A plasma etching apparatus

Abstract

The application relates to the technical field of semiconductor etching, in particular to a plasma etching device which comprises a rack, a liftable lifting frame arranged on the rack, a rotatable gas supply main pipe installed on the lifting frame, a cross pipe arranged below the gas supply main pipe, a plurality of fixed pipes fixed on the cross pipe, a servo motor installed on the lifting frame, and a transmission member in transmission connection between the gas supply main pipe and the output shaft of the servo motor. In use, the number of nozzles on the cross pipe can be adjusted according to the size of a semiconductor wafer, so that the ejected plasma etching gas can completely cover the wafer, gas waste is avoided, and cost is reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor etching technology, and more specifically, to a plasma etching apparatus. Background Technology

[0002] Semiconductor plasma etching equipment is a key device in the semiconductor manufacturing process used to precisely remove material to form the desired patterned structure. It utilizes high-energy ions and active free radicals in plasma to react chemically and physically with the surface of semiconductor materials, thereby achieving precise material removal. Plasma is generated by the ionization of gas under the action of a high-energy electric or magnetic field, and contains positive ions, negative ions, electrons, and neutral free radicals. These high-energy particles have high chemical activity and can react with atoms or molecules on the surface of semiconductor materials to form volatile products, thereby achieving material removal.

[0003] A search revealed that Chinese patent CN115513101A discloses a plasma etching cleaning process, comprising: an etching chamber; a base; a jetting mechanism consisting of an air inlet pipe and a jetting disk, wherein the air inlet pipe has a first air inlet channel and a second air inlet channel arranged coaxially, the jetting disk has a gas equalization chamber, a spiral gas equalization pipe is arranged inside the gas equalization chamber, a plurality of first jetting pipes are evenly connected to the bottom of the spiral gas equalization pipe, and a second jetting pipe corresponding to the first jetting pipe is connected to the bottom of the jetting disk; a gas supply system; and an exhaust mechanism. The above scheme can effectively increase the gas jetting range, and at the same time, different reactive gases can be synchronously jetted at different jetting points, which effectively improves the uniformity of reactive gas dispersion, thereby ensuring the uniform distribution of excited plasma and improving the etching quality.

[0004] The aforementioned patent still has shortcomings in practical use. The size of the jet disk is fixed and the position of the nozzle cannot be adjusted. When processing small semiconductor wafers, the jet pipes that extend beyond the wafer area will continue to spray etching gas. This gas cannot act on the wafer surface, which not only wastes etching gas and increases production costs, but may also have an adverse effect on equipment performance and service life due to the accumulation of excess gas inside the equipment. It may even interfere with the accuracy of the etching process, affecting the quality of the final product and production efficiency.

[0005] Based on this, the present invention discloses a plasma etching apparatus. Summary of the Invention

[0006] To address the problem of poor device versatility mentioned in the background art, the present invention provides a plasma etching apparatus, which includes a frame, a liftable lifting frame on the frame, a rotatable gas supply main pipe mounted on the lifting frame, a horizontal pipe arranged below the gas supply main pipe and connected to the gas supply main pipe through a pipeline, a plurality of fixed pipes fixed on the horizontal pipe, a servo motor mounted on the lifting frame, and the gas supply main pipe and the output shaft of the servo motor being connected by a transmission component.

[0007] Each of the fixed tubes has a magnetic ring fixed on its inner surface, a sealing groove is provided on the inner surface of each fixed tube, a sealing ring is provided in each sealing groove, an air jet assembly is connected to each fixed tube, and a sealing assembly is provided inside each fixed tube. When the air jet assembly is connected to the fixed tube, the sealing assembly controls the fixed tube to be in a conductive state.

[0008] The horizontal tube has a loading assembly arranged below it for placing semiconductor wafers. The loading assembly includes a base, a rotating shaft, and a loading stage. The rotating shaft is rotatably mounted on the base, and the loading stage is fixed to the top of the rotating shaft.

[0009] Since the semiconductor wafers to be processed have different sizes, this technical solution uses nozzles with adjustable positions so that the gas ejected from several nozzles can completely cover the semiconductor wafer.

[0010] As a further improvement to this technical solution, the rotating shaft, the platform, and the main gas supply pipe are arranged coaxially.

[0011] The purpose is to ensure that the semiconductor wafers on the stage remain coaxial with the main gas supply pipe when rotating;

[0012] As a further improvement to this technical solution, the jet assembly includes an installation tube inserted into a fixed tube. One end of the installation tube is fixed with a magnetic ring two, and the other end is fixed with a connecting tube. A nozzle is fixed at the end of the connecting tube away from the installation tube for spraying plasma gas. A fixing plate is fixed inside the installation tube and is located near the magnetic ring two. A push rod is fixed on the fixing plate, and the end of the push rod extends to the outside of the installation tube. When the installation tube is inserted into the fixed tube, the push rod acts precisely on the sealing assembly.

[0013] The mounting tube and the fixed tube are connected by magnetic attraction. When the mounting tube and the fixed tube are assembled, they are connected. When the mounting tube is not installed on the fixed tube, the fixed tube is blocked by the sealing component. This means that only the fixed tube with the mounting tube installed can spray gas, while the other fixed tubes will not spray gas.

[0014] As a further improvement to this technical solution, the sealing assembly includes a bracket, the top of which has an air passage and the bottom has an air port, with the air passage facing the air port. A movable plug is provided on the bracket, and the plug is placed between the air passage and the air port. The plug is connected to the bracket by a spring. In the initial state, the plug blocks the air port under the action of the spring.

[0015] To allow staff to flexibly adjust the nozzle position, a sealing assembly is used to control the opening and closing of the fixed tube.

[0016] As a further improvement to this technical solution, a plurality of positioning rings are fixed on the top surface of the stage. The plurality of positioning rings are arranged concentrically. The ring diameter of the plurality of positioning rings increases from the center to the outer edge of the stage, and the thickness of the plurality of positioning rings decreases from the outer edge to the center of the stage.

[0017] To ensure coaxiality between the semiconductor wafer and the stage, multiple positioning rings of different sizes are used, with increasing ring diameter and decreasing thickness, which can accurately position semiconductor wafers of different sizes.

[0018] As a further improvement to this technical solution, each of the sealing rings is a hollow structure, and two adjacent sealing rings are connected by a connecting pipe. Air supply components are arranged at both ends of the horizontal pipe, and the two air supply components are respectively connected to the sealing rings located at both ends. A guide component is arranged above the platform.

[0019] The guide assembly includes a mounting ring arranged above the stage and coaxially aligned with the stage. The mounting ring is connected to the base via two connecting rods.

[0020] To improve the sealing performance at the connection between the installation pipe and the fixed pipe, the sealing ring is designed as a hollow structure, and air is supplied into the sealing ring using an air supply component, so that the sealing ring only presses against the installation pipe under air pressure.

[0021] As a further improvement to this technical solution, the inner ring of the mounting ring is provided with an upper convex lip and a lower convex lip. The upper convex lip and the lower convex lip have the same shape, and the surfaces of the upper convex lip and the lower convex lip are both arc surfaces. There is a gap between the upper convex lip and the lower convex lip.

[0022] The upper and lower convex lips enable the air supply assembly to supply air and ensure stability when the horizontal tube rotates.

[0023] As a further improvement to this technical solution, the sealing cylinder is fixed at the end of the crossbar, and the end of the sealing cylinder away from the crossbar is open. A sliding plug is slidably connected inside the sealing cylinder, and the sliding plug and the sealing cylinder are connected by a spring. A fixing rod is fixed on the sliding plug, and the end of the fixing rod away from the sliding plug extends to the outside of the sealing cylinder. An air supply pipe is connected to the sealing cylinder, and the end of the air supply pipe away from the sealing cylinder is connected to a sealing ring at a corresponding position.

[0024] As the sealing cylinder moves downward with the horizontal pipe, the fixing rod fits precisely between the upper and lower convex lips, and drives the sliding plug to move, thus achieving automatic air supply.

[0025] As a further improvement to this technical solution, the output shaft of the servo motor is fixed with an elastic telescopic rod, and the telescopic end of the elastic telescopic rod is fixed with a locking block. A rotatable rotating shaft two is arranged below the elastic telescopic rod. A gear one is fixedly sleeved on the rotating shaft two, and a gear two is fixedly sleeved on the rotating shaft one, and the gear two meshes with the gear one. A locking groove is opened at the top of the rotating shaft two, and the locking groove is set directly opposite the locking block. The cross-section of the locking block and the locking groove are both rectangular structures.

[0026] To improve etching efficiency, a transmission structure consisting of a rotating shaft, an elastic telescopic rod, and a locking block is designed to allow the semiconductor wafer to rotate in the opposite direction to the horizontal tube during the etching process.

[0027] As a further improvement to this technical solution, the second rotating shaft is coaxially arranged with the output shaft of the servo motor.

[0028] The purpose is to ensure the transmission stability between the two.

[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0030] 1. Staff can adjust the number of nozzles on the horizontal tube according to the size of the semiconductor wafer to ensure that the ejected plasma etching gas completely covers the wafer, avoiding gas waste and reducing costs.

[0031] 2. A sealing groove and a sealing ring are installed inside the fixed pipe to ensure the sealing between the fixed pipe and the installation pipe and prevent gas leakage. The sealing ring has a hollow structure. When the horizontal pipe descends to the working position, the sealing ring is filled with air through the cooperation of the air supply component and the guide component, which further improves the sealing effect.

[0032] 3. When the lifting frame descends, the servo motor drives the second rotating shaft to rotate through the elastic telescopic rod, the locking block and the locking slot, which in turn drives the stage to rotate. The main air supply pipe and the horizontal pipe rotate in the same direction, while the second rotating shaft rotates in the opposite direction to the first rotating shaft. This causes the horizontal pipe and the semiconductor wafer on the stage to rotate in opposite directions, shortening the overall etching time and improving etching efficiency. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ;

[0034] Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ;

[0035] Figure 3 A schematic diagram of the structure in which two fixing rods are secured to the mounting ring;

[0036] Figure 4 A schematic diagram of the horizontal tube and several jet components;

[0037] Figure 5 This is a cross-sectional structural diagram of the horizontal tube, fixed tube, and jet assembly;

[0038] Figure 6 This is a cross-sectional view of the fixed pipe and jet assembly.

[0039] Figure 7 This is a cross-sectional view of the fixed tube.

[0040] Figure 8 This is a schematic diagram of the jet assembly.

[0041] Figure 9 Exploded view of the fixed tube, magnetic ring, and sealing assembly;

[0042] Figure 10 This is a cross-sectional view of the elastic telescopic rod and the second pivot.

[0043] Figure 11 This is a schematic diagram of the mounting ring structure;

[0044] Figure 12 for Figure 10 Enlarged view of the structure at point A.

[0045] The meanings of the labels in the diagram are as follows:

[0046] 11. Frame; 12. Lifting frame; 13. Main air supply pipe; 14. Horizontal pipe; 15. Fixed pipe; 151. Magnetic ring one; 152. Sealing groove; 153. Sealing ring; 16. Servo motor; 17. Transmission component; 21. Mounting pipe; 22. Connecting pipe; 23. Nozzle; 24. Magnetic ring two; 25. Fixing plate; 26. Top rod; 31. Bracket; 32. Plug; 33. Spring one; 41. Base; 42. Rotating shaft one; 43. Platform; 51. Mounting ring; 511. Upper convex lip; 512. Lower convex lip; 52. Connecting rod; 53. Sealing cylinder; 54. Sliding plug; 55. Fixed rod; 56. Spring two; 57. Air supply pipe; 58. Connecting pipe; 61. Elastic telescopic rod; 62. Locking block; 63. Rotating shaft two; 64. Locking groove; 65. Gear one; 66. Gear two. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] Existing plasma etching machines cannot meet the production needs of wafers of different sizes. At the same time, when processing smaller semiconductor wafers, the jet pipes that extend beyond the wafer area continue to eject etching gas. This gas cannot act on the wafer surface, which not only wastes etching gas and increases production costs, but may also cause excess gas to accumulate inside the equipment.

[0049] Therefore, the present invention provides a plasma etching apparatus, see [link to apparatus]. Figure 1 As shown, it includes a frame 11, on which a liftable lifting frame 12 is provided. A rotatable gas supply main pipe 13 is installed on the lifting frame 12. A horizontal pipe 14 is arranged below the gas supply main pipe 13, and the horizontal pipe 14 is connected to the gas supply main pipe 13 through a pipeline. Several fixed pipes 15 are fixed on the horizontal pipe 14. A servo motor 16 is installed on the lifting frame 12. The gas supply main pipe 13 and the output shaft of the servo motor 16 are connected by a transmission component 17. A rotary joint is installed at the top of the gas supply main pipe 13. The gas pipe for providing etching gas is connected to the rotary joint. The design of the rotary joint allows the gas supply main pipe 13 and the gas pipe to rotate relative to each other. Since the gas supply main pipe 13 is in a rotating state during the etching process, this design can prevent the gas pipe from getting tangled on the rotating gas supply main pipe 13.

[0050] See Figure 1 , 2As shown in Figure 3, a carrier assembly is arranged below the horizontal tube 14 for placing semiconductor wafers. The carrier assembly includes a base 41, a rotating shaft 42, and a stage 43. The rotating shaft 42 is rotatably mounted on the base 41, and the stage 43 is fixed on the top of the rotating shaft 42. The rotating shaft 42, the stage 43, and the air supply main tube 13 are arranged coaxially. Several positioning rings are fixed on the top surface of the stage 43. The positioning rings are arranged concentrically. The ring diameter of the positioning rings increases from the center to the outer edge of the stage 43, and the thickness of the positioning rings decreases from the outer edge to the center of the stage 43.

[0051] The operator places the semiconductor wafer to be processed on the stage 43. Several positioning rings are fixed on the stage 43. The diameter of the positioning rings increases from the center to the outer edge of the stage 43, and the thickness decreases from the outer edge to the center of the stage 43. This allows the positioning rings to position the semiconductor wafer. The operator can place the semiconductor wafer in a positioning ring that matches its size. At this time, the outer edge of the semiconductor wafer is in contact with the positioning ring to ensure that the semiconductor wafer and the stage 43 remain coaxial. In addition, by setting multiple positioning rings, positioning of semiconductor wafers of different sizes can be provided. The size of the positioning rings matches the size of common semiconductor wafers.

[0052] See Figure 6 , 9 As shown, each fixing tube 15 has a magnetic ring 151 fixed to its inner surface, and each fixing tube 15 has a sealing groove 152 on its inner surface. Each sealing groove 152 contains a sealing ring 153. To ensure the seal between the fixing tube 15 and the mounting tube 21, the present invention provides a sealing groove 152 inside the fixing tube 15. Figure 6 and Figure 9 As shown, a sealing ring 153 is arranged in the sealing groove 152. When the installation tube 21 is inserted into the fixed tube 15, the sealing ring 153 presses tightly against the installation tube 21, thereby ensuring the sealing between the fixed tube 15 and the installation tube 21 and preventing gas leakage.

[0053] See Figure 8 As shown, each fixed tube 15 is connected to a jet assembly, which includes a mounting tube 21 inserted into the fixed tube 15. One end of the mounting tube 21 is fixed with a magnetic ring 24, and the other end is fixed with a connecting tube 22. The end of the connecting tube 22 away from the mounting tube 21 is fixed with a nozzle 23 for spraying plasma gas. After the semiconductor wafer is placed, the operator adjusts the number of nozzles 23 on the horizontal tube 14 according to the size of the semiconductor wafer so that the plasma etching gas sprayed by several nozzles 23 can completely cover the semiconductor wafer. Through this design, the device can not only process semiconductor wafers of different sizes, but also avoid gas waste.

[0054] See Figure 6 , 7 As shown, a fixing plate 25 is fixed inside the mounting tube 21, and the fixing plate 25 is located near the magnetic ring 24. A push rod 26 is fixed on the fixing plate 25, and the end of the push rod 26 extends to the outside of the mounting tube 21. Each fixing tube 15 is equipped with a sealing assembly. When the jet assembly is connected to the fixing tube 15, the sealing assembly controls the fixing tube 15 to be in a conductive state. When the mounting tube 21 is inserted into the fixing tube 15, the push rod 26 acts on the sealing assembly. The sealing assembly includes a bracket 31. An air passage is opened on the top of the bracket 31, and an air port is opened on the bottom surface. The air passage is directly opposite the air port. A movable plug 32 is provided on the bracket 31, and the plug 32 is placed between the air passage and the air port. The plug 32 is connected to the bracket 31 by a spring 33.

[0055] Initially, the plug 32 blocks the air inlet under the action of spring 33. Specifically, when installing the nozzle 23, the operator directly inserts the mounting tube 21 on the nozzle 23 into the fixing tube 15. The fixing tube 15 contains a magnetic ring 151, and the mounting tube 21 is fixed with a magnetic ring 24. When the mounting tube 21 is inserted into the fixing tube 15, the magnetic ring 151 and magnetic ring 24 come into contact and attract each other, using magnetic attraction to fix the mounting tube 21 in the fixing tube 15, enabling quick installation of the nozzle 23. Furthermore, when the mounting tube 21 is in place, the push rod 26 pushes up the plug 32, causing it to move towards the air passage. When the plug 32 is pushed up, it no longer blocks the air inlet, allowing gas in the horizontal tube 14 to enter the mounting tube 21 through the fixing tube 15. Figure 6 As shown, when the mounting tube 21 is assembled, the mounting tube 21 and the fixed tube 15 are in a connected state so that the gas can be ejected through the nozzle 23. For the fixed tube 15 which is not connected to the mounting tube 21, the plug 32 will press the bracket 31 under the elastic force of the spring 33. At this time, the plug 32 will block the air port, and the gas in the horizontal tube 14 cannot be ejected from the fixed tube 15. In summary, the operator only needs to install the nozzle 23 by plugging and unplugging.

[0056] Based on the above process, the staff can adjust the number and position of the nozzles 23 according to the size of the semiconductor wafer. This ensures that the device can process semiconductor wafers of different sizes and also avoids gas waste.

[0057] After adjusting the position of the nozzle 23, the operator controls the lifting frame 12 to move downward. When the lifting frame 12 moves downward, it drives the horizontal tube 14 to move downward, so that the horizontal tube 14 is close to the semiconductor wafer for etching. During the etching process, the etching gas enters the gas supply main pipe 13, then enters the horizontal tube 14, and finally is ejected through several nozzles 23. During this process, the operator starts the servo motor 16. When the servo motor 16 is running, it can drive the gas supply main pipe 13 to rotate through the transmission component 17, which makes the horizontal tube 14 rotate slowly, thereby etching the semiconductor wafer.

[0058] See Figure 3 , 11 As shown, each sealing ring 153 is a hollow structure. Adjacent sealing rings 153 are connected by a connecting pipe 58. Air supply components are arranged at both ends of the horizontal pipe 14, and each air supply component is connected to a sealing ring 153 located at one end. A guide assembly is arranged above the platform 43. The guide assembly includes a mounting ring 51, which is arranged above the platform 43 and coaxially with the platform 43. The mounting ring 51 is connected to the base 41 via two connecting rods 52. The inner ring of the mounting ring 51 has an upper convex lip 511 and a lower convex lip 512. The upper convex lip 511 and the lower convex lip 512 have the same shape, and their surfaces are both arc-shaped. There is a gap between the upper convex lip 511 and the lower convex lip 512. In the initial state, as... Figure 1 As shown, the horizontal tube 14 is located above the mounting ring 51;

[0059] See Figure 4 , 5 As shown, the air supply assembly includes a sealing cylinder 53, which is fixed at the end of the crossbar. The end of the sealing cylinder 53 away from the crossbar is open. A sliding plug 54 is slidably connected inside the sealing cylinder 53, and the sliding plug 54 is connected to the sealing cylinder 53 by a spring 56. A fixing rod 55 is fixed on the sliding plug 54, and the end of the fixing rod 55 away from the sliding plug 54 extends to the outside of the sealing cylinder 53. An air supply pipe 57 is connected to the sealing cylinder 53, and the end of the air supply pipe 57 away from the sealing cylinder 53 is connected to the sealing ring 153 at the corresponding position.

[0060] To further improve the sealing performance between the fixed pipe 15 and the mounting pipe 21, the present invention designs the sealing ring 153 as a hollow structure and simultaneously sets up an air supply component and a guide component. The purpose is that when the lifting frame 12 drives the horizontal pipe 14 to descend, the air supply component and the guide component cooperate to inflate the interior of several sealing rings 153. Under the action of air pressure, the sealing effect of the sealing rings 153 between the fixed pipe 15 and the mounting pipe 21 is further improved. Specifically, before the etching process, the horizontal pipe 14 descends. During this process, the fixing rod 55 in the air supply component first contacts the upper convex lip 511 and moves along the upper convex lip 511 with an arc surface. When the horizontal pipe 14 descends to the working position, the fixing rod 55 is exactly located between the upper convex lip 511 and the lower convex lip 512. Under the action of the upper convex lip 511 and the lower convex lip 512, the fixing rod 55 will drive the sliding plug 54 to move. When the sliding plug 54 moves, it can seal the... The gas inside the cylinder 53 is forced into the corresponding sealing ring 153 through the gas supply pipe 57. Adjacent sealing rings 153 are connected by a connecting pipe 58, which allows the gas to fill several sealing rings 153 in sequence. In summary, when the horizontal tube 14 descends to the working position, the two gas supply components simultaneously supply gas, filling several sealing rings 153 with gas. The gas pressure allows the sealing rings 153 to press tightly against the mounting tube 21, thereby improving the sealing between the fixed tube 15 and the mounting tube 21. In addition, during the rotation of the horizontal tube 14, the two fixed rods 55 slide between the upper convex lip 511 and the lower convex lip 512. At this time, the upper convex lip 511 and the lower convex lip 512 provide a limit to the two fixed rods 55, so that the two fixed rods 55 can only move on a horizontal plane and cannot deviate in the vertical direction, thereby improving the rotational stability of the horizontal tube 14 and thus improving the etching effect of the device on the semiconductor wafer.

[0061] See Figure 3 , 10 As shown in Figure 12, the output shaft of the servo motor 16 is fixed with an elastic telescopic rod 61. The telescopic end of the elastic telescopic rod 61 is fixed with a locking block 62. A rotatable shaft 63 is arranged below the elastic telescopic rod 61. A gear 65 is fixedly sleeved on the shaft 63. A gear 66 is fixedly sleeved on the shaft 42. The gear 66 meshes with the gear 65. A slot 64 is opened at the top of the shaft 63. The slot 64 is set directly opposite the locking block 62. The cross-section of the locking block 62 and the slot 64 are both rectangular. The shaft 63 and the output shaft of the servo motor 16 are coaxially arranged.

[0062] To improve the working efficiency of the device, this invention designs a structure for driving the platform 43 to rotate. Specifically, when the lifting frame 12 moves downward, the servo motor 16 mounted on the lifting frame 12 moves accordingly, driving the elastic telescopic rod 61 to move downward, as shown below. Figure 2 , 3As shown in Figure 10, a locking block 62 is fixed to the telescopic end of the elastic telescopic rod 61, which causes the locking block 62 to move toward the rotating shaft 63. Both the locking block 62 and the slot 64 have rectangular cross-sections. During this process, the locking block 62 and the slot 64 have two positional states: First, the locking block 62 is completely aligned with the slot 64, so that the locking block 62 is inserted into the slot when it moves down; second, there is a misalignment between the locking block 62 and the slot 64. In this case, the locking block 62 will press against the top of the rotating shaft 63 when it moves down, and cause the telescopic end of the elastic telescopic rod 61 to retract. In the first case, while the servo motor 16 drives the horizontal tube 14 to rotate, it can also directly drive the rotating shaft 63 to rotate via the elastic telescopic rod 61, the locking block 62, and the locking slot 64. In the second case, when the servo motor 16 drives the horizontal tube 14 to rotate, it can also drive the elastic telescopic rod 61 and the locking block 62 to rotate. During the rotation of the locking block 62, when the locking block 62 rotates to the position directly opposite the locking slot 64, the locking block 62 can be locked into the locking slot 64 under the elastic force of the elastic telescopic rod 61. Therefore, in this case, the servo motor 16 can still drive the rotating shaft 63 to rotate. In summary, without Regardless of the relative positions of the card block 62 and the card slot 64, the servo motor 16 can drive the rotating shaft 63 to rotate during the rotation of the horizontal tube 14. The rotating shaft 63 and the rotating shaft 42 are connected by meshing gears 65 and 66. Therefore, when the rotating shaft 63 rotates, the rotating shaft 42 rotates accordingly, driving the platform 43 to rotate. It is worth mentioning that the servo motor 16 and the air supply main pipe 13 are connected by a transmission component 17, which makes the rotation direction of the air supply main pipe 13 the same as the rotation direction of the servo motor 16. The rotation direction is the same as the rotation direction of the servo motor 16. However, the two shafts 63 and 42 are driven by two gears, which makes the rotation direction between the shafts 42 and 63 opposite. In other words, the rotation direction of the shafts 42 and the horizontal tube 14 is also opposite. In this case, the horizontal tube 14 and the semiconductor wafer on the stage 43 can rotate in opposite directions. Compared with the case where the horizontal tube 14 rotates and the stage 43 is stationary, the overall etching time of the semiconductor wafer can be shortened, thereby improving the etching efficiency of the semiconductor wafer.

[0063] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0064] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A plasma etching apparatus, characterized in that: It includes a frame (11), on which a liftable lifting frame (12) is provided, on which a rotatable air supply main pipe (13) is installed, and a horizontal pipe (14) is arranged below the air supply main pipe (13), and the horizontal pipe (14) is connected to the air supply main pipe (13) through a pipeline. Several fixed pipes (15) are fixed on the horizontal pipe (14), and a servo motor (16) is installed on the lifting frame (12). The air supply main pipe (13) and the output shaft of the servo motor (16) are connected by a transmission component (17). Each of the fixed tubes (15) has a magnetic ring (151) fixed on its inner surface, a sealing groove (152) is opened on the inner surface of each fixed tube (15), a sealing ring (153) is provided in each sealing groove (152), an air jet assembly is connected to each fixed tube (15), and a sealing assembly is provided inside each fixed tube (15). When the air jet assembly is connected to the fixed tube (15), the sealing assembly controls the fixed tube (15) to be in a conductive state. The horizontal tube (14) is provided with a carrier assembly for placing semiconductor wafers. The carrier assembly includes a base (41), a rotating shaft (42) and a stage (43). The rotating shaft (42) is rotatably mounted on the base (41), and the stage (43) is fixed to the top of the rotating shaft (42). The jet assembly includes an installation tube (21) which is inserted into a fixed tube (15). One end of the installation tube (21) is fixed with a magnetic ring (24), and the other end is fixed with a connecting tube (22). The end of the connecting tube (22) away from the installation tube (21) is fixed with a nozzle (23) for spraying plasma gas. A fixed plate (25) is fixed inside the installation tube (21), and the fixed plate (25) is located near the magnetic ring (24). A push rod (26) is fixed on the fixed plate (25), and the end of the push rod (26) extends to the outside of the installation tube (21). When the installation tube (21) is inserted into the fixed tube (15), the push rod (26) acts on the sealing assembly. The sealing assembly includes a bracket (31), the top of the bracket (31) is provided with an air passage, the bottom is provided with an air port, and the air passage is positioned directly opposite the air port. A movable plug (32) is provided on the bracket (31), and the plug (32) is placed between the air passage and the air port. The plug (32) is connected to the bracket (31) by a spring (33). In the initial state, the plug (32) blocks the air port under the action of the spring (33).

2. The plasma etching apparatus according to claim 1, characterized in that: The rotating shaft (42), the platform (43), and the gas supply main pipe (13) are arranged coaxially.

3. The plasma etching apparatus according to claim 2, characterized in that: The top surface of the stage (43) is fixed with a plurality of positioning rings. The plurality of positioning rings are arranged concentrically. The ring diameter of the plurality of positioning rings increases from the center to the outer edge of the stage (43), and the thickness of the plurality of positioning rings decreases from the outer edge to the center of the stage (43).

4. The plasma etching apparatus according to any one of claims 1-3, characterized in that: Each of the sealing rings (153) is a hollow structure. Two adjacent sealing rings (153) are connected by a connecting pipe (58). Both ends of the horizontal pipe (14) are provided with air supply components. The two air supply components are respectively connected to the sealing rings (153) located at both ends. A guide component is arranged above the platform (43). The guide assembly includes a mounting ring (51) arranged above the stage (43) and coaxially arranged with the stage (43). The mounting ring (51) is connected to the base (41) via two connecting rods (52).

5. The plasma etching apparatus according to claim 4, characterized in that: The inner ring of the mounting ring (51) is provided with an upper convex lip (511) and a lower convex lip (512). The upper convex lip (511) and the lower convex lip (512) have the same shape, and the surfaces of the upper convex lip (511) and the lower convex lip (512) are both arc surfaces. There is a gap between the upper convex lip (511) and the lower convex lip (512).

6. The plasma etching apparatus according to claim 5, characterized in that: The gas supply assembly includes a sealing cylinder (53), which is fixed at the end of the crossbar. The end of the sealing cylinder (53) away from the crossbar is open. A sliding plug (54) is slidably connected inside the sealing cylinder (53), and the sliding plug (54) and the sealing cylinder (53) are connected by a spring (56). A fixing rod (55) is fixed on the sliding plug (54), and the end of the fixing rod (55) away from the sliding plug (54) extends to the outside of the sealing cylinder (53). A gas supply pipe (57) is connected to the sealing cylinder (53), and the end of the gas supply pipe (57) away from the sealing cylinder (53) is connected to a sealing ring (153) at the corresponding position.

7. The plasma etching apparatus according to claim 1, characterized in that: The output shaft of the servo motor (16) is fixed with an elastic telescopic rod (61). The telescopic end of the elastic telescopic rod (61) is fixed with a locking block (62). A rotatable rotating shaft (63) is arranged below the elastic telescopic rod (61). A gear (65) is fixedly sleeved on the rotating shaft (63). A gear (66) is fixedly sleeved on the rotating shaft (42). The gear (66) meshes with the gear (65). A slot (64) is opened at the top of the rotating shaft (63). The slot (64) is set opposite to the locking block (62). The cross-section of the locking block (62) and the slot (64) are both rectangular structures.

8. The plasma etching apparatus according to claim 7, characterized in that: The rotating shaft 2 (63) is coaxially arranged with the output shaft of the servo motor (16).

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