Maintenance carrier, electron beam measurement assembly and semiconductor equipment

Abstract

The invention discloses a maintenance carrier, an electron beam measurement assembly and semiconductor equipment, relates to the technical field of semiconductor equipment, and is used for solving the technical problem that the maintenance of the semiconductor equipment in the prior art costs more manpower and time. The maintenance carrier comprises a movable base, a carrying seat, a plurality of air springs, a plurality of guide rods and a plurality of two-way speed regulating valves, wherein each air spring comprises an air inlet and an air outlet; the multiple air springs are all arranged between the base and the carrying seat. The multiple guide rods are arranged on the base at intervals and are all arranged in the lifting direction of the carrying base. A plurality of guide holes are formed in the carrying seat, and at least parts of the guide rods penetrate through the guide holes one by one; the two-way speed regulating valves and the air springs are arranged in a one-to-one correspondence mode, each two-way speed regulating valve comprises a first speed regulating valve part and a second speed regulating valve part, and the first speed regulating valve part is connected with the air inlet; and the second speed regulating valve part is connected with the air outlet.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a maintenance carrier, an electron beam measurement assembly, and a semiconductor equipment. BACKGROUND

[0002] Some semiconductor equipment (such as an electron beam measurement device) needs to work in a vacuum environment. This type of equipment is generally composed of an upper (vacuum) cavity and a lower cavity connected below the upper cavity. A moving table for exposing a silicon wafer is generally placed in the lower cavity, and the moving table is used to transport and accurately position a wafer. For example, in an electron beam measurement device, the moving table can accurately move the wafer in a three-dimensional space to accurately position the part to be measured within the measurement range of the electron beam to meet the high-precision measurement requirement.

[0003] Since the positioning accuracy of the moving table is crucial to semiconductor manufacturing, the accuracy of the moving table may decrease due to wear, loosening, and other reasons during long-term use. Therefore, the lower cavity needs to be removed from the upper cavity to maintain the moving table.

[0004] In the related art, four jacks are provided and are respectively supported on the bottom wall of the lower cavity. After the screws connecting the lower cavity and the upper cavity are removed, the jacks are lowered to move the lower cavity to a ground cow provided below. Then, the lower cavity is moved out by dragging the ground cow to achieve maintenance of the moving table. In this way, multiple maintenance personnel need to participate simultaneously, and the process of moving out the lower cavity is complex, resulting in a large amount of manpower and time spent on maintenance. SUMMARY

[0005] The present application discloses a maintenance carrier, an electron beam measurement assembly, and a semiconductor equipment to solve the technical problem of a large amount of manpower and time spent on maintenance of the semiconductor equipment in the related art.

[0006] Therefore, in a first aspect, the present application provides a maintenance carrier for transferring at least part of a semiconductor equipment, comprising: a movable base, a carrier seat, a plurality of air springs, a plurality of guide rods, and a plurality of bidirectional speed regulating valves. Each air spring comprises an air inlet and an air outlet. The plurality of air springs are arranged between the base and the carrier seat and are used to drive the carrier seat to ascend and descend relative to the carrier seat. The plurality of guide rods are arranged on the base and extend along the ascending and descending direction of the carrier seat. The carrier seat is provided with a plurality of guide holes, and at least part of the plurality of guide rods are arranged in the plurality of guide holes to enable the carrier seat to slide along the extension direction of the guide rods. The plurality of bidirectional speed regulating valves are arranged in one-to-one correspondence with the plurality of air springs. Each bidirectional speed regulating valve comprises a first speed regulating valve part and a second speed regulating valve part. The first speed regulating valve part is connected with the air inlet and is adapted to regulate the flow rate of the gas flowing into the air spring. The second speed regulating valve part is connected with the air outlet and is adapted to regulate the flow rate of the gas flowing out of the air spring.

[0007] Thus, the plurality of guide rods can constrain and support the carrier from multiple directions, and the plurality of guide rods can jointly act to disperse the lateral force, thereby effectively preventing the carrier from tilting or shaking and improving the stability of the carrier during lifting. Moreover, the maintenance carrier can adjust the opening degree of the speed regulating valve to change the gas flow rate according to the specific requirements of semiconductor device transfer, and then flexibly control the lifting speed of the carrier. Since the bidirectional speed regulating valve is an integrated component, the bidirectional speed regulating valve integrates the functions of adjusting the inlet and outlet gas flow rates. Compared with installing two independent speed regulating valves, it occupies less space, so that the overall structure of the maintenance carrier is more compact, facilitating movement and operation in different working environments. In addition, since the air spring is arranged between the base and the carrier and can drive the carrier to lift relative to the carrier, when part of the structure of the semiconductor device needs to be transferred, the air spring can be lifted to make the air spring contact the semiconductor device, then the part of the semiconductor device to be transferred is disassembled, so that the air spring supports the part of the semiconductor device to be transferred, and then the air spring is lowered to make the carrier drive the part of the semiconductor device to be transferred to be lowered, and then the base is moved out, so that the part of the semiconductor device to be transferred is transferred. Thus, compared with the transfer mode of the related art through the jack and the ground ox, the maintenance carrier of the present application requires less manpower, and the maintenance personnel can more easily and efficiently maintain the semiconductor device, reducing the maintenance time and cost, and improving the availability and production efficiency of the semiconductor device.

[0008] The air spring can change the stiffness and carrying capacity by adjusting the internal air pressure, while the stiffness of the traditional metal coil spring is fixed, and once the specification of the spring is determined, the carrying capacity is basically fixed. Therefore, the air spring can provide greater carrying capacity under the same installation space and size conditions. In addition, the compressed air in the air spring has good compressibility and elasticity, which can play a buffering role during lifting to make the lifting process more stable and avoid rigid impact. In addition, the air spring uses air as the working medium, and air has good compressibility and elasticity. When subjected to external force, air can be compressed or expanded in a small space, thereby realizing a large volume change. Therefore, the air spring can realize a large amplitude of stretching and contracting through the significant change in air volume during the charging and discharging process. Compared with some hydraulic or mechanical transmission lifting devices, the compressibility of hydraulic oil is very small, and the force is mainly transmitted and the lifting is realized through the flow and pressure change of the liquid, and the stretching amount is usually limited by the stroke of the hydraulic cylinder and the pressure of the hydraulic system, and the stretching ratio is generally relatively small. The stretching amount of the mechanical transmission lifting device, such as the screw nut transmission and the chain transmission, depends on the size of the mechanical parts and the transmission ratio, and it is difficult to realize a large stretching ratio like the air spring. When the semiconductor equipment is transferred, the maintenance space at the bottom of the semiconductor equipment is small, and the air spring is arranged in the embodiment of the application, so that the maintenance device has the advantages of large carrying capacity, convenient and fast use, stable lifting, large stretching ratio and the like, and meets the maintenance requirements of the maintenance carrier. In addition, the air spring does not need to be provided with oil such as lubricating oil and hydraulic oil, so as to facilitate the maintenance of a clean environment.

[0009] Therefore, the maintenance carrier cooperates the movable base, the carrier seat, the air spring, the guide rod and the bidirectional speed regulating valve to realize stable lifting and accurate speed control of the carrier seat, and can safely and reliably transfer the semiconductor equipment.

[0010] In a possible implementation, the maintenance carrier further includes: a plurality of communication branches, the plurality of communication branches are connected one by one with the plurality of air springs; each communication branch includes: a gas inlet branch and a gas outlet branch, one end of the gas inlet branch is connected one by one with the plurality of gas inlets, and the other end is adapted to be in communication with the gas source, and the first speed regulating valve part is arranged in the gas inlet branch; one end of the gas outlet branch is connected with the gas outlet, and the other end is adapted to be in communication with the gas source, and the second speed regulating valve part is arranged in the gas outlet branch.

[0011] Since each air spring has an independent air inlet and air outlet, and is connected to the air source through the air inlet branch and the air outlet branch respectively, the maintenance personnel can independently control each air spring, so as to accurately adjust the inflation or deflation state according to the actual needs. It can be understood that, when the semiconductor device is transferred, due to the uneven weight distribution of each part of the semiconductor device, by independently controlling the plurality of air springs, the carrier can be kept horizontal, ensuring that the semiconductor device will not be damaged due to tilting during the transfer process, and the accuracy and reliability of the maintenance operation are improved.

[0012] In a possible implementation, the maintenance carrier further comprises a speed regulating device; the speed regulating device comprises a plurality of flow rate adjusting members, which are arranged one by one on the plurality of air inlet branches and connected between the first speed regulating valve part and the air inlets, and the flow rate adjusting members have a higher speed regulating precision than the first speed regulating valve part.

[0013] Since the first speed regulating valve part can preliminarily regulate the flow rate of the gas flowing into the air spring, realize a large range of flow rate control, and complete the rough adjustment of the inflation speed of the air spring, and the flow rate adjusting members can finely adjust on the basis of the adjustment of the first speed regulating valve part due to their higher speed regulating precision. Thus, through two-stage regulation, the inflation amount and inflation speed of the air spring can be more accurately controlled, so as to keep the carrier horizontal, ensure that the semiconductor device will not be damaged due to tilting during the transfer process, and improve the accuracy and reliability during the operation of the maintenance carrier.

[0014] In a possible implementation, the maintenance carrier further comprises an inclination detection device and a first controller; the inclination detection device is arranged on the carrier and is adapted to detect the inclination angle of the carrier; the first controller is arranged on the carrier and is electrically connected with the inclination detection device and the plurality of flow rate adjusting members; the first controller is configured to control the opening and closing size of the valve port of the plurality of flow rate adjusting members according to the inclination angle of the carrier detected by the inclination detection device, so that the plurality of air springs are synchronously lifted.

[0015] Since the inclination detection device can obtain the inclination angle information of the carrier in real time, when the carrier is detected to be inclined, it means that the carrier is not in a horizontal state, and the first controller will immediately calculate the parameters to be adjusted according to the detected inclination angle data. By controlling the opening and closing size of the valve port of the plurality of flow rate adjusting members, the flow rate of the gas flowing into each air spring can be accurately adjusted.

[0016] In a possible implementation, the maintenance carrier further comprises a support member; the support member comprises a first end and a second end arranged oppositely; the first end is connected with the carrier; and the second end is adapted to support at least part of the semiconductor device.

[0017] Since the first end of the support member is connected with the carrier and the second end supports at least part of the semiconductor device, the weight of the lower cavity can be effectively transmitted to the carrier, thereby providing stable support for the lower cavity. In addition, it can be understood that when the carrier is lowered, the guide rod arranged on the base will gradually pass through the guide hole and extend away from the base on the side of the guide hole away from the base. Then, the guide hole can abut against the lower cavity arranged on the carrier. The embodiment of the present application forms an avoiding space between the carrier and the lower cavity by arranging the support member, and the avoiding space can accommodate the guide rod, thereby ensuring stable operation of the lifting of the maintenance carrier.

[0018] In a possible implementation, the second end is provided with a first positioning structure, and the first positioning structure is adapted to cooperate with at least part of the semiconductor device to position the carrier and at least part of the semiconductor device. In this way, the positioning of the carrier and the semiconductor device is facilitated.

[0019] In a possible implementation, the first positioning structure includes at least one of a positioning protrusion and a positioning groove. Since the positioning protrusion and the positioning groove are designed intuitively, the maintenance personnel can easily identify and align the two in actual operation, thereby quickly completing the positioning work between the semiconductor device and the base. This simple structure design reduces the complexity of operation and improves the positioning efficiency.

[0020] In a possible implementation, the first positioning structure includes a positioning protrusion, and the wall surface on the side of the positioning protrusion away from the base is a convex spherical surface. In this way, the first positioning structure cooperates with the lower cavity of the semiconductor device, the first positioning structure of the second end can cooperate with the second positioning structure of the lower cavity to achieve positioning, and the positioning accuracy between the base and the lower cavity of the semiconductor device is improved. Since the convex spherical surface and the concave spherical surface have the automatic centering feature. In this way, when at least part of the semiconductor device is installed on the carrier, even if there is a certain deviation in the initial position of the device, the positioning protrusion can automatically adjust the position in the positioning groove due to the interaction between the spherical surfaces, thereby achieving accurate centering. In this way, the requirement for installation accuracy is reduced, and the operator can more easily install the device in place. Then, the functions of quick positioning and disengagement of the maintenance carrier and the lower cavity can be achieved.

[0021] In a possible implementation, the maintenance carrier further includes a bearing member connected to the carrier, and the bearing member includes a support portion located on the side of the carrier away from the air spring, and the support portion is adapted to bear at least part of the semiconductor device.

[0022] Therefore, the support part can directly share part of the weight of the semiconductor device, effectively increasing the carrying capacity of the maintenance carrier for the semiconductor device. In addition, when the part of the semiconductor device that needs to be transferred is heavy, simply relying on the support on the carrier seat may not meet the weight carrying requirement, and the support part of the carrier provides an additional support point, so that the carrier can more stably carry the device, ensuring the safety of the device during transportation and maintenance. In addition, since the convex spherical surface and the concave spherical surface can realize centering and limiting of the semiconductor device, the embodiment of the application additionally provides a carrier, which can prevent the convex spherical surface and the concave spherical surface from being separated due to bumps of the ground during operation of the maintenance carrier, and realizes the anti-toppling function by increasing the contact area with the lower cavity.

[0023] In a possible implementation, the carrier is provided in plurality, and the plurality of carriers are arranged at the periphery of the support. The plurality of carriers can more evenly disperse the weight of the semiconductor device by being distributed at the periphery of the support. When the semiconductor device is placed on the carrier, the plurality of carriers jointly bear the gravity of the semiconductor device, avoiding the case that the local force is too large. This is conducive to improving the overall stability of the carrier when carrying the semiconductor device, reducing the risk of tilting or deformation of the carrier seat due to uneven weight distribution, and ensuring that the semiconductor device remains stable during transportation and maintenance.

[0024] In a possible implementation, the maintenance carrier further comprises a plurality of buffers, each of the buffers is arranged on the base and located between the edge of the base and the edge of the carrier seat, and the plurality of buffers are arranged at the periphery of the air spring.

[0025] In this way, in the case of sudden descent of the air spring, the buffer can quickly convert the kinetic energy into the internal energy of the hydraulic oil, and generate resistance through the flow of the oil in the damping hole, thereby effectively reducing the impact force. Since the plurality of buffers are distributed at the periphery of the air spring, the air spring can be protected from all directions. During lifting and lowering, the carrier seat may collide with the base due to various reasons (such as operation error, equipment failure, etc.), and the buffer can effectively absorb and buffer the impact force generated by the collision, avoiding damage to the carrier seat and the semiconductor device on the carrier seat, and helping to prolong the service life of the air spring.

[0026] In a possible implementation, the maintenance carrier further comprises: a wheel and a driving member, the wheel is rotatably connected to the base and is adapted to support the base; and the driving member is arranged on the base and is in transmission connection with the wheel. In this way, the maintenance carrier can be freely moved by arranging the wheel.

[0027] In a possible implementation, the vehicle wheel comprises: a first wheel set and a second wheel set, the first wheel set and the second wheel set are arranged along a second direction, and the height of at least one of the first wheel set and the second wheel set is adjustable, the second direction being the moving direction of the maintenance vehicle.

[0028] It can be understood that in the actual working environment, the road surface may not be flat, and there may be pits, bumps or slopes. When at least one of the first wheel set and the second wheel set is adjustable in height, the maintenance vehicle can adjust the height of the wheel to adapt to these uneven road surfaces. By raising the wheel set on the lower side and lowering the wheel set on the higher side, the carrier can be kept in a horizontal state, ensuring that the semiconductor equipment is not affected by the bumps on the road during transportation, and protecting the safety of the semiconductor equipment.

[0029] In a possible implementation, the maintenance vehicle further comprises: a speed reducer, the speed reducer being drivingly connected between the vehicle wheel and the driving member. It can be understood that the driving member (such as a motor) usually outputs at a high speed but has relatively small torque. However, during the driving of the maintenance vehicle, especially when carrying semiconductor equipment, a larger torque is required to overcome the resistance such as ground friction and load weight, so as to achieve smooth driving. The speed reducer can reduce the high speed of the driving member while increasing the output torque, so that the vehicle wheel obtains sufficient driving force, ensuring that the vehicle can easily cope with various road conditions and load conditions, and improving the stability and safety of driving.

[0030] In a possible implementation, the speed reducer is a cycloidal pin wheel speed reducer. Since the structure of the cycloidal pin wheel speed reducer is relatively compact, it has small volume and light weight. In this way, the vehicle can be provided with powerful power transmission capability without occupying too much space, and at the same time, the overall weight of the vehicle can be reduced, and the maneuverability and flexibility of the vehicle can be improved.

[0031] In a possible implementation, the semiconductor equipment comprises an electron beam metrology assembly, the electron beam metrology assembly comprising a base, an upper cavity and a lower cavity, the upper cavity being fixedly connected with the base; the lower cavity being connected with the upper cavity and enclosing a maintenance chamber with an outlet with the base, the maintenance chamber being adapted to accommodate the maintenance vehicle, and the maintenance vehicle being adapted to transfer the lower cavity.

[0032] In this way, when the lower cavity does not need to be transferred, the maintenance vehicle can be arranged in the maintenance chamber, so as to avoid occupying too much space in the limited space such as a workshop, and to make the layout of the site more compact. When the lower cavity needs to be transferred, the maintenance vehicle can move the lower cavity out of the maintenance chamber through the outlet.

[0033] In a possible implementation, the base comprises: oppositely arranged first and second side walls, the extending directions of the first and second side walls being consistent with the moving direction of the maintenance carrier; and a rotating member rotatably connected to the first and second side walls, the rotating member being adapted to be in sliding fit with the base.

[0034] In a possible implementation, the base further comprises a third end wall, the first and second side walls being connected to opposite edges of the third end wall respectively, and the third end wall is provided with a first position detection device adapted to detect a first distance, the first distance being the distance from the maintenance carrier to a side wall surface of the maintenance chamber away from the outlet.

[0035] In this way, when the maintenance carrier enters or exits the maintenance chamber or moves in the chamber, the first distance is monitored in real time by the first position detection device, which can effectively prevent the carrier from colliding with the side wall of the maintenance chamber away from the outlet, avoid the occurrence of collision accidents, and protect the safety of the semiconductor equipment and the maintenance carrier.

[0036] In a possible implementation, the maintenance carrier further comprises a second controller arranged on the base and electrically connected to the first position detection device, the second controller being configured to control the maintenance carrier to stop moving when the first distance is detected to be less than a first threshold during the process that the maintenance carrier enters the maintenance chamber from the outlet.

[0037] In this way, when the maintenance carrier enters the maintenance chamber from the outlet, the first position detection device monitors the distance from the maintenance carrier to the side wall surface of the maintenance chamber away from the outlet in real time. Once the first distance is detected to be less than the first threshold, the second controller will quickly control the maintenance carrier to stop moving. Then, the collision between the maintenance carrier and the side wall of the maintenance chamber can be effectively avoided, so as to protect the maintenance carrier and the precision instruments such as semiconductor equipment carried thereby from being damaged. Since the semiconductor equipment is often valuable and extremely sensitive to collision, any slight collision may cause the chips, circuits, etc. inside the equipment to malfunction, affecting the performance and service life of the equipment. Moreover, when the first distance is detected to be less than the first threshold, the second controller will quickly control the maintenance carrier to stop moving, which is conducive to making the maintenance carrier reach a fixed position each time and positioning the maintenance carrier and the lower cavity.

[0038] In a possible implementation, the maintenance carrier further comprises a second position detection device arranged on the first and / or second side wall, the second position detection device being adapted to detect a second distance, the second distance being the distance from the maintenance carrier to a wall surface of the maintenance chamber opposite to the first and / or second side wall; the second controller is further electrically connected to the second position detection device, and the second controller is further configured to control the maintenance carrier to stop moving when the second distance is detected to be greater than a second threshold during the process that the maintenance carrier moves out of the maintenance chamber along the outlet.

[0039] Thus, when the maintenance carrier moves out of the maintenance chamber along the exit, the second position detection device monitors the distance (i.e. the second distance) of the carrier to the opposite wall surface of the first side wall and / or the second side wall in the maintenance chamber in real time. Once the second distance is detected to be greater than the second threshold, the second controller controls the maintenance carrier to stop moving in time. The maintenance carrier is prevented from moving excessively during the moving-out process, and the part of the structure of the maintenance carrier is prevented from exceeding the range of the exit of the maintenance chamber and colliding with the surrounding environment, thereby protecting the safety of the carrier and the semiconductor device.

[0040] In a second aspect, the present application provides an electron beam metrology assembly, comprising the maintenance carrier of the first aspect and an electron beam metrology device.

[0041] In a third aspect, the present application further provides a semiconductor device, comprising the maintenance carrier of the first aspect or the electron beam metrology assembly of the second aspect.

[0042] It should be noted that the technical effects brought by the implementation manners of the second aspect and the third aspect can refer to the technical effects brought by the corresponding implementation manners of the first aspect, and will not be described here again. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0044] Figure 1 A partial front view of a semiconductor device provided by the embodiments of the present application;

[0045] Figure 2 A partial front view of a semiconductor device provided by the embodiments of the present application; Figure 1 A top view of the semiconductor device shown in the figure after removing the upper cavity, the lower cavity and the carrier seat;

[0046] Figure 3 A partial front view of a semiconductor device provided by the embodiments of the present application; Figure 1 A perspective structural schematic view of the maintenance carrier in the figure;

[0047] Figure 4 A partial structural schematic view of the maintenance carrier in the figure. Figure 1

[0048] Explanation of reference signs:

[0049] 1000-semiconductor device;

[0050] ​100 - maintenance carrier; 200 - e-beam metrology apparatus; 210 - pedestal; 210A - maintenance chamber; 210B - outlet; 2101 - first portion; 2102 - second portion; 220 - upper cavity; 230 - lower cavity;

[0051] 10 - base; 11 - first side wall; 12 - second side wall; 13 - third end wall;

[0052] 20 - carrier; 21 - guide hole;

[0053] 30 - lifting device; 31 - air spring;

[0054] 40 - guide; 41 - guide rod;

[0055] 50 - first speed regulation assembly; 51 - speed regulation device; 52 - inclination detection apparatus; 53 - first controller; 54 - support; 541 - first positioning structure; 55 - carrier; 551 - connecting portion; 552 - support portion; 56 - buffer; 57 - wheel; 570 - driving member; 571 - first wheel set; 572 - second wheel set; 58 - speed reducer; 59 - rotating member; 60 - first position detection device; 61 - second position detection device; 62 - signal receiver; 63 - remote controller; 64 - switching power supply; 65 - pressure reducing valve. DETAILED DESCRIPTION

[0056] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0057] In the description of the present application, the orientations or positional relationships indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0058] The terms "first", "second", are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise stated, the meaning of "multiple" is two or more.

[0059] In the description of the present application, it should be noted that unless specifically defined and limited otherwise, the terms "connected", "connected", should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0060] In the embodiments of the present application, the words such as "exemplary" or "for example" are used to represent an example, illustration or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, the words such as "exemplary" or "for example" are intended to present the relevant concept in a specific manner.

[0061] In the description of the present application, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0062] In order to facilitate the understanding of the maintenance carrier, electron beam measurement assembly and semiconductor equipment provided by the embodiments of the present application, the following briefly describes some technical terms related to the embodiments of the present application.

[0063] Electron beam measurement device: uses various signals generated by the interaction of electron beams with the measured object to perform measurement. The electron gun in the device emits a high-energy electron beam, which is focused by electromagnetic lenses and irradiates the surface of the measured object. The interaction of electrons with the object will generate various signals, such as secondary electrons, backscattered electrons, transmitted electrons, etc. The electron beam measurement device can obtain information such as the topography, composition and structure of the object surface by detecting the intensity, energy, time of flight, etc. of these signals.

[0064] Motion stage: a device used to accurately manipulate the position and motion of an object in a vacuum environment. For example, in an electron beam measurement device, the motion stage can accurately move the wafer in three-dimensional space, accurately positioning the part to be measured within the measurement range of the electron beam, and its positioning accuracy is usually up to nanometer level to meet the high-precision measurement requirements.

[0065] Wafer: refers to a silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and added to a silicon crystal seed, then slowly pulled out to form a cylindrical single crystal silicon. After the silicon rod is ground, polished and sliced, a silicon wafer is formed, which is a wafer.

[0066] Some semiconductor devices, such as electron beam measurement devices, need to work in a vacuum environment. This type of device is generally composed of an upper vacuum chamber and a lower vacuum chamber. The lower vacuum chamber is connected to the lower side of the upper vacuum chamber, and a motion stage for silicon exposure is generally placed in the lower vacuum chamber. The motion stage is used to realize the transportation and accurate positioning of a wafer. For example, in an electron beam measurement device, the motion stage can accurately move the wafer in three-dimensional space, accurately position the part to be measured within the measurement range of the electron beam, to meet the high-precision measurement requirements.

[0067] In order to prevent impurity pollution, prevent oxidation of semiconductor materials, and improve process precision, some semiconductor devices need to work in a vacuum environment. Therefore, these semiconductor devices generally include an upper chamber, a lower chamber, and a base. The upper chamber and the lower chamber can be a vacuum chamber or a chamber close to a vacuum environment, which is not limited in the present application. A motion stage for silicon exposure is generally placed in the lower chamber. The motion stage is used to realize the transportation and accurate positioning of an object (for example, a wafer).

[0068] Since the positioning accuracy of the motion stage is crucial to semiconductor manufacturing, during long-term use, the components of the motion stage may be worn, loose, and other reasons that cause the accuracy to decrease. Therefore, the lower vacuum chamber needs to be removed from the upper chamber to maintain the motion stage.

[0069] In order to facilitate the removal of the lower chamber, the lower chamber is connected to the lower side of the upper chamber, and the upper chamber is connected to the base. At least part of the base is located on the opposite sides of the lower chamber, so that the lower chamber and the base enclose a maintenance chamber. In this way, the maintenance tool can be placed in the maintenance chamber to remove the lower chamber.

[0070] One maintenance method in the related art is to set multiple jacks and support them on the bottom wall of the lower chamber. After the screws connecting the lower chamber and the upper chamber are removed, the height of the jacks is lowered to move the lower chamber to the ground below. Then, the lower chamber is removed by dragging the ground to realize the maintenance of the motion stage. In this way, multiple maintenance personnel need to participate at the same time, and the process of removing the lower chamber is complex, resulting in more manpower and time spent on maintenance.

[0071] Please refer to Figure 1 , Figure 1 A partial front view of a semiconductor device provided by an embodiment of the present application is shown. The semiconductor device 1000 can be a semiconductor device 1000 with a vacuum chamber, which refers to a production device needed to generate various semiconductor products, such as a device applied in a chip manufacturing and packaging process. For example, the semiconductor device 1000 includes a process assembly or an electron beam measurement assembly for performing various processes.

[0072] For convenience of description, the semiconductor device 1000 is taken as an electron beam measurement assembly in the embodiments of the present application for description.

[0073] The electron beam measurement assembly comprises a maintenance carrier 100 and an electron beam measurement device 200, and the maintenance carrier 100 is adapted to transfer at least part of the electron beam measurement device 200.

[0074] It should be noted that in the semiconductor manufacturing process, the critical dimensions of the patterns in each process need to be accurately measured, such as line width, hole diameter, etc. The electron beam measurement device 200 can achieve sub-nanometer resolution by using the signals generated by the interaction between the electron beam and the sample surface, and accurately measure the dimensions of these tiny structures to provide accurate data for process adjustment and control. In addition, the electron beam measurement device 200 can also detect various defects on the surface of the semiconductor wafer, such as particle contamination, scratches, and glue residue. When the electron beam scans the wafer surface, defects will cause changes in electron scattering or absorption, and by analyzing these changes, defects can be identified and located, which helps to find process problems in time and improve the yield of chips. In addition, the electron beam measurement device 200 can also measure the three-dimensional profile of the semiconductor structure, such as step height, sidewall angle, etc.

[0075] Please refer to Figure 1 and Figure 2 , Figure 2 The semiconductor device shown in Figure 1 The top view of the semiconductor device after removing the upper cavity, the lower cavity and the carrier seat, in some embodiments of the present application, the electron beam measurement device 200 comprises a base 210, an upper cavity 220 and a lower cavity 230, the upper cavity 220 is fixedly connected with the base 210, for example, the upper cavity 220 can be fixedly connected with the base 210 by bonding, threaded connection, welding, clamping and the like, for example, the upper cavity 220 can also be an integral structure with the base 210, that is, the upper cavity 220 and the base 210 are an integral structure.

[0076] In addition, the lower cavity 230 is connected with the upper cavity 220, for example, the lower cavity 230 can be connected with the base 210 by threaded connection, clamping and the like. The base 210 comprises a first part 2101 and a second part 2102, the first part 2101 and the second part 2102 are respectively located on opposite sides of the lower cavity 230, and the first part 2101, the second part 2102 and the lower cavity 230 enclose a maintenance chamber 210A, at least one side of the maintenance chamber 210A is provided with an outlet 210B. The maintenance carrier 100 can move the lower cavity 230 out of the maintenance chamber 210A through the outlet 210B.

[0077] Thus, when the lower chamber 230 does not need to be moved, the maintenance vehicle 100 can be placed in the maintenance chamber 210A, thus preventing the maintenance vehicle 100 from occupying too much space in a limited space such as a workshop, thereby making the site layout more compact. When the lower chamber 230 needs to be moved, the maintenance vehicle 100 can be moved out of the maintenance chamber 210A through the exit 210B.

[0078] See also Figure 1 、 Figure 2 and Figure 3 , Figure 3 The embodiment of the present application provides Figure 1 FIG. 1 is a schematic diagram of the three-dimensional structure of a maintenance vehicle 100. The maintenance vehicle 100 includes a base 10, a carrier 20, and a lifting device 30. The base 10 is movable, that is, it can slide relative to the ground. The lifting device 30 is disposed between the base 10 and the carrier 20 and is used to drive the carrier 20 to rise and fall relative to the base 10.

[0079] Since the lifting device 30 is arranged between the base 10 and the carrier 20, it can drive the carrier 20 to rise and fall relative to the carrier 20. Therefore, when it is necessary to transfer part of the structure of the semiconductor device 1000, the lifting device 30 can be lifted so that the lifting device 30 contacts the semiconductor device 1000, and then the part to be transferred of the semiconductor device 1000 is disassembled so that the lifting device 30 supports the part to be transferred of the semiconductor device 1000. Then, the lifting device 30 is lowered so that the carrier 20 drives the part to be transferred of the semiconductor device 1000 to be lowered. Then, the base 10 is moved out to realize the transfer of the part to be transferred of the semiconductor device 1000.

[0080] In this way, compared with the transfer method through jacks and ground bulls in the related art, the maintenance vehicle 100 of the present application requires less manpower, and maintenance personnel can maintain the semiconductor equipment 1000 more easily and efficiently, reducing maintenance time and costs, and improving the availability and production efficiency of the semiconductor equipment 1000.

[0081] It can be understood that the lower cavity 230 has a large weight, and therefore a lifting device 30 with large load capacity, convenient and fast movement, and stable lifting is required to realize lifting. In addition, the SEMI (semiconductor equipment and materials international) standard specifies that the height of wafer silicon transmission is 1100 mm, and the space height of the electron beam measurement device 200 is about 400 mm after removing the body height of the motion table and the height of the vacuum cavity. Due to the height of the motion table and the working distance, the displacement table in the lower cavity 230 needs to be lowered by about 200 mm if it is completely separated from the upper cavity 220. Therefore, the lifting device 30 needs to realize a larger extension (lifting) ratio in a smaller space.

[0082] Therefore, in some embodiments of the present application, the lifting device 30 is an air spring 31. The air spring 31 uses the compressibility of air to realize elastic action by filling pressure air in a flexible sealed container (i.e. air bag). When an external force acts on the air spring 31, the air is compressed, the pressure in the container increases, and a counterforce is generated to resist the external force. When the external force disappears, the air spring 31 returns to its original state. As the air is continuously filled, the air pressure in the air bag increases, and the air bag gradually expands, thereby raising the height of the air spring 31. As the air in the air bag is discharged, the air pressure gradually decreases, the air bag contracts, and the height of the air spring 31 decreases, thereby realizing the lifting of the lifting device 30.

[0083] For example, the air spring 31 can be a bag-type air spring 31, a membrane-type air spring 31, or a composite air spring 31, etc., which is not limited in the present application.

[0084] Since the air spring 31 can change the stiffness and load capacity by adjusting the internal air pressure, and the stiffness of the traditional metal coil spring is fixed, once the spring size is determined, the load capacity is basically fixed. Therefore, under the same installation space and size conditions, the air spring 31 can often provide greater load capacity. In addition, the compressed air in the air spring 31 has good compressibility and elasticity, and can play a buffering role during lifting. Whether it is slow lifting or rapid lifting, the gas can absorb and release energy through its compression and expansion, making the lifting process more stable and avoiding rigid impact. When the air spring 31 needs to be lifted, it can be achieved by charging and discharging, which is convenient and fast to operate, and has fast response speed.

[0085] In addition, the air spring 31 uses air as a working medium, and the air has good compressibility and elasticity. When subjected to external force, the air can be compressed or expanded in a small space, thereby achieving a large volume change. Then, the air spring 31 can achieve a large amplitude of expansion and contraction through a significant change in the volume of air during the charging and discharging process. Compared with some hydraulic or mechanical transmission lifting devices 30, the compressibility of hydraulic oil is very small, and the force is mainly transmitted and the lifting is mainly achieved through the flow and pressure change of the liquid, and the expansion and contraction amount is usually limited by the stroke of the hydraulic cylinder and the pressure of the hydraulic system, and the expansion and contraction ratio is relatively small. The expansion and contraction amount of the mechanical transmission lifting device 30 such as the screw nut transmission and the chain transmission depends on the size of the mechanical parts and the transmission ratio, and it is also difficult to achieve a large expansion and contraction ratio like the air spring 31. Therefore, by designing the lifting device 30 as the air spring 31, the maintenance device can have the advantages of large load bearing, convenient and fast use, stable lifting, and large expansion and contraction ratio, and can meet the maintenance requirements of the maintenance carrier 100. The air spring 31 does not need to be provided with oil such as lubricating oil and hydraulic oil, so as to facilitate the maintenance of a clean environment.

[0086] In some embodiments of the present application, the lifting device 30 can also be a hydraulic lifting device 30 or a mechanical transmission type lifting device 30, and the present application does not limit this. For the convenience of description, the lifting device 30 is taken as the air spring 31 in the embodiments of the present application.

[0087] In some embodiments of the present application, the maintenance carrier 100 can further include a guide 40 provided on the base 10, and the guide 40 is adapted to guide the carrier 20 to move in the lifting direction to lift at least part of the semiconductor equipment 1000. For example, the guide 40 can be used to lift the lower cavity 230 of the semiconductor equipment 1000.

[0088] In this way, the guide 40 can ensure that the carrier 20 can move in the preset direction (such as vertical) during lifting, avoiding deviation or shaking in the (horizontal) direction. In addition, the guide 40 can provide additional support and constraint for the carrier 20, so that the carrier 20 is more stable during lifting, thereby ensuring the safety of the equipment and the operator, and improving the running stability of the maintenance carrier 100.

[0089] In a possible structural design, the guide 40 includes a guide rod 41 provided along the lifting direction of the carrier 20, and the carrier 20 is provided with a guide hole 21 adapted to cooperate with the guide rod 41, and at least part of the guide rod 41 is provided in the guide hole 21. The guide rod 41 can be gap-fitted with the guide hole 21.

[0090] The guide rod 41 can be a hollow rod or a solid rod, and the radial cross section of the guide rod 41 can be circular, triangular, quadrilateral, pentagonal, hexagonal, or other polygonal shapes, which are not limited in the present application.

[0091] Since the guide rod 41 is arranged along the lifting direction of the carrier 20, and the carrier 20 is provided with a guide hole 21 matched with the guide rod 41, the cooperation between the guide rod 41 and the guide hole 21 can provide stable guiding for the lifting of the carrier 20, and ensure the movement of the carrier 20 along a fixed path. Moreover, the structure is relatively simple, the number of components is less, and the probability of failure is low during long-term use. Maintenance and maintenance are also more convenient, which can effectively improve the reliability and stability of the maintenance carrier 100. In addition, the guide rod 41 can withstand a certain lateral force. When the components of the semiconductor equipment 1000 on the carrier 20 generate eccentric load during lifting, the guide rod 41 can effectively transmit these lateral forces to the base 10, ensuring the stable operation of the carrier 20.

[0092] Optionally, the guide rod 41 can be provided with one. Optionally, the guide rod 41 can also be provided with a plurality of guide rods 41, and the plurality of guide rods 41 are arranged on the base 10 in a spaced manner. The carrier 20 is provided with a plurality of guide holes 21, and the plurality of guide rods 41 are arranged in the plurality of guide holes 21 in a one-to-one correspondence. For example, the guide rod 41 can be provided with four, and the carrier 20 is provided with four guide holes 21. The four guide rods 41 are arranged in the four guide holes 21 in a one-to-one correspondence.

[0093] The plurality of guide rods 41 can be arranged in an array on the base 10. For example, as shown in Figure 2 and Figure 3 The four guide rods 41 can be arranged in a 2x2 array on the base 10.

[0094] It should be noted that a single guide rod 41 may not be stable when guiding the lifting of the carrier 20 when facing a large lateral force or eccentric load. The plurality of guide rods 41 are arranged in a spaced manner, which can constrain and support the carrier 20 from multiple directions. The plurality of guide rods 41 can act together to disperse the lateral force, thereby effectively preventing the carrier 20 from tilting or shaking, and improving the stability of the carrier 20 during lifting. In addition, the one-to-one correspondence between the plurality of guide rods 41 and the guide holes 21 can better ensure the movement accuracy of the carrier 20 in each direction. Each guide rod 41 plays a role in precise guidance, so that the carrier 20 will not deviate as a whole due to the failure or insufficient accuracy of a single guide rod 41 during lifting.

[0095] In some embodiments of the present application, the lifting device 30 can be provided with a plurality of lifting devices 30, and the plurality of lifting devices 30 are arranged on the base 10 in a spaced manner.

[0096] Optionally, the plurality of lifting devices can be arranged in an array on the base 10. For example, as shown in FIGS. 17 and 18, the lifting devices 30 can be arranged in a 2x2 array on the base 10. Optionally, the lifting devices 30 can be arranged in a 2x3 array on the base 10. The present application does not limit the number of lifting devices 30. Figure 2 and Figure 3 Optionally, the lifting devices 30 can be arranged in a 2x2 array on the base 10. Optionally, the lifting devices 30 can be arranged in a 2x3 array on the base 10. The present application does not limit the number of lifting devices 30.

[0097] In this way, the plurality of lifting devices 30 can distribute the weight of the semiconductor equipment 1000 components, and avoid damage to a single lifting device 30 due to excessive load. The plurality of lifting devices 30 arranged at intervals can support and lift the carrier 20 from different positions, reducing the likelihood of the carrier 20 tilting or shaking during lifting. In this way, even if the center of gravity of the equipment components is unevenly distributed, the plurality of lifting devices 30 can work in coordination to keep the carrier 20 in a horizontal state. In other embodiments of the present application, the lifting device 30 can also be provided as one. The present application does not limit this. For ease of description, the embodiments of the present application are described with multiple lifting devices 30 as an example.

[0098] In some embodiments of the present application, the plurality of air springs 31 each includes an air inlet and an air outlet, and the maintenance carrier 100 further includes a plurality of air inlet branches and a plurality of air outlet branches. One end of the plurality of air inlet branches is connected to the plurality of air inlets one by one, and the other end is adapted to communicate with the air source. One end of the plurality of air outlet branches is connected to the plurality of air outlets one by one, and the other end is adapted to communicate with the air source. The air source is a source device for providing compressed air to various pneumatic equipment.

[0099] For ease of description, the possible structural design of a single air inlet branch and a single air outlet branch is described below.

[0100] In one possible structural design, the maintenance carrier 100 includes a first pipe and a second pipe, and the first pipe and the second pipe each form a channel therein. The channel in the first pipe forms at least part of the air inlet branch, and the channel in the second pipe forms at least part of the air outlet branch. The first pipe is provided with a first opening and a second opening communicating with the channel. The first opening can communicate with the air inlet, and the second opening is adapted to communicate with the outlet 210B of the air source. The second pipe is also provided with a third opening and a fourth opening communicating with the channel. The third opening can communicate with the air outlet, and the fourth opening can communicate with the inlet of the air source.

[0101] Exemplarily, the first pipeline and the second pipeline can be made of plastic material, for example, the plastic material can be acrylonitrile butadiene styrene (ABS) plastic, high impact polystyrene (HIPS), polycarbonate (PC), polyethylene glycol terephthalate (PET), etc. In this way, the first pipeline and the second pipeline can be integrally formed by a mold using an injection molding process, thereby improving production efficiency and reducing production cost.

[0102] Exemplarily, the first pipeline and the second pipeline can also be made of metal material, for example, the metal material can be stainless steel, aluminum alloy, zinc-containing steel sheet, etc. In this way, the first pipeline and the second pipeline have certain strength, which can reduce the deformation of the first pipeline and the second pipeline when colliding with other objects, thereby improving the service life of the pipelines.

[0103] In another possible structural design, the maintenance carrier 100 includes a housing, and the housing is formed with a first channel and a second channel. The first channel forms at least part of the air inlet branch, and the second channel forms at least part of the air outlet branch.

[0104] Since the semiconductor device 1000 is usually provided with an air source, in a possible structural design, the air spring 31 in the present application can use the air source of the semiconductor device 1000. In this way, it is not necessary to additionally provide an air source, which is beneficial to reduce the production cost of the maintenance carrier 100 and facilitate the miniaturization of the maintenance carrier 100, thereby reducing the floor space occupied by the maintenance carrier 100.

[0105] In another possible structural design, the present application can further include an air source provided on the base 10, and the air source is adapted to communicate with the air inlet branch and the air outlet branch.

[0106] Since each air spring 31 has an independent air inlet and an air outlet, and is connected to the air source through the air inlet branch and the air outlet branch respectively. This allows the maintenance personnel to independently control each air spring 31, so as to accurately adjust the inflation or deflation state according to actual needs. It can be understood that, when transferring the semiconductor device 1000, the weight distribution of each part of the semiconductor device 1000 can be uneven. By independently controlling the plurality of air springs 31, the carrier seat 20 can be kept horizontal, so as to ensure that the semiconductor device 1000 will not be damaged due to inclination during the transfer process, thereby improving the accuracy and reliability of the maintenance operation.

[0107] Please continue to refer to Figure 2 andFigure 3 In some embodiments of the present application, the maintenance carrier 100 further comprises a first speed regulating assembly 50, which comprises a first speed regulating member and a second speed regulating member, the first speed regulating member is arranged on the air inlet branch, and the second speed regulating member is arranged on the air outlet branch. The first speed regulating member is adapted to regulate the flow rate of the gas flowing into the air spring 31, and the second speed regulating member is adapted to regulate the flow rate of the gas flowing out of the air spring 31.

[0108] In this way, the flow rate of the gas flowing into the air spring 31 can be regulated by the first speed regulating member, so as to control the inflation speed of the air spring 31, and further control the ascending speed of the carrier 20. Similarly, the flow rate of the gas flowing out of the air spring 31 can be regulated by the second speed regulating member, so as to control the deflation speed of the air spring 31, and further control the descending speed of the carrier 20. Then, when the carrier 20 ascends or the plane on which the carrier 20 is arranged is inclined, or when the carrier 20 descends or the plane on which the carrier 20 is arranged is inclined, the multiple air springs 31 are controlled by the first speed regulating assembly 50, so as to keep the carrier 20 horizontal, and ensure that the semiconductor device 1000 is not damaged due to the inclination during the transfer process, and the accuracy and reliability of the maintenance operation are improved.

[0109] In a possible structural design, the first speed regulating assembly 50 is a bidirectional speed regulating valve, which comprises a first speed regulating valve part and a second speed regulating valve part, the first speed regulating valve part forms the first speed regulating member, and the second speed regulating valve part forms the second speed regulating member. Since the bidirectional speed regulating valve is an integrated component, the bidirectional speed regulating valve integrates the functions of regulating the flow rates of the inlet gas and the outlet gas. Compared with installing two independent speed regulating valves respectively, the bidirectional speed regulating valve occupies less space, so that the overall structure of the maintenance carrier 100 is more compact, and the maintenance carrier 100 is convenient to move and operate in different working environments. In another possible structural design, a first one-way speed regulating valve forms the first speed regulating member, and a second one-way speed regulating valve forms the second speed regulating member.

[0110] Please continue to refer to Figure 2 and Figure 3 In some embodiments of the present application, the maintenance carrier 100 can further comprise a speed regulating device 51. The speed regulating device 51 comprises multiple flow rate regulating members, which are arranged one by one on the multiple air inlet branches and connected between the first speed regulating member and the air inlet. The speed regulating precision of the flow rate regulating member is greater than that of the first speed regulating member. The speed regulating precision refers to the minimum step of the flow rate regulating member and the first speed regulating member, which refers to the minimum speed adjustment change that can be achieved by the flow rate regulating member and the first speed regulating member. For example, the minimum step of the first speed regulating member is 0.1 m / s, which means that it can only increase or decrease by 0.1 m / s as the minimum unit for speed adjustment each time, and cannot achieve a smaller speed change adjustment than 0.1 m / s.

[0111] Exemplarily, the flow rate adjusting member can be a servo proportional valve. Since the servo proportional valve can accurately adjust the opening degree of the valve port according to the input electrical signal, the flow rate of the gas flowing into the air spring 31 can be precisely controlled. The servo proportional valve has high speed regulation accuracy, thereby meeting the requirements for the lifting speed of the air spring 31 during the maintenance of the semiconductor equipment 1000. In addition, the servo proportional valve can realize a very small change in the opening degree of the valve port, thereby corresponding to a very small adjustment of the gas flow rate. Therefore, the maintenance carrier 100 can perform very fine operation when adjusting the inflation amount of the air spring 31, realize a very small height adjustment, and ensure the accuracy of the operation.

[0112] Exemplarily, the flow rate adjusting member can also be an electric regulating valve, a pneumatic regulating valve, or a throttle valve, etc., which are not limited in the present application.

[0113] Since the first speed regulating member can preliminarily regulate the flow rate of the gas flowing into the air spring 31, realize a large range of flow rate control, and complete the rough adjustment of the inflation speed of the air spring 31. The flow rate adjusting member can finely adjust on the basis of the adjustment of the first speed regulating member due to its higher speed regulation accuracy. Thus, through two-stage regulation, the inflation amount and inflation speed of the air spring 31 can be more accurately controlled, so that the carrier seat 20 can be kept horizontal, and the semiconductor equipment 1000 can be prevented from being damaged due to tilting during the transfer process, thereby improving the accuracy and reliability of the maintenance carrier 100 during operation.

[0114] Please continue to refer to Figure 2 and Figure 3 In some embodiments of the present application, the maintenance carrier 100 further comprises an inclination detection device 52 and a first controller 53. The inclination detection device 52 is arranged on the carrier seat 20 and is adapted to detect the inclination angle of the base 10. The inclination detection device is a device for measuring the inclination angle of an object. Exemplarily, the inclination detection device can be an inclinometer or a gyroscope, etc., which are not limited in the present application.

[0115] In addition, the first controller 53 is arranged on the base 10. The first controller 53 is electrically connected with the inclination detection device and the plurality of flow rate adjusting members. The first controller 53 is configured to control the opening and closing size of the valve port of the plurality of flow rate adjusting members according to the inclination angle of the base 10 detected by the inclination detection device, so that the plurality of air springs 31 are synchronously lifted.

[0116] In a possible design, the flow rate adjusting member is a servo proportional valve, and the first controller 53 can convert the inclination signal sent by the inclination detection device into a voltage signal to control the output pressure value of the servo proportional valve, and output a higher pressure to the air spring 31 at a lower position, so as to ensure the synchronous rising of the air springs 31, avoid the problem that the load is not centered and the seat 20 is inclined, and improve the stability of the rising of the seat 20.

[0117] In another possible structural design, the first controller 53 can control the air spring 31 at a high position to stop air supply and the air spring 31 at a low position to continue air supply according to the inclination signal sent by the inclination detection device, and control the air spring 31 at the high position to continue air supply when the inclination is less than a certain threshold, so as to avoid the problem that the load is not centered and the seat 20 is inclined, and improve the stability of the rising of the seat 20.

[0118] Since the inclination detection device 52 can obtain the inclination angle information of the seat 20 in real time, when the inclination of the seat 20 is detected, it means that the base 10 is not in a horizontal state, and the first controller 53 can immediately calculate the parameters that need to be adjusted according to the detected inclination angle data, and accurately adjust the gas flow rate flowing into each air spring 31 by controlling the valve opening size of the flow rate adjusting member.

[0119] In some embodiments of the present application, the maintenance carrier 100 further includes a support member 54, the support member 54 includes a first end and a second end arranged oppositely, the first end is connected with the seat 20, and the second end is adapted to support at least part of the semiconductor device 1000. In this application, the support member 54 can be a column, a rod, a seat or a plate structure, which is not limited in the present application.

[0120] Since the first end of the support member 54 is connected with the seat 20, and the second end supports at least part of the semiconductor device 1000, the weight of the lower cavity 230 can be effectively transmitted to the seat 20, and stable support is provided for the lower cavity 230. In addition, it can be understood that when the seat 20 is lowered, the guide rod 41 arranged on the base 10 will gradually pass through the guide hole 21 and extend away from the base 10 on the side of the guide hole 21, and then the guide hole 21 can abut against the lower cavity 230 arranged on the seat 20. The embodiments of the present application form an avoiding space between the seat 20 and the lower cavity 230, which can accommodate the guide rod 41, so as to ensure the stable operation of the lifting of the maintenance carrier 100.

[0121] Please refer to Figure 3 and Figure 4 , Figure 4 Fig. 1 shows the maintenance carrier 100 provided by the embodiments of the present application. Figure 1Fig. 6 is a schematic view of a partial structure of the semiconductor device 1000, in some embodiments of the present application, the second end is provided with a first positioning structure 541, which is adapted to cooperate with at least part of the semiconductor device 1000 to position the carrier 20 and at least part of the semiconductor device 1000. That is, the first positioning structure 541 is adapted to cooperate with the lower cavity 230 of the semiconductor device 1000 to position the carrier 20 and the lower cavity 230 of the semiconductor device 1000. In this case, the bottom wall of the lower cavity 230 can be provided with a second positioning structure, which is adapted to cooperate with the first positioning structure 541.

[0122] In one possible structural design, the first positioning structure 541 is a positioning protrusion, and the second positioning structure is a positioning groove adapted to cooperate with the positioning protrusion. Since the positioning protrusion and the positioning groove are designed intuitively, in actual operation, the maintenance personnel can easily identify and align the two, and quickly complete the positioning work between the semiconductor device 1000 and the carrier 20. This simple structural design reduces the complexity of operation and improves the positioning efficiency. In another possible structural design, the first positioning structure 541 is a positioning groove, and the second positioning structure is a positioning protrusion adapted to cooperate with the positioning groove.

[0123] For example, the wall surface of the positioning protrusion away from the carrier 20 is a convex spherical surface, and the positioning groove is provided with a concave spherical surface adapted to cooperate with the positioning protrusion.

[0124] In this way, the first positioning structure 541 cooperates with the lower cavity 230 of the semiconductor device 1000, and the first positioning structure 541 of the second end can cooperate with the second positioning structure of the lower cavity 230 to achieve positioning, and improve the positioning accuracy between the carrier 20 and the lower cavity 230 of the semiconductor device 1000. Since the convex spherical surface and the concave spherical surface have the automatic centering feature. In this way, when at least part of the semiconductor device 1000 is installed on the carrier 20, even if there is a certain deviation in the initial position of the device, due to the interaction between the spherical surfaces, the positioning protrusion can automatically adjust the position in the positioning groove to achieve accurate centering. In this way, the requirement for installation accuracy is reduced, so that the operator can more easily install the device in place. Then, the function of quickly positioning and disengaging the maintenance carrier 100 and the lower cavity 230 can be achieved.

[0125] In some embodiments of the present application, the maintenance carrier 100 further comprises a bearing member 55 connected to the carrier 20, the bearing member 55 comprises a connecting portion 551 and a supporting portion 552, the connecting portion 551 is connected to the supporting portion 552 and the carrier 20, and the supporting portion 552 is located on the side of the carrier 20 away from the lifting device 30, and the supporting portion 552 is adapted to bear at least part of the semiconductor device 1000.

[0126] Exemplarily, the connecting part 551 can be fixedly connected to the supporting part 552 by bonding, threaded connection, welding, clamping or the like. Exemplarily, the connecting part 551 can also be integrally formed with the supporting part 552, i.e., the connecting part 551 and the supporting part 552 are one structural whole. In addition, the supporting part 552 can also be fixedly connected to the carrier 20 by bonding, threaded connection, welding, clamping or the like, which are not limited in the present application.

[0127] The structure of the connecting part 551 and the supporting part 552 can be the same or different, which are not limited in the present application. The structure of the connecting part 551 and the supporting part 552 can be plate-shaped, rod-shaped, columnar or irregular three-dimensional structure, which are not limited in the present application.

[0128] In this way, the supporting part 552 can directly share part of the weight of the semiconductor device 1000, effectively increasing the carrying capacity of the maintenance carrier 100 to the device. In addition, when the weight of the part of the semiconductor device 1000 that needs to be transferred is heavy, simply relying on the supporting part 54 on the carrier 20 can not meet the weight carrying requirement, and the supporting part 552 of the carrier 55 provides an additional support point, so that the carrier can more stably carry the device, ensuring the safety of the device during transportation and maintenance. In addition, since the convex spherical surface and the concave spherical surface can realize centering and limiting of the semiconductor device 1000, the embodiment of the present application additionally provides the carrier 55, which can prevent the convex spherical surface and the concave spherical surface from being separated due to bumps of the ground during operation of the maintenance carrier 100, and realize the function of preventing tilting by increasing the contact area with the lower cavity 230.

[0129] In a possible structural design, a plurality of carriers 55 are provided, and the plurality of carriers 55 are arranged on the periphery of the supporting part 54. The plurality of carriers 55 can be arranged in an array on the carrier 20. Exemplarily, as shown in FIG. 5, the four carriers 55 can be arranged in a 2x2 array on the carrier 20. Figure 3

[0130] The embodiment of the present application can more evenly distribute the weight of the semiconductor device 1000 by distributing the plurality of carriers 55 on the periphery of the supporting part 54. When the semiconductor device 1000 is placed on the carrier, the plurality of carriers 55 jointly bear the gravity of the semiconductor device 1000, avoiding the case that the local stress is too large. This is conducive to improving the overall stability of the carrier when carrying the semiconductor device 1000, reducing the risk of tilting or deformation of the carrier 20 due to uneven weight distribution, and ensuring that the semiconductor device 1000 remains stable during transportation and maintenance.

[0131] In some embodiments of the present application, the maintenance carrier 100 includes a buffer 56, which is arranged on the base 10 and located between the edge of the base 10 and the edge of the carrier 20. ​

[0132] Exemplarily, the buffer 56 can be a hydraulic anti-falling buffer which absorbs and consumes impact energy by using the damping characteristics of hydraulic oil. In this way, in the case of sudden descent of the air spring 31, the hydraulic anti-falling buffer can quickly convert kinetic energy into internal energy of the hydraulic oil, and generate resistance by the flow of oil in the damping hole, thereby effectively reducing the impact force. The high-efficiency buffering and energy-absorbing capability of the hydraulic anti-falling buffer can reduce the impact on the semiconductor equipment 1000 and avoid damage to internal precision components such as chips, circuit boards, etc. of the semiconductor equipment 1000 due to the instantaneous strong impact force.

[0133] Exemplarily, the buffer can also be a spring buffer, a rubber buffer, or a gas-liquid buffer, etc. which are not limited in the present application.

[0134] In a possible structural design, the buffer 56 is provided in plurality, and the plurality of buffers 56 are arranged on the periphery of the lifting device 30. Exemplarily, the buffer is provided in 14, and 7 buffers are arranged on the opposite sides of the lifting device 30, respectively.

[0135] In this way, the plurality of buffers 56 are distributed on the periphery of the lifting device 30, which can protect the lifting device 30 from all directions. During lifting, the carrier 20 can collide with the base 10 due to various reasons (such as operation error, equipment failure, etc.), and the buffer 56 can effectively absorb and buffer the impact force generated by the collision, thereby avoiding damage to the carrier 20 and the semiconductor equipment 1000 on the carrier 20, and helping to prolong the service life of the lifting device 30.

[0136] In some embodiments of the present application, the maintenance carrier 100 further comprises a wheel 57 and a driving member 570, the wheel 57 is rotatably connected to the base 10 and is adapted to support the base 10, and the driving member 570 is arranged on the base 10 and is in driving connection with the wheel 57. Exemplarily, the driving member 570 can be an electric motor, an engine, etc. which are not limited in the present application. In this way, the embodiments of the present application enable the maintenance carrier 100 to move freely by arranging the wheel 57.

[0137] In a possible structural design, the wheel 57 comprises a first wheel set 571 and a second wheel set 572, the first wheel set 571 and the second wheel set 572 are arranged along a second direction, and the height of at least one of the first wheel set 571 and the second wheel set 572 is adjustable, the second direction being the moving direction of the maintenance carrier 100. Exemplarily, the height of the first wheel set 571 is adjustable, and when the maintenance carrier 100 is arranged in the maintenance chamber 210A, the first wheel set 571 is arranged close to the outlet 210B. In this way, when the ground is uneven, the maintenance personnel can adjust the height of the first wheel set 571 through the outlet 210B, which is convenient for the maintenance personnel to operate.

[0138] In a possible structural design, the maintenance carrier 100 further comprises a support, the wheel 57 is rotatably connected to the support, one end of the support is hingedly connected to the base 10, and the other end of the support can be threadedly connected to the base 10 by a screw, so that the height of the support, and thus the height of the wheel 57, can be finely adjusted by controlling the length of the screw extending into the base 10.

[0139] In another possible structural design, a screw-nut mechanism is installed between the support and the base 10. One end of the screw is connected to the support, and the other end of the screw passes through the base 10 and is connected to a hand wheel or a driving motor. When the hand wheel or the motor drives the screw to rotate, the nut moves up and down along the screw, thereby driving the support and the wheel 57 to adjust the height.

[0140] It can be understood that in actual working environment, the road surface can not be flat, and there can be pits, bumps or slopes. When at least one of the first wheel set 571 and the second wheel set 572 is height-adjustable, the maintenance carrier 100 can adapt to these uneven road surfaces by adjusting the height of the wheel 57. By raising the wheel set on the lower side and lowering the wheel set on the higher side, the carrier 20 can be kept in a horizontal state, ensuring that the semiconductor equipment 1000 is not affected by the bumps of the road surface during transportation, and protecting the safety of the semiconductor equipment 1000.

[0141] In some embodiments of the present application, the maintenance carrier 100 further comprises a speed reducer 58, which is drivingly connected between the wheel 57 and the driving member 570.

[0142] In a possible structural design, the speed reducer 58 is a cycloidal pin wheel speed reducer 58. Since the cycloidal pin wheel speed reducer 58 has a relatively compact structure, it has a small volume and light weight. In this way, the carrier can be provided with powerful power transmission capability without occupying too much space, while also helping to reduce the overall weight of the carrier, improve its maneuverability and flexibility.

[0143] In a possible structural design, the speed reducer 58 can also be a planetary speed reducer 58 or a worm gear speed reducer 58, etc., which is not limited in the present application.

[0144] It can be understood that the driving member 570 (such as a motor) usually outputs at a high speed but with relatively small torque. However, during the driving process of the maintenance carrier 100, especially when carrying the semiconductor equipment 1000, a larger torque is needed to overcome the resistance such as ground friction, load weight, etc., to achieve smooth driving. The speed reducer 58 can reduce the high speed of the driving member 570 while increasing the output torque, so that the wheel 57 can obtain sufficient driving force, ensuring that the carrier can easily cope with various road conditions and load conditions, and improving the stability and safety of driving.

[0145] In some embodiments of the present application, the base 10 comprises a first sidewall 11 and a second sidewall 12 oppositely arranged, which can be arranged perpendicularly to the moving direction of the maintenance carrier 100, and the extending direction of the first sidewall 11 and the second sidewall 12 is consistent with the moving direction of the maintenance carrier 100; a rotating member 59 is rotatably connected to the first sidewall 11 and the second sidewall 12, and the rotating member 59 is adapted to be in sliding fit with the base 210.

[0146] For example, the rotating member 59 can be a guide ball, part of which is rotatably connected to the base 10, and the part of the guide ball extending out of the base 10 is in contact with the base 210. In this way, the guide has the freedom of multidirectional rotation, so as to adapt to the travel of the maintenance carrier 100 on a bumpy road. For example, the rotating member 59 can also be a guide wheel, which is rotatably connected to the base 10, and part of the outer periphery of the guide wheel is in contact with the base 210.

[0147] In this way, the extending direction of the first sidewall 11 and the second sidewall 12 is consistent with the moving direction of the maintenance carrier 100, which provides guidance for the movement of the maintenance carrier 100. The sliding fit of the rotating member 59 with the base 210 enables the carrier to move forward along the predetermined direction during movement, reducing the possibility of deviating from the track. In addition, the rotating member 59 increases the contact points between the base 10 and the base 210, which helps to improve the stability of the maintenance carrier 100 during movement.

[0148] In some embodiments of the present application, the base 10 further comprises a third end wall 13, the first sidewall 11 and the second sidewall 12 are respectively connected to opposite edges of the third end wall 13, and a first position detection device 60 is arranged on the third end wall 13, which is adapted to detect a first distance, the first distance being the distance from the maintenance carrier 100 to a sidewall surface in the maintenance chamber 210A away from the outlet 210B.

[0149] For example, the first position detection device 60 can be a capacitive distance sensor, which detects the distance change between objects by using the principle of capacitance. It is usually composed of a fixed electrode and a movable electrode, when the distance between the two electrodes changes, the capacitance value will also change accordingly. The capacitive distance sensor can achieve high measurement accuracy, which can ensure the accurate docking position of the maintenance carrier 100 in the maintenance chamber 210A, and avoid the impact on the semiconductor equipment 1000 due to position deviation. In addition, the capacitive distance sensor can quickly detect the change of distance and output the corresponding signal in time, which can meet the real-time monitoring of the position of the maintenance carrier 100 during movement, so that the carrier can quickly adjust according to the distance change, and the operation safety is guaranteed.

[0150] For example, the first position detection device 60 can also be an infrared distance sensor, a visual sensor, an ultrasonic sensor, a laser distance sensor, etc., which are not limited in the present application.

[0151] In this way, when the maintenance carrier 100 enters or exits the maintenance chamber 210A or moves within the chamber, the first distance is monitored in real time by the first position detection device 60, which can effectively prevent the carrier from colliding with the side wall of the maintenance chamber 210A away from the exit 210B, avoid the occurrence of collision accidents, and protect the safety of the semiconductor equipment 1000 and the maintenance carrier 100.

[0152] In some embodiments of the present application, the maintenance carrier 100 further comprises a second controller, which is arranged on the base 10 and is electrically connected with the first position detection device 60. The second controller is further configured to control the maintenance carrier 100 to stop moving when the first distance is detected to be less than the first threshold during the process of the maintenance carrier 100 entering the maintenance chamber 210A from the exit 210B. The second controller and the first controller 53 described above can be the same controller, or the second controller and the first controller 53 described above can be two different controllers, which are not limited in the present application.

[0153] In this way, when the maintenance carrier 100 enters the maintenance chamber 210A from the exit 210B, the first position detection device 60 monitors the distance between the maintenance carrier 100 and the side wall of the maintenance chamber 210A away from the exit 210B in real time. Once the first distance is detected to be less than the first threshold, the second controller will quickly control the maintenance carrier 100 to stop moving. Then, the collision between the maintenance carrier 100 and the side wall of the maintenance chamber 210A can be effectively avoided, so as to protect the maintenance carrier 100 and the precise instruments such as the semiconductor equipment 1000 carried by the maintenance carrier 100 from being damaged. Since the semiconductor equipment 1000 is often valuable and extremely sensitive to collision, any slight collision can cause the chips, circuits, etc. inside the equipment to malfunction, affecting its performance and service life. Moreover, when the first distance is detected to be less than the first threshold, the second controller will quickly control the maintenance carrier 100 to stop moving, which is beneficial to make the maintenance carrier 100 reach a fixed position each time, and is beneficial to the positioning of the maintenance carrier 100 and the lower cavity 230.

[0154] In some embodiments of the present application, the maintenance carrier 100 further comprises a second position detection device 61 arranged at the second side wall 12, the second position detection device 61 being adapted to detect a second distance between the maintenance carrier 100 and a wall surface opposite to the first side wall 11 and / or the second side wall 12 in the maintenance chamber 210A; the second controller is further electrically connected with the second position detection device 61, and the second controller is further configured to control the maintenance carrier 100 to stop moving when it is detected that the second distance is greater than a second threshold value during the process that the maintenance carrier 100 moves out of the maintenance chamber 210A along the outlet 210B.

[0155] Thus, when the maintenance carrier 100 moves out of the maintenance chamber 210A along the outlet 210B, the second position detection device 61 monitors the distance (i.e. the second distance) between the maintenance carrier 100 and the wall surface opposite to the first side wall 11 and / or the second side wall 12 in the maintenance chamber 210A in real time. Once it is detected that the second distance is greater than the second threshold value, the second controller controls the maintenance carrier 100 to stop moving in time. This avoids the maintenance carrier 100 from moving excessively during the moving-out process, and prevents the part of the maintenance carrier 100 from exceeding the range of the outlet 210B of the maintenance chamber 210A and colliding with the surrounding environment, thereby protecting the safety of the carrier and the semiconductor device 1000.

[0156] In some embodiments of the present application, the maintenance carrier 100 further comprises a signal receiver 62 and a remote controller 63, the signal receiver 62 can be arranged on the base 10 or the carrier 20, which is not limited in the present application. Thus, the maintenance personnel can control the maintenance carrier 100 from a certain distance away through the remote controller 63, without the need for close operation, which avoids direct contact with possible dangers and ensures the personal safety of the operator.

[0157] In some embodiments of the present application, the maintenance carrier 100 further comprises a switching power supply 64, which is electrically connected with the motor and the first controller 53. The switching power supply 64 can be arranged on the base 10 or the carrier 20, which is not limited in the present application. Thus, the switching power supply 64 can convert the input power (such as mains or battery power) into the stable voltage and current required by each component, ensuring that the device can operate normally.

[0158] In some embodiments of the present application, the maintenance vehicle 100 may further include a pressure reducing valve 65 provided on the air inlet branch and / or the air outlet branch. Since the air pressure provided by the air source may be unstable and have a high pressure value, directly entering the air inlet system may damage various pneumatic components, such as valves. The pressure reducing valve 65 on the air inlet branch can reduce the high-pressure gas to a suitable and stable pressure level, thereby avoiding damage to the components caused by high-pressure shock, extending the service life of the components, and reducing maintenance costs. Similarly, when the air outlet branch of the maintenance vehicle 100 discharges gas, the gas pressure may be relatively high. If it is discharged directly, problems such as noise and airflow shock may occur. The pressure reducing valve 65 on the air outlet branch can reduce the pressure of the discharged gas, reducing the impact of noise and airflow shock on the surrounding environment and personnel.

[0159] The above examples are preferred embodiments, which further illustrate the objectives, technical solutions and advantages of the present invention in detail. It should be understood that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A maintenance carrier for transferring at least part of a semiconductor device, characterized in that The maintenance vehicle includes: Removable base; Carrier; A plurality of air springs, each of the air springs comprising an air inlet and an air outlet; the plurality of air springs are disposed between the base and the carrier, and are used to drive the carrier to rise and fall relative to the base; a plurality of guide rods, the plurality of guide rods being arranged at intervals on the base and all arranged along the lifting direction of the carrier; a plurality of guide holes being provided on the carrier, at least portions of the plurality of guide rods being passed through the plurality of guide holes one by one, so that the carrier slides along the extension direction of the guide rods; Multiple two-way speed regulating valves are arranged in a one-to-one correspondence with the multiple air springs. Each of the two-way speed regulating valves includes a first speed regulating valve part and a second speed regulating valve part. The first speed regulating valve part is connected to the air inlet and is suitable for adjusting the gas flow rate flowing into the air spring; the second speed regulating valve part is connected to the air outlet and is suitable for adjusting the gas flow rate flowing out of the air spring.

2. The maintenance vehicle according to claim 1, characterized in that: Also includes: A plurality of communication branches, wherein the plurality of communication branches are connected to the plurality of air springs in a one-to-one correspondence; Each of the connecting branches comprises: an air intake branch, one end of which is connected to the air inlet and the other end of which is adapted to communicate with an air source, wherein the first speed regulating valve is provided on the air intake branch; An air outlet branch, one end of which is connected to the air outlet, and the other end of which is suitable for communicating with the air source, and the second speed regulating valve portion is arranged on the air outlet branch.

3. The maintenance vehicle according to claim 2, characterized in that: Also includes: Speed ​​regulating device; The speed regulation device includes: multiple flow rate regulating parts, which are arranged one by one on multiple intake branches and connected between the first speed regulating valve part and the air inlet. The speed regulation accuracy of the flow rate regulating parts is greater than the speed regulation accuracy of the first speed regulating valve part.

4. The maintenance vehicle according to claim 3, characterized in that: Also includes: An inclination angle detection device is provided on the carrier and is suitable for detecting the inclination angle of the base; The first controller is arranged on the base and is electrically connected to the inclination detection device and the multiple flow rate adjusting parts. The first controller is configured to control the opening and closing sizes of the valve ports of the multiple flow rate adjusting parts according to the inclination angle of the base detected by the inclination detection equipment, so that the multiple air springs rise synchronously.

5. The maintenance vehicle according to any one of claims 1 to 4, characterized in that: Also includes: The support member includes a first end and a second end that are oppositely arranged, the first end is connected to the carrier, and the second end is suitable for supporting the at least part of the semiconductor device.

6. The maintenance vehicle according to claim 5, characterized in that: The second end is provided with a first positioning structure, and the first positioning structure is suitable for cooperating with the at least part of the semiconductor device to position the base and the at least part of the semiconductor device.

7. The maintenance vehicle according to claim 6, characterized in that: The first positioning structure includes at least one of a positioning protrusion and a positioning groove.

8. The maintenance vehicle according to claim 7, characterized in that: The first positioning structure includes a positioning protrusion, and a wall surface of the positioning protrusion facing away from the base is a convex spherical surface.

9. The maintenance vehicle according to claim 8, characterized in that: It also includes a carrier connected to the carrier, the carrier including a supporting portion, the supporting portion is located on a side of the carrier away from the air spring, and the supporting portion is suitable for supporting at least part of the semiconductor device.

10. The maintenance vehicle according to claim 9, characterized in that: There are a plurality of the bearing members, and the plurality of the bearing members are arranged on the periphery of the supporting member.

11. The maintenance vehicle according to any one of claims 1 to 4, characterized in that: Also includes: A plurality of buffer members are provided, each of the buffer members is provided on the base and is located between the edge of the base and the edge of the carrier, and the plurality of buffer members are provided on the periphery of the air spring.

12. The maintenance vehicle according to any one of claims 1 to 4, characterized in that: Also includes: a wheel rotatably connected to the base and adapted to support the base; The driving member is arranged on the base and is drivingly connected to the wheel.

13. The maintenance vehicle according to claim 12, characterized in that: The wheels include: a first wheel group and a second wheel group, the first wheel group and the second wheel group are arranged along a second direction, and the height of at least one of the first wheel group and the second wheel group is adjustable, and the second direction is the moving direction of the maintenance vehicle.

14. The maintenance vehicle according to claim 12, characterized in that: Also includes: A reducer is connected in transmission between the wheel and the driving member.

15. The maintenance vehicle according to claim 14, characterized in that: The reducer is a cycloid pinwheel reducer.

16. The maintenance vehicle according to any one of claims 1 to 4, characterized in that: The semiconductor device includes an electron beam measurement component, which includes a base, an upper cavity and a lower cavity. The upper cavity is fixedly connected to the base; the lower cavity is connected to the upper cavity and, together with the base, encloses a maintenance chamber suitable for accommodating the maintenance carrier and having an exit. The maintenance carrier is suitable for transferring the lower cavity.

17. The maintenance vehicle according to claim 16, characterized in that: The base comprises: a first side wall and a second side wall arranged opposite to each other, wherein the extending direction of the first side wall and the second side wall is consistent with the moving direction of the maintenance vehicle; The first side wall and the second side wall are rotatably connected with a rotating member, and the rotating member is suitable for sliding cooperation with the base.

18. The maintenance vehicle according to claim 17, characterized in that: The base also includes: a third end wall, the first side wall and the second side wall are respectively connected to the two opposite edges of the third end wall, and a first position detection device is provided on the third end wall. The first position detection device is suitable for detecting a first distance, and the first distance is the distance from the maintenance carrier to a side wall surface away from the exit in the maintenance chamber.

19. The maintenance vehicle according to claim 18, characterized in that: The maintenance vehicle further includes a second controller, which is disposed on the base and electrically connected to the first position detection device. The second controller is configured to: During the process of the maintenance vehicle entering the maintenance chamber from the exit, when it is detected that the first distance is less than a first threshold, the maintenance vehicle is controlled to stop moving.

20. The maintenance vehicle according to claim 19, characterized in that: The maintenance vehicle further includes: a second position detection device disposed on the first side wall and / or the second side wall, the second position detection device being adapted to detect a second distance, the second distance being the distance between the maintenance vehicle and a wall surface opposite to the first side wall and / or the second side wall within the maintenance chamber; and a second controller being electrically connected to the second position detection device and further configured to: During the process of the maintenance vehicle moving out of the maintenance chamber along the exit, when it is detected that the second distance is greater than a second threshold, the maintenance vehicle is controlled to stop moving.

21. An electron beam measurement component, characterized in that The invention comprises an electron beam measuring device and the maintenance carrier according to any one of claims 1 to 20.

22. A semiconductor device, characterized in that: It comprises the maintenance vehicle according to any one of claims 1 to 20, or the electron beam measurement component according to claim 21.

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