Detection method of heat dissipation device and electronic equipment

Abstract

The invention discloses a heat dissipation device detection method and electronic equipment, and the method comprises the steps: responding to a detection instruction for a first heat dissipation device, and sequentially setting a plurality of heat dissipation parameters for the first heat dissipation device; the heat dissipation parameters set each time are different, and the different heat dissipation parameters are used for controlling the first heat dissipation device to meet different heat dissipation requirements; the first heat dissipation device is composed of a plurality of heat dissipation units in the flowing direction of heat dissipation airflow. Under the condition that the operation load of the first equipment is controlled to meet a fixed condition, collecting first temperature data of a first part in the first equipment under each heat dissipation parameter; the first component is arranged in a heat dissipation area corresponding to the first heat dissipation device; and determining whether the first heat dissipation device is abnormal or not according to the first temperature data.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of computer, in particular to a detection method of a heat dissipation device and an electronic device. BACKGROUND

[0002] The fan is arranged in the case, and each component on the mainboard can be cooled by the fan. However, the fan rotor may be installed reversely in the fan production process, so that the fan cannot effectively cool the corresponding component.

[0003] At present, it can only be detected whether the fan rotor is installed reversely by manually opening the case and checking one by one. SUMMARY

[0004] Therefore, the present application provides a detection method of a heat dissipation device and an electronic device, as follows:

[0005] The detection method of the heat dissipation device comprises the following steps.

[0006] In response to a detection instruction for a first heat dissipation device, a plurality of heat dissipation parameters are sequentially set for the first heat dissipation device; the heat dissipation parameter set each time is different, and different heat dissipation parameters are used to control the first heat dissipation device to cope with different heat dissipation requirements; the first heat dissipation device is composed of a plurality of heat dissipation units along the flow direction of the heat dissipation air flow;

[0007] In the case where the running load of the first device meets the fixed condition, first temperature data of a first component in the first device under each heat dissipation parameter is collected; the first component is arranged in the heat dissipation area corresponding to the first heat dissipation device;

[0008] According to the first temperature data, it is determined whether the first heat dissipation device is abnormal.

[0009] The above method, preferably, the first temperature data comprises a first temperature value and a second temperature value corresponding to the first component; the first temperature value is the temperature value corresponding to the first component when the first heat dissipation device is set to the first heat dissipation parameter, and the second temperature value is the temperature value corresponding to the first component when the first heat dissipation device is set to the second heat dissipation parameter;

[0010] According to the first temperature data, it is determined whether the first heat dissipation device is abnormal, comprising:

[0011] According to the first temperature value and the second temperature value, a first temperature difference value is obtained;

[0012] According to a difference between the first temperature difference and a first standard threshold, it is determined whether the first heat dissipation device is abnormal, wherein the first standard threshold is a predetermined theoretical temperature difference.

[0013] Preferably, according to a difference between the first temperature difference and a first standard threshold, it is determined whether the first heat dissipation device is abnormal, wherein the first standard threshold is a predetermined theoretical temperature difference.

[0014] In a case where the first temperature difference is less than or equal to the first standard threshold, it is determined that the first heat dissipation device is abnormal.

[0015] In a case where the first temperature difference is greater than the first standard threshold, it is determined whether the first heat dissipation device is abnormal in a first manner.

[0016] Preferably, the first standard threshold is related to a deployment parameter of the first component in the first device.

[0017] Different deployment parameters correspond to different first standard thresholds.

[0018] Preferably, determining whether the first heat dissipation device is abnormal in the first manner comprises:

[0019] According to a first heat dissipation parameter of the first heat dissipation device, a second heat dissipation parameter of a second heat dissipation device is set; the second component is disposed in a heat dissipation region corresponding to the second heat dissipation device; the first component and the second component are the same type of components in the first device.

[0020] A first temperature value of the first component under the first heat dissipation parameter and a third temperature value of the second component under the first heat dissipation parameter are collected.

[0021] According to the first temperature value and the third temperature value, it is determined whether any of the first heat dissipation device and the second heat dissipation device is abnormal.

[0022] Preferably, according to the first temperature value and the third temperature value, it is determined whether any of the first heat dissipation device and the second heat dissipation device is abnormal, comprising:

[0023] According to the first temperature value and the third temperature value, a second temperature difference is obtained.

[0024] According to a difference between the second temperature difference and a second standard threshold, it is determined whether any of the first heat dissipation device and the second heat dissipation device is abnormal.

[0025] The method, preferably, determines whether an abnormality exists in the first heat dissipation device and the second heat dissipation device according to a difference between the second temperature difference and a second standard threshold value, and includes:

[0026] In a case where the second temperature difference is greater than or equal to the second standard threshold value, it is determined that the heat dissipation device corresponding to the maximum temperature value of the first temperature value and the third temperature value has an abnormality.

[0027] In a case where the second temperature difference is less than the second standard threshold value, it is determined that the first heat dissipation device and the second heat dissipation device do not have an abnormality or both have an abnormality.

[0028] The method, preferably, determines whether an abnormality exists in the first heat dissipation device in the first mode, and includes:

[0029] According to the first heat dissipation parameter set for the first heat dissipation device, a third heat dissipation parameter is set for a third heat dissipation device in a second device; the third heat dissipation device has a third component disposed in a heat dissipation region corresponding to the third heat dissipation device; the first component and the third component are the same type of component;

[0030] In a case where the running load of the second device meets the fixed condition, a first temperature value of the first component under the first heat dissipation parameter and a fourth temperature value of the third component under the first heat dissipation parameter are collected;

[0031] According to the first temperature value and the fourth temperature value, it is determined whether an abnormality exists in the first heat dissipation device and the third heat dissipation device.

[0032] The method, preferably, further includes:

[0033] In response to the detection instruction, the first device is controlled to restart;

[0034] During the restart of the first device, a UEFI system in the first device performs a stress processing to make the running load of the first device meet the fixed condition.

[0035] An electronic device, including:

[0036] A first heat dissipation device; the first heat dissipation device is composed of a plurality of heat dissipation units along a heat dissipation airflow flow direction;

[0037] A first component;

[0038] The processor is configured to set a plurality of heat dissipation parameters for the first heat dissipation device in sequence in response to a detection instruction for the first heat dissipation device, the heat dissipation parameter set each time is different, and the different heat dissipation parameters are used to control the first heat dissipation device to cope with different heat dissipation requirements; in the case that the running load of the electronic device meets a fixed condition, first temperature data of the first component under each heat dissipation parameter is collected; the first component is arranged in a heat dissipation area corresponding to the first heat dissipation device; and whether the first heat dissipation device is abnormal is determined according to the first temperature data.

[0039] It can be seen from the above technical solution that, in the detection method of the heat dissipation device and the electronic device disclosed in the present application, a plurality of different heat dissipation parameters are set for the heat dissipation device in sequence, in the case that the running load of the electronic device meets a fixed condition, temperature data of components arranged in a heat dissipation area corresponding to the heat dissipation device under each heat dissipation parameter can be collected, and then whether the heat dissipation device is abnormal can be determined according to the temperature data. It can be seen that, in the present application, the electronic device does not need to be unpacked, but the temperature data of the components in the heat dissipation area under a plurality of heat dissipation parameters is used to realize the abnormal detection of the heat dissipation device, so that the present application can reduce the user operation complexity of detecting the heat dissipation device. BRIEF DESCRIPTION OF DRAWINGS

[0040] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0041] Figure 1 A flowchart of a detection method of a heat dissipation device provided by an embodiment of the present application;

[0042] Figure 2 An example diagram of a heat dissipation device in an embodiment of the present application;

[0043] Figure 3 An example diagram of the first heat dissipation device dissipating heat for the first component in an embodiment of the present application;

[0044] Figure 4 A partial flowchart of a detection method of a heat dissipation device provided by an embodiment of the present application;

[0045] Figure 5 Another partial flowchart of a detection method of a heat dissipation device provided by an embodiment of the present application;

[0046] Figure 6 Still another partial flowchart of a detection method of a heat dissipation device provided by an embodiment of the present application;

[0047] Figure 7 Another example diagram of a heat dissipation device in the embodiments of the present application is shown in FIG. 6.

[0048] Figure 8 Another example diagram of a heat dissipation device in the embodiments of the present application is shown in FIG. 6.

[0049] Figure 9 Another example diagram of a heat dissipation device in the embodiments of the present application is shown in FIG. 6.

[0050] Figure 10 Another example diagram of a heat dissipation device in the embodiments of the present application is shown in FIG. 6.

[0051] Figure 11 Another example diagram of a heat dissipation device in the embodiments of the present application is shown in FIG. 6.

[0052] Figure 12 Another example diagram of a heat dissipation device in the embodiments of the present application is shown in FIG. 6. DETAILED DESCRIPTION

[0053] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0054] Reference Figure 1 An implementation flowchart of a detection method of a heat dissipation device provided by the embodiments of the present application is shown in FIG. 5. The method can be applied to electronic devices, such as servers, notebooks, etc., which are deployed with heat dissipation devices. The technical solution in the present embodiment is mainly used to reduce the user operation complexity of detecting the heat dissipation device.

[0055] Specifically, the method in the present embodiment can include the following steps:

[0056] Step 101: In response to a detection instruction for a first heat dissipation device, a plurality of heat dissipation parameters are set for the first heat dissipation device in sequence.

[0057] The first heat dissipation device is a heat dissipation device that needs to be detected for abnormalities in the first device. The abnormality detection in the present embodiment can be abnormality detection of whether the heat dissipation device is installed reversely. The heat dissipation device installed reversely means that the air outlet of the heat dissipation device does not correspond to the heat dissipation area corresponding to the heat dissipation device.

[0058] It should be noted that the heat dissipation parameters set for the first heat dissipation device are different each time in this embodiment. Different heat dissipation parameters are used to control the first heat dissipation device to cope with different heat dissipation demands; the first heat dissipation device is composed of a plurality of heat dissipation units along the flow direction of the heat dissipation airflow. For example, as shown in Figure 2 In the bottom plate for installing the heat dissipation device, the flow direction of the heat dissipation airflow of the heat dissipation device is marked. When installing the heat dissipation device, the air outlet of the heat dissipation device needs to be consistent with the flow direction of the heat dissipation airflow. If it is not consistent, the heat dissipation device is installed in reverse.

[0059] For example, the first heat dissipation device can include a plurality of heat dissipation fans, which are arranged along the flow direction of the heat dissipation airflow in the heat dissipation area, so that the heat dissipation airflows output by the heat dissipation fans are in the same direction and together dissipate heat for the components in the heat dissipation area. As shown in Figure 3 The first heat dissipation device corresponds to the first component arranged inside the heat dissipation area, which can be a processor, a memory, etc. The first heat dissipation device can include a plurality of heat dissipation fans, which output heat dissipation airflows to dissipate heat for the first component.

[0060] Different heat dissipation parameters can make the airflow size and airflow area of the heat dissipation airflows output by the first heat dissipation device different. For example, taking the fan speed ratio (the proportion of the actual fan speed in the maximum fan speed) as an example, different fan speeds can control the heat dissipation device to cope with different heat dissipation demands. In the case that the heat dissipation device is not abnormal (i.e. not installed in reverse), different heat dissipation parameters can achieve different heat dissipation effects.

[0061] Step 102: Control the running load of the first device to meet a fixed condition.

[0062] In an implementation manner, the processor and the memory in the first device can be stressed in this embodiment, so that the processor is fully loaded and stable, and at the same time, the cache data in the memory is fully loaded and stable.

[0063] Specifically, the control of the running load of the first device in this embodiment can be realized by running a specific stress tool, so that the running load meets the fixed condition.

[0064] In a specific implementation, the first device can be restarted in response to a detection instruction in this embodiment, and the Unified Extensible Firmware Interface (UEFI) system in the first device performs stress processing during the restart of the first device, so that the running load of the first device meets the fixed condition.

[0065] Step 103: Collect first temperature data of the first component in the first device under each heat dissipation parameter.

[0066] In the embodiment, the first temperature data of the first component under each heat dissipation parameter can be collected by the temperature sensor arranged for the first component.

[0067] In step 104, whether the first heat dissipation device has an abnormality is determined according to the first temperature data.

[0068] Specifically, in the embodiment, the first temperature data can be compared in temperature value, and whether the first heat dissipation device has an abnormality is determined based on the comparison result of the temperature value. It can be seen that, in the embodiment, whether the heat dissipation device has an abnormality can be determined by the temperature difference of the components in the heat dissipation region of the heat dissipation device under different heat dissipation parameters.

[0069] As can be seen from the above technical solution, in the detection method of the heat dissipation device provided by the embodiment, by sequentially setting a plurality of different heat dissipation parameters for the heat dissipation device, under the condition that the running load of the electronic equipment meets the fixed condition, the temperature data of the components arranged in the corresponding heat dissipation region of the heat dissipation device under each heat dissipation parameter can be collected, and then whether the heat dissipation device has an abnormality can be determined according to the temperature data. It can be seen that, in the present application, the electronic equipment does not need to be unpacked, but the abnormality detection of the heat dissipation device is realized by the temperature data of the components in the heat dissipation region under a plurality of heat dissipation parameters, so that the user operation complexity of detecting the heat dissipation device can be reduced.

[0070] In an implementation manner, the detection triggering interface can be provided for the user in the embodiment, the user can select the components which need to be detected for abnormality of the heat dissipation device in the detection triggering interface, based on which, after receiving the detection triggering operation of the user in the detection triggering interface for the first component, the heat dissipation device in which the first component is arranged, i.e., the first heat dissipation device, can be determined, and thus the detection instruction for the first heat dissipation device can be generated.

[0071] In another implementation manner, the detection triggering interface can be provided for the user in the embodiment, the user can select the heat dissipation device which needs to be detected for abnormality in the detection triggering interface, based on which, after receiving the detection triggering operation of the user in the detection triggering interface for the first heat dissipation device, the detection instruction for the first heat dissipation device can be generated, and at the same time, the first heat dissipation device corresponding to the first component can be determined.

[0072] In an implementation manner, the first temperature data can include a first temperature value and a second temperature value corresponding to the first component. The first temperature value is the temperature value corresponding to the first component when the first heat dissipation device is set to the first heat dissipation parameter. The second temperature value is the temperature value corresponding to the first component when the first heat dissipation device is set to the second heat dissipation parameter.

[0073] For example, taking the first heat dissipation device as a heat dissipation fan and the first component as a processor as an example, the first temperature value is the real-time temperature value of the processor when the heat dissipation fan is deployed at a first fan speed ratio, such as 50%; and the second temperature value is the real-time temperature value of the processor when the heat dissipation fan is deployed at a second fan speed ratio, such as 80%.

[0074] It should be noted that the first temperature value and the second temperature value can each be an average temperature value obtained by collecting temperature values of the first component at multiple time points within a specific time length and taking an average value.

[0075] Based on this, when determining whether the first heat dissipation device is abnormal according to the first temperature data in step 104, the following method can be used, as shown in Figure 4

[0076] Step 401: Obtain a first temperature difference value according to the first temperature value and the second temperature value.

[0077] For example, the first temperature value is subtracted from the second temperature value to obtain the first temperature difference value.

[0078] Step 402: Determine whether the first heat dissipation device is abnormal according to the difference between the first temperature difference value and a first standard threshold value.

[0079] The first standard threshold value is a pre-determined theoretical temperature difference value.

[0080] It should be noted that the first standard threshold value corresponds to the first component, different first components correspond to different first heat dissipation devices, and correspondingly, different first components correspond to different first standard threshold values. Specifically, the first standard threshold value is related to the deployment parameters of the first component in the first device, and different deployment parameters correspond to different first standard threshold values.

[0081] The deployment parameters can be the deployment position of the first component in the electronic device or the component type of the first component, such as the component model, etc. For example, the respective first standard threshold values of a central processing unit (CPU) and a dual inline memory module (DIMM) are different. For another example, the respective first standard threshold values of a CPU and a disk are different.

[0082] Based on this, in this embodiment, the first temperature difference value is compared with the first standard threshold value corresponding to the first component, and whether the first heat dissipation device is abnormal is determined based on the size relationship between the first temperature difference value and the first standard threshold value.

[0083] Specifically, as shown in Figure 5 ​As shown in , step 402 can be implemented in the following ways:

[0084] Step 501: Determine whether the first temperature difference is less than or equal to the first standard threshold. If the first temperature difference is less than or equal to the first standard threshold, execute step 502; if the first temperature difference is greater than the first standard threshold, execute step 503.

[0085] Step 502: Determine whether the first heat dissipation device is abnormal.

[0086] If the first temperature difference is less than or equal to the first standard threshold, it may indicate that the heat dissipation effect achieved on the first component is not obvious under different heat dissipation parameters, and therefore it may be determined that the first heat dissipation device is abnormal.

[0087] Step 503: Determine whether the first heat dissipation device has an abnormality in a first manner.

[0088] Among them, if the first temperature difference is greater than the first standard threshold, this embodiment does not determine whether there is an abnormality in the first heat dissipation device, because the parameter gap between the first heat dissipation parameter and the second heat dissipation parameter may be too large or other external factors such as external temperature changes may cause inaccurate temperature value collection. At this time, this embodiment can further determine whether there is an abnormality in the first heat dissipation device in the first way.

[0089] In a specific implementation, in step 503, when determining whether the first heat dissipation device is abnormal in the first manner, it can be implemented in the following manner: Figure 6 As shown in:

[0090] Step 601: setting a first heat dissipation parameter for a second heat dissipation device according to the first heat dissipation parameter set for the first heat dissipation device.

[0091] The second component is disposed in the heat dissipation area corresponding to the second heat dissipation device, and the first component and the second component are components of the same type in the first device, such as the same type of CPU or the same type of DIMM.

[0092] For example, Figure 7 As shown in FIG, two CPUs, CPU1 and CPU2, are deployed on the motherboard of the host. Each CPU is equipped with a cooling fan, namely, cooling fan 1 and cooling fan 2. In this embodiment, the fan speed ratio of cooling fan 2 corresponding to CPU 2 is set according to the fan speed ratio of cooling fan 1 corresponding to CPU 1. The fan speed ratios of cooling fan 1 and cooling fan 2 are the same.

[0093] Step 602: Collect a first temperature value of a first component under a first heat dissipation parameter and a third temperature value of a second component under the first heat dissipation parameter.

[0094] In the embodiment, the first temperature value of the first component under the first heat dissipation parameter and the third temperature value of the second component under the first heat dissipation parameter can be collected through the temperature sensors respectively arranged for the first component and the second component.

[0095] In step 603, whether there is an abnormal heat dissipation device in the first heat dissipation device and the second heat dissipation device is determined according to the first temperature value and the third temperature value.

[0096] Specifically, in the embodiment, the first temperature value and the third temperature value can be compared, and whether there is an abnormal heat dissipation device in the first heat dissipation device and the second heat dissipation device is determined based on the comparison result of the temperature values.

[0097] It can be seen that, in the embodiment, the temperature difference between two same type components in different heat dissipation regions of different heat dissipation devices in the same device under the same heat dissipation parameter can be used to determine whether there is an abnormal heat dissipation device in the two heat dissipation devices.

[0098] In the specific implementation, in step 603, whether there is an abnormal heat dissipation device in the first heat dissipation device and the second heat dissipation device is determined according to the first temperature value and the third temperature value. This can be realized by the following manners, such as: Figure 8

[0099] In step 801, the second temperature difference value is obtained according to the first temperature value and the third temperature value.

[0100] For example, the first temperature value and the third temperature value are subtracted to obtain the second temperature difference value.

[0101] In step 802, whether there is an abnormal heat dissipation device in the first heat dissipation device and the second heat dissipation device is determined according to the difference between the second temperature difference value and the second standard threshold value.

[0102] The second standard threshold value is a pre-determined theoretical temperature difference value. The second standard threshold value corresponds to the second component, and is related to the deployment parameter of the second component in the first device, such as the deployment position or the device type. The second standard threshold value and the first standard threshold value can be the same threshold value.

[0103] Specifically, in the embodiment, the second temperature difference value and the second standard threshold value can be compared, and whether there is an abnormal heat dissipation device in the first heat dissipation device and the second heat dissipation device is determined based on the relationship between the second temperature difference value and the second standard threshold value.

[0104] ​Among them, in this embodiment, when the second temperature difference is greater than or equal to the second standard threshold, it can be determined that one of the two heat dissipation devices must have an abnormality, which makes it impossible to normally dissipate heat for the corresponding components, which will cause the second temperature difference to reach or exceed the second standard threshold. Therefore, in this embodiment, it can be determined that the heat dissipation device corresponding to the largest temperature value between the first temperature value and the third temperature value has an abnormality.

[0105] In this embodiment, when the second temperature difference is less than the second standard threshold, it can be determined that the states of the two heat dissipation devices are synchronized, so that the difference between the temperature values ​​of the first component and the second component is small. At this time, in this embodiment, it can be determined that there is no abnormality in the first heat dissipation device and the second heat dissipation device or both have abnormalities.

[0106] For example, Figure 7 For example, if the temperature difference between CPU1 and CPU2 exceeds 5 degrees (the second standard threshold), the cooling fan corresponding to the component with the highest temperature in CPU1 and CPU2 can be determined to be abnormal.

[0107] In another specific implementation, in step 503, when determining whether the first heat dissipation device is abnormal in the first manner, it can be implemented in the following manner: Figure 9 As shown in:

[0108] Step 901: According to the first heat dissipation parameter set for the first heat dissipation device, set the first heat dissipation parameter for the third heat dissipation device in the second device.

[0109] A third component is disposed in the heat dissipation area corresponding to the third heat dissipation device, and the third component and the first component are components of the same type in different devices.

[0110] For example, Figure 10 As shown in FIG, CPU 1 is deployed on the mainboard of host 1, and CPU 2 is deployed on the mainboard of host 2. Each CPU is deployed with a cooling fan, namely, cooling fan 1 and cooling fan 2. In this embodiment, the fan speed ratio of cooling fan 2 corresponding to CPU 2 in host 2 is set according to the fan speed ratio of cooling fan 1 corresponding to CPU 1 in host 1, and the fan speed ratios of cooling fan 1 and cooling fan 2 are the same.

[0111] Step 902: Control the operating load of the second device to meet the fixed condition.

[0112] In one implementation, in this embodiment, the processor and memory in the second device can be pressurized so that the processor is fully loaded and stable, and the cached data in the memory is fully loaded and stable. Specifically, in this embodiment, the operating load of the second device can be controlled by running a specific pressurization tool so that the operating load meets fixed conditions. The first device and the second device are consistent in operating load based on fixed conditions. For example, in the first device and the second device, the processors are both fully loaded and stable, and the cached data in the memory is fully loaded and stable.

[0113] In a specific implementation, in this embodiment, the second device can be controlled to restart in response to a detection instruction. During the restart of the second device, the UEFI system in the second device performs a pressurization process so that the operating load of the second device meets fixed conditions.

[0114] Step 903: Collect a first temperature value of the first component under the first heat dissipation parameter and a fourth temperature value of the third component under the first heat dissipation parameter.

[0115] In this embodiment, the first temperature value of the first component under the first heat dissipation parameter and the fourth temperature value of the third component under the first heat dissipation parameter can be collected by respectively deploying temperature sensors for the first component and the third component.

[0116] Step 904: Determine whether there is an abnormality in the first heat dissipation device and the third heat dissipation device according to the first temperature value and the fourth temperature value.

[0117] Specifically, in this embodiment, the first temperature value and the fourth temperature value may be compared, and based on the comparison result of the temperature values, it is determined whether there is an abnormality in the first heat dissipation device and the second heat dissipation device.

[0118] It can be seen that in this embodiment, whether there is an abnormal heat sink in different devices can be determined by the temperature difference between two components of the same type under the same heat dissipation parameters in the heat dissipation areas of different heat sinks.

[0119] In a specific implementation, in step 904, a third temperature difference can be obtained based on the first temperature value and the fourth temperature value. For example, the first temperature value is numerically subtracted from the fourth temperature value to obtain the third temperature difference. Then, based on the gap between the third temperature difference and the third standard threshold, it is determined whether there is an abnormality in the heat dissipation device between the first heat dissipation device and the third heat dissipation device.

[0120] The third standard threshold is a predetermined theoretical temperature difference. The third standard threshold corresponds to the third component and is related to the deployment parameters of the third component in the second device, such as the deployment location or the device type. The third standard threshold can be the same as the first standard threshold.

[0121] Specifically, in the embodiment, the third temperature difference can be compared with the third standard threshold, and based on the relationship between the third temperature difference and the third standard threshold, it is determined whether an abnormality exists in the first heat dissipation device and the second heat dissipation device.

[0122] In the embodiment, if the third temperature difference is greater than or equal to the third standard threshold, it can be determined that one of the two heat dissipation devices has an abnormality that prevents it from normally dissipating heat from the corresponding component, which causes the third temperature difference to reach or exceed the third standard threshold. Therefore, in the embodiment, the heat dissipation device corresponding to the maximum temperature value between the first temperature value and the fourth temperature value is determined to have an abnormality.

[0123] In the embodiment, if the third temperature difference is less than the third standard threshold, it can be determined that the states of the two heat dissipation devices are synchronized, which causes the temperature difference between the first component and the third component to be small. In this case, in the embodiment, it can be determined that the first heat dissipation device and the third heat dissipation device either both have an abnormality or neither has an abnormality.

[0124] For example, in the case of Figure 10 For example, if the temperature difference between CPU1 in host 1 and CPU2 in host 2 exceeds 5 degrees (the second standard threshold), the heat dissipation fan corresponding to the component with the highest temperature among CPU1 and CPU2 is determined to have an abnormality.

[0125] Referring to Figure 11 FIG. 1 is a structural schematic diagram of a heat dissipation device detection device provided by an embodiment of the application. The device can be applied to an electronic device in which a heat dissipation device is deployed, such as a server, a notebook computer, and the like. The technical solution in the embodiment is mainly used to reduce the complexity of user operation for detecting a heat dissipation device.

[0126] Specifically, the device in the embodiment can include the following units:

[0127] The parameter setting unit 1101 is configured to, in response to a detection instruction for the first heat dissipation device, sequentially set a plurality of heat dissipation parameters for the first heat dissipation device. Each time, the heat dissipation parameter is different, and different heat dissipation parameters are used to control the first heat dissipation device to cope with different heat dissipation requirements. The first heat dissipation device is composed of a plurality of heat dissipation units along the flow direction of the heat dissipation air flow.

[0128] The temperature collection unit 1102 is configured to collect first temperature data of a first component in the first device under each heat dissipation parameter in a case where a running load of the first device meets a fixed condition; the first component is arranged in a heat dissipation region corresponding to the first heat dissipation device.

[0129] The anomaly determination unit 1103 is configured to determine whether the first heat dissipation device has an anomaly according to the first temperature data.

[0130] As can be seen from the above technical solution, in the detection device for the heat dissipation device provided in the embodiment of the present application, a plurality of different heat dissipation parameters are sequentially arranged for the heat dissipation device, and in a case where a running load of the electronic device meets a fixed condition, temperature data of components arranged in a heat dissipation region corresponding to the heat dissipation device under each heat dissipation parameter can be collected, and then whether the heat dissipation device has an anomaly can be determined according to the temperature data. It can be seen that, in the present application, the electronic device does not need to be unpacked, but the temperature data of the components in the heat dissipation region under a plurality of heat dissipation parameters is used to realize anomaly detection of the heat dissipation device, so that the present application can reduce the user operation complexity of detecting the heat dissipation device.

[0131] In an implementation manner, the first temperature data includes a first temperature value and a second temperature value corresponding to the first component; the first temperature value is a temperature value corresponding to the first component in a case where the first heat dissipation device is set to a first heat dissipation parameter, and the second temperature value is a temperature value corresponding to the first component in a case where the first heat dissipation device is set to a second heat dissipation parameter.

[0132] The anomaly determination unit 1103 is specifically configured to: obtain a first temperature difference value according to the first temperature value and the second temperature value; and determine whether the first heat dissipation device has an anomaly according to a difference between the first temperature difference value and a first standard threshold value, the first standard threshold value being a pre-determined theoretical temperature difference value. For example, in a case where the first temperature difference value is less than or equal to the first standard threshold value, it is determined that the first heat dissipation device has an anomaly; and in a case where the first temperature difference value is greater than the first standard threshold value, it is determined whether the first heat dissipation device has an anomaly in a first manner.

[0133] The first standard threshold value is related to a deployment parameter of the first component in the first device; and different deployment parameters correspond to different first standard threshold values.

[0134] In an implementation manner, the abnormality determining unit 1103 is specifically configured to, when determining whether the first heat dissipation device is abnormal in the first manner: set the first heat dissipation parameter for a second heat dissipation device according to the first heat dissipation parameter set for the first heat dissipation device; the second component is arranged in the heat dissipation region corresponding to the second heat dissipation device; the first component and the second component are the same type of components in the first device; collect a first temperature value of the first component under the first heat dissipation parameter and a third temperature value of the second component under the first heat dissipation parameter; and determine whether the first heat dissipation device and the second heat dissipation device are abnormal according to the first temperature value and the third temperature value.

[0135] Specifically, when the abnormality determining unit 1103 determines whether the first heat dissipation device and the second heat dissipation device are abnormal according to the first temperature value and the third temperature value, the following manner can be used: obtain a second temperature difference value according to the first temperature value and the third temperature value; and determine whether the first heat dissipation device and the second heat dissipation device are abnormal according to the difference between the second temperature difference value and a second standard threshold. For example, in a case where the second temperature difference value is greater than or equal to the second standard threshold, it is determined that the heat dissipation device corresponding to the maximum temperature value of the first temperature value and the third temperature value is abnormal; and in a case where the second temperature difference value is less than the second standard threshold, it is determined that the first heat dissipation device and the second heat dissipation device are both normal or both abnormal.

[0136] In another implementation manner, the abnormality determining unit 1103 is specifically configured to, when determining whether the first heat dissipation device is abnormal in the first manner: set the first heat dissipation parameter for a third heat dissipation device in a second device according to the first heat dissipation parameter set for the first heat dissipation device; the third component is arranged in the heat dissipation region corresponding to the third heat dissipation device; the first component and the third component are the same type of components; collect a first temperature value of the first component under the first heat dissipation parameter and a fourth temperature value of the third component under the first heat dissipation parameter when the running load of the second device meets the fixed condition; and determine whether the first heat dissipation device and the third heat dissipation device are abnormal according to the first temperature value and the fourth temperature value.

[0137] In an implementation manner, the temperature collecting unit 1102 is further configured to, in response to the detection instruction, control the first device to restart; so that, during the restart of the first device, the UEFI system in the first device performs a pressure processing to make the running load of the first device meet the fixed condition.

[0138] It should be noted that the specific implementation mode of each unit in the present embodiment can refer to the corresponding content in the foregoing, which will not be described in detail here.

[0139] Reference Figure 12 A structural schematic diagram of an electronic device provided in the present embodiment can be a server, a notebook computer, etc. The technical solution in the present embodiment is mainly used for reducing the user operation complexity of detecting a heat dissipation device.

[0140] Specifically, the electronic device in the present embodiment can include the following structure:

[0141] a first heat dissipation device 1201; the first heat dissipation device is composed of a plurality of heat dissipation units along the flow direction of a heat dissipation airflow;

[0142] a first component 1202;

[0143] a processor 1203, configured to: in response to a detection instruction for the first heat dissipation device 1201, sequentially set a plurality of heat dissipation parameters for the first heat dissipation device 1201, the heat dissipation parameter set each time being different, and different heat dissipation parameters being used to control the first heat dissipation device 1201 to cope with different heat dissipation requirements; in a case where the running load of the electronic device meets a fixed condition, collect first temperature data of the first component 1202 under each heat dissipation parameter; the first component 1202 is arranged in a heat dissipation region corresponding to the first heat dissipation device 1201; and determine whether the first heat dissipation device 1201 is abnormal according to the first temperature data.

[0144] As can be seen from the above technical solution, in the electronic device provided in the present embodiment, a plurality of different heat dissipation parameters are sequentially set for a heat dissipation device, in a case where the running load of the electronic device meets a fixed condition, temperature data of a component arranged in a heat dissipation region corresponding to the heat dissipation device under each heat dissipation parameter can be collected, and then whether the heat dissipation device is abnormal can be determined according to the temperature data. It can be seen that, in the present application, the electronic device does not need to be unpacked, but the temperature data of the component in the heat dissipation region under a plurality of heat dissipation parameters is used to realize the abnormal detection of the heat dissipation device, so that the present application can reduce the user operation complexity of detecting the heat dissipation device.

[0145] Taking a server as an example, in order to realize whether the server heat dissipation fan is installed reversely, the technical solution of the present application is described as follows:

[0146] Because the heat dissipation fan rotor is installed reversely, the components in the server cannot be effectively cooled, the user can manually unpack and check one by one, but this will increase the difficulty and cost of troubleshooting. Therefore, the present application proposes a scheme which can automatically detect the installation problem of the heat dissipation fan in the factory and the customer site.

[0147] In the present application, a scheme for testing the fan by stressing the CPU / memory is provided in the factory test stage of the server or in the customer site. In the case of fixed load of the CPU / memory, the speed of the cooling fan is first set at 50%, and the temperature of the corresponding components of the cooling fan, such as the CPU temperature, is collected during a period of operation. Then, the speed is set to 100%, and the CPU temperature is collected during a period of operation. Based on this, the Baseboard Management Controller (BMC) in the server records the temperatures of all components, such as the CPU / memory / boards / disk, and compares them. Specifically, the BMC can compare the temperature difference (i.e., the first temperature difference) of the components in the same fan zone of the same cooling fan at different speeds; or the BMC can compare the temperature difference (i.e., the second temperature difference) of two same types of components in the same fan zone of different cooling fans at the same speed; or the BMC can compare the temperature difference (i.e., the third temperature difference) of two same types of components in the same fan zone of two cooling fans included in two devices at the same speed. Thus, if it is found that the temperature of the components does not change significantly (e.g., the first temperature difference is less than 5 degrees) when the cooling fan is accelerated, it is reported that the corresponding cooling fan of the fan zone has an abnormal installation.

[0148] Specifically, in the present embodiment, a fan detection command can be issued to the server by the factory staff or the on-site engineer through a test tool. When the fan test command is issued, the BMC restarts the machine, i.e., restarts the UEFI of the server, and during the UEFI startup process, a tool for stressing the CPU / DIMM, such as a PTU (power tuning unit), is loaded and stably operated for a period of time (e.g., 30 seconds). Based on this, during the CPU stressing process, the BMC sets the fan speed to 50% and 100% for half of the time (e.g., 15 seconds), and monitors the temperatures of the components (CPU / memory / boards / disk) of the server during this period. When the stressing is completed, the BMC calculates the average temperatures of the components in the same fan zone when the fan is at 50% and 100%. For example, the temperature of the CPU, the average temperature of the memory, the average temperature of the disk, and the temperature of the board in the same fan zone. Then, the BMC compares whether the difference between the average temperatures of the same component when the fan is at 50% and 100% is significantly reduced (e.g., whether the first temperature difference is less than 5 degrees). If the temperature of the component does not change significantly (e.g., the first temperature difference is less than 5 degrees) when the fan speed changes (from 50% to 100%), it is reported that the corresponding fan of the fan zone is abnormal, i.e., the rotor is installed in reverse.

[0149] It can be seen that in the embodiment, under the condition of pressurization, the BMC calculates the average temperature of various components in different fan regions under different fan speeds, and based on this, the BMC can compare the temperatures of various components in different fan regions to see if there is a significant difference. If it is found that the temperatures of all components in one fan region are generally higher than those of the corresponding components in another fan region, for example, the card, hard disk, and memory are all 5 degrees higher, it is considered that the fan corresponding to the fan region is abnormal, and the fan corresponding to the fan region is reported to be abnormal.

[0150] Further, in the factory stage, the BMC can also upload the corresponding test log to a dedicated server. Then the temperature comparison (i.e. the third temperature difference) between the same configuration servers can be performed to determine whether there is an abnormal cooling fan.

[0151] It can be seen that in the technical solution of the application, similar problems of fan rotor installation in reverse can be prevented in the factory stage, and in the customer site, there is also a way to automatically detect the problem of fan rotor installation in reverse without opening the cover. In addition, the application does not need to increase additional hardware to achieve this purpose.

[0152] The embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple, and the related parts can be referred to the method part.

[0153] The skilled person can further realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be realized by electronic hardware, computer software or a combination of the two. In order to clearly show the interchangeability of hardware and software, the components and steps of the examples have been described in the above description. Whether the functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the application.

[0154] The steps of the method or algorithm described in combination with the embodiments disclosed herein can be directly implemented by hardware, software modules executed by a processor, or a combination of the two. The software modules can be placed in random access memory (RAM), memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disks, removable disks, CD-ROMs, or any other form of storage medium known in the art.

[0155] The foregoing description of the disclosed embodiments enables a person skilled in the art to make or use the application. Modifications of these embodiments will occur to persons of skill in the art, and that the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Therefore, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for detecting a heat dissipation device, comprising: In response to a detection instruction for a first heat dissipation device, sequentially setting a plurality of heat dissipation parameters for the first heat dissipation device; The heat dissipation parameters set each time are different, and the different heat dissipation parameters are used to control the first heat dissipation device to meet different heat dissipation requirements; the first heat dissipation device is composed of a plurality of heat dissipation units along the flow direction of the heat dissipation airflow; Under the condition that the operating load of the first device is controlled to meet a fixed condition, first temperature data of a first component in the first device under each of the heat dissipation parameters is collected; the first component is deployed in a heat dissipation area corresponding to the first heat dissipation device; Determine whether the first heat dissipation device has an abnormality according to the first temperature data.

2. The method according to claim 1, wherein the first temperature data comprises: a first temperature value and a second temperature value corresponding to the first component; The first temperature value is a temperature value corresponding to the first component when the first heat dissipation device is set to a first heat dissipation parameter, and the second temperature value is a temperature value corresponding to the first component when the first heat dissipation device is set to a second heat dissipation parameter; Determining whether the first heat dissipation device is abnormal according to the first temperature data includes: Obtaining a first temperature difference according to the first temperature value and the second temperature value; Whether the first heat dissipation device is abnormal is determined based on the gap between the first temperature difference and a first standard threshold value, where the first standard threshold value is a predetermined theoretical temperature difference value.

3. The method according to claim 2, wherein determining whether the first heat dissipation device is abnormal based on the difference between the first temperature difference and a first standard threshold value comprises: When the first temperature difference is less than or equal to a first standard threshold, determining that an abnormality exists in the first heat dissipation device; When the first temperature difference is greater than the first standard threshold, it is determined in a first manner whether the first heat dissipation device has an abnormality.

4. The method according to claim 2, wherein the first standard threshold is related to a deployment parameter of the first component in the first device; in, Different deployment parameters correspond to different first standard thresholds.

5. The method according to claim 3, wherein determining whether the first heat dissipation device has an abnormality in a first manner comprises: setting the first heat dissipation parameter for the second heat dissipation device according to the first heat dissipation parameter set for the first heat dissipation device; A second component is disposed in the heat dissipation area corresponding to the second heat dissipation device; the first component and the second component are components of the same type in the first device; collecting a first temperature value of the first component under the first heat dissipation parameter and a third temperature value of the second component under the first heat dissipation parameter; It is determined whether there is an abnormality in the first heat dissipation device or the second heat dissipation device according to the first temperature value and the three temperature values.

6. The method according to claim 5, wherein determining whether one of the first heat sink and the second heat sink has an abnormality according to the first temperature value and the third temperature value comprises: Obtaining a second temperature difference according to the first temperature value and the third temperature value; It is determined whether there is an abnormality in one of the first heat dissipation device and the second heat dissipation device according to the gap between the second temperature difference and a second standard threshold.

7. The method according to claim 6, wherein determining whether one of the first heat sink and the second heat sink has an abnormality based on the difference between the second temperature difference and a second standard threshold value comprises: When the second temperature difference is greater than or equal to a second standard threshold, determining that an abnormality exists in the heat dissipation device corresponding to the maximum temperature value between the first temperature value and the third temperature value; When the second temperature difference is less than the second standard threshold, it is determined that neither the first heat dissipation device nor the second heat dissipation device has an abnormality or both have an abnormality.

8. The method according to claim 4, wherein determining whether the first heat dissipation device has an abnormality in a first manner comprises: setting the first heat dissipation parameter for a third heat dissipation device in the second device according to the first heat dissipation parameter set for the first heat dissipation device; A third component is disposed in the heat dissipation area corresponding to the third heat dissipation device; the first component and the third component are components of the same type; Under the condition that the operating load of the second device is controlled to meet the fixed condition, collecting a first temperature value of the first component under the first heat dissipation parameter and a fourth temperature value of the third component under the first heat dissipation parameter; It is determined whether there is an abnormality in either the first heat dissipation device or the third heat dissipation device according to the first temperature value and the fourth temperature value.

9. The method according to claim 1, further comprising: In response to the detection instruction, controlling the first device to restart; During the restart of the first device, the UEFI system in the first device performs a pressurization process so that the running load of the first device meets the fixed condition.

10. An electronic device comprising: a first heat dissipation device; The first heat dissipation device is composed of a plurality of heat dissipation units along the flow direction of the heat dissipation airflow; first component; The processor is configured to, in response to a detection instruction for the first heat dissipation device, sequentially set a plurality of heat dissipation parameters for the first heat dissipation device, wherein the heat dissipation parameters set each time are different, and the different heat dissipation parameters are used to control the first heat dissipation device to meet different heat dissipation requirements; while controlling the operating load of the electronic device to meet fixed conditions, collect first temperature data of the first component under each of the heat dissipation parameters; the first component is deployed in a heat dissipation area corresponding to the first heat dissipation device; and determine whether the first heat dissipation device has an abnormality based on the first temperature data.

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