Height difference control method and device for junction area of rigid-flex board

By obtaining and adjusting the initial size and scene parameters of the rigid-flex PCB and controlling the height difference of the junction area, the circuit attachment problem of the rigid-flex PCB in the multi-layer design is solved, achieving efficient production and cost control.

CN120769438AActive Publication Date: 2025-10-10BRAIN POWER (QING YUAN) CO LTD
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Patent Information

Application Number
CN202511282608.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-09
Publication Date
2025-10-10
Estimated Expiration
2045-09-09

AI Technical Summary

Technical Problem

In the multi-layer, high-density design of existing rigid-flex boards, the height difference problem in the rigid-flex interface area leads to poor circuit attachment, resulting in poor exposure, open circuits, short circuits and other problems, affecting product yield.

Method used

By obtaining the initial dimensions of the soft board area and the hard board area, calculating the initial staggered dimensions, and adjusting the staggered dimensions according to the application scenario parameters, cutting and staggered lamination operations are performed to control the height difference of the junction area.

Benefits of technology

It reduces the height difference of the junction area, ensures the electrical performance of the product, reduces material usage costs, improves production efficiency, reduces product scrap, and adapts to the size requirements of different application scenarios.

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Patent Text Reader

Abstract

The embodiment of the invention provides a method and a device for controlling the height difference of a joint area of a rigid-flex board. The method comprises the following steps: acquiring a first initial size of a flexible board area CVL layer; obtaining a second initial size of the hard board area; calculating an initial interleaving size according to the first initial size and the second initial size; acquiring application scene parameters corresponding to the rigid-flex board; adjusting the initial interleaving size according to the application scene parameters to obtain a feature interleaving size; controlling equipment to perform cutting operation on the soft board area CVL layer or the hard board area according to the characteristic staggering size; the CVL layer of the soft board area or the hard board area after the cutting operation is completed is laminated in a staggered mode, and then preset operation is carried out to obtain a soft and hard combined board; according to the CVL staggered design, the height difference is reduced, the use cost of materials is reduced by reducing the use of the CVL, the waste of scrapped materials of products is reduced, different staggered lengths are set according to different product application scenes, and the production efficiency is improved.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computer, in particular to a soft and hard combination board interface area height difference control method, a soft and hard combination board interface area height difference control device, a computer equipment and a storage medium. BACKGROUND

[0002] With the development of soft and hard combination board technology to multi-layer and high density, the number of layers is superimposed with the height difference of the soft and hard interface area gradually increasing, the product line yield is low and the scrap is serious by using the existing manufacturing method; how to reduce the height difference of the soft and hard interface area has become one of the important research topics for the breakthrough of soft and hard combination board. At present, the CVL of the soft plate area needs to be extended to the hard plate area in the design of the multi-layer soft and hard combination board, and the soft plate covering film and the hard plate interface area are uneven after pressing, forming a height difference, as shown in Figure 1 , which leads to the phenomenon of exposure failure, open circuit and short circuit of the line caused by the influence of the height difference on the line dry film in the later process. SUMMARY

[0003] In view of the above problems, the present embodiment is proposed to provide a soft and hard combination board interface area height difference control method, a soft and hard combination board interface area height difference control device, a computer equipment and a storage medium which overcome the above problems or at least partially solve the above problems.

[0004] In order to solve the above problems, the present embodiment discloses a soft and hard combination board interface area height difference control method, the soft and hard combination board comprising a hard plate area and a soft plate area, the soft plate area CVL being staggered with the hard plate area, comprising: obtaining a first initial size of the soft plate area CVL layer; obtaining a second initial size of the hard plate area; calculating an initial staggered size according to the first initial size and the second initial size; obtaining application scenario parameters corresponding to the soft and hard combination board; adjusting the initial staggered size according to the application scenario parameters to obtain a characteristic staggered size; controlling the equipment according to the characteristic staggered size to perform cutting operation on the soft plate area CVL layer or the hard plate area; staggering the soft plate area CVL layer or the hard plate area after the cutting operation is completed, and then performing a preset operation to obtain a soft and hard combination board.

[0005] Preferably, the first initial size comprises a first longitudinal size and a first transverse size; and the obtaining of the first initial size of the soft plate area CVL layer comprises: obtaining a soft plate area CVL layer image; The first longitudinal size and the first transverse size of the CVL layer image in the flexible board area are acquired by image recognition.

[0006] Preferably, the second initial size includes a second longitudinal size and a second transverse size; and obtaining the second initial size of the hard board area includes: The image of the hard plate area is obtained; The second longitudinal dimension and the second transverse dimension of the hard plate area image are acquired by image recognition.

[0007] Preferably, the application scenario parameters include high temperature scenario parameters, cold scenario parameters, high humidity scenario parameters, and drought scenario parameters; and obtaining the application scenario parameters corresponding to the rigid-flex board includes: The high temperature scene parameters, cold scene parameters, high humidity scene parameters, and drought scene parameters corresponding to the rigid-flex board are obtained.

[0008] Preferably, adjusting the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size includes: Identifying the category code in the application scenario parameter; Find the corresponding interleaved variation size according to the type code; The staggered variation size is adjusted to the same type of size as the initial staggered size to obtain a characteristic staggered size.

[0009] Preferably, the method further comprises: Get the type code in the application scenario parameters; The staggered variation size of the CVL layer in the soft board area is calculated; A mapping relationship between the type code and the interleaving variation size is established.

[0010] Preferably, calculating the initial interleaving size according to the first initial size and the second initial size includes: extracting a first longitudinal dimension of the first initial dimension; extracting a second longitudinal dimension of the second initial dimension; An initial interleaving size is calculated according to the first longitudinal size and the second longitudinal size.

[0011] This embodiment discloses a device for controlling the height difference of the junction area of ​​a rigid-flex board. The rigid-flex board includes a rigid board area and a flexible board area. The flexible board area CVL is alternately bonded with the rigid board area, including: A first acquisition module is used to acquire a first initial size of the CVL layer in the soft board area; A second acquisition module is used to acquire a second initial size of the hard plate area; a calculation module, configured to calculate an initial interleaving size according to the first initial size and the second initial size; A scenario parameter acquisition module, used to obtain application scenario parameters corresponding to the rigid-flex board; a characteristic interleaving size acquisition module, configured to adjust the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size; A cutting operation module, configured to control the device to perform a cutting operation on the CVL layer of the soft board area or the hard board area according to the characteristic staggered size; The laminating module is used to alternately laminate the CVL layer of the soft board area or the hard board area after the cutting operation, and then perform a preset operation to obtain a soft-rigid combination board.

[0012] This embodiment further discloses a computer device including a memory and a processor. The memory stores a computer program. When the processor executes the computer program, the computer device implements the above-mentioned step of controlling the height difference of the interface area of ​​the rigid-flex board.

[0013] This embodiment further discloses a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the steps of controlling the height difference of the interface area of ​​the rigid-flex board are implemented.

[0014] This embodiment has the following advantages: In an embodiment of the present invention, the rigid-flex board includes a rigid board area and a flexible board area, the CVL of the flexible board area is staggered with the rigid board area, and the height difference control method of the junction area of ​​the rigid-flex board includes: obtaining a first initial size of the CVL layer of the flexible board area; obtaining a second initial size of the rigid board area; calculating an initial staggered size based on the first initial size and the second initial size; obtaining an application scenario parameter corresponding to the rigid-flex board; adjusting the initial staggered size according to the application scenario parameter to obtain a characteristic staggered size; and controlling the height difference of the junction area of ​​the rigid-flex board according to the characteristic staggered size. The equipment performs a cutting operation on the CVL layer of the soft board area or the hard board area; the CVL layer of the soft board area or the hard board area after the cutting operation is completed is staggered and bonded, and then a preset operation is performed to obtain a soft-hard combination board; the CVL staggered design reduces the height difference and ensures the electrical performance of the product; and reducing the use of CVL reduces the material usage cost, reduces the height difference of the soft and hard junction area, and reduces the waste of scrapped materials of the product. Different staggered lengths are set according to different product application scenarios to make the size more suitable, which not only controls the cost, reduces the cost, saves materials, but also improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solution in this embodiment, the following is a brief introduction to the drawings required for the description of the embodiment. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0016] Figure 1 This is a schematic diagram of the height difference at the junction of a rigid-flex board in the prior art; Figure 2 This is a flowchart of the steps of an embodiment of a method for controlling the height difference of the junction area of ​​a rigid-flex board according to this embodiment; Figure 3 This is a schematic diagram of a rigid-flex board with a staggered arrangement of rigid board areas and flexible board areas according to this embodiment; Figure 4 This is a structural block diagram of an embodiment of a device for controlling the height difference of a junction area of ​​a rigid-flex board according to this embodiment; Figure 5 The diagram is an internal structural diagram of a computer device according to an embodiment. DETAILED DESCRIPTION

[0017] In order to make the technical problems, technical solutions and beneficial effects solved by this embodiment more clearly understood, this embodiment is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0018] The method for controlling the height difference at the interface of a rigid-flex board provided in this embodiment can be applied to an application environment including a terminal and a server. The terminal communicates with the server via a network. The terminal can be, but is not limited to, various personal computers, laptops, and tablet computers. The server can be implemented as a standalone server or a server cluster consisting of multiple servers.

[0019] Reference Figure 2 , shows a flowchart of a method for controlling the height difference of the interface area of ​​a rigid-flex board according to this embodiment. The rigid-flex board includes a rigid board area and a flexible board area. The flexible board area CVL is alternately bonded with the rigid board area. Specifically, the method may include the following steps: Step 101, obtaining a first initial size of the CVL layer in the soft board area; In the embodiment of the present invention, Figure 3As shown, the inner layer 2 is arranged between the first outer layer 1 and the second outer layer 3, and a hard board area 5 and a soft board area 4 are arranged between the inner layer 2 and the first outer layer 1, and the CVL layer on one side of the soft board area 4 is connected to the hard board area 5, and the CVL layer on the other side of the soft board area 4 is staggered and overlapped with the hard board area 5; a hard board area 5 and a soft board area 4 are also arranged between the inner layer 2 and the second outer layer 3, and the CVL layer on one side of the soft board area 4 is staggered and overlapped with the hard board area 5, and the CVL layer on the other side of the soft board area 4 is connected to the hard board area 5, and 6 represents the characteristic staggered dimension in the longitudinal length direction; the CVL staggered design reduces the height difference and ensures the electrical performance of the product; and reducing the use of CVL reduces the material usage cost, reduces the height difference in the hard and soft junction area, improves production quality, reduces the waste of scrapped materials, thereby ensuring smooth product production; and improves production efficiency; wherein, the first outer layer 1 and the second outer layer 3 may include outer layers made of copper material, and the inner layer 2 may refer to a soft board made of a variety of plastic materials, and the embodiments of the present invention do not impose too many restrictions on this.

[0020] In a core concept of an embodiment of the present invention, the length of the staggered overlapping CVL layers can be adjusted according to different application scenarios of the flexible and rigid combination board, which can shorten the length of the CVL layer, further save materials, and reduce material costs.

[0021] Specifically applied to the embodiment of the present invention, the terminal can first obtain the first initial size of the CVL layer in the soft board area; the first initial size includes a first longitudinal size and a first lateral size; obtaining the first initial size of the CVL layer in the soft board area includes: obtaining an image of the CVL layer in the soft board area; obtaining the first longitudinal size and the first lateral size of the CVL layer image in the soft board area by image recognition.

[0022] In the embodiment of the present invention, the first longitudinal dimension refers to the longitudinal length dimension of the CVL layer in the flexible circuit area; the first transverse dimension refers to the transverse length dimension of the CVL layer in the flexible circuit area; for example, the first longitudinal dimension may be 2.3 mm; and the first transverse dimension may be 0.5 mm.

[0023] Step 102, obtaining a second initial size of the hard board area; Further applied to the embodiment of the present application, the second initial size of the hard plate area can also be obtained; the second initial size includes a second longitudinal size and a second transverse size; the obtaining of the second initial size of the hard plate area includes: obtaining a hard plate area image; obtaining the second longitudinal size and the second transverse size of the hard plate area image through image recognition; in the embodiment of the present application, the longitudinal and transverse sizes of the hard plate area image can be recognized through image recognition; on the other hand, the longitudinal and transverse sizes of the hard plate area image can also be recognized from the preset design parameters, that is, the second longitudinal size and the second transverse size of the hard plate area can be obtained.

[0024] It should be noted that the second longitudinal size refers to the size of the longitudinal length direction of the hard plate area; the second transverse size refers to the size of the transverse length direction of the hard plate area; for example, the first longitudinal size can be 4.5 mm; and the first transverse size can be 0.7 mm.

[0025] Step 103: calculating an initial staggered size according to the first initial size and the second initial size; Further, the initial staggered size can be calculated according to the first initial size and the second initial size.

[0026] In the embodiment of the present application, the calculation of the initial staggered size according to the first initial size and the second initial size includes: extracting a first longitudinal size of the first initial size; extracting a second longitudinal size of the second initial size; and calculating an initial staggered size according to the first longitudinal size and the second longitudinal size.

[0027] The first longitudinal size and the second longitudinal size are added to obtain a longitudinal length sum, and the longitudinal length sum is subtracted from the overall longitudinal design length to obtain a difference, which is the initial staggered size, that is, the longitudinal length of the staggered part of the soft plate area CVL layer and the hard plate area.

[0028] Specifically, the overall longitudinal design length refers to the sum of the longitudinal design lengths of the soft plate area CVL layer and the hard plate area which are designed in advance; and the initial staggered size refers to the longitudinal length of the staggered part of the soft plate area CVL layer and the hard plate area compared with the overall longitudinal design length.

[0029] Step 104: obtaining an application scene parameter corresponding to the soft and hard combination plate; In the embodiment of the present application, the initial staggered size can also be adjusted according to the application scene parameter; first, the terminal can obtain an application scene parameter corresponding to the soft and hard combination plate; specifically, the application scene parameter includes a high-temperature scene parameter, a cold scene parameter, a high-humidity scene parameter, and a dry scene parameter; and can also include other types of application scene parameters, such as a long-sunlight scene parameter, which is not limited in the embodiment of the present application. In an embodiment of the present invention, obtaining application scenario parameters corresponding to the rigid-flexible board includes obtaining high temperature scenario parameters, cold scenario parameters, high humidity scenario parameters, drought scenario parameters, and long daylight scenario parameters corresponding to the rigid-flexible board.

[0030] Step 105, adjusting the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size; In the embodiment of the present invention, a mapping relationship between the type code in the application scenario parameters and the interleaving variation size can be established first. Specifically applied to the embodiment of the present invention, the type code in the application scenario parameters can be obtained first; the interleaving variation size of the CVL layer in the flexible board area can be calculated; and a mapping relationship between the type code and the interleaving variation size can be established; The interleaving variation size refers to the increase or decrease in the longitudinal length of the interleaving portion of the CVL layer in the flexible board area and the rigid board area. The type code can be associated with the interleaving variation size, that is, each application scenario corresponds to a interleaving variation size.

[0031] For example, the mapping relationship between the type code and the interleaving change size in the application scenario parameters of the embodiment of the present invention can be described as follows: the type code of the high temperature scene parameter is H23, and the corresponding interleaving change size is increased by X1mm; the type code corresponding to the cold scene parameter is C23, and the corresponding interleaving change size is increased by X2mm; the high humidity scene parameter is H41, and the corresponding interleaving change size is reduced by X3mm; the drought scene parameter is D68, and the corresponding interleaving change size is X4mm; the long daylight scene parameter is S09, and the corresponding interleaving change size is increased by X5mm; Specifically, the staggered variable size can be a dimensional parameter related to the cost coefficient, performance coefficient (such as the coefficient related to the tensile strength, fatigue resistance, aging resistance, and heat resistance of the plastic) and the longitudinal interface length. Those skilled in the art can set or calculate any staggered variable dimensional parameter based on actual conditions, and the embodiments of the present invention do not impose excessive restrictions on this.

[0032] In an application process of an embodiment of the present invention, the initial interleaving size is adjusted according to the application scenario parameters to obtain a characteristic interleaving size, including: identifying the type code in the application scenario parameters; finding the corresponding interleaving variable size according to the type code; and adjusting the interleaving variable size with the same type size of the initial interleaving size to obtain a characteristic interleaving size.

[0033] In the actual application of the embodiment of the present invention, the interleaving variation size corresponding to the type code in the application scenario parameter can be found according to the above-mentioned mapping relationship, and the initial interleaving size is adjusted according to the interleaving variation size to obtain the characteristic interleaving size. For example, when a certain rigid-flex board is used in a high-temperature steam room, its application scenario is determined to be a high-temperature scene, and the application scenario parameter is a high-temperature scene parameter. By querying the mapping relationship, it can be known that the high-temperature scene parameter type code is: H23, and the corresponding interleaving variation size is an increase of X1mm; then the longitudinal length is increased by X1mm on the basis of the initial interleaving size to obtain the characteristic interleaving size.

[0034] Step 106 , performing a cutting operation on the CVL layer of the soft board area or the hard board area according to the characteristic staggered size control device; According to this characteristic, the staggered size control device performs cutting operations on the CVL layer of the soft board area or the hard board area, and sets different staggered lengths according to different product application scenarios to make the size more appropriate, thereby controlling costs, reducing costs, saving materials, and improving production efficiency.

[0035] Step 107 , alternately laminating the CVL layers of the flexible board area or the rigid board area after the cutting operation, and then performing a preset operation to obtain a flexible and rigid board.

[0036] Furthermore, the CVL layer of the soft board area or the hard board area after the cutting operation can be staggered and bonded, and then the preset operation can be performed to obtain a soft-hard combination board; specifically, the preset operation can include: combination operation, stacking operation, pressing operation, shooting operation, edge beading operation, drilling operation, electroplating operation, outer layer image etching operation, solder mask operation, gold plating operation, thermosetting text operation, molding operation, cover opening operation, soft board UV molding operation, electrical measurement operation, etc., and the embodiment of the present invention does not impose too many restrictions on this; before the staggered bonding, it can also include FCCL cutting operation, baking operation, inner layer drilling operation, inner layer image etching operation, browning operation, etc., and the embodiment of the present invention also does not impose too many restrictions on this.

[0037] In an embodiment of the present invention, the rigid-flex board includes a rigid board area and a flexible board area, the CVL of the flexible board area is staggered with the rigid board area, and the height difference control method of the junction area of ​​the rigid-flex board includes: obtaining a first initial size of the CVL layer of the flexible board area; obtaining a second initial size of the rigid board area; calculating an initial staggered size based on the first initial size and the second initial size; obtaining an application scenario parameter corresponding to the rigid-flex board; adjusting the initial staggered size according to the application scenario parameter to obtain a characteristic staggered size; and controlling the height difference of the junction area of ​​the rigid-flex board according to the characteristic staggered size. The equipment performs a cutting operation on the CVL layer of the soft board area or the hard board area; the CVL layer of the soft board area or the hard board area after the cutting operation is completed is staggered and bonded, and then a preset operation is performed to obtain a soft-hard combination board; the CVL staggered design reduces the height difference and ensures the electrical performance of the product; and reducing the use of CVL reduces the material usage cost, reduces the height difference of the soft and hard junction area, and reduces the waste of scrapped materials of the product. Different staggered lengths are set according to different product application scenarios to make the size more suitable, which not only controls the cost, reduces the cost, saves materials, but also improves production efficiency.

[0038] It should be noted that for the sake of simplicity, the method embodiments are described as a series of actions. However, those skilled in the art should be aware that the embodiments are not limited by the order of the actions described, as certain steps can be performed in other orders or simultaneously according to the embodiments. Secondly, those skilled in the art should also be aware that the embodiments described in this specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments.

[0039] Reference Figure 4 , shows a structural block diagram of an embodiment of a device for controlling the height difference of the interface area of ​​a rigid-flex board according to this embodiment. The rigid-flex board includes a rigid board area and a flexible board area. The flexible board area CVL is alternately bonded with the rigid board area. Specifically, the device may include the following modules: A first acquisition module 301 is used to acquire a first initial size of the CVL layer in the soft board area; A second acquisition module 302 is used to acquire a second initial size of the hard plate area; A calculation module 303 is configured to calculate an initial interleaving size based on the first initial size and the second initial size; A scenario parameter acquisition module 304 is used to acquire application scenario parameters corresponding to the rigid-flex board; A characteristic interleaving size acquisition module 305 is configured to adjust the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size; A cutting operation module 306 is configured to perform a cutting operation on the CVL layer of the soft board area or the hard board area according to the characteristic staggered size control device; The bonding module 307 is used to alternately bond the CVL layers of the flexible board area or the rigid board area after the cutting operation, and then perform a preset operation to obtain a flexible and rigid board.

[0040] Preferably, the first initial size includes a first longitudinal size and a first transverse size; and the first acquisition module includes: The first acquisition submodule is used to acquire the CVL layer image of the soft board area; The first recognition submodule is configured to obtain a first longitudinal dimension and a first transverse dimension of the CVL layer image in the flexible circuit area by image recognition.

[0041] Preferably, the second initial size includes a second longitudinal size and a second transverse size; and the second acquisition module includes: The second acquisition submodule is used to acquire the hard plate area image; The second recognition submodule is configured to obtain a second longitudinal dimension and a second transverse dimension of the hard board area image by image recognition.

[0042] Preferably, the application scenario parameters include high temperature scenario parameters, cold scenario parameters, high humidity scenario parameters, and drought scenario parameters; and the scenario parameter acquisition module includes: The scene parameter acquisition submodule is used to obtain high temperature scene parameters, cold scene parameters, high humidity scene parameters and drought scene parameters corresponding to the flexible and rigid combination board.

[0043] Preferably, the characteristic staggered size acquisition module includes: A code identification submodule, used to identify the type code in the application scenario parameters; A search submodule, configured to search for a corresponding interleaved variation size according to the type code; The adjusting submodule is used to adjust the staggered variation size and the same type of size of the initial staggered size to obtain a characteristic staggered size.

[0044] Preferably, the device further comprises: The encoding module is used to obtain the type code in the application scenario parameters; A calculation module is used to calculate the staggered variation size of the CVL layer in the soft board area; The establishing module is used to establish a mapping relationship between the type coding and the interleaving variation size.

[0045] Preferably, the calculation module includes: a first extraction submodule, configured to extract a first longitudinal dimension of the first initial dimension; a second extraction submodule, configured to extract a second longitudinal size of the second initial size; A calculation submodule is configured to calculate an initial interleaving size according to the first longitudinal size and the second longitudinal size.

[0046] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0047] Regarding the specific definition of the height difference control device of the intersection area of ​​the soft and hard combination board, please refer to the definition of the height difference control method of the intersection area of ​​the soft and hard combination board above, which will not be repeated here. The various modules in the above-mentioned height difference control device of the intersection area of ​​the soft and hard combination board can be fully or partially implemented by software, hardware and their combination. The above-mentioned modules can be embedded in or independent of the processor in the computer device in the form of hardware, or can be stored in the memory of the computer device in the form of software, so that the processor can call and execute the operations corresponding to the above modules.

[0048] The device for controlling the height difference of the interface area of ​​a rigid-flex board provided above can be used to implement the method for controlling the height difference of the interface area of ​​a rigid-flex board provided in any of the above embodiments, and has corresponding functions and beneficial effects.

[0049] In one embodiment, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as follows: Figure 5 As shown. The computer device includes a processor, a memory, a network interface, a display screen and an input device connected via a system bus. The processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal via a network connection. When the computer program is executed by the processor, a method for simulating daylighting is implemented. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covering the display screen, or a button, trackball or touchpad provided on the computer device housing, or an external keyboard, touchpad or mouse.

[0050] Those skilled in the art will understand that Figure 5 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0051] In one embodiment, a computer device is provided, including a memory and a processor, wherein a computer program is stored in the memory, and when the processor executes the computer program, the following steps are implemented: Obtaining a first initial size of the CVL layer in the soft board area; Obtaining a second initial size of the hard plate area; Calculating an initial interleaving size according to the first initial size and the second initial size; Obtain application scenario parameters corresponding to the rigid-flex board; Adjusting the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size; Performing a cutting operation on the CVL layer of the soft board area or the hard board area according to the characteristic staggered size control device; The CVL layer of the soft board area or the hard board area after the cutting operation is staggered and laminated, and then the preset operation is performed to obtain a soft-rigid combination board.

[0052] Preferably, the first initial size includes a first longitudinal size and a first transverse size; and obtaining the first initial size of the CVL layer in the soft board area includes: Get the CVL layer image of the soft board area; The first longitudinal size and the first transverse size of the CVL layer image in the flexible board area are acquired by image recognition.

[0053] Preferably, the second initial size includes a second longitudinal size and a second transverse size; and obtaining the second initial size of the hard board area includes: The image of the hard plate area is obtained; The second longitudinal dimension and the second transverse dimension of the hard plate area image are acquired by image recognition.

[0054] Preferably, the application scenario parameters include high temperature scenario parameters, cold scenario parameters, high humidity scenario parameters, and drought scenario parameters; and obtaining the application scenario parameters corresponding to the rigid-flex board includes: The high temperature scene parameters, cold scene parameters, high humidity scene parameters, and drought scene parameters corresponding to the rigid-flex board are obtained.

[0055] Preferably, adjusting the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size includes: Identifying the category code in the application scenario parameter; Find the corresponding interleaved variation size according to the type code; The staggered variation size is adjusted to the same type of size as the initial staggered size to obtain a characteristic staggered size.

[0056] Preferably, the method further comprises: obtaining a category code in the application scenario parameter; calculating the staggered variable size of the soft board area CVL layer; establishing a mapping relationship between the category code and the staggered variable size.

[0057] Preferably, the calculating the initial staggered size according to the first initial size and the second initial size comprises: extracting a first longitudinal size of the first initial size; extracting a second longitudinal size of the second initial size; calculating an initial staggered size according to the first longitudinal size and the second longitudinal size.

[0058] In one embodiment, a computer readable storage medium is provided, and the computer readable storage medium has stored thereon a computer program, and the computer program is executed by a processor to implement the following steps: obtaining a first initial size of the soft board area CVL layer; obtaining a second initial size of the hard board area; calculating an initial staggered size according to the first initial size and the second initial size; obtaining an application scenario parameter corresponding to the soft and hard combination board; adjusting the initial staggered size according to the application scenario parameter to obtain a feature staggered size; controlling a device according to the feature staggered size to perform a cutting operation on the soft board area CVL layer or the hard board area; staggering and pasting the soft board area CVL layer or the hard board area after the cutting operation is completed, and then performing a preset operation to obtain the soft and hard combination board.

[0059] Preferably, the first initial size comprises a first longitudinal size and a first transverse size; and the obtaining the first initial size of the soft board area CVL layer comprises: obtaining a soft board area CVL layer image; obtaining a first longitudinal size and a first transverse size of the soft board area CVL layer image by image recognition.

[0060] Preferably, the second initial size comprises a second longitudinal size and a second transverse size; and the obtaining the second initial size of the hard board area comprises: obtaining a hard board area image; obtaining a second longitudinal size and a second transverse size of the hard board area image by image recognition.

[0061] Preferably, the application scenario parameters include high-temperature scenario parameters, cold scenario parameters, high-humidity scenario parameters, and arid scenario parameters; and the obtaining of the application scenario parameters corresponding to the soft-and-hard combination board comprises: obtaining high-temperature scenario parameters, cold scenario parameters, high-humidity scenario parameters, and arid scenario parameters corresponding to the soft-and-hard combination board.

[0062] Preferably, the adjusting of the initial staggered size according to the application scenario parameters to obtain a characteristic staggered size comprises: identifying a category code in the application scenario parameters; finding a corresponding staggered variable size according to the category code; adjusting the staggered variable size and an initial staggered size of the same category to obtain a characteristic staggered size.

[0063] Preferably, the method further comprises: obtaining a category code in the application scenario parameters; calculating a staggered variable size of a CVL layer in a soft board area; establishing a mapping relationship between the category code and the staggered variable size.

[0064] Preferably, the calculating of the initial staggered size according to the first initial size and the second initial size comprises: extracting a first longitudinal size of the first initial size; extracting a second longitudinal size of the second initial size; calculating an initial staggered size according to the first longitudinal size and the second longitudinal size.

[0065] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0066] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0067] Those skilled in the art will appreciate that the embodiments of the present invention may be provided as methods, apparatuses, or computer program products. Therefore, the present invention may take the form of a fully hardware embodiment, a fully software embodiment, or an embodiment combining software and hardware. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0068] This embodiment is described with reference to the flowcharts and / or block diagrams of the apparatus, terminal device (system), and computer program product according to this embodiment. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1one or more processes and / or blocks Figure 1 an apparatus for performing the functions specified in the block or blocks.

[0069] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the Figure 1 one or more processes and / or blocks Figure 1 an apparatus for performing the functions specified in the block or blocks.

[0070] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the Figure 1 one or more processes and / or blocks Figure 1 an apparatus for performing the functions specified in the block or blocks.

[0071] While preferred embodiments of the application have been described, additional variations and modifications can be made to these embodiments by those skilled in the art once they learn of the basic inventive concepts. Therefore, the appended claims are intended to cover all such variations and modifications as fall within the scope of the application.

[0072] Finally, it should be noted that the terms "first", "second", and the like, herein do not denote any order, quantity, combination, or importance, but rather are used to distinguish one element from another, and do not imply singular or plural. Moreover, terms such as "including", "having", or "containing" or any other similar terms are intended to be broad and encompass the case where anything referred to is inclusive of, but does not or need not, to be limited to, the listed items. In addition, it is intended that the expression "consisting of" be used to provide the broadest disclosure possible, and that the expression "consisting essentially of" be used where substantially all recited components or steps are required, but the inclusion of additional components or steps is permissible if the additional components or steps do not materially change the basic and novel characteristics of the disclosed embodiments. Finally, it is intended that the disclosure can be practiced by one of ordinary skill in the art without necessarily relying on a claimed combination of features. Accordingly, the claims are not intended to be limited to the preferred embodiments described herein, but instead have the scope defined by the appended claims and their equivalents.

[0073] The above describes in detail the soft and hard combined board joint area height difference control method, the soft and hard combined board joint area height difference control device, the computer equipment and the storage medium provided by the present application. The principles and implementation manners of the present application are described by using specific examples. The above examples are only used to help understand the method of the present application and its core idea. Meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manners and application ranges will be changed. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A method for controlling the height difference of the junction area of ​​a rigid-flex board, characterized in that: The rigid-flex board includes a rigid board area and a flexible board area, wherein the flexible board area CVL is alternately bonded with the rigid board area, including: Obtaining a first initial size of the CVL layer in the soft board area; Obtaining a second initial size of the hard plate area; Calculating an initial interleaving size according to the first initial size and the second initial size; Obtaining application scenario parameters corresponding to the rigid-flex board; Adjusting the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size; Performing a cutting operation on the CVL layer of the soft board area or the hard board area according to the characteristic staggered size control device; The CVL layer of the soft board area or the hard board area after the cutting operation is staggered and laminated, and then the preset operation is performed to obtain a soft-rigid combination board.

2. The method according to claim 1, characterized in that The first initial size includes a first longitudinal size and a first transverse size; and obtaining the first initial size of the CVL layer in the soft board area includes: Get the CVL layer image of the soft board area; The first longitudinal size and the first transverse size of the CVL layer image in the flexible board area are acquired by image recognition.

3. The method according to claim 2, characterized in that The second initial size includes a second longitudinal size and a second transverse size; the second initial size of the hard board area is obtained, including: The image of the hard plate area is obtained; The second longitudinal dimension and the second transverse dimension of the hard plate area image are acquired by image recognition.

4. The method according to claim 1, wherein The application scenario parameters include high temperature scenario parameters, cold scenario parameters, high humidity scenario parameters, and drought scenario parameters; and obtaining the application scenario parameters corresponding to the rigid-flex board includes: The high temperature scene parameters, cold scene parameters, high humidity scene parameters, and drought scene parameters corresponding to the rigid-flex board are obtained.

5. The method according to claim 4, characterized in that The adjusting the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size includes: Identifying the category code in the application scenario parameter; Find the corresponding interleaved variation size according to the type code; The staggered variation size is adjusted to the same type of size as the initial staggered size to obtain a characteristic staggered size.

6. The method according to claim 5, characterized in that The method further comprises: Get the type code in the application scenario parameters; The staggered variation size of the CVL layer in the soft board area is calculated; A mapping relationship between the type code and the interleaving variation size is established.

7. The method according to claim 3, characterized in that The calculating the initial interleaving size according to the first initial size and the second initial size includes: extracting a first longitudinal dimension of the first initial dimension; extracting a second longitudinal dimension of the second initial dimension; An initial interleaving size is calculated according to the first longitudinal size and the second longitudinal size.

8. A device for controlling the height difference of the junction area of ​​a rigid-flex board, characterized in that: The rigid-flex board includes a rigid board area and a flexible board area, wherein the flexible board area CVL is alternately bonded with the rigid board area, including: A first acquisition module is used to acquire a first initial size of the CVL layer in the soft board area; A second acquisition module is used to acquire a second initial size of the hard plate area; a calculation module, configured to calculate an initial interleaving size according to the first initial size and the second initial size; A scenario parameter acquisition module, used to obtain application scenario parameters corresponding to the rigid-flex board; a characteristic interleaving size acquisition module, configured to adjust the initial interleaving size according to the application scenario parameters to obtain a characteristic interleaving size; A cutting operation module, configured to control the device to perform a cutting operation on the CVL layer of the soft board area or the hard board area according to the characteristic staggered size; The laminating module is used to alternately laminate the CVL layer of the soft board area or the hard board area after the cutting operation, and then perform a preset operation to obtain a soft-rigid combination board.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the method for controlling the height difference of the junction area of ​​the flexible and rigid board according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the method for controlling the height difference of the junction area of ​​a flexible and rigid board according to any one of claims 1 to 7 are implemented.

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