Automatic wafer placing equipment

Abstract

The invention discloses an automatic wafer placing device, and relates to the technical field of wafers, the automatic wafer placing device comprises a workbench, the bottom of the workbench is fixedly provided with a controller, the top of the workbench is provided with a placing frame, the top of the workbench is slidably connected with a movable frame through an adjusting part, and the movable frame is located at the top of the placing frame; a fixed frame is fixedly mounted at the top of the movable frame, a plurality of wafer bodies are placed in the fixed frame, an opening is formed in the movable frame on the right side of the wafer bodies, and a second electric push rod is fixedly mounted at the top of the movable frame. Through mutual cooperation of the sleeve and the internal structure of the sleeve, the wafer body on the rightmost side can be adsorbed, so that the sealing ring is tightly attached to the wafer body, and the wafer body is driven to move towards the right side and automatically slides into the placement frame through the opening, so that manual operation is replaced, and the labor intensity of workers is reduced. The wafer body can be automatically placed, and the working efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of wafer, in particular to a wafer automatic placing device. BACKGROUND

[0002] Wafer is the core raw material of the semiconductor industry, which is essentially an ultra-thin circular semiconductor substrate, usually made of single crystal silicon, with a diameter covering 6 inches, 8 inches, 12 inches, etc. The single crystal silicon ingot is cut into thin slices (thickness about 0.775 mm) by diamond wire cutting, and then polished to mirror level by chemical mechanical polishing, with a surface roughness of less than 0.3 nm. As the "semiconductor industry food", the technical evolution of wafer directly determines the boundary of digital economy.

[0003] In the chip production process, after the silicon rod is cut into wafers, the stacked wafers need to be placed on a special placing rack, and then subjected to subsequent cleaning treatment. However, the existing placing process is mostly carried out manually, which is inefficient. Therefore, it is necessary to provide a wafer automatic placing device to solve these problems. SUMMARY

[0004] The purpose of the present application is to provide a wafer automatic placing device to solve the problem of inefficient manual placing process in the background art.

[0005] To solve the above technical problems, the technical solution adopted by the present application is: A wafer automatic placing device, comprising a workbench, a controller fixedly installed at the bottom of the workbench, a placing rack placed on the top of the workbench, an adjustable rack slidably connected to the top of the workbench through an adjusting component, the adjustable rack being located on the top of the placing rack, a fixed rack fixedly installed on the top of the adjustable rack, a plurality of wafer bodies placed in the fixed rack, an opening formed in the inside of the adjustable rack on the right side of the wafer body, an electric push rod two fixedly installed on the top of the adjustable rack, an electric push rod one fixedly connected to the top of the adjustable rack, a sleeve provided on the left side of the electric push rod one, a piston plate slidably installed in the inside of the sleeve through an electric push rod three, and a suction cup one fixedly installed on the left side of the sleeve; a shunt component provided on the left side of the sleeve for shunting adjustment of the suction cup one, the shunt component; and a movable component provided between the electric push rod one and the sleeve for position adjustment of the sleeve.

[0006] Through setting the sleeve and its internal structure, after the suction cup 1 is closely attached to the wafer body, the piston plate is driven to move to the right side by the electric push rod 3, so that the inside of the sleeve on the left side of the piston plate forms a negative pressure, and then the suction cup 1 can form a suction effect on the wafer body, and the wafer body is driven to move to the right side by the electric push rod 1, so that it is separated from other wafer bodies, after the wafer body is moved to the top of the opening, the suction force disappears by controlling the piston plate to move by the electric push rod 3, at this time, the wafer body can automatically slide into the placing rack through the opening, so as to replace manual operation, realize automatic placing of the wafer body, and improve the work efficiency.

[0007] Further improvement of the technical scheme of the application is that the shunt component includes a plurality of hoses, the plurality of hoses are fixedly connected with the outer surface of the sleeve and are uniformly distributed, a shunt suction cup is fixedly installed on the outer surface of the hose, a plurality of rotating tubes are rotatably installed on the outer surface of the suction cup 1, a screw rod is threadedly connected in the rotating tube, and each screw rod penetrates through the inside of each rotating tube and is fixedly connected with the surface of each shunt suction cup.

[0008] By adopting the above technical scheme, the shunt suction cup is arranged on the suction cup 1, the wafer body can be uniformly adsorbed from multiple positions, the rotating tube and the screw rod are installed, the hose is expanded outward by rotating the rotating tube and moving the screw rod in the rotating tube, the position of each shunt suction cup is adjusted, the contact position between the shunt suction cup and the wafer body is adjusted, the contact position is dynamically adjusted for the wafer body with local particle pollution or warping, the stable adsorption force is maintained, and different wafer bodies are adapted to, so that the applicability of the device is improved.

[0009] Further improvement of the technical scheme of the application is that the left side of the suction cup 1 and the shunt suction cup is attached with a sealing ring, and the sealing ring is closely attached to the right surface of the wafer body.

[0010] By adopting the above technical scheme, the sealing ring is arranged to seal the contact surface between the suction cup 1 and the shunt suction cup and the wafer body, so that the adsorption effect is improved.

[0011] Further improvement of the technical scheme of the application is that the movable part includes a connecting plate, the right side of the connecting plate is fixedly connected with the movable rod of the electric push rod 1, the left side of the connecting plate is fixedly connected with the sleeve, a contact block is fixedly installed at the bottom of the sleeve, and a support frame is fixedly installed at the top of the movable frame on the right side of the opening.

[0012] The technical scheme is characterized in that when the plurality of wafer bodies are stacked together, in the process of separating them, the wafer bodies other than the wafer body to be separated can follow the movement of the wafer body to be separated, so that the wafer body to be separated cannot be effectively separated, affecting the work of the wafer body, and therefore the contact block and the support frame are installed, wherein in the process of moving the sleeve to the right side by the electric push rod, the contact block can slide along the surface of the support frame, and the connecting plate is slidably arranged between the sleeve, so that the sleeve can be moved to the top, the wafer bodies are moved out of position, the possibility of the wafer bodies other than the wafer body to be separated moving synchronously with the wafer body to be separated is reduced, the effect of separating the wafer bodies is improved, and the device can be normally used.

[0013] The technical scheme is further improved in that the bottom of the contact block is provided with a slope one, a plurality of balls two are rotatably installed in the slope one, and the surfaces of the two sides of the support frame are provided with slopes two, and the balls two are in contact with the slopes two on the left side of the support frame.

[0014] The technical scheme is characterized in that the balls two are installed to reduce the contact area between the contact block and the support frame, and the balls two can roll along the surface of the support frame, so that the wear of the contact block and the support frame is reduced.

[0015] The technical scheme is further improved in that the top of the movable frame on the left side of the opening is fixedly provided with a baffle, and the baffle is in contact with the right bottom of the wafer body.

[0016] The technical scheme is characterized in that the baffle is installed, the inclination of the slopes on the two sides of the baffle is equal to the inclination of the slopes two of the support frame, so that the baffle can intercept the wafer body behind to a certain extent, and the possibility of the wafer bodies other than the wafer body to be separated moving synchronously with the wafer body to be separated is further reduced.

[0017] The technical scheme is further improved in that the top of the connecting plate is fixedly provided with a top block, and the fixed frame is fixedly provided with a stop block, and the stop block is located on the left side of the top block and corresponds to each other.

[0018] The technical scheme is adopted, in the scheme, the electric push rod drives the sleeve to move, and the wafer body needs to be observed by the naked eye whether it moves to the top of the opening during following the movement of the sleeve, so the operator needs to observe at all times, which increases the work of the operator and is easy to cause errors, thereby affecting the wafer placing work, therefore, the top block and the stop block are installed and located on the same horizontal line, so that when the electric push rod drives the connecting plate to move to the right side, the wafer body is just moved to the top of the opening when the top block and the stop block are attached, so the operator does not need to pay attention to the movement process of the wafer body at all times, and the work efficiency is further improved.

[0019] The further improvement of the technical scheme of the present application is that a plurality of ball bearings are arranged on both sides of the opening.

[0020] The technical scheme is adopted, in the scheme, the electric push rod drives the sleeve to move, and the wafer body needs to be observed by the naked eye whether it moves to the top of the opening during following the movement of the sleeve, so the operator needs to observe at all times, which increases the work of the operator and is easy to cause errors, thereby affecting the wafer placing work, therefore, the top block and the stop block are installed and located on the same horizontal line, so that when the electric push rod drives the connecting plate to move to the right side, the wafer body is just moved to the top of the opening when the top block and the stop block are attached, so the operator does not need to pay attention to the movement process of the wafer body at all times, and the work efficiency is further improved.

[0021] In summary, compared with the prior art, the technical progress achieved by the present application is that: 1、The wafer automatic wafer placing equipment provided by the present application is provided with a sleeve and an internal structure, the sealing ring of the suction cup is closely attached to the wafer body, the piston plate is driven to move to the right side by the electric push rod, the wafer body is formed with an adsorption force, the wafer body is moved to the top of the opening by the electric push rod, the piston plate is reversely moved by the electric push rod, the adsorption force disappears, and the wafer body can automatically slide into the placing rack through the opening, thereby replacing manual operation, realizing automatic placing of the wafer body, and improving the work efficiency.

[0022] 2、The wafer automatic wafer placing equipment provided by the present application is provided with a sleeve and an internal structure, the sealing ring of the suction cup is closely attached to the wafer body, the piston plate is driven to move to the right side by the electric push rod, the wafer body is formed with an adsorption force, the wafer body is moved to the top of the opening by the electric push rod, the piston plate is reversely moved by the electric push rod, the adsorption force disappears, and the wafer body can automatically slide into the placing rack through the opening, thereby replacing manual operation, realizing automatic placing of the wafer body, and improving the work efficiency.

[0023] 3. The present invention provides an automatic wafer swinging device, which cooperates with each other between movable parts. In the process of using the electric push rod to drive the sleeve to move to the right, the contact block and the ball bearing can slide along the surface of the support frame and drive the sleeve to move to the top at the same time, so that the two wafer bodies move out of position, thereby reducing the possibility of other wafer bodies moving synchronously with the wafer body that needs to be moved, and the baffle can intercept the wafer body behind to a certain extent, further reducing the possibility of other wafer bodies moving synchronously with the wafer body that needs to be moved, thereby improving the effect of separating and swinging the wafer bodies and ensuring that the device can be used normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a perspective view of the present invention.

[0025] Figure 2 It is a partial structural schematic diagram of the workbench of the present invention from a second viewing angle.

[0026] Figure 3 It is a schematic diagram of a partial cross-sectional structure of a fixing frame of the present invention; Figure 4 It is a schematic diagram of the partial structure of the movable frame cross section of the present invention; Figure 5 The present invention Figure 4 A schematic diagram of the enlarged structure at point A; Figure 6 It is a schematic diagram of the partial structure of the movable frame of the present invention in front view; Figure 7 It is a schematic diagram of the partial structure of the sleeve cross section of the present invention; Figure 8 It is a schematic diagram of the local structure of the contact block of the present invention.

[0027] Description of reference numerals: 1. Workbench; 2. Movable frame; 3. Wafer body; 4. Controller; 5. Placement frame; 6. Adjustment component; 7. Fixed frame; 8. Sleeve; 9. Electric push rod 1; 10. Top block; 11. Sealing ring; 12. Electric push rod 2; 13. Diverter suction cup; 14. Connecting plate; 15. Support frame; 16. Contact block; 17. Opening; 18. Baffle; 19. Ball 1; 20. Ball 2; 21. Piston plate; 22. Electric push rod 3; 23. Hose; 24. Suction cup 1; 25. Rotating tube; 26. Screw; 27. Block. DETAILED DESCRIPTION

[0028] The present invention is described in further detail below in conjunction with the embodiments: Example 1 like Figure 2 、 Figure 3 and Figure 5As shown, the present application provides a wafer automatic placing equipment, including a workbench 1, the bottom of the workbench 1 is fixedly installed with a controller 4, the top of the workbench 1 is placed with a placing rack 5, the top of the workbench 1 is slidably connected with a movable rack 2 through an adjusting component 6, the movable rack 2 is located on the top of the placing rack 5, the top of the movable rack 2 is fixedly installed with a fixed rack 7, the inside of the fixed rack 7 is placed with a plurality of wafer bodies 3, the inside of the movable rack 2 right side of the wafer body 3 is provided with an opening 17, the top of the movable rack 2 is fixedly installed with an electric push rod two 12, the top of the movable rack 2 is fixedly connected with an electric push rod one 9, the left side of the electric push rod one 9 is provided with a sleeve 8, the inside of the sleeve 8 is slidably installed with a piston plate 21 through an electric push rod three 22, the left side of the sleeve 8 is fixedly installed with a suction cup one 24; the left side of the sleeve 8 is provided with a shunt component for shunting adjustment of the suction cup one 24, the shunt component; the electric push rod one 9 and the sleeve 8 are provided with a movable component for position adjustment of the sleeve 8.

[0029] In the embodiment, by setting the sleeve 8 and its internal structure, after the suction cup one 24 is tightly attached to the wafer body 3, the piston plate 21 is driven to move right by controlling the electric push rod three 22, so that the inside of the sleeve 8 left side of the piston plate 21 forms a negative pressure, and then the suction cup one 24 can form an adsorption effect on the wafer body 3, and then the wafer body 3 is driven to move right by the electric push rod one 9, so that it is separated from other wafer bodies 3, after the wafer body 3 is moved to the top of the opening 17, the suction force disappears by controlling the electric push rod three 22 to drive the piston plate 21 to move, at this time the wafer body 3 can automatically slide into the placing rack 5 through the opening 17, thereby replacing manual operation, realizing automatic placing of the wafer body 3, and improving work efficiency.

[0030] Embodiment 2 As Figure 1 and Figure 3 As shown, on the basis of embodiment 1, the present application provides a technical solution: preferably, the shunt component includes a plurality of hoses 23, the plurality of hoses 23 are fixedly connected with the outer surface of the sleeve 8 and are uniformly distributed, the outer surface of the hose 23 is fixedly installed with a shunt suction cup 13, the outer surface of the suction cup one 24 is rotatably installed with a plurality of rotating tubes 25, the inside of the rotating tube 25 is threadedly connected with a screw rod 26, each screw rod 26 respectively penetrates the inside of each rotating tube 25 and is fixedly connected with the surface of each shunt suction cup 13, the left side of the suction cup one 24 and the shunt suction cup 13 is attached with a sealing ring 11, the sealing ring 11 is tightly attached to the right side surface of the wafer body 3 movable component.

[0031] In the embodiment, the suction disc 24 is divided into several parts by the shunt suction disc 13, and the wafer body 3 is uniformly sucked from multiple positions. The rotating pipe 25, the screw 26 and the hose 23 are installed. The rotating pipe 25 is rotated to drive the screw 26 to move in the rotating pipe 25, so that the hose 23 is unfolded outward, and the position of each shunt suction disc 13 is adjusted. The contact position between the shunt suction disc 13 and the wafer body 3 is adjusted. For the wafer body 3 with local particle pollution or warping, the contact position is dynamically adjusted to maintain stable suction force, so as to adapt to different wafer bodies 3 and expand the application performance of the device. The sealing ring 11 is arranged to seal the contact surface between the suction disc 24, the shunt suction disc 13 and the wafer body 3, thereby improving the suction effect.

[0032] Embodiment 3 As shown in Figure 1 and Figure 3 Based on the embodiment 2, the application provides a technical scheme: preferably, the movable part includes a connecting plate 14, the right side of the connecting plate 14 is fixedly connected with the movable rod of the electric push rod 9, the left side of the connecting plate 14 is fixedly connected with the sleeve 8, the bottom of the sleeve 8 is fixedly installed with a contact block 16, the top of the movable frame 2 on the right side of the opening 17 is fixedly installed with a support frame 15, the bottom of the contact block 16 is provided with an inclined surface 1, a plurality of ball bearings 20 are installed in the inclined surface 1, the both sides of the support frame 15 are provided with inclined surfaces 2, the ball bearings 20 are in contact with the inclined surfaces 2 on the left side of the support frame 15, the top of the movable frame 2 on the left side of the opening 17 is fixedly installed with a baffle 18, the baffle 18 is in contact with the right bottom of the wafer body 3, the top of the connecting plate 14 is fixedly installed with a top block 10, the fixed frame 7 is fixedly installed with a stop block 27, the stop block 27 is located on the left side of the top block 10 and corresponds to each other, and a plurality of ball bearings 19 are arranged on the both sides of the opening 17.

[0033] In this embodiment, when a plurality of wafer bodies 3 are stacked together, in the process of separating them, other wafer bodies 3 in contact with the separated wafer body 3 may move following the movement of the wafer body 3, thereby failing to effectively separate the single wafer body 3, affecting the work of the wafer, therefore, by installing the contact block 16 and the support frame 15, wherein in the process of moving the sleeve 8 to the right side by the electric push rod 1, the contact block 16 can slide along the surface of the support frame 15, and by slidingly arranging between the connecting plate 14 and the sleeve 8, the sleeve 8 can be moved to the top, so that the two wafer bodies 3 are moved out of position, reducing the possibility of other wafer bodies 3 moving synchronously with the wafer body 3 that needs to move, and by installing the baffle 18, the inclination of the inclined surface on both sides of the baffle 18 is equal to the inclination of the inclined surface 2 of the support frame 15, therefore, the baffle 18 can intercept the wafer body 3 behind to a certain extent, further reducing the possibility of other wafer bodies 3 moving synchronously with the wafer body 3 that needs to move, thereby improving the effect of separating the wafer body 3, and ensuring that the device can be used normally; Wherein the installation of the ball 2 20 can reduce the contact area between the contact block 16 and the support frame 15, and the ball 2 20 can roll along the surface of the support frame 15, thereby reducing the wear of the contact block 16 and the support frame 15; In the process of moving the sleeve 8 by the electric push rod 1, and the wafer body 3 following the movement of the sleeve 8, the operator needs to observe with the naked eye whether the wafer body 3 moves to the top of the opening 17, therefore, the operator needs to observe at all times, increasing the work of the operator, and easy to cause error, thereby affecting the work of the wafer, therefore, by installing the top block 10 and the stop block 27, wherein the top block 10 and the stop block 27 are located on the same horizontal line, therefore, in the process of moving the connecting plate 14 to the right side by the electric push rod 1, when the top block 10 and the stop block 27 are in close contact, the wafer body 3 that is adsorbed just moves to the top of the opening 17, therefore, the operator does not need to pay attention to the movement process of the wafer body 3 at all times, further improving the work efficiency; Wherein the installation of the ball 1 19 can reduce the contact area between the inner wall of the opening 17 and the wafer body 3, and the ball 1 19 can roll along the surface of the wafer body 3 moving downward, thereby reducing the wear of the wafer body 3 and the inner wall of the opening 17.

[0034] The working principle of the wafer automatic wafer device will be described in detail below.

[0035] As Figures 1-8As shown, the operator places the superimposed multiple wafer bodies 3 on the top of the movable frame 2, and the movable rod right side of the electric push rod two 12 is attached to the wafer body 3, and the left side is supported. According to the actual contact surface of the wafer body 3, the operator can rotate the rotating pipe 25, and at the same time drive the screw 26 to move, adjust the position of the shunt suction cup 13, adjust the position of each shunt suction cup 13 respectively, and then use the electric push rod one 9 to drive the sleeve 8 to move to the left side, so that the sealing ring 11 of the shunt suction cup 13 is in contact with the smooth and flat surface of the wafer body 3. Then use the electric push rod three 22 to drive the piston plate 21 to move to the right side, and then use the electric push rod one 9 to drive the sleeve 8 to move to the right side, and at the same time the ball two 20 slides along the inclined surface two of the support frame 15, and drives the sleeve 8 to move to the top, so that the two wafer bodies 3 are moved out of position, so that the wafer body 3 is separated from other wafer bodies 3. When the top block 10 contacts the stop block 27, the electric push rod three 22 drives the piston plate 21 to move to the left side, so that the wafer body 3 and the sealing ring 11 lose the adsorption force, and at the same time the wafer body 3 can slide along the opening 17 to the bottom, and the ball one 19 rolls along the wafer body 3. Finally, the wafer body 3 automatically slides into the placing frame 5. The operator can use the adjusting part 6 to drive the movable frame 2 to move, and use the electric push rod two 12 to push the wafer body 3 to the right side, and adjust the position of the opening 17, so as to facilitate the movement and placement of each wafer body 3 in the placing frame 5.

[0036] The above is a detailed description of the general application, but some modifications or improvements can be made on the basis of the application, which is obvious to those skilled in the art. Therefore, the modifications or improvements without departing from the spirit of the application are within the scope of the application.

Claims

1. A wafer automatic swinging device, comprising a workbench (1), characterized in that: A controller (4) is fixedly installed at the bottom of the workbench (1), a placement rack (5) is placed on the top of the workbench (1), and a movable rack (2) is slidably connected to the top of the workbench (1) through an adjusting component (6), and the movable rack (2) is located on the top of the placement rack (5). A fixed rack (7) is fixedly installed on the top of the movable rack (2), and a plurality of wafer bodies (3) are placed inside the fixed rack (7). An opening (17) is provided inside the movable rack (2) on the right side of the wafer body (3). An electric push rod 2 (12) is fixedly installed on the top of the movable rack (2), and an electric push rod 1 (9) is fixedly connected to the top of the movable rack (2). A sleeve (8) is provided on the left side of the electric push rod 1 (9), and a piston plate (21) is slidably installed inside the sleeve (8) through an electric push rod 3 (22), and a suction cup 1 (24) is fixedly installed on the left side of the sleeve (8); A diversion component for diverting and regulating the suction cup 1 (24) is provided on the left side of the sleeve (8), wherein the diversion component; A movable component for movably adjusting the position of the sleeve (8) is provided between the electric push rod 1 (9) and the sleeve (8).

2. The automatic wafer swinging device according to claim 1, characterized in that: The diversion component includes a plurality of hoses (23), and the plurality of hoses (23) are fixedly connected to the outer surface of the sleeve (8) and are evenly distributed. A diversion suction cup (13) is fixedly installed on the outer surface of the hose (23), and a plurality of rotating tubes (25) are rotatably installed on the outer surface of the suction cup (24). The internal thread of the rotating tube (25) is connected to a screw (26), and each screw (26) passes through the interior of each rotating tube (25) and is fixedly connected to the surface of each diversion suction cup (13).

3. The automatic wafer swinging device according to claim 2, characterized in that: The left sides of the suction cup 1 (24) and the diversion suction cup (13) are both attached with a sealing ring (11), and the sealing ring (11) is tightly fitted to the right side surface of the wafer body (3) as a movable part.

4. The automatic wafer swinging device according to claim 1, characterized in that: The movable component includes a connecting plate (14), the right side of the connecting plate (14) is fixedly connected to the movable rod of the electric push rod (9), and the left side of the connecting plate (14) is fixedly connected to the sleeve (8), a contact block (16) is fixedly installed on the bottom of the sleeve (8), and a support frame (15) is fixedly installed on the top of the movable frame (2) on the right side of the opening (17).

5. The automatic wafer swinging device according to claim 4, characterized in that: The bottom of the contact block (16) is provided with an inclined surface 1, and a plurality of ball bearings 2 (20) are installed in a rolling manner inside the inclined surface 1. The two side surfaces of the support frame (15) are both provided with inclined surfaces 2, and the ball bearings 2 (20) are in contact with the inclined surface 2 on the left side of the support frame (15).

6. The automatic wafer swinging device according to claim 5, characterized in that: A baffle (18) is fixedly mounted on the top of the movable frame (2) on the left side of the opening (17), and the baffle (18) is fitted with the bottom right side of the wafer body (3).

7. The automatic wafer swinging device according to claim 6, characterized in that: A top block (10) is fixedly mounted on the top of the connecting plate (14), and a stop block (27) is fixedly mounted on the fixing frame (7). The stop block (27) is located on the left side of the top block (10) and corresponds to each other.

8. The automatic wafer swinging device according to claim 7, characterized in that: A plurality of balls (19) are provided on both sides of the interior of the opening (17).

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