Connector assembly

Abstract

Connector assemblies for high speed data communication are described. In one example, the plug connector comprises a base and a butt joint interface, a conductive pad located on an outer surface of the base in an area of the docking interface; and the sheet body assembly is positioned in the base. The sheet assembly includes a plurality of channel-like shields, a pair of signal terminals extending within each of the channel-like shields, a signal terminal insert extending within each of the channel-like shields, and an electrically conductive cable clip on the plurality of channel-like shields. In one example, the base can be embodied as a conductive plated plastic base, and each of the channel-like shields is electrically coupled to the conductive plated plastic base. The improved shielding provided by the conductive pads, the plated plastic base, and other features in the plug connector helps maintain signal integrity and higher data throughput for the connector assemblies described herein.

Description

[0001] Related applications

[0002] This application claims the benefit of U.S. Provisional Application No. 63 / 503,635, filed May 22, 2023. The disclosure of the above application is incorporated herein by reference in its entirety. Background Art

[0003] A range of input / output (I / O) connectors are designed for power, data, and power and data interconnect systems, including board-to-board, wire-to-wire, and wire-to-board systems. Numerous designs exist for each type of system, depending on the requirements of the power and data communication environment in which the connector is used. As an example, a wire-to-board system includes a free-end connector attached to a wire and a fixed-end connector attached to a board.

[0004] High-data-rate connectors, cable assemblies, and interconnect systems often rely on two conductors arranged as a pair of differentially coupled signal pairs to transmit a differential signal. The transmitted signal is represented by the electrical difference measured between the conductor pairs. Differential signaling can help avoid parasitic signals and crosstalk and prevent unintentional signaling modes between adjacent signal pairs. In connector interfaces, ground terminals can be used to create a return path for electrical grounding, provide shielding between differential pairs, and for other purposes.

[0005] Connectors used in high-data-rate applications are typically designed to meet a range of mechanical and electrical requirements. For example, high-data-rate connectors are often used in backplane applications that require very high conductor density and data rates. To achieve these mechanical and electrical requirements, connectors used in such applications often incorporate one or more wafer assemblies. The use of wafer assemblies facilitates the fabrication of connectors capable of achieving high data rates using a variety of assembly processes. Summary of the Invention

[0006] Various aspects and embodiments of connector assemblies are described. In one example, a plug connector includes: a base; a docking interface; a conductive gasket located on an outer surface of the base in an area of ​​the docking interface; and a wafer assembly located in the base. The wafer assembly includes a plurality of channel shields, a pair of signal terminals extending within each of the channel shields, a signal terminal insert extending within each of the channel shields, and a conductive cable clamp located on the plurality of channel shields. In one example, the base can be embodied as a conductive plated plastic base. Additionally, each of the plurality of channel shields can be electrically coupled to the conductive plated plastic base.

[0007] In other aspects, the plurality of channel-shaped shields can include a plurality of insert tabs extending into the conductive cable clamp and providing an interference fit with the conductive cable clamp. The laminate assembly can include a laminate overmold molded over the conductive cable clamp. In other aspects, each of the plurality of channel-shaped shields extends through an opening in the conductive gasket in the region of the docking interface. In one example, the conductive gasket can be embodied as a foam multilayer laminate having a conductive material disposed therein.

[0008] In another example, a connector assembly includes a plug connector and a receptacle connector. The plug connector includes a plug base, a plug mating interface, a conductive gasket located on an outer surface of the plug base in an area of ​​the plug mating interface; and a thin film assembly located within the plug base. The receptacle connector includes a receptacle base and a receptacle mating interface. The conductive gasket is located between the plug mating interface and the receptacle mating interface. The plug base can be a conductive plated plastic plug base. The receptacle base can be a conductive plated plastic receptacle base. The conductive gasket can be a foam multilayer laminate having a conductive material disposed therein.

[0009] The wafer assembly can include: a plurality of channel-shaped shields, a pair of signal terminals extending within each of the plurality of channel-shaped shields, a signal terminal insert extending within each of the channel-shaped shields, and a conductive cable clamp located on the plurality of channel-shaped shields. In addition, the plug base can be embodied as a conductive plated plastic base of the plug, and each of the channel-shaped shields can be electrically connected to the conductive plated plastic base of the plug. In other aspects, each of the channel-shaped shields includes a plurality of insert tabs extending into the conductive cable clamp and providing an interference fit with the conductive cable clamp. The wafer assembly can also include: a wafer overmold molded onto the conductive cable clamp. In still other aspects, the channel-shaped shield can extend through an opening in the conductive gasket in the area of ​​the docking interface. In addition, the plurality of channel-shaped shielding members can include a plurality of contact protrusions, the socket base can be embodied as a conductive plated socket plastic base, and the plurality of contact protrusions can contact a surface of the conductive plated socket plastic base.

[0010] In another example, a connector includes: a base; a conductive gasket located on an outer surface of the base; and a wafer assembly located within the base. The wafer assembly includes a plurality of channel shields, a pair of signal terminals extending within each of the channel shields, and a conductive cable clamp located on the channel shields. The base can be embodied as a conductive plated plastic base. Each of the channel shields can be electrically coupled to the conductive plated plastic base. Additionally, the channel shields can extend through openings in the conductive gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Many aspects of the present disclosure may be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, but emphasis is placed on clearly illustrating the principles of the present disclosure. Additionally, in the drawings, similar reference numerals throughout the several views indicate corresponding parts.

[0012] Figure 1A A top perspective view of an example connector assembly according to various aspects of the present disclosure is shown.

[0013] Figure 1B A bottom perspective view of an example connector assembly according to various aspects of the present disclosure is shown.

[0014] Figure 1C Showing various aspects of the present disclosure Figure 1A and Figure 1B A perspective view of the plug connector assembly and the receptacle connector assembly is shown.

[0015] Figure 2A A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0016] Figure 2B A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0017] Figure 2C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0018] Figure 2D A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0019] Figure 2E A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0020] Figure 2F A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0021] Figure 2G A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0022] Figure 2H A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figures 1A to 1C A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0023] Figure 2I A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figure 2H A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0024] Figure 2J A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figure 2H A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0025] Figure 3A A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure. Figure 2H A top perspective view of a plug connector assembly is shown in accordance with various aspects of the present disclosure.

[0026] Figure 3B Showing various aspects of the present disclosure Figure 3A A rear perspective view of a conductive cable clamp is shown.

[0027] Figure 4A Showing various aspects of the present disclosure Figure 1A and Figure 1B A top view of the plug base of the plug connector is shown.

[0028] Figure 4B Showing various aspects of the present disclosure Figure 4A Cross-sectional view along line AA.

[0029] Figure 5A Showing various aspects of the present disclosure Figure 1A and Figure 1B A top view of the receptacle connector is shown.

[0030] Figure 5B Showing various aspects of the present disclosure Figure 5A Cross-sectional view of line BB in.

[0031] Figure 5C Showing various aspects of the present disclosure Figure 5A The signal module (chicklet) and shield terminal assembly in the receptacle connector are shown.

[0032] Figure 5D Showing various aspects of the present disclosure Figure 5A A signal module and a shielding terminal assembly in the socket connector are shown.

[0033] Figure 6 Showing various aspects of the present disclosure Figure 1A A cutaway view of the connector assembly is shown. DETAILED DESCRIPTION

[0034] Connectors are typically designed to meet a range of mechanical and electrical requirements. As an example, high data rate connectors are often used in backplane applications that require very high conductor density and data rates. In order to achieve the required mechanical and electrical requirements, connectors used in such applications often include one or more wafer assemblies. The wafer assembly can include an insulating web that supports the terminal conductors in the wafer assembly. The use of wafer assemblies can facilitate the use of a range of different assembly processes to manufacture connectors capable of high data rates. In any case, it remains challenging to design connectors in new systems that have the conductor density and small pinout required for high data rate applications while also maintaining the desired electrical characteristics for high data rate transmission with appropriate signal integrity.

[0035] In the sections set forth above, various aspects and embodiments of high-speed connector assemblies are described. In one example, a plug connector includes: a base; a docking interface; a conductive gasket located on an outer surface of the base in an area of ​​the docking interface; and a wafer assembly located in the base. The wafer assembly includes a plurality of channel shields, a pair of signal terminals extending within each of the channel shields, a signal terminal insert extending within each of the channel shields, and a conductive cable clamp located on the plurality of channel shields. In one example, the base can be embodied as a conductive plated plastic base, and each of the channel shields is electrically coupled to the conductive plated plastic base. The improved shielding provided by the conductive gasket, the plated plastic base, and other features in the plug connector helps maintain signal integrity and higher data throughput for the connector assembly described herein.

[0036] Turning to the accompanying drawings, Figure 1A A top perspective view of an example connector assembly 10 is shown, and Figure 1B Show Figure 1A A bottom perspective view of the connector assembly 10 is shown. The connector assembly 10 is shown as a representative example and is not drawn to any particular scale or size. The shape, size, ratios, and other characteristics of the connector assembly 10 can vary relative to that shown. In addition, although the connector assembly 10 and other connectors discussed herein are described for use in high-speed backplane and related interconnect applications, the concept is not limited to use with such interconnect applications or systems. The concept can be extended to use in other types of connectors for other types of interconnect applications or systems.

[0037] Connector assembly 10 includes a plug connector assembly 12 (i.e., plug connector 12) and a receptacle connector assembly 14 (i.e., receptacle connector 14). Plug connector 12 includes a plug housing 20, a plug housing cover 22, plug retainers 25-27, a cable bundle 30 and a cable bundle retainer 24, among other components described later. Receptacle connector 14 includes a receptacle housing 60 and receptacle retainers 65-67, among other components described later. Plug connector assembly 12 is connectable with receptacle connector 14, as shown in Figure 1A Figure 1B A surface mating interface 14B of receptacle connector 14 is surface mountable to a printed circuit board (PCB).

[0038] Plug connector assembly 12 is a plug connector at a free end of an interconnect cable, particularly a free end of cable bundle 30. Cable bundle 30 includes a number of cables, including cables 30A-30D, among others. In the example shown, cable bundle 30 includes thirty-two cables, but connector assembly 10 can be modified for use with other numbers of cables in cable bundle 30. In one example, the cables in cable bundle 30 can be embodied as twin axial cables or twin axial cable bodies, which include a pair of signal conductors insulated by a central dielectric insulating material and one or more shielded or common conductors, suitable for short reach high speed differential data signal transmission applications. However, in a number of other examples, cable bundle 30 can include other types of cables.

[0039] Receptacle connector 14 is surface mountable to a PCB. Receptacle connector 14 includes a number of signal modules and shielded terminal assemblies in receptacle housing 60. The contact tails of the signal modules and shielded terminal assemblies in receptacle connector 14 extend downward and form surface mountable (SMT) contact tails at a surface mating interface 14B of receptacle connector 14. The contact tails are surface mountable and electrically connected (e.g., soldered, sintered, etc.) to contact pads of a PCB. The contact tails are arranged in rows 71-78. Rows 71-78 are staggered or offset relative to each other in a longitudinal direction L in which rows 71-78 extend. In particular, in the example shown, rows 71, 73, 75, 77 are staggered from rows 72, 74, 76, 78, but other staggered arrangements are possible. The staggered arrangement can help reduce signal cross-talk in receptacle connector 14. Additional aspects of receptacle connector 14 are described later with reference to Figures 5A to 5C

[0040] Figure 1C A perspective view showing plug connector 12 separated from receptacle connector 14. As Figure 1C ​​As shown, the plug base 20 of the plug connector 12 includes an insertion area 20A and a body area 20B. The insertion area 20A of the plug base 20 can be inserted into a socket mating interface 14A of the receptacle connector 14 to connect the plug connector 12 with the receptacle connector 14.

[0041] The plug connector 12 includes a plurality of wafer components held within the plug base 20. The wafer components are described later in detail. Figure 2C-Figure 2I The signal conductors and shielding conductors of the cables in the cable bundle 30 are terminated at one end at the thin-film assembly in the plug base 20. The contact ends of the thin-film assembly are respectively connected to the signal module and the shield terminal assembly in the socket connector 14 and electrically connected. The signal module and the shield terminal assembly of the socket connector 14 are described later. Figure 5B and Figure 5C To further explain, at the surface-mating interface 14B of the receptacle connector 14, the contact tails of the signal module and the shield terminal assembly can be surface-mounted and electrically connected to contact pads on a PCB. Thus, the connector assembly 10 facilitates electrically connecting or coupling data signals carried on cables in the cable bundle 30 to signal traces on a PCB. The connector assembly 10 also facilitates shielding of data signals from the cables in the cable bundle 30 to the PCB. As described below, the connector assembly 10 includes numerous features that enhance shielding of data signals carried on the cables in the cable bundle 30.

[0042] Plug base 20 can be formed from a plastic or polymer such as liquid crystal polymer (LCP), polyethylene (PE), polytetrafluoroethylene (PTFE), a fluoropolymer, or other plastic or insulating material. Plug base 20 can be formed using any suitable additive or subtractive manufacturing technique, including molding, injection molding, printing, and other techniques. The outer surface of plug base 20 can be plated with one or more plating metals for conductivity, and plug base 20 can be embodied as a plated plastic component. The surface can, in some cases, be etched and can be metallized or plated in a bath, barrel plated, plated by physical vapor deposition (PVD), plated by electroless plating, electroplating, sputtering, ion plating, or other plating techniques, or a combination thereof. The surface of plug base 20 can be metallized or plated with copper, nickel, tin, silver, another plating metal, or a combination of these. As will be described in further detail below, the channel-shaped shielding members in the wafer assembly within the plug base 20 contact and electrically connect to the plug base 20 , which provides a common shielding or ground connection for the plug connector 12 .

[0043] Similar to the plug base 20, the plug base cover 22 can also be formed of a plated plastic member. The plug base cover 22 can be formed of a plastic or polymer such as LCP, PE, PTFE, fluoropolymer or other plastic or insulating material and in some cases can be metallized or plated with a metal or a combination of plated metals. Figure 2A Illustratively, the plug base cover 22 can be retained on the plug base 20 by an interference fit between the base posts of the plug base 20 and the locating openings of the plug base cover 22. The plug base cover 22 can also be retained on the plug base 20 by one or more plug retainers 25-27.

[0044] The cable harness retainer 24 can also be formed of a plastic or polymer such as LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material and, in some cases, can be metallized or plated with a metal or a combination of plated metals. The cables in the cable harness 30 extend through the cable harness retainer 24. In some cases, the cable harness retainer 24 can be molded around the cables in the cable harness 30 to provide strain relief, but in other cases, the cables can be inserted through the cable harness retainer 24. The cable harness retainer 24 can be retained to the plug base 20 using an interference fit, an adhesive, by plastic welding, other means, or a combination thereof.

[0045] Similar to the plug base 20, the socket base 60 of the socket connector 14 can be formed from a plastic or polymer such as LCP, PE, PTFE, a fluoropolymer, or other plastic or insulating material. The socket base 60 can be formed using any suitable additive or subtractive manufacturing technique, including molding, injection molding, printing, and other techniques. The outer surface of the socket base 60 can be plated with one or more metallizations for conductivity, and the socket base 60 can be embodied as a plated plastic component. The surface can, in some cases, be etched and can be metallized or plated in a bath, barrel plated, plated by PVD, plated by electroless plating, electroplating, sputtering, ion plating, or other plating techniques, or a combination thereof. The surface of the socket base 60 can be metallized or plated with copper, nickel, tin, silver, another metallization, or a combination of these metallizations. As described in further detail below, the socket base 60 provides a common shielding or grounding connection for the socket connector 14.

[0046] The plug fixing members 25-27 can be embodied as metal or plastic screws. Figures 1A to 1CAs shown, the plug retainers 25-27 extend through openings in the plug base 20, through openings in the plug base cover 22, or through corresponding openings in both the plug base 20 and the plug base cover 22. The plug retainers 25-27 can be screws of any suitable size and style, including screws with torx, star, phillips, pin, or other heads, and with any suitable style of thread (e.g., angle, pitch, lead tread). In the example shown, the heads of the plug retainers 25-27 have recessed flat torx heads, but other types of retainers can be used.

[0047] The socket fixing members 65-67 can be embodied as metal or plastic barrel sockets, wherein the threaded opening extends into the barrel socket. The barrel sockets of the socket fixing members 65-67 can be inserted into the barrel seat body formed in the socket base 60, such as Figure 1C As best shown, the socket holders 65-67 include socket posts 65A-67A extending downwardly from the barrel of the socket holders 65-67 and through openings in the socket base 60. The socket posts 65A-67A extend from a bottom surface of the socket base 60 (see FIG. Figure 1B ) extend downwardly in the surface mating interface 14B area of ​​the receptacle base 60. For example, each of the receptacle posts 65A-67A can be inserted into a plated opening of a PCB and soldered into place when the surface mating interface 14B area of ​​the connector 10 is secured to the PCB and electrically connected to the PCB. However, in some cases, the receptacle posts 65A-67A can be secured to a PCB in other ways, such as by employing mechanical fasteners (i.e., pins, bolts, snaps, etc.). The receptacle posts 65A-67A provide mechanical support to the receptacle connector 14 and help reduce stress on the signal tail contacts and shield tail contacts of the receptacle connector 14. When the plug connector 12 is connected to the receptacle connector 14, the plug retainers 25-27 can be inserted into and screwed into threaded openings within the barrel receptacles of the receptacle retainers 65-67.

[0048] Figure 2A Show Figures 1A to 1CA top perspective view of the plug connector 12 is shown, with the plug base cover 22 separated from the plug base 20. The cable harness 30 is shown extending within the body region 20B of the plug base 20. The plug base 20 includes base posts at the top of the plug base 20, including base posts 24A, 24B, etc. The plug base cover 22 includes locating apertures, including locating apertures 23A, 23B, etc. The plug base cover 22 can be retained on the plug base 20 using an interference fit between the base posts 24A, 24B of the plug base 20 and the locating apertures 23A, 23B of the plug base cover 22. The plug base cover 22 can also be retained on the plug base 20 using plug retainers 26, 27.

[0049] Figure 2B Show Figures 1A to 1C The plug connector 12 is shown in a bottom perspective view and a docking interface 12A. The insertion area 20A of the plug base 20 includes an insertion recess 20AA. The insertion recess 20AA is recessed from the bottom periphery 20AB of the insertion area 20A toward the center of the plug base 20. Figure 2B As shown, the contact ends of the wafer assemblies in the plug connector 12 extend through the apertures or openings in the insertion area 20A of the plug base 20 to form rows 41-48 of wafer assembly contact ends. The four contact ends of a single wafer assembly of the plug connector 12 extend through the plug base 20 to form one of the rows 41-48. The rows 41-48 are staggered or offset relative to each other in the longitudinal direction L in which the rows 41-48 extend. In particular, in the example shown, rows 41, 43, 45, and 47 are staggered from rows 42, 44, 46, and 48, but other staggered arrangements can be used. The staggered arrangement can help reduce signal crosstalk between signals on two different wafer assemblies.

[0050] The rows 41-44 can include contacts for data reception, and the rows 45-48 can include contacts for data transmission. Alternatively, the rows 41-44 can include contacts for data transmission, and the rows 45-48 can include contacts for data reception. Thus, in the plug connector 12, the contacts for data reception and the contacts for data transmission can be separated from each other within the insertion area 20A of the plug base 20. Figure 2A As shown, the spacing between the group of rows 41-44 and the group of rows 45-48 is greater than the individual spacing between each pair of rows 41-44 or each pair of rows 45-48. The spacing between rows 41-44 and rows 45-48 can help reduce signal crosstalk between signals used for data reception and signals used for data transmission in plug connector 12.

[0051] The plug connector 12 further includes a conductive elastomer gasket 100 (ie, conductive gasket 100). The conductive gasket 100 is fixed to an outer surface of the plug base 20. Figure 2B In the example shown, the conductive pad 100 is located on an outer surface of a plug base 20 of the plug connector 12 in an area of ​​the docking interface 12A, particularly on a surface within the insertion area 20A of the plug base 20. Figure 2D and Figure 2E As shown, the contact ends of the wafer assembly in the plug connector 12 extend through the apertures or openings in the conductive elastomeric gasket 100. The conductive gasket 100 can be formed from a conductive elastomer or foam material. The conductive gasket 100 is elastic and compressible to some extent. As an example, the conductive gasket 100 can be embodied as a polyurethane foam multilayer laminate including a conductive material such as copper, nickel or other conductive metal or material disposed therein. In a particular example, the conductive gasket 100 can be embodied as a polyurethane foam multilayer laminate manufactured by Polymer Sciences, Inc. of Monticello, Indiana. The conductive gasket 100 may be made of a brand PS-1323 conductive foam or conductive foam tape or sheet, but other suitable types of conductive elastomers or foam materials may be used. The conductive gasket 100 may vary in thickness between 0.1-3 mm, with example thicknesses including 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, and 3.0 mm, but other thicknesses may be used. A conductive adhesive may be applied between a surface of the conductive gasket 100 and a surface within the insertion area 20A of the plug base 20 to secure the conductive gasket 100 to the plug base 20.

[0052] In some cases, the receptacle connector 14 can also include a conductive pad similar to the conductive pad 100. For example, referring back to Figure 1C , a conductive pad can be placed on the surface 62 of the socket base 60 within the socket mating interface 14A of the socket connector 14. In other cases, the conductive pad 100 of the plug connector 12 can be omitted, and the socket connector 14 can include a conductive pad on the surface 62 of the socket base 60.

[0053] Due to its elastomeric properties, the conductive gasket 100 can be compressed against a surface of a receptacle base 60 to continuously contact the surface of the receptacle base 60, even if the entire surface does not extend in exactly the same plane. In particular, the conductive gasket 100 can contact the surface 62 of the receptacle base 60 within the receptacle docking interface 14A, such as Figure 1CAs shown, the conductive gasket 100 can help electrically couple the plug connector 12 to the receptacle connector 14. The conductive gasket 100 can achieve better contact with surfaces such as surface 62, especially if the surface is even slightly uneven due to manufacturing tolerances. The improved shielding provided by the conductive gasket 100 helps maintain signal integrity and higher data throughput for the connector assembly 10. The conductivity of the conductive gasket 100 also helps electrically couple the trench shields 201-204 and share a common potential between the trench shields 201-204.

[0054] Figure 2C Show Figures 1A to 1C A perspective view of the plug connector 12 is shown, with various components omitted. Figure 2D Show Figures 1A to 1C A side view of the plug connector 12 is shown, wherein several components are omitted. In particular, the plug base 20, the plug base cover 22, the plug retainers 25-27 and the cable harness retainer 24 are shown. Figure 2C and Figure 2D Omitted from the view in . Figure 2C and Figure 2D , the plug base 20 includes eight wafer assemblies 51-58. The wafer assemblies 51-58 are shown as representative examples and are not drawn to any particular scale or size. In other embodiments, the shapes, sizes, ratios, and other characteristics of the wafer assemblies 51-58 can vary relative to those shown. In the example shown, the plug connector 12 includes eight wafer assemblies 51-58. However, in other cases, the plug connector 12 can include other numbers of wafer assemblies, including fewer or more wafer assemblies. Each of the wafer assemblies 51-58 includes similar components and can be formed and constructed in the same manner. Thus, although the components of the wafer assembly 51 are described in detail later, each of the wafer assemblies 52-58 can include the same components and structure as the wafer assembly 51.

[0055] The wafer assemblies 51-58 are staggered or offset relative to each other within the plug base 20. In particular, in the illustrated example, the wafer assemblies 51, 53, 55, 57 are staggered from the wafer assemblies 52, 54, 56, 58, but other staggered arrangements can be employed. The staggered arrangement can help reduce signal crosstalk within the plug connector 12.

[0056] Four of the cables in the cable bundle 30 are terminated at each of the wafer assemblies 51-58. For example, cables 30A-30D are terminated at and to the wafer assembly 51. Each of the wafer assemblies 51-58 includes four pairs of signal conductors and four channel-shaped shields. Each pair of signal conductors extends within a channel of a respective channel-shaped shield, and the channel-shaped shield provides a common ground and shield for the pair of signal conductors. Each of the wafer assemblies 51-58 also includes a conductive cable clamp, a wafer overmold, and a number of conductor inserts. These and other aspects of the wafer assemblies 51-58 are described in greater detail below.

[0057] Referring to Figure 2C , the wafer assembly 51 includes channel-shaped shields 201-204. The channel-shaped shields 201-204 are common or ground shields in the wafer assembly 51. In the examples described herein, the channel-shaped shields 201-204 are formed as U-shaped shields, but the channel-shaped shields 201-204 can be formed in other shapes. The channel-shaped shields 201-204 can be formed independently from a flat sheet of metal material (e.g., formed by stamping, shearing, or other means). As described below with reference to Figure 2J , the shielded conductors of the cables 30A-30D are electrically connected to the channel-shaped shields 201-204, respectively. Signal terminal inserts 211-214 are positioned within the channels of the channel-shaped shields 201-204, respectively. The conductor inserts 211-214 surround and electrically isolate the signal terminals extending within the channel-shaped shields 201-204. A conductive cable clamp is secured to and electrically connected to the channel-shaped shields 201-204 and between the channel-shaped shields 201-204 below the wafer overmold 220. The conductive cable clamp is described below with reference to Figure 2H to FIG. 2K.

[0058] Figure 2E A side view of the wafer assembly 51 and the conductive gasket 100 in the plug connector 12 is shown. The conductive gasket 100 includes a number of openings, including openings 101-104, etc. The contact ends of the wafer assembly in the plug connector 12 extend through the openings or apertures in the conductive gasket 100. For example, the contact ends of the wafer assembly 51 extend through the openings in the conductive gasket 100, as shown in Figure 2E , and Figure 2D shows how each of the wafer assemblies 51-58 extends through the conductive gasket 100.

[0059] Figure 2F shows Figures 1A to 1CA front view of the wafer assembly 51 in the plug connector 12 is shown. The wafer assembly 51 includes channel shields 201-204 and signal terminal inserts 211-214 positioned within the channels of the channel shields 201-204, respectively. The signal terminal inserts 211-214 surround and electrically isolate the signal terminals extending within the channel shields 201-204. In particular, the signal terminal insert 211 surrounds and isolates the signal terminals 231 and 232, the signal terminal insert 212 surrounds and isolates the signal terminals 233 and 234, the signal terminal insert 213 surrounds and isolates the signal terminals 235 and 236, and the signal terminal insert 214 surrounds and isolates the signal terminals 237 and 238. The signal terminal inserts 211-214 surround and electrically isolate the signal terminals 231-218 from the conductive surfaces of the channel shields 201-204.

[0060] The signal terminals 231-238 can be formed from a flat sheet of metal, such as a lead frame (e.g., by stamping, shearing, or otherwise forming). In some cases, the sheet of metal or lead frame can be plated with one or more plating metals. The signal terminal inserts 211-214 can be formed from a plastic or polymer, such as LCP, PE, PTFE, a fluoropolymer, or other plastic or insulating material. Before the signal terminals 231-238 are separated from the larger lead frame, the signal terminal inserts 211-214 can be molded around the lead frame forming the signal terminals 231-238. Channel-shaped shields 201-204 can also be positioned around the signal terminal inserts 211-214, respectively, before the signal terminal inserts 211-214 and the signal terminals 231-238 are separated from the lead frame. When the signal terminal inserts 211-214 are molded around the signal terminal inserts 211-214, the signal terminal inserts 211-214 can be formed to include heat stakes. The heat stakes are used to secure the signal terminal inserts 211-214 and to secure the signal terminal inserts 211-214 to the channel-shaped shields 201-204 during a heat stake process described below. The signal terminal inserts 211-214 secure the signal terminals 231-238 and position the signal terminals 231-238 relative to each other and relative to the channel-shaped shields 201-204. The signal terminal inserts 211-214 maintain the position and spacing of the signal terminals 231-238 within the channels of the channel-shaped shields 201-204.

[0061] The channel shields 201-204 are common or ground shields in the plug connector 12 and, together with the conductive cable grips in the wafer assemblies 51-58, the plug base 20, the conductive gasket 100, and possibly the plug base cover 22, form a common shielding or grounding network for the plug connector 12. In the examples described herein, the channel shields 201-204 are formed as U-shaped shields, but the channel shields 201-204 can be formed in other shapes.

[0062] The signal conductors in cables 30A-30D are electrically connected to signal terminals 231-238 in the wafer assembly 51. As described above, each cable in the cable bundle 30 can be embodied as a twin-axial or twin-ax cable, which includes a pair of signal conductors insulated by a central dielectric insulating material and one or more shielding or common conductors. The pair of signal conductors in cable 30A are electrically connected to signal terminals 231 and 232, respectively; the pair of signal conductors in cable 30B are electrically connected to signal terminals 233 and 234, respectively; the pair of signal conductors in cable 30C are electrically connected to signal terminals 235 and 236, respectively; and the pair of signal conductors in cable 30D are electrically connected to signal terminals 237 and 238, respectively.

[0063] Figure 2G Show Figures 1A to 1C A rear view of the wafer assembly 51 in the plug connector 12 is shown. Figure 2G , the heat-seal caps 211A-214A of the signal terminal inserts 211-214 are shown on the rear side of the channel-shaped shields 201-204. When the signal terminal inserts 211-214 are molded around the signal terminal inserts 211-214, the signal terminal inserts 211-214 can be formed to include heat-seal posts. The heat-seal posts extend through openings in the channel-shaped shields 201-204 and are heat-seal to form the heat-seal caps 211A-214A. The heat-seal caps 211A-214A help secure the signal terminal inserts 211-214 within the channel-shaped shields 201-204. The heat-seal caps 211A-214A can also be formed to align the wafer assembly 51, and in particular, the channel-shaped shields 201-204, within the aperture or opening in the plug base 20.

[0064] The channel shields 201-204 also include contact dimples. For example, channel shield 201 includes contact dimples 201A and 201B, and each of channel shields 202-204 includes similar contact dimples. Contact dimples 201A and 201B have a contour that protrudes from the rear surface of channel shield 201 and contacts an inner surface of an opening in the receptacle base 60 of receptacle connector 14 when plug connector 12 is connected to receptacle connector 14. Thus, the contact dimples on channel shields 202-204 help electrically connect the common shield or ground network of plug connector 12 to the common shield or ground network of receptacle connector 14. Sidewalls 201C and 201D of channel shield 201 also contact the inner surface of an opening in plug base 20, further contacting plug base 20. The side surfaces of the channel-shaped shields 202 - 204 also contact the inner surfaces of the other openings in the plug base 20 .

[0065] Figure 2H The wafer assembly 51 is shown with the wafer overmold 220 omitted from this view. With the wafer overmold 220 omitted, a conductive cable clamp 260 (i.e., cable clamp 260) of the wafer assembly 51 is visible. In one example, the conductive cable clamp 260 can be independently formed from a plastic or polymer such as LCP, PE, PTFE, a fluoropolymer, or other plastic or insulating material. The conductive cable clamp 260 can be formed using any suitable additive or subtractive manufacturing technique, including molding, injection molding, printing, and other techniques. The outer surface of the conductive cable clamp 260 can be plated with one or more metal platings for conductivity, and the conductive cable clamp 260 can be embodied as a plated plastic member. The surface can be etched in some cases and can be metallized or plated in a plating bath, barrel plated, plated by PVD, plated by electroless plating, electroplating, sputtering, ion plating, or other plating techniques, or a combination thereof. The surface of the conductive cable clamp 260 can be metallized or plated with copper, nickel, tin, silver, another plating metal, or a combination of these plating metals. In another example, the conductive cable clamp 260 can be formed from a conductive material such as a metal or metal alloy by casting or other additive or subtractive processing techniques.

[0066] The conductive cable clamp 260 is Figure 2HThe locations shown are located and retained on each of the channel shields 201-204. The conductive cable clamp 260 provides an electrical connection between the channel shields 201-204 to form a common ground between the channel shields 201-204. The conductive cable clamp 260 helps provide a common shielding or grounding network for the wafer assembly 51 because the conductive cable clamp 260 electrically connects the channel shields 201-204 together.

[0067] Figure 2I The wafer assembly 51 is shown, wherein the conductive cable clamp 260 and the signal terminal insert 211 are omitted. Figure 2I As shown, cable 30A includes a pair of signal conductors 31A and 32B. Signal conductors 31A and 32B are electrically connected (e.g., welded, soldered, etc.) to signal terminals 231 and 232, respectively. The signal conductors in cables 30B-30D are electrically connected to signal terminals 233-238 in a similar manner. Figure 2J Illustratively, the shield conductors of the cables 30A-30D are also electrically connected to the channel-shaped shields 201-204, respectively.

[0068] Also like Figure 2I As shown, each of the channel shields 201-204 includes an insertion tab. For example, the channel shield 201 includes insertion tabs 241, 242, and each of the channel shields 202-204 includes similar insertion tabs. The conductive cable clamp 260 includes a Figure 3A and Figure 3B The conductive cable clamp 260 can be positioned over the channel shields 201-204 and the cables 30A-30D by extending the insertion tabs of the channel shields 201-204 into the slit grooves. The insertion tabs of the channel shields 201-204 provide an interference fit with the conductive cable clamp 260 to secure and electrically connect the conductive cable clamp 260 to the channel shields 201-204. The conductive cable clamp 260 also provides some strain relief between the cables 30A-30D and the channel shields 201-204 in the sheet assembly 51. When the conductive cable clamp 260 is positioned as shown Figure 2H After that, the sheet body is overmolded 220 (see Figure 2F and Figure 2G ) can be molded around the conductive cable clamp 260. The sheet overmold 220 can be a molded plastic or polymer and, in some cases, can be metallized or plated with one or more metal platings. The sheet overmold 220 provides strain relief between the cables 30A-30D and the channel-shaped shields 201-204 in the sheet assembly 51.

[0069] Figure 2J A channel-shaped shield 201 and a cable 30A of a thin-film assembly 51 are shown. The cable 30A includes signal conductors 31A, 32A, a dielectric material 33A surrounding the signal conductors 31A, 32A, a foil or shielding layer 36A, drain conductors 34A, 35A, and a sheath 37A. The sheath 37A of the cable 30A is stripped or cut back to expose the drain conductors 34A, 35A. The channel-shaped shield 201 includes drain tabs 243, 244 extending upward from the body of the channel-shaped shield 201, and the cable 30A is positioned between the drain tabs 243, 244, with the drain conductors 34A, 35A resting on and contacting the top edges of the drain tabs 243, 244. The drain conductors 34A and 35A are electrically connected (eg, welded, soldered, etc.) to the top edges of the drain tabs 243 and 244. The signal conductors 31A and 32A are also electrically connected to the signal terminals 231 and 232, respectively.

[0070] Figure 3A Show Figure 2H A front perspective view of the cable clamp 260 of the wafer assembly 51 is shown, and Figure 3B A rear perspective view of the cable clamp 260 is shown. The cable clamp 260 is formed as a single integral piece and can be embodied as a plated plastic member as described above. The cable clamp 260 includes a plurality of parts, including clamping parts 261-264. Based on the outer contour shape of the cables 30A-30D, each of the clamping parts 261-264 is formed in a C-shape. Figure 3B As shown, the clamping portions 261-264 include grooves 271-274, respectively. When the wafer assembly 51 is assembled, the cables 30A-30D extend within the grooves 271-274, and the inner surfaces of the grooves 271-274 contact the outer surfaces of the cables 30A-30D to help secure the cables 30A-30D to the channel-shaped shields 201-204.

[0071] Each of the clamping portions 261-264 includes a slit groove. For example, the clamping portion 261 includes slit grooves 281, 282, and the other clamping portions 262-264 include similar slit grooves. The slit grooves 281, 282 are relatively narrow openings through the clamping portion 261. When the cable clamp 260 is as shown in FIG. Figure 2HWhen positioned and assembled on the channel-shaped shields 201-204 and the cables 30A-30D, the insertion tabs of the channel-shaped shields 201-204 extend into the slit grooves of the cable clamp 260. The insertion tabs of the channel-shaped shields 201-204 provide an interference fit with the conductive cable clamp 260 to secure and electrically connect the cable clamp 260 to the channel-shaped shields 201-204. For example, the channel-shaped shield 201 includes the insertion tabs 241, 242, as shown in FIG. Figure 2J As shown, the insert tabs 241, 242 fit into the slit grooves 281, 282, respectively, to provide an interference fit between the cable clamp 260 and the channel shield 201. A similar interference fit is also provided between each of the channel shields 202-204 and the cable clamp 260.

[0072] Because the cable clamp 260 is a conductive member, the cable clamp 260 provides an electrical connection between each of the channel shields 201-204. Because each of the channel shields 201-204 is electrically connected to the shield conductors in the cables 30A-30D, respectively, the cable clamp 260 electrically shares or ties the potential between the channel shields 201-204 and the shield conductors in the cables 30A-30D. The cable clamp 260 thereby provides a common ground between each of the cables 30A-30D in the wafer assembly 51. The cable clamp 260 can help reduce signal interference between the data signals carried on the wafer assembly 51, which facilitates higher data throughput in the plug connector 12.

[0073] Figure 4A A top view of the plug base 20 of the plug connector 12 is shown. The plug base 20 includes an area where each of the wafer assemblies 51-58 can be located and secured. For example, the wafer assembly 51 can be retained in the plug base 20 in the area 250, and the wafer assemblies 52-58 can be retained in a side-by-side arrangement in a similar area within the plug base 20. The plug base 20 includes openings 251-254 in the area 250. The channel-shaped shields 201-204 and the signal terminals 231, 232 extend through the openings 251-254 to form a row 41 of contact terminals (see FIG. 4 ). Figure 2B The channel-shaped shields and signal terminals of the other laminae 52-58 extend through the other openings of the plug base 20 to form rows of contact terminals 42-48. The outer surfaces of the channel-shaped shields 201-204 contact the inner surfaces of the openings 251-254 to electrically connect or couple to the plug base 20.

[0074] Figure 4B Show Figure 4A The sectional view of line AA. Figure 4B In FIG, certain features within the opening 254 can be seen. For example, in Figure 4B , an interference protrusion 255, a positioning groove 256, and an interference ridge 257 are shown in the opening 254. Each of the plurality of openings in the plug base 20 includes features similar to those in the opening 254. The interference protrusion 255 forms a portion of the signal terminal insert 211 (see FIG. 1 ) when the wafer assembly 51 is installed in the plug base 20. Figure 2F ) can be seated and leaned against a protrusion or surface on which the positioning groove 256 forms the heat-melting cap 211A of the signal terminal plug 211 (see Figure 2G ) can be inserted into the groove. The positioning groove 256 in the opening 254 and similar positioning grooves in the other openings 251-254 can guide the heat-melting caps 211A-214A and thus guide the channel-shaped shields 201-204 into the openings 251-254. The interference ridge 257 includes a ridge of material protruding from the inside surface of the opening 254. The side wall 201D of the channel-shaped shield 201 (see Figure 2G ) contacts (and can be compressed against) the interference ridge 257 in the opening 254. The other side wall 201C of the channel-shaped shield 201 contacts another interference ridge ( Figure 4B not shown) contacts.

[0075] Figure 5A Showing various aspects of the present disclosure Figure 1A and Figure 1B A top view of the receptacle connector 14 is shown. Figure 5A In FIG. 1 , the socket interface 14A of the socket connector 14 can be seen. The socket connector 14 includes a socket interface 14A. Figure 5B and Figure 5C The illustrated embodiment depicts a plurality of signal modules and shield terminal assemblies. The contact tips of the signal modules and shield terminal assemblies are exposed and visible within the receptacle mating interface 14A of the receptacle connector 14. The contact tips are arranged in rows. For example, the receptacle connector 14 includes a row 310 of contact tips and other rows. The rows of contact tips are staggered or offset relative to one another, which can help reduce signal crosstalk within the receptacle connector 14.

[0076] The receptacle connector 14 includes a pair of offset key posts 61A, 61B extending upwardly from a surface 62 of the receptacle base 60 within the receptacle mating interface 14A. Corresponding to the key posts 61A, 61B, the plug base 20 includes keyway openings 21A, 21B, as shown. Figure 2BWhen the plug connector 12 is mated with the receptacle connector 14, the key posts 61A, 61B extend into the keyway openings 21A, 21B, respectively. The keyway openings 21A, 21B and the key posts 61A, 61B are pitched or offset from any line of symmetry in the connector assembly 10. Thus, if the plug connector 12 is not oriented properly relative to the receptacle connector 14, the key posts 61A, 61B extend into the keyway openings 21A, 21B, respectively. Figure 1C In the arrangement shown, the key posts 61A, 61B would interfere with the base 20 of the plug connector 12. In some cases, the receptacle connector 14 can include a conductive pad similar to the conductive pad 100. For example, a conductive pad can be placed on the surface 62 of the receptacle base 60 within the receptacle docking interface 14A of the receptacle connector 14.

[0077] Figure 5B Show Figure 5A BB line cross-sectional view. As shown, the socket base 60 includes many openings, including openings 320-323. When the plug connector 12 is docked with the socket connector 14, the channel-shaped shielding members 201-204 and the signal terminals 231-238 of the wafer assembly 51 will be inserted into and extend into the openings 320-323. The signal module and the shielding terminal assembly are located in the openings. For example, the signal module and the shielding terminal assembly 330-333 (i.e., the terminal assembly 330-333) are respectively located and fixed in the openings 320-323. The contact tail ends of the terminal assemblies 330-333 extend downward and form SMT tails at the surface docking interface 14B of the socket connector 14. The contact head ends of the terminal assemblies 330-333 extend upward and are exposed at the socket docking interface 14A of the socket connector 14. As will be described later, when the plug connector 12 is mated with the receptacle connector 14 , the channel-shaped shields 201 - 204 and the signal terminals 231 - 238 of the wafer assembly 51 come into contact with and are electrically connected to the terminal assemblies 330 - 333 .

[0078] Figure 5C Show Figure 5B The terminal assemblies 330-333 in the receptacle connector 14 are shown, and Figure 5DAnother view of the terminal assembly 330 is shown. The terminal assembly 330 includes a base 330A, shield terminals 350, 360, and signal terminals 370, 380. The base 330A is an insulator and can be formed of a plastic or polymer such as LCP, PE, PTFE, fluoropolymers, or other plastic or insulating material. The base 330A is molded around the signal terminals 370, 380. More particularly, the signal terminals 370, 380 can be formed of a flat sheet of metal (e.g., stamped, sheared, or otherwise formed) such as a leadframe. In some cases, the sheet of metal or leadframe can be plated with one or more plating metals. The base 330A can be molded around the leadframe forming the signal terminals 370, 380 before the signal terminals 370, 380 are separated from the larger leadframe. The shield terminals 350, 360 can also be formed of a flat sheet of metal such as a leadframe.

[0079] Referring to Figure 5C The shield terminal 350 includes a base 351, a contact bend 352, and a J-hook surface mount tail contact 353. The shield terminal 360 includes a base 361, a contact bend 362, and a J-hook surface mount tail contact 363. The bases 351, 361 of the shield terminals 350, 360 can be attached on opposite sides of the base 330A by a hot melt process, with adhesive, mechanical interlock or interference, or other means. Referring to Figure 5C and Figure 5D The signal terminal 370 includes a contact bend 372 and a J-hook surface mount tail contact 373. The signal terminal 380 includes a contact bend 382 and a J-hook surface mount tail contact 383. The surface mount tail contacts 353, 363 of the shield terminals 350, 360 can be electrically joined (e.g., soldered, sintered, etc.) to contact pads of a PCB for ground connections to the PCB. The surface mount tail contacts 373, 383 can be electrically joined (e.g., soldered, sintered, etc.) to contact pads of a PCB for signal connections to the PCB. In a number of other examples, the tail contacts of the terminal assemblies 330-333 can be formed with a pierced contact (e.g., an eye of needle (EON)), although in some cases other styles of end contacts can be relied upon.

[0080] As Figure 5BAs shown, the aperture 320 includes opposing or facing inner side walls 324, 325. From the surface mating interface 14B to the receptacle mating interface 14A of the receptacle connector 14, the side walls 324, 325 of the aperture 320 include a tapering section in which the inner side walls 324, 325 narrow and come closer together. The contact bends 352, 362 of the shield terminals 350, 360 respectively contact the side walls 324, 325 of the aperture 320 at a point above the tapering section closer to the receptacle mating interface 14A than to the surface mating interface 14B.

[0081] When the plug connector 12 is mated with the receptacle connector 14, the channel-shaped shield 201 of the wafer assembly 51 will be inserted into and extend into the aperture 320. In that configuration, the side wall 201C (see Figure 2G ) of the channel-shaped shield 201 will extend between the contact bend 352 of the shield terminal 350 and the side wall 324 of the aperture 320. In addition, the side wall 201D (see Figure 2G ) of the channel-shaped shield 201 will extend between the contact bend 362 of the shield terminal 360 and the side wall 325 of the aperture 320. Because the outer surfaces of the receptacle housing 60, including all of the surfaces within the aperture 320, are plated and electrically conductive, the channel-shaped shield 201 is electrically coupled to the side surfaces of the receptacle housing 60 and the shield terminals 350, 360 when the plug connector 12 is mated with the receptacle connector 14. Similarly, the channel-shaped shields 202-204 of the wafer assembly 51 will also be inserted into and extend into the apertures 321-323 and contact the surfaces within the apertures 321-323.

[0082] When the plug connector 12 is mated with the receptacle connector 14, the signal terminals 231, 232 extending within the channel-shaped shield 201 (see Figure 2F ) of the wafer assembly 51 will also be inserted into and extend into the aperture 320 and contact the signal terminals 370, 380 of the terminal assembly 330, respectively. Similarly, the other signal terminals 233-238 of the wafer assembly 51 will contact the other signal terminals of the terminal assemblies 331-333 in the receptacle connector 14.

[0083] Figure 5B and Figure 5C A ground stud 340 of the receptacle connector 14 is also shown. The receptacle connector 14 includes many ground studs, as also shown in Figure 1B . In the example shown, the ground stud 340 is inserted into the receptacle housing 60 at the location shown and held in place by a mechanical interference. In other cases, the receptacle housing 60 can be molded around the ground stud 340. The ground stud can provide additional ground connections in the receptacle connector 14.

[0084] Figure 6 Showing various aspects of the present disclosure Figure 1A A cutaway view of the connector assembly 10 is shown. Figure 6 As shown, when the plug connector 12 is mated with the receptacle connector 14, the channel-shaped shielding members 201-204 and the signal terminals 231-238 of the wafer assembly 51 are inserted into and extended into the openings 320-323 of the receptacle connector 14 (see FIG. Figure 5B ). The channel-shaped shields 201-203 of the wafer assembly 51 contact the surface of the receptacle base 60 within the openings 321-323. The signal terminals 231 and 232 within the channel-shaped shield 201 contact the signal terminals 370 and 380 of the terminal assembly 330, respectively. Similarly, the other signal terminals 233-238 of the wafer assembly 51 contact the other signal terminals of the terminal assemblies 331-333 in the receptacle connector 14.

[0085] exist Figure 6 , a conductive gasket 100 is also shown between the plug connector 12 and the receptacle connector 14. Due to its elastomeric properties, the conductive gasket 100 can be compressed between the receptacle base 60 and the plug base 20, which allows for continuous contact between the conductive gasket 100, the receptacle base 60, and the plug base 20, even if there are some irregularities across their surfaces. The conductive gasket 100 can help electrically couple the plug connector 12 to the receptacle connector 14. The improved shielding provided by the conductive gasket 100 helps maintain signal integrity and higher data throughput for the connector assembly 10.

[0086] Terms such as "top," "bottom," "side," "front," "back," "right," and "left" are not intended to provide an absolute frame of reference. Rather, these terms are relative and are intended to identify certain features in relationship to one another, as the posture of the structures described herein can vary. The terms "comprising," "including," "having," and the like are synonymous and are used in an open-ended manner and do not exclude additional elements, features, actions, operations, and the like. Furthermore, the term "or" is used in its inclusive sense, not its exclusive sense, and thus, when used to connect a list of elements, the term "or" means one, some, or all of the elements in the list.

[0087] Unless otherwise indicated, combinational language, such as "at least one of X, Y, and Z" or "at least one of X, X, or Z," is generally used to identify one, a combination of any two, or all three (or more if identifying a larger group), such as X and only X, Y and only Y, Z and only Z, X and Y, a combination of X and Z and Y and Z, and all of X, Y, and Z. Unless otherwise specified, such combinational language is generally not intended to and does not identify or require the inclusion of at least one of X, at least one of Y, and at least one of Z. Unless otherwise defined herein, the terms "about" and "substantially" in connection with a particular range, percentage, or relative measure of deviation illustrate at least some manufacturing tolerance between a theoretical design and a manufactured product or component, such as the American Society of Mechanical Engineers. Y14.5 and related ISO As one skilled in the art will recognize, even without explicit reference to "approximately," "substantially," or related terms, or even with respect to theoretical terms such as "perpendicular," "orthogonal," "highest point," "collinear," "coplanar," etc., such manufacturing tolerances are still considered.

[0088] The above-described embodiments of the present disclosure are merely examples of implementation to provide a clear understanding of the principles of the present disclosure. Many variations and modifications may be made to the above-described embodiments without departing substantially from the spirit and principles of the present disclosure. In addition, components and features described for one embodiment may be included in another embodiment. All such modifications and variations are intended to be included within the scope of the present disclosure.

Claims

1. A plug connector, comprising: a base; One docking interface; a conductive pad located on an outer surface of the base in an area of ​​the docking interface; as well as A thin-sheet assembly is located in the base, and the thin-sheet assembly includes: a plurality of channel-shaped shielding members; a pair of signal terminals extending within each of the plurality of channel-shaped shields; a signal terminal insert extending within each of the plurality of channel-shaped shields; and A conductive cable clamp is located on the plurality of channel-shaped shielding members.

2. The plug connector according to claim 1, wherein The base comprises a conductive plated plastic base.

3. The plug connector according to claim 2, wherein: Each of the plurality of channel-shaped shields is electrically coupled to the conductive plated plastic base.

4. The plug connector according to claim 1, wherein Each of the plurality of channel-shaped shields includes a plurality of insert tabs extending into the conductive cable clamp and providing an interference fit with the conductive cable clamp.

5. The plug connector according to claim 1, further comprising: A laminar overmold is molded over the conductive cable clamp.

6. The plug connector according to claim 1, wherein The plurality of channel-shaped shields extend through openings in the conductive gasket in the region of the docking interface.

7. The plug connector according to claim 1, wherein The conductive gasket includes a foam multi-layer laminate having a conductive material disposed therein.

8. A connector assembly comprising: a plug connector; as well as A socket connector, wherein The plug connector includes a plug base, a plug docking interface, a conductive pad located on an outer surface of the plug base in an area of ​​the plug docking interface, and a wafer assembly located in the plug base; The socket connector includes a socket base and a socket docking interface; and The conductive gasket is located between the plug docking interface and the socket docking interface.

9. The connector assembly according to claim 8, wherein: The plug base comprises a conductive plated plastic plug base; and The socket base includes a conductive plated socket plastic base.

10. The connector assembly according to claim 8, wherein: The conductive gasket includes a foam multi-layer laminate having a conductive material disposed therein.

11. The connector assembly according to claim 8, wherein: The wafer assembly comprises: a plurality of channel-shaped shielding members; a pair of signal terminals extending within each of the plurality of channel-shaped shields; a signal terminal insert extending within each of the plurality of channel-shaped shields; and A conductive cable clamp is located on the plurality of channel-shaped shielding members.

12. The connector assembly according to claim 11, wherein: The plug base comprises a conductive plated plastic plug base; and Each of the plurality of channel shields is electrically coupled to the conductive plated plug plastic base.

13. The connector assembly according to claim 11, wherein: Each of the plurality of channel-shaped shields includes a plurality of insert tabs extending into the conductive cable clamp and providing an interference fit with the conductive cable clamp.

14. The connector assembly of claim 11, further comprising: A laminar overmold is molded over the conductive cable clamp.

15. The connector assembly according to claim 11, wherein The plurality of channel-shaped shields extend through openings on the conductive gasket in the region of the plug mating interface.

16. The connector assembly according to claim 11, wherein The plurality of channel-shaped shielding members include a plurality of contact protrusions; The socket base comprises a conductive plated plastic socket base; and The plurality of contact bumps contact a surface of the conductive plated plastic socket base.

17. A connector comprising: a base; a conductive pad located on an outer surface of the base; as well as A thin-sheet assembly is located in the base, and the thin-sheet assembly includes: a plurality of channel-shaped shielding members; a pair of signal terminals extending within each of the plurality of channel-shaped shields; and A conductive cable clamp is located on the plurality of channel-shaped shielding members.

18. The connector according to claim 17, wherein The base comprises a conductive plated plastic base.

19. The connector according to claim 17, wherein Each of the plurality of channel-shaped shields is electrically coupled to the conductive plated plastic base.

20. The connector according to claim 17, wherein The plurality of channel-shaped shielding elements extend through the openings on the conductive gasket.

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