Semiconductor wafer processing and cleaning device

Abstract

The invention provides a semiconductor wafer processing and cleaning device, and relates to the technical field of wafer processing, the semiconductor wafer processing and cleaning device comprises a plurality of rotatably arranged placing seats, hollow positioning rings used for placing wafers are symmetrically arranged in the placing seats, nozzles located at the two ends of the wafers are symmetrically embedded in the inner walls of the hollow positioning rings, and the nozzles face the wafers; and the cleaning devices are configured to clean the surfaces of the wafers in a blowing mode, communicating pipes are arranged between the adjacent placing seats, communicating holes used for communicating the communicating pipes with the hollow positioning rings are formed in the placing seats, and annular hollow spraying plates used for spraying the wafers are arranged above the placing seats. According to the design, the rotating wafer is sprayed through the annular hollow spraying plate, air is supplied to the communicating holes through the air supply assembly, air flow is sprayed out of the multiple nozzles through the hollow positioning ring, air is sprayed to the surfaces of the two ends of the wafer, meanwhile, impurities are prevented from flowing back to the surfaces of the wafer, the thoroughness of cleaning is improved, and the cleaning effect is enhanced. The cleaning device is reasonable in structure, thorough in cleaning and good in cleaning effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer processing, in particular to a semiconductor wafer processing and cleaning device. BACKGROUND

[0002] Wafer refers to a wafer used for making silicon semiconductor integrated circuits, which is called wafer because of its circular shape; various circuit element structures can be processed and made on the silicon wafer to become IC products with specific electrical properties; wafer is the basic material for manufacturing semiconductor chips, and the most important raw material for semiconductor integrated circuits is silicon, so it is a silicon wafer. Semiconductor wafer processing and cleaning is an important link in the wafer manufacturing process, and its main purpose is to remove impurities and contaminants on the wafer surface to ensure the purity and quality of the wafer.

[0003] In the prior art, when the cleaning device is used, the wafer is generally fixed in the inside of the placing rack, and the placing rack is rotated in the inside of the cleaning liquid to complete the cleaning of the wafer. In this cleaning method, after cleaning, due to the residual impurities in the cleaning liquid, there is still a risk of adhering impurities on the surface of the wafer, the cleaning is not complete, and the cleaning effect is not good. There is an urgent need for a semiconductor wafer processing and cleaning device to solve the above problems. SUMMARY

[0004] In view of the deficiencies in the prior art, the present application aims to provide a semiconductor wafer processing and cleaning device to solve the problems raised in the background art, which has a reasonable structure, complete cleaning and good cleaning effect.

[0005] In order to achieve the above-mentioned purpose, the present application is realized by the following technical scheme: a semiconductor wafer processing and cleaning device, comprising: A plurality of placing seats are rotationally arranged, the inside of the placing seat is symmetrically provided with a hollow positioning ring for placing a wafer, the inner wall of the hollow positioning ring is symmetrically embedded with a nozzle located at both ends of the wafer, the nozzle faces the wafer and is configured to clean the surface of the wafer by blowing, a communication pipe is arranged between adjacent placing seats, a communication hole for connecting the communication pipe and the hollow positioning ring is formed in the inside of the placing seat, and an annular hollow spray plate for spraying the wafer is arranged above the placing seat.

[0006] Further, a wind supply assembly for driving the nozzles to blow air at both ends of the wafer is arranged below the placing seat; The wind supply assembly comprises a pipe joint arranged at the bottom of the lowermost placing seat, a metal hose is arranged at the bottom of the pipe joint, a gas supply pipe is arranged at the end of the metal hose, a gas pump and a second one-way valve are arranged in sequence on the side wall of the gas supply pipe, the pipe joint is connected to the bottom of the lowermost placing seat through a communication pipe, and a sealing bearing is arranged at the connection between the pipe joint and the communication pipe.

[0007] Further, the placing seat and the annular hollow spray plate are located inside the shell, the metal hose is connected with the gas supply pipe through the pipe joint arranged on the lower side of the inner wall of the shell, and the metal hose and the sealing bearing are located inside the shell. The side wall of the pipe joint connected with the sealing bearing is symmetrically provided with a limiting plate, and the inner wall of the shell is vertically provided with a limiting groove matched with the limiting plate.

[0008] Further, the top of the shell is provided with an adjusting electric push rod, a driving motor located inside the shell is arranged on the telescopic shaft of the adjusting electric push rod, the output shaft of the driving motor is connected with the placing seat, and the outer diameter of the driving motor is smaller than the inner diameter of the annular hollow spray plate.

[0009] Further, the bottom of the shell is provided with a three-way valve, the pipe joint arranged on the lower side of the inner wall of the shell is connected with the three-way valve, the gas supply pipe is connected with the three-way valve, and the side wall of the shell is provided with a liquid supply assembly for providing cleaning liquid for the three-way valve and the annular hollow spray plate respectively.

[0010] Further, the liquid supply assembly comprises a liquid supply pipe arranged on the side wall of the shell and connected with the annular hollow spray plate, the side wall of the liquid supply pipe is provided with a first valve, the side wall of the liquid supply pipe is provided with a water pump, the side wall of the liquid supply pipe is provided with a flow guide pipe located between the first valve and the water pump and connected with the three-way valve, the side wall of the flow guide pipe is provided with a second valve, and the side wall of the flow guide pipe is provided with a first one-way valve.

[0011] Further, a through hole matched with the hollow positioning ring is arranged in the placing seat, a plurality of support columns for supporting the wafer and located between the nozzles are arranged on the inner wall of the hollow positioning ring, and a pressing assembly for pressing the wafer is arranged on the top of the placing seat.

[0012] Further, the pressing assembly comprises an arc-shaped pressing plate arranged inside the hollow positioning ring and matched with the side wall of the wafer, the arc-shaped pressing plate is connected with the through hole, a threaded rod penetrating through the hollow positioning ring and connected with the arc-shaped pressing plate is arranged on the top of the placing seat, and a connecting bearing is arranged at the connecting position of the threaded rod and the arc-shaped pressing plate.

[0013] Further, a sealing groove is arranged on the side wall of the shell, a sealing door is arranged in the sealing groove, a through groove connected with the sealing groove is arranged on the inner wall of the shell, and the vertical sectional area of the sealing groove is greater than that of the through groove.

[0014] Further, the annular hollow spray plate is internally provided with an annular hollow groove, and the bottom of the annular hollow spray plate is provided with a plurality of water spray holes in communication with the annular hollow groove.

[0015] The beneficial effects achieved by the application with the above structure are as follows: The application sprays and cleans the rotating wafer through the annular hollow spray plate, supplies air to the communication holes through the air supply assembly, and sprays the air from the plurality of nozzles through the hollow positioning ring, so as to accelerate the speed of impurities separating from the wafer, avoid the backflow of impurities to the wafer surface, improve the thoroughness of cleaning, and enhance the cleaning effect. BRIEF DESCRIPTION OF DRAWINGS

[0016] Other features, objects and advantages of the application will become more apparent from the following detailed description of non-limiting embodiments with reference to the attached drawings: Figure 1 It is a perspective view of a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 2 It is a front view of a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 3 It is a sectional perspective view of a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 4 It is a sectional perspective view of a semiconductor wafer processing and cleaning device according to an embodiment of the application from another angle; Figure 5 It is a perspective view of the connection between the air supply assembly and the annular hollow spray plate in a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 6 It is a perspective view of the connection between the air supply assembly and the placement seat in a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 7 It is a perspective view of the connection between the placement seat and the hollow positioning ring in a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 8 It is a right view of the connection between the placement seat and the hollow positioning ring in a semiconductor wafer processing and cleaning device according to an embodiment of the application; Figure 9 It is a sectional perspective view of the connection between the placement seat and the hollow positioning ring in a semiconductor wafer processing and cleaning device according to an embodiment of the application; In the figure: 1, shell; 2, sealing door; 3, adjusting electric push rod; 4, liquid supply assembly; 41, liquid supply pipe; 42, first valve; 43, water pump; 44, flow guide pipe; 45, second valve; 46, first one-way valve; 5, three-way valve; 6, air supply assembly; 61, air supply pipe; 62, air pump; 63, second one-way valve; 64, pipe joint; 65, metal hose; 66, sealing bearing; 67, limiting plate; 68, limiting groove; 7, through hole; 8, placing seat; 9, hollow positioning ring; 91, wafer; 92, nozzle; 93, support column; 10, pressing assembly; 101, threaded rod; 102, connecting bearing; 103, arc-shaped pressing plate; 11, communication pipe; 12, communication hole; 13, driving motor; 14, annular hollow spray plate; 141, water spray hole. DETAILED DESCRIPTION

[0017] In order to make the technical means, creative features, purposes and effects of the present application easy to understand, the present application is further described below in conjunction with specific embodiments.

[0018] As shown in Figure 1 , the present application provides a semiconductor wafer processing and cleaning device, which comprises: A plurality of placing seats 8 are rotationally arranged, and a hollow positioning ring 9 for placing a wafer 91 is symmetrically arranged in the placing seat 8. Nozzles 92 are symmetrically embedded in the inner wall of the hollow positioning ring 9 and located at both ends of the wafer 91. The nozzles 92 face the wafer 91 and are configured to clean the surface of the wafer 91 by blowing. A communication pipe 11 is arranged between adjacent placing seats 8. A communication hole 12 is formed in the placing seat 8 for communication between the communication pipe 11 and the hollow positioning ring 9. An annular hollow spray plate 14 is arranged above the placing seat 8 for spraying the wafer 91. This design sprays and cleans the rotating wafer 91 by the annular hollow spray plate 14. The communication hole 12 is supplied with air by the air supply assembly 6. The air flows through the hollow positioning ring 9 and is sprayed from the nozzles 92 to accelerate the speed of impurities separating from the wafer 91, avoid the backflow of impurities to the surface of the wafer 91, improve the thoroughness of cleaning, and enhance the cleaning effect.

[0019] Referring to Figure 2 , Figure 3 , Figure 5 and Figure 6 , the air supply assembly 6 is arranged below the placing seat 8 for driving the nozzles 92 to blow air at both ends of the wafer 91. The air supply assembly 6 comprises a pipe joint 64 arranged at the bottom of the lowermost placement seat 8, the bottom of the pipe joint 64 is provided with a metal hose 65, the end of the metal hose 65 is provided with a gas supply pipe 61, the sidewall of the gas supply pipe 61 is sequentially provided with a gas pump 62 and a second one-way valve 63, the pipe joint 64 is connected with the bottom of the lowermost placement seat 8 through the communication pipe 11, and the connection position of the pipe joint 64 and the communication pipe 11 is provided with a sealing bearing 66. Through the working of the gas pump 62 in the air supply assembly 6, the gas supply pipe 61 is supplied with gas, the gas flows into the communication hole 12 through the metal hose 65, and finally is sprayed out from the multiple nozzles 92 on the hollow positioning ring 9, so that the two end surfaces of the wafer 91 are sprayed with gas, the speed of impurities separating from the wafer 91 is accelerated, meanwhile, the impurities are prevented from flowing back to the surface of the wafer 91, the completeness of cleaning is improved, and the cleaning effect is enhanced.

[0020] With reference to Figure 2 , Figure 3 and Figure 5 , the housing 1 is further provided with the placement seat 8 and the annular hollow spray plate 14, the metal hose 65 is communicated with the gas supply pipe 61 through the pipe joint 64 arranged at the lower side of the inner wall of the housing 1, and the metal hose 65 and the sealing bearing 66 are located in the housing 1; The sidewall of the pipe joint 64 connected with the sealing bearing 66 is symmetrically provided with a limiting plate 67, and the inner wall of the housing 1 is vertically provided with a limiting groove 68 matched with the limiting plate 67. Through the connection of the limiting plate 67 and the limiting groove 68, the pipe joint 64 connected with the sealing bearing 66 is limited, and under the action of the sealing bearing 66, the pipe joint 64 is prevented from rotating with the placement seat 8; the lower side of the inner wall of the housing 1 is provided with an inclined plate, the sidewall of the housing 1 is provided with a liquid outlet pipe communicated with the low end of the inclined plate, and the sidewall of the liquid outlet pipe is provided with a liquid outlet valve, so that the liquid can be conveniently discharged from the housing 1 through the liquid outlet pipe and the liquid outlet valve.

[0021] With reference to Figure 2 , Figure 4 and Figure 5 , the top of the housing 1 is provided with the adjusting electric push rod 3, the driving motor 13 located in the housing 1 is arranged on the telescopic shaft of the adjusting electric push rod 3, the output shaft of the driving motor 13 is connected with the placement seat 8, and the outer diameter of the driving motor 13 is smaller than the inner diameter of the annular hollow spray plate 14. Through the working of the adjusting electric push rod 3, the driving motor 13 is driven to move in the vertical direction, the wafer 91 in the placement seat 8 is driven to move in the vertical direction, and is immersed in the cleaning liquid in the housing 1.

[0022] With reference to Figure 2 , Figure 5 and Figure 6The bottom of the shell 1 is provided with a three-way valve 5, a pipe joint 64 arranged on the lower side of the inner wall of the shell 1 is in communication with the three-way valve 5, a gas supply pipe 61 is in communication with the three-way valve 5, and the side wall of the shell 1 is provided with a liquid supply assembly 4 for supplying cleaning liquid to the three-way valve 5 and the annular hollow spray plate 14 respectively. The design can supply cleaning liquid to the three-way valve 5 and the annular hollow spray plate 14 through the liquid supply assembly 4. When the air pump 62 is not used, the cleaning liquid can enter the inside of the hollow positioning ring 9 through the metal hose 65, the cleaning liquid is sprayed out from the nozzle 92, the impurities on the surfaces of the two ends of the wafer 91 are cleaned again, the thoroughness of cleaning is improved, the impurities are prevented from being left on the surfaces of the two ends of the wafer 91, the thoroughness of cleaning is improved, and the cleaning effect is enhanced.

[0023] With reference to Figure 5 The liquid supply assembly 4 comprises a liquid supply pipe 41 arranged on the side wall of the shell 1 and in communication with the annular hollow spray plate 14, a first valve 42 arranged on the side wall of the liquid supply pipe 41, a water pump 43 arranged on the side wall of the liquid supply pipe 41, a flow guide pipe 44 arranged on the side wall of the liquid supply pipe 41 and in communication with the three-way valve 5, a second valve 45 arranged on the side wall of the flow guide pipe 44, and a first one-way valve 46 arranged on the side wall of the flow guide pipe 44. The water pump 43 in the liquid supply assembly 4 is connected with a cleaning liquid source through a pipeline, so that the cleaning liquid can be conveniently sent into the inside of the liquid supply pipe 41, and the liquid can enter the inside of the annular hollow spray plate 14 and the nozzle 92 respectively. When it is necessary to supply liquid to the annular hollow spray plate 14, the second valve 45 is closed and the first valve 42 is opened. When it is necessary to supply liquid to the nozzle 92, the first valve 42 is closed and the second valve 45 is opened. Under the action of the first one-way valve 46 and the second one-way valve 63, the liquid is prevented from entering the gas supply pipe 61 or the gas is prevented from entering the inside of the liquid supply pipe 41.

[0024] With reference to Figure 7 , Figure 8 and Figure 9 The inside of the placing seat 8 is provided with a through hole 7 matched with the hollow positioning ring 9, the inner wall of the hollow positioning ring 9 is provided with a plurality of support columns 93 arranged between the nozzles 92 and used for supporting the wafer 91, and the top of the placing seat 8 is provided with a pressing assembly 10 used for pressing the wafer 91. The design can conveniently position and place the wafer 91 through the support columns 93 and conveniently press the positioned wafer 91 through the pressing assembly 10, so that the stability of the placing seat 8 in driving the wafer 91 to rotate is improved.

[0025] With reference to Figure 8 and Figure 9The compression assembly 10 comprises an arc-shaped pressing plate 103 arranged inside the hollow positioning ring 9 and matched with the side wall of the wafer 91, the arc-shaped pressing plate 103 is communicated with the through hole 7, the top of the placing seat 8 is provided with a threaded rod 101 penetrating through the hollow positioning ring 9 and connected with the arc-shaped pressing plate 103, and the connecting position of the threaded rod 101 and the arc-shaped pressing plate 103 is provided with a connecting bearing 102. Through the rotation of the threaded rod 101 in the compression assembly 10, the threaded rod 101 is connected with the placing seat 8 and the hollow positioning ring 9 through threads, and the threaded rod 101 drives the arc-shaped pressing plate 103 to move in the vertical direction to compress and fix the wafer 91; the inner wall of the hollow positioning ring 9 is provided with an arc-shaped groove communicated with the through hole 7, and the arc-shaped pressing plate 103 is located inside the arc-shaped groove. The arc-shaped groove limits the movement of the arc-shaped pressing plate 103 in the vertical direction, thereby improving the stability of the movement of the arc-shaped pressing plate 103 in the vertical direction.

[0026] With reference to Figure 1 The side wall of the shell 1 is provided with a sealing groove, the sealing door 2 is arranged inside the sealing groove, the inner wall of the shell 1 is provided with a through groove communicated with the sealing groove, and the vertical sectional area of the sealing groove is greater than that of the through groove. Through the connection of the sealing door 2 and the sealing groove, the sealing property of the connecting position is improved, and the wafer 91 is conveniently placed inside the hollow positioning ring 9 of the placing seat 8 through the through groove. The sealing door 2 is rotatably connected with the shell 1 through a hinge.

[0027] With reference to Figure 3 and Figure 5 The annular hollow spraying plate 14 is provided with an annular hollow groove inside, and the bottom of the annular hollow spraying plate 14 is provided with a plurality of water spraying holes 141 communicated with the annular hollow groove. Through the water spraying holes 141, the uniformity of the liquid spraying of the annular hollow spraying plate 14 is improved.

[0028] With reference to Figures 1-9 As an embodiment of the present application: when the wafer 91 needs to be cleaned, the staff places the wafer 91 inside the hollow positioning ring 9 by opening the sealing door 2, and then rotates the threaded rod 101 in the compression assembly 10, so that the threaded rod 101 drives the arc-shaped pressing plate 103 to move in the vertical direction to compress and fix the wafer 91, thereby completing the fixed placement of the wafer 91.

[0029] The water pump 43 works to send the cleaning liquid to the annular hollow spraying plate 14 and the nozzle 92, and the liquid flows out from the nozzle 92 and the water spraying hole 141 to spray and clean the two end faces of the wafer 91 for the first time, and the cleaning liquid is injected into the shell 1 at the same time. The driving motor 13 works to drive the hollow positioning ring 9 on the placing seat 8 to rotate, and the hollow positioning ring 9 drives the wafer 91 to rotate, thereby improving the uniformity of the first cleaning.

[0030] When the cleaning liquid inside the shell 1 reaches the appropriate height, the water pump 43 stops working, the driving motor 13 is driven to move in the vertical direction by adjusting the electric push rod 3, the driving motor 13 drives the placing seat 8 to move in the vertical direction, the wafer 91 inside the hollow positioning ring 9 is driven to move in the vertical direction, and the wafer 91 is completely placed in the cleaning liquid; the wafer 91 rotates in the cleaning liquid, accelerates the speed of impurities separated from the surface of the wafer 91, and improves the cleaning efficiency; when the placing seat 8 moves in the vertical direction, the connecting pipe 11 drives the pipe joint 64 to move, the metal hose 65 moves in the vertical direction, and under the action of the limiting plate 67 and the limiting groove 68 and the sealing bearing 66, the pipe joint 64 on the metal hose 65 can only move in the vertical direction and cannot rotate.

[0031] When the wafer 91 rotates, the air pump 62 in the air supply assembly 6 works to supply air to the air supply pipe 61, the gas flows through the metal hose 65 into the connecting hole 12, and finally is sprayed from the multiple nozzles 92 on the hollow positioning ring 9 to spray air on the surfaces of both ends of the wafer 91, air bubbles are generated at both ends of the wafer 91, and contact between impurities and the surface of the wafer 91 is avoided.

[0032] When the cleaning is completed, the wafer 91 is driven upward by the electric push rod 3 to separate from the cleaning liquid, the nozzles 92 always blow air to avoid impurities flowing back to the surface of the wafer 91, improve the thoroughness of cleaning, and enhance the cleaning effect; when the wafer 91 completely separates from the cleaning liquid, the blowing is stopped, liquid is supplied to the nozzles 92 to further avoid impurities remaining on the surface of the wafer 91, and the thoroughness of cleaning is improved.

[0033] The above shows and describes the basic principles and main features of the present application and the advantages of the present application, and it is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and the present application can be realized in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. A semiconductor wafer processing and cleaning device, characterized in that: include: A plurality of rotatably arranged placement seats (8); A hollow positioning ring (9) for placing a wafer (91) is symmetrically arranged inside the placement seat (8); The inner wall of the hollow positioning ring (9) is symmetrically embedded with nozzles (92) located at both ends of the wafer (91); The nozzle (92) faces the wafer (91) and is configured to clean the surface of the wafer (91) by blowing air; A connecting pipe (11) is provided between adjacent placement seats (8); A communication hole (12) for connecting the communication pipe (11) and the hollow positioning ring (9) is provided inside the placement seat (8); An annular hollow spray plate (14) for spraying the wafer (91) is provided above the placement seat (8).

2. The semiconductor wafer processing and cleaning device according to claim 1, characterized in that: An air supply component (6) is provided below the placement seat (8) for driving the nozzle (92) to blow air towards both ends of the wafer (91); The air supply assembly (6) includes a pipe joint (64) arranged at the bottom of the lowest placement seat (8), a metal hose (65) is provided at the bottom of the pipe joint (64), an air supply pipe (61) is provided at the end of the metal hose (65), an air pump (62) and a second one-way valve (63) are provided on the side wall of the air supply pipe (61) in sequence, the pipe joint (64) is connected to the bottom of the lowest placement seat (8) through a connecting pipe (11), and a sealing bearing (66) is provided at the connection between the pipe joint (64) and the connecting pipe (11).

3. The semiconductor wafer processing and cleaning device according to claim 2, characterized in that: It also includes a shell (1), the placement seat (8) and the annular hollow spray plate (14) are both located inside the shell (1), the metal hose (65) is connected to the air supply pipe (61) through a pipe joint (64) provided on the lower side of the inner wall of the shell (1), and the metal hose (65) and the sealing bearing (66) are located inside the shell (1); A limiting plate (67) is symmetrically provided on the side wall of the pipe joint (64) connected to the sealing bearing (66), and a limiting groove (68) matching the limiting plate (67) is vertically opened on the inner wall of the housing (1).

4. The semiconductor wafer processing and cleaning device according to claim 3, characterized in that: An adjusting electric push rod (3) is provided on the top of the housing (1), and a driving motor (13) located inside the housing (1) is provided on the telescopic shaft of the adjusting electric push rod (3). The output shaft of the driving motor (13) is connected to the placement seat (8), and the outer diameter of the driving motor (13) is smaller than the inner diameter of the annular hollow spray plate (14).

5. The semiconductor wafer processing and cleaning device according to claim 3, characterized in that: A three-way valve (5) is provided at the bottom of the shell (1), a pipe joint (64) provided on the lower side of the inner wall of the shell (1) is connected to the three-way valve (5), the air supply pipe (61) is connected to the three-way valve (5), and a liquid supply component (4) for supplying cleaning liquid to the three-way valve (5) and the annular hollow spray plate (14) is provided on the side wall of the shell (1).

6. The semiconductor wafer processing and cleaning device according to claim 5, characterized in that: The liquid supply assembly (4) comprises a liquid supply pipe (41) arranged on the side wall of the shell (1) and connected to the annular hollow spray plate (14); a first valve (42) is arranged on the side wall of the liquid supply pipe (41); a water pump (43) is arranged on the side wall of the liquid supply pipe (41); a guide pipe (44) is arranged on the side wall of the liquid supply pipe (41) and is located between the first valve (42) and the water pump (43) and connected to the three-way valve (5); a second valve (45) is arranged on the side wall of the guide pipe (44); and a first one-way valve (46) is arranged on the side wall of the guide pipe (44).

7. The semiconductor wafer processing and cleaning device according to claim 1, wherein: A through hole (7) matching the hollow positioning ring (9) is provided inside the placement seat (8); a plurality of support columns (93) located between the nozzles (92) and used to support the wafer (91) are provided on the inner wall of the hollow positioning ring (9); a pressing assembly (10) for pressing the wafer (91) is provided on the top of the placement seat (8).

8. The semiconductor wafer processing and cleaning device according to claim 7, characterized in that: The clamping assembly (10) includes an arc-shaped pressure plate (103) arranged inside the hollow positioning ring (9) and matching the side wall of the wafer (91), the arc-shaped pressure plate (103) is connected to the through hole (7), and a threaded rod (101) is provided on the top of the placement seat (8) and passes through the hollow positioning ring (9) and is connected to the arc-shaped pressure plate (103), and a connecting bearing (102) is provided at the connection between the threaded rod (101) and the arc-shaped pressure plate (103).

9. The semiconductor wafer processing and cleaning device according to claim 3, characterized in that: The side wall of the shell (1) is provided with a sealing groove, a sealing door (2) is provided inside the sealing groove, and the inner wall of the shell (1) is provided with a through groove connected to the sealing groove, and the vertical cross-sectional area of ​​the sealing groove is larger than the vertical cross-sectional area of ​​the through groove.

10. The semiconductor wafer processing and cleaning device according to claim 1, wherein: An annular hollow groove is provided inside the annular hollow spray plate (14), and a plurality of water spray holes (141) connected to the annular hollow groove are provided at the bottom of the annular hollow spray plate (14).

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