Mini-LED backlight reflection module and preparation method thereof

Abstract

The invention provides a mini-LED (light-emitting diode) backlight reflection module and a preparation method thereof. The mini-LED backlight reflection module comprises a substrate, a light-emitting diode (LED) module, a light-emitting diode (LED) module and a light-emitting diode (LED) module, the mini-LED lamp beads are distributed on the substrate, and the mini-LED lamp beads are arranged on the substrate; the white glue layer is arranged on one side, on which the mini-LED lamp beads are distributed, of the substrate; the surface adhesive layer is arranged on one side, far away from the substrate, of the white adhesive layer; the preparation raw materials of the white glue layer comprise organic silicon macromolecules, and in the organic silicon macromolecules, the molar content of phenyl is 30%-40%. According to the mini-LED backlight reflection module provided by the invention, not only can the reflectivity reach 95%, but also the process difficulty can be obviously reduced, the production efficiency can be improved, and the product reliability can be improved.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of new display such as Micro-LED, Mini-LED, OLED, electronic paper, and relates to a mini-LED backlight reflection module and a preparation method thereof. BACKGROUND

[0002] Compared with the traditional LCD screen, the mini-LED is improved on the basis of the traditional LED backlight, smaller LED lamp beads are used, the backlight area is smaller, higher contrast and brightness can be achieved; due to the application of more precise light emitting units, the design difficulty of the lamp plate backlight reflection layer is increased, and white ink becomes the preferred scheme of various manufacturers due to its high maturity, high universality and good operability. Compared with the current mainstream display technologies such as LCD and OLED, the mini-LED lamp plate using white ink as the main material of the backlight reflection layer has advantages such as high brightness, long service life, high contrast, wide color gamut and excellent light control.

[0003] However, when white ink is used as the backlight reflection layer, the reflectivity is low (≤89%), the light utilization efficiency is not high, and the process steps need to be exposed and developed, which increases the cost and process time. In addition, the ink may cause warping of the substrate during the curing process, and peeling may occur at the bonding part under the cold and hot impact test conditions. These are determined by the characteristics of the ink itself. If the white ink is too thin as the backlight reflection layer, the reflectivity is not enough, and if it is too thick, it may cause warping of the substrate and failure of photolithography during curing, and the base resin material, pigment, filler, additive and solvent of the white ink composition formula have a great influence on the reliability.

[0004] Therefore, in the field, it is desirable to develop a mini-LED backlight reflection module which not only has high reflectivity, but also has a simple process, can improve production efficiency, and can improve the reliability of the product. SUMMARY

[0005] In view of the deficiencies of the prior art, the purpose of the present application is to provide a mini-LED backlight reflection module and a preparation method thereof. In view of the problems such as complex white ink process (exposure and development), low production efficiency and poor reliability (peeling may occur at the bonding part during RA verification) of the current mini-LED backlight, the present application designs and develops a new mini-LED backlight reflection module structure, which not only can make the reflectivity reach 95%, but also can significantly reduce the process difficulty, improve the production efficiency, and improve the reliability of the product.

[0006] To achieve the purpose of the application, the following technical solutions are adopted:

[0007] In a first aspect, the present application provides a mini-LED backlight reflection module, which comprises:

[0008] a substrate;

[0009] mini-LED lamp beads distributed on the substrate;

[0010] a white glue layer arranged on one side of the substrate where the mini-LED lamp beads are distributed;

[0011] a surface glue layer arranged on a side of the white glue layer away from the substrate;

[0012] The preparation raw material of the white glue layer comprises an organosilicon-based polymer, and the mole content of phenyl in the organosilicon-based polymer is 30%-40% (i.e., the content of phenyl in the organosilicon-based polymer is 30%-40% based on 100% of the total moles of the organosilicon-based polymer), for example, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, etc.

[0013] The present application uses an organosilicon-based polymer as the matrix material of the white glue layer, develops a white glue material different from white ink, and the heat resistance of the organosilicon-based polymer avoids the yellowing and other adverse properties of the material when working at high temperature. The excellent compatibility of the organosilicon-based polymer also makes it easy to modify it with other materials according to the needs. After the white glue layer is used to replace the white ink layer as the backlight reflection layer in the present application, the thickness limitation (the thickness of the white ink layer ≤ 50 μm, generally 30 μm, and the maximum reflectivity can only reach 89%) is eliminated, the reflectivity can reach more than 95%, and the energy consumption is significantly reduced (about 15%-20%). In addition, after the surface glue is used to replace the original lens (lens) glue in the present application, the surface glue can be directly sprayed after the white glue is cured, which not only achieves the same light output effect as the prior art, but also protects the lamp beads and the reflection layer (i.e., the white glue layer) more effectively, simplifies the structure design, greatly simplifies the process, shortens the process flow time, and greatly improves the production efficiency.

[0014] Preferably, the organosilicon-based polymer comprises a compound having the structure of formula (I) and formula (II):

[0015]

[0016] n in formula (I) and formula (II) is independently selected from an integer of 10-1000 (for example, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 150, 200, 250, 300, 350, 400, 450, 500, 550, 600, 650, 700, 750, 800, 850, 900, 950, 1000, etc.), and R1 in formula (II) is selected from H or C1-C10 (for example, C1, C2, C3, C4, C5, C6, C7, C8, C9, or C10) alkyl (for example, methyl, ethyl, or n-butyl, etc.).

[0017] The schematic diagram of the reaction of the compounds of the structures of formula (I) and formula (II) is shown in Figure 1

[0018] The side chains of the products generated by the reaction of the compounds of the structures of formula (I) and formula (II) contain methyl and phenyl groups, and the parameters of the material can be adjusted by adjusting the content ratio of the two groups. For example, the higher the content of phenyl group, the higher the refractive index, the higher the hardness, the higher the Tg, and the better the thermal stability; and the higher the content of methyl group, the lower the refractive index, the lower the modulus, the lower the Tg, and the better the adhesion.

[0019] Preferably, the molar ratio of the compounds of the structures of formula (I) and formula (II) is 1: (1-10), for example, 1:1, 1:2, 1:3, 1:4, 1:5, 1:6, 1:7, 1:8, 1:9, 1:10, etc.

[0020] Preferably, the raw materials for preparing the white glue layer include the following components in terms of weight fraction:

[0021] 40-60 parts of silicone-based polymer;

[0022] 10-20 parts of white pigment;

[0023] 2.5-9 parts of auxiliary agent.

[0024] As a preferred technical solution of the present application, the raw materials for preparing the white glue layer include silicone-based polymer, white pigment, and auxiliary agent, and the performance of the white glue layer can be adjusted according to the specific components as required.

[0025] Preferably, the amount of silicone-based polymer in the raw materials for preparing the white glue layer can be 40 parts, 42 parts, 44 parts, 46 parts, 48 parts, 50 parts, 52 parts, 54 parts, 56 parts, 58 parts, 60 parts, etc. in terms of weight fraction.

[0026] Preferably, the amount of white pigment in the raw materials for preparing the white glue layer can be 10 parts, 12 parts, 14 parts, 16 parts, 18 parts, 20 parts, etc. in terms of weight fraction. ​

[0027] Preferably, the amount of the auxiliary agent in the preparation of the white glue layer can be 2.5 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, etc. by weight.

[0028] Preferably, the white pigment includes titanium dioxide particles.

[0029] Preferably, the auxiliary agent includes any one or a combination of at least two of a coupling agent, a curing agent, a catalyst, a leveling agent, and an inhibitor.

[0030] Preferably, the coupling agent includes an organosilicon coupling agent.

[0031] Preferably, the organosilicon coupling agent has a general structure of RSiX3, where R is an organic group and X is a hydrolyzable group.

[0032] Preferably, the organic group is selected from any one or a combination of at least two of -C6H5 or -CH=CH2.

[0033] Preferably, the hydrolyzable group is selected from any one or a combination of at least two of -OCH3, -OC2H5, or -Cl.

[0034] Preferably, the curing agent includes MeSi(ONCMe2)3 and / or MeSi(OMe)3.

[0035] Preferably, the catalyst includes a platinum complex catalyst.

[0036] Preferably, the platinum complex catalyst includes H2PtCl6-i-PrOH and / or H2PtCl6·6H2O.

[0037] Preferably, the leveling agent includes any one or a combination of at least two of MONENG-1071, MONENG-1073, and MONENG-1074.

[0038] Preferably, the inhibitor includes vinyltrimethoxysilane and / or hyperbranched polyethyleneimine.

[0039] Preferably, the auxiliary agent includes: coupling agent 0.5-1.5 parts (for example, 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.3 parts, 1.5 parts, etc.), curing agent 1-3 parts (for example, 1 part, 1.5 parts, 2 parts, 2.5 parts, 3 parts, etc.), catalyst 0.5-1.5 parts (for example, 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.3 parts, 1.5 parts, etc.), leveling agent 0.5-2 parts (for example, 0.5 parts, 0.6 parts, 0.8 parts, 1 part, 1.2 parts, 1.3 parts, 1.5 parts, 1.6 parts, 1.8 parts, 2 parts, etc.), inhibitor 0.01-1 parts (for example, 0.01 parts, 0.03 parts, 0.05 parts, 0.08 parts, 0.1 parts, 0.2 parts, 0.3 parts, 0.5 parts, 0.8 parts, 1 parts, etc.).

[0040] Preferably, the mini-LED lamp bead is connected to the substrate through a pin, and the height of the white glue layer is not lower than the lower end of the mini-LED lamp bead and not higher than the upper end of the mini-LED lamp bead. Generally, the higher the thickness of the white reflective layer, the higher the reflectivity. The white ink can only be about 30 μm due to the thickness limitation, and therefore the reflectivity can only reach 89% at most. However, the white glue layer of the present application is not limited by the thickness, as long as it is lower than the height of the chip (i.e. not higher than the upper end of the mini-LED lamp bead), and therefore the reflectivity can reach more than 95%.

[0041] Preferably, the thickness of the white glue layer is 80-140 μm, for example, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, etc.

[0042] Preferably, the thickness of the surface glue layer is 250-350 μm, for example, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, etc.

[0043] It should be noted that the surface glue layer mainly plays a protective role and is transparent. The present application does not specifically limit the components of the surface glue layer, which can be conventional components on the market, for example, it can be an organic silicon component.

[0044] As a preferred technical solution of the present application, the white glue and surface glue used in the present application are both silicone-based glue materials, which have obvious advantages in many aspects compared with acrylic white ink, such as significantly improved reliability in high temperature resistance, high temperature and humidity resistance, UV resistance, etc., and are more suitable for use in vehicle-mounted environments, etc.

[0045] Preferably, the substrate is a PCB board or a glass plate.

[0046] In a second aspect, the present application provides a preparation method of the mini-LED backlight reflection module according to the first aspect, and the preparation method comprises the following steps:

[0047] (1) providing a substrate with distributed mini-LED lamp beads;

[0048] (2) mixing raw materials of a white glue layer to obtain white glue, and then the white glue is spot-coated on one side of the substrate with distributed mini-LED lamp beads, and after the white glue is naturally leveled, it is solidified to form a white glue layer;

[0049] (3) spot-coating a face glue on the side of the white glue layer away from the substrate to form a face glue layer, thereby obtaining the mini-LED backlight reflection module.

[0050] In the preparation method provided by the present application, the spot-gluing process is used to replace the silk-screen printing, exposure development, and photolithography process of the ink, and the steps are simple and the thickness is controllable; the whole-surface spraying of the face glue on the lamp panel is used to replace the spot-lens glue process of the ink, and the process is simple.

[0051] Preferably, the spot-coating in step (2) specifically comprises: spot-coating a plurality of glue lines between two adjacent mini-LED lamp beads, wherein the number of the plurality of glue lines is ≥2 (for example, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc.), the distance between two adjacent glue lines is 0.8-1.2 mm (for example, 0.8 mm, 0.9 mm, 1 mm, 1.1 mm, 1.2 mm, etc.), and the distance between the mini-LED lamp bead and its nearest glue line is 0.4-0.6 mm, for example, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, etc.

[0052] Preferably, the solidification in step (2) specifically comprises: pre-solidification at 50-70℃ (for example, 50℃, 55℃, 60℃, 65℃, 70℃, etc.) for 20-40 min (for example, 20 min, 25 min, 30 min, 35 min, 40 min, etc.), and then solidification at 140-160℃ (for example, 140℃, 145℃, 150℃, 155℃, 160℃, etc.) for 50-70 min (for example, 50 min, 55 min, 60 min, 65 min, 70 min, etc.).

[0053] Compared with the prior art, the present application has the following beneficial effects:

[0054] (1) The mini-LED backlight reflection module provided by the present application uses a white glue layer made of an organic silicon-based high polymer as the backlight reflection layer, which has high reflectivity, excellent thermal stability, etc., and the content of phenyl and methyl can be adjusted to adjust the performance of the material itself.

[0055] (2)The present application fills the gap between the lamp beads by the leveling property of the white glue, realizes the full coverage of the glue on the lamp panel, the structure design is novel, simple and easy to operate, compared with the white ink layer as the backlight reflection layer in the prior art, greatly improves the reflectivity and greatly reduces the power consumption (reduces by about 15-20%).

[0056] (3)The present application utilizes the leveling property of the glue, and the wavy microstructure formed after curing can effectively concentrate light to improve light efficiency and improve light utilization, thereby ultimately improving the reflectivity of the lamp panel (more than 95%).

[0057] (4)The present application adopts the whole surface spraying of the face glue to replace the original lens glue, which not only achieves the same light output effect as the prior art, but also more effectively protects the lamp beads and the reflection layer, simplifies the structure design, and improves the production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0058] Figure 1 Schematic diagram of the reaction of the compound of the present application formula (I) and formula (II).

[0059] Figure 2 Structure schematic diagram of the mini-LED backlight reflection module provided by the prior art (left figure) and the present application (right figure).

[0060] Figure 3 Top view schematic diagram of the mini-LED backlight reflection module provided by the prior art.

[0061] Figure 4 Light path schematic diagram of the mini-LED backlight reflection module provided by the prior art (upper figure) and the present application (lower figure).

[0062] Figure 5 Dispensing path schematic diagram of the white glue layer of the present application.

[0063] Figure 6 Actual light path diagram of the white glue layer in the mini-LED backlight reflection module provided by the present application. DETAILED DESCRIPTION

[0064] The technical solutions of the present application will be further described below through specific embodiments. Those skilled in the art should understand that the embodiments are only to help understand the present application and should not be regarded as specific limitations of the present application.

[0065] As described in the background, when white ink is used as a backlight reflection layer, there are disadvantages such as low reflectivity, low light utilization efficiency, the need for exposure and development in the process step, increased cost and process time, etc.

[0066] The structural schematic diagram of the prior art and the mini-LED backlight reflection module provided by the present application is shown in Figure 2 , wherein the left drawing is the structural schematic diagram of the mini-LED backlight reflection module in the prior art, and the right drawing is the structural schematic diagram of the mini-LED backlight reflection module provided by the present application. As can be seen, in the white ink process of the prior art, a reflective cup or a reflective sheet is needed to improve the light pattern, and then lens glue is needed to protect and improve the light emission at each lamp bead point, which is relatively complex and time-consuming. In the present application, the leveling property of the glue can be relied on to infiltrate into the bottom of the lamp bead, so that the reflective cup or the reflective sheet is no longer needed. In addition, after the white glue is heat-cured, a layer of high-transparency surface glue (with controllable thickness) can be applied on the surface of the white glue, which is simple in process and can greatly improve the efficiency compared with the white ink solution.

[0067] The top view schematic diagram of the mini-LED backlight reflection module provided by the prior art is shown in Figure 3 , and the light path schematic diagrams of the mini-LED backlight reflection module provided by the prior art and the present application are shown in Figure 4 , respectively.

[0068] The traditional white ink solution is to first silk-print white ink and then print keys, and then apply lens glue to improve the light pattern and protection. The area occupied by the lens glue at the same point is much larger than the lamp bead, which will cause a large number of light invalid areas (empty light areas, as shown in Figure 3 ). The light loss is large during work. In the present application, the keys are printed first and then the white glue is applied, so the leveling property of the glue itself can be used to fill into the bottom of the lamp bead, leaving no gap (no empty light area), so the effective reflection area is larger than that of the white ink solution. During the work of the lamp panel, in addition to the direct emission, the rest of the light is refracted between the surface glue and the air interface (as shown in Figure 4 ), and can also be emitted after oscillation, greatly improving the utilization efficiency of light.

[0069] In the present application, the glue application path of the white glue layer is designed and optimized, and a plurality of (for example, 5) glue lines can be applied between two adjacent lamps. The glue application path schematic diagram of the white glue layer of the present application is shown in Figure 5 . The white glue layer is filled into the bottom of the lamp bead by the natural leveling of the glue, achieving full coverage of the lamp panel. Since the glue itself has a certain viscosity (for example, 500 mPa.s), the microstructure of the white glue layer after leveling is not completely flat (macroscopically flat), but will form a wavy structure as shown in Figure 6 , which will slightly protrude on both sides of the lamp bead, which will play a certain light collecting effect and can effectively improve the utilization of light, thereby improving the reflectivity of the entire lamp panel.

[0070] The technical solutions of the present application will be further described through specific embodiments.

[0071] Embodiment 1

[0072] In this embodiment, a mini-LED backlight reflection module is provided, which comprises:

[0073] a substrate;

[0074] mini-LED lamp beads distributed on the substrate;

[0075] a white adhesive layer provided on the side of the substrate where the mini-LED lamp beads are distributed, with a thickness of 100 μm;

[0076] a surface adhesive layer provided on the side of the white adhesive layer away from the substrate, with a thickness of 300 μm;

[0077] The raw materials for preparing the white adhesive layer include the following components in terms of weight fraction:

[0078]

[0079]

[0080] Among them, the organosilicon polymer includes compounds with structures as shown in the following formula (I) and formula (II):

[0081]

[0082] Among them, formula (I) is a phenyl vinyl silicone resin (the molar content of phenyl is 40%), formula (II) is a phenyl hydrogen-containing silicone oil (the molar content of phenyl is 30%), R1 is H; the molar ratio of formula (I) and formula (II) is 1:1;

[0083] The white pigment is titanium dioxide particles; the coupling agent is an organosilicon coupling agent RSiX3, where R is -C6H5 and X is -OCH3; the curing agent is MeSi(ONCMe2)3; the catalyst is H2PtCl6-i-PrOH; the leveling agent is MONENG-1071; and the inhibitor is vinyl trimethoxysilane;

[0084] The raw materials for preparing the surface adhesive layer include the following components in terms of weight fraction:

[0085]

[0086] The preparation method of the mini-LED backlight reflection module includes the following steps:

[0087] (1) providing a substrate with distributed mini-LED lamp beads;

[0088] (2) mixing the raw materials for preparing the white glue layer to obtain white glue, and dotting the white glue on the side of the substrate where the mini-LED lamp beads are distributed, and after the white glue is naturally leveled, pre-curing at 60°C for 30 min, and then curing at 150°C for 60 min to form the white glue layer;

[0089] (3) dotting face glue on the side of the white glue layer away from the substrate to form a face glue layer, thereby obtaining the mini-LED backlight reflection module.

[0090] In step (2), the dotting specifically includes: dotting 5 glue lines between two adjacent mini-LED lamp beads, and the distance between two adjacent glue lines is 1 mm, and the distance between the mini-LED lamp bead and the nearest glue line is 0.5 mm.

[0091] Example 2

[0092] The difference between this embodiment and Example 1 is only that the thickness of the white glue layer is 105 μm.

[0093] Example 3

[0094] The difference between this embodiment and Example 1 is only that the thickness of the white glue layer is 110 μm.

[0095] Example 4

[0096] The difference between this embodiment and Example 1 is only that the thickness of the white glue layer is 115 μm.

[0097] Example 5

[0098] The difference between this embodiment and Example 1 is only that the thickness of the white glue layer is 120 μm.

[0099] Example 6

[0100] The difference between this embodiment and Example 1 is only that the specific components of the organosilicon-based polymer are different, and are as follows: the organosilicon-based polymer includes phenyl vinyl silicone resin (the molar content of phenyl is 40%), phenyl hydrogen-containing silicone oil (the molar content of phenyl is 30%), and phenyl hydrogen-containing silicone oil (the molar content of phenyl is 20%) at a molar ratio of 1:1:1.

[0101] Example 7

[0102] The difference between this embodiment and Example 1 is only that the specific components of the organosilicon-based polymer are different, and are as follows: the organosilicon-based polymer includes phenyl vinyl silicone resin (the molar content of phenyl is 50%), phenyl vinyl silicone resin (the molar content of phenyl is 40%), and phenyl hydrogen-containing silicone oil (the molar content of phenyl is 30%) at a molar ratio of 1:1:1.

[0103] Comparative Example 1

[0104] In the present comparative example, a mini-LED backlight reflection module in the prior art is provided, the structure schematic diagram of which is as shown in the left drawing of FIG. 1, wherein the thickness of the white ink layer is 30 μm. Figure 2

[0105] Comparative Example 2

[0106] The only difference between the present comparative example and Example 1 is that the specific components of the organosilicon-based high polymer are different, which are as follows: the organosilicon-based high polymer includes phenyl vinyl silicone resin (the molar content of phenyl is 10%) and phenyl hydrogen-containing silicone oil (the molar content of phenyl is 30%) in a molar ratio of 1:1.

[0107] Comparative Example 3

[0108] The only difference between the present comparative example and Example 1 is that the specific components of the organosilicon-based high polymer are different, which are as follows: the organosilicon-based high polymer includes phenyl vinyl silicone resin (the molar content of phenyl is 50%) and phenyl hydrogen-containing silicone oil (the molar content of phenyl is 50%) in a molar ratio of 1:1.

[0109] The performance of the mini-LED backlight reflection modules provided by the examples and comparative examples of the present application is tested, and the performance test results are shown in Table 1.

[0110] Table 1

[0111]

[0112]

[0113] In Table 1, the thickness is the measured thickness of the white glue layer after curing, and the average value is tested; the power consumption test is to control the brightness at 1000 nit, and the voltage is uniformly 13V, and the corresponding power consumption is finally obtained by testing the current; the power consumption test only includes the lamp panel, and does not include the power panel and other external hardware.

[0114] As can be seen from Table 1, compared with the white ink used as the backlight reflection layer in the prior art (Comparative Example 1), the mini-LED backlight reflection module prepared by using the white glue layer as the backlight reflection layer in the present application has higher reflectivity (94.54%-95.76%) and lower power consumption (7.93-8.32W), which can reduce the power consumption by about 15%-20%.

[0115] ​Compared with Example 1, although the power consumption of the backlight reflection module provided by Comparative Example 2-3 only slightly increases, the reflectivity is similar, but in Comparative Example 2, the content of phenyl in the organosilicon polymer is too low, which makes the white glue layer soft and the glass transition temperature too low, which is easy to cover the lamp beads, and in Comparative Example 3, the content of phenyl in the organosilicon polymer is too high, which makes the white glue layer brittle.

[0116] The applicant declares that the mini-LED backlight reflection module and the preparation method thereof of the present application are illustrated by the above examples, but the present application is not limited to the above examples, that is, it does not mean that the present application must rely on the above examples to be implemented. Those skilled in the art should understand that any improvement of the present application, equivalent replacement of the selected materials of the present application, addition of auxiliary ingredients, selection of specific methods, etc. fall within the protection scope and disclosure scope of the present application.

Claims

1. A mini-LED backlight reflective module, characterized in that: The mini-LED backlight reflective module includes: substrate; mini-LED lamp beads, which are distributed on the substrate; A white glue layer is provided on a side of the substrate where mini-LED lamp beads are distributed; a surface adhesive layer, which is arranged on a side of the white adhesive layer away from the substrate; The raw materials for preparing the white glue layer include organic silicon polymers, and the molar content of phenyl groups in the organic silicon polymers is 30%-40%.

2. The mini-LED backlight reflective module according to claim 1, wherein: The organosilicon polymer includes compounds having the structures described in the following formula (I) and formula (II): In formula (I) and formula (II), n is independently selected from an integer of 10-1000, and in formula (II), R1 is selected from H or a C1-C10 alkyl group.

3. The mini-LED backlight reflective module according to claim 2, wherein: The molar ratio of the compounds of the structures described in formula (I) to formula (II) is 1:(1-10).

4. The mini-LED backlight reflective module according to any one of claims 1 to 3, wherein: The raw materials for preparing the white glue layer include the following components in parts by weight: 40-60 parts of silicone polymer; 10-20 parts of white pigment; 2.5-9 parts of additives.

5. The mini-LED backlight reflective module according to claim 4, wherein: The white pigment includes titanium dioxide particles; Preferably, the auxiliary agent includes any one or a combination of at least two of a coupling agent, a curing agent, a catalyst, a leveling agent, and an inhibitor; Preferably, the auxiliary agent includes: 0.5-1.5 parts of coupling agent, 1-3 parts of curing agent, 0.5-1.5 parts of catalyst, 0.5-2 parts of leveling agent, and 0.01-1 part of inhibitor.

6. The mini-LED backlight reflective module according to any one of claims 1 to 5, wherein: The mini-LED lamp bead is connected to the substrate through a pin, and the height of the white glue layer is not lower than the lower end of the mini-LED lamp bead and not higher than the upper end of the mini-LED lamp bead; Preferably, the thickness of the white glue layer is 80-140 μm.

7. The mini-LED backlight reflective module according to any one of claims 1 to 6, wherein: The thickness of the surface adhesive layer is 250-350 μm.

8. A method for preparing a mini-LED backlight reflective module according to any one of claims 1 to 7, characterized in that: The preparation method comprises the following steps: (1) Providing a substrate with mini-LED lamp beads distributed; (2) Mixing the raw materials for preparing the white glue layer to obtain white glue, applying the white glue on the side of the substrate where the mini-LED lamp beads are distributed, and solidifying the white glue after it naturally flows and levels to form a white glue layer; (3) Applying surface glue on the side of the white glue layer away from the substrate to form a surface glue layer to obtain the mini-LED backlight reflection module.

9. The preparation method according to claim 8, characterized in that The spot coating in step (2) specifically includes: spot coating a plurality of glue lines between two adjacent mini-LED lamp beads, wherein the plurality of lines is ≥2, the spacing between two adjacent glue lines is 0.8-1.2mm, and the spacing between the mini-LED lamp bead and its nearest glue line is 0.4-0.6mm.

10. The preparation method according to claim 8 or 9, characterized in that: The curing in step (2) specifically includes: pre-curing at 50-70° C. for 20-40 minutes, and then curing at 140-160° C. for 50-70 minutes.

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