Integrated inductor module and power supply module

Abstract

The invention relates to the technical field of electronic components, in particular to an integrated inductor module and a power module. According to the inductor module, the fixing groove is formed in the peripheral face of the magnetic core, the size and the shape of the fixing groove are set to be matched with those of the metal conductor used for transmitting power and signals, the metal conductor is partially arranged in the fixing groove, mechanical fixing of the magnetic core and the metal conductor is achieved, and the integration level and the mechanical strength of the inductor module can be effectively improved; furthermore, the side face part of the metal conductor is exposed outside, heat dissipation of the inductor module is facilitated, and the electrical performance and reliability of the whole inductor module can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic components, in particular to an integrated inductor module and a power module. BACKGROUND

[0002] In the fields of power electronics, communications, consumer electronics, etc., inductor modules are widely used as important electronic components. Traditional inductor modules are usually composed of a coil wound on a magnetic core. With the development trend of miniaturization and integration of electronic devices, higher requirements are put forward for the volume, performance and reliability of inductors.

[0003] The structures of the commonly used inductor modules at present mainly include: Wound inductor: winding metal wires on a magnetic core, simple structure, but large volume and low integration; laminated inductor: forming an inductor coil by laminating multiple printed circuit boards or ceramic substrates, small volume, but limited inductance and current carrying capacity; thin film inductor: making an inductor coil on a substrate by thin film technology, small volume, but small inductance and high cost.

[0004] For high frequency circuits, the stability of inductor modules is very high, and in the above existing inductor module structures, most of them cannot meet the requirements of integration, mechanical strength and electrical performance at the same time, therefore, there is an urgent need for an inductor module with high integration, high mechanical strength and excellent electrical performance to meet the requirements of various high frequency circuits.

[0005] Therefore, it is urgent to overcome the defects of the prior art in the technical field. SUMMARY

[0006] The technical problem to be solved by the present application is how to improve the integration, mechanical strength and electrical performance of the inductor module to improve the stability of the inductor module.

[0007] The present application adopts the following technical solutions: In a first aspect, an integrated inductor module is provided, comprising a magnetic core 1 and a metal conductor 2, the outer circumferential surface of the magnetic core 1 is provided with a fixing groove 10; The size and shape of the fixing groove 10 match the metal conductor 2, the metal conductor 2 is partially arranged in the fixing groove 10, and the side surface of the metal conductor 2 is partially exposed.

[0008] Preferably, at least one first fitting part 100 is arranged in the fixing groove 10, and the outer circumferential surface of the metal conductor 2 is provided with at least one second fitting part 20 matching the first fitting part 100; The first fitting part 100 and the second fitting part 20 cooperate to fix the metal conductor 2 in the fixing groove 10.

[0009] Preferably, the metal conductor 2 comprises a power transmission conductor 21 for transmitting current and a signal transmission conductor 22 for transmitting control signal.

[0010] Preferably, a metal plating layer is arranged on the surface of the power transmission conductor 21, the metal plating layer comprising at least one metal layer, each metal layer comprising at least two segmented metal regions; The distance between the segmented metal regions ranges from 0.1 mm to 5 mm; The thickness of each metal layer ranges from 0.1 μm to 1 μm; The segmented metal regions of adjacent two layers are staggered in the horizontal direction by a distance ranging from 0.2 mm to 0.5 mm and offset in the vertical direction by a distance ranging from 0.1 mm to 0.3 mm to form stable three-dimensional current channels.

[0011] Preferably, when the frequency of the signal to be transmitted is lower than or equal to 100 MHz, the signal transmission conductor 22 is arranged as a planar plating layer with a thickness ranging from 0.1 μm to 10 μm and a signal trace width ranging from 0.05 mm to 5 mm; When the frequency of the signal to be transmitted is higher than 100 MHz, the signal transmission conductor 22 is formed by a microstrip line structure or a coplanar waveguide structure; When the frequency of the signal to be transmitted is higher than or equal to 1 GMHz, the signal transmission conductor 22 is formed by a stripline structure or a shielded microstrip line structure.

[0012] Preferably, the signal transmission conductor 22 is in the shape of a straight strip, an arc-shaped strip, a zigzag strip, a plate or a sheet.

[0013] Preferably, the integrated inductor module further comprises a fixing collar 3, the fixing collar 3 being arranged along the array of metal conductors 2 on the outer circumferential surface of the magnetic core 1. The fixing collar 3 comprises a plurality of ring structures 30 that are not completely closed to allow the metal conductors 2 to pass through the openings of the ring structures 30 to fix the metal conductors 2 on the outer circumferential surface of the magnetic core 1.

[0014] Preferably, the magnetic core 1 is in the shape of one or more of a cuboid, a cylinder, a ring or a special-shaped body.

[0015] Preferably, the integrated inductor module further comprises a winding 4, the winding 4 is wrapped by the magnetic core 1 and two ends of the winding 4 are exposed from the surface of the magnetic core 1; or the winding 4 is arranged on the surface of the magnetic core 1.

[0016] In a second aspect, a power module is provided, comprising a circuit board and the integrated inductor module as described in the first aspect, the circuit board is provided with a functional chip, the winding 4 and the metal conductor 2 of the integrated inductor module are electrically connected to the circuit board.

[0017] Preferably, the projection of the input voltage pin of the functional chip is at least 40% within the range of the input voltage pin area of the integrated inductor module. The projection of the ground pin of the functional chip is at least 50% within the range of the ground pin area of the integrated inductor module. The projection of the switch node SW pin of the functional chip is at least 80% within the range of the output voltage pin area of the integrated inductor module.

[0018] Preferably, the projection of the switch node SW pin of the functional chip and the projection of the winding 4 in the integrated inductor module have an area overlap, and the minimum distance between the center point of the winding 4 projection and the projection of the switch node SW pin of the functional chip is not more than 2mm.

[0019] Preferably, the width of the ground wire of the functional chip is not less than the width of the ground pin of the integrated inductor module.

[0020] Preferably, the distance between any two vertical center lines of the vertical center line of the ground wire of the functional chip, the vertical center line of the ground wire of the integrated inductor module and the vertical center line of the ground pin of the integrated inductor module is not more than 1.5mm.

[0021] Compared with the prior art, the present application has the following beneficial effects: The present application realizes the mechanical fixation of the magnetic core 1 and the metal conductor 2 by opening the fixing groove 10 on the outer circumferential surface of the magnetic core 1, setting the size and shape of the fixing groove 10 to match the metal conductor 2 for transmitting power and signals, and arranging part of the metal conductor 2 in the fixing groove 10, which can effectively improve the integration and mechanical strength of the inductor module; further, the side part of the metal conductor 2 is exposed outside, which is beneficial to the heat dissipation of the inductor module and can effectively improve the electrical performance and reliability of the overall inductor module. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0023] Figure 1 is a structural schematic diagram of an inductance module provided by an embodiment of the present application; Figure 2 is another structural schematic diagram of an inductance module provided by an embodiment of the present application; Figure 3 is a structural schematic diagram of a winding of an inductance module provided by an embodiment of the present application; Figure 4 is a structural schematic diagram of a first fitting part provided by an embodiment of the present application; Figure 5 is a structural schematic diagram of a second fitting part provided by an embodiment of the present application; Figure 6 is a structural schematic diagram of another fixing structure of a metal conductor provided by an embodiment of the present application; Figure 7 is a structural schematic diagram of a fixing ring provided by an embodiment of the present application; Figure 8 is a structural schematic diagram of a power module provided by an embodiment of the present application; Figure 9 is a PIN distribution schematic diagram of an inductance module provided by an embodiment of the present application; Figure 10 is a structural schematic diagram of a power module provided by an embodiment of the present application.

[0024] In all the drawings, the same reference signs represent the same structures, wherein: magnetic core 1, fixing groove 10, first fitting part 100, metal conductor 2, second fitting part 20, power transmission conductor 21, signal transmission conductor 22, fixing ring 3, winding 4. DETAILED DESCRIPTION

[0025] In order to make the objects, technical solutions and advantages of the present application more clearly understood, the following will further describe the present application in combination with the drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not used to limit the present application.

[0026] Unless otherwise required by context, as used herein the term "comprising" is to be interpreted as meaning "including but not limited to". In describing the embodiments, the terms "one embodiment," "some embodiments,” “exemplary embodiments,” “example,” “specific example” or “some examples” are used to indicate that the described embodiment(s) is (are) among numerous embodiments of the present disclosure. The above terms are not to be construed to be referring to the same embodiment or example. Moreover, the above terms are not to be construed as limiting the number of embodiments or examples to that which is specifically described. In addition, the term "about" means approximately or nearly as understood by one of ordinary skill in the art. Also, the term "coupled" means directly connected to or in communication with the indicated element or elements, and nothing additional is necessarily connected or intervening between the specified elements and the element that is "coupled" thereto.

[0027] In the description of the present disclosure, the terms "first", "second", "third", "fourth", "fifth", "sixth" and the like in the description are used for purposes of description and are not intended to necessarily imply relative importance or a particular order. Thus, features having a "first" and a "second" can be carried out in either order. In the description of embodiments of the present disclosure, the meaning of "a plurality" is two or more unless otherwise specified. Also, the terms "A and B" and "A or B" when used in the description mean that there can be only A, only B, or both A and B, unless otherwise specified.

[0028] In describing some embodiments, the expressions "coupled", "coupling" and "connected" and their derivatives can be used. For example, the expression "connected" can be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. Also, for example, the expression "coupled" can be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. However, the expressions "connected" or "coupled" can also mean that two or more components are not in direct contact with each other, but are still in cooperation or interaction with each other, such as "optical coupling", "wireless connection", etc. The embodiments disclosed herein are not necessarily limited to the content of the present disclosure.

[0029] In addition, the technical features involved in each of the embodiments of the present disclosure described below can be combined with each other as long as there is no conflict.

[0030] Embodiment 1: To solve the problems of the prior art, the present embodiment proposes an integrated inductor module. In one embodiment, as shown in Figure 1 andFigure 2 As shown, it comprises a magnetic core 1 and a metal conductor 2, the outer circumferential surface of the magnetic core 1 is provided with a fixing groove 10; the size and shape of the fixing groove 10 match the metal conductor 2, the metal conductor 2 is partially arranged in the fixing groove 10, and the side surface of the metal conductor 2 is partially exposed.

[0031] In one embodiment, the magnetic core 1 can be made of a high magnetic permeability material (such as ferrite, nanocrystalline alloy, silicon steel sheet, etc.), the purpose is to provide a low magnetic resistance magnetic circuit, and to enhance the energy storage capacity of the inductor module (the inductance is positively correlated with the magnetic permeability of the magnetic core 1).

[0032] In one embodiment, the shape of the magnetic core 1 is one or more of a cuboid, a cylinder, a ring body or a special-shaped body. The outer circumferential surface of the magnetic core 1 is provided with a fixing groove 10, rather than a traditional smooth surface. If the magnetic core 1 is a ring body (such as EE type, ring-shaped magnetic core), the outer circumferential surface is the outer curved surface of the ring; if it is a cylinder, it is the side surface of the column. The size and shape of the fixing groove 10 strictly match the metal conductor 2, for example, when the metal conductor 2 is a flat copper strip, the fixing groove 10 is rectangular; when the metal conductor 2 is of a special-shaped cross section, the fixing groove 10 is synchronously adapted to ensure that the two are closely fitted. The specific shape is designed according to the actual situation, which is not limited here.

[0033] In one embodiment, referring to Figure 2 As shown, the integrated inductor module further comprises a winding 4, the winding 4 is wrapped by the magnetic core 1 and the two ends of the winding 4 are exposed from the surface of the magnetic core 1; or, as shown in Figure 3 The winding 4 is arranged on the surface of the magnetic core 1.

[0034] In one embodiment, the material of the metal conductor 2 can be selected from high-conductivity metals (such as oxygen-free copper, high-purity aluminum), which can reduce the direct current resistance and reduce the conduction loss, while having a certain mechanical strength to avoid deformation when embedded in the fixing groove 10. Through the design of matching the shape and size of the fixing groove 10 and the metal conductor 2, the metal conductor 2 can be rigidly fixed by mechanical engagement. After the metal conductor 2 is embedded in the fixing groove 10, the groove wall restricts the metal conductor 2, so that no additional fixing parts are needed to resist deformation caused by vibration and temperature change.

[0035] In one embodiment, the metal conductor 2 is partially arranged in the fixing groove 10, and the other part of the side surface is exposed. The exposed side can provide a release channel for heat, which can be directly in contact with air or a heat dissipation structure (such as a heat sink), and can quickly dissipate heat through convection or conduction, solving the problem of poor heat dissipation caused by the close fit of the metal conductor 2 and the magnetic core 1.

[0036] Since the fixed groove 10 can be designed according to requirements, the metal conductor 2 can adopt a special-shaped cross section (such as a flat shape or a trapezoidal shape), which has two advantages compared with a traditional round wire: in the same space, the cross-sectional area of the special-shaped conductor is larger, which can reduce the direct current resistance (copper loss is positively correlated with resistance); the surface area of the flat conductor is larger, and the heat dissipation efficiency can be improved by more than 30% in cooperation with the side exposed design, especially in high-frequency scenarios, the skin effect makes the current concentrate on the surface of the conductor, and the larger surface area can reduce the skin loss.

[0037] In summary, the integrated inductor module matches the structure of the fixed groove 10 on the magnetic core 1 and the metal conductor 2, realizes the triangular balance of fixity, magnetic performance and heat dissipation, and is especially suitable for scenes (such as automobile electronics, industrial power supply and high-frequency communication equipment) with high requirements for stability, efficiency and heat dissipation.

[0038] In order to further increase the stability between the metal conductor 2 and the fixed groove 10, in one embodiment, as shown in Figure 4 and Figure 5 At least one first fitting part 100 is arranged in the fixed groove 10, and at least one second fitting part 20 matched with the first fitting part 100 is arranged on the outer circumferential surface of the metal conductor 2; the first fitting part 100 and the second fitting part 20 cooperate to fix the metal conductor 2 in the fixed groove 10.

[0039] The first fitting part 100 and the second fitting part 20 are complementary matching structures, and common forms include: A protrusion cooperates with a groove, that is, the first fitting part 100 can be a strip-shaped protrusion, and the second fitting part 20 can be a strip-shaped groove. The inner wall of the fixed groove 10 is provided with a strip-shaped protrusion (the first fitting part 100) extending in the length direction, and the metal conductor 2 is provided with a strip-shaped groove (the second fitting part 20) at the corresponding position. After the two are nested, axial constraint (to prevent the metal conductor 2 from sliding along the length direction of the fixed groove 10) is formed. If it is necessary to enhance the circumferential fixation (such as to prevent the conductor from rotating), it can be designed as a ring-shaped protrusion and a ring-shaped groove (distributed in the circumferential direction), or an irregular sawtooth-shaped protrusion and groove.

[0040] A buckle cooperates with a slot, that is, the first fitting part 100 can be an elastic buckle, and the second fitting part 20 can be a metal protrusion. The fixed groove 10 is provided with an elastic buckle, such as a metal protrusion with a small deformation capacity, and the metal conductor 2 is provided with a slot at the corresponding position. When the metal conductor 2 is embedded in the fixed groove 10, the buckle pops into the slot to form a locking effect, completely limiting the axial and radial movement of the metal conductor 2.

[0041] The tapered and inclined surfaces mate, meaning the first engaging portion 100 of the fixing slot 10 is designed as an inwardly inclined tapered surface, while the second engaging portion 20 of the metal conductor 2 is designed as a matching outwardly inclined surface. During assembly, an interference fit (compression between the inclined surfaces) ensures a tight fit between the two, secured by friction and mechanical locking. This approach is suitable for applications requiring high tightening force.

[0042] In one embodiment, multiple groups of small interlocking structures (such as dot-shaped protrusions and recesses) are spaced along the length of the fixing groove 10 and the metal conductor 2 to ensure overall fixation while preventing structural damage caused by excessive force on a single interlocking portion. Specifically, the first interlocking portion 100 can be a dot-shaped protrusion, and the second interlocking portion 20 can be a dot-shaped recess; alternatively, the first interlocking portion 100 can be a dot-shaped recess, and the second interlocking portion 20 can be a dot-shaped protrusion.

[0043] exist Figure 4 and Figure 5 In the structure shown, a strip protrusion of a preset length is provided in the fixing groove 10, and a strip groove corresponding to the strip protrusion is provided on the metal conductor 2. Other structures will not be described in detail in this embodiment.

[0044] In one embodiment, Figure 6 As shown, the metal conductor 2 includes a power transmission conductor 21 and a signal transmission conductor 22. The power transmission conductor 21 is used to transmit current, and the signal transmission conductor 22 is used to transmit control signals. In one embodiment, the power transmission conductor 21 is used to transmit a large current, and the signal transmission conductor 22 can also be used to transmit a small current or a control signal.

[0045] The signal transmission conductor 22 is in the shape of a straight bar, an arc-shaped bar, a broken line, a plate, or a sheet.

[0046] In order to improve the conductive efficiency of the power transmission conductor 21, in one embodiment, a metal coating is provided on the surface of the power transmission conductor 21, and the metal coating includes at least one metal layer, and each metal layer includes at least two segmented metal areas; the spacing between the segmented metal areas ranges from 0.1 mm to 5 mm; the thickness of each metal layer ranges from 0.1 μm to 1 μm; the horizontal offset distance of the segmented metal areas of two adjacent layers ranges from 0.2 mm to 0.5 mm, and the vertical offset ranges from 0.1 mm to 0.3 mm, so as to form a stable three-dimensional current channel and improve the conductive efficiency.

[0047] The metal layer may be a gold plating layer or a composite layer formed by gold and other materials with good electrical conductivity.

[0048] In one embodiment, the current distribution can be simulated by finite element analysis, and the spacing between the segmented metal regions is adjusted to concentrate the current in the metal layer to maximize the skin effect and improve the conduction efficiency. Too small spacing will cause current congestion, and too large spacing will reduce the skin effect. Preferably, the spacing between the segmented metal regions is in the range of 0.1 mm to 5 mm. Within this spacing range, the problem of current congestion caused by too small spacing can be effectively avoided, and sufficient skin effect strength can be ensured to significantly improve the conduction efficiency. Further preferably, when the spacing between the segmented metal regions is 0.5 mm to 2 mm, the current concentration effect in the metal layer can be optimized, the skin effect is maximized, and the conduction efficiency is optimally improved.

[0049] In one embodiment, in the multi-layer segmented metal structure, the segmented metal regions between different layers are staggered to form a three-dimensional current channel to further optimize the current distribution and reduce the resistance. Specifically, in the multi-layer segmented metal structure, the thickness of each layer can be adjusted according to actual application requirements. Preferably, the thickness of each gold-plated layer is in the range of 0.1 μm to 1 μm to ensure good conductivity and effective cost control. In one embodiment, the staggered arrangement of the metal layers between different layers can be regular, for example, the metal layers of adjacent two layers are staggered in the horizontal direction by a distance of 0.2 mm to 0.5 mm, and are also appropriately offset in the vertical direction by an offset of 0.1 mm to 0.3 mm to form a stable and efficient three-dimensional current channel.

[0050] In the preparation of the multi-layer segmented metal structure, an electroplating process can be used to realize precise deposition of each gold-plated layer by controlling parameters such as electroplating time and current density. The electroplating time can be controlled between 10 min and 30 min, and the current density is preferably 0.5 A / dm 2 -2 A / dm 2 to ensure the uniformity and quality of the metal plating layer, further optimize the current distribution, and effectively reduce the resistance.

[0051] Next, the design of the signal transmission conductor 22 in this embodiment will be introduced. The frequency of the signal to be transmitted is divided into three intervals, including less than or equal to 100 MHz (corresponding to low frequency), 100 MHz-1 GHz (corresponding to medium frequency), and higher than or equal to 1 GMHz (corresponding to high frequency).

[0052] In one embodiment, when the frequency of the signal to be transmitted is less than or equal to 100 MHz, the signal transmission conductor 22 is provided as a planar plating layer, the thickness of the planar plating layer is 0.1 μm-10 μm, and the width of the signal trace is 0.05 mm-5 mm.

[0053] For signals with a frequency lower than or equal to 100 MHz, a planar plating structure is adopted. The planar plating structure has the advantages of simple structure and low manufacturing cost, and can meet the transmission requirements of low-frequency signals. The shape and width of the signal trace can be adjusted according to actual application requirements to optimize the signal transmission characteristics. Preferably, the thickness of the planar plating structure is 0.1 μm-10 μm, and more preferably 0.5 μm-5 μm. The width of the signal trace is preferably 0.05 mm-5 mm, and more preferably 0.1 mm-2 mm; in one embodiment, the shape of the signal trace is a straight line, a broken line, or a microstrip line shape, wherein the length of the straight line trace is controlled within ±5% of the signal transmission distance, the bending angle of the broken line trace is preferably 45° or 90°, and the characteristic impedance of the microstrip line shape is preferably 50 Ω or 75 Ω.

[0054] In one embodiment, when the frequency of the signal to be transmitted is higher than 100 MHz, the signal transmission conductor 22 is formed by a microstrip line structure or a coplanar waveguide structure.

[0055] For signals with a frequency higher than 100 MHz, a microstrip line or coplanar waveguide structure is adopted. The microstrip line and coplanar waveguide structures can accurately control the characteristic impedance, reduce signal reflection, and improve signal integrity. The dielectric layer of the microstrip line structure can be made of a plastic encapsulating material, and by accurately controlling the thickness (0.1 mm-0.5 mm) and dielectric constant (εr=3.0-4.5) of the plastic encapsulating material, the characteristic impedance can be accurately matched (50 Ω±5 Ω). The coplanar waveguide structure has better grounding performance and can effectively suppress common-mode interference.

[0056] In one embodiment, when the frequency of the signal to be transmitted is higher than or equal to 1 GHz, the signal transmission conductor 22 is formed by a strip line structure or a shielded microstrip line structure.

[0057] For signals with a frequency higher than or equal to 1 GHz, a strip line structure or a shielded microstrip line structure is adopted. The strip line structure and the shielded microstrip line structure can provide stronger shielding effect and reduce signal radiation and crosstalk. The strip line structure completely wraps the signal line in the ground layer, having excellent shielding performance, and the shielding effect can reach -60 dB. The shielded microstrip line structure adds a ground layer above the microstrip line to form a shield, effectively suppressing electromagnetic interference and reducing crosstalk by ≥40 dB.

[0058] In one embodiment, the signal transmission conductor 22 includes a signal layer, a ground layer, and a power supply layer; the signal layer is used for transmitting signals, the ground layer is used for providing a reference ground, and the power supply layer is used for providing power for signal transmission; wherein the signal layer, the ground layer, and the power supply layer are connected to an external circuit through a blind hole or a buried hole.

[0059] The signal transmission conductor 22 is provided in a multi-layer interconnect structure. The signal layer is used to transmit high-speed signals, and an optimized routing design is used to reduce signal loss and crosstalk. The ground layer is used to provide a stable reference ground, suppress common-mode interference, and improve signal integrity. The power layer provides power for signal transmission, reducing the impact of power supply noise on the signal. Interlayer interconnection uses via technology, preferably blind or buried via technology, to reduce the impact of vias on signals. The via diameter is ≤0.2mm, and the via spacing is ≥0.4mm.

[0060] In order to avoid a short circuit between the signal transmission path and the power transmission path, in one embodiment, the minimum distance between the power transmission conductor 21 and the signal transmission conductor 22 is greater than or equal to 0.5 mm.

[0061] In order to improve signal integrity and anti-interference capability, in one embodiment, the metal plating layer is connected to the ground end of the signal transmission conductor 22 to improve signal integrity and anti-interference capability.

[0062] In summary, after the metal coating is plated using the multi-layer segmented metal structure, a large current (10A-50A) from an external power source flows in through the top pad and the bottom pad of the power transmission conductor 21. The metal coating has an extremely low oxidation rate (annual average weight gain ≤ 0.1μg / cm 2 ) and high electrical conductivity, ensuring long-term stability of the contact interface. Furthermore, signals to be transmitted (such as pulse-width modulation signals and current feedback signals) are transmitted via signal transmission conductor 22. Its low skin depth (approximately 6.6μm at 10MHz) reduces losses in high-frequency signal transmission. The spatial isolation between the signal and power transmission paths achieves a crosstalk suppression ratio exceeding 40dB.

[0063] In one embodiment, in addition to the above-mentioned solution of fixing the metal conductor 2 to the magnetic core 1 by providing a fixing groove 10 on the outer circumference of the magnetic core 1 and placing the metal conductor 2 in the fixing groove 10, considering the limitations of processing some structures in some scenarios, in one embodiment, referring to Figure 6 , directly bond the metal conductor 2 to the surface of the magnetic core 1. Figure 6 The signal transmission conductor 22 is disposed on the surface of the magnetic core 1 by electroplating, and the power transmission conductor 21 is bonded to the surface of the magnetic core 1 by adhesive.

[0064] In order to further fix the metal conductor 2, in one embodiment, as Figure 7As shown, the integrated inductor module further comprises a fixing collar 3, which is arranged along the array of metal conductors 2 on the outer circumferential surface of the magnetic core 1; the fixing collar 3 comprises a plurality of non-fully closed ring structures 30, which allow the metal conductors 2 to pass through the openings of the ring structures 30 to fix the metal conductors 2 on the outer circumferential surface of the magnetic core 1.

[0065] In the embodiment, the ring structures 30 are arranged along the array of metal conductors 2 on the outer circumferential surface of the magnetic core 1, and each ring structure 30 is a non-fully closed ring, but is in a "C" or "U" shape, i.e., the interface of the ring structure 30 with the magnetic core 1 is open to allow the metal conductors 2 to pass through and ensure that the metal conductors 2 are arranged on the outer surface of the magnetic core 1.

[0066] The fixing collar 3 is arranged on the side or top of the metal conductors 2, and the specific position depends on the shape and arrangement of the metal conductors 2. Each ring structure 30 is adjacent to a plurality of metal conductors 2 and fixes them by physical contact or slight pressure. The ring structures 30 are uniformly distributed in the array of metal conductors 2 to ensure the overall fixing effect. The ring structures 30 are connected with the metal conductors 2 by buckling, interference fit or adhesion, etc. In one embodiment, the fixing collar 3 clamps the metal conductors 2 by its own elastic deformation without physical connection. Referring to Figure 7 The fixing collar 3 is in a strip shape and is arranged on both the upper and lower sides of the metal conductors 2, which can effectively fix the metal conductors 2 and improve the overall mechanical strength.

[0067] In one embodiment, the ring structures 30 in the fixing collar 3 can also isolate adjacent metal conductors 2 to reduce electromagnetic interference. The fixing collar 3 can also be made of heat-conducting materials to assist heat dissipation and thus reduce the temperature of the integrated inductor module.

[0068] In the embodiment, the fixing groove 10 is arranged on the outer circumferential surface of the magnetic core 1, and the size and shape of the fixing groove 10 are matched with the metal conductors 2 for transmitting power and signals. The metal conductors 2 are partially arranged in the fixing groove 10, which realizes the mechanical fixing of the magnetic core 1 and the metal conductors 2, effectively improves the integration and mechanical strength of the inductor module, and further exposes the side of the metal conductors 2, which is beneficial to the heat dissipation of the inductor module and effectively improves the electrical performance and reliability of the overall inductor module.

[0069] Embodiment 2: The embodiment proposes a power module to further illustrate the integrated inductor module proposed in embodiment 1. In one embodiment, the power module comprises a circuit board and the integrated inductor module as described in embodiment 1, and the winding 4 and the metal conductor 2 of the integrated inductor module are electrically connected with the circuit board.

[0070] Wherein, the circuit board is designed with a functional chip, and the specific function of the functional chip can be designed according to actual needs. The embodiment also optimizes the layout design of the PIN (pin) on the integrated inductor module, wherein: In one embodiment, as shown in Figure 8 , Figure 9 and Figure 10 , from the top view of the power module, the orthographic projection of the input voltage pin (i.e. vin) of the functional chip is at least 40% in the input voltage pin (i.e. VIN) area range of the integrated inductor module. That is, the orthographic projection of the vin area of the functional chip is at least 40% in the VIN PIN area range of the integrated inductor module. This ensures that the input voltage of the functional chip can be effectively and directly transmitted to the VIN PIN of the inductor module, thereby reducing the impedance of the input loop.

[0071] Further referring to Figure 8 and Figure 9 , from the top view of the power module, the orthographic projection of the ground pin of the functional chip is at least 50% in the ground pin area range of the integrated inductor module. That is, the orthographic projection of the GND PIN (i.e. ground pin) of the functional chip is at least 50% in the GND PIN area range of the integrated inductor module. This design makes the ground connection of the functional chip more stable, reduces the ground bounce effect, and improves the stability of the power module.

[0072] In one embodiment, referring to Figure 10 , from the top view of the power module, the orthographic projection of the switch node SW pin of the functional chip is at least 80% in the output voltage pin area range of the integrated inductor module. That is, the orthographic projection of the SW PIN (i.e. switch node SW pin) of the functional chip is at least 80% in the VOUT PIN (i.e. output voltage pin) area range of the integrated inductor module. This means that the energy of the switch node SW can be efficiently transmitted to the output end, while reducing the electromagnetic interference radiated by the switch node SW.

[0073] In summary, the PIN pin layout scheme of the top view of the integrated inductor module can reduce the wiring on the external circuit board, reduce the parasitic parameters, and facilitate the layout of the designer.

[0074] In one embodiment, the projection of the switch node SW pin of the functional chip and the projection of winding 4 in the integrated inductor module are in area overlap, and the minimum distance between the center point of the projection of winding 4 and the projection of the switch node SW pin of the functional chip is not more than 2mm. This feature makes the connection between the switch node SW of the functional chip and the integrated inductor module as short as possible, significantly reduces the parasitic inductance efficiency, and improves the switching speed. This compact layout is also beneficial to reduce electromagnetic interference radiation. The switch node SW is the main source of electromagnetic interference radiation in the power conversion circuit. By shortening the connection between the switch node SW pin of the functional chip and the inductor module, electromagnetic interference can be effectively reduced. The design of overlap or minimum distance ensures the compactness of the connection, which needs to be balanced between manufacturing process and performance requirements in actual design.

[0075] In one embodiment, as shown in Figure 10 From the side view of the inductor module, the width of the ground wire of the functional chip is not less than the width of the ground pin of the integrated inductor module. That is, the width of the GND wire of the functional chip is not less than the width of the GND PIN of the integrated inductor module. In addition, among the vertical center lines of the ground wire of the functional chip, the vertical center line of the ground wire of the integrated inductor module, and the vertical center line of the ground pin of the integrated inductor module, the distance between any two vertical center lines is not more than 1.5mm. This design ensures the low impedance of the GND path, reduces the ground bounce effect and common mode noise, and improves the stability and electromagnetic compatibility of the power module.

[0076] For the specific structure of the integrated inductor module, see embodiment 1, which will not be repeated here.

[0077] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An integrated inductor module, characterized in that: It comprises a magnetic core (1) and a metal conductor (2), wherein the outer peripheral surface of the magnetic core (1) is provided with a fixing groove (10); The size and shape of the fixing groove (10) match the metal conductor (2); the metal conductor (2) is partially disposed in the fixing groove (10), and the side surface of the metal conductor (2) is partially exposed.

2. The integrated inductor module according to claim 1, wherein: At least one first engaging portion (100) is provided in the fixing groove (10), and at least one second engaging portion (20) matching the first engaging portion (100) is provided on the outer peripheral surface of the metal conductor (2); The first engaging portion (100) and the second engaging portion (20) cooperate to fix the metal conductor (2) in the fixing groove (10).

3. The integrated inductor module according to claim 1, wherein: The metal conductor (2) comprises a power transmission conductor (21) and a signal transmission conductor (22), wherein the power transmission conductor (21) is used to transmit current, and the signal transmission conductor (22) is used to transmit a control signal.

4. The integrated inductor module according to claim 3, wherein: A metal coating is provided on the surface of the power transmission conductor (21), the metal coating comprising at least one metal layer, each metal layer comprising at least two segmented metal regions; The spacing between the segmented metal areas ranges from 0.1 mm to 5 mm; The thickness of each metal layer ranges from 0.1 μm to 1 μm; The distance between the segmented metal regions of two adjacent layers is staggered in the horizontal direction by 0.2 mm to 0.5 mm, and the offset in the vertical direction is offset by 0.1 mm to 0.3 mm, so as to form a stable three-dimensional current channel.

5. The integrated inductor module according to claim 3, wherein: When the frequency of the signal to be transmitted is lower than or equal to 100 MHz, the signal transmission conductor (22) is configured as a planar coating, the thickness of the planar coating is 0.1 μm-10 μm, and the width of the signal trace is 0.05 mm-5 mm; When the frequency of the signal to be transmitted is higher than 100 MHz, the signal transmission conductor (22) is formed by a microstrip line structure or a coplanar waveguide structure; When the frequency of the signal to be transmitted is higher than or equal to 1 GMHz, the signal transmission conductor (22) is formed by a stripline structure or a shielded microstrip line structure.

6. The integrated inductor module according to claim 3, wherein: The signal transmission conductor (22) is in the shape of a straight bar, an arc-shaped bar, a broken line, a plate or a sheet.

7. The integrated inductor module according to claim 1, wherein: The integrated inductor module further comprises a fixed collar (3), wherein the fixed collar (3) is distributed along the metal conductor (2) array on the outer peripheral surface of the magnetic core (1); The fixing collar (3) comprises a plurality of incompletely enclosed annular structures (30) to allow the metal conductor (2) to pass through openings of the annular structures (30) to fix the metal conductor (2) on the outer peripheral surface of the magnetic core (1).

8. The integrated inductor module according to claim 1, wherein: The shape of the magnetic core (1) is one or more of a cuboid, a cylinder, a ring or a special shape.

9. The integrated inductor module according to claim 1, wherein: The integrated inductor module further comprises a winding (4), wherein the winding (4) is wrapped by the magnetic core (1) and two ends of the winding (4) are exposed from the surface of the magnetic core (1); or, the winding (4) is arranged on the surface of the magnetic core (1).

10. A power module, characterized in that: It comprises a circuit board and an integrated inductor module according to any one of claims 1 to 9, wherein a functional chip is provided on the circuit board, and the winding (4) of the integrated inductor module and the metal conductor (2) are both electrically connected to the circuit board.

11. The power module according to claim 10, characterized in that: At least 40% of the orthographic projection of the input voltage pin of the functional chip is located within the input voltage pin area of ​​the integrated inductor module; At least 50% of the orthographic projection of the ground pin of the functional chip is located within the ground pin area of ​​the integrated inductor module; At least 80% of the orthographic projection of the switch node SW pin of the functional chip is located within the output voltage pin area of ​​the integrated inductor module.

12. The power module according to claim 10, characterized in that: The orthographic projection of the switch node SW pin of the functional chip overlaps with the orthographic projection of the winding (4) in the integrated inductor module, and the minimum distance between the center point of the orthographic projection of the winding (4) and the orthographic projection of the switch node SW pin of the functional chip does not exceed 2 mm.

13. The power module according to claim 10, characterized in that: The width of the grounding conductor of the functional chip is not less than the width of the grounding pin of the integrated inductor module.

14. The power module according to claim 10, characterized in that: Among the vertical center lines of the grounding wire of the functional chip, the vertical center line of the grounding wire of the integrated inductor module, and the vertical center line of the grounding pin of the integrated inductor module, the distance between any two vertical center lines does not exceed 1.5 mm.

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