Vapor chamber circular hole heat pipe heat conduction structure and enhanced backflow method

Abstract

The invention relates to a uniform temperature plate circular hole heat pipe heat conduction structure and an enhanced backflow method, and belongs to the technical field of uniform temperature plates, the uniform temperature plate circular hole heat pipe heat conduction structure comprises a uniform temperature plate body in which a cavity is arranged, the uniform temperature plate is characterized in that the cavity is a circular cavity, a plurality of raised lines are uniformly arranged on the circumferential inner wall of the circular cavity, and the raised lines are arranged in the cavity. The convex strips are matched with the cavity wall of the circular cavity to form a plurality of capillary grooves distributed around the circumferential inner wall, the circular cavity is free of sharp corners, local stress concentration caused by steam pressure is avoided, compression strength and deformation resistance are remarkably improved, and long-term reliability of the uniform-temperature plate under high-heat loads is guaranteed. The convex strips are evenly arranged along the circumference and matched with the arc-shaped cavity wall to form capillary grooves without dead angles, the problems that capillary force of corner areas of a square cavity is weakened, and working media cannot flow smoothly are thoroughly solved, under the same projection area, the perimeter-area ratio of a circular cavity is better than that of a rectangular cavity, the inner surface area is increased, and the heat exchange efficiency is remarkably improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of vapor chamber, and particularly relates to a vapor chamber round-hole heat pipe heat conduction structure and a method for strengthening backflow. BACKGROUND

[0002] At present, a vapor chamber generally comprises a vapor chamber body, which is internally processed with a square cavity. In order to enhance the capillary backflow capacity of a working medium and improve the heat transfer efficiency, parallel ridges with the same height are arranged on the inner walls of the upper and lower sides of the square cavity. These ridges and the straight wall surface of the square cavity cooperatively form a plurality of capillary groove structures extending along the length direction of the cavity. The main purpose of this design is to drive the working liquid to circulate efficiently between the evaporation end and the condensation end by using the capillary structure formed by the ridges and the cavity wall, so as to realize the rapid diffusion of heat.

[0003] However, the above design based on the square cavity structure has some inherent limitations. First, when the square cavity bears internal steam pressure, stress concentration phenomenon is prone to occur at the sharp corner regions of the square cavity, which limits the overall pressure resistance and deformation resistance of the cavity structure, and further affects the long-term working reliability and the upper limit of the maximum bearing temperature of the vapor chamber under high heat load or extreme temperature conditions. Second, the capillary groove structure formed by the straight wall and the ridges in the square cavity has an unsatisfactory groove distribution and form in the corner regions of the cavity, which may cause local capillary force to weaken or the working medium to flow poorly, thereby limiting the further improvement of the overall heat exchange efficiency. In addition, the geometric characteristics of the square cavity itself may limit the optimization of the effective heat exchange area under the same projected area. Therefore, how to design a new type of vapor chamber cavity structure to significantly improve the pressure resistance, temperature bearing capacity and heat exchange efficiency of the vapor chamber, especially to overcome the stress concentration at the corners of the square cavity, optimize the uniformity of the capillary structure distribution and maximize the effective heat exchange area, so as to meet the heat dissipation requirements of electronic devices with higher power density, has become a technical problem to be solved at present. For this purpose, a vapor chamber round-hole heat pipe heat conduction structure and a method for strengthening backflow are proposed. SUMMARY

[0004] In order to solve the problems of insufficient pressure resistance, uneven capillary structure distribution and limited effective heat exchange area of the existing square cavity vapor chamber caused by stress concentration, the present application provides a vapor chamber round-hole heat pipe heat conduction structure and a method for strengthening backflow.

[0005] The purpose of the present application can be achieved by the following technical solutions. A vapor chamber round-hole heat pipe heat conduction structure comprises a vapor chamber body, a cavity is arranged in the vapor chamber body, the cavity is a circular cavity, a plurality of ridges are uniformly arranged on the inner wall of the circumference of the circular cavity, and the ridges and the cavity wall of the circular cavity cooperatively form a plurality of capillary grooves distributed around the inner wall of the circumference.

[0006] As a further scheme of the present application, the overall thickness of the vapor chamber body is 5.5mm-6.5mm, and the length of the vapor chamber body is 100mm-103mm.

[0007] As a further scheme of the present application, the equivalent circle diameter of the capillary groove formed by the convex strip is 4.3mm-4.7mm.

[0008] As a further scheme of the present application, the distance between the centers of two adjacent circular cavities is 5.0mm-5.5mm.

[0009] As a further scheme of the present application, the number of the circular cavities is 18-20, and the circular cavities are linearly and uniformly arranged along the length direction of the vapor chamber body.

[0010] As a further scheme of the present application, the number of the convex strips is 19-21, and the width of the convex strip is greater than the width of the capillary groove.

[0011] A method for strengthening backflow of a vapor chamber circular hole heat pipe, comprising the following steps: S1: dividing the vapor chamber body into an evaporation zone, a transition zone and a condensation zone along the length direction, opening a first depth groove on the surface of the convex strip in the evaporation zone in a direction perpendicular to the axis of the circular cavity, then opening an auxiliary groove on the bottom wall of the capillary groove in communication with the first depth groove, opening a second depth groove on the bottom wall of the capillary groove and the surface of the convex strip in the transition zone to form a continuous wave-shaped flow channel, and opening a third depth groove on the bottom wall of the capillary groove in the condensation zone in a direction parallel to the axis of the circular cavity; S2: applying an external heat source to the evaporation zone to make heat conduct to the working medium through the cavity wall to promote the working medium to be heated and vaporized; S3: vapor phase change strengthening, controlling the vaporized working medium to flow to the condensation zone in a directional manner through the vapor space and synchronously releasing latent heat of vaporization; S4: condensation zone backflow triggering, guiding the liquefied working medium to flow back to the evaporation zone along the groove on the bottom wall of the capillary groove in the condensation zone; S5: using the capillary pressure and gravity to drive the liquid phase working medium to return to the evaporation zone to complete the cycle.

[0012] As a further scheme of the present application, the groove depth in the step S1 satisfies: the first depth groove>the second depth groove>the third depth groove.

[0013] As a further scheme of the present application, the directional flow of the vapor in the step S3 is accelerated through the wave-shaped flow channel in the transition zone, and the flow direction of the vapor is consistent with the included angle of the groove.

[0014] As a further scheme of the present application, the backflow in the condensation zone in the step S4 is guided through the third depth groove, and the backflow direction is in communication with the auxiliary groove in the evaporation zone.

[0015] The beneficial effects of the present application are: Through the design of the circular cavity structure, the sharp corners are completely eliminated, the local stress concentration caused by the steam pressure is avoided, the pressure resistance and the deformation resistance are significantly improved, and the long-term reliable operation of the vapor chamber under high heat load is ensured. The convex strips are evenly arranged along the circumference and cooperate with the arc-shaped cavity wall to form a dead corner-free capillary groove structure, completely solving the problem of weakening of capillary force in the corner area of the square cavity, realizing uniform wetting of the working medium in the whole area, and eliminating the flow dead angle. Under the same projection area, the inner surface area of the circular cavity is significantly increased, the effective heat exchange efficiency is greatly improved, and the precise parameter collaborative design makes the overall thickness and length match the size of the heat source, and the cavity spacing is accurately controlled. The number of heat distribution convex strips and the size of the capillary groove are optimized in linkage, the best groove wall area ratio is maintained, the working medium is covered without dead angle, and the heat flux density carrying capacity is significantly enhanced.

[0016] The partitioned groove strengthening reflux method opens deep grooves in the evaporation area to enhance the capillary suction force; the transition area wave flow channel directionally accelerates the steam flow; the condensation area parallel grooves guide the working medium to flow back quickly, forming a closed loop low resistance path. The steam flow direction cooperates with the groove shape, the reflux path is connected with the auxiliary groove in the evaporation area, and the circulation speed of the working medium is increased. Finally, on the basis of eliminating stress concentration, the synergistic effect of enhancing pressure resistance, reducing thermal resistance and improving temperature uniformity is achieved. Under the same power environment, the chip temperature is significantly reduced compared with the traditional square hole structure, and the service life is greatly extended through extreme temperature impact verification. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to facilitate the understanding of those skilled in the art, the present application will be further described below in conjunction with the drawings.

[0018] Figure 1 It is a schematic diagram of the overall structure of the vapor chamber circular hole heat pipe heat conduction structure of the present application. Figure 2 It is an overall size diagram of the vapor chamber circular hole heat pipe heat conduction structure of the present application. Figure 3 It is a flow chart of the vapor chamber circular hole heat pipe strengthening reflux method of the present application.

[0019] Legend: 1, vapor chamber body; 2, circular cavity; 3, convex strip; 4, capillary groove. DETAILED DESCRIPTION

[0020] In order to further illustrate the technical means and effects adopted by the present application to achieve the predetermined invention purpose, the specific embodiments, structures, features and effects according to the present application are described in detail as follows in conjunction with the drawings and preferred embodiments.

[0021] REFERENCE Figures 1-3The embodiment provides a heat conduction structure of a uniform temperature plate round hole heat pipe, which comprises a uniform temperature plate body 1, a cavity is arranged in the uniform temperature plate body 1, the cavity is a circular cavity 2, a plurality of convex strips 3 are uniformly arranged on the circumferential inner wall of the circular cavity 2, and the convex strips 3 and the cavity wall of the circular cavity 2 are matched to form a plurality of capillary grooves 4 distributed around the circumferential inner wall.

[0022] It should be noted that the sharp corners are eliminated by the circular shape, stress concentration is eliminated, pressure strength and deformation resistance are improved, the uniform temperature plate can bear higher temperature and heat load, the convex strips 3 are uniformly arranged along the circumference, the no-dead-corner capillary grooves 4 are formed in cooperation with the arc-shaped cavity wall, the working medium is uniformly wetted in the whole domain, flow dead angles are avoided, the inner surface area of the circular cavity 2 is increased compared with that of a square cavity under the same projection area, because the circular perimeter and area ratio are better than those of a rectangle, the demand of maximum effective heat exchange area is met, in addition, under the same power and environment, the chip temperature of the round hole structure is lower than that of the relative hole structure in actual tests.

[0023] The current uniform temperature plate usually comprises a uniform temperature plate body 1, a square cavity is processed in the uniform temperature plate body 1, in order to enhance the capillary return flow capacity of the working medium and improve the heat transfer efficiency, parallel convex strips 3 with the same height are arranged on the inner walls of the upper and lower sides of the square cavity, the convex strips 3 and the straight wall surface of the square cavity are matched to jointly form a plurality of capillary groove 4 structures extending along the length direction of the cavity, the main purpose of the design is to drive the working liquid to efficiently circulate between the evaporation end and the condensation end by using the capillary structure formed by the convex strips 3 and the cavity wall, so that the heat is quickly spread, however, the design based on the square cavity structure has some inherent limitations, first, when the square cavity bears internal steam pressure, stress concentration phenomenon is easily generated in the sharp corner area of the square cavity, the pressure strength and deformation resistance of the whole cavity structure are relatively limited, and then the long-term working reliability and the upper limit of the highest bearing temperature of the uniform temperature plate under high heat load or extreme temperature conditions are affected, secondly, the capillary groove 4 structure formed by the straight wall and the convex strips 3 in the square cavity has an ideal groove distribution and form in the corner area of the cavity, which may cause local capillary force to weaken or the working medium to flow poorly, thereby limiting the further improvement of the overall heat exchange efficiency, in addition, the geometric characteristics of the square cavity itself may also limit the optimization of the effective heat exchange area under the same projection area.

[0024] To solve the above problems, in the embodiment, by using the circular cavity 2 without sharp corners, the local stress concentration caused by steam pressure is avoided, the pressure resistance and deformation resistance are significantly improved, and the long-term reliability of the vapor chamber under high heat load is ensured; the convex strips 3 are uniformly arranged along the circumference and cooperate with the arc-shaped cavity wall to form a dead corner-free capillary groove 4, completely solving the problem of weak capillary force in the corner area of the square cavity and poor working fluid flow, and realizing uniform wetting and efficient working fluid circulation; under the same projected area, the circumference to area ratio of the circular cavity 2 is better than that of the rectangle, the inner surface area is increased, and the heat exchange efficiency is significantly improved.

[0025] In the above embodiment, in an embodiment, the overall thickness of the vapor chamber body 1 is 5.5mm-6.5mm, the length of the vapor chamber body 1 is 100mm-103mm, and the distance between the centers of the two adjacent circular cavities 2 is 5.0mm-5.5mm. The overall thickness of the vapor chamber body 1 is selected to be 6mm, the length of the vapor chamber body 1 is selected to be 101.8, and the center distance is selected to be 5.25mm, so as to ensure that the cavity wall thickness is sufficient to disperse the steam pressure, and at the same time the time interval is accurately matched with the size of the heat source, avoiding heat accumulation, as shown in Figure 2 The 6mm wall thickness ensures that the cavity can disperse the steam pressure and avoid stress concentration caused by thin walls, thereby improving the pressure resistance; the 5.25mm center distance accurately corresponds to the size of the heat source, avoiding heat accumulation caused by too small distance or incomplete heat coverage caused by too large distance, and the 101.8mm length and distance are linked to realize uniform arrangement of the cavities in limited space.

[0026] In order to better balance the working fluid return efficiency and heat flux density, in an embodiment, the equivalent circle diameter of the capillary groove 4 formed by the convex strip 3 is 4.3mm-4.7mm, and the equivalent circle diameter is selected to be 4.5mm here. The number of circular cavities 2 is 18-20, and the circular cavities 2 are linearly and uniformly arranged along the length direction of the vapor chamber body 1. The number of circular cavities 2 is limited by the length of the vapor chamber body 1. If the number of circular cavities 2 is less than 18, the heat distribution is uneven, and if the number of circular cavities 2 is more than 20, the processing is out of tolerance. 18-20 makes the single cavity projected area ≈5.5mm², and the heat flux density is optimal solution; here, the number of circular cavities 2 is taken as 19, as shown in Figure 2 The 4.5mm diameter takes into account the capillary force (too small increases the flow resistance) and working fluid coverage (too large weakens the capillary driving force), and 19 cavities realize single cavity projected area ≈5.5mm² under 101.8mm length, reaching the optimal solution of heat flux density. In addition, the number of convex strips 3 is 19-21, and the width of the convex strips 3 is greater than the width of the capillary groove 4. Here, the number of convex strips 3 is selected to be 20, as shown in Figure 2 The diameter of the capillary groove 4 is too small to increase the flow resistance, and too large to weaken the capillary force, so the number of convex strips 3 needs to be matched to maintain the working fluid coverage without dead corners.

[0027] In addition, it is particularly pointed out that any parameter out of range will break the balance, for example, the thickness is increased to 7mm, which needs to be expanded at the same time, the distance between the centers of the circular cavities 2 will be 5.0mm-5.5mm, otherwise stress concentration will occur, or the number of convex strips 3 is reduced to 18, which needs to be reduced, the groove diameter conflicts with the equivalent circle diameter of 4.3mm-4.7mm, otherwise the capillary force is insufficient, only by the overall implementation of the scale size as shown Figure 2 The stress concentration is eliminated, and the synergistic effect of pressure resistance improvement, heat resistance reduction, and actual temperature reduction is simultaneously achieved.

[0028] A method for strengthening the backflow of a uniform heat plate circular hole heat pipe, comprising the following steps: S1: The uniform heat plate body 1 is divided into an evaporation zone, a transition zone and a condensation zone along the length direction, a first depth groove is opened on the surface of the convex strip 3 in the evaporation zone along the direction perpendicular to the axis of the circular cavity 2, and then an auxiliary groove is opened on the bottom wall of the capillary groove 4 in communication with the first depth groove; a second depth groove is opened on the bottom wall of the capillary groove 4 and the surface of the convex strip 3 in the transition zone to form a continuous wave-shaped flow channel, and a third depth groove is opened on the bottom wall of the capillary groove 4 in the condensation zone along the direction parallel to the axis of the circular cavity 2; Wherein, the first depth groove is perpendicular to the axis, which increases the surface area of the convex strip 3 and promotes the vaporization of the working medium; the auxiliary groove provides additional capillary force on the bottom wall of the capillary groove 4 to ensure that the working medium is quickly vaporized and forms a steam flow; the wave-shaped flow channel in the transition zone, the second depth groove creates a continuous path to guide the steam to move directionally from the evaporation zone to the condensation zone, reducing flow resistance; the third depth groove is parallel to the axis to form a straight backflow channel in the condensation zone, which facilitates the return of liquefied working medium to the evaporation zone; through groove depth and direction control, the decoupling of steam flow and liquid backflow is realized, aiming to maximize the release of latent heat of vaporization and the speed of backflow; S2: An external heat source is applied to the evaporation zone to conduct heat to the working medium through the cavity wall to promote the vaporization of the working medium; by applying an external heat source to the evaporation zone, heat can be effectively conducted to the working medium through the cavity wall, which not only ensures uniform heating of the working medium, but also promotes the vaporization of the working medium in the evaporation zone, thereby improving the heat conduction efficiency; S3: Steam phase change strengthening, control the vaporization of working medium through the steam space to the condensation zone, synchronous release of latent heat of vaporization, steam phase change strengthening is to control the flow of vaporization working medium in the steam space, so that it flows directionally to the condensation zone, in this way, the steam will release the latent heat of vaporization in the flow process, which helps to improve the conversion efficiency of heat energy, and can reduce the energy loss of steam in the flow process; S4: Condensation zone backflow triggering, guiding the liquefied working medium in the condensation zone to flow along the groove on the bottom wall of the capillary groove 4 to the evaporation zone, which can ensure that the liquefied working medium can quickly and efficiently return to the evaporation zone. This backflow mechanism not only helps to maintain the stable vaporization of the working medium in the evaporation zone, but also reduces the energy loss of the liquefied working medium during the backflow process, thereby improving the overall heat transfer efficiency; S5: Using the action of capillary pressure and gravity to drive the liquid phase working medium to return to the evaporation zone to complete the cycle. Through the joint action of capillary pressure and gravity, the liquid phase working medium can be effectively driven to flow back to the evaporation zone, thereby realizing the circulation of the working medium in the heat spreader. This process ensures the continuous and stable operation of the system. First, it improves the thermal energy utilization efficiency and reduces energy waste. Second, it helps to maintain the temperature balance of the evaporation zone, transition zone and condensation zone, ensuring the stable performance of the entire heat spreader. This circulation method reduces the operation and maintenance cost of the system and improves the service life and reliability of the heat spreader.

[0029] It is worth mentioning that in the heat spreader, the working medium filled in the heat spreader needs to achieve efficient heat transfer during evaporation and condensation. If the capillary structure is not designed properly, the working medium flow path may not be clear and efficient, resulting in reduced heat transfer efficiency. In addition, low backflow efficiency means that the working medium cannot quickly flow back to the evaporation zone, which affects the overall heat dissipation performance. To address this issue, in S1, the heat spreader body 1 is divided into an evaporation zone, a transition zone and a condensation zone along the length, and grooves are opened in each zone: a first depth groove is opened on the surface of the convex strip 3 perpendicular to the axis of the circular cavity 2, an auxiliary groove is opened on the bottom wall of the capillary groove 4, a second depth groove is opened on the bottom wall of the capillary groove 4 and the surface of the convex strip 3, forming a continuous wave-shaped flow channel, and a third depth groove is opened on the bottom wall of the capillary groove 4 along the direction parallel to the axis of the circular cavity 2. This zoning grooving is based on the inherent defects of working medium flow in the background technology: in the traditional method, the working medium after vaporization in the evaporation zone tends to diffuse disorderly, resulting in low steam flow efficiency; and the liquid backflow in the condensation zone lacks a guiding path, causing backflow delay. Through the directional grooves and the depth differences of the grooves mentioned below, a directional flow channel is given in step S1. The evaporation zone grooves strengthen the capillary force to drive the initial vaporization, the transition zone wave-shaped flow channel guides the steam to accelerate, and the condensation zone grooves optimize the liquid backflow path. In short, by opening grooves of different depths in the evaporation zone, transition zone and condensation zone, a directional flow channel is formed, effectively controlling the flow of the working medium. The grooves in the evaporation zone strengthen the capillary force, which helps to drive the initial vaporization. The wave-shaped flow channel in the transition zone accelerates the steam flow. The grooves in the condensation zone optimize the liquid backflow path, reducing backflow delay. These designs make the working medium flow in the heat spreader more orderly and efficient, thereby improving the heat dissipation performance of the heat spreader.

[0030] The flow conflict problem caused by the uniform depth mainly occurs in the evaporation, transition and condensation regions. When the groove depths of the three regions are uniform, the capillary evaporation force of the evaporation region may be insufficient because the maximum depth is required to enhance the evaporation efficiency; at the same time, the steam acceleration of the transition region will be hindered because the depth is insufficient to ensure smooth flow; and the liquid backflow of the condensation region will also be affected because the depth is too large, which is not conducive to the preferential backflow of the liquid. This uniform depth will make the phase change process unable to be effectively controlled in different regions, resulting in a conflict between the flow requirements of the evaporation region and the condensation region: the evaporation region needs more steam generation, while the condensation region needs more liquid backflow. In order to solve this problem, in an embodiment, the groove depths in step S1 satisfy: first depth groove > second depth groove > third depth groove. The evaporation region needs the maximum depth to enhance the capillary evaporation force; the transition region has the second depth to ensure steam acceleration but not to hinder the flow; and the condensation region has the minimum depth to preferentially backflow the liquid, thereby controlling the phase change process through the depth difference, preferentially vaporizing in the evaporation region and preferentially condensing in the condensation region.

[0031] In the heat exchange system, steam is used as the heat transfer medium, and its flow state has an important influence on the heat exchange efficiency. The steam flow path may have inconsistent flow direction and speed due to the shape and size of the flow channel or the characteristics of the steam itself. When the steam enters the condensation region, if its flow is not uniform and directional, the steam will be concentrated in some local regions, while it is relatively sparse in other regions. This uneven distribution will cause the latent heat in some regions to be released in time and effectively, resulting in a decrease in heat exchange efficiency, and may also cause local overheating or subcooling, affecting the stable operation of the entire system. In order to avoid the problem of uneven release of latent heat caused by dispersed steam flow, in an embodiment, the steam directional flow through the transition region wave-shaped flow channel is accelerated, and the steam flow direction is consistent with the groove angle. The steam flow direction is consistent with the groove angle, and the wave-shaped flow channel is used for acceleration, which is derived from the optimization of fluid dynamics in the transition region. The wave-shaped flow channel reduces the flow resistance, ensures the directional flow of steam from the evaporation region to the condensation region at high speed, and avoids disordered diffusion.

[0032] In addition, there is an interruption or obstacle in the working medium flow channel between the condensation zone and the evaporation zone, so that the liquefied working medium cannot return to the evaporation zone smoothly. When the liquefied working medium in the condensation zone needs to return to the evaporation zone, if the return flow path is not smooth due to design or structural defects, such as insufficient groove depth or incomplete connection, the return flow path will be broken. This breakage will hinder the continuous flow of the liquid, causing a delay in the supply of working medium, which will reduce the thermal efficiency of the system and may affect the working performance of the entire device. In order to avoid the delay in the supply of working medium caused by the breakage of the return flow path, in an embodiment, the condensation zone return flow in step S4 is guided through a third depth groove, and the return flow direction is communicated with the auxiliary groove of the evaporation zone. The third depth groove of the condensation zone is communicated with the auxiliary groove of the evaporation zone, based on the continuity requirement of the liquid capillary return flow path, by creating a closed-loop return flow channel, to drive the liquefied working medium to return to the evaporation zone efficiently.

[0033] Working principle and working process of the present application: By setting multiple circular cavities 2 inside the uniform temperature plate body 1 instead of traditional square cavities, the arc-shaped inner walls of the circular cavities 2 are uniformly distributed with convex strips 3, and the convex strips 3 cooperate with the cavity walls to form a dead-angle-free capillary groove 4 around the inner wall. This design completely eliminates the stress concentration at sharp corners and significantly improves the pressure resistance. The circumferentially distributed capillary grooves 4 ensure uniform wetting of the working medium throughout the domain and avoid flow dead angles. Under the same projected area, the inner surface area of the circular cavity 2 increases, and the heat exchange efficiency is improved. Then, the uniform temperature plate body 1 is divided into an evaporation zone, a transition zone and a condensation zone along the length direction. First depth grooves are opened on the surface of the convex strips 3 in the evaporation zone in a direction perpendicular to the axis of the circular cavities 2, and then auxiliary grooves are opened on the bottom wall of the capillary grooves 4 and communicated with the first depth grooves. Second depth grooves are opened on the bottom wall of the capillary grooves 4 and the surface of the convex strips 3 in the transition zone, forming a continuous wave-shaped flow channel. Third depth grooves are opened on the bottom wall of the capillary grooves 4 in the condensation zone in a direction parallel to the axis of the circular cavities 2. When the external heat source acts on the evaporation area, heat is conducted to the working medium through the cavity wall, and the working medium is vaporized by heating in the evaporation area; this process enhances the capillary suction force through the first deep groove vertically opened on the surface of the evaporation area convex strip 3 and the auxiliary groove connected with the bottom wall of the capillary groove 4, greatly accelerates the vaporization efficiency, and the steam directional flow stage: the generated steam enters the transition area, and is guided by the wave-shaped flow channel to flow to the condensation area in a directional and accelerated manner, the steam flow direction is consistent with the included angle of the groove, reduces the turbulent loss and synchronously releases the latent heat of vaporization. Condensation and reflux stage: after the steam is liquefied into working medium liquid in the condensation area, it flows back along the third deep groove parallel to the axis of the cavity; the shallow groove preferentially guides the liquid flow, and the reflux path is connected with the auxiliary groove in the evaporation area to form a closed loop low resistance channel; combined with the capillary pressure and the action of gravity, the liquefied working medium returns to the evaporation area efficiently to complete the cycle, and the depth difference of the partition groove realizes vaporization and reflux, and the design of the groove direction ensures that the steam directional acceleration and the liquid preferential reflux path are separated, and finally the common effects of high-speed circulation of the working medium, significant reduction of thermal resistance and improvement of uniform temperature are achieved.

[0034] The above is only a preferred embodiment of the present application, and does not limit the present application in any form. Although the present application has been disclosed as above, it is not intended to limit the present application. Any person skilled in the art can make some changes or modifications to the above disclosed technical content to obtain equivalent embodiments with equivalent changes, without departing from the scope of the technical solution of the present application. Any modification, equivalent change and modification of the above embodiments made according to the technical essence of the present application, without departing from the technical solution content of the present application, are still within the scope of the technical solution of the present application.

Claims

1. A heat conducting structure of a heat evaporating plate with a circular hole heat pipe, comprising a heat evaporating plate body, wherein a cavity is provided in the heat evaporating plate body, characterized in that: The cavity is a circular cavity, and a plurality of convex strips are evenly arranged on the circumferential inner wall of the circular cavity. The convex strips cooperate with the cavity wall of the circular cavity to form a plurality of capillary grooves distributed around the circumferential inner wall.

2. The heat conducting structure of a heat evaporating plate with circular holes according to claim 1, characterized in that: The overall thickness of the temperature homogenizing plate body is 5.5 mm to 6.5 mm, and the length of the temperature homogenizing plate body is 100 mm to 103 mm.

3. The heat conducting structure of a heat evaporating plate with circular holes according to claim 1, characterized in that: The equivalent circular diameter of the capillary groove formed by the convex strip is 4.3 mm to 4.7 mm.

4. The heat conducting structure of a heat evaporating plate with circular holes according to claim 1, characterized in that: The distance between the centers of two adjacent circular cavities is 5.0 mm to 5.5 mm.

5. The heat conducting structure of a heat evaporating plate with circular holes according to claim 1, characterized in that: The number of the circular cavities is 18-20, and the circular cavities are linearly and evenly arranged along the length direction of the temperature homogenizing plate body.

6. The heat conducting structure of a heat evaporating plate with circular holes according to claim 1, characterized in that: The number of the convex strips is 19-21, and the width of the convex strips is greater than the width of the capillary grooves.

7. A method for enhancing reflux of a heat pipe with a circular hole in a temperature-vaporizing plate, based on a heat-conducting structure of a heat pipe with a circular hole in a temperature-vaporizing plate according to any one of claims 1 to 5, characterized in that: The following steps are involved: S1: Divide the vapor chamber body into an evaporation zone, a transition zone, and a condensation zone along its length. A first-depth groove is provided on the convex strip surface of the evaporation zone in a direction perpendicular to the axis of the circular cavity. An auxiliary groove is provided on the bottom wall of the capillary groove to communicate with the first-depth groove. A second-depth groove is provided on the bottom wall of the capillary groove and the convex strip surface of the transition zone to form a continuous wavy flow channel. A third-depth groove is provided on the bottom wall of the capillary groove in the condensation zone in a direction parallel to the axis of the circular cavity. S2: Apply an external heat source to the evaporation zone, so that the heat is transferred to the working fluid through the cavity wall, promoting the vaporization of the working fluid; S3: Steam phase change enhancement, controlling the directional flow of the vaporized substance through the steam space to the condensation zone, and simultaneously releasing the latent heat of vaporization; S4: Reflux triggering in the condensation zone guides the liquefied chemical in the condensation zone to reflux along the grooves on the bottom wall of the capillary groove to the evaporation zone; S5: Using the capillary pressure and gravity, the liquid phase working medium is driven back to the evaporation zone to complete the cycle.

8. The method for enhancing reflow of circular hole heat pipe with temperature homogenizing plate according to claim 7, characterized in that: The depth of the groove in step S1 satisfies: first depth groove>second depth groove>third depth groove.

9. The method for enhancing reflow of circular hole heat pipe with temperature homogenizing plate according to claim 7, characterized in that: In step S3, the steam directionally flows through the wavy flow channel in the transition zone to achieve acceleration, and the steam flow direction is consistent with the angle between the grooves.

10. The method for enhancing reflow of circular hole heat pipe with temperature homogenizing plate according to claim 7, characterized in that: In step S4, the reflux of the condensation zone is guided through the third depth groove, and the reflux direction is connected to the auxiliary groove of the evaporation zone.

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