Semiconductor packaging structure and manufacturing method of semiconductor packaging structure

Abstract

The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging structure and a manufacturing method of the semiconductor packaging structure. External electric connecting pieces are uniformly distributed and connected to the bottom end of the substrate, frustums are connected to four corners of the bottom end of the wafer, and the wafer is arranged on the substrate through a positioning assembly and an auxiliary assembly; a wafer is sleeved in a positioning frame until the wafer is clamped with a pad table, so that the wafer is positioned and mounted on a substrate, then a mounting table is mounted, and the positions of the mounting table and an L-shaped limiting plate are fixed through screws, so that the L-shaped limiting plate and the wafer are clamped and limited, and the wafer is stably and horizontally arranged on the substrate; glue is injected from the glue injection chute, flows through the trapezoidal glue guide plate and finally flows into the glue pouring chute to be filled into the column groove; and the glue columns formed by solidification in the column grooves bond the wafer, and meanwhile, the glue columns are matched with the conical grooves and the frustums to form a stable structure, so that the mounting stability of the wafer on the substrate is further improved, and the packaging effect of the semiconductor chip is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor packaging, and in particular to a semiconductor packaging structure and a method for manufacturing the semiconductor packaging structure. Background Art

[0002] Semiconductor packaging refers to the process of converting tested wafers into individual chips according to product model and functional requirements. The packaging process involves dicing wafers from the front-end wafer processing process into small chips. These chips are then glued onto islands on the corresponding substrate (lead frame). Ultra-fine metal (gold, tin, copper, and aluminum) wires or conductive resin are then used to connect the chip's bonding pads to the corresponding pins on the substrate, forming the required circuit. The individual chips are then encapsulated and protected in a plastic casing. A series of operations are performed after the packaging process, culminating in finished product testing.

[0003] However, in the prior art, when semiconductor chips are packaged and produced, the chip is mounted on the corresponding substrate by glue, and the glue needs to be applied to the substrate. During the operation, the glue is not easy to apply evenly, and the glue thickness in the glue application area is inconsistent, resulting in the chip not being able to remain stable and horizontally mounted on the substrate, that is, the chip is tilted on the substrate, affecting the subsequent packaging layout, and further affecting the packaging effect of the semiconductor chip, which requires improvement and optimization. Summary of the Invention

[0004] An object of the present invention is to provide a semiconductor package structure and a method for manufacturing a semiconductor package structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a semiconductor packaging structure, comprising: a substrate, a chip; the bottom end of the substrate is evenly connected with external electrical connectors, the four corners of the bottom end of the chip are connected with a frustum, and the chip is set on the substrate through a positioning component and an auxiliary component; the positioning component includes a positioning frame and a mounting table, and the auxiliary component includes an air blow pipe, an air bag, a push block, and a rotating plate.

[0006] Preferably, the positioning frame is connected to the substrate, heat dissipation holes are provided on the four side walls of the positioning frame, pads are connected to the four corners of the inner wall of the positioning frame, the chip is sleeved on the positioning frame, and the chip is clamped on the pads.

[0007] Preferably, a column groove is opened in the center of the pad, a frustum is arranged in the column groove, a conical groove is opened at the bottom of the column groove, a glue pouring inclined groove is opened on the side wall of the column groove, an installation groove is opened at the end of the glue pouring inclined groove, the installation groove passes through the positioning frame, and threaded holes are opened at equal distances on both side walls of the positioning frame.

[0008] Preferably, a mounting platform is inserted into the mounting groove, and an L-shaped limit plate is fixedly sleeved on the outside of the mounting platform. The L-shaped limit plate is clamped with the positioning frame, and the L-shaped limit plate is clamped with the chip. A mounting hole is opened on the side wall of the L-shaped limit plate, and a screw passes through the mounting hole and is threadedly connected to the threaded hole.

[0009] Preferably, a glue injection chute is provided on the upper side wall of the mounting platform, a vertical slide is provided on the side end of the mounting platform, and a horizontal slide is provided on the bottom end of the mounting platform. The upper end of the vertical slide is connected to the end of the glue injection chute, and the lower end of the vertical slide is connected to the end of the horizontal slide.

[0010] Preferably, a guide column is provided in the vertical slide groove, both ends of the guide column are fixedly connected to the side walls of the vertical slide groove, a trapezoidal slider is connected to the side wall of the horizontal slide groove, and a trapezoidal rubber guide plate is movably connected in the vertical slide groove.

[0011] Preferably, a guide groove is provided on the side wall of the trapezoidal rubber guide plate, the guide column is movably clamped in the guide groove, the top of the trapezoidal rubber guide plate is arranged at an angle, the side corner of the bottom end of the trapezoidal rubber guide plate is arranged at an angle, a first magnetic block is embedded in the inclined surface of the bottom end of the trapezoidal rubber guide plate, and the blowing tube is fixedly plugged into the mounting table.

[0012] Preferably, the peripheral wall of the air blowing tube protrudes from the glue injection chute, the end of the air blowing tube passes through the mounting platform and is threadedly connected to an air bag, the top inclined surface of the trapezoidal glue guide plate and the inclined surface of the glue injection chute are in the same plane, the air blowing tube mouth is exposed from the glue injection chute and points to the glue pouring chute, the trapezoidal glue guide plate is clamped with the end of the air blowing tube, and the push block is movably clamped in the horizontal slide groove.

[0013] Preferably, a trapezoidal slide groove is provided on the push block, the trapezoidal slider is movably clamped in the trapezoidal slide groove, the end of the push block is arranged in an inclined surface, the inclined surface of the push block is clamped with the inclined surface of the bottom end of the trapezoidal rubber guide plate, and a second magnetic block is fixedly embedded on the inclined surface of the push block, the second magnetic block and the first magnetic block attract each other, and a rotating plate is rotatably provided on the side wall of the mounting platform, and the rotating plate is clamped with the push block.

[0014] A method for manufacturing a semiconductor packaging structure, the method comprising: inserting a wafer into a positioning frame until the wafer is engaged with a pad, thereby positioning the wafer on a substrate, inserting a frustum at the bottom end of the wafer into a column slot, then installing a mounting platform, tightening screws to fix the mounting platform and an L-shaped limit plate so that the L-shaped limit plate is engaged with the wafer; engaging the inclined surface of a push block with the inclined surface at the bottom end of a trapezoidal glue guide plate, and attracting a second magnetic block and a first magnetic block to fix the position of the trapezoidal glue guide plate; pouring glue from an exposed glue injection chute, flowing through the top inclined surface of the trapezoidal glue guide plate, and finally flowing into a glue pouring chute. Fill it into the column slot, and during the process, slowly pinch the air bag and blow air along the air blowing tube toward the glue pouring chute, and auxiliary blowing pushes the glue into the glue pouring chute; after the glue fills the column slot, push the push block so that the inclined surface at the end of the push block pushes the trapezoidal glue guide plate upward, and rotate the rotating plate and the push block to engage the limit to achieve the limitation of the trapezoidal glue guide plate. At this time, the two side walls of the trapezoidal glue guide plate respectively block the air blowing tube orifice and the glue pouring chute, and wait for the glue in the column slot to solidify before removing the mounting table. The glue column formed by the solidification in the column slot bonds the chip, and the glue column cooperates with the tapered slot and the frustum to form a stable structure.

[0015] Compared with the prior art, this application has the following beneficial effects: The wafer is positioned and mounted on the substrate by inserting the wafer into the positioning frame until the wafer is engaged with the pad. The frustum at the bottom of the wafer is positioned and inserted into the column groove. After that, the mounting platform is installed so that it is plugged into the end of the mounting groove. The screws are screwed into the threaded holes to tightly fix the mounting platform and the L-shaped limit plate so that the L-shaped limit plate is engaged and limited with the wafer, so that the wafer is stably and horizontally placed on the substrate, which facilitates the wafer to be fixed by glue and avoids affecting the subsequent packaging layout. By pouring glue into the exposed glue injection chute, it flows through the top inclined surface of the trapezoidal glue guide plate and finally flows into the glue pouring chute to fill the column groove. During the process, the air bag is slowly pinched and air is blown along the blowing tube toward the glue pouring chute to assist in blowing and push the glue to flow into the glue pouring chute to fill the column groove; the glue column formed by solidification in the column groove adheres to the chip, and the glue column cooperates with the tapered groove and the frustum to form a stable structure, further improving the mounting stability of the chip on the substrate and ensuring the packaging effect of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the chip structure connection of the present invention; Figure 3 A half-sectional view of the structure of the present invention; Figure 4 This is a schematic diagram of the connection of the positioning frame structure of the present invention; Figure 5 For the present invention Figure 4 A partial enlarged view of the Figure 6This is an exploded view of the mounting platform structure of the present invention; Figure 7 This is a half-section view of the mounting platform structure of the present invention.

[0017] In the figure: substrate 1, external electrical connector 2, chip 3, frustum 4, positioning frame 5, heat dissipation hole 501, pad 502, column groove 503, conical groove 504, glue pouring inclined groove 505, mounting groove 506, threaded hole 507, mounting platform 6, L-shaped limit plate 601, mounting hole 602, glue injection inclined groove 603, vertical slide 604, horizontal slide 605, guide column 606, trapezoidal slider 607, trapezoidal glue guide plate 608, guide groove 609, first magnetic block 610, blowing tube 7, air bag 8, push block 9, trapezoidal slide 901, second magnetic block 902, rotating plate 10. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figure 1-7 The present invention provides a technical solution: a semiconductor packaging structure and a method for manufacturing a semiconductor packaging structure, including: a substrate 1 and a chip 3; the bottom end of the substrate 1 is evenly connected with external electrical connectors 2, and the four corners of the bottom end of the chip 3 are connected with frustums 4, and the chip 3 is set on the substrate 1 through a positioning component and an auxiliary component.

[0020] The positioning frame 5 in the positioning assembly is connected to the substrate 1, and heat dissipation holes 501 are provided on the four side walls of the positioning frame 5. Pads 502 are connected to the four corners of the inner wall of the positioning frame 5. The chip 3 is connected to the positioning frame 5, and the chip 3 is clamped to the pads 502.

[0021] The chip 3 is inserted into the positioning frame 5 until the chip 3 is engaged with the pad 502, so that the chip 3 is positioned and installed on the substrate 1, preventing the chip 3 from moving relative to the substrate 1 during the installation process. At the same time, the pad 502 lifts the chip 3 and assists in heat dissipation through the heat dissipation holes 501 on the positioning frame 5.

[0022] A column groove 503 is provided at the center of the pad 502, and the frustum 4 is arranged in the column groove 503. A conical groove 504 is provided at the bottom end of the column groove 503, and a glue pouring inclined groove 505 is provided on the side wall of the column groove 503. An installation groove 506 is provided at the end of the glue pouring inclined groove 505. The installation groove 506 passes through the positioning frame 5, and threaded holes 507 are equidistantly provided on the two side walls of the positioning frame 5.

[0023] When the chip 3 is inserted into the positioning frame 5 and clamped with the pad 502, the frustum 4 at the bottom end of the chip 3 is positioned and inserted into the column groove 503, and the glue used to fix the chip 3 flows into the column groove 503 through the glue pouring inclined groove 505. When the glue fills the column groove 503 and solidifies, the chip 3 is adhered to the pad 502. The bottom end of the glue column formed by the solidification of the glue forms a cone to fill and adhere to the conical groove 504. The top end of the glue column adheres to the chip 3 and forms a conical groove that is embedded with the frustum 4, further improving the mounting stability of the chip 3 on the substrate 1.

[0024] A mounting platform 6 is inserted into the mounting groove 506, and an L-shaped limiting plate 601 is fixedly sleeved on the outside of the mounting platform 6. The L-shaped limiting plate 601 is clamped with the positioning frame 5, and the L-shaped limiting plate 601 is clamped with the chip 3. A mounting hole 602 is opened on the side wall of the L-shaped limiting plate 601, and a screw passes through the mounting hole 602 and is threadedly connected to the threaded hole 507.

[0025] When the mounting platform 6 is inserted into the end of the mounting groove 506, the L-shaped limiting plate 601 is engaged with the positioning frame 5 so that the screw passes through the mounting hole 602 and is threadedly connected with the threaded hole 507, thereby fixing the position of the mounting platform 6 and the L-shaped limiting plate 601. At this time, the L-shaped limiting plate 601 is engaged with the chip 3 to limit the position, which makes it convenient to keep the position of the chip 3 fixed when pouring glue to bond the chip 3.

[0026] The upper side wall of the mounting platform 6 is provided with a glue injection chute 603, the side end of the mounting platform 6 is provided with a vertical slide 604, and the bottom end of the mounting platform 6 is provided with a horizontal slide 605. The upper end of the vertical slide 604 is connected to the end of the glue injection chute 603, and the lower end of the vertical slide 604 is connected to the end of the horizontal slide 605.

[0027] A guide column 606 is provided in the vertical slide groove 604, and both ends of the guide column 606 are fixedly connected to the side walls of the vertical slide groove 604. A trapezoidal slider 607 is connected to the side wall of the horizontal slide groove 605, and a trapezoidal rubber guide plate 608 is movably connected in the vertical slide groove 604.

[0028] When pouring glue to bond the wafer 3 , the glue is poured in from the exposed glue injection chute 603 , flows through the top inclined surface of the trapezoidal glue guide plate 608 , and finally flows into the glue pouring chute 505 to fill in the column groove 503 .

[0029] A guide groove 609 is provided on the side wall of the trapezoidal rubber guide plate 608, and the guide column 606 is movably snap-fitted into the guide groove 609. The top of the trapezoidal rubber guide plate 608 is inclined, and one side corner of the bottom end of the trapezoidal rubber guide plate 608 is inclined. A first magnetic block 610 is embedded on the inclined surface of the bottom end of the trapezoidal rubber guide plate 608, and the air blowing tube 7 is fixedly plugged into the mounting platform 6.

[0030] When the guide column 606 is clamped in the upper end of the guide groove 609, the top inclined surface of the trapezoidal glue guide plate 608 is in the same plane as the inclined surface of the glue injection chute 603, which facilitates the glue to be poured into the glue pouring chute 505 from the exposed glue injection chute 603. After the glue fills the column groove 503, the trapezoidal glue guide plate 608 is moved upward to block the glue pouring chute 505 to prevent the unsolidified glue in the column groove 503 from flowing out.

[0031] The surrounding wall of the air blowing tube 7 in the auxiliary component protrudes from the glue injection chute 603, and the end of the air blowing tube 7 passes through the mounting platform 6 and is threadedly connected to an air bag 8. The top inclined surface of the trapezoidal glue guide plate 608 is in the same plane as the inclined surface of the glue injection chute 603. The mouth of the air blowing tube 7 is exposed from the glue injection chute 603 and points to the glue pouring chute 505. The trapezoidal glue guide plate 608 is clamped with the end of the air blowing tube 7, and the push block 9 is movably clamped in the horizontal slide groove 605.

[0032] The air bag 8 is threadedly connected and arranged at the end of the blowing tube 7, so that when pouring glue, the air bag 8 is pinched and blown along the blowing tube 7 toward the glue pouring chute 505, and the auxiliary blowing pushes the glue into the glue pouring chute 505. The trapezoidal glue guide plate 608 blocks the mouth of the blowing tube 7 when moving upward.

[0033] The push block 9 is provided with a trapezoidal slide groove 901, and the trapezoidal slider 607 is movably engaged in the trapezoidal slide groove 901. The end of the push block 9 is provided with an inclined surface, and the inclined surface of the push block 9 is engaged with the inclined surface of the bottom end of the trapezoidal rubber guide plate 608. A second magnetic block 902 is fixedly embedded on the inclined surface of the push block 9, and the second magnetic block 902 and the first magnetic block 610 attract each other. A rotating plate 10 is rotatably provided on the side wall of the mounting platform 6, and the rotating plate 10 is engaged with the push block 9.

[0034] When pouring glue, the trapezoidal slider 607 is located at the end of the trapezoidal slide groove 901. At this time, the inclined surface of the push block 9 is engaged with the inclined surface at the bottom end of the trapezoidal glue guide plate 608, and the second magnetic block 902 and the first magnetic block 610 attract each other, so that the position of the trapezoidal glue guide plate 608 is fixed. The push block 9 is pushed along the horizontal slide groove 605, and the inclined surface at the end of the push block 9 pushes the trapezoidal glue guide plate 608 to move upward. The rotating plate 10 is engaged with the push block 9 to limit the position, thereby limiting the trapezoidal glue guide plate 608.

[0035] After the wafer 3 is positioned on the substrate 1, the second magnetic block 902 and the first magnetic block 610 are attracted to each other and the position of the trapezoidal guide plate 608 is fixed. The glue is poured into the exposed glue injection chute 603, flows through the top inclined surface of the trapezoidal guide plate 608 and finally flows into the glue pouring chute 505 to fill the column groove 503, and is slowly pinched during the process. The airbag 8 blows air along the blowing pipe 7 toward the glue pouring chute 505, and the auxiliary blowing pushes the glue into the glue pouring chute 505; when it is observed from the opening of the glue injection chute 603 that the glue is no longer flowing and overflows the inclined surface of the trapezoidal glue guide plate 608, the glue has filled the column groove 503, and the push block 9 is pushed along the horizontal slide groove 605. The inclined surface at the end of the push block 9 pushes the trapezoidal glue guide plate 608 to move upward, and the rotating plate 10 is rotated to engage with the push block 9 to limit the trapezoidal glue guide plate 608, thereby limiting the position of the trapezoidal glue guide plate 608. At this time, the two side walls of the trapezoidal glue guide plate 608 respectively block the pipe opening of the blowing pipe 7 and the glue pouring chute 505, and wait for the glue in the column groove 503 to solidify before removing the mounting table 6. The glue column formed by the solidification in the column groove 503 adheres to the chip 3, and the glue column cooperates with the tapered groove 504 and the cone 4 to form a stable structure, further improving the mounting stability of the chip 3 on the substrate 1, avoiding affecting the subsequent packaging layout, and ensuring the packaging effect of the semiconductor chip.

[0036] Although the above describes the illustrative specific implementation methods of the present application so that those skilled in the art can understand the present application, the present application is not limited to the scope of the specific implementation methods. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present application defined and determined by the attached claims, all application creations based on the concept of the present application are protected.

Claims

1. Semiconductor packaging structure, including: A substrate (1) and a chip (3); the bottom end of the substrate (1) is evenly connected to external electrical connectors (2), the four corners of the bottom end of the chip (3) are connected to cones (4), and the chip (3) is arranged on the substrate (1) through a positioning component and an auxiliary component; The feature is that the positioning component comprises a positioning frame (5) and a mounting platform (6), and the auxiliary component comprises an air blowing pipe (7), an air bag (8), a push block (9), and a rotating plate (10).

2. The semiconductor package structure according to claim 1, wherein: The positioning frame (5) is connected and arranged on the substrate (1); heat dissipation holes (501) are arranged on the four side walls of the positioning frame (5); pads (502) are connected and arranged at the four corners of the inner wall of the positioning frame (5); the chip (3) is sleeved with the positioning frame (5), and the chip (3) is clamped with the pad (502).

3. The semiconductor package structure according to claim 2, wherein: A column groove (503) is provided at the center of the pad (502), the frustum (4) is arranged in the column groove (503), a conical groove (504) is provided at the bottom end of the column groove (503), a glue pouring inclined groove (505) is provided on the side wall of the column groove (503), and a mounting groove (506) is provided at the end of the glue pouring inclined groove (505), the mounting groove (506) passes through the positioning frame (5), and threaded holes (507) are provided at equal distances on both side walls of the positioning frame (5).

4. The semiconductor package structure according to claim 3, wherein: The mounting groove (506) is provided with a mounting platform (6) inserted therein, and an L-shaped limiting plate (601) is fixedly sleeved on the outside of the mounting platform (6), the L-shaped limiting plate (601) is clamped with the positioning frame (5), and the L-shaped limiting plate (601) is clamped with the chip (3), and a mounting hole (602) is provided on the side wall of the L-shaped limiting plate (601), and a screw passes through the mounting hole (602) and is threadedly connected to the threaded hole (507).

5. The semiconductor package structure according to claim 4, wherein: The upper side wall of the mounting platform (6) is provided with a glue injection chute (603), the side end of the mounting platform (6) is provided with a vertical slide groove (604), and the bottom end of the mounting platform (6) is provided with a horizontal slide groove (605), the upper end of the vertical slide groove (604) is connected to the end of the glue injection chute (603), and the lower end of the vertical slide groove (604) is connected to the end of the horizontal slide groove (605).

6. The semiconductor package structure according to claim 5, wherein: A guide column (606) is provided in the vertical slide groove (604), and both ends of the guide column (606) are fixedly connected to the side wall of the vertical slide groove (604). A trapezoidal slider (607) is connected to the side wall of the horizontal slide groove (605), and a trapezoidal rubber guide plate (608) is movably connected and provided in the vertical slide groove (604).

7. The semiconductor package structure according to claim 6, wherein: A guide groove (609) is provided on the side wall of the trapezoidal rubber guide plate (608), and the guide column (606) is movably connected and arranged in the guide groove (609). The top of the trapezoidal rubber guide plate (608) is arranged in an inclined surface, and the corner of one side of the bottom end of the trapezoidal rubber guide plate (608) is arranged in an inclined surface. A first magnetic block (610) is embedded in the inclined surface of the bottom end of the trapezoidal rubber guide plate (608), and the air blowing pipe (7) is fixedly plugged and arranged on the mounting platform (6).

8. The semiconductor package structure according to claim 7, wherein: The wall of the air blowing pipe (7) protrudes from the glue injection chute (603), the end of the air blowing pipe (7) passes through the mounting platform (6) and is threadedly connected to be provided with an air bag (8), the top inclined surface of the trapezoidal glue guide plate (608) and the inclined surface of the glue injection chute (603) are in the same plane, the pipe opening of the air blowing pipe (7) is exposed from the glue injection chute (603) and points to the glue pouring chute (505), the trapezoidal glue guide plate (608) is clamped with the end of the air blowing pipe (7), and the push block (9) is movably clamped and arranged in the horizontal slide groove (605).

9. The semiconductor package structure according to claim 8, wherein: The push block (9) is provided with a trapezoidal slide groove (901), the trapezoidal slider (607) is movably engaged in the trapezoidal slide groove (901), the end of the push block (9) is provided with an inclined surface, the inclined surface of the push block (9) is engaged with the inclined surface of the bottom end of the trapezoidal rubber guide plate (608), a second magnetic block (902) is fixedly engaged on the inclined surface of the push block (9), the second magnetic block (902) and the first magnetic block (610) attract each other, and a rotating plate (10) is rotatably provided on the side wall of the mounting platform (6), and the rotating plate (10) is engaged with the push block (9).

10. A method for manufacturing a semiconductor package structure according to any one of claims 1 to 9, characterized in that: The method comprises the following steps: inserting a chip (3) into a positioning frame (5) until the chip (3) is engaged with the pad (502), so that the chip (3) is positioned and mounted on the substrate (1); the cone (4) at the bottom end of the chip (3) is positioned and inserted into the column groove (503); then installing the mounting platform (6); tightening the screws to fix the mounting platform (6) and the position of the L-shaped limiting plate (601) so that the L-shaped limiting plate (601) and the chip (3) are engaged and limited; the inclined surface of the push block (9) is engaged with the inclined surface at the bottom end of the trapezoidal glue guide plate (608); the second magnetic block (902) and the first magnetic block (610) attract each other to fix the position of the trapezoidal glue guide plate (608); and the glue is poured from the exposed glue injection chute (603), flows through the top inclined surface of the trapezoidal glue guide plate (608) and finally flows into the glue pouring chute (505) to fill the column groove ( 503), during the process, slowly pinch the air bag (8) and blow air along the air blowing pipe (7) toward the glue pouring chute (505), and auxiliary blowing pushes the glue into the glue pouring chute (505); after the glue fills the column groove (503), push the push block (9) so that the inclined surface of the end of the push block (9) pushes the trapezoidal glue guide plate (608) upward, rotate the rotating plate (10) and the push block (9) to engage and limit, thereby realizing the limitation of the trapezoidal glue guide plate (608), at this time, the two side walls of the trapezoidal glue guide plate (608) respectively block the air blowing pipe (7) pipe mouth and the glue pouring chute (505), wait for the glue in the column groove (503) to solidify, and then remove the mounting table (6), the glue column formed by the solidification in the column groove (503) adheres to the chip (3), and at the same time, the glue column cooperates with the conical groove (504) and the cone (4) to form a stable structure.

Images