Polytetrafluoroethylene coating for grinding and polishing semiconductors and preparation device of polytetrafluoroethylene coating

Abstract

The invention relates to the technical field of semiconductor grinding, in particular to a polytetrafluoroethylene coating for grinding and polishing a semiconductor and a preparation device of the polytetrafluoroethylene coating. 5 parts of modified graphene; 12 parts of epoxy resin; through three-stage cooperative processing of double-rotating-shaft linkage smashing, conical base pre-grinding and dynamic grinding disc fine polishing, full-process efficient machining of a semiconductor material from coarse smashing to precise polishing is achieved, the grinding efficiency is improved, meanwhile, material loss caused by multi-device conversion is avoided, and the grinding efficiency is improved. The grinding disc made of the carbon fiber reinforced PTFE composite material has metal-grade strength and non-metal characteristics, metal ion pollution is thoroughly eliminated, meanwhile, the dynamic stability of the grinding cylinder during high-speed rotation is ensured through a bolt and circular groove rapid locking mechanism, batch discharging of semiconductors is achieved by supporting one-key unlocking, and the machining efficiency of the preparation device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of semiconductor grinding, in particular to a polytetrafluoroethylene coating for semiconductor grinding and polishing and a preparation device thereof. BACKGROUND

[0002] As a material, a semiconductor has a conductivity between that of a conductor and that of an insulator, wherein the semiconductor material comprises polytetrafluoroethylene, which is also known as Teflon. In order to produce a grinding disc made of Teflon material, the semiconductor Teflon material needs to be ground and crushed during production and processing, and thus a corresponding preparation device is needed.

[0003] The prior art discloses a patent with the application number CN202121759854.X, a grinding and crushing device for semiconductor material production and processing, which comprises a workbench, the upper end surface of the workbench is fixedly connected with a vertical rod, the upper end of the vertical rod is fixedly connected with a fixed top frame, the upper end of the fixed top frame is fixedly installed with a hydraulic cylinder, the output end of the hydraulic cylinder is fixedly connected with an upper grinding disc, the lower end surface of the workbench is fixedly connected with a lower fixed frame, the middle part of the lower fixed frame is fixedly installed with an electric motor, and the workbench is rotatably connected with a connecting cylinder through a bearing, the upper end of the connecting cylinder is fixedly connected with a lower grinding disc.

[0004] Although the above device can mechanically operate grinding and crushing, the above device usually uses a grinding disc to perform grinding operation, at this time, the existing grinding disc is mostly made of cast iron or other metal materials, and long-time grinding will increase the metal particles carried by the semiconductor during grinding, and the strength of the semiconductor Teflon material itself will also increase the difficulty of grinding, thereby affecting the grinding effect of the preparation device. SUMMARY

[0005] The purpose of the present application is to provide a polytetrafluoroethylene coating for semiconductor grinding and polishing and a preparation device thereof to solve the problems raised in the background art.

[0006] The purpose of the present application can be achieved by the following technical solutions: A polytetrafluoroethylene coating for semiconductor grinding and polishing, the polytetrafluoroethylene coating is composed of the following components in mass fraction: Polytetrafluoroethylene emulsion: 40 parts; Modified graphene: 5 parts; Epoxy resin: 12 parts; Solvent: 15 parts.

[0007] The present application also provides a preparation device for a polytetrafluoroethylene coating for semiconductor grinding and polishing, comprising: The bottom plate 1, the upper side of the bottom plate 1 is fixedly connected with a U-shaped seat 2, the upper side of the U-shaped seat 2 is rotatably connected with a rotating shaft one 3, the lower side of the rotating shaft one 3 is fixedly connected with a circular seat 4, the inside of the circular seat 4 is clamped with a grinding cylinder 5, the bottom end of the inside of the processing cylinder 10 is arrayed connected with a grinding block two 9, the upper side of the bottom plate 1 is fixedly connected with two symmetrically arranged processing cylinders 10, the top of the inside of the two processing cylinders 10 is rotatably connected with a rotating shaft two 11, the outer surface of the two rotating shafts two 11 is arrayed connected with a lower inclined blade 12 and an upper inclined blade 13; The outer surface of the two rotating shafts two 11 is fixedly connected with a conical seat 14 and a rolling seat 15, the outer surface of the conical seat 14 is arrayed connected with a grinding block three 16, the inner wall of the processing cylinder 10 is arrayed connected with a grinding block four 17; The grinding mechanism, the grinding mechanism includes a grinding disc 6 located above the grinding cylinder 5, the outer surface of the grinding disc 6 is arrayed connected with a ball 7, the lower side of the grinding disc 6 is arrayed connected with a grinding block one 8, the grinding mechanism, the grinding block two 9, the grinding block three 16 and the grinding block four 17 are all made of carbon fiber reinforced PTFE composite material.

[0008] Preferably, the upper side of the processing cylinder 10 is fixedly connected with an L-shaped top plate 23, the upper side of the rotating shaft two 11 penetrates through the processing cylinder 10 and extends to the upper side of the L-shaped top plate 23, the outer surface of the two rotating shafts two 11 is fixedly connected with a chain wheel 25, the upper side of one of the two rotating shafts two 11 is fixedly connected with a second servo motor 24, and the chain wheel 25 is sleeved between the two chain wheels 25.

[0009] Preferably, the lower side of the two processing cylinders 10 is fixedly connected with a discharging pipe 27 in communication with the processing cylinder 10, a valve 29 is arranged on the two discharging pipes 27, an extension pipe 28 is slidingly clamped on one side of the two discharging pipes 27, and the upper side of the two processing cylinders 10 is fixedly connected with a feeding port 26 in communication with the processing cylinder 10.

[0010] Preferably, the lower side of the rotating shaft one 3 penetrates through the U-shaped seat 2 and extends to the top end inside the U-shaped seat 2, the lower side of the rotating shaft one 3 is fixedly connected with a driven gear 18, the upper side of the bottom plate 1 is fixedly connected with an L-shaped plate 19, one side of the L-shaped plate 19 is rotatably connected with a rotating shaft three 20, the upper side of the rotating shaft three 20 is fixedly connected with a driving gear 21 engaged with the driven gear 18, the other side of the L-shaped plate 19 is fixedly connected with a first servo motor 22, and the output shaft of the first servo motor 22 is fixedly connected with the rotating shaft three 20.

[0011] Preferably, the upper side of the bottom plate 1 is fixedly connected with a support plate 55, the upper side of the support plate 55 is fixedly connected with a U-shaped plate 56, the inside of the U-shaped plate 56 is rotatably connected with a lead screw one 57, the lead screw one 57 is provided with a lead screw sleeve 32 matched with the lead screw one 57, the lower side of the lead screw sleeve 32 is fixedly connected with a U-shaped frame 33, the lower side of the U-shaped frame 33 is clamped with two fixed blocks 34, and one side of the two fixed blocks 34 is fixedly connected with the grinding disc 6.

[0012] Preferably, the inside of the U-shaped plate 56 is fixedly connected with a limiting rod 30, the inside of the lead screw sleeve 32 is slidably arranged on the outer surface of the limiting rod 30, the upper side of the U-shaped plate 56 is fixedly connected with a third servo motor 31, and the output shaft of the third servo motor 31 is fixedly connected with the lead screw 57.

[0013] Preferably, one side of each of the two fixed blocks 34 is clamped with a plug post 35, one side of the plug post 35 penetrates through the U-shaped frame 33 and extends to the other side of the fixed block 34, one end of each of the two fixed blocks 34 is clamped with a clamping plate 36, one side of the clamping plate 36 penetrates through the U-shaped frame 33 and extends to the other end of the fixed block 34, and the upper side of each of the two clamping plates 36 is clamped with two plugs 37.

[0014] Preferably, the lower side of the grinding cylinder 5 is arrayed with a cylinder 38, the lower side of the cylinder 38 penetrates through the circular seat 4 and extends to the lower side of the circular seat 4, one side of the cylinder 38 is provided with a circular groove 39, the lower side of the circular seat 4 is arrayed with a connecting plate 66, one side of the connecting plate 66 is threadedly connected with a bolt 67, one side of the bolt 67 penetrates through the connecting plate 66 and extends to the other side of the connecting plate 66, and one side of the bolt 67 is clamped into the inside of the circular groove 39.

[0015] Preferably, the grinding block three 16 and the grinding block four 17 are staggered, the grinding block one 8 and the grinding block two 9 are staggered, the lower inclined blade 12 and the upper inclined blade 13 are symmetrically arranged, and the rolling seat 15 is located below the conical seat 14.

[0016] The beneficial effects of the present application are as follows: 1. The present application realizes efficient processing of the whole process from rough crushing to precision polishing of semiconductor materials through three-level collaborative processing of double-rotating shaft linkage crushing, conical seat pre-grinding and dynamic grinding disc fine polishing, improves grinding efficiency, and avoids material loss caused by multi-device conversion.

[0017] 2. The present application adopts a carbon fiber reinforced PTFE composite grinding disc, which has metal-level strength and non-metal characteristics, completely eliminates metal ion pollution, and a bolt and circular groove quick locking mechanism ensures the dynamic stability of the grinding cylinder during high-speed rotation, and supports one-key unlocking to realize batch unloading of semiconductor materials, thereby improving the processing efficiency of the preparation device.

[0018] 3. The present application adopts a bolt-free fixing structure of plug posts and clamping plates to conveniently assemble and disassemble the grinding disc, and then reversely retreats the lead screw to drive the grinding disc away from the grinding cylinder, and then pulls out the plug posts, plugs and clamping plates to complete the disassembly of the grinding disc, thereby saving the time of assembly and disassembly compared with the traditional bolt fixing mode. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments or prior art description, and obviously, other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings. Figure 1 is a schematic diagram of the overall structure of the present application; Figure 2 is Figure 1 is a schematic diagram of the installation of the second rotating shaft and the chain wheel; Figure 3 is Figure 2 is a schematic diagram of the structure of the conical seat, the third grinding block and the fourth grinding block; Figure 4 is Figure 1 is a schematic diagram of the structure of the grinding disc and the spherical ball; Figure 5 is Figure 4 is a schematic diagram of the structure of the grinding disc and the first grinding block; Figure 6 is Figure 1 is a schematic diagram of the installation of the circular seat and the grinding cylinder; Figure 7 is Figure 1 is a schematic diagram of the structure of the grinding cylinder and the second grinding block; Figure 8 is Figure 7 is a schematic diagram of the installation of the driven gear and the driving gear.

[0020] The reference signs in the drawings are as follows: 1, base plate; 2, U-shaped seat; 3, first rotating shaft; 4, circular seat; 5, grinding cylinder; 6, grinding disc; 7, spherical ball; 8, first grinding block; 9, second grinding block; 10, processing cylinder; 11, second rotating shaft; 12, lower inclined blade; 13, upper inclined blade; 14, conical seat; 15, rolling seat; 16, third grinding block; 17, fourth grinding block; 18, driven gear; 19, L-shaped plate; 20, third rotating shaft; 21, driving gear; 22, first servo motor; 23, L-shaped top plate; 24, second servo motor; 25, chain wheel; 26, feeding inlet; 27, discharging pipe; 28, extended circular pipe; 29, valve; 30, limiting rod; 31, third servo motor; 32, screw sleeve; 33, U-shaped frame; 34, fixed block; 35, insertion column; 36, clamping plate; 37, bolt; 38, cylinder; 39, circular groove; 55, support plate; 56, U-shaped plate; 57, first screw; 66, connecting plate; 67, bolt. DETAILED DESCRIPTION

[0021] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present application.

[0022] A polytetrafluoroethylene coating for semiconductor grinding and polishing, as shown, is composed of the following components in mass fraction: Figures 1-8 Polytetrafluoroethylene emulsion: 40 parts; Modified graphene: 5 parts; Epoxy resin: 12 parts; Solvent: 15 parts.

[0023] The present application also provides a preparation device for a polytetrafluoroethylene coating for semiconductor grinding and polishing, comprising: The bottom plate 1 is fixedly connected with the U-shaped seat 2 on the upper side, the U-shaped seat 2 is rotatably connected with the first rotating shaft 3 on the upper side, the first rotating shaft 3 is fixedly connected with the circular seat 4 on the upper side, the grinding cylinder 5 is clamped in the circular seat 4, the grinding block two 9 is arrayed and connected at the bottom end in the processing cylinder 10, the two processing cylinders 10 are fixedly connected with the bottom plate 1 on the upper side, the two processing cylinders 10 are rotatably connected with the second rotating shaft 11 at the top end, and the lower inclined blade 12 and the upper inclined blade 13 are arrayed and connected on the outer surface of the two second rotating shafts 11. The outer surface of the two second rotating shafts 11 is fixedly connected with the conical seat 14 and the rolling seat 15, and the semiconductor in the processing cylinder 10 can be fully ground by the installation and use of the conical seat 14 and the rolling seat 15, and the grinding effect is improved. The outer surface of the conical seat 14 is arrayed and connected with the grinding block three 16, and the inner wall of the processing cylinder 10 is arrayed and connected with the grinding block four 17. The grinding mechanism includes the grinding disc 6 above the grinding cylinder 5, the outer surface of the grinding disc 6 is arrayed and connected with the spherical ball 7, the spherical ball 7 can also play a role in grinding the semiconductor by arraying and distributing the spherical ball 7, and the grinding disc 6 is arrayed and connected with the grinding block one 8 on the lower side. The grinding mechanism, the grinding block two 9, the grinding block three 16 and the grinding block four 17 are all made of carbon fiber reinforced PTFE composite material.

[0024] The upper side of the processing cylinder 10 is fixedly connected with the L-shaped top plate 23, the upper side of the second rotating shaft 11 penetrates through the processing cylinder 10 and extends to the upper side of the L-shaped top plate 23, the outer surface of the two second rotating shafts 11 is fixedly connected with the chain wheel 25, the upper side of one of the two second rotating shafts 11 is fixedly connected with the second servo motor 24, and the chain wheel 25 is sleeved between the two chain wheels 25.

[0025] ​The lower sides of the two processing cylinders 10 are fixedly connected with a discharge pipe 27 that is connected to the processing cylinder 10. Valves 29 are provided on the two discharge pipes 27. The valves 29 can be used to control the discharge of semiconductors in the processing cylinder 10 to facilitate secondary grinding. An extension circular tube 28 is slidably connected to one side of the two discharge pipes 27, and the upper sides of the two processing cylinders 10 are fixedly connected with a feed port 26 that is connected to the processing cylinder 10.

[0026] The lower side of the rotating shaft 3 passes through the U-shaped seat 2 and extends to the top inside the U-shaped seat 2. The lower side of the rotating shaft 3 is fixedly connected to the driven gear 18, and the upper side of the base plate 1 is fixedly connected to the L-shaped plate 19. One side of the L-shaped plate 19 is rotatably connected to the rotating shaft three 20. The upper side of the rotating shaft three 20 is fixedly connected to the driving gear 21 that meshes with the driven gear 18. The other side of the L-shaped plate 19 is fixedly connected to the first servo motor 22. The output shaft of the first servo motor 22 is fastened to the rotating shaft three 20.

[0027] The upper side of the base plate 1 is fixedly connected to a support plate 55, and the upper side of the support plate 55 is fixedly connected to a U-shaped plate 56. The inside of the U-shaped plate 56 is rotatably connected to a screw 1 57, and a screw sleeve 32 adapted to the screw 1 57 is provided on the screw 1 57. The lower side of the screw sleeve 32 is fixedly connected to a U-shaped frame 33, and two fixed blocks 34 are clamped on the lower side of the U-shaped frame 33. One side of the two fixed blocks 34 is fastened to the grinding disc 6.

[0028] The interior of the U-shaped plate 56 is fixedly connected to the limit rod 30, and the interior of the screw sleeve 32 is slidably placed on the outer surface of the limit rod 30. The limit rod 30 can be used to limit and guide the moving trajectory of the screw sleeve 32, so that the screw sleeve 32 can drive the grinding disc 6 to move up and down smoothly for grinding and polishing. The upper side of the U-shaped plate 56 is fixedly connected to the third servo motor 31, and the output shaft of the third servo motor 31 is fastened to the screw 1 57. The model of the servo motor is SMBL-60P.

[0029] One side of the two fixing blocks 34 is clamped with a column 35, one side of the column 35 passes through the U-shaped frame 33 and extends to the other side of the fixing block 34, one end of the two fixing blocks 34 is clamped with a clamping plate 36, one side of the clamping plate 36 passes through the U-shaped frame 33 and extends to the other end of the fixing block 34, and the upper side of the two clamping plates 36 are clamped with two pins 37.

[0030] The lower array of the grinding cylinder 5 is connected to a cylinder 38, the lower side of the cylinder 38 passes through the round seat 4 and extends to the lower side of the round seat 4, a circular groove 39 is opened on one side of the cylinder 38, and the lower array of the round seat 4 is connected to a connecting plate 66, one side of the connecting plate 66 is threadedly connected to a bolt 67, one side of the bolt 67 passes through the connecting plate 66 and extends to the other side of the connecting plate 66, and one side of the bolt 67 is clamped and placed inside the circular groove 39.

[0031] The grinding blocks three 16 and the grinding blocks four 17 are staggered between the grinding blocks one 8 and the grinding blocks two 9, the lower inclined blades 12 and the upper inclined blades 13 are symmetrically arranged, and the rolling seats 15 are below the conical seats 14.

[0032] In use, the present application can provide ultra-low friction coefficient and chemical inertness by using the polytetrafluoroethylene emulsion, the modified graphene enhances the interface bonding with the polytetrafluoroethylene emulsion, and the thermal conductivity and mechanical strength are improved, the epoxy resin improves the adhesion of the polytetrafluoroethylene emulsion and the coating, and the compactness of the coating is improved, and then the solvent regulates the rheological properties, ensures the uniform dispersion of each component and the coating process, so as to improve the strength of the grinding disc 6 during grinding, then the second servo motor 24 is started, the output shaft of the second servo motor 24 drives the second rotating shaft 11 to rotate, and then the chain wheel 25 and the chain are used, so that the two rotating shafts 11 can rotate together, and then the semiconductor to be ground is put into the inside of the two processing barrels 10 along the inlet 26, so that the lower inclined blades 12 and the upper inclined blades 13 on the two rotating shafts 11 can crush larger semiconductors, and then the grinding blocks three 16 at the conical seats 14 and the grinding blocks four 17 on the inner wall of the processing barrels 10 cooperate to cross-rolling grind the semiconductors for pretreatment grinding and polishing of the semiconductors; Then the valve 29 is opened, the semiconductor is put into the inside of the grinding barrel 5 from the discharge pipe 27 and the extension pipe 28, then the two extension pipes 28 are retracted, the third servo motor 31 is started, the output shaft of the third servo motor 31 drives the lead screw 57 to rotate, so that the lead screw sleeve 32 on the lead screw 57 can drive the grinding disc 6 to enter the inside of the grinding barrel 5, then the first servo motor 22 is started, the output shaft of the first servo motor 22 drives the driving gear 21 on the third rotating shaft 20 to rotate, at this time the driving gear 21 can drive the rotating shaft 3 at the driven gear 18 to rotate, so that the grinding barrel 5 can rotate to realize the secondary grinding and polishing of the semiconductor by the grinding disc 6, so that the grinding disc 6 and the grinding blocks two 9 in the grinding barrel 5 can cross-grind the semiconductor again, so that the grinding disc 6 can fully and uniformly grind the flowing semiconductor, and the grinding disc 6 composed of carbon fiber reinforced PTFE composite material has a strength close to that of metal material, which can effectively avoid the generation of additional metal particles during the grinding and polishing process of the semiconductor, and can effectively ensure the cleanliness of the surface of the semiconductor and improve the grinding effect of the preparation device. By clamping the grinding cylinder 5 to the upper side of the round seat 4, the cylinder 38 at the grinding cylinder 5 is also clamped to the inside of the round seat 4 and extends below the round seat 4, then turn the bolt 67 in sequence, so that the bolt 67 can be clamped into the circular groove 39 of the cylinder 38, so as to firmly clamp and position the grinding cylinder 5, ensure the stability of the grinding cylinder 5 during installation, when the ground semiconductor in the grinding cylinder 5 needs to be taken out, the bolt 67 can be turned in the opposite direction to make the bolt 67 away from the circular groove 39 to release the positioning of the grinding cylinder 5, then lift the grinding cylinder 5, for one-time removal of all semiconductors, improve the preparation efficiency of the preparation device; By letting the output shaft of the third servo motor 31 drive the lead screw one 57 to rotate in the opposite direction, the lead screw sleeve 32 on the lead screw one 57 can drive the grinding disc 6 to move upwards and away from the grinding cylinder 5, then pull out the two insertion columns 35 and the four insertion pins 37 in sequence, and then take out the two clamping plates 36, so as to separate the two fixing blocks 34 and the U-shaped frame 33, so as to conveniently disassemble the grinding disc 6, the clamping mode of the insertion column 35 and the clamping plate 36 can facilitate the quick assembly and disassembly of the grinding disc 6, improve the assembly efficiency of the grinding disc 6, without using the fixing mode of the bolt 67, saving time and labor cost.

[0033] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above embodiments, the above embodiments and descriptions in the specification are only to illustrate the principles of the present application, without departing from the spirit and scope of the present application, the present application can have various changes and improvements, these changes and improvements all fall within the scope of the claimed present application.

Claims

1. A polytetrafluoroethylene coating for semiconductor grinding and polishing, characterized in that: The polytetrafluoroethylene coating is composed of the following components in parts by mass: Polytetrafluoroethylene emulsion: 40 parts; Modified graphene: 5 parts; Epoxy resin: 12 parts; Solvent: 15 parts.

2. A device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing, wherein the device is used to grind and prepare the polytetrafluoroethylene coating for semiconductor grinding and polishing as claimed in claim 1, characterized in that: include: A bottom plate (1), wherein the upper side of the bottom plate (1) is fixedly connected to a U-shaped seat (2), the upper side of the U-shaped seat (2) is rotatably connected to a rotating shaft (3), the upper side of the rotating shaft (3) is fixedly connected to a round seat (4), a grinding cylinder (5) is clamped inside the round seat (4), the bottom end of the inside of the processing cylinder (10) is connected to a second grinding block (9) in an array, the upper side of the bottom plate (1) is fixedly connected to two symmetrically arranged processing cylinders (10), the top ends of the insides of the two processing cylinders (10) are both rotatably connected to a second rotating shaft (11), and the outer surfaces of the two second rotating shafts (11) are both connected in an array to a lower inclined blade (12) and an upper inclined blade (13); The outer surfaces of the two rotating shafts (11) are fixedly connected to a conical seat (14) and a grinding seat (15); the outer surface of the conical seat (14) is connected to a grinding block (16) in an array; the inner wall of the processing cylinder (10) is connected to a grinding block (17) in an array; The grinding mechanism comprises a grinding disc (6) located above the grinding cylinder (5), an outer surface array of the grinding disc (6) is connected to balls (7), and a lower side array of the grinding disc (6) is connected to grinding block 1 (8), and the grinding mechanism, grinding block 2 (9), grinding block 3 (16) and grinding block 4 (17) are all made of carbon fiber reinforced PTFE composite materials.

3. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 2, characterized in that: The upper side of the treatment cylinder (10) is fixedly connected to an L-shaped top plate (23), the upper side of the second rotating shaft (11) passes through the treatment cylinder (10) and extends to the upper side of the L-shaped top plate (23), the outer surfaces of the two second rotating shafts (11) are fixedly connected to sprockets (25), the upper side of one of the second rotating shafts (11) is fixedly connected to a second servo motor (24), and a sprocket (25) is sleeved between the two sprockets (25).

4. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 3, characterized in that: The lower sides of the two processing cylinders (10) are fixedly connected to a feed pipe (27) communicating with the processing cylinder (10), and the two feed pipes (27) are provided with a valve (29). One side of the two feed pipes (27) is slidably connected to an extension circular tube (28), and the upper sides of the two processing cylinders (10) are fixedly connected to a feed port (26) communicating with the processing cylinder (10).

5. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 2, characterized in that: The lower side of the rotating shaft 1 (3) passes through the U-shaped seat (2) and extends to the top of the U-shaped seat (2). The lower side of the rotating shaft 1 (3) is fixedly connected to the driven gear (18). The upper side of the bottom plate (1) is fixedly connected to the L-shaped plate (19). One side of the L-shaped plate (19) is rotatably connected to the rotating shaft 3 (20). The upper side of the rotating shaft 3 (20) is fixedly connected to the driving gear (21) meshing with the driven gear (18). The other side of the L-shaped plate (19) is fixedly connected to the first servo motor (22). The output shaft of the first servo motor (22) is tightly connected to the rotating shaft 3 (20).

6. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 2, characterized in that: The upper side of the base plate (1) is fixedly connected to a support plate (55), the upper side of the support plate (55) is fixedly connected to a U-shaped plate (56), the interior of the U-shaped plate (56) is rotatably connected to a lead screw (57), the lead screw (57) is provided with a lead screw sleeve (32) adapted to the lead screw (57), the lower side of the lead screw sleeve (32) is fixedly connected to a U-shaped frame (33), the lower side of the U-shaped frame (33) is clamped with two fixed blocks (34), and one side of the two fixed blocks (34) is fastened to the grinding disc (6).

7. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 6, characterized in that: The interior of the U-shaped plate (56) is fixedly connected to the limit rod (30), the interior of the lead screw sleeve (32) is slidably placed on the outer surface of the limit rod (30), the upper side of the U-shaped plate (56) is fixedly connected to the third servo motor (31), and the output shaft of the third servo motor (31) is tightly connected to the lead screw (57).

8. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 6, characterized in that: One side of the two fixed blocks (34) is clamped with a plug post (35), one side of the plug post (35) passes through the U-shaped frame (33) and extends to the other side of the fixed block (34), one end of the two fixed blocks (34) is clamped with a card plate (36), one side of the card plate (36) passes through the U-shaped frame (33) and extends to the other end of the fixed block (34), and the upper sides of the two card plates (36) are clamped with two latches (37).

9. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 2, characterized in that: The lower array of the grinding cylinder (5) is connected to a cylinder (38), the lower side of the cylinder (38) passes through the round seat (4) and extends to the lower side of the round seat (4), a circular groove (39) is opened on one side of the cylinder (38), and the lower array of the round seat (4) is connected to a connecting plate (66), one side of the connecting plate (66) is threadedly connected to a bolt (67), one side of the bolt (67) passes through the connecting plate (66) and extends to the other side of the connecting plate (66), and one side of the bolt (67) is clamped and placed inside the circular groove (39).

10. The device for preparing a polytetrafluoroethylene coating for semiconductor grinding and polishing according to claim 2, characterized in that: The grinding blocks 3 (16) and 4 (17) are staggered, the grinding blocks 1 (8) and 2 (9) are staggered, the lower inclined blades (12) and the upper inclined blades (13) are symmetrically arranged, and the rolling seat (15) is located below the conical seat (14).

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