Capacitive angle ring and manufacturing method

Abstract

The invention relates to the technical field of capacitor manufacturing, in particular to a capacitive angle ring and a manufacturing method. The capacitive angle ring provided by the invention comprises a body on an annular body, the body and the annular body are plate bodies which are insulated and are of a multi-layer structure, nonlinear semi-conductive polar plates are arranged between layers of the plate bodies, the nonlinear semi-conductive polar plates and the plate bodies are tightly attached to each other, and a sensor arranged in the capacitive angle ring performs signal transmission with an upper computer through a signal transmission line. The invention solves the problem that the power line at the angle ring position obliquely penetrates through the insulator and is easy to cause creeping discharge. According to the invention, a plurality of capacitors are arranged in series, and the insulating cardboard has insulation and mechanical strength and has a synergistic effect with the nonlinear semi-conductive polar plate. After the device is installed and used, the trend of a power line is rearranged by virtue of a unique capacitor structure according to a capacitor voltage division principle, the surface electric field of the angle ring is forcibly homogenized, the surface discharge risk is greatly reduced, and the insulation performance and the operation reliability of electrical equipment are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of electric appliance manufacturing, in particular to a capacitive angle ring and a manufacturing method. BACKGROUND

[0002] In a high-voltage electrical equipment operation system, the angle ring is one of the core components of the insulation structure, and is located in a special position in the equipment, so that the power line penetrates the insulation through the tilt, and the electric field distribution is not conducive to insulation. When in the running condition, this uneven electric field has a great possibility of developing into a surface discharge, and the energy generated by the surface discharge gradually erodes the insulation material, gradually reducing the insulation performance. Over time, once the insulation breakdown occurs, the electrical equipment may even be paralyzed, threatening the power supply safety and stability of the entire power system. With the development of power equipment towards high voltage and large capacity, the traditional angle ring is more likely to become the weak link of the entire equipment, and it is urgent to innovate the angle ring structure and optimize the electric field distribution. SUMMARY

[0003] In order to solve the above technical problems existing in the prior art, the application provides a capacitive angle ring and a manufacturing method. Compared with the special structure of the traditional angle ring in which the nonlinear semi-conductive electrode plate is clamped between the multiple paper boards, multiple capacitors are arranged in series, the power line direction is reorganized according to the capacitor voltage division principle by virtue of the unique capacitor structure, the surface electric field of the angle ring is forced to be uniform, and the purpose of reducing the risk of surface discharge and improving the insulation performance and operation reliability of the electrical equipment is achieved.

[0004] In order to achieve the above application purpose, the application provides a capacitive angle ring, which comprises a body arranged on a ring body, the body comprises an insulating and multi-layer structure plate body, a nonlinear semi-conductive electrode plate is arranged between layers of the multi-layer structure plate body, and the nonlinear semi-conductive electrode plate is tightly attached to the plate body layers, at least one sensor is arranged in the body, and the sensor is connected to an upper computer through a signal transmission line for signal transmission, and the sensor is used to monitor the internal electric field distribution.

[0005] Preferably, the sensor is embedded in the preset clamping groove of the body and is tightly attached to the internal multi-layer structure plate body.

[0006] Preferably, a circular arc is arranged between the vertical plate body and the horizontal plate body of the body, and the radian range of the circular arc is 80-130°.

[0007] Preferably, the radian of the circular arc is 80°, 90°, 100°, 100°, 120° or 130°.

[0008] Preferably, the plate body is made of a multi-layer structure of paperboard of paper material, which has good insulation performance and mechanical strength, and the thickness of the paperboard ranges from 0.5 to 3.0 mm according to the voltage level of the transformer and the required process.

[0009] Preferably, each layer of the paperboard is directly and stably connected to the adjacent nonlinear semi-conductive electrode plate by adhesive or hot-pressing composite connection to form an integral structure, and the nonlinear semi-conductive electrode plate forms a capacitor series structure, which plays a role in forcing the surface electric field distribution of the corner ring and realizing electric field homogenization.

[0010] Preferably, the nonlinear semi-conductive electrode plate is coated with a thin insulating plate of a nonlinear semi-conductive material coating, and the electrical conductivity ranges from 1×10 5 S / m to 1×10 7 S / m, the thickness of the nonlinear semi-conductive electrode plate ranges from 0.05 to 0.30 mm, the nonlinear semi-conductive electrode plate is horizontally placed between the adjacent two layers of the paperboard, and completely covers the corresponding layer of the paperboard, which plays a role in ensuring uniform distribution of the electric field.

[0011] Preferably, the annular body and the edge of the body are provided with an insulating protective layer, which tightly wraps the edge of the corner ring, and the thickness ranges from 1.0 to 5.0 mm, which plays a role in preventing discharge of the edge of the corner ring and avoiding external physical damage.

[0012] The application also provides a manufacturing method of the capacitor corner ring, which comprises the following steps:

[0013] Step 1: The paper material with good insulation performance and mechanical strength meeting the use conditions is used as the body and the body raw material, and the wood pulp insulating paperboard with a thickness of 0.5 mm is formed by pressing the raw material of the wood pulp paper of the electrical grade sulfate in a mold, so as to ensure that the thickness of each layer of the paperboard is uniform and the material quality is stable and reliable.

[0014] Step 2: The surface of the prepared nonlinear semi-conductive electrode plate insulating paperboard is coated with a nonlinear semi-conductive material coating, and the coating material is the epoxy resin paint doped with nano-SiC, the electrical conductivity is 1×10 -7 S / m or 8×10 -6 S / m, the thickness is 0.05 mm, the spraying method is used for coating, and the coating is uniform, dense, without pinholes and air bubbles.

[0015] Step 3: The paperboard with nonlinear semiconductive electrode plates processed in step 1 and step 2 are alternately stacked, a layer of paperboard with nonlinear semiconductive electrode plates is placed first, and then epoxy resin insulating glue is uniformly coated on its surface. Then the next layer of paperboard with nonlinear semiconductive electrode plates is placed in alignment, ensuring complete coverage of the paperboard layer and no offset or wrinkles. This step is repeated until the designed number of layers, which is 10 layers, is reached. During the stacking process, the layers are tightly arranged, and the gap between the body and the annular body layer is less than 0.01 millimeters;

[0016] The hollow annular body and the body are connected by adhesive method and placed in a constant temperature and humidity device for curing. The curing temperature is 35°C and the humidity is 40%. The curing time is at least 48 hours;

[0017] Step 4: The edges of the bonded annular body and body are treated with 2.0-5.0 mm rounded corners. Epoxy resin is selected as the edge protection layer material. A secondary injection molding process is used to inject the molten protective material into the mold, tightly wrapping the edge of the annular ring. The thickness of the protective layer is controlled to be 1.0-5.0 millimeters to ensure seamless integration with the annular ring body and form a complete protective structure.

[0018] Step 5: The sensor is embedded. According to the size of the electric field intensity sensor, a 5.0 cm x 5.0 cm square card slot is dug on the outside of the annular ring. The electric field intensity sensor is embedded in the card slot, and a signal transmission line with a shielding layer is led out. Then epoxy resin insulating glue is filled into the card slot and cured at 35°C and 40% humidity for 48 hours. After curing, the cured epoxy resin is polished to ensure that the surface of the cured epoxy resin is smooth and smoothly transitions to the surrounding insulating paperboard. At this time, the sensor is tightly attached to the internal structure of the annular ring and is well connected to the signal lead-out line.

[0019] Preferably, the manufacturing method further comprises the following steps:

[0020] Step 1: Aramid insulation paper is selected as the raw material and is pressed into 1 mm thick insulation paperboard in a mold. Ensure that the thickness of each layer of paperboard is uniform and the material quality is stable and reliable. The surface of the nonlinear semiconductive electrode plate insulation paperboard is coated with a nonlinear semiconductive material coating. The coating material is nano-SiC doped modified epoxy resin paint with an electrical conductivity of 8 x 10 -6 S / m and a thickness of 0.05 millimeters. The coating is applied using a spray coating method to ensure uniformity, density, and freedom from pinholes and air bubbles.

[0021] Step 2: Make the annular body and the body of the capacitive angle ring, alternately stack the processed multi-layer paperboard with nonlinear semiconductive electrode plates, first place a layer of paperboard with nonlinear semiconductive electrode plates, evenly coat epoxy resin insulating glue on the surface, then align and place the next layer of paperboard with nonlinear semiconductive electrode plates, ensure complete coverage of the paperboard layer and no offset, wrinkle, repeat this step until the number of layers reaches 3, during the stacking process, the layers are closely arranged, and the gap between the layers is less than 0.01 millimeters;

[0022] Step 3: Using hot pressing composite process, the annular body and the body of the stacked structure are sent into the hot press, and the paperboard and the nonlinear semiconductive electrode plate of the annular body and the body are tightly combined under the condition of 120 DEG C temperature and 3 MPa pressure for 60 minutes, to form an integrated capacitive angle ring rough blank;

[0023] Step 4: The edges of the annular body and the body are rounded by 5mm, silicon rubber is selected as the edge protection layer material, and a secondary injection molding process is adopted to inject the molten protective material into the mold to tightly wrap the edge of the angle ring, the thickness of the protective layer is controlled to be 1.0 millimeter, which ensures seamless combination with the angle ring body to form a complete protective structure;

[0024] Step 5: Embed the sensor, according to the size of the electric field intensity sensor, a 5cm*5cm square clamping groove is dug on the outside of the angle ring, the electric field intensity sensor is embedded in the clamping groove, and the signal transmission line with a shielding layer is led out, then the clamping groove is filled with epoxy resin insulating glue and cured for at least 48 hours in an environment of 35 DEG C and 40% humidity, after curing, the cured epoxy resin is polished, the surface of the cured epoxy resin is smooth and smoothly transitions to the surrounding insulating paperboard, the sensor is tightly attached to the internal structure of the angle ring, and is well connected with the lead wire of the signal transmission line.

[0025] Compared with the prior art, the present application has the following beneficial effects:

[0026] 1. Electric field optimization and insulation enhancement: The unique capacitive series structure of the capacitive angle ring significantly optimizes the electric field distribution, greatly reduces the electric field intensity peak, makes the surface electric field of the angle ring uniform, effectively suppresses the surface discharge, significantly improves the insulation performance of the electrical equipment, prolongs the service life of the equipment, reduces the equipment failure rate, reduces the power outage accidents caused by insulation problems, and ensures the stable operation of the power system.

[0027] 2. Structure adaptation and universality: Flexible layer number, various shapes and adjustable internal angle design make it adapt to the internal structure of various high-voltage electrical equipment, whether it is a transformer, motor or other high-voltage equipment, it can realize efficient insulation protection, has strong universality, and can be widely applied to various equipment in the power industry, reducing equipment research and production cost.

[0028] 3. This invention improves edge protection and safety: The edge insulation layer is made of high-voltage, wear-resistant insulating rubber or plastic, tightly bonded to the main body of the corner ring through secondary injection molding or bonding, forming a seamless protective structure. This effectively prevents edge discharge and protects against external physical damage such as collisions and friction, further enhancing the overall insulation performance and safety of the corner ring, ensuring reliable operation of the device in complex environments.

[0029] 4. This invention enables real-time monitoring and intelligent operation and maintenance: Built-in sensors are precisely embedded in the internal slots of the corner ring, tightly fitting the multi-layer structure, and monitor internal capacitance performance and electric field distribution in real time. Data is transmitted to external monitoring equipment via wireless or wired connections, allowing technicians to remotely monitor the corner ring's operating status in real time, detect anomalies promptly, and issue warnings. This enables intelligent operation and maintenance, preventing potential failures and reducing equipment maintenance costs and downtime. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention.

[0031] Figure 1 This is a structural diagram of the capacitive angle ring and the positions of the high and low voltage coils of the present invention;

[0032] Figure 2 This is a three-dimensional structural diagram of the capacitive angle ring of the present invention;

[0033] Figure 3 for Figure 2 AA section view.

[0034] Reference numerals

[0035] In the figure, 1-capacitive angle ring, 2-body, 3-slot, 4-signal transmission line, 5-connection connector, 6-sensor, 7-arc, 8-nonlinear conductive electrode plate, 9-plate body, 10-ring body. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0037] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0038] Example 1

[0039] like Figures 1-3 As shown, the present embodiment provides a capacitive angle ring 1, comprising a body 2 arranged on a ring body 10, wherein the capacitive angle ring 1 is arranged between the high and low windings, the ring body 10 and the body 2 comprise an insulating and multi-layered plate body 9, nonlinear semiconductor electrode plates 8 are provided between the layers of the multi-layered plate body 9, and the nonlinear semiconductor electrode plates 8 and the plate body 9 are tightly fitted. To achieve tight fitting, a stable overall structure is formed by gluing or hot pressing. The cross section of the body 2 is an L-shaped structure. At least one sensor 6 is provided in the body 2 to transmit signals to the host computer through a signal transmission line 4. For easy connection, a connection connector 5 that can be quickly plugged in and out is provided on the signal transmission line 4. The sensor 6 is used to monitor the internal electric field distribution. The body 2 is pre-set with a card slot 3, and the sensor 6 is embedded in the pre-set card slot 3 of the body 2, and it is tightly fitted with the internal multi-layered plate body 9.

[0040] Preferably, a circular arc 7 is provided between the vertical and horizontal plates of the main body 2, and the arc 7 has an angle ranging from 80° to 130°. In a preferred configuration, the arc 7 has an angle of 80°, 90°, 100°, 100°, 120°, or 130°. In this embodiment, the arc 7 has an angle of 90°. Preferably, the plate 9 is made of a multi-layered cardboard structure made of paper material, which has excellent insulation properties and mechanical strength. The cardboard thickness ranges from 0.5 to 3.0 mm, depending on the voltage level of the transformer and the required process. Preferably, each layer of cardboard is directly and firmly connected to the adjacent nonlinear semiconductor plate 8 via gluing or hot pressing to form a monolithic structure. The nonlinear semiconductor plates 8 form a capacitor series structure, which enforces electric field distribution on the corner ring surface and achieves electric field equalization. The monolithic structure provides a solid insulation foundation and physical support. Preferably, the cardboard thickness of the plate 9 ranges from 1.0 to 2.0 mm. More preferably, the thickness of the paperboard is 1.0, 1.5, 1.8 or 2.0 mm. In the preferred structure, the nonlinear semiconductive electrode plate 8 is coated with a thin insulating plate of nonlinear semiconductive material coating, and the conductivity is between 1×10 5 S / m to 1×10 7The thickness of the non-linear semi-conductive plate 8 is 0.05-0.30 mm, the non-linear semi-conductive plate 8 is horizontally placed between the adjacent two layers of paperboard and completely covers the corresponding layer of the paperboard, thereby ensuring uniform distribution of the electric field. Further preferably, the edge of the annular body 10 and the body 2 is provided with an insulating protective layer which tightly wraps the edge of the annular ring, and the thickness of the insulating protective layer is 1.0-5.0 mm, thereby preventing discharge of the edge of the annular ring and avoiding external physical damage.

[0041] In the embodiment, when power is turned on, the capacitor series structure formed between the non-linear semi-conductive plate 8 and the paperboard starts to work based on the capacitor voltage division principle, re-plans the power line path, effectively disperses the electric field intensity, thereby forcibly uniformly distributing the electric field on the surface of the annular ring and fundamentally inhibiting the occurrence of surface discharge. The number of layers of the capacitor type annular ring is flexibly designed to be 3-10, and the capacitor type annular ring can be customized according to the electric field distribution requirements of different equipment, has various shapes including arc shape, ring shape or polygonal shape, and the inner angle of the annular ring is adjustable within 30°-150°, thereby accurately adapting to the complex structure inside various equipment and cooperating with other insulating components to build a perfect insulating system.

[0042] The manufacturing method and process of the capacitor type annular ring are as follows.

[0043] Step 1: paper material with good insulating performance and mechanical strength meeting the use conditions is used as the raw material of the multi-layer paper, and the paper material is pressed and formed into 0.5 mm thick wood pulp insulating paperboard in a mold by using the paper raw material of the wood pulp sulfate of the electrician grade, so as to ensure that the thickness of each layer of paperboard is uniform and the material quality is stable and reliable.

[0044] Step 2: the surface of the prepared non-linear semi-conductive plate 8 insulating paperboard is coated with a non-linear semi-conductive material coating, and the coating material used is nano SiC doped modified epoxy resin paint, the conductivity of which is 1*10 -7 S / m or 8*10 -6 S / m, and the thickness is 0.05 mm, the coating is performed by using a spraying method, and the coating is uniform and dense without pinhole and bubble defects.

[0045] Step 3: the multi-layer paperboard with the non-linear semi-conductive plate 8 treated in steps 1 and 2 is alternately stacked, one layer of the paperboard with the non-linear semi-conductive plate 8 is first placed, the surface of the paperboard is uniformly coated with epoxy resin insulating glue, then the next layer of the paperboard with the non-linear semi-conductive plate 8 is aligned and placed, so as to ensure that the paperboard layer is completely covered and free of offset and wrinkles, and the step is repeated until the designed number of layers is 10, and in the stacking process, the layers are closely arranged, and the gap between the layers is less than 0.01 mm.

[0046] The hollow annular body 10 and the body 2 are connected by adhesion, placed in a constant temperature and humidity device for curing, the curing temperature is 35 DEG C, the humidity is 40%, and at least 48 hours are cured;

[0047] Step 4: The edges of the bonded annular body 10 and the body 2 are chamfered by 2.0-5.0mm, epoxy resin is selected as the edge protection layer material, a secondary injection molding process is used, the molten protection material is injected into the mold, tightly wraps the edge of the annular ring, the thickness of the protection layer is controlled to be 1-5mm, the seamless combination with the main body of the annular ring is ensured, and a complete protection structure is formed;

[0048] Step 5: The embedding of the sensor 6, according to the size of the electric field intensity sensor, a square card slot 3 with a size of 5cm*5cm is dug out on the outside of the annular ring, the electric field intensity sensor 6 is embedded in the card slot 3, and the signal transmission line 4 with a shielding layer is led out, then the card slot 3 is filled with epoxy resin insulating glue and cured for 48 hours in an environment of 35 DEG C and 40% humidity; after curing, the cured epoxy resin is polished to ensure that the surface of the cured epoxy resin is smooth and the surrounding insulating paper board is smoothly transitioned, at this time, the sensor 6 is closely combined with the internal structure of the annular ring, and is well connected with the signal leading-out line.

[0049] Example 2

[0050] The manufacturing method and process of the capacitive annular ring provided by the application are as follows:

[0051] The manufacturing method comprises the following steps:

[0052] Step 1: Aramid insulating paper is selected as raw material, and is pressed and formed into an insulating paper board with a thickness of 1mm in a mold, to ensure that the thickness of each paper board is uniform, and the material quality is stable and reliable, the surface of the insulating paper board of the nonlinear semi-conductive plate 8 is coated with a nonlinear semi-conductive material coating, the coating material is nano-SiC doped modified epoxy resin paint, the electrical conductivity is 8*10 -6 S / m, and the thickness is 0.05mm, the coating is performed by spraying to ensure that the coating is uniform, dense, and free of pinholes and air bubble defects;

[0053] Step 2: The annular body 10 and the body 2 of the capacitive annular ring are manufactured, the treated multiple paper boards with the nonlinear semi-conductive plate 8 are alternately stacked, a paper board with the nonlinear semi-conductive plate 8 is first placed, the surface is uniformly coated with epoxy resin insulating glue, then the next paper board with the nonlinear semi-conductive plate 8 is placed in alignment, to ensure that the paper board is completely covered and free of offset and wrinkles, the step is repeated until the number of layers reaches 3, in the stacking process, the layers are closely arranged, and the interlayer gap is less than 0.01mm;

[0054] Step 3: The annular body 10 and the body 2 of the laminated structure are sent into a hot press by using a hot-pressing process, and the paperboard of the annular body 10 and the body 2 and the nonlinear semiconductive plate 8 are tightly combined to form an integrated capacitor angle ring roughcast under the conditions of 120℃ temperature, 3MPa pressure and 60 minutes of hot pressing;

[0055] Step 4: The edges of the annular body 10 and the body 2 are rounded by 5mm, and silicone rubber is selected as the edge protection layer material, and a secondary injection molding process is used to inject the molten protective material into the mold to tightly wrap the edge of the angle ring, the thickness of the protective layer is controlled to be 1mm, and seamless combination with the angle ring body is ensured to form a complete protective structure;

[0056] Step 5: The sensor 6 is embedded, a 5cm×5cm square clamping groove 3 is dug out on the outside of the angle ring according to the size of the electric field intensity sensor, the electric field intensity sensor is embedded in the clamping groove 3, and the signal transmission line 4 with a shielding layer is led out, then the clamping groove 3 is filled with epoxy resin insulating glue and cured for at least 48 hours in an environment of 35℃ and 40% humidity, and after curing, the cured epoxy resin is polished, the surface of the cured epoxy resin is smooth and smoothly transitions to the surrounding insulating paperboard, the sensor 6 is tightly attached to the internal structure of the angle ring, and is well connected with the lead wire of the signal transmission line 4.

[0057] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to these embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including all the preferred embodiments and all the changes and modifications falling within the scope of the present application.

[0058] Obviously, various modifications and changes can be made to the present application by those skilled in the art without departing from the spirit and scope of the present application. Thus, it is intended that the present application cover the modifications and changes as falling within the scope of the claims and their equivalents.

Claims

1. A capacitive angle ring (1), comprising a body (2) arranged on a ring body (10), characterized in that: The main body (2) includes an insulating and multi-layered plate body (9), wherein nonlinear semiconductor electrode plates (8) are provided between the layers of the plate body (9), and the nonlinear semiconductor electrode plates (8) and the plate body (9) are tightly fitted together. At least one sensor (6) is provided in the main body (2) for transmitting signals to a host computer via a signal transmission line (4), and the sensor (6) is used to monitor the internal electric field distribution.

2. The capacitive angle ring according to claim 1, wherein: The sensor (6) is embedded in a preset slot (3) of the main body (2) and is tightly fitted with the internal multi-layer structure plate (9).

3. The capacitive angle ring according to claim 1, wherein: A circular arc (7) is provided between the vertical plate and the horizontal plate of the main body (2), and the arc angle of the circular arc (7) ranges from 80 to 130 degrees.

4. The capacitive angle ring according to claim 3, wherein: The arc (7) has an angle of 80°, 90°, 100°, 100°, 120° or 130°.

5. The capacitive angle ring according to claim 1, wherein: The board body (9) is made of a paper material and has a multi-layer structure. The board has good insulation performance and mechanical strength. The thickness of the board is set in a range of 0.5 to 3.0 mm according to the voltage level of the transformer and the required process.

6. The capacitive angle ring according to claim 1, wherein: Each layer of paperboard of the plate body (9) is directly and firmly connected to the adjacent nonlinear semiconductor electrode plate (8) by gluing or hot pressing to form an integral structure. The nonlinear semiconductor electrode plate (8) forms a capacitor series structure, which plays the role of forcing the electric field distribution on the corner ring surface and achieving electric field homogenization.

7. The capacitive angle ring according to claim 1, wherein: The nonlinear semiconducting electrode plate (8) is coated with a thin insulating plate of a nonlinear semiconducting material coating, and the conductivity is 1×10 5 S / m to 1×10 7 S / m, the thickness of the nonlinear semiconductive electrode plate (8) is 0.05-0.30 mm, and the nonlinear semiconductive electrode plate (8) is horizontally placed between two adjacent layers of cardboard and completely covers the corresponding layers of the cardboard, thereby ensuring uniform distribution of the electric field.

8. The capacitive angle ring according to claim 1, wherein: The edges of the annular body (10) and the main body (2) are provided with an insulating protective layer, which tightly wraps the edge of the corner ring and has a thickness ranging from 1.0 to 5.0 mm, thereby preventing discharge from occurring at the edge of the corner ring and avoiding external physical damage.

9. A method for manufacturing a capacitive angle ring according to any one of claims 1 to 8, characterized in that: The production method comprises the following steps: Step 1: Use a paper material with good insulation performance and mechanical strength that meets the use conditions as the raw material for the multi-layer paper of the body (2), and use electrical grade sulfate wood pulp paper raw material to press and form it into a 0.5mm thick wood pulp insulation paperboard in a mold, ensuring that the thickness of each layer of paperboard is uniform and the material quality is stable and reliable; Step 2: The nonlinear semiconducting electrode plate (8) insulating paperboard surface is coated with a nonlinear semiconducting material coating. The coating material used is nano-SiC doped modified epoxy resin paint with a conductivity of 1×10 -7 S / m or 8×10 -6 S / m, thickness of 0.05 mm, spray coating method is used, the coating is uniform and dense, without pinholes and bubble defects; Step 3: alternately stack the multiple layers of cardboard with nonlinear semiconductor electrode plates (8) processed in steps 1 and 2, first place a layer of cardboard with nonlinear semiconductor electrode plates (8), evenly apply epoxy resin insulating glue on its surface, and then align and place the next layer of cardboard with nonlinear semiconductor electrode plates (8), ensuring that the cardboard layer is completely covered without offset or wrinkles, repeat this step until the designed number of layers is at least 10, and the layers are closely arranged during the stacking process, and the gap between the layers is less than 0.01 mm; The hollow annular body (10) and the main body (2) are connected by gluing, and placed in a constant temperature and humidity device for curing at a temperature of 35°C and a humidity of 40% for at least 48 hours; Step 4; The edges of the bonded annular body (10) and the main body (2) are chamfered by 2.0 to 5.0 mm, epoxy resin is selected as the edge protection layer material, and a secondary injection molding process is adopted to inject the molten protection material into the mold to tightly wrap the edge of the corner ring. The thickness of the protection layer is controlled to be 1.0 mm to 5.0 mm to ensure seamless integration with the main body of the corner ring to form a complete protection structure; Step 5: Embed the sensor (6). According to the size of the electric field strength sensor, dig out a 5cm×5cm square slot (3) on the outside of the corner ring, embed the sensor (6) in the slot (3), and lead out the signal transmission line (4) with a shielding layer. Then fill the slot (3) with epoxy resin insulation glue and cure it at 35℃ and 40% humidity for 48 hours. After curing, polish the cured epoxy resin to ensure that the surface of the cured epoxy resin is flat and smooth and has a smooth transition to the surrounding insulating cardboard. The sensor (6) fits tightly with the internal structure of the corner ring and is well connected with the signal lead line.

10. A method for manufacturing a capacitive angle ring according to any one of claims 1 to 8, characterized in that: The production method comprises the following steps: Step 1: Use aramid insulation paper as raw material and press it into 1.0 mm thick insulation paperboard in a mold to ensure that the thickness of each paperboard layer is uniform and the material quality is stable and reliable. Coat the surface of the insulation paperboard of the nonlinear semiconducting electrode plate (8) with a nonlinear semiconducting material coating. The coating material is nano-SiC doped modified epoxy resin paint with a conductivity of 8×10 -6 S / m, thickness of 0.05 mm, spray coating method is used to ensure uniform and dense coating without pinhole and bubble defects; Step 2: Make the annular body (1) and the main body (2) of the capacitive angle ring, and alternately stack the processed multiple layers of cardboard with nonlinear semiconductor electrode plates (8). First, place a layer of cardboard with nonlinear semiconductor electrode plates (8), evenly apply epoxy resin insulating glue on its surface, and then align and place the next layer of cardboard with nonlinear semiconductor electrode plates (8), ensuring that the cardboard layer is completely covered without offset or wrinkles. Repeat this step until the number of layers reaches 3. During the stacking process, the layers are closely arranged, and the gap between the layers is less than 0.01 mm. Step 3: Using a hot pressing composite process, the laminated ring body (10) and the main body (2) are fed into a hot press, and hot pressed at a temperature of 120° C. and a pressure of 3 MPa for 60 minutes, so that the paperboards of the ring body (10) and the main body (2) are tightly combined with the nonlinear semiconductor electrode plate (8) to form an integrated capacitive angle ring blank; Step 4: The edges of the ring body (10) and the main body (2) are chamfered by 5 mm, silicone rubber is selected as the edge protection layer material, and the protective material in a molten state is injected into the mold by a secondary injection molding process to tightly wrap the edge of the corner ring. The thickness of the protective layer is controlled at 1.0 mm to ensure seamless integration with the main body of the corner ring to form a complete protective structure; Step 5: Embed the sensor (6). According to the size of the electric field strength sensor, dig out a 5cm×5cm square slot (3) on the outside of the corner ring. Embed the electric field strength sensor in the slot (3) and lead out the signal transmission line (4) with a shielding layer. Then fill the slot (3) with epoxy resin insulation glue and cure it at 35°C and 40% humidity for at least 48 hours. After curing, polish the cured epoxy resin. The surface of the cured epoxy resin is flat and smooth and smoothly transitions to the surrounding insulating cardboard. The sensor (6) fits tightly with the internal structure of the corner ring and is well connected with the lead-out line of the signal transmission line (4).

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