Server and power supply method

Abstract

The invention provides a server and a power supply method, which can be applied to the technical field of servers. The server comprises a signal board which extends along a first direction and divides the internal space of the server into a first area and a second area; the processing equipment and the computing equipment are arranged in the first area and are electrically connected with the signal board; the power supply equipment is at least partially arranged in the first area; and the power distribution equipment is arranged in the second area and is electrically connected with the power supply equipment and the signal board.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of servers, in particular to a server and a power supply method. BACKGROUND

[0002] With the development of new Internet technologies such as cloud computing, artificial intelligence, and big data, the performance of servers is becoming more and more powerful, and the computing scale is becoming larger and larger. In this case, the artificial intelligence (AI) server has problems such as low power supply power density, complex architecture, and difficult maintenance. SUMMARY

[0003] The present application provides a server and a power supply method.

[0004] According to a first aspect of the present application, a server is provided, comprising: a signal board extending along a first direction, the signal board separating an internal space of the server into a first region and a second region; a processing device and a computing device disposed in the first region and electrically connected to the signal board; a power supply device at least partially disposed in the first region; a power distribution device disposed in the second region and electrically connected to the power supply device and the signal board; wherein the power supply device is configured to supply power to the power distribution device, so that the power distribution device supplies power to the processing device and the computing device via a wire in the signal board.

[0005] A second aspect of the present application provides a power supply method for the server as described above, comprising: the power supply device supplying power to the power distribution device, so that the power distribution device supplies power to the processing device and the computing device via the wire in the signal board.

[0006] According to embodiments of the present application, the processing device and the computing device are disposed in the first region of the internal space of the server, the power supply device is at least partially disposed in the first region, and the power distribution device is disposed in the second region. In this way, by partially disposing the power supply device in the first region where the processing device and the computing device are located, and disposing the power distribution device in another region, it is convenient to maintain the power supply device, and there is relatively sufficient space to set up a high-power power supply device. On this basis, the power supply device supplies power to the power distribution device, and then the power distribution device supplies power to other devices via the wire in the signal board, thereby improving the power density of power supply. Moreover, since the power distribution device, the processing device, and the computing device transmit signals via the signal board, the signal path is shortened, the use of cables is reduced, and the complexity of the server architecture is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0007] The above and other objects, features and advantages of the present application will become more apparent from the following description of embodiments of the present application taken with reference to the accompanying drawings, in which:

[0008] Figure 1A A schematic diagram of a server according to an embodiment of the application is shown.

[0009] Figure 1B A schematic diagram of a server according to another embodiment of the application is shown.

[0010] Figure 2 A schematic diagram of a signal board according to an embodiment of the application is shown.

[0011] Figure 3 A schematic diagram of a server according to another embodiment of the application is shown.

[0012] Figure 4 A schematic diagram of a server according to another embodiment of the application is shown.

[0013] Figure 5 A schematic diagram of a server according to another embodiment of the application is shown.

[0014] Figure 6 A schematic diagram of a server according to another embodiment of the application is shown.

[0015] Figure 7 A top view of a power distribution board according to an embodiment of the application is shown.

[0016] Figure 8 A schematic diagram of a power distribution board according to another embodiment of the application is shown.

[0017] Figure 9 A schematic diagram of a power distribution board according to an embodiment of the application is shown.

[0018] Figure 10 A connection diagram of a power distribution board and a signal board according to an embodiment of the application is shown.

[0019] Figure 11 A schematic diagram of a heat dissipation device according to an embodiment of the application is shown.

[0020] Figure 12 A flowchart of a power supply method according to an embodiment of the application is shown. DETAILED DESCRIPTION

[0021] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. It is to be understood, however, the description is merely exemplary of the present application, and therefore not to be used in a limiting sense. In the following detailed description of embodiments of the present application, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that one or more embodiments of the present application can be practiced without these specific details. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring the concepts of the present application.

[0022] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "comprising" or "comprises" or "including" or "includes" or "containing" or "contains" or "has" or "having" or the like is used in the sense of "including" and / or "comprising" but not limited to, meaning and range ending the particular recited item or items precede them, and does not exclude other moieties, steps or components.

[0023] All terms used herein including technical and scientific terms have the meanings commonly understood by one of ordinary skill in the art unless otherwise defined. It should be noted that the use of certain terms or terminology in this specification is intended to be illustrative and not limiting. Unless otherwise clear from the context, words using the singular or plural number also include the plural or singular number respectively.

[0024] In situations where similar terminology is used in a similar context but with a different meaning, terminology is intended to be interpreted where the entire term is presented, not just a part of the defined term that might differ from other instances of the same term.

[0025] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate relative or positional relationships based on the orientation or position shown in the drawings, and are used only for convenience of description and simplification of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mount", "connected", "connected" should be understood broadly, for example, it can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through intermediate medium, can be the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the case similar to the described case, the range of the similar case is within the acceptable deviation range, wherein the acceptable deviation range is determined by the ordinary skilled in the art considering the measurement being discussed and the error related to the measurement of specific quantity (i.e. the limitation of measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be within 5° deviation for example; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be within 5° deviation for example. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be that the difference between the two equalities is less than or equal to 5% of either one for example. The specific meaning of the above terms in the present application can be understood according to the specific circumstances for the ordinary skilled in the art.

[0026] With the development of new Internet technologies such as cloud computing, AI intelligence, and big data, the performance of servers is becoming more and more powerful, and the scale of server computing is becoming larger, so that the number and power of devices such as central processing units (CPUs), graphics processing units (GPUs), and switches are becoming larger and larger. However, high power and high computing power will have many influences on the design of the server system. For example, the high power corresponding to the large current transmission will increase the current transmission impedance loss of the board card printed circuit board (PCB) copper foil. High power requires efficient heat dissipation, which requires a high board card opening rate, but this situation will cause the copper foil area of the board card to decrease, limiting signal transmission. At the same time, efficient heat dissipation also requires reducing the interconnection cables between the board cards, and high and low speed signals require board-to-board interconnection. On this basis, the connection between complex board cards requires interconnection between multiple types of connectors, which brings challenges to board card assembly and maintenance. The large power flow of the complex board card connector, the special structure, and other reasons also lead to an increase in the resources consumed in manufacturing.

[0027] In one scheme, the central processor (which can be a server motherboard, etc.) and the graphics processor are each located in an independent area or independent chassis, and the central processor and the graphics processor each use an independent power supply device (such as a power supply unit (PSU)) for power supply. And the central processor and the graphics processor each use an independent heat dissipation device for heat dissipation. In this way, the heat dissipation device of the central processor and the graphics processor needs to be maintained separately. And since the heat dissipation device of the central processor is generally built-in in the central processor, it is difficult to directly maintain in the powered-on state, which affects the online operation of the server.

[0028] In addition, the heat dissipation device of the central processor, the central processor, and the power supply device of the central processor are arranged in the horizontal direction in sequence. In this way, the power supply device of the central processor needs to pass through the central processor to supply power to the heat dissipation device of the central processor. In this way, the power supply device of the central processor has a long path to supply power to the heat dissipation device of the central processor. In the case of maintaining the power supply path, the top chassis cover of the central processor needs to be opened for maintenance.

[0029] Similarly, a Peripheral Component Interconnect Express Switch (PCIE Switch), an image processor, and a power supply device of the image processor are arranged in a horizontal direction in sequence. In this way, a power supply path of the power supply device of the image processor to the PCIE Switch crosses the image processor, and the same problem of a long power supply path exists. In addition, the power supply device is generally a 54V power supply, and such a power supply has a small size and limited power, and it is difficult to meet the demand of a high-power image processor.

[0030] In addition, the image processor and the central processor are generally stacked in a vertical direction, so that in the case of maintaining the image processor, the central processor and the image processor device need to be separated first, and then the case cover of the lower image processor can be opened to maintain the image processor or the PCIE Switch.

[0031] In some schemes, the image processor and the PCIE Switch can be designed in the form of a drawer so as to be pulled out and maintained. However, the image processor and the PCIE Switch are heavy, and the drawer stroke is long, so that the convenience of pulling is low, and thus the maintenance of the image processor and the PCIE Switch is difficult. In this way, the image processor and the central processor interfere with each other, and the maintenance difficulty is increased. In addition, since the image processor and the central processor are mainly connected through a high-speed cable, the high-speed cable has a high cost and poor connection reliability, and when the cable is loose, it may affect the stable operation of the system.

[0032] Therefore, the present application provides a server.

[0033] Figure 1A A schematic diagram of a server according to an embodiment of the present application is shown. Figure 1B A schematic diagram of a server according to another embodiment of the present application is shown.

[0034] As shown in Figure 1A , the server includes a signal board MBP, a processing device CPU BOX, a computing device GPU BOX, a power distribution device PD, and a power supply device PS. In addition, as shown in Figure 1B , in some embodiments, the server can further include a cooling device CBOX, etc.

[0035] The signal board MBP can extend in a first direction Z (e.g., which can be a vertical direction) within the server, but embodiments of the present application are not limited thereto, and in some embodiments, the signal board MBP can also extend in a second direction X orthogonal to the first direction Z. In this way, the signal board MBP can divide the internal space of the server into a first region and a second region. The signal board MBP can have a first face and a second face facing away from each other, and the first face and the second face can also extend in the first direction Z. The first face of the signal board MBP can face the first region. The second face of the signal board MBP can face the second region. The first face and the second face of the signal board MBP can be respectively provided with a plurality of interfaces, so as to be electrically connected to other devices within the server via pins in the interfaces, such as a processing device CPU BOX, a computing device GPU BOX, a heat dissipation device CBOX, a power distribution device PD, a power supply device PS, and the like.

[0036] The processing device CPU BOX can be disposed in the first region. The processing device CPU BOX can include a server mainboard and a switching board, etc. The server mainboard can be provided with a central processing unit, etc. For example, the processing device CPU BOX can be provided in a box shape so as to load the server mainboard and the switching board. The computing device GPU BOX can also be disposed in the first region. The computing device GPU BOX can include an image processor, etc. Similarly, the computing device GPU BOX can also be provided in a box shape so as to load the computing device such as the image processor.

[0037] The processing device CPU BOX and the computing device GPU BOX are arranged on the first surface of the signal board MBP to be electrically connected with the signal board MBP. In this way, the processing device CPU BOX and the computing device GPU BOX can be electrically connected via the wirings in the signal board MBP. The processing device CPU BOX can include an interface for connecting the signal board MBP. The pins in the interface of the processing device CPU BOX are electrically connected with the pins in the interface of the signal board MBP. Similarly, the computing device GPU BOX can also include an interface for connecting the signal board MBP. The pins in the interface of the computing device GPU BOX can also be electrically connected with the pins in the interface of the signal board MBP. On this basis, the server mainboard, the switching board and the computing device GPU BOX can be interconnected via the wirings in the signal board MBP. For example, the high-speed signals and the low-speed signals of the central processor of the server mainboard can be transmitted to the switching board and the computing device GPU BOX through the signal board MBP. However, the embodiments of the present application are not limited thereto, and the central processor can also be connected to the switching board through a cable, so that the signals are transmitted to the computing device GPU BOX through the wirings in the switching board and the interconnection board. The computing device GPU BOX will generate heat when performing calculation. In this regard, the processing device CPU BOX can control the cooling device CBOX to cool the computing device GPU BOX.

[0038] The cooling device CBOX can be arranged in the first region or the second region. In this embodiment, the cooling device CBOX is arranged in the second region. The cooling device CBOX can include a cooling device such as a fan. The cooling device CBOX can be arranged on the second surface of the signal board MBP to be electrically connected with the signal board MBP. For example, the cooling device CBOX can include an interface for connecting the signal board MBP. The pins in the interface of the cooling device CBOX can also be electrically connected with the pins in the interface of the signal board MBP. In this way, the processing device CPU BOX and the cooling device CBOX can be electrically connected via the wirings in the signal board MBP, so that the processing device CPU BOX sends a control signal to the cooling device CBOX. In this way, the multiple cooling devices (which can be fans, etc.) in the cooling device CBOX can be uniformly dispatched, and the complexity of cooling regulation is reduced.

[0039] The power distribution device PD can be arranged in the second region. The power distribution device PD can include a power distribution board. The power distribution device PD can include an interface for connecting the signal board MBP. The pins in the interface of the power distribution device PD can also be electrically connected with the pins in the interface of the second surface of the signal board MBP. The power distribution device PD can be located on the side of the power supply device PS close to the signal board MBP in a third direction Y (which can be a horizontal direction) orthogonal to the first direction Z, and be electrically connected with the power supply device PS.

[0040] The power supply device PS can be disposed at least partially in the first region. For example, the power supply device can be disposed in the first region, or can be partially disposed in the first region and additionally partially disposed in the second region. The power supply device PS can include a power supply unit, etc. For example, the power supply device PS can be disposed in a box shape so as to accommodate the power supply unit. In this case, the projection of the processing device in the first direction coincides at least partially with the projection of the computing device, and the projection of the computing device coincides at least partially with the projection of the power supply device.

[0041] Specifically, the power supply device PS can be located beside the processing device CPU BOX and the computing device GPU BOX in the first direction Z, for example, the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX. For example, in an embodiment of the present application, the pins in the interface of the power supply device PS can be electrically connected to the interface pins of the first face of the signal board MBP, thereby being electrically connected to the power distribution device PD via the signal board MBP. However, embodiments of the present application are not limited thereto, and in another embodiment of the present application, the power supply device PS can also be electrically connected to the power distribution device PD below the signal board MBP. For example, a space is formed between the lower face of the signal board MBP and the first inner face of the server (for example, the inner bottom face of the server), facilitating the electrical connection between the power supply device PS and the power distribution device PD at the space. In this case, the projection of the power supply device PS in the third direction Y (for example, the projection in the horizontal plane) can not overlap the projection of the signal board MBP in the third direction Y (for example, the projection in the horizontal plane), or can at least partially overlap the projection of the signal board MBP on the bottom face of the server. For example, the power supply device PS can be electrically connected to the power distribution device PD via the pins in the interface of the power supply device PS and the pins in the interface of the power distribution device PD. In addition to being connected to the power supply device PS, the power distribution device PD can also be connected to the processing device CPU BOX, the computing device GPU BOX and the heat dissipation device CBOX via the wires in the signal board MBP. On this basis, the signal board MBP can serve as an important bridge for high-speed signals, low-speed signals and power flow, realizing high-density high-speed signal interconnection, low-speed signal interconnection and power signal transmission. For example, the signal board MBP can be electrically connected to the power distribution device PD to provide, for example, a 54V direct current voltage to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD, so that the power distribution device PD supplies power to the processing device CPU BOX, the computing device GPU BOX and the heat dissipation device CBOX via the wires in the signal board MBP.

[0042] Based on this, the processing device CPU BOX and the computing device GPU BOX are arranged in the first region of the internal space of the server, the power supply device PS is arranged at least partially in the first region, and the power distribution device PD is arranged in the second region. In this way, by arranging the power supply device PS partially in the first region where the processing device CPU BOX and the computing device GPU BOX are located, and arranging the power distribution device PD in another region, it is convenient to maintain the power supply device PS, and a relatively sufficient space can be provided for arranging the power supply device PS with high power. On this basis, the power supply device PS supplies power to the power distribution device PD, and the power distribution device PD supplies power to other devices through the wiring in the signal board MBP, thereby improving the power density of power supply. Moreover, since the power distribution device PD, the processing device CPU BOX and the computing device GPU BOX perform signal transmission through the signal board MBP, the signal path is shortened, the use of cables is reduced, and the complexity of the server architecture is reduced.

[0043] In the embodiments of the present application, the power supply device PS, the processing device CPU BOX and the computing device GPU BOX are arranged at intervals along the first direction Z. For example, along the first direction Z, the power supply device, the processing device and the computing device can be arranged in sequence. For example, the power supply device PS, the processing device CPU BOX and the computing device GPU BOX can be arranged in the front part (i.e. the first region) of the server, so that it is convenient to maintain the power supply device PS, the processing device CPU BOX and the computing device GPU BOX after failure. Specifically, in the case of taking the first direction Z as the projection direction, the projection of the processing device CPU BOX at least partially coincides with the projection of the computing device GPU BOX, and the projection of the computing device GPU BOX at least partially coincides with the projection of the power supply device PS, thereby avoiding the mutual influence of the devices in structure, reducing the complexity of the server architecture, and facilitating maintenance. The heat dissipation device CBOX and the power distribution device PD can also be arranged in sequence along the first direction Z. For example, the heat dissipation device CBOX and the power distribution device PD can be arranged in the rear part (i.e. the second region) of the server.

[0044] On this basis, at least one of the processing device CPU BOX, the computing device GPU BOX and the power supply device PS is slidingly arranged in the internal space. For example, the processing device CPU BOX can slide between a first position and a second position, and in a state where the processing device CPU BOX is in the second position, the processing device CPU BOX is electrically connected with the signal board MBP. For another example, the computing device GPU BOX can slide between a first position and a second position, and in a state where the computing device GPU BOX is in the second position, the computing device GPU BOX is electrically connected with the signal board MBP. For yet another example, the power supply device PS can slide between a first position and a second position, and in a state where the power supply device PS is in the second position, the power supply device PS is electrically connected with the power distribution device PD. The first position can correspond to a position where the entire device is outside the server. The second position can correspond to a position where the entire device is inside the server.

[0045] Specifically, the power supply device PS, the processing device CPU BOX and the computing device GPU BOX can slide along the third direction Y, and the heat dissipation device CBOX can slide along the third direction Y or the second direction X. For example, the server can further include a plurality of sliding rails arranged in the first direction Z, and the plurality of sliding rails are between a plane where the first face of the signal board MBP is located and an inner side face of the server opposite to the first face of the signal board MBP. The computing device GPU BOX, the processing device CPU BOX and the power supply device PS can slide along the sliding rails relative to the first face of the signal board MBP, respectively. Specifically, the computing device GPU BOX and the processing device CPU BOX are electrically connected with the signal board MBP at a first end of the sliding rails close to the plane. In this way, the devices are structurally independent of each other. For example, the power supply device PS, the processing device CPU BOX, the computing device GPU BOX and the heat dissipation device CBOX can be designed in the form of a drawer.

[0046] Meanwhile, the processing device CPU BOX and the computing device GPU BOX are arranged adjacently, which facilitates shortening of the signal path between the processing device CPU BOX and the computing device GPU BOX. For example, the processing device CPU BOX includes a server mainboard and a switchboard arranged in the first direction Z and electrically connected, which facilitates shortening of the signal path from the server mainboard, the switchboard in the processing device CPU BOX and the computing device GPU BOX. Specifically, the server mainboard can be located above, and the switchboard can be located below, which facilitates high-speed signal connection. The power distribution device PD and the heat dissipation device CBOX are arranged in the first direction Z in sequence, which facilitates electrical connection of the power supply device PS and the power distribution device PD below the signal board MBP.

[0047] Further, the switching board can be, for example, a Peripheral Component Interconnect Express (PCIe) switch. High-speed signals of the switching board can be connected to the board edge of the switching board through a high-speed connector, and connected to the signal board MBP through a vertical board connector of the switching board. In assembly, the switching board can be arranged in the shell of the processing device CPU BOX first, and then the server mainboard is installed, and the server mainboard and the switching board are electrically connected through a high-speed cable. The server mainboard and the switching board can be vertically stacked along the first direction Z, or can be laid horizontally. In the present application, the preferred solution is that the server mainboard and the switching board are vertically stacked along the first direction Z, so that the difficulty of the size of the board development can be reduced, and the plug-in and maintenance operation of the connection cable of the high-speed signal between the server mainboard and the switching board is facilitated.

[0048] In the embodiments of the present application, the processing device CPU BOX can further include at least one of a communication card (which can be, for example, a network card) and a storage device (which can be, for example, a hard disk). Specifically, in one embodiment, the projection of the communication card partially overlaps the projection of the switching board in the first direction Z as the projection direction. And the embodiments of the present application are not limited to this, in the embodiments of the present application, the projection of the server mainboard can also partially overlap the projection of the switching board. For example, the server mainboard and the communication card can be arranged above or below the switching board. Preferably, the server mainboard and the communication card can be arranged on the switching board, so as to maintain the server mainboard and the communication card. In addition, along the third direction Y, the communication card can be arranged on the side of the server mainboard away from the signal board, so that the communication card can be closer to the outside of the server relative to the server mainboard, facilitating the maintenance of the communication card. Similarly, the storage device can also be arranged according to the arrangement mode of the communication card described above, and can also have similar effects, which will not be described here.

[0049] In addition, in the embodiments of the present application, the projection of the communication card partially overlaps the projection of the power supply device PS in the first direction Z as the projection direction, which can specifically mean that the projection of the communication card partially overlaps the projection of the end of the power supply device PS close to the outside of the server. In this way, the end of the power supply device PS and the communication card are both close to the outside of the server in the front window area, facilitating maintenance. In addition, the high-power power supply device PS can extend between the connection position of the power supply device PS and the power distribution device PD and the above-mentioned overlapping position. On this basis, the present application improves the convenience of maintaining the high-power power supply device PS arranged inside the server.

[0050] For example, after assembling the server motherboard, devices such as network cards and hard disks can be arranged in the processing device CPU BOX. Specifically, at least one of the hard disk and the network card can be located at a side of the server motherboard away from the signal board MBP. For example, the network card can be connected to the server motherboard through a slot. The hard disk can be electrically connected to the server motherboard or the switching board. After assembly is completed, the drawer of the processing device CPU BOX can be placed in the server case and docked with the signal board MBP. The same applies to the computing device GPU BOX. For example, the power supply device PS, the processing device CPU BOX, and the computing device GPU BOX can each be in a separate drawer. For example, the first face of the signal board MBP is provided with a plurality of first plug-in interfaces. For example, the first plug-in interface can be a vertical board-to-board connector. For example, the plug-in interface of the signal board MBP can be designed through blind insertion design, and a structure-guided design can be used to enable the processing device CPU BOX, the computing device GPU BOX, and the heat dissipation device CBOX to align with the plug-in interface of the signal board MBP, avoid the use of cable connections, enable reliable connections, and thus meet the design requirements of large data volume and reliable operation of the artificial intelligence server, and have good foolproof effect and simple assembly. In addition, the high-tolerance connector (such as a floating connector) itself can also be used in the present application to ensure the reliability of the blind insertion design. The power supply device PS can also use a similar blind insertion design, such as a slide rail, to facilitate processing of signals of the power supply device PS when the power supply device PS is slid to a position where it can be interconnected with the signal board MBP or the power distribution board, and has good foolproof effect and simple assembly. Similarly, the power distribution device PD and the signal board MBP can also be removed from the server, which will not be described here.

[0051] The plurality of first plug-in interfaces are respectively at the first ends of the first slide rail and the second slide rail. The first end of the computing device GPU BOX is provided with a computing device plug-in interface, and the pins in the computing device plug-in interface are used to electrically connect with the pins in the first plug-in interface of the first slide rail when the first end of the computing device GPU BOX is located at the first end of the first slide rail. The first end of the processing device CPU BOX is provided with a processing device plug-in interface, and the pins in the processing device plug-in interface are used to electrically connect with the pins in the first plug-in interface of the second slide rail when the first end of the processing device CPU BOX is located at the first end of the second slide rail.

[0052] Specifically, the first plug-in interface of the second slide rail can be multiple. The processing device plug-in interface can include a mainboard plug-in interface and a switchboard plug-in interface. The pins in the mainboard plug-in interface are used to be electrically connected with the pins in the corresponding first plug-in interface in the second slide rail in the case that the first end of the server mainboard is located at the first end of the second slide rail. The pins in the switchboard plug-in interface are used to be electrically connected with the pins in the corresponding first plug-in interface in the second slide rail in the case that the first end of the switchboard is located at the first end of the second slide rail. In addition, in another embodiment of the present application, the server mainboard can also be connected to the power distribution device PD through a cable so that the power distribution device PD supplies power to the server mainboard via the cable. For example, the voltage output by the power distribution device PD can be a 12V direct current voltage. In an embodiment of the present application, taking a third direction Y orthogonal to both the first direction Z and the second direction X as the projection direction, the projection of the computing device GPU BOX at least partially coincides with the projection of the at least one heat dissipation device, and the projection of the processing device CPU BOX at least partially coincides with the projection of the at least one heat dissipation device. In this way, the heat dissipation device can conveniently dissipate heat for both the computing device GPU BOX and the processing device CPU BOX. For example, the processing device CPU BOX, the computing device GPU BOX and the heat dissipation device CBOX are at the same horizontal position. For example, relative to the inner side surface parallel to the horizontal plane inside the server, the processing device CPU BOX, the computing device GPU BOX and the heat dissipation device CBOX can be at the same height. In this way, the heat dissipation device CBOX can conveniently dissipate heat for the processing device CPU BOX and the computing device GPU BOX. For example, the heat dissipation device CBOX can blow horizontally on the processing device CPU BOX and the computing device GPU BOX, thereby dissipating heat for the processing device CPU BOX and the computing device GPU BOX together. Specifically, the computing device GPU BOX is located at a relatively upper position, which is convenient for the heat dissipation device CBOX to dissipate heat.

[0053] Figure 2 A schematic diagram of a signal board MBP according to an embodiment of the present application is shown.

[0054] As Figure 2 shown, the surface of the signal board MBP of this embodiment can be provided with a plurality of plug-in interfaces. The plurality of plug-in interfaces may, for example, include a plurality of first plug-in interfaces provided on the first surface of the signal board MBP and a plurality of second plug-in interfaces provided on the second surface of the signal board MBP.

[0055] For example, the plurality of first plug-in interfaces of the signal board MBP can include a first plug-in interface GPUP for connecting a computing device, a first plug-in interface for connecting a processing device, and a first plug-in interface PSP for connecting a power supply device. For example, the first plug-in interface GPUP for connecting the computing device (e.g., the first plug-in interface of the first slide rail described above) can be disposed at a portion of the signal board MBP close to the second inner side surface of the server (e.g., the top end). Specifically, the server has a second inner side surface in the first direction Z, and the second inner side surface is adjacent to the computing device inside the server. For example, the second inner side surface can be the top surface of the server. A gap is formed between the top end of the signal board and the second inner side surface of the server, so that at least a portion of the computing device can be exposed to the heat dissipation device. In this way, the heat dissipation device, such as a fan, can facilitate heat dissipation of the computing device. At the same time, the signal board can be structurally designed such that the signal board is partially exposed to the processing device, so that the computing device and the processing device can share the heat dissipation.

[0056] The first plug-in interface for connecting the processing device can include a first plug-in interface MBPP for connecting a server motherboard and a first plug-in interface SWP for connecting a switching board. For example, the first plug-in interface MBPP for connecting the server motherboard and the first plug-in interface SWP for connecting the switching board can be located in the middle of the surface of the signal board MBP. For example, the first plug-in interface MBPP for connecting the server motherboard can be located above the first plug-in interface SWP for connecting the switching board, but the embodiments of the present application are not limited thereto, and the first plug-in interface MBPP for connecting the server motherboard can also be located below the first plug-in interface SWP for connecting the switching board.

[0057] Correspondingly, the computing device can be provided with a computing device plug-in interface. The processing device can be provided with a processing device plug-in interface. The processing device plug-in interface can include a motherboard plug-in interface and a switching plug-in interface. For example, the computing device can be electrically connected to the pins in the first plug-in interface GPUP for connecting the computing device via the pins in the computing device plug-in interface. The processing device can be electrically connected to the pins in the first plug-in interface for connecting the processing device via the pins in the processing device plug-in interface. Specifically, the server motherboard can be electrically connected to the pins in the first plug-in interface MBPP for connecting the server motherboard via the pins in the motherboard plug-in interface. The switching board can be electrically connected to the pins in the first plug-in interface SWP for connecting the switching board via the pins in the switching plug-in interface.

[0058] The server motherboard can be electrically connected with the switching board via a cable or the like, and the pins in the switching board plug-in interface can be electrically connected to the pins in the computing device plug-in interface via the wirings inside the signal board MBP. In this way, the server motherboard can be interconnected with the computing device via the switching board, the pins in the switching board plug-in interface, the wirings inside the signal board MBP, and the pins in the computing device plug-in interface, with a relatively short signal path.

[0059] The first plug-in interface PSP for connecting the power supply device can be located near one side of the bottom of the signal board MBP. The power supply device can be provided with an output interface, and the output interface of the power supply device can be used for electrical connection to the first plug-in interface PSP for connecting the power supply device of the signal board MBP. The first plug-in interface PSP for connecting the power supply device of the signal board MBP can be multiple, so that multiple power supply devices can be connected.

[0060] On the other hand, the multiple second plug-in interfaces of the signal board MBP can include the second plug-in interface FANP for connecting the heat dissipation device and the second plug-in interface PDP for connecting the power distribution device.

[0061] The second plug-in interface PDP for connecting the power distribution device and the first plug-in interface PSP for connecting the power supply device can be located at the side of the signal board MBP in the first direction Z, for example, the bottom of the signal board MBP. Specifically, the first plug-in interface of the power supply device can also be located on one side of the signal board MBP in the second direction X on the first surface of the signal board MBP.

[0062] The pins in the output interface of the power supply device can be electrically connected to the pins in the first plug-in interface PSP for connecting the power supply device, and the pins in the input interface of the power distribution device can be electrically connected to the pins in the second plug-in interface PDP for connecting the power distribution device. The pins in the output interface of the power distribution device can be electrically connected to the pins in another second plug-in interface PDP for connecting the power distribution device. In this way, the power supply device can be electrically connected to the power distribution device via the pins in the output interface of the power supply device, the pins in the first plug-in interface PSP for connecting the power supply device, the wirings inside the signal board MBP, the pins in the second plug-in interface PDP for connecting the power distribution device, and the pins in the input interface of the power distribution device, so as to be electrically connected to the signal board MBP via the pins in the output interface of the power distribution device and the pins in another second plug-in interface PDP for connecting the power distribution device, thereby powering the computing device, the processing device, and the heat dissipation device.

[0063] Figure 3 A schematic diagram of a server according to another embodiment of the present application is shown.

[0064] As Figure 3As shown, the server of the embodiment can include a signal board MBP, a processing device CPU BOX, a computing device GPU BOX, a cooling device CBOX, a power distribution device PD, and a power supply device PS. The processing device CPU BOX can include a server motherboard MB and a switch board SW. The processing device CPU BOX can also include a network card and a hard disk. At least one of the hard disk and the network card can be located at a side of the server motherboard away from the signal board MBP. The cooling device can include a fan FAN. The processing device CPU BOX and the computing device GPU BOX are disposed at a first side of the signal board MBP so as to be electrically connected with the signal board MBP. The cooling device CBOX can be disposed at a second side of the signal board MBP so as to be electrically connected with the signal board MBP. The power distribution device PD can include a power distribution board. The power distribution board is provided with a distribution board interface, which can be directed towards the first area so as to be electrically connected with the power supply device PS. In addition, in some embodiments, the power distribution device PD can also not include the power distribution board.

[0065] The power distribution device PD can be located at a side of the power supply device PS close to the signal board MBP in a third direction Y (which can be a horizontal direction) intersecting the first direction Z, and be electrically connected with the power supply device PS. The power supply device PS can be located beside the processing device CPU BOX and the computing device GPU BOX in the first direction Z, for example, the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX.

[0066] With reference to the foregoing description, the server of the embodiment can include a signal board MBP, a processing device CPU BOX, a computing device GPU BOX, a cooling device CBOX, a power distribution device PD, and a power supply device PS. The processing device CPU BOX can include a server motherboard MB and a switch board SW. The processing device CPU BOX can also include a network card and a hard disk. At least one of the hard disk and the network card can be located at a side of the server motherboard away from the signal board MBP. The cooling device can include a fan FAN. The processing device CPU BOX and the computing device GPU BOX are disposed at a first side of the signal board MBP so as to be electrically connected with the signal board MBP. The cooling device CBOX can be disposed at a second side of the signal board MBP so as to be electrically connected with the signal board MBP. The power distribution device PD can include a power distribution board. The power distribution board is provided with a distribution board interface, which can be directed towards the first area so as to be electrically connected with the power supply device PS. In addition, in some embodiments, the power distribution device PD can also not include the power distribution board. Figure 3It can be seen that in this embodiment, the length of the power supply device PS does not exceed the bottom of the signal board MBP, that is, the orthogonal projection of the power supply device PS on the third direction Y does not overlap with the orthogonal projection of the signal board MBP on the third direction Y. In this case, the output interface of the power supply device PS is adjacent to the bottom of the signal board MBP. The output interface of the power supply device PS can be a vertical board connector, and specifically can be a vertical board-to-board connector. In this way, the output interface of the power supply device PS can be directly plugged into the first plugging interface of the signal board MBP for connecting the power supply device PS, so that the pins in the output interface of the power supply device PS are electrically connected with the pins in the first plugging interface for connecting the power supply device PS, so that the use of the power distribution board to electrically connect the power supply device PS and the signal board MBP can be avoided. Moreover, the embodiments of the present application are not limited thereto, and in other embodiments of the present application, a common redundant power supply (CRPS) connector of the power supply device PS can be welded to the signal board MBP. In this way, the power supply device PS can supply power to the computing device GPU BOX, the processing device CPU BOX and the heat dissipation device CBOX via the signal board MBP and the power distribution device PD. For example, the power supply device PS in this example can include a power supply unit of 12V, and the power supply unit in this example can be multiple. In this case, the signal board MBP occupies a space of 1U in height in the lower area of the server. Wherein, U is a unit of height. In an embodiment of the present application, the power supply device PS of 12V can be plugged into the plugging interface of the power distribution board through the signal board MBP. Moreover, the power supply device PS of 12V can be changed to a power supply device PS of 54V, so that the number of power supply devices PS can be reduced.

[0067] Still further, with reference to Figure 3It can be seen that the second surface of the signal board MBP is opposite to the second inner surface of the server. The second inner surface is provided with an alternating voltage interface AC. The pins in the alternating voltage interface AC can be electrically connected to the signal board MBP interface of the signal board MBP for connecting the alternating voltage interface AC through a cable. For example, the connection relationship between the alternating voltage interface AC and the signal board MBP can be pre-assembled. Specifically, the pins in the alternating voltage interface AC can be electrically connected to the pins in the signal board MBP interface. At the same time, the pins in the input interface of the power supply device PS can be electrically connected to the pins in the first plug interface of the signal board MBP for connecting the input interface of the power supply device PS. In this way, the power supply device PS can be electrically connected to the pins in the alternating voltage interface AC through the pins in the input interface of the power supply device PS, the pins in the first plug interface for connecting the input interface of the power supply device PS, the wires inside the signal board MBP and the pins in the signal board MBP interface for connecting the alternating voltage interface AC, and receive alternating voltage from the alternating voltage interface AC. The power supply device PS can perform chopping, voltage reduction and other processing on the received alternating voltage to obtain direct current voltage, and then provide the direct current voltage to the power distribution board through the wires inside the signal board MBP, so that the power distribution board reduces the direct current voltage to direct current voltage for providing the computing device GPU BOX, the processing device CPU BOX and the heat dissipation device CBOX, and provides the reduced direct current voltage to the computing device GPU BOX, the processing device CPU BOX and the heat dissipation device CBOX through the wires inside the signal board MBP. On this basis, the signal board MBP can play an important role as a bridge for high-speed signals, low-speed signals and power flow, and realize high-density high-speed signal interconnection, low-speed signal interconnection and power signal transmission. For example, the signal board MBP can be electrically connected to the power distribution device PD to provide, for example, 54V direct current voltage to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD, so that the power distribution device PD supplies power to the processing device CPU BOX, the computing device GPU BOX and the heat dissipation device CBOX through the wires inside the signal board MBP.

[0068] In another embodiment of the present application, the power supply device PS and the power distribution board can be directly electrically connected at the interval below the signal board MBP. The following will be described in combination with Figure 4

[0069] Figure 4 A schematic diagram of a server according to another embodiment of the present application is shown.

[0070] As Figure 4 ​As shown, the server of this embodiment can include a signal board MBP, a processing device CPU BOX, a computing device GPU BOX, a cooling device CBOX, a power distribution device PD, and a power supply device PS. The processing device CPU BOX can include a server motherboard MB and a switch board SW. The processing device CPU BOX can further include a network card and a hard disk. At least one of the hard disk and the network card can be located at a side of the server motherboard distal to the signal board MBP. The cooling device can include a fan FAN. The processing device CPU BOX and the computing device GPU BOX are disposed at a first side of the signal board MBP so as to be electrically connected with the signal board MBP. The cooling device CBOX can be disposed at a second side of the signal board MBP so as to be electrically connected with the signal board MBP. The power distribution device PD can include a power distribution board. The power distribution device PD can be located at a side of the power supply device PS proximal to the signal board MBP in a third direction Y (e.g., which can be a horizontal direction) intersecting the first direction Z, and be electrically connected with the power supply device PS. The power supply device PS can be located beside the processing device CPU BOX and the computing device GPU BOX in the first direction Z, e.g., the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX.

[0071] Further, with reference to Figure 4 It can be seen that, in this embodiment, the length of the power supply device PS does not exceed the bottom of the signal board MBP, i.e., the orthogonal projection of the power supply device PS in the third direction Y does not overlap with the orthogonal projection of the signal board MBP in the third direction Y.

[0072] For example, the server has a first inner side in the first direction Z. The first inner side is adjacent to the power supply device PS inside the server. For example, the first inner side can be a bottom surface inside the server, and the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX. A gap is formed between the first inner side and the signal board MBP, so that the power supply device PS is electrically connected with the power distribution device PD at the gap between the first inner side and the signal board MBP. Specifically, the power supply device PS can be electrically connected with the power distribution board. For example, the power supply device PS can be electrically connected with the power distribution board through a horizontal board-to-board connector. For example, the power supply device PS can include a 54V power supply node.

[0073] In this case, the orthogonal projection of the power distribution board in the third direction Y partially overlaps with the orthogonal projection of the signal board MBP in the third direction Y. The power supply device PS can provide a direct current voltage to the power distribution board via the power distribution board, so that the power distribution board supplies power to the computing device GPU BOX, the processing device CPU BOX, and the cooling device CBOX via the wirings in the signal board MBP.

[0074] Further, with continued reference to Figure 4 It can be known that the second surface of the signal board MBP is opposite to the second inner surface of the server. The second inner surface is provided with an alternating voltage interface AC. The alternating voltage interface AC can be electrically connected to the power distribution board. For example, the connection relationship between the alternating voltage interface AC and the power distribution board can be pre-assembled. The power distribution board can be provided with an interface for connecting the input interface of the power supply unit, that is, a distribution board interface. In the case that the pins in the input interface of the power supply unit are electrically connected to the pins in the distribution board interface of the power distribution board, the power supply unit can receive alternating voltage from the alternating voltage interface AC via the pins inside the distribution board interface of the power distribution board and the wires of the power distribution board. Then, the power supply device PS can perform chopping, voltage reduction and other processing on the received alternating voltage to obtain direct current voltage.

[0075] In this embodiment, in the case that the pins in the output interface of the power supply device PS are electrically connected to the pins in another interface of the power distribution board, the power supply device PS can provide direct current voltage to the power distribution board electrically connected to the power distribution board via the pins in the other interface of the power distribution board. The power distribution board can be provided with an electrolytic capacitor. The electrolytic capacitor can be used to meet the peak power demand of the image processor of the artificial intelligence server. The number of electrolytic capacitors can be set based on the power of the power supply unit to meet the dynamic load demand. The power distribution board can be used to provide the direct current voltage received from the power distribution board to the computing device GPU BOX, the processing device CPU BOX and the heat dissipation device CBOX via different wires in the signal board MBP after being stepped down based on the power consumption demand of the computing device GPU BOX, the processing device CPU BOX and the heat dissipation device CBOX.

[0076] In an embodiment of the present application, in order to avoid signal electromagnetic interference between AC voltage and DC voltage on the power distribution board, and in order to meet the requirements of safety specifications, the 54V power supply device PS and the 54V power distribution board can be connected by a DC and AC split connector. The AC part of the connector is connected by an AC cable across the 54V power distribution board and is fixed at the 54V AC voltage interface AC. The AC voltage interface AC is then connected to the external machine room AC power cable. By this design, the DC part and the AC part are separated, thereby at least partially avoiding the interference between AC signals and DC signals. The AC and DC split connector is then assembled with the 54V power supply device PS by blind insertion after being fixed on the 54V power distribution board. On this basis, the signal board MBP can serve as an important bridge for high-speed signals, low-speed signals and power flow, realizing high-density high-speed signal interconnection, low-speed signal interconnection and power signal transmission. For example, the signal board MBP can be electrically connected to the power distribution device PD to provide, for example, 54V DC voltage to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD, so that the power distribution device PD supplies power to the processing device CPU BOX, the computing device GPU BOX and the cooling device CBOX via the wiring in the signal board MBP.

[0077] In another embodiment of the present application, the output interface and the input interface of the power supply device PS can be electrically connected to the same interface of the power distribution board and are electrically connected to the power distribution board via different pins in the same interface. For example, the output interface of the power supply device PS can be provided with an output pin, and the input interface of the power supply device PS can be provided with an input pin. In yet another embodiment of the present application, the power supply device PS can be provided with an interface including both an output pin and an input pin. For example, the output pin of the power supply device is located in the first area. Alternatively, in the case where the power supply device is arranged in the first area and the second area, the output pin of the power supply device can be located in the second area to be electrically connected to the power distribution device.

[0078] Figure 5 A schematic diagram of a server according to another embodiment of the present application is shown.

[0079] As Figure 5As shown, the server of the embodiment can include a signal board MBP, a processing device CPU BOX, a computing device GPU BOX, a cooling device CBOX, a power distribution device PD, and a power supply device PS. The processing device CPU BOX can include a server motherboard MB and a switch board SW. The processing device CPU BOX can further include a network card and a hard disk. At least one of the hard disk and the network card can be located at a side of the server motherboard away from the signal board MBP. The cooling device can include a fan FAN. The processing device CPU BOX and the computing device GPU BOX are disposed at a first side of the signal board MBP so as to be electrically connected with the signal board MBP. The cooling device CBOX can be disposed at a second side of the signal board MBP so as to be electrically connected with the signal board MBP. The power distribution device PD can include a power distribution board. The power distribution device PD can be located at a side of the power supply device PS close to the signal board MBP in a third direction Y (e.g., which can be a horizontal direction) intersecting the first direction Z, and be electrically connected with the power supply device PS. The power supply device PS can be located beside the processing device CPU BOX and the computing device GPU BOX in the first direction Z, e.g., the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX.

[0080] Reference is made to Figure 5 As can be seen, in the embodiment, the length of the power supply device PS does not exceed the bottom of the signal board MBP, i.e., the orthogonal projection of the power supply device PS in the third direction Y does not overlap with the orthogonal projection of the signal board MBP in the third direction Y. However, since there is a gap between the bottom end of the signal board MBP and the bottom of the interior of the server, the output interface of the power supply device PS and the input interface of the power distribution device PD can be electrically connected below the signal board MBP. In this case, the orthogonal projection of the power distribution board in the third direction Y at least partially overlaps with the orthogonal projection of the signal board MBP in the third direction Y. The power supply device PS can provide a direct current voltage to the power distribution board, so that the power distribution board supplies power to the computing device GPU BOX, the processing device CPU BOX, and the cooling device CBOX via the wirings in the signal board MBP.

[0081] Further, the power distribution board can include a distribution board interface facing the power supply device PS, and a first pin in the distribution board interface is used to connect an output pin of the power supply device PS to receive a direct current voltage via a pin in the output interface of the power supply device PS. The power distribution board can supply power to the processing device CPU BOX, the computing device GPU BOX, and the cooling device CBOX via the wirings in the signal board MBP based on the received direct current voltage. For example, the power supply device can use pre-stored electric energy to supply power. However, the present application is not limited thereto, and in another embodiment of the present application, the power supply device can also receive an alternating current voltage from a data center outside the server to supply power.

[0082] Continue to refer Figure 5 It can be seen that the second side of the signal board MBP is opposite to the inner side of the server where the AC voltage interface AC is provided, and the distribution board interface also includes a second pin. This second pin can be used to connect the input pin of the power supply device PS and the pin in the AC voltage interface AC to provide the AC voltage of the AC voltage interface AC to the power supply device PS. For example, the power distribution device may also include a cable. One end of the cable is electrically connected to the second pin, and the other end of the cable is electrically connected to the AC voltage pin in the AC voltage interface. The second pin in the distribution board interface can be connected to the pin in the AC voltage interface AC via a cable. In this way, the output pin of the power supply device PS can be electrically connected to the first pin of the distribution board interface, and the input pin of the power supply device PS can be electrically connected to the second pin of the distribution board interface. On this basis, the power supply device PS can receive the AC voltage from the AC voltage interface AC via the second pin. The power supply device PS can then perform chopping, voltage reduction, and other processing on the received AC voltage to obtain a DC voltage. Next, the power supply device PS can provide a DC voltage to the power distribution board via the first pin within the distribution board interface of the power distribution board, so that the power distribution board steps down the DC voltage to a DC voltage for supplying to the computing device GPU BOX, the processing device CPU BOX, and the heat dissipation device CBOX. The stepped-down DC voltage is then provided to the computing device GPU BOX, the processing device CPU BOX, and the heat dissipation device CBOX via the wiring within the signal board MBP. On this basis, the signal board MBP can serve as an important bridge for the flow of high-speed signals, low-speed signals, and power, enabling high-density interconnection of high-speed signals, low-speed signals, and power signals. For example, the signal board MBP can be electrically connected to the power distribution device PD, providing a DC voltage of, for example, 54V to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD, so that the power distribution device PD supplies power to the processing device CPU BOX, the computing device GPU BOX, and the heat dissipation device CBOX via the wiring within the signal board MBP.

[0083] Figure 6 A schematic diagram of a server according to another embodiment of the present application is shown.

[0084] like Figure 6As shown, the server of the embodiment can include a signal board MBP, a processing device CPU BOX, a computing device GPU BOX, a cooling device CBOX, a power distribution device PD, and a power supply device PS. The processing device CPU BOX can include a server motherboard MB and a switch board SW. The processing device CPU BOX can further include a network card and a hard disk. At least one of the hard disk and the network card can be located at a side of the server motherboard away from the signal board MBP. The cooling device can include a fan FAN. The processing device CPU BOX and the computing device GPU BOX are disposed at a first side of the signal board MBP so as to be electrically connected with the signal board MBP. The cooling device CBOX can be disposed at a second side of the signal board MBP so as to be electrically connected with the signal board MBP. The power distribution device PD can include a power distribution board. The power distribution device PD can be located at a side of the power supply device PS close to the signal board MBP in a third direction Y (e.g., which can be a horizontal direction) intersecting the first direction Z and be electrically connected with the power supply device PS. The power supply device PS can be located beside the processing device CPU BOX and the computing device GPU BOX in the first direction Z, e.g., the power supply device PS can be located below the processing device CPU BOX and the computing device GPU BOX.

[0085] Reference is made to Figure 6 As can be seen, in the embodiment, the length of the power supply device PS exceeds the bottom of the signal board MBP, i.e., the orthogonal projection of the power supply device PS in the third direction Y (i.e., the orthogonal projection in the horizontal plane) at least partially overlaps with the orthogonal projection of the signal board MBP in the third direction Y. However, since there is a gap between the bottom end of the signal board MBP and the bottom of the interior of the server, the output interface of the power supply device PS and the input interface of the power distribution device PD can be electrically connected below the signal board MBP. In this case, the orthogonal projection of the power distribution board in the third direction Y does not overlap with the orthogonal projection of the signal board MBP in the third direction Y. The power supply device PS can provide a direct current voltage to the power distribution board so that the power distribution board supplies power to the computing device GPU BOX, the processing device CPU BOX, and the cooling device CBOX via the wirings in the signal board MBP. On this basis, the signal board MBP can serve as an important bridge for high-speed signals, low-speed signals, and power flow, realizing high-density high-speed signal interconnection, low-speed signal interconnection, and power signal transmission. For example, the signal board MBP can be electrically connected to the power distribution device PD to provide a direct current voltage of, e.g., 54V to the computing device GPU BOX. In this way, the power supply device PS can supply power to the power distribution device PD so that the power distribution device PD supplies power to the processing device CPU BOX, the computing device GPU BOX, and the cooling device CBOX via the wirings in the signal board MBP.

[0086] Further reference is made to Figure 6It can be seen that the first end of the power supply device PS is located at the inner side of the server opposite to the first side of the signal board MBP, and the second end of the power supply device PS passes through the plane where the first side of the signal board MBP is located and the interval at the bottom end of the signal board MBP to be electrically connected with the power distribution device PD. In this way, there is sufficient space to arrange the high-power power supply device PS beside the same side of the processing device CPU BOX, the computing device GPU BOX and the signal board MBP (for example, below the processing device CPU BOX, the computing device GPU BOX and the signal board MBP), or even beside the same side of the processing device CPU BOX, the computing device GPU BOX, the signal board MBP and the heat dissipation device CBOX (for example, below the processing device CPU BOX, the computing device GPU BOX, the signal board MBP and the heat dissipation device CBOX), so as to improve the power density of the power supply of the device.

[0087] The power supply device PS can include at least two power supply devices in the embodiment of the present application. The power distribution device PD includes at least two distribution board interfaces, and each of the at least two distribution board interfaces is electrically connected with one power supply device PS. Specifically, at least one input pin of any power supply device PS is respectively connected with an alternating voltage pin in at least one alternating voltage interface AC via a second pin in at least one distribution board interface. The following will be described in combination with Figure 7

[0088] Figure 7 A top view of the power distribution board according to the embodiment of the present application is shown.

[0089] Reference Figure 7 It can be seen that a plurality of distribution board interfaces SP can be arranged on the power distribution board PDB, and a protruding part PDU can be arranged. Each distribution board interface SP can include a first interface area A and a second interface area B. The first interface area A can be provided with a first pin, and the second interface area B can be provided with a second pin. For example, the first interface area and the second interface area can be butted by a card slot, so that the first interface area and the second interface area on the side close to the power supply unit are flush, facilitating the butt joint of the interface of the power supply unit. For example, the first pin arranged in the first interface area A can be a direct current voltage pin, for example, can include a positive pin and a negative pin, which can be arranged in the first direction Z or the second direction X. For example, the first pin arranged in the second interface area B can be an alternating voltage pin, for example, can include a zero line pin, a live line pin and a ground pin, respectively used for connecting a live line, a zero line and a ground line. The pins in the interface of the power supply device correspond to the pins arranged in the power distribution board, which will not be described here.

[0090] ​At the same time, the second pins in the second interface area B may be provided in multiple groups, each of which is electrically connected to the first AC voltage interface C and the second AC voltage interface D. The first AC voltage interface C and the second AC voltage interface D may each be multiple. Furthermore, the first AC voltage interface C may include a neutral pin, a live pin, and a ground pin, while the second AC voltage interface D may include a neutral pin, a live pin, and a ground pin. In this way, if one of the first AC voltage interface C and the second AC voltage interface D fails, AC voltage can still be provided via the other unfaulted AC voltage interface.

[0091] Through the above-mentioned redundant design, in the event of a power supply unit failure, an AC voltage interface failure, a cable failure, or a distribution board interface failure, the present application can still ensure the reliability of power supply through non-faulty devices. Moreover, based on the above-mentioned design, based on the 54V system power of the 54V power supply device, the AC voltage can be provided to the 54V power supply device through a dual AC voltage interface, or the AC voltage can be provided to the 54V power supply device through a single AC voltage interface. On this basis, the power supply nodes with dual AC inputs are preferably composed of N+1 (for example, N+1 power supply nodes with dual AC inputs, N is a positive integer) redundancy, which is suitable for configurations with higher power computing devices; the power supply nodes with single AC inputs are preferably composed of N+N (for example, 2N power supply nodes with dual AC inputs, N is a positive integer) redundancy, which is suitable for configurations with low power computing devices.

[0092] Figure 8 A schematic diagram of a power distribution board according to another embodiment of the present application is shown.

[0093] like Figure 8 As shown, the distribution board interface of the power distribution board in this embodiment is vertically lower than the output interface of the power distribution board. Specifically, the height H of the output interface of the power distribution board above the distribution board interface can be 1U. In this way, the power distribution board can be electrically connected to the output interface of the power supply device below the signal board, and the output interface of the protrusion provided on the power distribution board can be electrically connected to the signal board.

[0094] Figure 9 A schematic diagram of a power distribution board according to an embodiment of the present application is shown. Figure 10 A connection diagram of a power distribution board and a signal board according to an embodiment of the present application is shown.

[0095] like Figure 9 and Figure 10As shown, the protruding part of the power distribution device can protrude from the power distribution board. The protruding part is provided with the output interface of the power distribution device, which faces the signal board and is electrically connected to the signal board. In this way, the power distribution board can be electrically connected to the output interface of the power supply device below the signal board, and the output interface of the power distribution board can be electrically connected to the signal board. For example, the power distribution board can be provided with a wire for connecting the protruding part and the power supply device. A plurality of voltage reduction circuits for reducing the direct current voltage can be arranged in the protruding part. The plurality of voltage reduction circuits can be used to reduce the received direct current voltage to obtain a voltage reduction voltage suitable for each device, so as to supply power to each device through the plurality of voltage reduction voltages via a plurality of wires in the signal board. For example, an electrolytic capacitor can be arranged in the protruding part of the power distribution board in the first direction Z.

[0096] The output interface of the power distribution device includes a copper bar welded to the power distribution device. Specifically, the output interface of the power distribution device can include a positive copper bar and a negative copper bar. The second plug-in interface of the signal board includes a floating clamp-shaped interface, i.e., a clip connector, welded to the signal board. In the state that the floating clamp-shaped interface clamps the copper bar, the power distribution device is electrically connected to the signal board, i.e., in the case that the copper bar is inserted into the floating clamp-shaped interface, the power distribution device is electrically connected to the signal board. In this way, the clip connectors on the left and right sides below the signal board are respectively connected to the two copper bars of the power distribution board, so that the 54V power supply unit is connected to the signal board through the two groups of connectors. In this way, the power supply wire of the signal board can be partially saved, and the interference between the power supply wire and the high-speed link can be reduced.

[0097] The power distribution board can support blind insertion design. For example, the power distribution board can slide (e.g., through a slide rail) along the third direction Y or the second direction X. Since the power distribution board and the signal board have a large impact force when blind insertion and have a large left-right offset error, in order to ensure the reliability of electrical connection, the above-mentioned design of the copper bar matched with the floating clamp-shaped interface can be used to meet the tolerance requirements of the connection. On this basis, the copper bar is designed as a positive and negative integrated design (i.e., the positive copper bar and the negative copper bar are integrated in the same protruding structure), and the floating clamp-shaped interface is designed as a split design. In this way, the accuracy of the connection between the power distribution board and the signal board can be improved, and the flexibility of the setting position of the floating clamp-shaped interface can be improved.

[0098] In the embodiments of the present application, the plurality of second plug-in interfaces can be used to connect the heat dissipation device plug-in interface of the heat dissipation device in addition to being used to connect the output interface of the power distribution device. In the embodiments of the present application, the heat dissipation device can include at least two heat dissipation devices, and the at least two heat dissipation devices are arranged at intervals along the first direction and / or the second direction. The second direction is orthogonal to the first direction.

[0099] Figure 11A schematic diagram of a heat dissipation device according to an embodiment of the present application is shown.

[0100] With reference to Figure 11 , the heat dissipation device further comprises a first connecting plate and a second connecting plate. The first connecting plate can extend along the second direction and is electrically connected with the at least one heat dissipation device. It should be understood that the embodiments of the present application are not limited thereto, and in other embodiments, the first connecting plate can also extend along the third direction. The second connecting plate can extend along the first direction, is electrically connected with the at least one first connecting plate, and is electrically connected with the signal plate. For example, the first connecting plate can be a vertical connecting plate. The second connecting plate can be a horizontal connecting plate. In this way, the heat dissipation device can comprise a vertical connecting plate, a horizontal connecting plate and a heat dissipation device (not shown in the figure). Figure 11

[0101] The vertical connecting plate can extend along the first direction and comprises a plurality of interfaces of the first connecting plates. For example, the plurality of interfaces of the first connecting plates can be a plurality of vertical plate plug-in interfaces (for example, can be vertical plate-to-plate connectors) and a heat dissipation device plug-in interface of the heat dissipation device (for example, can be a vertical plate-to-plate connector). The plurality of vertical plate plug-in interfaces are arranged in the first direction and are electrically connected with the heat dissipation device plug-in interface. For example, the pins in the plurality of vertical plate plug-in interfaces can be electrically connected with the pins in the heat dissipation device plug-in interface via the wiring inside the vertical connecting plate.

[0102] ​There may be multiple horizontal connecting boards. The multiple horizontal connecting boards are arranged in a first direction. Each of the multiple horizontal connecting boards includes an interface for a second connecting board. For example, the interface of the second connecting board may be a horizontal board plug-in interface (e.g., a vertical board-to-board connector). The horizontal board plug-in interface of any horizontal connecting board is used to connect to the vertical board plug-in interface. Specifically, the pins in the horizontal board plug-in interface can be used to electrically connect to the pins in the vertical board plug-in interface. Any horizontal connecting board may be provided with a heat sink. For example, the heat sink may be a fan. Four to five heat sinks may be provided on any horizontal connecting board. The number of horizontal connecting boards may be three to four rows. Each row of heat sinks is plugged into a corresponding horizontal connecting board, for example, via a heat sink connector (e.g., a vertical connector). For example, the heat sink is configured to be removably connected to the first connecting board. Specifically, there may be multiple heat sinks on any horizontal connecting board. The multiple heat sinks on any horizontal connecting board are arranged at intervals in the second direction and are removable from any horizontal connecting board. However, the embodiments of the present application are not limited to this. In other embodiments of the present application, multiple heat dissipation devices may be arranged spaced apart in the third direction, spaced apart in both the second and third directions, and so on. Furthermore, by providing a horizontal connecting plate, the system's heat dissipation resistance can be reduced. Each row of horizontal connecting plates is connected to a vertical connecting plate via a vertical plate plug-in interface, thereby receiving voltage from the signal board to power the fans. The horizontal and vertical connecting plates can be reinforced with structural members or other devices. Furthermore, the connecting plates support blind plugging and feature a guide design, making inter-board connections simpler and more reliable than cable connections. For example, the first connecting plate can be moved between a third and a fourth position. When in the fourth position, the first connecting plate is electrically connected to the second connecting plate. The third position may correspond to a position where the entire first connecting plate is external to the server, and the fourth position may correspond to a position where the entire first connecting plate is internal to the server. For example, the server also includes a third inner side surface (e.g., a vertical inner side surface of the server) extending along the first direction and perpendicular to the first and second surfaces of the signal board. Connecting plate slide rails are formed between the third inner side surface and the vertical connecting plate. Each horizontal connecting plate can slide relative to the vertical connecting plates along the connecting plate slide rails. For example, a horizontal plate plug-in interface is provided at the first end of each horizontal connecting plate. When the first end of each horizontal connecting plate is located at the vertical plate plug-in interface, the horizontal plate plug-in interface is electrically connected to the vertical connecting plate via the vertical plate plug-in interface. Because the vertical and horizontal connecting plates are connected via the plug-in interface, the system offers advantages such as cable-free connection, simple assembly, good foolproofing, high connection reliability, and ease of maintenance. Furthermore, the heat dissipation device can be maintained at any position while the system is powered on.

[0103] Figure 12A flow chart of a power supply method according to an embodiment of the present application is shown.

[0104] like Figure 12 As shown, the power supply method of this embodiment may include operation S1210.

[0105] In operation S1210 , the power supply device supplies power to the power distribution device, so that the power distribution device supplies power to the processing device and the computing device via traces within the signal board.

[0106] It should be understood that the power supply method of the embodiment of the present application is not limited to this. Please refer to the previous description and will not elaborate on it here.

[0107] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or a part of code, and the above-mentioned module, program segment, or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of the boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0108] Those skilled in the art will appreciate that the features described in the various embodiments of this application may be combined and / or coupled in various ways, even if such combinations or couplings are not explicitly described in this application. In particular, the features described in the various embodiments of this application may be combined and / or coupled in various ways without departing from the spirit and teachings of this application. All such combinations and / or couplings fall within the scope of this application.

[0109] The embodiments of the present application have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present application. Although each embodiment has been described separately above, this does not mean that the measures in each embodiment cannot be advantageously used in combination. Without departing from the scope of the present application, those skilled in the art may make various substitutions and modifications, and these substitutions and modifications should all fall within the scope of the present application.

Claims

1. A server, characterized in that: The server includes: a signal plate extending along a first direction, wherein the signal plate divides an inner space of the server into a first area and a second area; a processing device and a computing device, disposed in the first area and electrically connected to the signal board; a power supply device, at least partially disposed in the first area; a power distribution device, disposed in the second area and electrically connected to the power supply device and the signal board; The power supply device is used to supply power to the power distribution device, so that the power distribution device supplies power to the processing device and the computing device via the wiring in the signal board.

2. The server according to claim 1, wherein: The power distribution device comprises: A power distribution board is provided with a distribution board interface, the distribution board interface faces the first area, and the distribution board interface is electrically connected to the power supply device.

3. The server according to claim 2, wherein: The power distribution device further includes: The raised portion is provided on the power distribution board and protrudes from the power distribution board. The raised portion is provided with an output interface, and the output interface faces the signal board and is electrically connected to the signal board.

4. The server according to claim 3, wherein: The output interface includes a copper busbar; The signal board is provided with a floating clamp-shaped interface; when the floating clamp-shaped interface clamps the copper busbar, the power distribution device is electrically connected to the signal board.

5. The server according to any one of claims 2 to 4, characterized in that: The distribution board interface includes: A first pin is configured to be electrically connected to an output pin of the power supply device; The second pin is configured to be electrically connected to the AC voltage pin and the input pin of the power supply device.

6. The server according to claim 5, wherein: The output pin of the power supply device is located in the first area; Alternatively, the output pin of the power supply device is located in the second area.

7. The server according to claim 5, wherein: The power distribution device further includes: A cable, one end of the cable is electrically connected to the second pin, and the other end of the cable is electrically connected to the AC voltage pin.

8. The server according to any one of claims 2 to 4, wherein: comprising at least two of the power supply devices; The power distribution device includes at least two distribution board interfaces, and each of the at least two distribution board interfaces is electrically connected to one power supply device.

9. The server according to any one of claims 1 to 4, characterized in that: At least one of the processing device, the computing device and the power supply device is slidably disposed in the internal space.

10. The server according to claim 9, wherein: The processing device is configured to slide between a first position and a second position, and when the processing device is in the second position, the processing device is electrically connected to the signal board; And / or, the computing device is configured to slide between a first position and a second position, and when the computing device is in the second position, the computing device is electrically connected to the signal board.

11. The server according to claim 10, wherein: The power supply device is configured to slide between a first position and a second position. When the power supply device is in the second position, the power supply device is electrically connected to the power distribution device.

12. The server according to any one of claims 1 to 4, characterized in that: Also includes: The heat dissipation device is arranged in the second area.

13. The server according to claim 12, wherein: The heat dissipation device comprises: At least two heat dissipation devices, wherein the at least two heat dissipation devices are spaced apart along the first direction and / or the second direction; The second direction is orthogonal to the first direction.

14. The server according to claim 13, wherein: The heat dissipation device further includes: a first connecting plate extending along the second direction and electrically connected to at least one of the heat dissipation devices; The second connecting board extends along the first direction, is electrically connected to at least one of the first connecting boards, and is electrically connected to the signal board.

15. The server according to claim 14, wherein: The first connecting plate is configured to move between a third position and a fourth position, and is electrically connected to the second connecting plate when the first connecting plate is in the fourth position.

16. The server according to claim 14, wherein: The heat dissipation device is configured to be detachably connected to the first connecting plate.

17. The server according to claim 13, wherein: Taking a third direction orthogonal to both the first direction and the second direction as a projection direction, a projection of the computing device at least partially overlaps with a projection of at least one of the heat dissipation devices; Furthermore, a projection of the processing device at least partially overlaps with a projection of at least one of the heat dissipation devices.

18. The server according to any one of claims 1 to 4, characterized in that: The power supply device, the processing device, and the computing device are spaced apart along the first direction.

19. The server according to claim 18, wherein: Along the first direction, the power supply device, the processing device and the computing device are arranged in sequence.

20. The server according to any one of claims 1 to 4, characterized in that: The processing device includes a switch board, a server mainboard, a storage device and a communication card which are electrically connected.

21. The server according to claim 20, wherein: Along a third direction orthogonal to both the first direction and the second direction, the communication card is arranged on a side of the server mainboard away from the signal board; Taking the first direction as the projection direction, the projection of the communication card partially overlaps with the projection of the switch board, and / or the projection of the server mainboard partially overlaps with the projection of the switch board.

22. The server according to claim 21, wherein: Taking the first direction as the projection direction, the projection of the communication card partially overlaps with the projection of the power supply device.

23. A power supply method for the server according to any one of claims 1 to 22, characterized in that: The power supply method includes: The power supply device supplies power to the power distribution device, so that the power distribution device supplies power to the processing device and the computing device via the wiring in the signal board.

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