Embedded multilayer ceramic capacitor

Abstract

An embedded multilayer ceramic capacitor comprises a multilayer brick, a first terminal electrode and a second terminal electrode. The laminated brick comprises a ceramic body, a first inner electrode and a second inner electrode. The ceramic body is provided with an upper surface, a lower surface, a first side surface and a second side surface, the first and second side surfaces are located between the upper and lower surfaces. The first inner electrode and the second inner electrode are alternately embedded in the ceramic body at intervals. Each of the first and second internal electrodes includes a first portion and a second portion. The first part extends between the first side surface and the second side surface and is separated from the first side surface, the second side surface, the upper surface and the lower surface. The second portion extends from a portion of the top surface of the first portion to the upper surface of the ceramic body. Second portions of the first and second internal electrodes face each other. The first terminal electrode covers a top surface of the second portion of the first inner electrode. The second terminal electrode covers the top surface of the second portion of the second inner electrode. The first end electrode and the second end electrode are both located on the upper surface of the ceramic body, so that a circuit connected with the outside can be directly manufactured on the upper surface, and the yield of the packaging process can be improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a capacitor manufacturing technique, and more particularly to a multi-layer ceramic capacitor (MLCC) embedded in a circuit board. BACKGROUND

[0002] A multi-layer ceramic capacitor is a type of ceramic capacitor, and its capacitance is proportional to the product's surface area and the number of stacked ceramic films. Because the multi-layer ceramic capacitor can be directly adhered by surface mount technology (SMT), and the multi-layer ceramic capacitor is easy to be waferized and small in size, the multi-layer ceramic capacitor has become a mainstream product in the capacitor industry and is used in various electronic devices.

[0003] Embedded packaging technology integrates passive components, such as capacitors and resistors, into the multi-layer structure of a circuit board or a packaging carrier to reduce the area of the passive components on the surface of the circuit board or the packaging carrier, thereby leaving the surface space of the circuit board or the packaging carrier for integrated circuits. Therefore, such packaging technology can improve the use efficiency of the circuit board or the packaging carrier. In addition, embedding the multi-layer ceramic capacitor in the circuit board or the packaging carrier can make the multi-layer ceramic capacitor have lower acoustic noise, better bending resistance, and smaller equivalent series inductance (ESL).

[0004] Generally, when embedding the multi-layer ceramic capacitor in the circuit board, a groove is first formed in the circuit board to accommodate the multi-layer ceramic capacitor, and then the multi-layer ceramic capacitor is installed in the groove. Next, an insulating layer is formed on the circuit board and the multi-layer ceramic capacitor, and a via hole is formed in the insulating layer to expose two end electrodes of the multi-layer ceramic capacitor. Subsequently, a conductive material is filled in the via hole to form a via, and a circuit is formed on the circuit board and the via, so that the multi-layer ceramic capacitor can be electrically connected to external components through the via and the circuit.

[0005] However, such embedding method includes steps of setting an insulating layer, drilling a hole in the insulating layer, and filling a conductive material into the via hole, which makes the process too complicated. In addition, the end electrodes are mostly formed by first adhering a metal liquid to two end surfaces of the multi-layer brick to form a first layer of metal, and then plating other metal layers that are beneficial for soldering. However, the surface roughness of the end electrodes formed by such manufacturing method is high, and the thickness uniformity is poor. When the multi-layer ceramic capacitor is installed in the circuit board in an embedded manner, the high surface roughness and low thickness uniformity of the end electrodes can cause the bonding reliability between the end electrodes and the vias connecting the end electrodes and other components of the packaging structure to decrease, thereby affecting the packaging yield. SUMMARY

[0006] One object of the present disclosure is to provide an embedded multilayer ceramic capacitor that can solve the problems of the prior art.

[0007] To achieve the above object, the present disclosure provides an embedded multilayer ceramic capacitor. The embedded multilayer ceramic capacitor includes a multilayer brick, a first end electrode, and a second end electrode. The multilayer brick includes a ceramic body, a plurality of first internal electrodes, and a plurality of second internal electrodes. The ceramic body has an upper surface and a lower surface, and first and second side surfaces opposite to each other, wherein the first and second side surfaces are located between the upper surface and the lower surface. The plurality of first and second internal electrodes are alternately and physically spaced embedded in the ceramic body. Each of the first and second internal electrodes includes a first portion and a second portion. The first portion extends between the first and second side surfaces and is spaced from the first and second side surfaces, the upper surface, and the lower surface. The second portion extends from a portion of the top surface of the first portion to the upper surface of the ceramic body, and the top surface of the second portion is exposed to the upper surface. The second portion of the first internal electrode and the second portion of the second internal electrode are opposite to each other. The first end electrode extends to cover the top surface of the second portion of the first internal electrode. The second end electrode extends to cover the top surface of the second portion of the second internal electrode.

[0008] According to an embodiment of the present disclosure, the first and second internal electrodes are substantially perpendicular to the upper and lower surfaces.

[0009] According to an embodiment of the present disclosure, the shape of each of the first internal electrodes is substantially inverted L-shaped, and the shape of each of the second internal electrodes is substantially L-shaped.

[0010] According to an embodiment of the present disclosure, the first and second end electrodes are both electroplated copper structures.

[0011] According to an embodiment of the present disclosure, the first and second end electrodes each include an electroplated copper layer, an electroplated nickel layer, and an electroplated tin layer stacked in sequence.

[0012] According to an embodiment of the present disclosure, the first and second internal electrodes, the portion of the ceramic body sandwiched between the first and second internal electrodes, the first end electrode, and the second end electrode constitute a first capacitor unit, and the embedded multilayer ceramic capacitor further includes at least one second capacitor unit in the multilayer brick.

[0013] According to an embodiment of the present disclosure, the second capacitor unit has the same structure as the first capacitor unit, and each of the second capacitor units includes the same number of first and second internal electrodes as the first and second internal electrodes of the first capacitor unit.

[0014] According to an embodiment of the present disclosure, the second capacitor unit has the same structure as the first capacitor unit, and each of the second capacitor units includes a plurality of first inner electrodes and a plurality of second inner electrodes, the number of the first inner electrodes and the second inner electrodes of each of the second capacitor units being different from each other.

[0015] According to an embodiment of the present disclosure, the second capacitor unit has the same structure as the first capacitor unit, and the number of the second capacitor units is plural. Each of the second capacitor units includes a plurality of first inner electrodes and a plurality of second inner electrodes, the number of the first inner electrodes and the second inner electrodes of each of the second capacitor units being different from each other.

[0016] According to an embodiment of the present disclosure, the second capacitor unit has the same structure as the first capacitor unit, and the number of the second capacitor units is plural. Each of the second capacitor units includes a plurality of first inner electrodes and a plurality of second inner electrodes. The second capacitor units are divided into a plurality of groups, and the number of the first inner electrodes and the second inner electrodes of each of the second capacitor units in each group is the same.

[0017] According to the above-mentioned embodiments, the second part of the first inner electrode and the second inner electrode of the embedded multilayer ceramic capacitor protrudes from the top surface of the first part, and the top surface of the second part is exposed on the upper surface of the ceramic body. Therefore, by using the electroplating process, two electrodes with the required height and high quality can be grown on the opposite two regions of the upper surface of the ceramic body based on the exposed part of the first inner electrode and the second inner electrode. In addition, the height of the embedded multilayer ceramic capacitor can be adjusted according to the thickness of the packaging carrier, so that the end electrodes of the embedded multilayer ceramic capacitor protrude from the top of the packaging carrier, and the lines connecting the embedded multilayer ceramic capacitor and the outside can be directly made on the upper surface of the ceramic body and the surface of the packaging carrier. Therefore, the application of the embedded multilayer ceramic capacitor can greatly reduce the complexity of the packaging process and improve the yield of the packaging process.

[0018] Moreover, since both end electrodes are located on the upper surface of the ceramic body, the oxidation protection treatment of the end electrodes can be concentrated on the area of the upper surface of the ceramic body, which can simplify the oxidation protection treatment and reduce the risk of oxidation of the end electrodes. BRIEF DESCRIPTION OF DRAWINGS

[0019] A better understanding of the present disclosure will be obtained through the following detailed description in conjunction with the following drawings, in which it should be noted that the various features are not drawn to scale and that the embodiments are by way of illustration only. In fact, dimensions can be arbitrarily increased or decreased for the sake of discussion.

[0020] Figure 1 To illustrate a perspective view of an embedded multilayer ceramic capacitor according to a first embodiment of the present disclosure.

[0021] Figure 2 FIG. 1 is a perspective view illustrating a multilayer ceramic capacitor package according to an embodiment of the present disclosure.

[0022] Figure 3 FIG. 2 is a perspective view illustrating a multilayer ceramic capacitor package according to another embodiment of the present disclosure.

[0023] Figure 4 FIG. 3 is a perspective view illustrating a multilayer ceramic capacitor package according to another embodiment of the present disclosure.

[0024] Figure 5 FIG. 4 is a perspective view illustrating a multilayer ceramic capacitor package according to another embodiment of the present disclosure.

[0025] Figure 6 FIG. 5 is a perspective view illustrating a multilayer ceramic capacitor package according to another embodiment of the present disclosure.

[0026] Figure 7 FIG. 6 is a perspective view illustrating a multilayer ceramic capacitor package according to another embodiment of the present disclosure.

[0027] Figures 8A to 9B FIG. 7 is a flow diagram illustrating a method of packaging a multilayer ceramic capacitor according to an embodiment of the present disclosure. Figure 8A FIG. 8 is a perspective view illustrating a multilayer ceramic capacitor package according to an embodiment of the present disclosure. Figure 9A FIG. 9 is a perspective view illustrating a multilayer ceramic capacitor package according to an embodiment of the present disclosure. Figure 8B FIG. 10 is a perspective view illustrating a multilayer ceramic capacitor package according to an embodiment of the present disclosure. Figure 9B FIG. 11 is a perspective view illustrating a multilayer ceramic capacitor package according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] The embodiments discussed below provide many applicable concepts, which can be implemented in a wide variety of specific contexts. The embodiments discussed and disclosed are merely illustrative and not restrictive.

[0029] In addition, the terms "first", "second", etc. are used herein only to describe one element or operation from another element or operation, and do not necessarily indicate the order of the elements or operations.

[0030] Spatially relative terms, such as "first", "second", and the like, merely describe a relative position or order of one element to another element, and do not necessarily indicate orientation. The terms "connected", "coupled", or the like, merely mean that two or more elements are in some way physically or electrically related, whether directly or indirectly, and can include wired or wireless communication between or among two or more elements.

[0031] Please refer to Figure 1 With Figure 2 FIG. 1A and FIG. 1B respectively show a perspective view of an embedded multilayer ceramic capacitor 100 and a perspective view of a multilayer brick 200 of the embedded multilayer ceramic capacitor 100 according to a first embodiment of the present disclosure. The embedded multilayer ceramic capacitor 100 is suitable for an embedded package structure. However, the embedded multilayer ceramic capacitor 100 can also be suitable for other package structures, and the present disclosure is not limited thereto. The embedded multilayer ceramic capacitor 100 can mainly include the multilayer brick 200, a first end electrode 300, and a second end electrode 400.

[0032] The shape of the multilayer brick 200 can be designed according to product requirements. For example, the multilayer brick 200 can be a cuboid or a cube. The multilayer brick 200 can mainly include a ceramic body 210, a plurality of first internal electrodes 220, and a plurality of second internal electrodes 230. When the multilayer brick 200 is manufactured, a plurality of ceramic green sheets, the first internal electrodes 220, and the second internal electrodes 230 can be alternately stacked to form a stacked structure, and then the stacked structure can be sintered. The ceramic body 210 is formed after sintering of the ceramic green sheets.

[0033] In Figure 1 The ceramic body 210 is a cuboid. The ceramic body 210 can have an upper surface 212 and a lower surface 214, and a first side surface 216 and a second side surface 218 opposite to each other. The first side surface 216 and the second side surface 218 are both located between the upper surface 212 and the lower surface 214. In some embodiments, the upper surface 212 and the lower surface 214 are parallel to each other, and the first side surface 216 and the second side surface 218 are parallel to each other and substantially perpendicular to the upper surface 212 and the lower surface 214.

[0034] As Figure 2 shown, the first internal electrodes 220 and the second internal electrodes 230 are in a sheet structure. The first internal electrodes 220 and the second internal electrodes 230 are embedded in the ceramic body 210 with a physical distance from each other. The first internal electrodes 220 and the second internal electrodes 230 are alternately arranged with each other.

[0035] Each first internal electrode 220 includes a first portion 222 and a second portion 224 joined to each other. The first portion 222 extends between the first side surface 216 and the second side surface 218 of the ceramic body 210. The first portion 222 is spaced apart from the first side surface 216, the second side surface 218, the upper surface 212, and the lower surface 214, i.e. the first portion 222 is completely located in the ceramic body 210 without being exposed. Specifically, the first portion 222 is vertically arranged above the lower surface 214 and between the lower surface 214 and the upper surface 212. The first portion 222 can be a square or rectangular sheet structure. The first portion 222 has a top surface 222a facing the upper surface 212 of the ceramic body 210.

[0036] The second portion 224 of the first inner electrode 220 is joined on the top surface 222a of the first portion 222 and extends from the top surface 222a to the upper surface 212 of the ceramic body 210. Thus, a top surface 224a of the second portion 224 is exposed to the upper surface 212. The second portion 224 can be a square or rectangular plate-like structure. The second portion 224 is shorter than the first portion 222, and thus the second portion 224 is located on only a portion of the top surface 222a of the first portion 222. For example, as shown, the second portion 224 can be located on one end of the top surface 222a of the first portion 222, such that the first inner electrode 220 has a shape like an inverted L character. Figure 2

[0037] Similarly, each second inner electrode 230 includes a first portion 232 and a second portion 234 joined to each other. The first portion 232 extends between the first side surface 216 and the second side surface 218 of the ceramic body 210. The first portion 232 is spaced apart from the first side surface 216, the second side surface 218, the upper surface 212, and the lower surface 214. Thus, the first portion 232 is entirely located within the ceramic body 210 and is not exposed. In particular, the first portion 232 is erected between the lower surface 214 and the upper surface 212. The first portion 232 can be a square or rectangular plate-like structure. The first portion 232 has a top surface 232a facing the upper surface 212.

[0038] The second portion 234 of the second inner electrode 230 is joined on the top surface 232a of the first portion 232 and extends from the top surface 232a to the upper surface 212 of the ceramic body 210. Thus, a top surface 234a of the second portion 234 is exposed to the upper surface 212. The second portion 234 can be a square or rectangular plate-like structure. The second portion 234 is shorter than the first portion 232 and is located on only a portion of the top surface 232a of the first portion 232. The second portion 234 of the second inner electrode 230 is opposite to the second portion 224 of the first inner electrode 220. For example, the second portion 234 can be located on one end of the top surface 232a, such that the second inner electrode 230 has a shape like an L character.

[0039] In some embodiments, the first inner electrode 220 and the second inner electrode 230 are mirror-symmetric structures, i.e., the second inner electrode 230 can completely overlap the first inner electrode 220 after being flipped 180 degrees. However, the first inner electrode 220 and the second inner electrode 230 can not be symmetric structures, and the disclosure is not limited thereto. In some embodiments, the first inner electrode 220 and the second inner electrode 230 are substantially perpendicular to the upper surface 212 and the lower surface 214. For example, the material of the first inner electrode 220 and the second inner electrode 230 can be copper, silver, or nickel.

[0040] ​The first end electrode 300 is located on the upper surface 212 of the ceramic body 210 and extends to cover the exposed top surface 224a of the second portion 224 of all the first inner electrodes 220. The first end electrode 300 is located only on the upper surface 212 and does not extend to other surfaces of the ceramic body 210. The first end electrode 300 can be a single layer structure. For example, the first end electrode 300 can be a one layer electroplated copper structure. In some embodiments, the first end electrode 300 is a multi-layer stacked structure. For example, the first end electrode 300 can include an electroplated copper layer, an electroplated nickel layer, and an electroplated tin layer stacked in sequence on the upper surface 212 for applications of other packaging methods.

[0041] The second end electrode 400 is located on the upper surface 212 of the ceramic body 210 and extends to cover the exposed top surface 234a of the second portion 234 of all the second inner electrodes 230. The second end electrode 400 is also located only on the upper surface 212 and does not extend to other surfaces of the ceramic body 210. The second end electrode 400 can be a single layer structure or a multi-layer stacked structure. For example, the second end electrode 400 can be a one layer electroplated copper structure, or the second end electrode 400 can include an electroplated copper layer, an electroplated nickel layer, and an electroplated tin layer stacked in sequence on the upper surface 212.

[0042] Since the top surfaces 224a of the second portions 224 of the first inner electrodes 220 and the top surfaces 234a of the second portions 234 of the second inner electrodes 230 are exposed on the upper surface 212 of the ceramic body 210, the first end electrode 300 and the second end electrode 400 can be grown on two local areas of the upper surface 212 of the ceramic body 210 based on the exposed portions of the first inner electrodes 220 and the second inner electrodes 230 by electroplating. Since the first end electrode 300 and the second end electrode 400 are made by electroplating, the surface roughness of the first end electrode 300 and the second end electrode 400 is low and the thickness is uniform.

[0043] Since the first end electrode 300 and the second end electrode 400 are both located on the upper surface 212 of the ceramic body 210, when the embedded multilayer ceramic capacitor 100 is packaged in a packaging carrier, lines can be directly formed to be connected with the first end electrode 300 and the second end electrode 400. Therefore, steps such as setting an insulating layer, drilling holes in the insulating layer, and filling conductive material in the holes of the insulating layer can be omitted, the complexity of the embedding process of the embedded multilayer ceramic capacitor 100 can be reduced, and the packaging yield can be improved.

[0044] The embedded multilayer ceramic capacitor disclosed in the present disclosure can integrate multiple multilayer ceramic capacitor units in a multilayer brick according to various application requirements. These multilayer ceramic capacitor units can have the same capacitance value or different capacitance values; or some of the multilayer ceramic capacitor units have the same capacitance value, and other multilayer ceramic capacitor units have different capacitance values.

[0045] Referring to Figure 3 With Figure 4 FIG. 6 is a perspective view illustrating a multilayer ceramic capacitor 100a according to a second embodiment of the present disclosure, and FIG. 7 is a perspective view illustrating a multilayer ceramic capacitor 200a of the multilayer ceramic capacitor 100a according to the second embodiment of the present disclosure. In the multilayer ceramic capacitor 100a, the multilayer ceramic capacitor 200a includes a first capacitor unit CA1 and a plurality of second capacitor units CA2a. The second capacitor units CA2a can be one, but the present disclosure is not limited thereto.

[0046] The first capacitor unit CA1 is the same as the multilayer ceramic capacitor 100, and includes the first internal electrodes 220, the second internal electrodes 230, the portions of the ceramic body 210 interposed between the first and second internal electrodes 220 and 230, the first end electrode 300, and the second end electrode 400 of the above-described embodiments.

[0047] The configuration of each of the second capacitor units CA2a is the same as that of the first capacitor unit CA1. That is, each of the second capacitor units CA2a includes the plurality of first internal electrodes 220, the plurality of second internal electrodes 230, the ceramic body 210 interposed between the first and second internal electrodes 220 and 230, and the two end electrodes, and the arrangement of the first and second internal electrodes 220 and 230 is the same as that of the first capacitor unit CA1. In this embodiment, the number of the first and second internal electrodes 220 and 230 of each of the second capacitor units CA2a is the same as that of the first and second internal electrodes 220 and 230 of the first capacitor unit CA1. Therefore, each of the second capacitor units CA2a includes the same first and second end electrodes 300 and 400 as the first capacitor unit CA1. Thus, the capacitance of each of the second capacitor units CA2a can be substantially the same as that of the first capacitor unit CA1.

[0048] Referring to Figure 5 With Figure 6 FIG. 8 is a perspective view illustrating a multilayer ceramic capacitor 100b according to a third embodiment of the present disclosure, and FIG. 9 is a perspective view illustrating a multilayer ceramic capacitor 200b of the multilayer ceramic capacitor 100b according to the third embodiment of the present disclosure. In the multilayer ceramic capacitor 100b, the multilayer ceramic capacitor 200b includes the first capacitor unit CA1 and one second capacitor unit CA2b.

[0049] The configuration of the second capacitor unit CA2b is the same as that of the first capacitor unit CA1. That is, the second capacitor unit CA2b includes a plurality of first internal electrodes 220, a plurality of second internal electrodes 230, ceramic bodies 210 interposed between the first and second internal electrodes 220 and 230, and two end electrodes, and the arrangement of the first and second internal electrodes 220 and 230 is the same as that of the first capacitor unit CA1. In this embodiment, the number of the first and second internal electrodes 220 and 230 of the second capacitor unit CA2b is different from that of the first and second internal electrodes 220 and 230 of the first capacitor unit CA1. In Figure 4 In the illustrated embodiment, the second capacitor unit CA2b has more first and second internal electrodes 220 and 230 than the first capacitor unit CA1. Since the second capacitor unit CA2b has more first and second internal electrodes 220 and 230, the first and second end electrodes 500 and 600 of the second capacitor unit CA2b are larger than the first and second end electrodes 300 and 400 of the first capacitor unit CA1, respectively. The capacitance of the second capacitor unit CA2b is larger than that of the first capacitor unit CA1.

[0050] Please refer to Figure 7 which is a perspective view illustrating an embedded multilayer ceramic capacitor 100c according to a fourth embodiment of the present disclosure. In the embedded multilayer ceramic capacitor 100c, the multilayer brick 200c includes the first capacitor unit CA1, and a plurality of second capacitor units CA2c and CA2d.

[0051] The configuration of each of the second capacitor units CA2c and CA2d is the same as that of the first capacitor unit CA1. Please refer to Figure 2 Like the first capacitor unit CA1, each of the second capacitor units CA2c and CA2d includes a plurality of first internal electrodes 220, a plurality of second internal electrodes 230, ceramic bodies 210 interposed between the first and second internal electrodes 220 and 230, and two end electrodes, and the arrangement of the first and second internal electrodes 220 and 230 is the same as that of the first capacitor unit CA1.

[0052] The number of the first and second internal electrodes 220 and 230 of each of the second capacitor units CA2c is different from that of each of the second capacitor units CA2d. Therefore, the size of the first and second end electrodes 500a and 600a of each of the second capacitor units CA2c is different from that of the first and second end electrodes 500b and 600b of each of the second capacitor units CA2d.

[0053] In this embodiment, the second capacitor units CA2c and CA2d are divided into a group of four second capacitor units CA2c and a group of three second capacitor units CA2d. In the group of second capacitor units CA2c, the number of first internal electrodes 220 and the number of second internal electrodes 230 are the same among the four second capacitor units CA2c. In the group of second capacitor units CA2d, the number of first internal electrodes 220 and the number of second internal electrodes 230 are the same among the three second capacitor units CA2d. Therefore, the second capacitor units CA2c have substantially the same capacitance value, and the second capacitor units CA2d have substantially the same capacitance value.

[0054] The present disclosure is not limited to the above embodiment. The first capacitor units CA1 and other capacitor units, such as the second capacitor units CA2b, CA2c, and CA2d, can be integrated together in a similar manner as described above. The number of first internal electrodes 220 and the number of second internal electrodes 230 are different among the second capacitor units CA2b, CA2c, and CA2d.

[0055] Please refer to Figures 8A to 9B , which is a flowchart illustrating a process of packaging an embedded multilayer ceramic capacitor 100 in a packaging carrier 700 according to an embodiment of the present disclosure, wherein Figure 8A and Figure 9A are perspective views, Figure 8B and Figure 9B are cross-sectional views. The packaging carrier 700 can be, for example, a circuit board. The packaging carrier 700 has a recess 710. The shape of the recess 710 corresponds to the shape of the embedded multilayer ceramic capacitor 100, but the size can be slightly larger than the embedded multilayer ceramic capacitor 100 to facilitate placement of the embedded multilayer ceramic capacitor 100. As shown in Figure 8A and Figure 8B , during packaging, the embedded multilayer ceramic capacitor 100 can be placed in the recess 710, and the embedded multilayer ceramic capacitor 100 can be fixed in the recess 710 using a subsequent layer 720.

[0056] In Figure 8B embodiments, the first end electrode 300 and the second end electrode 400 of the embedded multilayer ceramic capacitor 100 are higher than the upper surface 702 of the packaging carrier 700. In other embodiments, the height of the embedded multilayer ceramic capacitor 100 can be adjusted so that the upper surface 302 of the first end electrode 300 and the upper surface 402 of the second end electrode 400 are substantially flush with the upper surface 702 of the packaging carrier 700.

[0057] Subsequently, as shown in Figure 9A and Figure 9BAs shown, the lines 800 and 900 can be formed directly by, for example, printing or deposition. The line 800 covers the first end electrode 300 of the embedded multilayer ceramic capacitor 100 and is electrically connected to the first end electrode 300. The line 900 covers the second end electrode 400 of the embedded multilayer ceramic capacitor 100 and is electrically connected to the second end electrode 400. Through the lines 800 and 900, the embedded multilayer ceramic capacitor 100 can be electrically connected to other components. For example, two end electrodes of another capacitor can be mounted on the lines 800 and 900, respectively, so that the embedded multilayer ceramic capacitor 100 can be electrically connected to the capacitor through the lines 800 and 900. The lines 800 and 900 can be made of copper.

[0058] The first end electrode 300 and the second end electrode 400 of the embedded multilayer ceramic capacitor 100 are located on the upper side of the embedded multilayer ceramic capacitor 100, and the height of the embedded multilayer ceramic capacitor 100 can be adjusted so that the first end electrode 300 and the second end electrode 400 of the embedded multilayer ceramic capacitor 100 protrude from the upper surface 702 of the packaging carrier 700. In this way, the steps of providing the insulating layer, drilling the insulating layer, and filling the holes with the conductive material can be omitted, thereby simplifying the packaging process and improving the yield of the packaging process.

[0059] As can be seen from the above embodiments, the second portions of the first internal electrode and the second internal electrode of the embedded multilayer ceramic capacitor protrude from the top surface of the first portion, and the top surface of the second portion is exposed on the upper surface of the ceramic body. Therefore, the two end electrodes with the required height and high quality can be grown on the opposite two regions of the upper surface of the ceramic body based on the exposed portions of the first internal electrode and the second internal electrode by using the electroplating process. In addition, the height of the embedded multilayer ceramic capacitor can be adjusted according to the thickness of the packaging carrier, so that the end electrodes of the embedded multilayer ceramic capacitor protrude from the top of the packaging carrier, and the lines for connecting the embedded multilayer ceramic capacitor to the outside can be directly made on the upper surface of the ceramic body and the surface of the packaging carrier. Therefore, the application of the embedded multilayer ceramic capacitor can greatly reduce the complexity of the packaging process and improve the yield of the packaging process.

[0060] Furthermore, since the two end electrodes are located on the upper surface of the ceramic body, the oxidation protection treatment of the end electrodes can be concentrated on the regions of the upper surface of the ceramic body, thereby simplifying the oxidation protection treatment and reducing the risk of oxidation of the end electrodes.

[0061] Although the present disclosure has been disclosed with the above embodiments, it is not intended to limit the present disclosure, and any person skilled in the art can make various modifications and improvements without departing from the spirit and scope of the present disclosure, and the protection scope of the present disclosure shall be subject to the appended claims.

[0062]

Symbol Description

[0063] 100: Embedded multilayer ceramic capacitor

[0064] 100a: Embedded multilayer ceramic capacitor

[0065] 100b: Embedded multilayer ceramic capacitor

[0066] 100c: Embedded multilayer ceramic capacitor

[0067] 200: Multilayer brick

[0068] 200a: Multilayer brick

[0069] 200b: Multilayer brick

[0070] 200c: Multilayer brick

[0071] 210: Ceramic body

[0072] 212: Upper surface

[0073] 214: Lower surface

[0074] 216: First side surface

[0075] 218: Second side surface

[0076] 220: First internal electrode

[0077] 222: First portion

[0078] 222a: Top surface

[0079] 224: Second portion

[0080] 224a: Top surface

[0081] 230: Second internal electrode

[0082] 232: First portion

[0083] 232a: Top surface

[0084] 234: Second portion

[0085] 234a: Top surface

[0086] 300: First end electrode

[0087] 302: Upper surface

[0088] 400: Second end electrode

[0089] 402: Upper surface

[0090] 500: First end electrode

[0091] 500a: first terminal electrode

[0092] 500b: first terminal electrode

[0093] 600: second terminal electrode

[0094] 600a: second terminal electrode

[0095] 600b: second terminal electrode

[0096] 700: package carrier

[0097] 702: upper surface

[0098] 710: recess

[0099] 720: adhesive layer

[0100] 800: line

[0101] 900: line

[0102] CA1: first capacitor unit

[0103] CA2a: second capacitor unit

[0104] CA2b: second capacitor unit

[0105] CA2c: second capacitor unit

[0106] CA2d: second capacitor unit

Claims

1. An embedded multilayer ceramic capacitor, characterized in that: The embedded multilayer ceramic capacitor comprises: Laminated bricks, including: a ceramic body having an upper surface and a lower surface, and a first side surface and a second side surface opposite to each other, wherein the first side surface and the second side surface are located between the upper surface and the lower surface; and A plurality of first inner electrodes and a plurality of second inner electrodes are alternately and physically separated from each other and embedded in the ceramic body, wherein each of the plurality of first inner electrodes and the plurality of second inner electrodes comprises: a first portion extending between the first side surface and the second side surface and spaced apart from the first side surface, the second side surface, the upper surface, and the lower surface; as well as a second portion extending from a portion of the top surface of the first portion to the upper surface of the ceramic body, with the top surface of the second portion exposed to the upper surface, wherein the second portions of the plurality of first inner electrodes and the second portions of the plurality of second inner electrodes are opposite to each other; and a first terminal electrode extending to cover the top surfaces of the second portions of the plurality of first inner electrodes; as well as The second terminal electrode extends to cover the top surfaces of the second portions of the second inner electrodes.

2. The embedded multilayer ceramic capacitor according to claim 1, wherein: The plurality of first inner electrodes and the plurality of second inner electrodes are substantially perpendicular to the upper surface and the lower surface.

3. The embedded multilayer ceramic capacitor according to claim 1, wherein: Each of the plurality of first inner electrodes has a shape similar to an inverted L-shape, and each of the plurality of second inner electrodes has a shape similar to an L-shape.

4. The embedded multilayer ceramic capacitor according to claim 1, wherein: The first terminal electrode and the second terminal electrode are both electroplated copper structures.

5. The embedded multilayer ceramic capacitor according to claim 1, wherein: The first end electrode and the second end electrode both include an electroplated copper layer, an electroplated nickel layer, and an electroplated tin layer stacked in sequence.

6. The embedded multilayer ceramic capacitor according to claim 1, wherein: The multiple first inner electrodes, the multiple second inner electrodes, the portion of the ceramic body sandwiched between the multiple first inner electrodes and the multiple second inner electrodes, the first end electrode, and the second end electrode constitute a first capacitor unit, and the embedded multilayer ceramic capacitor also includes at least one second capacitor unit located in the multilayer brick.

7. The embedded multilayer ceramic capacitor according to claim 6, wherein: The structure of the at least one second capacitor unit is the same as that of the first capacitor unit, and each of the at least one second capacitor unit includes a plurality of first inner electrodes and a plurality of second inner electrodes, the same number as the plurality of first inner electrodes and the plurality of second inner electrodes of the first capacitor unit.

8. The embedded multilayer ceramic capacitor according to claim 6, wherein: The structure of the at least one second capacitor unit is the same as that of the first capacitor unit, and each of the at least one second capacitor unit includes a plurality of first inner electrodes and a plurality of second inner electrodes different in number from the plurality of first inner electrodes and the plurality of second inner electrodes of the first capacitor unit.

9. The embedded multilayer ceramic capacitor according to claim 6, wherein: The structure of the at least one second capacitor unit is the same as that of the first capacitor unit, and the number of the at least one second capacitor unit is multiple, each of the multiple second capacitor units includes multiple first inner electrodes and multiple second inner electrodes, and the number of the multiple first inner electrodes and the multiple second inner electrodes between the multiple second capacitor units are different.

10. The embedded multilayer ceramic capacitor according to claim 6, wherein: The structure of the at least one second capacitor unit is the same as that of the first capacitor unit, and there are multiple second capacitor units. Each of the multiple second capacitor units includes multiple first inner electrodes and multiple second inner electrodes. The multiple second capacitor units are divided into multiple groups, wherein the number of the multiple first inner electrodes and the number of the multiple second inner electrodes between the multiple second capacitor units in each of the multiple groups is the same.

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