Optical signal receiving and transmitting integrated device

Abstract

The invention discloses an optical signal receiving and transmitting integrated device. The optical signal receiving and transmitting integrated device comprises a silicon-based substrate, a management module, a first silicon optical modulation module, a second silicon optical modulation module, a first optical demodulation module and a second optical demodulation module, the management module, the first silicon light modulation module, the second silicon light modulation module, the first light demodulation module and the second light demodulation module are all located on one side of the silicon-based substrate. The management module comprises a plurality of input ports and output ports; the first silicon light modulation module and the second silicon light modulation module are symmetrically distributed on the two sides of the management module in the direction parallel to the plane where the silicon-based substrate is located. The first optical demodulation module and the second optical demodulation module are symmetrically distributed on the sides, away from the management module, of the first silicon optical modulation module and the second silicon optical modulation module in the direction parallel to the plane where the silicon-based substrate is located. The management module is electrically connected with the first optical demodulation module and the second optical demodulation module through the input port and / or the output port.

Description

Technical Field

[0001] The present invention relates to the field of optical communication technology, and in particular to an optical signal transceiver integrated device. Background Art

[0002] Optical communication technology, using optical fiber as the optical transmission carrier, has been maturely applied in various communication networks, including backbone networks, metropolitan area networks, and local area networks. As next-generation computers, servers, and communication equipment evolve toward higher frequencies and higher speeds, traditional copper-based electrical interconnects will struggle to support high-speed information exchange over very short distances, such as between frames, boards, and chips, due to factors such as loss, radiation, and crosstalk. Optical interconnects, with their high capacity, high speed, low latency, and low power consumption, are poised to replace copper wires and provide physical connections over very short distances for high-performance systems.

[0003] Existing silicon photomodulators require dedicated electronic chips for the power and drive signals they need to operate. For example, separate multi-channel heating driver chips and multi-channel photodetector monitoring or driver chips are required. These discrete components and chips occupy a large area when electrically connected, hindering the miniaturization of optical transmission modules. Summary of the Invention

[0004] The present invention provides an integrated optical signal transceiver, which can improve the integration of the integrated optical signal transceiver, facilitate miniaturization, and improve ease of use.

[0005] In a first aspect, the present invention provides an integrated optical signal transceiver device, comprising: a silicon-based substrate, a management module, a first silicon optical modulation module, a second silicon optical modulation module, a first optical demodulation module, and a second optical demodulation module;

[0006] The management module, the first silicon optical modulation module, the second silicon optical modulation module, the first optical demodulation module and the second optical demodulation module are all located on one side of the silicon-based substrate;

[0007] The management module includes a plurality of input ports and output ports;

[0008] Along a direction parallel to the plane of the silicon-based substrate, the first silicon optical modulation module and the second silicon optical modulation module are symmetrically distributed on both sides of the management module; the management module is electrically connected to the first silicon optical modulation module and the second silicon optical modulation module through the input port and / or the output port;

[0009] The first optical demodulation module and the second optical demodulation module are symmetrically distributed on the side of the first silicon optical modulation module and the second silicon optical modulation module away from the management module in a direction parallel to the plane in which the silicon substrate is located; and the management module is electrically connected with the first optical demodulation module and the second optical demodulation module through the input port and / or the output port.

[0010] Optionally, the silicon substrate comprises a plurality of vias.

[0011] In the thickness direction of the silicon substrate, each of the vias overlaps with the projection of the management module on the plane in which the silicon substrate is located; and each of the vias is electrically connected with the power terminal of the management module.

[0012] Optionally, the optical signal transceiver integrated device further comprises a circuit board.

[0013] The circuit board is located on the side of the silicon substrate away from the management module, the circuit board is electrically connected with each of the vias, and the circuit board is configured to provide a power signal to the management module.

[0014] Optionally, the first silicon optical modulation module comprises at least two first optical input ports and at least four first optical output ports, the first optical input ports are configured to receive first input optical signals, and the first silicon optical modulation module is configured to modulate the first input optical signals and output first output optical signals to the first optical output ports.

[0015] The second silicon optical modulation module comprises at least two second optical input ports and at least four second optical output ports, the second optical input ports are configured to receive second input optical signals, and the second silicon optical modulation module is configured to modulate the second input optical signals and output second output optical signals to the second optical output ports.

[0016] Optionally, the optical signal transceiver integrated device further comprises a circuit board.

[0017] The first silicon optical modulation module comprises a plurality of first modulation input terminals, each of the first modulation input terminals is electrically connected with the circuit board, the circuit board is configured to provide a first modulation signal to each of the first modulation input terminals, and the first silicon optical modulation module is configured to modulate the first input optical signals according to the first modulation signal and output the first output optical signals.

[0018] The second silicon optical modulation module comprises a plurality of second modulation input terminals, each of the second modulation input terminals is electrically connected with the circuit board, the circuit board is configured to provide a second modulation signal to each of the second modulation input terminals, and the second silicon optical modulation module is configured to modulate the second input optical signals according to the second modulation signal and output the second output optical signals.

[0019] Optionally, the first silicon photonic modulation module includes a plurality of first feedback terminals and a plurality of first adjustment control terminals, the first feedback terminals are electrically connected to the input port of the management module, and the first adjustment control terminals are electrically connected to the output port of the management module; the management module is configured to provide a first adjustment control signal to the first silicon photonic modulation module based on a first feedback signal provided by the first silicon photonic modulation module;

[0020] The second silicon photonic modulation module includes multiple second feedback ends and multiple second adjustment control ends, the second feedback end is electrically connected to the input port of the management module, and the second adjustment control end is electrically connected to the output port of the management module; the management module is used to provide a second adjustment control signal to the second silicon photonic modulation module based on the second feedback signal provided by the second silicon photonic modulation module.

[0021] Optionally, the first silicon photonic modulation module includes a first heating structure, a driving end of the first heating structure is electrically connected to the output port of the management module; the management module is used to provide a first heating driving signal to the first heating structure; the first heating structure is used to heat the first optical input path in the first silicon photonic modulation module;

[0022] The second silicon photonic modulation module includes a second heating structure, wherein a driving end of the second heating structure is electrically connected to the output port of the management module; the management module is configured to provide a second heating driving signal to the second heating structure; and the second heating structure is configured to heat a second optical input path in the second silicon photonic modulation module.

[0023] Wherein, along a direction parallel to the plane where the silicon-based substrate is located, the first heating structure and the second heating structure are symmetrically distributed on both sides of the management module.

[0024] Optionally, the first optical demodulation module includes a plurality of first optical signal receiving ends and a plurality of first electrical signal output ends; the first optical demodulation module is used to convert the first optical signal to be demodulated received by the first optical signal receiving end into a first electrical signal and provide the first electrical signal to the first electrical signal output end;

[0025] The second optical demodulation module includes multiple second optical signal receiving ends and multiple second electrical signal output ends; the second optical demodulation module is used to convert the second optical signal to be demodulated received by the second optical signal receiving end into a second electrical signal and provide it to the second electrical signal output end.

[0026] Optionally, the first optical demodulation module includes a plurality of first control signal input terminals and a plurality of first detection signal output terminals, the first control signal input terminals are electrically connected to the output port of the management module, and the first detection signal output terminals are electrically connected to the input port of the management module; the first optical demodulation module is configured to convert the first optical signal to be demodulated into the first electrical signal according to a first control signal provided by the management module; and the management module is configured to control an operating state of the first optical demodulation module according to the first detection signal provided by the first optical demodulation module;

[0027] The second optical demodulation module includes multiple second control signal input terminals and multiple second detection signal output terminals, the second control signal input terminals are electrically connected to the output port of the management module, and the second detection signal output terminals are electrically connected to the input port of the management module; the second optical demodulation module is used to convert the second optical signal to be demodulated into the second electrical signal according to the second control signal provided by the management module; and the management module is used to control the working state of the second optical demodulation module according to the second detection signal provided by the second optical demodulation module.

[0028] Optionally, the management module includes a first management unit and a second management unit;

[0029] The first management unit is electrically connected to the first silicon optical modulation module and the first optical demodulation module, and the first silicon optical modulation module and the first optical demodulation module are both located on a side of the first management unit away from the management module;

[0030] The second management unit is electrically connected to the second silicon photonic modulation module and the second optical demodulation module. The second silicon photonic modulation module and the second optical demodulation module are both located on a side of the second management unit away from the management module.

[0031] The technical solution provided by the present invention realizes the integrated optical signal transmission and reception function by providing a first silicon optical modulation module and a second silicon optical modulation module for optical signal transmission, and a first optical demodulation module and a second optical demodulation module for optical signal reception. The first silicon optical modulation module and the first optical demodulation module, as well as the second silicon optical modulation module and the second silicon optical modulation module, are symmetrically arranged on either side of the management module and are all arranged on a single surface of the silicon-based substrate. This improves space utilization and manufacturing efficiency, reduces the length of the connecting harness, and increases the integration of the integrated optical signal transmission and reception device, facilitating miniaturization and improving ease of use. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic structural diagram of an optical signal transceiver integrated device provided in an embodiment of the present invention;

[0033] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure along the section line AA';

[0034] Figure 3 A partial cross-sectional schematic diagram of an optical signal integrated transceiver device provided by an embodiment of the present invention;

[0035] Figure 4 A schematic structural diagram of another optical signal transceiver integrated device provided by an embodiment of the present invention;

[0036] Figure 5 A schematic structural diagram of another optical signal transceiver integrated device provided in an embodiment of the present invention;

[0037] Figure 6 A schematic structural diagram of another optical signal transceiver integrated device provided in an embodiment of the present invention;

[0038] Figure 7 A schematic structural diagram of an optical signal transceiver integrated device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0039] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0040] Figure 1 A schematic diagram of the structure of an optical signal transceiver integrated device provided by an embodiment of the present invention is shown in FIG. Figure 1 As shown, the optical signal transceiver device includes a silicon substrate 01, a management module 10, a first silicon optical modulation module 21, a second silicon optical modulation module 22, a first optical demodulation module 31, and a second optical demodulation module 32. The management module 10, the first silicon optical modulation module 21, the second silicon optical modulation module 22, the first optical demodulation module 31, and the second optical demodulation module 32 are all located on one side of the silicon substrate 01. The management module 10 includes multiple input ports i and output ports o; along the direction parallel to the plane where the silicon-based substrate 01 is located, the first silicon optical modulation module 21 and the second silicon optical modulation module 22 are symmetrically distributed on both sides of the management module 10; the management module 10 is electrically connected to the first silicon optical modulation module 21 and the second silicon optical modulation module 22 through the input port i and / or the output port o; along the direction parallel to the plane where the silicon-based substrate 01 is located, the first optical demodulation module 31 and the second optical demodulation module 32 are symmetrically distributed on the side of the first silicon optical modulation module 21 and the second silicon optical modulation module 22 away from the management module 10; the management module 10 is electrically connected to the first optical demodulation module 31 and the second optical demodulation module 32 through the input port i and / or the output port o.

[0041] The management module 10 includes a multi-function device (MFD) and the like, and the silicon-based substrate 01 can include SiC, monocrystalline silicon, polycrystalline silicon and the like. The first silicon optical modulation module 21 and the second silicon optical modulation module 22 include a silicon optical modulator and the like. The first optical demodulation module 31 and the second optical demodulation module 32 include a photodetector and the like, which can be set according to actual needs, and are not specifically limited here.

[0042] Specifically, the first silicon optical modulation module 21 and the second silicon optical modulation module 22 can convert electrical signals into optical signals, and the first optical demodulation module 31 and the second optical demodulation module 32 can convert optical signals into electrical signals. The management module 10 can provide the first silicon optical modulation module 21, the second silicon optical modulation module 22, the first optical demodulation module 31 and the second optical demodulation module 32 with electrical signals required for work, and working parameters generated during work of the first silicon optical modulation module 21, the second silicon optical modulation module 22, the first optical demodulation module 31 and the second optical demodulation module 32, so as to monitor the working state of the first silicon optical modulation module 21, the second silicon optical modulation module 22, the first optical demodulation module 31 and the second optical demodulation module 32 in real time, and then adjust the control signals output to each module in real time, so that each module can output electrical signals or optical signals with high quality. By arranging the first silicon optical modulation module 21, the second silicon optical modulation module 22, the first optical demodulation module 31 and the second optical demodulation module 32 on one side of the silicon-based substrate 01, the preparation efficiency is improved. At the same time, the first silicon optical modulation module 21 and the second silicon optical modulation module 22 are symmetrically distributed on both sides of the management module 10, and the first optical demodulation module 31 and the second optical demodulation module 32 are symmetrically distributed on the side of the first silicon optical modulation module 21 and the second silicon optical modulation module 22 away from the management module 10, which can improve the utilization rate of the surface of the silicon-based substrate 01, avoid increasing the overall size of the optical signal transceiver integrated device due to the dispersed design of each module, and facilitate miniaturization.

[0043] The technical scheme of the present application realizes the function of optical signal transceiving by arranging the first silicon optical modulation module and the second silicon optical modulation module to emit optical signals, and arranging the first optical demodulation module and the second optical demodulation module to receive optical signals. The first silicon optical modulation module and the first optical demodulation module, and the second silicon optical modulation module and the second silicon optical modulation module are symmetrically arranged on both sides of the management module and on one side surface of the silicon-based substrate, which improves the space utilization rate and the preparation efficiency, reduces the length of the connection harness, facilitates miniaturization, and improves the use convenience.

[0044] Optionally, Figure 2 For Figure 1 The cross-sectional structure of the cross-sectional line AA' is shown in the cross-sectional structure diagram, Figure 2As shown, the silicon-based substrate 01 includes a plurality of vias; in the thickness direction Z of the silicon-based substrate 01, each via overlaps with the projection of the management module 10 on the plane where the silicon-based substrate 01 is located; and each via is electrically connected to the power terminal of the management module 10.

[0045] The material of the via can be a conductive material such as copper or aluminum, which can be set as required and is not limited here.

[0046] Specifically, by providing a plurality of vias in the silicon-based substrate 01, the management module 10 can receive external electrical signals through the vias, so that the management module 10 can work normally. The side surface of the management module 10 close to the silicon-based substrate 01 can be provided with an electrical connection pad, etc., which includes a power terminal that can transmit a power signal. After the electrical connection pad is fixedly electrically connected to the via, the electrical signal provided by other devices can be received through the via. In this way, by providing the via in the silicon-based substrate 01 to provide the electrical signal to the management module 10, the number of ports provided on the side of the silicon-based substrate 01 can be reduced, the number of electrical connection harnesses provided on the side of the silicon-based substrate 01 can be reduced, and the overall space utilization of the silicon-based substrate 01 can be improved.

[0047] Optionally, Figure 3 A partial cross-sectional view of an optical signal transceiver device provided by an embodiment of the present application is shown in FIG. 2. Figure 3 As shown, the optical signal transceiver device further includes a circuit board 40; the circuit board 40 is located on the side of the silicon-based substrate 01 away from the management module 10, and the circuit board 40 is electrically connected to each via; and the circuit board 40 is used to provide a power signal to the management module 10.

[0048] Specifically, the circuit board 40 can provide a power signal required for the operation of the management module 10. By arranging the circuit board 40 on the side of the silicon-based substrate 01 away from the management module 10 and electrically connecting the circuit board 40 to each via, the electrical connection path between the circuit board 40 and the management module 10 can be shortened to the maximum extent, the line impedance can be reduced, and the signal transmission efficiency can be improved. In addition, by arranging the circuit board 40 on the side of the silicon-based substrate 01 away from the management module 40, the overall integration of the optical signal transceiver device can be improved, and miniaturization can be facilitated.

[0049] Optionally, Figure 4 A structure diagram of another optical signal transceiver device provided by an embodiment of the present application is shown in FIG. 3. Figure 4As shown, the first silicon photonic modulation module 21 includes at least two first optical input ports LI1 and at least four first optical output ports LO1, the first optical input port LI1 is used to receive a first input optical signal, and the first silicon photonic modulation module 21 is used to modulate the first input optical signal and output the first output optical signal to the first optical output port LO1; the second silicon photonic modulation module 22 includes at least two second optical input ports LI2 and at least four second optical output ports LO2, the second optical input port LI2 is used to receive a second input optical signal, and the second silicon photonic modulation module 22 is used to modulate the second input optical signal and output the second output optical signal to the second optical output port LO2.

[0050] The first optical input port LI1 and the second optical input port LI2 can receive optical signals provided by the outside world, for example, they can be electrically connected to a laser to receive laser signals provided by the laser. The optical signal provided by the silicon photonic modulation module can be emitted to the outside world through the first optical output port LO1 and the second optical output port LO2.

[0051] Specifically, the first silicon photonics modulation module 21 can receive a first input optical signal through the first optical input port LI1, modulate the first input optical signal, and output a corresponding first output optical signal to the first optical output port LO1. Optical signal modulation can include phase modulation, intensity modulation, or frequency modulation, and can be configured as needed. Correspondingly, the second silicon photonics modulation module 22 can receive a second input optical signal through the second optical input port LI2, modulate the second input optical signal, and output a corresponding second output optical signal to the second optical output port LO2.

[0052] Optional, reference Figure 4 The optical signal transceiver device also includes a circuit board 40; the first silicon photonic modulation module 21 includes multiple first modulation input terminals T1, and each first modulation input terminal T1 is electrically connected to the circuit board 40; the circuit board 40 is used to provide a first modulation signal to each first modulation input terminal T1, and the first silicon photonic modulation module 21 is used to modulate the first input optical signal according to the first modulation signal and then output a first output optical signal; the second silicon photonic modulation module 22 includes multiple second modulation input terminals T2, and each second modulation input terminal T2 is electrically connected to the circuit board 40; the circuit board 40 is used to provide a second modulation signal to each second modulation input terminal T2, and the second silicon photonic modulation module 22 is used to modulate the second input optical signal according to the second modulation signal and then output a second output optical signal.

[0053] The electrical connection method between the circuit board 40 and the first modulation input terminal T1 or the second modulation input terminal T2 can be configured according to actual needs. In an optional embodiment, the circuit board 40 can be wire-bonded to the first modulation input terminal T1 or the second modulation input terminal T2 using fine metal wires. Other electrical connection methods are also possible and are not specifically limited here. The first modulation signal and the second modulation signal can include voltage signals or current signals, etc.

[0054] Specifically, the circuit board 40 can provide a first modulation signal to the first silicon optical modulation module 21 via the first modulation input terminal T1. The first silicon optical modulation module 21 can amplify and perform photoelectric conversion on the first modulation signal to form an optical modulated wave. After the optical modulated wave is coupled with the first input optical signal through the internal optical waveguide, the first output optical signal is output to the first optical output port LO1. The principle of modulating the optical signal by the second silicon optical modulation module 21 is the same as above and will not be repeated here. In this way, by modulating the modulation signal provided to the silicon optical modulation module by the modulation circuit board 40, different phase adjustments, frequency adjustments, or light intensity adjustments can be made to the optical signal, so that the integrated optical signal transceiver can output multiple optical signals, thereby improving the practicality of the integrated optical signal transceiver.

[0055] Optional, Figure 5 A structural diagram of another optical signal transceiver integrated device provided in an embodiment of the present invention is shown in FIG. Figure 5 As shown, the first silicon photonic modulation module 21 includes multiple first feedback terminals F1 and multiple first adjustment control terminals C1, the first feedback terminal F1 is electrically connected to the input port i of the management module 10, and the first adjustment control terminal C1 is electrically connected to the output port o of the management module 10 (not shown in the figure); the management module 10 is used to provide a first adjustment control signal to the first silicon photonic modulation module 21 according to the first feedback signal provided by the first silicon photonic modulation module 21; the second silicon photonic modulation module 22 includes multiple second feedback terminals F2 and multiple second adjustment control terminals C2, the second feedback terminal F2 is electrically connected to the input port i of the management module 10 (not shown in the figure), and the second adjustment control terminal C2 is electrically connected to the output port o of the management module 10; the management module 10 is used to provide a second adjustment control signal to the second silicon photonic modulation module 22 according to the second feedback signal provided by the second silicon photonic modulation module 22.

[0056] The feedback signal includes at least one of the phase of the currently output optical signal, the frequency of the optical signal, the intensity of the optical signal, etc. The first adjustment control signal and the second adjustment control signal include a control voltage or a control current, etc.

[0057] Specifically, the management module 10 can obtain the first output optical signal currently output by the first silicon photonic modulation module 21 through the first feedback terminal F1. The management module 10 can compare the corresponding frequency and other parameters of the current first output optical signal with the set frequency and other parameters, and adjust the first adjustment control signal output to the first silicon photonic modulation module 21 based on the comparison result, so that the first silicon photonic modulation module 21 can output the first output optical signal that is consistent with or has a small difference from the set frequency and other parameters under the action of the first adjustment control signal, thereby improving the accuracy of the first output optical signal.

[0058] Correspondingly, the management module 10 can obtain the second output optical signal currently output by the second silicon photonic modulation module 22 through the second feedback terminal F2. The management module 10 can compare the corresponding frequency and other parameters of the current second output optical signal with the set frequency and other parameters, and adjust the second adjustment control signal output to the second silicon photonic modulation module 22 according to the comparison result, so that the second silicon photonic modulation module 22 can output the second output optical signal that is consistent with or has a smaller difference from the set frequency and other parameters under the action of the second adjustment control signal, thereby improving the accuracy of the second output optical signal.

[0059] Optional, reference Figure 5 The first silicon photonic modulation module 21 includes a first heating structure 51, a driving end of which is electrically connected to the output port o of the management module 10 (not shown in the figure); the management module 10 is configured to provide a first heating driving signal to the first heating structure 51; the first heating structure 51 is configured to heat the first optical input path 23 in the first silicon photonic modulation module 21. The second silicon photonic modulation module 22 includes a second heating structure 52, a driving end of which is electrically connected to the output port o of the management module 10 (not shown in the figure); the management module 10 is configured to provide a second heating driving signal to the second heating structure 52; the second heating structure 52 is configured to heat the second optical input path 24 in the second silicon photonic modulation module 22.

[0060] The first heating structure 51 and the second heating structure 52 are symmetrically distributed on either side of the management module 10, parallel to the plane of the silicon substrate 01. The first optical input path 23 and the second optical input path 24 include components such as optical waveguides, and the first heating structure 51 and the second heating structure 52 include components such as micro resistors. These components can be configured as needed and are not specifically limited herein.

[0061] Specifically, the management module 10 provides the first heating structure 51 with a first heating drive signal, including a voltage signal or a current signal. Under the action of the first heating drive signal, the first heating structure 51 generates Joule heat, which in turn changes the local refractive index of the first optical input path 23 (optical waveguide), thereby adjusting the phase of the first input optical signal in the first optical input path 23. This minimizes or even makes the phase differences of the first input optical signal in each path uniform, thereby improving the accuracy of the first input optical signal. It should be noted that the operation of the second heating structure 52 is similar to that of the first heating structure 51. The operating principles of the first heating structure 51 can be referred to above and will not be further elaborated here.

[0062] Optional, Figure 6 A structural diagram of another optical signal transceiver integrated device provided in an embodiment of the present invention is shown in FIG. Figure 6 As shown, the first optical demodulation module 31 includes a plurality of first optical signal receiving terminals LR1 and a plurality of first electrical signal output terminals E1. The first optical demodulation module 31 is configured to convert a first optical signal to be demodulated, received by the first optical signal receiving terminals LR1, into a first electrical signal and provide the signal to the first electrical signal output terminal E1. The second optical demodulation module 32 includes a plurality of second optical signal receiving terminals and a plurality of second electrical signal output terminals E2. The second optical demodulation module 32 is configured to convert a second optical signal to be demodulated, received by the second optical signal receiving terminals, into a second electrical signal and provide the signal to the second electrical signal output terminal E2.

[0063] Among them, the number of the first optical signal receiving terminal LR1 and the second optical signal receiving terminal LR2 can be set according to actual needs. The figure only shows that the number of the first optical signal receiving terminal LR1 and the second optical signal receiving terminal LR2 is 4 respectively. In other optional embodiments, 8 first optical signal receiving terminals LR1 and 8 second optical signal receiving terminals LR2 can be set, which is not specifically limited here.

[0064] Specifically, the first optical signal receiving terminal LR1 and the second optical signal receiving terminal LR2 are used to receive the first optical signal to be demodulated. The first optical demodulation module 31 includes devices such as a photodetector and a transimpedance amplifier. The photodetector can convert the first optical signal to be demodulated into a current signal, and the transimpedance amplifier converts the current signal into a voltage signal. This voltage signal can serve as the first electrical signal corresponding to the first optical signal to be demodulated, thereby achieving conversion from an optical signal to an electrical signal. Accordingly, the operating principle of the second optical demodulation module 32 can refer to the operating principle of the first optical demodulation module 31 and will not be repeated here.

[0065] Optional, reference Figure 6The first optical demodulation module 31 includes multiple first control signal input terminals Cr1 and multiple first detection signal output terminals O1. The first control signal input terminal Cr1 is electrically connected to the output port o of the management module 10 (not shown in the figure), and the first detection signal output terminal O1 is electrically connected to the input port i of the management module 10 (not shown in the figure). The first optical demodulation module 31 is used to convert the first optical signal to be demodulated into a first electrical signal according to the first control signal provided by the management module 10. The management module 10 is used to control the working state of the first optical demodulation module 31 according to the first detection signal provided by the first optical demodulation module 31. The second optical demodulation module 32 includes multiple second control signal input terminals Cr2 and multiple second detection signal output terminals O2. The second control signal input terminals Cr2 are electrically connected to the output port o of the management module 10 (not shown in the figure), and the second detection signal output terminals O2 are electrically connected to the input port i of the management module 10 (not shown in the figure). The second optical demodulation module 32 is used to convert the second optical signal to be demodulated into a second electrical signal based on the second control signal provided by the management module 10. The management module 10 is used to control the operating state of the second optical demodulation module 32 based on the second detection signal provided by the second optical demodulation module 32.

[0066] Specifically, the first control signal provided by the management module 10 includes an enable signal and a disable signal. When the first control signal is an enable signal, the first optical demodulation module 31 can convert the first optical signal to be demodulated into a first electrical signal; when the first control signal is a disable signal, the first optical demodulation module 31 stops working. The first detection signal includes the current operating current, operating voltage, or operating temperature of the first optical demodulation module 31. If the management module 10 receives the first detection signal provided by the first optical demodulation module 31 and it exceeds the safety range, the first optical demodulation module 31 is controlled to stop working to avoid the first optical demodulation module 31 from continuously operating and damaging internal components, thereby improving the working safety and reliability of the first optical demodulation module 31. Accordingly, the working status of the second optical demodulation module 32 can refer to the relevant description of the first optical demodulation module 31 and will not be repeated here.

[0067] Optional, Figure 7 A schematic diagram of the structure of an optical signal transceiver integrated device provided by an embodiment of the present invention is shown in FIG. Figure 7 As shown, the management module 10 includes a first management unit 11 and a second management unit 12; the first management unit 11 is electrically connected to the first silicon photonic modulation module 21 and the first optical demodulation module 31, and the first silicon photonic modulation module 21 and the first optical demodulation module 31 are both located on the side of the first management unit 11 away from the management module 10; the second management unit 12 is electrically connected to the second silicon photonic modulation module 22 and the second optical demodulation module 32, and the second silicon photonic modulation module 22 and the second optical demodulation module 32 are both located on the side of the second management unit 12 away from the management module 10.

[0068] Specifically, by setting the first management unit 11 in the management module 10 to be electrically connected to the first silicon photonic modulation module 21 and the first optical demodulation module 31, and the second management unit 12 to be electrically connected to the second silicon photonic modulation module 22 and the second optical demodulation module 32, the operating status of the first silicon photonic modulation module 21 and the first optical demodulation module 31 can be managed and monitored by the first management unit 11, and the operating status of the second silicon photonic modulation module 22 and the second optical demodulation module 32 can be managed and monitored by the second management unit 12, thereby improving the accuracy and reliability of the management unit's control over the modulation module or demodulation module. At the same time, the first silicon photonic modulation module 21 and the first optical demodulation module 31 are arranged on the side of the first management unit 11 away from the management module 10. This can shorten the electrical connection path between the first silicon photonic modulation module 21 and the first management unit 11, as well as the electrical connection path between the first optical demodulation module 31 and the first management unit 11, thereby reducing the line transmission impedance. The second silicon photonics modulation module 22 and the second optical demodulation module 32 are arranged on the side of the second management unit 12 away from the management module 10. This can shorten the electrical connection path between the second silicon photonics modulation module 22 and the second management unit 12, as well as the electrical connection path between the second optical demodulation module 32 and the second management unit 12, thereby reducing line transmission impedance. In addition, when only the first management unit 11, the first silicon photonics modulation module 21, and the first optical demodulation module 31 are required, or when only the second management unit 12, the second silicon photonics modulation module 22, and the second optical demodulation module 32 are required, a cut can be made between the first management unit 11 and the second management unit 12, separating the modules on the first management unit 11 side and the modules on the second management unit 12 side, thereby improving usage flexibility.

[0069] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, combinations, and substitutions are possible for those skilled in the art without departing from the scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the scope of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. An integrated optical signal transceiver, characterized in that: include: Silicon-based substrate, management module, first silicon optical modulation module, second silicon optical modulation module, first optical demodulation module and second optical demodulation module; The management module, the first silicon optical modulation module, the second silicon optical modulation module, the first optical demodulation module and the second optical demodulation module are all located on one side of the silicon-based substrate; The management module includes a plurality of input ports and output ports; Along a direction parallel to the plane of the silicon-based substrate, the first silicon optical modulation module and the second silicon optical modulation module are symmetrically distributed on both sides of the management module; the management module is electrically connected to the first silicon optical modulation module and the second silicon optical modulation module through the input port and / or the output port; Along a direction parallel to the plane of the silicon-based substrate, the first optical demodulation module and the second optical demodulation module are symmetrically distributed on the side of the first silicon optical modulation module and the second silicon optical modulation module away from the management module; the management module is electrically connected to the first optical demodulation module and the second optical demodulation module through the input port and / or the output port.

2. The optical signal transceiver according to claim 1, wherein: The silicon-based substrate includes a plurality of vias; In the thickness direction of the silicon-based substrate, each of the conductive holes overlaps with a projection of the management module on the plane where the silicon-based substrate is located; and each of the conductive holes is electrically connected to a power supply terminal of the management module.

3. The optical signal transceiver according to claim 2, wherein: Also includes: circuit boards; The circuit board is located on a side of the silicon-based substrate away from the management module. The circuit board is electrically connected to each of the through holes. The circuit board is used to provide a power signal to the management module.

4. The optical signal transceiver according to claim 1, wherein: The first silicon optical modulation module includes at least two first optical input ports and at least four first optical output ports, the first optical input ports are used to receive first input optical signals, and the first silicon optical modulation module is used to modulate the first input optical signals and then output first output optical signals to the first optical output ports; The second silicon photonic modulation module includes at least two second optical input ports and at least four second optical output ports. The second optical input port is used to receive a second input optical signal. The second silicon photonic modulation module is used to modulate the second input optical signal and then output a second output optical signal to the second optical output port.

5. The optical signal transceiver according to claim 4, characterized in that: Also includes: circuit boards; The first silicon photonic modulation module includes a plurality of first modulation input terminals, each of which is electrically connected to the circuit board; The circuit board is used to provide a first modulation signal to each of the first modulation input terminals, and the first silicon photonic modulation module is used to modulate the first input optical signal according to the first modulation signal and then output the first output optical signal; The second silicon photonic modulation module includes multiple second modulation input terminals, each of which is electrically connected to the circuit board; the circuit board is used to provide a second modulation signal to each of the second modulation input terminals, and the second silicon photonic modulation module is used to modulate the second input optical signal according to the second modulation signal and then output the second output optical signal.

6. The optical signal transceiver according to claim 5, characterized in that: The first silicon photonic modulation module includes a plurality of first feedback terminals and a plurality of first adjustment control terminals, the first feedback terminals being electrically connected to the input port of the management module, and the first adjustment control terminals being electrically connected to the output port of the management module; the management module being configured to provide a first adjustment control signal to the first silicon photonic modulation module based on a first feedback signal provided by the first silicon photonic modulation module; The second silicon photonic modulation module includes multiple second feedback ends and multiple second adjustment control ends, the second feedback end is electrically connected to the input port of the management module, and the second adjustment control end is electrically connected to the output port of the management module; the management module is used to provide a second adjustment control signal to the second silicon photonic modulation module based on the second feedback signal provided by the second silicon photonic modulation module.

7. The optical signal transceiver according to claim 1, wherein: The first silicon photonic modulation module includes a first heating structure, wherein a driving end of the first heating structure is electrically connected to the output port of the management module; the management module is configured to provide a first heating driving signal to the first heating structure; and the first heating structure is configured to heat a first optical input path in the first silicon photonic modulation module. The second silicon photonic modulation module includes a second heating structure, wherein a driving end of the second heating structure is electrically connected to the output port of the management module; the management module is configured to provide a second heating driving signal to the second heating structure; and the second heating structure is configured to heat a second optical input path in the second silicon photonic modulation module. Wherein, along a direction parallel to the plane where the silicon-based substrate is located, the first heating structure and the second heating structure are symmetrically distributed on both sides of the management module.

8. The optical signal transceiver according to claim 1, wherein: The first optical demodulation module includes a plurality of first optical signal receiving ends and a plurality of first electrical signal output ends; the first optical demodulation module is used to convert the first optical signal to be demodulated received by the first optical signal receiving end into a first electrical signal and provide the signal to the first electrical signal output end; The second optical demodulation module includes multiple second optical signal receiving ends and multiple second electrical signal output ends; the second optical demodulation module is used to convert the second optical signal to be demodulated received by the second optical signal receiving end into a second electrical signal and provide it to the second electrical signal output end.

9. The optical signal transceiver according to claim 8, characterized in that: The first optical demodulation module includes a plurality of first control signal input terminals and a plurality of first detection signal output terminals, wherein the first control signal input terminals are electrically connected to the output port of the management module, and the first detection signal output terminals are electrically connected to the input port of the management module; the first optical demodulation module is configured to convert the first optical signal to be demodulated into the first electrical signal according to a first control signal provided by the management module; and the management module is configured to control an operating state of the first optical demodulation module according to the first detection signal provided by the first optical demodulation module; The second optical demodulation module includes multiple second control signal input terminals and multiple second detection signal output terminals, the second control signal input terminals are electrically connected to the output port of the management module, and the second detection signal output terminals are electrically connected to the input port of the management module; the second optical demodulation module is used to convert the second optical signal to be demodulated into the second electrical signal according to the second control signal provided by the management module; and the management module is used to control the working state of the second optical demodulation module according to the second detection signal provided by the second optical demodulation module.

10. The optical signal transceiver according to claim 1, wherein: The management module includes a first management unit and a second management unit; The first management unit is electrically connected to the first silicon optical modulation module and the first optical demodulation module, and the first silicon optical modulation module and the first optical demodulation module are both located on a side of the first management unit away from the management module; The second management unit is electrically connected to the second silicon photonic modulation module and the second optical demodulation module. The second silicon photonic modulation module and the second optical demodulation module are both located on a side of the second management unit away from the management module.

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