Semiconductor trimming and forming equipment with linkage of trimming and feeding

Abstract

The invention discloses semiconductor rib cutting and forming equipment with linkage of rib cutting and feeding, which comprises a machine body, a rib cutting and forming mold which is arranged on the machine body and can be opened and closed up and down, and a feeding mechanism which is arranged on the machine body and is used for supplying materials to the rib cutting and forming mold, the base is used for placing a semiconductor lead frame conveyed from a previous process; the material pushing assembly is linked with an upper mold plate of the rib cutting and forming mold and is used for moving the pushing end of the material pushing assembly to the far end, far away from the upper mold plate, of the feeding plate when the upper mold plate moves downwards for mold closing and moving the pushing end of the material pushing assembly to the near end, close to the upper mold plate, of the feeding plate when the upper mold plate moves upwards for mold opening; and the avoiding assembly is used for enabling the pushing end to lift and avoid the semiconductor lead frame on the feeding plate in the process that the pushing end of the material pushing assembly moves towards the far end of the feeding plate. The material pushing assembly and the avoiding assembly completely adopt a mechanical structure and are in linkage with the upper mold plate, a driving device and program control do not need to be additionally arranged, and the size and the cost are small.

Description

TECHNICAL FIELD

[0001] The present application relates to a lead cutting forming device, more particularly to a lead cutting forming device for semiconductor with lead cutting and feeding linkage. BACKGROUND

[0002] The semiconductor chip packaging product is in the form of a lead frame before lead cutting, and each semiconductor chip packaging product is arranged on a respective lead frame in an array. The structure of the semiconductor chip packaging product comprises a base island and leads arranged on both sides of the base island, and the adjacent leads are connected by connecting leads. The semiconductor lead cutting forming device is used for cutting the connecting leads on the product, so as to separate the semiconductor chip packaging product from the lead frame and simultaneously bend and form the leads.

[0003] The existing semiconductor lead cutting forming device mainly comprises a machine body, a feeding mechanism arranged on the machine body, and a lead cutting and bending mechanism. The lead cutting and bending mechanism mainly comprises a lead cutting and bending die and a driving assembly, and the opening and closing of the lead cutting and bending die is controlled by the driving assembly. The semiconductor lead frame is sequentially subjected to lead cutting and bending. The feeding mechanism is used for feeding the conveyed semiconductor lead frame into the lead cutting and bending die. The existing feeding mechanism is composed of an X-axis cylinder, a Z-axis cylinder and a clamping assembly. The clamping assembly is driven by the Z-axis cylinder to move to the semiconductor lead frame to clamp the semiconductor lead frame, and then the X-axis cylinder drives the clamping assembly to feed the semiconductor lead frame into the lead cutting and bending die. This mechanism needs to use two cylinders to complete the control of the entire clamping and feeding, and the program control is more troublesome, occupies a large space and has a high cost. SUMMARY

[0004] In view of the above-mentioned deficiencies of the prior art, the present application provides a semiconductor lead cutting forming device with lead cutting and feeding linkage, which does not need program control and has smaller volume and cost.

[0005] The above technical purpose of the present application is achieved by the following technical scheme:

[0006] A semiconductor lead cutting forming device with lead cutting and feeding linkage comprises a machine body, an up-and-down openable lead cutting forming die arranged on the machine body, and a feeding mechanism arranged on the machine body for feeding the lead cutting forming die, wherein the feeding mechanism comprises:

[0007] A feeding plate for placing the semiconductor lead frame conveyed from the previous process;

[0008] A pushing assembly arranged on the feeding plate and linked with the upper die plate of the lead cutting forming die, for moving the pushing end of the pushing assembly to the far end of the feeding plate away from the upper die plate when the upper die plate moves downward to close the die, and moving the pushing end of the pushing assembly to the near end of the feeding plate close to the upper die plate when the upper die plate moves upward to open the die;

[0009] The avoiding assembly is arranged on the feeding plate and used for lifting the pushing end to avoid the semiconductor lead frame on the feeding plate during the movement of the pushing end to the far end of the feeding plate, and used for lowering the pushing end to keep against the side of the semiconductor lead frame during the movement of the pushing end to the far end of the feeding plate and the movement of the pushing end to the near end of the feeding plate.

[0010] Further, the feeding plate comprises a bottom plate and two limiting strips, the two limiting strips are respectively fixedly connected to the left and right sides of the top surface of the bottom plate, and the opposite sides of the two limiting strips have a spacing and are parallel to each other.

[0011] Further, the pushing assembly comprises a first rack, a second rack, a gear reduction set and a pushing rod, the first rack is slidably connected to one side of the feeding plate and can move away from or close to the upper die plate, the second rack is fixedly connected to the upper die plate, the gear reduction set is arranged on the feeding plate and used for connecting the first rack and the second rack to make the movement speed of the first rack greater than that of the second rack, and the pushing rod is hingedly connected to the first rack and can rotate perpendicularly to the movement direction of the first rack to serve as the pushing end of the pushing assembly.

[0012] Further, the pushing assembly further comprises a pushing plate and a spring, the pushing plate is arranged at the end of the pushing rod and can move parallel to the movement direction of the first rack, and the pushing plate faces the upper die plate, and the two ends of the spring respectively abut against the upper die plate and the pushing plate.

[0013] Further, the avoiding assembly comprises a fixed rod and an avoiding plate, one end of the fixed rod is fixedly connected to the other side of the feeding plate opposite to the first rack, the other end of the fixed rod extends to the side of the feeding plate where the first rack is located and remains suspended, and the avoiding plate is hingedly connected to the suspended end of the fixed rod; during the movement of the pushing rod to the far end of the feeding plate, the avoiding plate makes the pushing rod slide over the top surface of the avoiding plate and be lifted, and after the pushing rod moves to the far end of the feeding plate and is separated from the avoiding plate, the pushing rod falls back, and when the pushing rod moves to the near end of the feeding plate, the pushing rod slides under the avoiding plate while lifting the avoiding plate upward.

[0014] Further, the feeding plate is provided with a recessed position close to the upper die plate, the near end of the avoiding plate close to the upper die plate falls into the recessed position by gravity, and the top surface of the near end of the avoiding plate is lower than the top edge of the recessed position.

[0015] Further, the avoiding plate comprises a near plate close to the upper die plate and a far plate away from the upper die plate, the connection between the fixed rod and the avoiding plate is located between the near plate and the far plate, and the top portions of the near plate and the far plate are respectively provided with inclined surfaces downwardly inclined from the connection between the fixed rod and the avoiding plate to the respective end portions, and when the pushing rod is not in contact with the avoiding plate, the near plate keeps falling downward to abut against the feeding plate while the far plate keeps being lifted.

[0016] Further, when the pushing rod slides to the end close to the far plate, the pushing rod presses the far plate, and the far plate swings down and the near plate lifts up.

[0017] Further, when the pushing rod moves to the near end of the feeding plate, the bottom surface of the near plate presses the top surface of the pushing rod.

[0018] In conclusion, the present application has the beneficial effects that: the present application sets the pushing assembly, links the pushing assembly with the upper die plate, makes the pushing end of the pushing assembly move away from and close to the upper die plate, pushes the semiconductor lead frame on the feeding plate into the trimming forming die, sets the avoiding assembly to avoid the semiconductor lead frame on the feeding plate when the pushing end of the pushing assembly moves to the far end of the feeding plate, avoids reverse pushing and scratches the semiconductor lead frame. The pushing assembly and the avoiding assembly of the present application completely adopt the mechanical structure and the linkage with the upper die plate, do not need to set the driving device and the program control, and have small volume and cost. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is the schematic diagram of the three-dimensional structure of the present application;

[0020] Figure 2 is the enlarged schematic diagram of A of Figure 1

[0021] Figure 3 is the schematic diagram of the trimming forming die, the feeding mechanism and the partially enlarged structure of the present application;

[0022] Figure 4 is the schematic diagram of the feeding mechanism in one state of the present application;

[0023] Figure 5 is the schematic diagram of the feeding mechanism in another state of the present application.

[0024] Reference signs:

[0025] machine body 1; trimming forming die 2; upper die plate 21; feeding mechanism 3; feeding plate 31; bottom plate 311; limiting strip 312; pushing assembly 32; first rack 321; second rack 322; reduction gear set 323; pushing rod 324; pushing plate 325; spring 326; avoiding assembly 33; fixed rod 331; avoiding plate 332; near plate 3321; far plate 3322. DETAILED DESCRIPTION

[0026] In order to make the technical problems, technical solutions and beneficial effects of the present application more clear, the present application is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the present application, and are not used to limit the present application. ​

[0027] It is to be understood that where a component is referred to as being "on" or "disposed on" another component, it can be directly on the other component or indirectly on the other component, with one or more intervening components. Where a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component, with one or more intervening components.

[0028] It is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like as terms of reference are in

[0029] In addition, the terms "first", "second", "third", etc. are used herein for descriptive purposes only and are not to be construed as indicating or implying relative importance or a significant nature of so described elements. It is to be understood that a "first", "second", "third", etc. element can include one or more such elements, and that features defined with "first", "second" or "third" etc. can implicitly or explicitly include one or more of either of these features unless specifically stated otherwise.

[0030] Referring to Figures 1 to 5 A cutting and feeding combined semiconductor lead cutting and forming device, comprising a machine body 1, an openable and closable lead cutting and forming die 2 arranged on the machine body 1, and a feeding mechanism 3 arranged on the machine body 1 for feeding the lead cutting and forming die 2. The lead cutting and forming die 2 is driven by a driving device of the machine body 1, and in the process of opening and closing the die, the connecting lead of the semiconductor lead frame is cut to separate the semiconductor chip packaging product from the lead frame, and at the same time, the pins of the semiconductor chip packaging product after cutting are bent to form.

[0031] As Figures 2 to 5 , the feeding mechanism 3 comprises:

[0032] A feeding plate 31 for placing the semiconductor lead frame conveyed from the previous process; in actual use, the semiconductor lead frame is placed on the conveying belt 4 one by one by the feeding mechanism, and the conveying belt 4 conveys the semiconductor lead frame to the feeding plate 31.

[0033] A pushing assembly 32 arranged on the feeding plate 31 and linked with the upper die plate 21 of the lead cutting and forming die 2, for moving the pushing end of the pushing assembly 32 to the far end of the feeding plate 31 away from the upper die plate 21 when the upper die plate 21 moves downward to close the die, and moving the pushing end of the pushing assembly 32 to the near end of the feeding plate 31 close to the upper die plate 21 when the upper die plate 21 moves upward to open the die;

[0034] The avoiding assembly 33 is arranged on the feeding plate 31, and is used for lifting the pushing end to avoid the semiconductor lead frame on the feeding plate 31 during the movement of the pushing end to the far end of the feeding plate 31, and is used for lowering the pushing end and keeping the pushing end against the side surface of the semiconductor lead frame during the movement of the pushing end to the far end of the feeding plate 31 and the movement of the pushing end to the near end.

[0035] In an embodiment, as shown in Figure 2 and Figure 3 The feeding plate 31 comprises a bottom plate 311 and two limiting strips 312, the two limiting strips 312 are respectively fixedly connected to the left and right sides of the top surface of the bottom plate 311, and the opposite sides of the two limiting strips 312 have a spacing and are parallel to each other. The spacing of the two limiting strips 312 is matched with the width of the semiconductor lead frame, and is used for passing the semiconductor lead frame and limiting the semiconductor lead frame in the width direction.

[0036] In an embodiment, referring to Figures 2 to 5 The pushing assembly 32 comprises a first rack 321, a second rack 322, a speed reduction gear set 323, a pushing rod 324, a pushing plate 325 and a spring 326. The first rack 321 is slidably connected to one side of the feeding plate 31 and can move away from or close to the upper die plate 21, the second rack 322 is fixedly connected to the upper die plate 21, the pushing rod 324 is hingedly connected to the first rack 321 and can rotate perpendicular to the moving direction of the first rack 321, and the pushing rod 324 is used for pushing the semiconductor lead frame and serves as the pushing end of the pushing assembly 32. The speed reduction gear set 323 is arranged on the feeding plate 31 and is used for connecting the first rack 321 and the second rack 322. Since the moving distance of the upper die plate 21 is shorter than the distance that the pushing rod 324 pushes the semiconductor lead frame to enter the cut-lip forming die 2, the speed reduction gear set 323 is arranged to make the moving speed of the first rack 321 greater than that of the second rack 322, so that the pushing rod 324 obtains a required moving distance.

[0037] The existing cut-lip forming die 2 is provided with a controllable telescopic positioning column. After the die is opened, the semiconductor lead frame that is cut is taken away by the blanking mechanism, and then the positioning column is extended from the lower die plate. The semiconductor lead frame is moved to abut against the positioning column, and then the semiconductor lead frame is successfully positioned. In order to completely push the semiconductor lead frame to the successfully positioned state, the pushing plate 325 is arranged at the end of the pushing rod 324, so that the pushing plate 325 can move parallel to the moving direction of the first rack 321, and the pushing plate 325 faces the upper die plate 21. The two ends of the spring 326 abut against the upper die plate 21 and the pushing plate 325, respectively. After the pushing plate 325 pushes the semiconductor lead frame to abut against the positioning column, the pushing rod continues to move forward by a small distance. At this time, the spring 326 is compressed and contracted under pressure, and a certain pressure is applied to the semiconductor lead frame through the pushing plate 325, so that the semiconductor lead frame is tightly attached to the positioning column, and the positioning is completed.

[0038] In an embodiment, referring to Figures 2 to 5 , the avoiding assembly 33 comprises a fixed rod 331 and an avoiding plate 332, one end of the fixed rod 331 is fixedly connected to the other side of the feeding plate 31 opposite to the first rack 321, the other end of the fixed rod 331 extends to the side of the feeding plate 31 where the first rack 321 is located and the end remains suspended, the avoiding plate 332 is hinged to the suspended end of the fixed rod 331; during the movement of the pushing rod 324 to the distal end of the feeding plate 31, the avoiding plate 332 makes the pushing rod 324 slide over the top surface of the avoiding plate 332 and be lifted, and after the pushing rod 324 moves to the distal end of the feeding plate 31, it falls back after leaving the avoiding plate 332, and when the pushing rod 324 moves to the proximal end of the feeding plate 31, it slides under the avoiding plate 332 while lifting the avoiding plate 332 upward.

[0039] In order to ensure that the pushing rod 324 can slide over the top surface of the avoiding plate 332 when the pushing rod 324 moves to the distal end of the feeding plate 31, a recessed position is provided on the feeding plate 31 near the position where the feeding plate 31 approaches the upper die plate 21, as shown in Figure 2 and Figure 3 , the proximal end of the avoiding plate 332 falls into the recessed position by gravity, and the top surface of the proximal end of the avoiding plate 332 is lower than the top edge of the recessed position. In this way, the movement of the pushing rod 324 to the distal end of the feeding plate 31 makes the pushing rod 324 contact the top surface of the proximal end of the avoiding plate 332 and then move over the top surface.

[0040] In an embodiment, referring to Figures 2 to 5 , the avoiding plate 332 is integrally formed by a proximal plate 3321 and a distal plate 3322, wherein the proximal plate 3321 approaches the upper die plate 21, and the distal plate 3322 is away from the upper die plate 21. The connection between the fixed rod 331 and the avoiding plate 332 is located between the proximal plate 3321 and the distal plate 3322, and the top of the proximal plate 3321 and the distal plate 3322 is provided with a slope respectively downward from the connection between the fixed rod 331 and the avoiding plate 332 to the respective end. The moment of the center of gravity of the proximal plate 3321 to the connection between the fixed rod 331 and the avoiding plate 332 is greater than the moment of the center of gravity of the distal plate 3322 to the connection between the fixed rod 331 and the avoiding plate 332. When the pushing rod 324 is not in contact with the avoiding plate 332, the lower edge of the proximal plate 3321 remains against the feeding plate 31, and the distal plate 3322 remains lifted.

[0041] As shown in Figure 4As shown, when the pushing rod 324 slides to the end of the far plate 3322, the pushing rod 324 presses the far plate 3322, and the far plate 3322 descends and the near plate 3321 rises. At this time, the force of the pushing rod 324 and the gravity of the far plate 3322 are superimposed together to the moment of force at the connection between the fixed rod 331 and the escape plate 332, which is greater than the moment of force at the connection between the fixed rod 331 and the escape plate 332 of the near plate 3321, so that the far plate 3322 descends and the near plate 3321 rises. When the pushing rod 324 gradually slides to the end of the far plate 3322, the far plate 3322 gradually descends, and the angle of the pushing rod 324 rising gradually becomes smaller, and finally the pushing rod 324 relatively gently separates from the far plate 3322, avoiding the pushing rod 324 directly falling from the far plate 3322.

[0042] As shown, Figure 5 As shown, because the near plate 3321 is kept against the feeding plate 31 by the weight descending, the bottom surface of the near plate 3321 is arranged to be relatively low in height, and when the pushing rod 324 moves to the near end of the feeding plate 31, the bottom surface of the near plate 3321 presses the top surface of the pushing rod 324, increases the pressure of the pushing rod 324, reduces the possibility of the pushing rod 324 being lifted by vibration and separated from the semiconductor lead frame during the movement, and ensures that the semiconductor lead frame is smoothly pushed to the position.

[0043] The above embodiments are only explanations of the present application, and are not limitations of the present application. Those skilled in the art can make modifications to the embodiments without creative contribution after reading the specification, as long as the modifications are within the scope of the claims of the present application, and are protected by the patent law.

Claims

1. A semiconductor rib forming device with linked rib cutting and feeding, comprising a body, a rib forming die mounted on the body and capable of opening and closing, and a feeding mechanism mounted on the body for feeding the rib forming die, characterized in that: The feeding mechanism comprises: Feed plate, used to place semiconductor lead frames transferred from the previous process; A pusher assembly is provided on the feed plate and is linked to the upper template of the rib cutting and forming mold, and is used to move its pushing end to the far end of the feed plate away from the upper template when the upper template moves downward to close the mold, and to move its pushing end to the near end of the feed plate close to the upper template when the upper template moves upward to open the mold; The avoidance component is arranged on the feed plate and is used to lift the pushing end of the pushing component to avoid the semiconductor lead frame on the feed plate when the pushing end moves toward the far end of the feed plate, and to fall back and keep facing the side of the semiconductor lead frame when the pushing end moves to the far end of the feed plate and moves toward the near end.

2. The semiconductor cutting and forming equipment with cutting and feeding linked together according to claim 1, characterized in that: The feed plate includes a bottom plate and two limit bars, the two limit bars are fixedly connected to the left and right sides of the top surface of the bottom plate respectively, and there is a distance between the opposite sides of the two limit bars and they are parallel to each other.

3. The semiconductor cutting and forming equipment with cutting and feeding linked together according to claim 1, characterized in that: The pushing assembly includes a first rack, a second rack, a reduction gear set and a pushing rod. The first rack is slidably connected to one side of the feed plate and can move away from or close to the upper template. The second rack is fixedly connected to the upper template. The reduction gear set is provided on the feed plate and is used to connect the first rack and the second rack so that the moving speed of the first rack is greater than that of the second rack. The pushing rod can be hinged on the first rack and can rotate perpendicular to the moving direction of the first rack, serving as the pushing end of the pushing assembly.

4. The semiconductor cutting and forming equipment with linked cutting and feeding according to claim 3, characterized in that: The pusher assembly also includes a push plate and a spring. The push plate is movable parallel to the moving direction of the first rack and is installed at the end of the push rod. The push plate faces the upper template, and the two ends of the spring respectively press against the upper template and the push plate.

5. The semiconductor cutting and forming equipment with linked cutting and feeding according to claim 3, characterized in that: The avoidance assembly includes a fixed rod and a avoidance plate, one end of the fixed rod is fixedly connected to the other side of the feed plate opposite to the first rack, the other end of the fixed rod extends to the side of the feed plate where the first rack is located and the end remains suspended, and the avoidance plate is hinged to the suspended end of the fixed rod; when the push rod moves toward the far end of the feed plate, the avoidance plate causes the push rod to slide from the top surface of the avoidance plate and be lifted up, after the push rod moves to the far end of the feed plate, it detaches from the avoidance plate and falls back, and when the push rod moves toward the proximal end of the feed plate, it slides from under the avoidance plate and pushes the avoidance plate to lift up.

6. The semiconductor cutting and forming equipment with linked cutting and feeding according to claim 5, characterized in that: The feed plate is provided with a recessed position near the upper template, and the proximal end of the avoidance plate close to the upper template falls into the recessed position by its own weight, and the top surface of the proximal end of the avoidance plate is lower than the top edge of the recessed position.

7. The semiconductor cutting and forming equipment with linked cutting and feeding according to claim 5, characterized in that: The avoidance plate is composed of a near plate close to the upper template and a far plate far away from the upper template. The connection between the fixed rod and the avoidance plate is located between the near plate and the far plate. The tops of the near plate and the far plate are provided with inclined surfaces that are respectively inclined downward from the connection between the fixed rod and the avoidance plate to their respective ends. When the push rod is not in contact with the avoidance plate, the lower hem of the near plate remains against the feed plate and the far plate remains lifted.

8. The semiconductor cutting and forming equipment with linked cutting and feeding according to claim 7, characterized in that: When the push rod slides to the end close to the far plate, the push rod presses the far plate, causing the far plate to swing down and the near plate to lift up.

9. The semiconductor cutting and forming equipment with linked cutting and feeding according to claim 7, characterized in that: When the push rod moves toward the proximal end of the feed plate, the bottom surface of the proximal plate presses against the top surface of the push rod.

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