Wafer scrubbing device

Abstract

The invention relates to the technical field of wafer scrubbing, in particular to a wafer scrubbing device which comprises a scrubbing unit, the scrubbing unit comprises a scrubbing mechanism, the scrubbing mechanism comprises a scrubbing conveying assembly, and a scrubbing conveying part for conveying wafers is arranged in the scrubbing conveying assembly; the brush roller assembly is arranged above the brushing conveying piece; the overturning unit is arranged between the first brushing unit and the second brushing unit in a butt joint manner so as to overturn the wafer; wherein the brush roller and the sheet pressing rollers act downwards on a wafer located on the brushing conveying piece, the two sheet pressing rollers are arranged on the front side and the rear side of the brush roller in the wafer conveying direction respectively, and the wafer is continuously limited by the sheet pressing rollers in the process that the wafer is acted by the brush roller through the two sheet pressing rollers; the technical problem that the cleaning cleanliness of the back face of the wafer is low is solved, and the technical effect of cleaning the back face of the wafer is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer brushing, in particular to a wafer brushing device. BACKGROUND

[0002] Photovoltaic wafer cleaning is an important link in the process of cell manufacturing, which can effectively improve the yield and performance of cell production. In order to ensure the cleanliness of the wafer, the wafer is usually cleaned by a cleaning mechanism.

[0003] In the prior art, the wafer brushing device includes a conveying member, a brush roller unit and a suction unit. The wafer is moved to the work position of the brush roller unit by the conveying member, and then the wafer position is fixed by the suction unit. In the above brushing method, the suction unit acts on the back of the wafer, so that the brushing of the brush roller unit on the back of the wafer is not in place, and the brushing cleanliness of the back of the wafer is low.

[0004] Therefore, the technical problem of the prior art is that the brushing cleanliness of the back of the wafer is low. SUMMARY

[0005] The present application provides a wafer brushing device, which solves the technical problem of low brushing cleanliness of the back of the wafer and achieves the technical effect of clean brushing of the back of the wafer.

[0006] The wafer brushing device provided by the present application adopts the following technical solution: the wafer brushing device includes a brushing unit, the brushing unit is arranged in front of and behind the conveying direction, the brushing unit includes a brushing mechanism, the brushing mechanism includes a brushing conveying assembly, the brushing conveying assembly is provided with a brushing conveying member for conveying the wafer, a brush roller assembly and a brushing water spraying assembly, the brush roller assembly is arranged above the brushing conveying member, the brush roller assembly includes a brush roller seat, a brush roller arranged on the brush roller seat and a wafer pressing roller arranged on the brush roller seat, the output end of the brushing water spraying assembly faces the conveying area and / or the brush roller assembly, and a turnover unit is arranged between the first brushing unit and the second brushing unit to turn over the wafer, wherein the brush roller and the wafer pressing roller act downward on the wafer located on the brushing conveying member, and the wafer pressing roller is provided with two groups, the two groups of wafer pressing rollers are arranged on the front and back of the brush roller along the wafer conveying direction, and the wafer is continuously limited by the wafer pressing roller during the action of the brush roller through the two groups of wafer pressing rollers.

[0007] As preferred, the brush washing unit further comprises a lifting mechanism connected to the brush roller assembly, through which the gap between the brush roller assembly and the brush washing conveyer is adjusted; and / or, the brush roller is arranged transversely relative to the brush washing conveyer, and the rotation direction of the brush roller is opposite to the movement direction of the brush washing conveyer; and / or, the distance between the two sets of the pressing rollers is less than 180mm.

[0008] As preferred, a plurality of the brush washing mechanisms are arranged in the first brush washing unit and the second brush washing unit, and the plurality of the brush washing mechanisms are arranged in front of and behind the conveying direction of the brush washing conveyer.

[0009] As preferred, a transition mechanism is arranged between the adjacent brush washing conveyers, and the movement direction of the transition mechanism is consistent with the movement direction of the brush washing conveyer, so as to move the wafer through the two brush washing conveyers; and / or, two brush washing mechanisms are arranged in the first brush washing unit and the second brush washing unit, and the brush rollers in the two brush washing mechanisms are a rough brush roller and a fine brush roller respectively.

[0010] As preferred, the turnover unit comprises a first conveyer, a second conveyer, and a turnover mechanism, the turnover mechanism is provided with a containing position for containing the wafer and a turnover track for turning over the containing position, and the turnover mechanism is arranged between the first conveyer and the second conveyer, so that the wafer output by the first conveyer is input to the second conveyer after being turned over.

[0011] As preferred, the wafer brush washing device further comprises a channeling unit arranged before the first brush washing unit, and the channeling unit inputs multiple wafers to the first brush washing unit; and / or, a rejection unit arranged after the second turnover unit.

[0012] As preferred, the wafer brush washing device further comprises a second turnover unit arranged after the second brush washing unit; and / or, a third brush washing unit arranged between the second turnover unit and the rejection unit.

[0013] As preferred, an adjusting plate is arranged between the brush roller seat and the brush roller, and the connection between the adjusting plate and at least one of the brush roller seat and the brush roller is adjustable; and / or, the brush washing conveyer is a ring-shaped conveyer, and the front surface of the brush washing conveyer is used for conveying the wafer; and / or, the brush washing conveyer assembly further comprises a cleaning roller acting on the back surface of the brush washing conveyer.

[0014] As a priority, the overturning unit further comprises a position sensor and an overturning controller which are electrically connected to each other; the position sensor is arranged relative to the first conveying mechanism and / or the second conveying mechanism, and a detection area of the position sensor is located on a conveying path of the wafer, the position sensor is used to send a position signal to the overturning controller after the wafer reaches the detection area; the overturning controller is electrically connected to the overturning mechanism, and the overturning controller is used to control the overturning mechanism to rotate once after receiving the position signal once, so as to overturn the containing position by a first preset angle.

[0015] As a priority, the overturning unit further comprises a position sensor and an overturning controller which are electrically connected to each other; the position sensor is arranged relative to the first conveying mechanism and / or the second conveying mechanism, and a detection area of the position sensor is located on a conveying path of the wafer, the position sensor is used to send a position signal to the overturning controller after the wafer reaches the detection area; the overturning controller is electrically connected to the overturning mechanism, and the overturning controller is used to control the overturning mechanism to rotate once after receiving the position signal once, so as to overturn the containing position by a first preset angle.

[0016] Distinguished from the prior art, the beneficial effects of the present application are:

[0017] Two brush washing units which can carry wafers are arranged to wash two surfaces of the wafers, and an overturning unit is arranged between the two brush washing units, the overturning unit is used to overturn the wafers, so that the wafers pass through the first brush washing unit in a posture with a first wafer surface facing upward, and then pass through the second brush washing unit in a posture with a second wafer surface (i.e. a wafer back surface) facing upward; the second brush washing unit is used to wash the wafer back surface, thereby solving the technical problem of low cleaning degree of the wafer back surface, and achieving the technical effect of clean wafer back surface. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a top view layout schematic diagram of a wafer brush washing device in the present application;

[0019] Figure 2 is an axonometric view structural schematic diagram of a brush washing mechanism in the present application;

[0020] Figure 3 is a side view structural schematic diagram of a brush washing mechanism in the present application;

[0021] Figure 4 is a side view structural schematic diagram of a rough brush assembly and a fine brush assembly being lifted in the present application;

[0022] Figure 5 is an axonometric view structural schematic diagram of an overturning unit in the present application;

[0023] Figure 6 is a side view structural schematic diagram of an overturning unit in the present application;

[0024] Figure 7 is Figure 6 is an enlarged view of A in FIG. 1;

[0025] Figure 8 is a side view structural schematic diagram of the rejecting mechanism in the present application;

[0026] Figure 9 is a top view layout schematic diagram of another wafer brushing device in the present application.

[0027] Explanation of reference signs:

[0028] S, wafer; Sa, first wafer surface; Sb, second wafer surface; 100, channeling unit; 200, brushing unit; 200a, first brushing unit; 200b, second brushing unit; 200c, third brushing unit; 21, brushing mechanism; 21a, first brushing mechanism; 21b, second brushing mechanism; 211, brushing conveying assembly; 2111, brushing conveying piece; 2112, wafer cleaning roller; 212, brush roller assembly; 2121, brush roller seat; 2122, adjusting plate; 2123, brush roller; 2124, wafer pressing roller; 213, brushing water spraying assembly; 22, transition mechanism; 23, lifting mechanism; 300, turning unit; 300a, first turning unit; 300b, second turning unit; 31, first conveying mechanism; 32, turning mechanism; 321, turning piece; 3211, containing position; 3212, containing surface; 3213, groove; 322, turning shaft; 33, second conveying mechanism; 34, turning water spraying mechanism; 35, in-position sensor; 35a, first in-position sensor; 35b, second in-position sensor; 400, rejecting unit; 41, mounting base; 42, image acquisition mechanism; 43, light supplementing mechanism; 44, rejecting action mechanism; 45, rejecting sensor. DETAILED DESCRIPTION

[0029] In the present application, the serial numbers of components, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. In the present application, "connection" and "coupling" include direct and indirect connection (coupling) unless otherwise specified. In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0030] In the present application, unless specifically defined and limited otherwise, a first feature is "on" or "under" a second feature can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature is "over", "above" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. The first feature is "under", "below" and "underneath" the second feature can mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is horizontally lower than the second feature.

[0031] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings of the specification and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0032] The embodiment of the present application provides a wafer S brushing device, referring to Figure 1 and Figure 2 The technical scheme is as follows: the wafer S brushing device comprises a brushing unit 200 and a turnover unit 300, two brushing units 200 are arranged in front of and behind the conveying direction, the brushing unit 200 comprises a brushing mechanism 21, the brushing mechanism 21 comprises a brushing conveying assembly 211, a brush roller assembly 212 and a brushing water spraying assembly 213, the brushing conveying assembly 211 is provided with a brushing conveying piece 2111 conveying the wafer S; the brush roller assembly 212 is arranged above the brushing conveying piece 2111, the brush roller assembly 212 comprises a brush roller seat 2121, a brush roller 2123 and a wafer pressing roller 2124, the brush roller 2123 is arranged on the brush roller seat 2121; the wafer pressing roller 2124 is arranged on the brush roller seat 2121; the output end of the brushing water spraying assembly 213 faces the conveying area and / or the brush roller assembly 212; the turnover unit 300 is arranged in abutment between the first brushing unit 200a and the second brushing unit 200b to turn over the wafer S; wherein the brush roller 2123 and the wafer pressing roller 2124 act downward on the wafer S located on the brushing conveying piece 2111, and the wafer pressing roller 2124 is provided with two groups, the two groups of wafer pressing rollers 2124 are arranged on the front and back sides of the brush roller 2123 along the conveying direction of the wafer S, so that the wafer S is continuously limited by the wafer pressing roller 2124 in the process of being acted on by the brush roller 2123.

[0033] The first brush washing unit 200a and the second brush washing unit 200b are arranged in front of and behind each other to cooperate with the first flipping unit 300a to brush wash the first crystal surface Sa and the second crystal surface Sb of the wafer S. In the present application, the brush roller assembly 212 is located above the brush washing conveying member 2111, and the brush roller 2123 contacts and brushes wash the wafer S by moving downward. It should be noted that, in order to ensure that the wafer S is in a stable state during the brushing washing process, the brush roller 2123 is provided with pressing rollers 2124 on both sides. The specific height relationship between the pressing rollers 2124 and the brush roller 2123 can be that the bottom surfaces of the pressing rollers 2124 and the brush roller 2123 are at the same height, or the bottom surface of the brush roller 2123 is slightly lower than the bottom surface of the pressing roller 2124, so that the bristles of the brush roller 2123 can be strongly brushed washed in a curved deformation manner.

[0034] In one embodiment, referring to Figure 3 and Figure 4 The brush washing unit 200 further comprises a lifting mechanism 23 connected to the brush roller assembly 212, which adjusts the gap between the brush roller assembly 212 and the brush washing conveying member 2111.

[0035] It can be understood that the lifting mechanism 23 can adjust the height difference between the brush roller assembly 212 and the brush washing conveying member 2111, so that the present device is suitable for wafers S of different thicknesses. The lifting structure can be in the form of telescopic lifting or integral lifting. In one embodiment, the lifting mechanism 23 comprises an upper frame and a telescopic rod, which can be a pneumatic telescopic rod, a hydraulic telescopic rod or an electric telescopic rod. The two ends of the telescopic rod are respectively connected to the upper frame and the brush roller assembly 212, and the lifting of the brush roller assembly 212 is controlled by controlling the telescopic rod.

[0036] In one embodiment, the brush roller 2123 is arranged transversely relative to the brush washing conveying member 2111, and the rotation direction of the brush roller 2123 is opposite to the movement direction of the brush washing conveying member 2111. It is worth mentioning that the brush roller 2123 is arranged transversely relative to the brush washing conveying member 2111, which is beneficial to the fact that one brush roller 2123 can brush wash multiple wafers S at the same time, thereby improving the brushing washing efficiency. The rotation direction of the brush roller 2123 is opposite to the movement direction of the brush washing conveying member 2111, which increases the contact speed of the bristles on the brush roller 2123 with the surface of the wafer S, thereby enhancing the mechanical friction. This higher relative speed can more effectively remove stubborn contaminants, especially small particles or strongly adhering residues.

[0037] In one embodiment, the distance between the two sets of tabletting rollers 2124 is less than 180 mm. The distance between the two sets of tabletting rollers 2124 is set to be less than 180 mm to ensure that the wafer S is always pressed by the tabletting rollers 2124 during the brushing process of the brushing roller 2123. Therefore, if small wafers S are brushed, the distance between the two sets of tabletting rollers 2124 needs to be further reduced, for example, to 160 mm, 140 mm or 120 mm. If large wafers S are brushed, the distance between the two sets of tabletting rollers 2124 can be increased, maintained or reduced.

[0038] In one embodiment, the first brushing unit 200a and the second brushing unit 200b are each provided with a plurality of brushing mechanisms 21, and the plurality of brushing mechanisms 21 are arranged in front of and behind each other in the conveying direction of the brushing conveyors 2111. The plurality of brushing mechanisms 21 are arranged in the brushing unit 200 to sequentially brush one side of the wafer S multiple times in the brushing unit 200, so as to sequentially brush the wafer S in the manner of rough brushing first and then fine brushing. In addition, it can be understood that the two brushing mechanisms 21 in one brushing unit 200 can share one brushing conveyor assembly 211, or each use one brushing conveyor assembly 211, and the two brushing conveyor assemblies 211 are connected in front of and behind each other to ensure that the wafer S moves from the front brushing conveyor assembly 211 to the rear brushing conveyor assembly 211.

[0039] Further, a transition mechanism 22 is arranged between adjacent brushing conveyors 2111, and the movement direction of the transition mechanism 22 is consistent with the movement direction of the brushing conveyors 2111, so as to enable the wafer S to move through the two brushing conveyors 2111. It can be understood that, in the case where the two brushing mechanisms 21 in one brushing unit 200 each use one brushing conveyor assembly 211, the transition mechanism 22 is arranged between the two brushing mechanisms 21 in one brushing unit 200 to connect the brushing conveyors 2111 of the adjacent two brushing mechanisms 21. The transition mechanism 22 can be a conveyor belt or a transition wheel. The arrangement of the transition mechanism 22 enables the wafer S to move more smoothly, and avoids affecting the smooth movement of the wafer S through the joint area of the two adjacent brushing conveyors 2111 due to the excessively large distance between the two adjacent brushing conveyors 2111.

[0040] As an implementable manner, the first brushing unit 200a and the second brushing unit 200b are each provided with two brushing mechanisms 21, and the brushing rollers 2123 in the two brushing mechanisms 21 are a rough brushing roller 2123 and a fine brushing roller 2123, respectively.

[0041] In one embodiment, two brush washing mechanisms 21 are arranged in the brush washing unit 200, the first brush washing mechanism 21a is used for rough brushing, and the second brush washing mechanism 21b is used for fine brushing; and a transition mechanism 22 is arranged between the brush washing conveyors 2111 of the two brush washing mechanisms 21, the transition mechanism 22 is structured as a transition shaft and a plurality of transition wheels arranged on the transition shaft; the transition mechanism 22 has a small cross-sectional area to fill the gap between the two brush washing conveyors 2111, so as to ensure the smooth movement of the wafer S from the former brush washing conveyor 2111 to the latter brush washing conveyor 2111 through the transition mechanism 22.

[0042] In one embodiment, referring to Figure 3 An adjusting plate 2122 is arranged between the brush roller seat 2121 and the brush roller 2123, and the connection between the adjusting plate 2122 and at least one of the brush roller seat 2121 and the brush roller 2123 is adjustable. It can be understood that the lifting mechanism 23 is used to coarsely adjust the height difference between the brush roller assembly 212 and the brush washing conveyor 2111; the adjusting plate 2122 is used to finely adjust the height difference between the brush roller assembly 212 and the brush washing conveyor 2111, and the adjusting plate 2122 is used to adjust the height difference between the brush roller 2123 and the pressing roller 2124. For example, the adjusting plate is a plate body with a long slot, the direction of the long slot is the height direction in the present application, and the height of the brush roller 2123 is adjusted by adjusting the height position of the brush roller seat 2121 fixed on the long slot.

[0043] As an implementable manner, the brush washing conveyor 2111 is an annular conveyor, and the front surface of the brush washing conveyor 2111 is used for conveying the wafer S; the brush washing conveying assembly 211 further comprises a wafer cleaning roller 2112 acting on the back surface of the brush washing conveyor 2111. Regarding the design of the brush washing conveyor 2111, the wafer cleaning roller 2112 cooperates with the circulating brush washing conveyor 2111, which is conducive to brushing off the wafer S fragments on the brush washing conveyor 2111 by the wafer cleaning roller 2112, so as to ensure that the circulating brush washing conveyor 2111 can carry the wafer S again in a clean state, and avoid affecting the normal carrying of the wafer S on the brush washing conveyor 2111 due to the adsorption of wafer S fragments. It should be noted that the back surface of the brush washing conveyor 2111 refers to the part of the circulating brush washing conveyor 2111 that does not participate in the carrying of the wafer S, that is, the conveying surface of the brush washing conveyor 2111 is dynamically divided into two parts, the first part carries the wafer S or is about to carry the wafer S, and the second part is the area other than the first part, and the second part of the conveying surface is the aforementioned back surface. For example, the wafer cleaning roller 2112 is arranged below the brush washing conveyor 2111, and the wafer cleaning roller 2112 abuts against the second part of the conveying surface of the brush washing conveyor 2111.

[0044] In one embodiment, referring to Figure 5The turnover unit 300 comprises a first conveying mechanism 31, a second conveying mechanism 33 and a turnover mechanism 32, the first conveying mechanism 31 can convey the wafer S, the second conveying mechanism 33 can convey the wafer S, the turnover mechanism 32 is provided with a containing position 3211 containing the wafer S and a turnover track overturning the containing position 3211, and the turnover mechanism 32 is connected between the first conveying mechanism 31 and the second conveying mechanism 33, so that the wafer S output by the first conveying mechanism 31 is input to the second conveying mechanism 33 after being overturned.

[0045] The turnover mechanism 32 with the containing position 3211 is connected between the first conveying mechanism 31 and the second conveying mechanism 33, the wafer S enters the containing position 3211 of the turnover mechanism 321 from the first conveying mechanism 31, the turnover mechanism 321 rotates with the rotation of the turnover shaft 322, and after the turnover mechanism 321 is overturned by 180°, the wafer S is overturned from the first wafer surface Sa upward to the second wafer surface Sb upward, so that the wafer S is overturned, the technical problem that the wafer S is easily damaged by the adsorption and overturning mode is solved, and the technical effect that the wafer S is overturned in a low-damage mode is achieved.

[0046] The first conveying mechanism 31 and the second conveying mechanism 33 horizontally or substantially horizontally convey the wafer S, the turnover shaft 322 of the turnover mechanism 32 is transversely arranged relative to the first conveying mechanism 31 and the second conveying mechanism 33, the rotation direction of the turnover shaft 322 is from the first conveying mechanism 31 side to the second conveying mechanism 33 side, so that the turnover mechanism 321 on the turnover shaft 322 is overturned from the first conveying mechanism 31 side to the second conveying mechanism 33 side. The containing position 3211 of the turnover mechanism 32 is a flat containing space capable of containing the wafer S, the opening of the containing position 3211 is a flat opening of the flat containing space, and the containing surface 3212 of the containing position 3211 corresponds to the first containing surface and the second containing surface of the first wafer surface Sa and the second wafer surface Sb. Regarding the orientation of the containing position 3211 relative to the turnover shaft 322, it can be understood that the axis direction passing through the first containing surface and the second containing surface in the containing position 3211 is the circumferential tangent direction of the turnover shaft 322, so as to ensure that when the wafer S is placed into the containing position 3211 from the first conveying mechanism 31, the first containing surface and the second containing surface of the containing position 3211 are parallel or substantially parallel to the conveying surface of the first conveying mechanism 31, that is, the first wafer surface Sa and the second wafer surface Sb on both sides of the wafer S are parallel or substantially parallel to the conveying surface of the first conveying mechanism 31, so as to facilitate the wafer S to move from the first conveying mechanism 31 to the containing position 3211 of the turnover mechanism 32.

[0047] The turnover member 321 is provided with a plurality of accommodation positions 3211 which are distributed radially outward from the turnover shaft 322. It can be understood that the angles between the plurality of accommodation positions 3211 on a turnover member 321 are preferably equal, so as to facilitate the turnover member 321 to continuously perform the loading and unloading operations by continuously turning at a certain angle. For example, the turnover member 321 is provided with eight accommodation positions 3211 which are distributed radially from the axial center of the turnover member 321, and the angles between adjacent accommodation positions 3211 are 45°, so as to facilitate the turnover mechanism 32 to perform the loading and unloading operations at a turnover angle of 45° as one cycle.

[0048] The turnover members 321 constituting the turnover group are provided with one or more alternating zones, or a group of turnover groups is provided with alternating zones on the outer side of the axial direction of the turnover shaft 322; the output end of the first conveying mechanism 31 and the input end of the second conveying mechanism 33 extend into the alternating zones, respectively.

[0049] Regarding the details of the connection between the turnover group and the two conveying mechanisms, the first conveying mechanism 31 and the second conveying mechanism 33 extend into the alternating zones in the turnover group, so as to facilitate the movement of the wafer S into the accommodation position 3211 and the movement of the wafer S out of the accommodation position 3211. The alternating zones can be provided between each turnover member 321 in the turnover group, or the alternating zones can be provided on both sides of the turnover group; preferably, the alternating zones are provided on both sides of the turnover group, or the alternating zones are provided between the turnover members 321 and are designed to be wide enough to facilitate the maintenance and repair of the conveying mechanisms.

[0050] Regarding the details of the connection between the accommodation position 3211 and the first conveying mechanism 31, preferably, the conveying surface of the first conveying mechanism 31 is higher than the lower accommodation surface 3212 of the connected accommodation position 3211, and when the wafer S is placed in the accommodation position 3211 by the first conveying mechanism 31, the turnover member 321 turns to make the lower accommodation surface 3212 of the corresponding accommodation position 3211 move upward to drive the wafer S to leave the conveying surface of the first conveying mechanism 31.

[0051] The turnover member 321 is a sheet or a plate, and the width dimension of the accommodation position 3211 in the axial direction of the turnover shaft 322 is between 2mm and 40mm. It can be understood that the function of the turnover member 321 is to support the wafer S and limit the position of the wafer S during the turnover of the wafer S; in order to save the cost of the turnover member 321 and leave space, the axial thickness dimension of the turnover member 321 can be designed to be a low value, such as 25mm.

[0052] The turnover unit 300 further comprises a turnover water spraying mechanism 34 facing the turnover member 321. It can be understood that the turnover unit 300 is arranged between the two brush washing units 200, and the purpose of turning over the wafer S is to turn the unbrushed second crystal surface Sb to an upward state after the first crystal surface Sa of the wafer S is brushed. The turnover water spraying mechanism 34 has two effects, the turnover water spraying mechanism 34 facing the area between the turnover mechanism 32 and the first conveying mechanism 31 can prevent the unbrushed wafer S surface from being dirty and polluting the brushed surface, and the turnover water spraying mechanism 34 facing the area between the turnover mechanism 32 and the second conveying mechanism 33 can help to ensure that the wafer S is separated from the turnover member, so that the wafer S can be smoothly output from the turnover mechanism 32. It should be noted that the specific arrangement details of the turnover water spraying mechanism 34, the turnover water spraying mechanism 34 is divided into a first water spraying pipe and a second water spraying pipe, the first water spraying pipe is inclined downward from the first conveying mechanism 31 side to the turnover mechanism 32 side, and the wafer S on the first conveying mechanism 31 and / or the wafer S on the containing position 3211 close to the first conveying mechanism 31 is flushed by the first water spraying pipe, so as to prevent the unbrushed wafer S surface from being dirty and polluting the brushed surface. The second water spraying pipe is inclined downward from the second conveying mechanism 33 side to the turnover mechanism 32 side, or the second water spraying pipe is inclined upward from the second conveying mechanism 33 side to the turnover mechanism 32 side, and the wafer S on the containing position 3211 close to the second conveying mechanism 33 is flushed by the second water spraying pipe, so that the first crystal surface Sa of the wafer S and the containing surface 3212 are in a separated state or a state tending to separate.

[0053] Regarding the connection scheme between the conveying unit and the turnover unit 300, when the second crystal surface Sb of the wafer S needs to be brushed, the wafer S will enter the turnover mechanism 32 through the first conveying mechanism 31. After the silicon wafer reaches the turnover position, the in-position sensor 35 will receive a rising edge signal from 0 to 1, and the turnover controller will determine that the wafer S has reached the specified position according to the signal. In order to adapt to silicon wafers of different specifications, the setting position of the in-position sensor 35 should be slightly larger than the length of the wafer S, and appropriate delay is used to ensure accurate judgment. After receiving the wafer S in-position signal, the turnover mechanism 32 will drive the wafer S to rotate by 45 degrees, and continue to rotate by 45 degrees when the next group of wafers S arrives. When a group of wafers S is turned to 180 degrees, they will be transmitted to the next station through the second conveying mechanism 33 for brushing of the second crystal surface Sb. The in-position sensor 35 is also arranged at the second conveying mechanism 33 to ensure that all wafers S are completely conveyed out before the next turnover operation is performed.

[0054] The in-position sensor 35 preferably detects the alternate region to determine whether the wafer S has been transferred to the receiving position 3211 of the flipping mechanism 32. When the first transfer mechanism 31 of the plurality of parallel channels has transferred the wafer S to the plurality of receiving positions 3211 of the parallel channels, the flipping controller drives the flipping mechanism 32 to flip, ensuring the consistent beat of the plurality of stations and facilitating the centralized brushing of the brushing unit 200. If a channel is missing a wafer S due to a broken piece being removed, the system will automatically mark the missing position, and no wafer S will be required in all the channels.

[0055] It is worth mentioning that the flipping strategy of the flipping unit 300 is that, after the conventional flipping mechanism 32 flips multiple times, the flipping angle of the driving member has an error, and the accumulation of the angle error will affect the docking of the flipping mechanism 32 and the first transfer mechanism 31 and the second transfer mechanism 33. Therefore, in order to ensure that the flipping mechanism 32 can stably dock and flip the wafer S for a long time, a new flipping strategy is developed in the present application.

[0056] Reference Figure 6 and Figure 7 The flipping unit 300 further comprises an in-position sensor 35 and a flipping controller electrically connected to each other. The in-position sensor 35 is arranged relative to the first transfer mechanism 31 and / or the second transfer mechanism 33, and the detection region of the in-position sensor 35 is located on the transfer path of the wafer S. The in-position sensor 35 is used to send an in-position signal to the flipping controller after the wafer S reaches the detection region. The flipping controller is electrically connected to the flipping mechanism 32, and the flipping controller is used to control the flipping mechanism 32 to rotate once after receiving the in-position signal once, so that the receiving position 3211 is flipped by a first preset angle. By controlling the flipping mechanism 32 to rotate once, the receiving position 3211 without the wafer S is moved to a position suitable for docking the wafer S from the first transfer mechanism 31, and the receiving position 3211 with the wafer S is moved to a position suitable for outputting the wafer S on it to the second transfer mechanism 33. In one embodiment, the in-position sensor 35 is provided with two groups, a first in-position sensor 35a35 corresponding to the first transfer mechanism 31, and a second in-position sensor 35b35 corresponding to the second transfer mechanism 33. The two groups of in-position sensors 35 are used to detect the entry and exit of the wafer S.

[0057] Each time the flipping mechanism 32 rotates once, the storage unit in the flipping controller accumulates a second preset angle on the current position angle recorded, and the difference between the second preset angle and the first preset angle is a preset difference value not equal to 0. Each time the difference between the current position angle recorded by the storage unit and 360° is less than a preset threshold, the current position angle is cleared.

[0058] It can be understood that the feature of the turning strategy in the present application is that the first preset angle turned by the turning mechanism 32 and the second preset angle accumulated by the storage unit are not equal, and when the range of the current position angle recorded by the storage unit + the preset threshold value (which can be a range value or a single numerical value) covers the angle value of 360°, the current position angle recorded by the storage unit is cleared; in the case that the turning mechanism 32 actually turns 360°, the turning angle recorded in the storage unit ≠ 360°, which avoids the running failure caused by the fact that the turning controller cannot distinguish the difference between 360° and 0°. At the same time, the current position angle recorded by the storage unit is cleared when the turning mechanism 32 turns a circle, which can avoid the problem of unsmooth docking of the wafer S by the turning mechanism 32 due to the accumulation of the turning angle error in the actual turning of the turning mechanism 32.

[0059] In one embodiment, the radial design on the turning mechanism 32 has 8 accommodation positions 3211, and the angle between adjacent accommodation positions 3211 is 45°, the first preset angle is 45°, the second preset angle is 44.8°, and the preset threshold value is 0°-3°; when the turning mechanism 32 turns for the first time, the turning mechanism 32 actually turns from 0° to 45°, and the storage unit accumulates and records 44.8° from 0°; when the turning mechanism 32 turns 8 times, the turning mechanism 32 actually turns 360° according to the first preset angle, the storage unit records 358.4°, and since 358.4° + the preset threshold value of 0°-3° covers the angle value of 360°, the 358.4° recorded by the storage unit is cleared; at this time, the turning mechanism 32 actually turns 360° back to the zero position, and the storage unit clears and records 0°.

[0060] In another embodiment, the radial design on the turning mechanism 32 has 8 accommodation positions 3211, and the angle between adjacent accommodation positions 3211 is 45°, the first preset angle is 45°, the second preset angle is 46°, and the preset threshold value is -8°; when the turning mechanism 32 turns 8 times, the turning mechanism 32 actually turns 360° according to the first preset angle, the storage unit records 368°, and since 368° + the preset threshold value of -8° = 360°, the 368° recorded by the storage unit is cleared; at this time, the turning mechanism 32 actually turns 360° back to the zero position, and the storage unit clears and records 0°.

[0061] In addition, if the actual zero position of the flipping mechanism 32 is not the appropriate wafer S docking angle, the flipping mechanism 32 needs to be re-zeroed. The method of zeroing the flipping mechanism 32 is to record the current position of the flipping mechanism by the storage unit, and then manually adjust the flipping mechanism to rotate by α°, so that the feeding port of the flipping mechanism is flush with the conveying surface of the first conveying mechanism 31 / the conveying surface of the second conveying mechanism 33, and the deflection angle α° is recorded. After the device is initialized, the zero point needs to be re-found, at which time the sensor trigger will consider the current position to be -α°, and will continue to rotate until 0°, completing the zero point finding function.

[0062] In one embodiment, referring to Figure 8 , the wafer S brushing device further comprises a channeling unit 100 and a rejection unit 400. The channeling unit 100 is docked before the first brushing unit 200a, and the channeling unit 100 inputs multiple lanes of wafers S in parallel to the first brushing unit 200a. The rejection unit 400 is docked after the second flipping unit 300b. It can be understood that the wafer S conveying line is designed with a high-speed line, which has high efficiency in conveying wafers S, but the beat of the high-speed line and the brushing unit 200 does not match. The present application designs multiple brushing units 200, and uses the channeling unit 100 to split the wafers S on the line to keep the beat of the entire line consistent. Of course, when using a conveying line with multiple beats and brushing units 200 that match, the channeling unit 100 can be omitted, and the conveying line can be directly docked with the brushing unit 200. The rejection unit 400 can reject broken / hidden cracked wafers based on visual information to supply qualified wafers S to subsequent processes. A rejection unit 400 can also be added between the channeling unit 100 and the brushing unit 200 to screen wafers S before brushing, reject broken and fragile wafers, or reject other unqualified wafers with quality problems, to reduce the number of wafers S to be brushed, reduce the number of broken wafers during brushing, and speed up the beat of the brushing unit 200.

[0063] As to the specific structure of the rejection unit 400, the rejection unit 400 comprises a mounting base 41, an image acquisition mechanism 42, a light supplement mechanism 43, a rejection action mechanism 44, and a rejection sensor. The mounting base 41 is the basic framework of the rejection unit 400, the rejection action mechanism 44 is connected to the previous conveying line (such as the channeling unit 100, such as the brushing unit 200), and the rejection action mechanism 44 can perform channeling operation, one channel leads to the next process, and the other channel guides the defective wafer S to a defective product accumulation space. The image acquisition mechanism 42 is arranged on the mounting base 41 and faces the rejection action mechanism 44 or the conveying line before the rejection action mechanism 44, and the image acquisition mechanism 42 acquires the wafer S image to determine whether it is a defective product. The light supplement mechanism 43 is consistent with the direction of the image acquisition mechanism 42, and the light supplement mechanism 43 is used to supplement light for the image acquisition mechanism 42. The rejection sensor is used to detect the action of the rejection action mechanism 44 to ensure that the defective wafer S is guided to the defective product accumulation space.

[0064] Further, referring to Figure 9 , the wafer S brushing device further comprises a second flipping unit 300b and a third brushing unit 200c, the second flipping unit 300b is arranged after the second brushing unit 200b, and the third brushing unit 200c is arranged between the second flipping unit 300b and the rejection unit 400.

[0065] It should be noted that the first brushing unit 200a is used to brush the first crystal surface Sa of the wafer S, and after the flipping of the first flipping unit 300a, the second brushing unit 200b brushes the second crystal surface Sb of the wafer S. The brushing operation of the second brushing unit 200b may cause the dirt on the second crystal surface Sb to contaminate the first crystal surface Sa of the wafer S, so the second flipping unit 300b and the third brushing unit 200c are added to perform secondary brushing on the first crystal surface Sa of the wafer S. Since the second crystal surface Sb of the wafer S is not contaminated and the first crystal surface Sa is only slightly contaminated before brushing by the third brushing unit 200c, the wafer S is in a basically clean state. Therefore, the brushing unit 200 of the third brushing unit 200c will not contaminate the second crystal surface Sb. In order to further prevent the third brushing unit 200c from contaminating the second crystal surface Sb, the structure of the third brushing unit 200c can also be improved; for example, the third brushing unit 200c is designed with only one brushing mechanism 21, and the brushing mechanism 21 adopts a brush roller 2123 made of fine brush material.

[0066] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted as including all changes and modifications falling within the scope of the present application.

[0067] It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application cover modifications and variations of this application provided they come within the scope of the appended claims and their equivalents.

Claims

1. A wafer scrubbing device, characterized in that: The wafer scrubbing device comprises: A scrubbing unit (200) is provided with two scrubbing units (200) in front and back according to the conveying direction. The scrubbing unit (200) comprises: A scrubbing mechanism (21), the scrubbing mechanism (21) comprising: A scrubbing conveying assembly (211), wherein the scrubbing conveying assembly (211) is provided with a scrubbing conveying member (2111) for conveying a wafer (S); A brush roller assembly (212), the brush roller assembly (212) being arranged above the brushing conveyor (2111), the brush roller assembly (212) comprising: Brush roller seat (2121); a brush roller (2123), the brush roller (2123) being arranged on the brush roller seat (2121); and a pressing roller (2124), the pressing roller (2124) being arranged on the brush roller seat (2121); a brushing and water spraying assembly (213), wherein an output end of the brushing and water spraying assembly (213) faces the conveying area and / or the brush roller assembly (212); A flip unit (300), the flip unit (300) being docked and disposed between the first scrubbing unit (200a) and the second scrubbing unit (200b) to flip the wafer (S); The brush roller (2123) and the pressing roller (2124) act downward on the wafer (S) located on the brushing conveyor (2111), and two groups of pressing rollers (2124) are provided. The two groups of pressing rollers (2124) are respectively arranged on the front and rear sides of the brush roller (2123) along the conveying direction of the wafer (S). The two groups of pressing rollers (2124) ensure that the wafer (S) is continuously restricted by the pressing roller (2124) while being acted upon by the brush roller (2123).

2. The wafer scrubbing device according to claim 1, wherein: The brushing unit (200) further comprises a lifting mechanism (23), wherein the lifting mechanism (23) is connected to the brush roller assembly (212), and the gap between the brush roller assembly (212) and the brushing conveying member (2111) is adjusted by the lifting mechanism (23); and / or, the brush roller (2123) is arranged transversely relative to the brushing conveyor (2111), and the rotation direction of the brush roller (2123) is opposite to the movement direction of the brushing conveyor (2111); And / or, the distance between the two groups of sheeting rollers (2124) is less than 180 mm.

3. The wafer scrubbing device according to claim 1, wherein: The first scrubbing unit (200a) and the second scrubbing unit (200b) are both provided with a plurality of scrubbing mechanisms (21), and the plurality of scrubbing mechanisms (21) are arranged front to back according to the conveying direction of the scrubbing conveyor (2111).

4. The wafer scrubbing device according to claim 3, characterized in that: A transition mechanism (22) is provided between adjacent scrubbing conveying members (2111), and the movement direction of the transition mechanism (22) is consistent with the movement direction of the scrubbing conveying members (2111), so that the wafer (S) moves through the two scrubbing conveying members (2111); And / or, two brushing mechanisms (21) are provided in each of the first brushing unit (200a) and the second brushing unit (200b), and the brush rollers (2123) in the two brushing mechanisms (21) are respectively a coarse brush roller and a fine brush roller.

5. The wafer scrubbing device according to claim 1, wherein: The turning unit (300) comprises: a first conveying mechanism (31), wherein the first conveying mechanism (31) can transport a wafer (S); a second transport mechanism (33) capable of transporting the wafer (S); and A flip mechanism (32) is provided on the flip mechanism (32), wherein a holding position (3211) for holding a wafer (S) and a flip track for flipping the holding position (3211) are provided. The flip mechanism (32) is docked and arranged between the first conveying mechanism (31) and the second conveying mechanism (33), so that the wafer (S) output by the first conveying mechanism (31) is flipped and input to the second conveying mechanism (33).

6. The wafer scrubbing device according to claim 1, wherein: The wafer scrubbing device further comprises: a lane unit (100), the lane unit (100) being docked and arranged before the first scrubbing unit (200a), and inputting multiple wafers (S) into the first scrubbing unit (200a) through the lane unit (100); The rejecting unit (400) is arranged behind the second flipping unit (300b).

7. The wafer scrubbing device according to claim 6, characterized in that: The wafer scrubbing device further comprises: a second turning unit (300b), the second turning unit (300b) being docked and arranged behind the second scrubbing unit (200b); A third brushing unit (200c) is provided between the second turning unit (300b) and the rejecting unit (400).

8. The wafer scrubbing device according to claim 1, wherein: An adjustment plate (2122) is provided between the brush roller seat (2121) and the brush roller (2123), and the adjustment plate (2122) and at least one of the brush roller seat (2121) and the brush roller (2123) are connected in an adjustable manner; And / or, the scrubbing conveyor (2111) is an annular conveyor, and the front side of the scrubbing conveyor (2111) is used to transfer the wafer (S); the scrubbing conveyor assembly (211) further includes a wafer cleaning roller (2112), and the wafer cleaning roller (2112) acts on the back side of the scrubbing conveyor (2111).

9. The wafer scrubbing device according to claim 5, characterized in that: The flip unit (300) further includes an in-position sensor (35) and a flip controller electrically connected to each other; The in-position sensor (35) is arranged relative to the first conveying mechanism (31) and / or the second conveying mechanism (33), and a detection area of ​​the in-position sensor (35) is located on a conveying path of the wafer (S), and the in-position sensor (35) is used to send an in-position signal to the flip controller after the wafer (S) arrives at the detection area; The flip controller is electrically connected to the flip mechanism (32), and is used to control the flip mechanism (32) to rotate once each time the in-position signal is received, so as to flip the accommodating position (3211) to a first preset angle.

10. The wafer scrubbing device according to claim 9, wherein: Whenever the flip mechanism (32) is required to rotate once so that the accommodation position (3211) flips by a first preset angle, the flip controller actually controls the flip mechanism to flip by a second preset angle, so that the storage unit in the flip controller accumulates a second preset angle to the recorded current position angle, and the difference between the second preset angle and the first preset angle is a preset difference value that is not equal to 0; Whenever the flip mechanism (32) rotates a certain time and the difference between the current position angle recorded by the storage unit and 360° is less than a preset threshold, the flip controller actually controls the flip mechanism to rotate a third preset angle so that the storage unit accumulates the third preset angle to the recorded current position angle to equal 360°, and clears the current position angle to zero. In each flip cycle, N accommodated bit flips are performed, where When the flipping number i is less than or equal to the N-1th time, the flipping controller obtains the previous position record value, flips the accommodation position based on the first angle α1, and determines the current position record value, which is i*α1; the first angle α1=2π / N-β, β is not equal to 0; When the flipping number i=N, the flip controller flips the accommodation position based on a second angle α2 and records the current position record value as 0; the second angle α2=2π-(N-1)α1.

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