second identification point in sequence. The mounting head device first mounts the circular mounting element to the first mounting position on the mounting part, and then mounts the non-circular mounting element to the second mounting position on the circular mounting element. That is, different mounting elements are stacked to meet the process logic of chip packaging, avoid mutual interference between different mounting elements during mounting, and improve the orderliness and continuity of the chip packaging process. The bonding position on the substrate can be identified and positioned by the lower positioning module. After the lower positioning module identifies and positions the bonding position, the mounting head device mounts the chip to the corresponding bonding position. Through this design, the alignment accuracy of the mounting head device in completing chip mounting can be significantly improved, ensuring a reliable connection between the chip and the substrate.

[0024] 9. This embodiment of the invention also provides a die bonding method applied to the aforementioned die bonding equipment. By first bonding circular components and then bonding non-circular components, and by stacking the components, different shapes and types of components are bonded sequentially according to the process logic, avoiding mutual interference and ensuring the orderliness and continuity of the die bonding process. By applying adhesive or dipping adhesive between the bonding section and the components, as well as between the stacked components, and by performing positioning calibration before each bonding, it can be ensured that the bonding section and the components, as well as the stacked components, are firmly connected by adhesive layers, improving the structural stability of the chip package. The top positioning device performs a second identification of the top alignment section and the support section to adapt to the bonding requirements of non-circular components. The bottom positioning module performs a third identification of the non-circular components already bonded to the bonding section. The top identification positioning identifies the bonding position, further ensuring the bonding accuracy of the bonding head device.

[0025] 10. In the die bonding method provided in this embodiment of the invention, after the mounting head device mounts the mounting components to the mounting section, the mounting base is baked by the base baking device. This can promote the curing of the adhesive used in the mounting process, enhance the bonding strength between the mounting components and the mounting section, as well as between each mounting component, reduce the risk of mounting components falling off after packaging, and ensure the stability of chip packaging. The baking process is integrated into the die bonding process, eliminating the need to transfer the mounting base to external equipment, shortening the process interval, and improving the overall continuity and production efficiency of the die bonding process. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the overall framework of the die bonding device according to an embodiment of the present invention.

[0028] Figure 2 This is a schematic diagram of the base support device and the upward positioning device of the die bonding equipment according to an embodiment of the present invention.

[0029] Figure 3 This is a schematic diagram of the mounting base of the die bonding device according to an embodiment of the present invention.

[0030] Figure 4 This is a cross-sectional view of the mounting base of the die bonding device according to an embodiment of the present invention.

[0031] Figure 5 This is the die bonding device according to an embodiment of the present invention. Figure 2 A magnified view of part A in the middle.

[0032] Figure 6 This is a schematic diagram of the material stage device of the die bonding equipment according to an embodiment of the present invention.

[0033] Figure 7 This is a schematic diagram of the nozzle holder device of the die bonding equipment according to an embodiment of the present invention.

[0034] Figure 8 This is a schematic flowchart of the die bonding method according to an embodiment of the present invention.

[0035] Explanation of reference numerals in the attached diagram:

[0036] 100. Die bonding equipment;

[0037] 1. Base support device; 12. Base support platform; 13. Mounting base; 131. Mounting section; 132. Support section; 1321. First through hole; 133. Top alignment section; 14. Limiting component; 141. First limiting member; 142. Second limiting member; 2. Mounting binding device; 21. Bottom positioning module; 22. Height measurement module; 23. Adhesive application module; 3. Top positioning device; 4. Material platform device; 41. Material platform body; 42. First support column; 43. First base; 5. Nozzle holder device; 51. Nozzle holder body; 510. Receiving groove; 52. Second support column; 53. Second base; 6. Adhesive application device; 101. Supporting platform; 102. First identification point; 103. Second identification point. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0039] In the embodiments provided by this invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined based on A. However, it should also be understood that determining B based on A does not mean determining B solely based on A; B can also be determined based on A and / or other information.

[0040] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also recognize that the embodiments described in the specification are optional embodiments, and the actions and modules involved are not necessarily essential to the invention.

[0041] In various embodiments of the present invention, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0042] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, or they may sometimes be executed in reverse order, depending on the functions involved. It is particularly important to note that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0043] Please see Figure 1 , Figure 2 and Figure 3 This invention provides a die bonding apparatus 100 for chip packaging on a mounting base 13. The mounting base 13 has a mounting section 131, a support section 132, and a top-view alignment section 133 connected in sequence. The die bonding apparatus 100 includes a support platform 101 and a base support device 1, a mounting head binding device 2, and a top-view positioning device 3 mounted on the support platform 101. The base support device 1 moves along the X and Y axes on the support platform 101, and the mounting head binding device 2 is above the base support device 1 and moves along the X, Y, and Z axes. The base support device 1 has a hollow channel in the vertical direction, and the top-view positioning device 3 moves along the Z axis within the hollow channel. The mounting head binding device 2 has a bottom-view positioning module 21. The base support device 1 has a mounting base 13 for placing the mounting base 13. When the mounting base 13 is placed on the base support platform 12, the support part 132 is detachably fixed to the base support platform 12. The mounting part 131 is located on the side close to the mounting head binding device 2, and the top alignment part 133 is located on the side close to the top positioning device 3. When the base support device 1 moves, the base support platform 12 and the mounting base 13 move synchronously so that the top alignment part 133 and the support part 132 enter the recognition area of ​​the top positioning device 3. The top positioning device 3 can recognize the top alignment part 133 and the support part 132, perform bottom visual positioning of the mounting base 13, and transmit the recognition alignment signal to the mounting head binding device 2. The mounting head binding device 2, based on the bottom visual positioning recognition alignment signal, mounts the circular or non-circular mounting element to the mounting part 131.

[0044] In the die bonding equipment 100 provided in this embodiment of the invention, the base support device 1, the mounting head binding device 2, and the top-view positioning device 3 are integrated on the support platform 101. The base support device 1 has a hollow channel in the vertical direction. The top-view positioning device 3 moves in the hollow channel. The mounting head binding device 2 is located above the base support device 1. The hollow channel can provide the top-view positioning device 3 with an independent movement space and can also provide the top-view positioning device 3 with an observation channel for bottom visual positioning of the mounting base 13. When the top-view alignment part 133 and the support part 132 enter the recognition area of ​​the top-view positioning device 3, the top-view alignment part 133 and the support part 132 can be positioned and recognized by the top-view positioning device 3. The top-view positioning device 3 and the mounting head binding device 2 are located on the top and bottom sides of the base support device 1, respectively, and their movement paths do not interfere with each other.

[0045] Furthermore, the base carrier platform 12 is mounted on the base carrier device 1, and several mounting bases 13 can be placed on the base carrier platform 12. The mounting base 13 has a mounting part 131, a support part 132 and a top alignment part 133 connected in sequence. The mounting base 13 is detachably connected and fixed to the base carrier platform 12 through the support part 132. This design allows for easy replacement of mounting bases 13 of different specifications to meet the packaging requirements of various chips and simplifies the maintenance process of the die bonding equipment 100.

[0046] This invention uses a mounting head device 2 to mount circular or non-circular mounting components onto a mounting section 131, enabling chip packaging on the mounting base 13. In this embodiment, six mounting bases 13 are used to facilitate batch mounting of components, reducing the time required for frequent replacement of the mounting base platform 12 or mounting base 13. The number of mounting bases 13 can be adjusted according to actual needs, such as considering the size of the mounting base platform 12 or the mounting device 1, or whether the distance between mounting bases 13 affects the sequential mounting effect. The above description is merely one embodiment of the invention and is not intended to limit the invention. Any modifications, equivalent substitutions, and improvements made within the principles of this invention should be included within the scope of protection of this invention.

[0047] Understandably, the base support device 1 moves along the X and Y axes on the support platform 101. When the base support device 1 moves, it drives the base support platform 12 and the mounting base 13 on it to move synchronously, so as to ensure that the upward alignment part 133 and the support part 132 enter the recognition area of ​​the upward positioning device 3, and avoid relative displacement between the base support device 1 and the mounting base 13 during the movement, which would cause positioning deviation.

[0048] It should be noted that the mounting part 131, the support part 132, and the top alignment part 133 are connected in sequence. The side of the support part 132 facing away from the mounting part 131 is attached to the upper surface of the base support platform 12. The top alignment part 133 passes through the base support platform 12 for bottom visual positioning by the top positioning device 3. The top positioning device 3 moves along the Z-axis in the hollow channel. By identifying the top alignment part 133 and the support part 132 of the mounting base 13, it performs bottom visual positioning of the mounting base 13, which significantly improves the alignment accuracy between the mounting element and the mounting part 131. The bottom positioning module 21 is set on the mounting head binding device 2 and moves synchronously with the mounting head binding device 2. It is used to identify the specific mounting position on the mounting element when multiple mounting elements are stacked. Compared with traditional chip packaging equipment, the die bonding equipment 100 provided by this invention has a higher degree of automation. Through the coordinated operation of the upper positioning device 3 and the lower positioning module 21, the alignment accuracy of circular or non-circular mounting components and the mounting part 131 is significantly improved without human intervention in production. The accuracy of the mounting head binding device 2 in mounting the mounting components to the mounting part 131 by moving along the X, Y, and Z axes above the base support device 1 is improved, and the chip packaging is better realized on the mounting base 13. This solves the technical problems of low production efficiency and product yield of existing chip packaging equipment and difficulty in guaranteeing accuracy.

[0049] Please see Figures 1 to 4 The top alignment part 133 is cylindrical in shape, and the side of the top alignment part 133 facing the working end of the top positioning device 3 is circular. The side of the top alignment part 133 facing the top positioning device 3 has a first identification point 102, and the side of the mounting part 131 facing the mounting head binding device 2 has a first mounting position. The first identification point 102 corresponds to the first mounting position. After the top positioning device 3 positions the first identification point 102, the mounting head binding device 2 mounts the circular mounting element to the first mounting position.

[0050] In the die bonding device 100 provided in this embodiment of the invention, the first identification point 102 corresponds to the first mounting position, so that the positioning result of the top-view positioning device 3 on the first identification point 102 can be directly associated with the first mounting position located on the mounting part 131, establishing a precise relationship between the identification point positioning and the mounting position, and improving the alignment accuracy between the circular mounting element and the mounting part 131.

[0051] Understandably, the die bonding equipment 100 performs bottom visual positioning of the mounting base 13 through the top-view positioning device 3. After positioning the first identification point 102, the identification alignment signal is transmitted to the mounting head binding device 2, which then mounts the circular mounting element to the mounting section 131. This reduces errors in the positioning information transmission process and ensures the accuracy and consistency of the mounting element being mounted to the first mounting position.

[0052] Specifically, the first identification point 102 is the center of the side of the upward alignment part 133 facing the working end of the upward positioning device 3, and the first mounting position on the mounting part 131 is the center of the circular mounting element. The first identification point 102 and the first mounting position are coaxially arranged. The specific steps of the upward positioning device 3 positioning the first identification point 102 and the mounting head binding device 2 mounting the circular mounting element to the corresponding first mounting position are as follows:

[0053] When the base support device 1 moves along the X and Y axes on the support platform 101, the base support stage 12 and the mounting base 13 move synchronously until the mounting base 13 moves directly above the working end of the top-view positioning device 3. At this time, the top-view alignment part 133 enters the recognition area of ​​the top-view positioning device 3. The top-view positioning device 3 performs bottom visual positioning on the mounting base 13 and can begin to position the first recognition point 102. In the embodiment of the present invention, the top-view alignment part 133 of the mounting base 13 is cylindrical in shape, and the top-view alignment part 133 faces the... One side of the working end of the top-view positioning device 3 is circular. The top-view positioning device 3 takes any three points on the bottom surface of the top-view alignment part 133. Any two points can be connected to form a straight line. The perpendicular bisectors of the two straight lines are taken, and the intersection of the perpendicular bisectors is the center of the circle. This center of the circle is also the first identification point 102 in this embodiment, which corresponds to the first mounting position on the mounting part 131. The top-view positioning device 3 transmits the identification alignment signal to the mounting head binding device 2. The mounting head binding device 2 mounts the circular mounting element to the first mounting position, completing one mounting cycle.

[0054] Furthermore, the support part 132 is provided with two first through holes 1321, which are symmetrically distributed on both sides of the upward alignment part 133. The base support platform 12 is provided with a second through hole. The first through holes 1321, the second through holes and the hollow channel are connected in sequence. The inner wall surface of the first through hole 1321 has a second identification point 103. After the upward positioning device 3 positions the second identification point 103, it determines the second mounting position on the side of the mounting part 131 facing the mounting head binding device 2 in combination with the first identification point 102. The mounting head binding device 2 mounts the non-circular mounting element to the second mounting position.

[0055] It should be noted that in the embodiments of the present invention, the first through hole 1321 of the upper viewing alignment part 133 is an elliptical hole, and the second through hole on the base support platform 12 is a circular hole. The size of the first through hole 1321 is smaller, so that the upper viewing positioning device 3 can better position the second identification point 103 on the inner wall surface of the first through hole 1321 through the second through hole. It can also avoid the second identification point 103 on the inner wall surface of the first through hole 1321 being blocked by the base support platform 12 due to the slight adjustment of the placement angle of the mounting base 13 during the previous mounting process.

[0056] In the die bonding device 100 provided in this embodiment of the invention, two first through holes 1321 on the support part 132 are symmetrically distributed. The inner wall surface of the first through hole 1321 has a second identification point 103. Combined with the first identification point 102, the second mounting position on the circular mounting element can be accurately determined, which meets the high precision requirements of non-circular mounting elements for mounting position and orientation, and improves the mounting accuracy of non-circular mounting elements. The first through hole 1321, the second through hole and the hollow channel are connected in sequence, which can ensure that the upward positioning device 3 is positioned at the second identification point 103 without human intervention, providing a positioning basis for the accurate mounting of non-circular mounting elements. By combining the second identification point 103 with the first identification point 102 to determine the second mounting position, the die bonding device 100 can adapt to the mounting requirements of non-circular mounting elements, improve the adaptability to mounting elements of different shapes, and thus ensure mounting accuracy.

[0057] Specifically, based on the completion of the positioning of the first identification point 102, the steps of the upward positioning device 3 positioning the second identification point 103 and the mounting and binding device 2 mounting the non-circular mounting element to the corresponding second mounting position are as follows:

[0058] The base support device 1 moves along the X and Y axes on the support platform 101, causing the mounting base 13 to move directly above the working end of the upward positioning device 3. At this time, the upward alignment part 133 and the support part 132 enter the recognition area of ​​the upward positioning device 3. Since the first through hole 1321, the second through hole, and the hollow channel are connected in sequence, the working end of the upward positioning device 3 can directly recognize the second recognition point 103 on the inner wall of the first through hole 1321, and the first through hole 1321 is symmetrically distributed on the upward alignment part 13. On both sides of 3, after identifying two symmetrical second identification points 103, the perpendicular bisector of the straight line connecting the two second identification points 103 is taken. This perpendicular bisector intersects with the first identification point 102 to determine the second mounting position on the side of the circular mounting element facing the mounting head device 2. In other words, the mounting position of the non-circular mounting element can be determined. The upward positioning device 3 transmits the identification alignment signal to the mounting head device 2. The mounting head device 2 then mounts the non-circular mounting element to the corresponding second mounting position, completing one mounting cycle.

[0059] Please see Figures 1 to 3 , Figure 5 The base support platform 12 is detachably mounted on the base support device 1. The base support platform 12 is provided with a limiting component 14, which includes a first limiting member 141 and a second limiting member 142. The first limiting member 141 and the second limiting member 142 are closely disposed on the side of the support part 132. The first limiting member 141 and the second limiting member 142 are disposed opposite to each other to detachably fix the mounting base 13 to the base support platform 12.

[0060] In the die bonding equipment 100 provided in this embodiment of the invention, the detachable base carrier 12 facilitates the replacement of different specifications of base carrier 12 according to the chip packaging requirements. Different types of mounting bases 13 can be placed on different specifications of base carrier 12. Before the mounting head binding device 2 mounts the chip, the specific position identified by the upward positioning device 3 may also change accordingly, so that the die bonding equipment 100 can realize different types of chip packaging.

[0061] Understandably, the limiting component 14 includes a first limiting member 141 and a second limiting member 142. The first limiting member 141 and the second limiting member 142 are closely disposed on the side of the support portion 132, and the first limiting member 141 and the second limiting member 142 are disposed opposite to each other. Through this design, the mounting base 13 can be fixed on the base support platform 12. When the base support device 1 moves along the X and Y axes on the support platform 101, driving the base support platform 12 and the mounting base 13 to move synchronously, it prevents relative displacement between the mounting base 13 and the base support platform 12, thereby ensuring the positioning accuracy of the upward positioning device 3.

[0062] Understandably, the support portion 132 is provided with two first through holes 1321, and the base support platform 12 is provided with two second through holes, which correspond to different first through holes 1321 on the support portion 132 respectively. The first through holes 1321, the second through holes and the hollow channel are connected in sequence. Therefore, the first limiting member 141 and the second limiting member 142 in this embodiment of the invention need to avoid the second through holes on the base support platform 12. This can ensure that the mounting base 13 is fixed to the base support platform 12 while avoiding affecting the positioning of the second identification point 103 on the inner wall of the first through hole 1321 by the upward positioning device 3.

[0063] Furthermore, the position and size between the first limiting member 141 and the second limiting member 142 are adapted to the support portion 132. When changing to different specifications of the mounting base 13, different second limiting members 142 can also be selected. Through this design, regardless of the specification of the mounting base 13 used for chip packaging, the first limiting member 141 and the second limiting member 142 can be used to achieve detachable fixing. It also facilitates the quick replacement of the mounting base 13, improves the production efficiency of the die bonding equipment 100, and meets the needs of mass production.

[0064] Please see Figure 1 , Figure 2 and Figure 5The downward positioning module 21 is installed on the side of the mounting head binding device 2; the mounting head binding device 2 is also provided with a height measuring module 22, which is used to detect the flatness of the mounting components on the mounting section 131. The height measuring module 22 is installed on the side of the mounting head binding device 2 or on the side of the downward positioning module 21; the downward positioning module 21 and the height measuring module 22 are located close to the working end of the mounting head binding device 2 and move synchronously with the mounting head binding device 2.

[0065] In the die bonding equipment 100 provided in this embodiment of the invention, the downward positioning module 21 is set close to the working end of the mounting head binding device 2 and moves synchronously with the mounting head binding device 2. It can obtain visual information of the mounting area in real time and at close range, reduce positioning errors caused by distance or relative displacement, and improve the accuracy of downward visual positioning.

[0066] Understandably, the height measurement module 22 can be used to detect the flatness of the components mounted on the mounting section 131, thereby ensuring mounting quality, avoiding packaging defects caused by uneven mounting components, and improving the yield of chip packaging on the mounting base 13. Specifically, the height measurement module 22 is installed on the side of the mounting head binding device 2 or the side of the downward positioning module 21, and moves synchronously with the working end. It can complete the flatness detection of the mounted components in real time during the mounting process of the mounting head binding device 2, improving detection efficiency without the need for additional steps.

[0067] It should be noted that, in this embodiment of the invention, the height measurement module 22 is installed on the side of the downward positioning module 21, and the height measurement module 22 is also set close to the working end of the mounting head binding device 2. Both the downward positioning module 21 and the height measurement module 22 move synchronously with the mounting head binding device 2. Through this design, it can be ensured that the actions of downward positioning and flatness detection are closely coordinated with the mounting process, thereby improving the production efficiency and product yield of the die bonding equipment 100.

[0068] Please see Figure 1 , Figures 5 to 7 The die bonding equipment 100 also includes a material table device 4 and a nozzle holder device 5 installed on the support platform 101. The material table device 4 is used to store the mounting components, and the nozzle holder is used to store the nozzles.

[0069] In the die bonding equipment 100 provided in this embodiment of the invention, the material platform device 4 and the nozzle holder device 5 are installed on the support platform 101, which enables the placement head binding device 2 to perform a complete process of selecting nozzles, picking up placement components and completing placement, thereby improving the automation level of the die bonding equipment 100 and ensuring the continuity of batch production. The material platform device 4 stores round or non-round placement components to realize multi-chip placement, and the nozzle holder device 5 can realize the replacement of various types of nozzles. The placement head binding device 2 can replace the nozzles that are suitable for different types of placement components.

[0070] Furthermore, the material platform device 4 is located between the base support device 1 and the nozzle holder device 5, and the working end of the mounting head binding device 2 cooperates with the material platform device 4 and the nozzle holder device 5 respectively. Through this design, the working end of the mounting head binding device 2 can efficiently complete the continuous action of changing the nozzle, picking up the mounting component, and mounting the mounting component to the mounting section 131, shortening the movement path and thus improving the working efficiency of the die bonding equipment 100.

[0071] In one embodiment of the present invention, the base support device 1, the material platform device 4 and the suction nozzle frame device 5 are arranged sequentially on the horizontal plane of the support platform 101, with the material platform device 4 close to the base support device 1 and the suction nozzle frame device 5 close to the material platform device 4.

[0072] In some embodiments, the material platform device 4 includes a material platform body 41, a first support column 42, and a first base 43. The first base 43 is fixedly mounted on the support platform 101, and the first support column 42 supports the material platform body 41. Understandably, different types of mounting components can be placed on the material platform body 41 of the material platform device 4. The mounting head device 2 can pick up the mounting components from the material platform device 4 for mounting, thereby enabling the mounting of various mounting components and improving mounting efficiency.

[0073] In some embodiments, the nozzle holder device 5 includes a nozzle holder body 51, a second support column 52, and a second base 53. The second base 53 is fixedly mounted on the support platform 101, and the second support column 52 supports the nozzle holder body 51. The nozzle holder body 51 is provided with a receiving groove 510 for accommodating vacuum nozzles of different sizes. It is understood that the nozzle holder device 5 is a device for replacing vacuum nozzles. The working end of the mounting and binding device 2 can be detachably connected to nozzles of different sizes. The method by which the mounting and binding device 2 replaces vacuum nozzles via the nozzle holder device 5 can be automatic or manual, depending on the actual situation. This embodiment of the invention, by setting the nozzle holder device 5, can satisfy the requirement of compatible replacement of vacuum nozzles of different sizes.

[0074] Please continue reading. Figure 1 , Figure 2 and Figure 5 The mounting and binding head device 2 is equipped with a glue application module 23, which moves synchronously with the mounting and binding head device 2; and / or, the die bonding equipment 100 also includes a glue application device 6 installed on the support platform 101, which is close to the base support device 1.

[0075] In the die bonding equipment 100 provided in this embodiment of the invention, the adhesive application module 23 and the mounting head binding device 2 move synchronously to avoid adhesive position deviation caused by relative displacement between the adhesive application module 23 and the mounting head binding device 2, thereby ensuring the fixing effect of the mounting component to the mounting part 131; the adhesive application device 6 is close to the base support device 1, which can shorten the path of the adhesive application process, reduce the shape change of the adhesive during the transfer process, and improve the continuity and efficiency of the adhesive application and mounting process.

[0076] It should be noted that the die bonding equipment 100 can select the method of applying adhesive and / or dipping adhesive according to different mounting requirements, thereby improving the flexibility and applicability of the die bonding equipment 100 in the adhesive processing stage. In the embodiments of the present invention, the die bonding equipment 100 includes an adhesive dipping device 6 installed on the support platform 101, and an adhesive application module 23 disposed on the mounting head binding device 2.

[0077] Please see Figure 1 , Figure 2 , Figure 4 and Figure 5 In some embodiments, after the upward positioning device 3 identifies the upward alignment part 133 and the support part 132, the mounting and binding device 2 first mounts the circular mounting element to the first mounting position, and then mounts the non-circular mounting element to the second mounting position.

[0078] In the die bonding equipment 100 provided in this embodiment of the invention, the first identification point 102 is located on the side of the upward alignment part 133 facing the upward positioning device 3, and the second identification point 103 is located on the inner wall surface of the first through hole 1321. The upward positioning device 3 positions the first identification point 102 and the second identification point 103 in sequence. The mounting head binding device 2 first mounts the circular mounting element to the first mounting position on the mounting part 131, and then mounts the non-circular mounting element to the second mounting position on the circular mounting element. That is, different mounting elements are stacked to meet the process logic of chip packaging, avoid mutual interference between different mounting elements during mounting, and improve the orderliness and continuity of the chip packaging process.

[0079] Specifically, the circular mounting element includes a ceramic component, and the non-circular mounting element includes a substrate and a chip bonded to the substrate. The substrate has bonding positions for top identification and positioning by the downward positioning module 21. In embodiments of the present invention, the substrate and the chip are square in shape, and can be rectangular or square.

[0080] Understandably, the bonding position on the substrate can be identified and positioned by the bottom-view positioning module 21. After the bottom-view positioning module 21 identifies and positions the bonding position, the mounting head device 2 will mount the chip to the bonding position accordingly. This design can significantly improve the alignment accuracy of the mounting head device 2 in completing chip mounting and ensure a reliable connection between the chip and the substrate.

[0081] Please see Figure 8 This invention also provides a die bonding method applied to the aforementioned die bonding equipment. The die bonding method includes the following steps:

[0082] S1: Provides mounting base and mounting components, the shape of which includes circular and non-circular components;

[0083] S2: After the top-view positioning device performs the first identification of the top-view alignment part, the mounting and binding head device applies glue or dips glue to the mounting part and mounts the circular mounting element to the mounting part accordingly.

[0084] S3: After the mounting head device applies glue or dips glue to the circular mounting element, the upper positioning device performs a second identification on the upper alignment part and the support part. The mounting head device then mounts the non-circular mounting element to the mounting part, and the mounting elements on the mounting part are stacked together.

[0085] S4: After the mounting head device applies adhesive or dips the adhesive to the non-circular mounting component, the downward positioning module performs a third identification of the non-circular mounting component, and the mounting head device mounts another non-circular mounting component to the mounting section.

[0086] The die bonding method of this invention has the same beneficial effects as the die bonding equipment described above. By first mounting circular mounting elements and then mounting non-circular mounting elements, and by stacking the mounting elements, mounting elements of different shapes and types are mounted sequentially according to the process logic, avoiding mutual interference and ensuring the orderliness and continuity of the die bonding process.

[0087] In step S1, circular mounting components include ceramic parts. After the top-view positioning device completes the first identification, the mounting head device applies adhesive or dips adhesive to the mounting part and mounts the ceramic part to the mounting part accordingly. Non-circular mounting components include a substrate and a chip. The substrate and chip are square in shape, which can be rectangular or square. After the top-view positioning device completes the second identification, the mounting head device mounts the substrate to the mounting part accordingly. The substrate has bonding positions for the bottom-view positioning module to perform top identification and positioning. After the bottom-view positioning module completes the third identification, the mounting head device mounts the chip to the bonding positions accordingly. At this time, the ceramic parts, substrate, and chip are stacked. This design can significantly improve the alignment accuracy of the mounting head device in chip mounting and ensure a reliable connection between the ceramic parts, substrate, and chip.

[0088] In steps S2 to S4, by applying adhesive or dipping it between the mounting part and the mounted components, as well as between the stacked mounted components, and by performing positioning calibration before each mounting, a stable connection between the mounting part and the mounted components, as well as between the stacked mounted components, can be ensured through the adhesive layer, thereby improving the structural stability of the chip package. In step S3, the top-view positioning device performs a second identification of the top-view alignment part and the support part to adapt to the mounting requirements of non-circular mounted components; in step S4, the bottom-view positioning module performs a third identification of the non-circular mounted components already mounted to the mounting part, identifying the bonding position through top identification positioning, further ensuring the mounting accuracy of the mounting head device.

[0089] The die bonding method provided in this embodiment of the invention has the same beneficial effects as the die bonding equipment described above. For details, please refer to... Figures 1 to 4 The mounting base 13 has a mounting section 131, a support section 132, and a top alignment section 133 connected in sequence. When the mounting base 13 is placed on the base support platform 12, the support section 132 is detachably fixed to the base support platform 12. The mounting section 131 is located on the side closer to the mounting head binding device 2, and the top alignment section 133 is located on the side closer to the top positioning device 3. When the base support device 1 moves, the base support platform 12 and the mounting base 13 move synchronously so that the top alignment section 133 and the support section 132 enter the recognition area of ​​the top positioning device 3. The top positioning device 3 can recognize the top alignment section 133 and the support section 132, perform bottom visual positioning of the mounting base 13, and transmit the recognition alignment signal to the mounting head binding device 2. The mounting head binding device 2 mounts circular or non-circular mounting elements to the mounting section 131 according to the bottom visual positioning recognition alignment signal.

[0090] In step S2, the upward positioning device 3 performs the first identification of the upward alignment part 133, specifically as follows: the shape of the upward alignment part 133 is cylindrical, and the side of the upward alignment part 133 facing the working end of the upward positioning device 3 is circular; the side of the upward alignment part 133 facing the upward positioning device 3 has a first identification point 102, and the side of the mounting part 131 facing the mounting head binding device 2 has a first mounting position, and the first identification point 102 corresponds to the first mounting position; after the upward positioning device 3 positions the first identification point 102, the mounting head binding device 2 mounts the circular mounting element to the corresponding first mounting position.

[0091] It should be noted that the first identification point 102 is the center of the side of the upward alignment part 133 facing the working end of the upward positioning device 3, and the first mounting position on the mounting part 131 is the center of the circular mounting element. The first identification point 102 and the first mounting position are coaxially arranged.

[0092] In step S2, the mounting head device 2 mounts the circular mounting element to the mounting section 131. The specific steps are as follows:

[0093] When the base support device 1 moves along the X and Y axes on the support platform 101, the base support stage 12 and the mounting base 13 move synchronously until the mounting base 13 moves directly above the working end of the top-view positioning device 3. At this time, the top-view alignment part 133 enters the recognition area of ​​the top-view positioning device 3. The top-view positioning device 3 performs bottom visual positioning on the mounting base 13 and can begin to position the first recognition point 102. In the embodiment of the present invention, the top-view alignment part 133 of the mounting base 13 is cylindrical in shape, and the top-view alignment part 133 faces the... One side of the working end of the top-view positioning device 3 is circular. The top-view positioning device 3 takes any three points on the bottom surface of the top-view alignment part 133. Any two points can be connected to form a straight line. The perpendicular bisectors of the two straight lines are taken, and the intersection of the perpendicular bisectors is the center of the circle. This center of the circle is also the first identification point 102 in this embodiment, which corresponds to the first mounting position on the mounting part 131. The top-view positioning device 3 transmits the identification alignment signal to the mounting head binding device 2. The mounting head binding device 2 mounts the circular mounting element to the first mounting position, completing one mounting cycle.

[0094] Further, in step S3, the upward positioning device 3 performs a second identification of the upward alignment part 133 and the support part 132, as follows: the support part 132 is provided with two first through holes 1321, which are symmetrically distributed on both sides of the upward alignment part 133. The base support platform 12 is provided with a second through hole. The first through holes 1321, the second through holes and the hollow channel are connected in sequence. The inner wall surface of the first through hole 1321 has a second identification point 103. After the upward positioning device 3 positions the second identification point 103, it determines the second mounting position on the side of the mounting part 131 facing the mounting head binding device 2 in combination with the first identification point 102. The mounting head binding device 2 mounts the non-circular mounting element to the second mounting position accordingly.

[0095] It should be noted that the two first through holes 1321 on the support part 132 are symmetrically distributed. The inner wall surface of the first through hole 1321 has a second identification point 103. Combined with the first identification point 102, the second mounting position on the circular mounting component can be accurately determined, which meets the high precision requirements of non-circular mounting components for mounting position and orientation, and improves the mounting accuracy of non-circular mounting components.

[0096] In step S3, the mounting head device 2 mounts the non-circular mounting components to the mounting section 131. The specific steps are as follows:

[0097] The base support device 1 moves along the X and Y axes on the support platform 101, causing the mounting base 13 to move directly above the working end of the upward positioning device 3. At this time, the upward alignment part 133 and the support part 132 enter the recognition area of ​​the upward positioning device 3. Since the first through hole 1321, the second through hole, and the hollow channel are connected in sequence, the working end of the upward positioning device 3 can directly recognize the second recognition point 103 on the inner wall of the first through hole 1321, and the first through hole 1321 is symmetrically distributed on the upward alignment part 13. On both sides of 3, after identifying two symmetrical second identification points 103, the perpendicular bisector of the straight line connecting the two second identification points 103 is taken. This perpendicular bisector intersects with the first identification point 102 to determine the second mounting position on the side of the circular mounting element facing the mounting head device 2. In other words, the mounting position of the non-circular mounting element can be determined. The upward positioning device 3 transmits the identification alignment signal to the mounting head device 2. The mounting head device 2 then mounts the non-circular mounting element to the corresponding second mounting position, completing one mounting cycle.

[0098] In some embodiments, the die bonding apparatus 100 further includes a substrate baking device; after the mounting head binding device 2 mounts the mounting element to the mounting part 131, the substrate baking device bakes the mounting substrate 13.

[0099] In the die bonding method provided in this embodiment of the invention, after the mounting head device 2 mounts the mounting element to the mounting part 131, the mounting base 13 is baked by the base baking device. This can promote the curing of the adhesive used in the mounting process, enhance the bonding strength between the mounting element and the mounting part 131 and between each mounting element, reduce the risk of the mounting element falling off after packaging, and ensure the stability of the chip packaging.

[0100] It should be noted that the baking process is integrated into the die bonding process, eliminating the need to transfer the mounting base 13 to external equipment, thus shortening the process interval and improving the overall continuity and production efficiency of the die bonding process. In the embodiments of the present invention, a baking process is performed each time the mounting head device 2 mounts the mounting component to the mounting section 131.

[0101] The die bonding apparatus and method disclosed in the embodiments of the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of the present invention. Furthermore, those skilled in the art will recognize that, based on the ideas of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A die bonding apparatus for encapsulating a chip on a mounting substrate, the mounting substrate having a mounting portion, a support portion, and a top-view alignment portion connected in sequence, characterized in that: The die bonding equipment includes a support platform and a base support device, a mounting head binding device, and a top-view positioning device installed on the support platform. The base support device moves on the support platform along the X and Y axes, and the mounting head binding device moves above the base support device along the X, Y, and Z axes. The base support device has a hollow channel in the vertical direction, and the top-view positioning device moves within the hollow channel along the Z axis. The mounting head binding device is equipped with a bottom-view positioning module. The base support device is provided with a base support platform for placing the mounting base. When the mounting base is placed on the base support platform, the support part is detachably fixed to the base support platform. The mounting part is located on the side closer to the mounting head binding device, and the upward alignment part is located on the side closer to the upward positioning device. When the base support device moves, the base support platform and the mounting base move synchronously so that the upward alignment part and the support part enter the recognition area of ​​the upward positioning device. The top-view positioning device can identify the top-view alignment part and the support part, perform bottom visual positioning of the mounting base, and transmit the identification alignment signal to the mounting head device. The mounting head device, based on the identification alignment signal of the bottom visual positioning, mounts the circular or non-circular mounting element to the mounting part.

2. The die bonding apparatus as described in claim 1, characterized in that: The shape of the upper alignment part is cylindrical, and the side of the upper alignment part facing the working end of the upper positioning device is circular; the side of the upper alignment part facing the upper positioning device has a first identification point, and the side of the mounting part facing the mounting and binding device has a first mounting position, and the first identification point corresponds to the first mounting position. After the upward positioning device locates the first identification point, the mounting and binding device mounts the circular mounting element to the first mounting position.

3. The die bonding apparatus as described in claim 2, characterized in that: The support portion is provided with two first through holes, which are symmetrically distributed on both sides of the upper viewing alignment portion. The base support platform is provided with a second through hole, and the first through hole, the second through hole and the hollow channel are connected in sequence. The inner wall of the first through hole has a second identification point. After the upward positioning device positions the second identification point, it determines the second mounting position on the side of the circular mounting element facing the mounting head device in combination with the first identification point. The mounting head device then mounts the non-circular mounting element to the second mounting position.

4. The die bonding apparatus as described in claim 3, characterized in that: The base support platform is detachably mounted on the base support device, and the base support platform is provided with a limiting component, which includes a first limiting member and a second limiting member; The first limiting member and the second limiting member are closely disposed on the side of the support portion, and the first limiting member and the second limiting member are disposed opposite to each other to detachably fix the mounting base to the base support platform.

5. The die bonding apparatus as described in claim 3, characterized in that: The downward positioning module is installed on the side of the mounting and binding device; The mounting head binding device is also equipped with a height measuring module, which is used to detect the flatness of the mounting element on the mounting part. The height measuring module is installed on the side of the mounting head binding device or the side of the downward positioning module. The downward positioning module and the height measurement module are located near the working end of the mounting and binding device and move synchronously with the mounting and binding device.

6. The die bonding apparatus as described in claim 3, characterized in that: The die bonding equipment also includes a material table device and a nozzle holder device installed on the support platform. The material table device is used to store the mounting components, and the nozzle holder device is used to store the nozzles. The material platform device is located between the base support device and the nozzle frame device, and the working end of the mounting and binding device cooperates with the material platform device and the nozzle frame device respectively.

7. The die bonding apparatus as described in claim 5 or 6, characterized in that: The mounting and binding head device is equipped with an adhesive application module, which moves synchronously with the mounting and binding head device; and / or, the die bonding equipment further includes an adhesive application device installed on the support platform, which is close to the base support device.

8. The die bonding apparatus as described in claim 7, characterized in that: After the upward positioning device identifies the upward alignment part and the support part, the mounting and binding device first mounts the circular mounting element to the first mounting position, and then mounts the non-circular mounting element to the second mounting position. The circular mounting element includes a ceramic component, and the non-circular mounting element includes a substrate and a chip bonded to the substrate. The substrate has bonding positions for the downward positioning module to perform top identification and positioning.

9. A die bonding method, applied to the die bonding apparatus according to any one of claims 1-8, characterized in that, The die bonding method includes the following steps: The mounting base and mounting element are provided, wherein the shape of the mounting element includes circular and non-circular shapes; After the upward positioning device performs the first identification of the upward alignment part, the mounting and binding head device applies glue or dips glue to the mounting part and attaches the circular mounting element to the mounting part accordingly. After the mounting head device applies glue or dips glue to the circular mounting element, the upward positioning device performs a second identification on the upward alignment part and the support part. The mounting head device then attaches the non-circular mounting element to the mounting part, and the mounting elements on the mounting part are stacked together. After the mounting head device applies adhesive or dips it into the non-circular mounting element, the downward positioning module performs a third identification of the non-circular mounting element, and the mounting head device then mounts another non-circular mounting element to the mounting section.

10. The die-bonding method as described in claim 9, characterized in that: The die bonding equipment also includes a base baking device; After the mounting head device mounts the mounting element to the mounting part, the base baking device bakes the mounting base.

Images