Wafer clamping automatic rotating alignment equipment

Abstract

The present application relates to wafer clamping technical field, specifically propose a kind of wafer clamping automatic rotation alignment equipment, including multi-angle rotating seat, suction mechanism, lifting tray, alignment mechanism and several connecting pipes.The present application is clamped to wafer, lifting tray and alignment mechanism are first aligned to wafer, so that wafer and lifting tray center alignment, then after suction head is fixed to wafer, lifting tray is moved upwards and the bottom of wafer is supported, to prevent the problem that fixed wafer warps and deforms, while alignment mechanism supports the edge of lifting tray, improves the stability of lifting tray to wafer support, so that lifting tray can be directly used as the support platform of wafer subsequent processing, avoid the precision error and scratch caused by wafer transfer and other problems, to realize the alignment, clamping, stable support and processing integration function to wafer.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer clamping, and particularly discloses a wafer clamping automatic rotation and alignment device. BACKGROUND

[0002] The wafer clamping device is a clamping device used in semiconductor manufacturing and advanced packaging, and is mainly used for positioning, clamping, rotation correction and placing processing (such as patching, photoetching, detection and the like) of a wafer. The core function thereof is to fix the wafer through vacuum adsorption or electrostatic clamping and the like, and to realize dynamic alignment by integrating a high-precision rotation mechanism.

[0003] The traditional wafer clamping device is to place the wafer clamped and fixed by adsorption on a corresponding supporting table after the wafer is clamped and fixed by adsorption, and then to process the wafer correspondingly. However, such placement is prone to cause a position deviation of the wafer when the wafer is transferred from the clamping device to the supporting table, and is prone to cause a scratch problem when the wafer is transferred from the clamping device to the supporting table. In addition, in the process of adsorption and fixation and transfer of the wafer, the wafer is prone to adsorption warping deformation due to the thinness of the wafer. Therefore, there is an urgent need for a wafer clamping automatic rotation and alignment device. SUMMARY

[0004] In view of the above problems, the present application provides a wafer clamping automatic rotation and alignment device to solve the technical problems in the related art.

[0005] In order to achieve the above-mentioned purpose, the present application provides the following technical scheme: a wafer clamping automatic rotation and alignment device, comprising a multi-angle rotating seat, an adsorption mechanism, a lifting tray, an alignment mechanism and a plurality of connecting pipes, a fixing disc is installed on the multi-angle rotating seat, a plurality of fan-shaped cavities are uniformly arranged on the fixing disc in the circumferential direction, the plurality of connecting pipes are arranged on the top of the fixing disc and are uniformly arranged in the circumferential direction of the fixing disc, the connecting pipes are communicated with the fan-shaped cavities, and an adsorption head is connected to the top of the connecting pipe, the adsorption mechanism and the multi-angle rotating seat are both existing devices, the adsorption mechanism is communicated with the plurality of fan-shaped cavities, so as to realize the adsorption and fixation of the wafer by the connecting pipe and the adsorption head.

[0006] The lifting tray is arranged on the top of the fixing disc through a cylinder installed at the center of the fixing disc, and is used for supporting the wafer. A supporting hole corresponding to the connecting pipe and sleeved on the connecting pipe is formed in the lifting tray.

[0007] The alignment mechanism is arranged on the fixing disc and comprises a supporting seat arranged on the side wall of the fixing disc and uniformly arranged in the circumferential direction. The supporting seat and the fan-shaped cavities are arranged alternately. A rotating rod is rotatably arranged on the supporting seat. An alignment abutment is fixedly arranged on the rotating rod. A supporting seat is arranged on the alignment abutment. A rectangular groove corresponding to the supporting seat is formed in the lower end surface of the lifting tray. A conversion part for driving the rotating rod to rotate when the cylinder pushes and moves the lifting tray is arranged on the fixing disc.

[0008] In a possible implementation, the adsorption head and the supporting hole are both funnel-shaped, the adsorption head is funnel-shaped to increase the adsorption area of the wafer, and the supporting hole is funnel-shaped to improve the supporting stability of the adsorption head.

[0009] In a possible implementation, the supporting seat is provided with a friction-reducing roller at the end away from the locating seat, and the top of the supporting seat is a horizontal surface closely fitted with the rectangular groove when the supporting seat is rotated to be horizontal, so as to stably support the bottom of the lifting tray.

[0010] In a possible implementation, the conversion part comprises a plurality of lifting linkage assemblies arranged uniformly along the circumferential direction of the side wall of the fixed disc and corresponding to the supporting seats, and the top of the fixed disc is provided with a synchronous driving assembly for synchronously driving the plurality of lifting linkage assemblies to drive the rotating rods to rotate when the air cylinder works, the synchronous driving assembly and the lifting linkage assemblies being matched to simultaneously drive the plurality of rotating rods to rotate.

[0011] In a possible implementation, the lifting linkage assembly comprises brackets respectively arranged at two sides of the supporting seat and fixed to the side wall of the fixed disc, the brackets are provided with guide sliding grooves, the two ends of the rotating rod are both provided with a gear fixedly sleeved after penetrating through the supporting seat, the guide sliding grooves are connected with a connecting block sliding up and down, the connecting block is provided with a rack engaged with the gear for transmission, and the fixed disc is provided with two inclined abutting pieces corresponding to the supporting seats and matched to push the corresponding two connecting blocks of the corresponding supporting seat to move up and down, the inclined abutting pieces and the brackets forming a triangle.

[0012] In a possible implementation, the synchronous driving assembly comprises a conical cover fixedly sleeved on the telescopic section of the air cylinder, the fixed disc is provided with an annular groove for accommodating the conical cover, the side wall of the conical cover is provided with guide grooves arranged uniformly along the circumferential direction, the guide grooves are corresponding to the supporting seats, the guide grooves are slidably connected with a limiting block, the end of the limiting block is provided with an abutting and pushing strip for pushing the inclined abutting piece, and the fixed disc is provided with a supporting block supporting the abutting and pushing strip and slidably connected with the abutting and pushing strip.

[0013] In a possible implementation, the inclined abutting piece comprises a sliding groove provided in the top of the fixed disc, the sliding groove is slidably connected with a guide sliding block, the guide sliding block is connected with the corresponding abutting and pushing strip, and the guide sliding block is hingedly connected with an abutting and pushing rod between the corresponding two connecting blocks, the lower end surface of the lifting tray is provided with an accommodating groove corresponding to the abutting and pushing rod, and the abutting and pushing rod is arranged obliquely to form a triangle with the bracket and the fixed disc.

[0014] The one or more technical solutions in the embodiments of the present application have at least one of the following beneficial effects: 1. The wafer clamping automatic rotation alignment equipment designed by the present application is matched with the lifting tray and the alignment mechanism through the adsorption mechanism, and when the wafer is clamped, the lifting tray and the alignment mechanism are matched to align the wafer first, so that the wafer is aligned with the center of the lifting tray, and then the lifting tray moves upward to support the bottom of the wafer after the wafer is adsorbed and fixed by the adsorption head, thereby preventing the wafer from being warped and deformed after being adsorbed and fixed, and the edge of the lifting tray is supported by the alignment mechanism, thereby improving the stability of the lifting tray supporting the wafer, so that the lifting tray can be directly used as a supporting table for subsequent processing of the wafer, thereby avoiding the precision error and scratching caused by wafer transfer, and thereby realizing the functions of wafer alignment, clamping, stable support and processing integration.

[0015] 2. When the lifting tray supports the bottom of the wafer, the conversion part drives the alignment abutment to move away from the wafer, the alignment abutment drives the supporting seat into the corresponding rectangular groove and abuts tightly with the rectangular groove, so that the middle part and the edge of the lifting tray are uniformly supported, thereby greatly improving the stability of the lifting tray supporting the wafer.

[0016] 3. The alignment mechanism in the present application can not only center the wafer before fixing the wafer, but also support the bottom edge of the lifting tray when the lifting tray supports the wafer after the wafer is adsorbed and fixed, thereby achieving the effect of one machine with two functions. DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and those skilled in the art can obtain other drawings according to the provided drawings without creative labor.

[0018] Figure 1 is a schematic diagram of the overall three-dimensional structure of the present application.

[0019] Figure 2 is a schematic diagram of the three-dimensional structure of the fixed disc, lifting tray and alignment mechanism of the present application.

[0020] Figure 3 is a schematic diagram of the three-dimensional structure of the lifting tray of the present application.

[0021] Figure 4 is a schematic diagram of the three-dimensional structure of the fixed disc and the alignment mechanism of the present application.

[0022] Figure 5 is Figure 4 the enlarged view of A in the present application.

[0023] Figure 6 is a front view of the present application Figure 2 .

[0024] Figure 7 is an enlarged view of B in Figure 6 .

[0025] Figure 8 is an enlarged view of C in Figure 6 .

[0026] Figure 9 is a bottom view of the lifting tray of the present application.

[0027] Figure 10 is a side view of the lifting tray and the supporting hole of the present application.

[0028] Reference signs:

[0029] 1, multi-angle rotating seat; 3, fixed disc; 4, fan-shaped cavity; 5, connecting pipe; 6, suction head; 7, lifting tray; 70, air cylinder; 71, supporting hole; 8, alignment mechanism; 80, supporting seat; 801, antifriction roller; 81, rotating rod; 82, alignment abutment; 83, supporting seat; 84, rectangular recess; 85, conversion part; 86, lifting linkage assembly; 860, support; 861, gear; 862, guide sliding slot; 863, connecting block; 864, rack; 87, synchronous driving assembly; 870, conical cover; 871, annular groove; 872, guide slot; 873, limiting block; 874, abutment strip; 875, supporting block; 880, sliding slot; 881, guide sliding block; 882, abutment rod; 9, wafer. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be apparently and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0031] In order to make the person in the art better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0032] Reference is made to Figure 1 , Figure 4 , Figure 7 and Figure 9The utility model relates to a kind of wafer clamping automatic rotation alignment equipment, including multi-angle rotating seat 1, suction mechanism, lifting tray 7, alignment mechanism 8 and several connecting pipes 5, fixed disc 3 is installed on multi-angle rotating seat 1, fixed disc 3 is equipped with fan-shaped cavity 4 evenly arranged along its circumferential direction, several connecting pipes 5 are arranged on the top of fixed disc 3 and evenly arranged along the circumferential direction of fixed disc 3, connecting pipe 5 is communicated with fan-shaped cavity 4 and suction head 6 is connected at the top of connecting pipe 5, suction mechanism and multi-angle rotating seat 1 are existing equipment, suction mechanism is communicated with multiple fan-shaped cavities 4, to realize the suction fixation of connecting pipe 5 and suction head 6 to wafer 9.

[0033] Refer to Figure 1 、 Figure 2 、 Figure 3 With Figure 4 , lifting tray 7 is arranged on the top of fixed disc 3 by cylinder 70 installed at the center of fixed disc 3, for supporting wafer 9, lifting disc is provided with supporting hole 71 corresponding with connecting pipe 5 and sleeved on connecting pipe 5.

[0034] Refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 6 With Figure 9 , alignment mechanism 8 is arranged on fixed disc 3, including support seat 80 arranged on the side wall of fixed disc 3 and evenly arranged along its circumferential direction, support seat 80 is staggered with fan-shaped cavity 4, rotatingly provided with rotating rod 81 on support seat 80, fixedly provided with alignment abutment 82 on rotating rod 81, provided with supporting seat 83 on alignment abutment 82, the lower end surface of lifting tray 7 is provided with rectangular recess 84 corresponding with supporting seat 83, provided with conversion part 85 on fixed disc 3, which drives rotating rod 81 to rotate when cylinder 70 pushes lifting tray 7 to move.

[0035] When clamping wafer 9, multi-angle rotating seat 1 drives fixed disc 3 and lifting tray 7 to move to the lower side of wafer storage equipment and makes the top of suction head 6 contact with the bottom of wafer 9, then cylinder 70 drives lifting tray 7 to move downward, conversion part 85 drives rotating rod 81 to rotate when lifting tray 7 moves downward, rotating rod 81 drives alignment abutment 82 to rotate to the side of wafer 9, until multiple alignment abutments 82 of circumferential direction of fixed disc 3 are in contact with wafer 9 to center alignment wafer 9, the end surface of alignment abutment 82 in contact with wafer 9 is provided with rubber pad, to reduce the abrasion of wafer 9 by alignment abutment 82, and also realize the center alignment of wafer 9 before suction head 6 absorbs and fixes wafer 9.

[0036] Then the adsorption mechanism starts to adsorb and fix the wafer 9 through the fan-shaped cavity 4, the connecting pipe 5 and the adsorption head 6, and then the multi-angle rotating seat 1 takes the wafer 9 from the wafer storage device through the adsorption head 6 and the fixed disc 3, while the air cylinder 70 drives the lifting tray 7 to move upwards, the lifting tray 7 supports the bottom of the wafer 9, at the same time, avoids the deformation of the wafer 9 under the long-time adsorption force, and affects the later processing of the wafer 9, and the conversion part 85 drives the alignment abutting seat 82 to move away from the wafer 9, the alignment abutting seat 82 drives the supporting seat 83 to enter the corresponding rectangular groove 84 and abuts tightly with the rectangular groove 84, so that the middle and the edge of the lifting tray 7 are uniformly supported, which greatly improves the stability of the lifting tray 7 supporting the wafer 9, so that the lifting tray 7 can stably support the wafer 9 during the later processing, directly becoming a supporting table for the wafer 9 processing, avoiding the problem that the wafer 9 needs to be placed on the corresponding processing supporting table in the traditional way, resulting in inaccurate placement position and affecting the subsequent processing of the wafer 9, and also avoiding the problem that the alignment abutting seat 82 protrudes from the top of the wafer 9, affecting the subsequent processing of the wafer 9.

[0037] Referring to Figure 2 , Figure 4 , Figure 6 , Figure 7 and Figure 10 , the adsorption head 6 and the supporting hole 71 are funnel-shaped, the adsorption head 6 is funnel-shaped to increase the adsorption area of the wafer 9, and the supporting hole 71 is funnel-shaped to improve the supporting stability of the adsorption head 6; the end of the supporting seat 83 away from the alignment abutting seat 82 is provided with an antifriction roller 801, and when the supporting seat 83 rotates to be horizontal, the top thereof is a horizontal surface closely attached to the rectangular groove 84, so as to stably support the bottom of the lifting tray 7.

[0038] Referring to Figure 1 , Figure 2 , Figure 4 and Figure 6 , the conversion part 85 includes a plurality of lifting linkage assemblies 86 installed on the side wall of the fixed disc 3 and uniformly arranged along the circumference thereof, the lifting linkage assemblies 86 correspond to the supporting seats 80 one by one, the top of the fixed disc 3 is provided with a synchronous driving assembly 87 for synchronously driving the plurality of lifting linkage assemblies 86 to drive the rotating rods 81 to rotate when the air cylinder 70 works, and the synchronous driving assembly 87 cooperates with the lifting linkage assemblies 86 to synchronously drive the plurality of rotating rods 81 to rotate.

[0039] Referring to Figure 2 , Figure 4 and Figure 5The lifting linkage assembly 86 comprises a support 860 fixed to the side wall of the fixed disc 3 and located on both sides of the support base 80, a guide sliding groove 862 is formed on the support 860, both ends of the rotating rod 81 penetrate through the support base 80 and are fixedly sleeved with a gear 861, a connecting block 863 connected with the gear 861 in sliding mode is connected to the guide sliding groove 862, a rack 864 engaged with the gear 861 in transmission mode is installed on the connecting block 863, and two connecting blocks 863 corresponding to the support base 80 are installed on the fixed disc 3 and are driven to move up and down by the inclined abutting pieces corresponding to the two connecting blocks 863. The inclined abutting pieces and the support 860 form a triangle.

[0040] In the initial state, the position correcting abutting seat 82 is in an inclined state away from the center of the lifting tray 7, and at this time, the supporting hole 71 on the lifting tray 7 is separated from the adsorption head 6. When the wafer 9 is centered and positioned, the cylinder 70 drives the lifting tray 7 to move downward, the cylinder 70 drives the plurality of inclined abutting pieces to move synchronously through the synchronous driving assembly 87, the inclined abutting pieces drive the connecting block 863 to move downward, the connecting block 863 drives the rack 864 to move downward, the rack 864 drives the rotating rod 81 to rotate through the engagement and transmission of the gear 861, and the rotating rod 81 stably drives the position correcting abutting seat 82 to move to the side of the wafer 9 through the engagement of the gears 861 and the racks 864 at both ends of the rotating rod 81, so that the wafer 9 is centered and positioned.

[0041] Referring to Figure 4 , Figure 5 , Figure 7 and Figure 8 , the synchronous driving assembly 87 comprises a conical cover 870 fixedly sleeved on the telescopic section of the cylinder 70, an annular groove 871 for accommodating the conical cover 870 is formed on the fixed disc 3, guide grooves 872 are uniformly arranged on the side wall of the conical cover 870 in the circumferential direction, the guide grooves 872 correspond to the supporting seats 83 in one-to-one mode, a limiting block 873 is connected in sliding mode to the guide grooves 872, an abutting strip 874 for pushing the inclined abutting piece is installed at the end of the limiting block 873, and a supporting block 875 for supporting the abutting strip 874 and connected in sliding mode with the abutting strip 874 is installed on the fixed disc 3.

[0042] Referring to Figure 3 , Figure 5 and Figure 7 , the inclined abutting piece comprises a sliding groove 880 formed on the top of the fixed disc 3, a guide sliding block 881 connected in sliding mode to the sliding groove 880, the guide sliding block 881 is connected with the corresponding abutting strip 874, an abutting rod 882 is hinged between the guide sliding block 881 and the corresponding two connecting blocks 863, a containing groove corresponding to the abutting rod 882 is formed on the lower end face of the lifting tray 7, and the abutting rod 882 is arranged in an inclined mode and forms a triangle with the support 860 and the fixed disc 3.

[0043] When working, when the cylinder 70 moves upward, the telescopic end drives the conical cover 870 to move upward, when the conical cover 870 moves upward, the limiting block 873 moves along the inclined surface of the guide groove 872, the limiting block 873 drives the abutting strip 874 and the guide sliding block 881 to move, when the guide sliding block 881 moves to the edge of the fixed disc 3, the abutting rod 882 drives the connecting block 863 to move upward, the abutting rod 882 is arranged obliquely and forms a triangle with the support 860 and the fixed disc 3, so that the stability of the connecting block 863 when driving the rack 864 to move is greatly improved, and at the same time, the rack 864 is driven to rotate into the rectangular groove 84 through the meshing transmission with the gear 861, so that the supporting seat 83 is rotated into the rectangular groove 84 and supports the edge of the lifting tray 7, avoiding that the lifting tray 7 only bears the thrust force at the center position, so that the supporting force at the edge of the lifting tray 7 is insufficient, the wafer 9 is difficult to be stably supported, and the stability of the lifting tray 7 in subsequent processing of the wafer 9 is affected.

[0044] Referring to Figures 1-10 , specifically, when the wafer 9 is clamped, the multi-angle rotating seat 1 drives the fixed disc 3 and the lifting tray 7 to move to the lower side of the wafer storage device and makes the top of the adsorption head 6 contact the bottom of the wafer 9, then the cylinder 70 drives the lifting tray 7 to move downward, when the lifting tray 7 moves downward, the conversion part 85 drives the rotating rod 81 to rotate, the rotating rod 81 drives the centering abutting seat 82 to rotate to the side of the wafer 9, until the plurality of centering abutting seats 82 around the fixed disc 3 all abut against the wafer 9 to center the wafer 9.

[0045] Then the adsorption mechanism is started, the wafer 9 is adsorbed and fixed through the fan-shaped cavity 4, the connecting pipe 5 and the adsorption head 6, then the multi-angle rotating seat 1 takes the wafer 9 out of the wafer storage device through the adsorption head 6 and the fixed disc 3, at the same time, the cylinder 70 drives the lifting tray 7 to move upward, the lifting tray 7 supports the bottom of the wafer 9, at the same time, deformation of the wafer 9 caused by long-time adsorption force is avoided, so that the subsequent processing of the wafer 9 is affected, at the same time, the conversion part 85 drives the centering abutting seat 82 to move away from the wafer 9, the centering abutting seat 82 drives the supporting seat 83 to enter the corresponding rectangular groove 84 and abut against the rectangular groove 84, so that the middle part and the edge of the lifting tray 7 are all subjected to uniform support force, and the centering abutting seat 82 is also avoided to protrude from the top of the wafer 9, so that the subsequent processing of the wafer 9 is affected.

[0046] In the description of the present application, it should be understood that the terms "long", "width", "upper", "lower", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0047] In the description of the application, it also needs to be explained that, unless otherwise explicitly specified and limited, the terms "set", "connected", "mounted", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0048] The embodiments of the specific implementation are the preferred embodiments of the application, and do not limit the protection scope of the application, so that equivalent changes made according to the structure, shape, principle of the application should be covered within the protection scope of the application.

Claims

1. A wafer clamping automatic rotation alignment device, comprising a multi-angle rotating seat and a suction mechanism, characterized in that, A plurality of fan-shaped cavities are arranged on the fixing disc in a uniform manner along the circumferential direction of the fixing disc; A plurality of connecting pipes are arranged on the top of the fixing disc in a uniform manner along the circumferential direction of the fixing disc, the connecting pipes are communicated with the fan-shaped cavities, and the top of each connecting pipe is provided with a suction head; A lifting tray is arranged on the top of the fixing disc through a cylinder arranged at the center of the fixing disc, and is used for supporting the wafer, and a supporting hole corresponding to the connecting pipe is arranged on the lifting tray and sleeved on the connecting pipe; A position correcting mechanism is arranged on the fixing disc, and includes a plurality of supporting seats arranged on the side wall of the fixing disc in a uniform manner along the circumferential direction of the fixing disc, the supporting seats are arranged alternately with the fan-shaped cavities, a rotating rod is rotatably arranged on each supporting seat, a position correcting seat is fixedly arranged on the rotating rod, a supporting seat is arranged on the position correcting seat, a rectangular groove corresponding to the supporting seat is arranged on the lower end surface of the lifting tray, and a conversion part is arranged on the fixing disc and used for driving the rotating rod to rotate when the cylinder pushes the lifting tray to move. When the cylinder drives the lifting tray to move downward, the conversion part drives the rotating rod to rotate the position correcting seat to the side of the wafer to correct the position of the wafer; when the lifting tray moves upward, the conversion part drives the position correcting seat to move away from the wafer, the supporting seat is tightly arranged in the rectangular groove to support the lifting tray for subsequent processing of the wafer.

2. The wafer clamping and automatic rotating and aligning apparatus according to claim 1, wherein: The conversion part includes a plurality of lifting linkage assemblies arranged on the side wall of the fixing disc in a uniform manner along the circumferential direction of the fixing disc, each lifting linkage assembly corresponds to one supporting seat, the top of the fixing disc is provided with a synchronous driving assembly used for driving the plurality of lifting linkage assemblies to drive the rotating rod to rotate synchronously when the cylinder works, and the synchronous driving assembly cooperates with the lifting linkage assemblies to simultaneously drive the plurality of rotating rods to rotate.

3. The wafer chucking, auto-rotating and aligning apparatus of claim 2, wherein: The lifting linkage assembly includes a bracket arranged on the side wall of the fixing disc and located on both sides of the supporting seat, a guide sliding groove is arranged on the bracket, gears are fixedly sleeved on both ends of the rotating rod and penetrate through the supporting seat, a connecting block sliding up and down is connected to the guide sliding groove, a rack meshing with the gear is arranged on the connecting block, and two inclined abutting pieces corresponding to the supporting seat are arranged on the fixing disc and used for driving the corresponding connecting block to move up and down, and the inclined abutting piece and the bracket form a triangle.

4. The wafer chucking, auto-rotating and aligning apparatus of claim 3, wherein: The synchronous driving assembly includes a conical cover fixedly sleeved on the telescopic section of the cylinder, an annular groove for accommodating the conical cover is arranged on the fixing disc, guide grooves are arranged on the side wall of the conical groove in a uniform manner along the circumferential direction of the conical groove, each guide groove corresponds to one supporting seat, a limiting block is slidingly connected to the guide groove, an abutting strip for pushing the inclined abutting piece is arranged on the end of the limiting block, and a supporting block supporting the abutting strip and slidingly connected with the abutting strip is arranged on the fixing disc.

5. The wafer chucking, auto-rotating and aligning apparatus of claim 4, wherein: The inclined abutting piece includes a sliding groove arranged on the top of the fixing disc, a guide sliding block slidingly connected to the sliding groove, the guide sliding block is connected with the corresponding abutting strip, and an abutting rod is hinged between the guide sliding block and the corresponding two connecting blocks, and the abutting rod is arranged in an inclined manner and forms a triangle with the bracket and the fixing disc.

6. The wafer chucking, auto-rotating, and aligning apparatus of claim 1, wherein: The end of the supporting seat away from the position correcting seat is provided with an antifriction roller, and the top of the supporting seat is a horizontal surface tightly arranged in the rectangular groove when the supporting seat rotates to be horizontal.

7. The wafer chucking, auto-rotating and aligning apparatus of claim 1, wherein: The suction head and the supporting hole are both funnel-shaped.

Images