Gas-liquid mixed purging single-chip cleaning device

Abstract

The invention relates to the technical field of semiconductors, in particular to a gas-liquid mixed purging single-chip cleaning device. The device comprises a U-shaped mounting main body, a lifting material supporting assembly is arranged on the inner bottom surface of the U-shaped mounting main body, a fixing assembly is arranged on the inner wall of one side of the U-shaped mounting main body, a gas-liquid mixing assembly is arranged on the outer wall of the same side of the U-shaped mounting main body, and a blowing assembly is arranged at the top of the side, away from the gas-liquid mixing assembly, of the U-shaped mounting main body. And a driving assembly is arranged on the outer wall of one side, far away from the gas-liquid mixing assembly, of the U-shaped mounting main body. The independent gas path and liquid path design is adopted, gas and liquid are conveyed to the gas-liquid mixing cavity and sprayed out from the multiple nozzles in a uniform gas-liquid two-phase flow after being fully mixed, the gas-liquid mixing proportion and spraying pressure can be flexibly adjusted according to different wafer materials and stain types through the design, all-directional and high-precision cleaning of the wafer surface is achieved, and the wafer surface cleaning efficiency is improved. Various stubborn stains and impurities are effectively removed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and in particular to a gas-liquid mixed blowing single-piece cleaning device. BACKGROUND

[0002] In the fields of semiconductor manufacturing and optical element processing, the surface cleanliness of wafers and precision sheet elements plays a decisive role in product performance and yield. Traditional cleaning devices mostly use single liquid spraying or gas blowing methods, which have problems such as low cleaning efficiency, obvious stain residue, and incomplete drying. SUMMARY

[0003] The present application aims to provide a gas-liquid mixed blowing single-piece cleaning device to solve the problems in the background art.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme, which comprises a U-shaped installation main body, a lifting material supporting assembly is arranged on the inner bottom surface of the U-shaped installation main body, a fixing assembly is arranged on the inner wall of one side of the U-shaped installation main body, a gas-liquid mixing assembly is arranged on the outer wall of the same side of the U-shaped installation main body, a blowing assembly is arranged on the top of the side of the U-shaped installation main body away from the gas-liquid mixing assembly, and a driving assembly is arranged on the outer wall of the side of the U-shaped installation main body away from the gas-liquid mixing assembly.

[0005] As a preferred scheme of the present application, the lifting material supporting assembly comprises a first fixed shell arranged on the U-shaped installation main body, a telescopic cylinder one is arranged in the first fixed shell, a sliding sleeve is arranged on the top of the first fixed shell, the telescopic rod of the telescopic cylinder one is arranged in the sliding sleeve, a fixed plate is arranged on the top of the telescopic rod, the fixed plate is fixed to the top shell through a plurality of screws, and the top shell is sleeved outside the first fixed shell.

[0006] As a preferred scheme of the present application, the fixing assembly comprises a second fixed shell arranged on the inner wall of the U-shaped installation main body, a bidirectional screw is movably arranged in the second fixed shell through a pair of bearing seats one, a mounting bracket one is arranged on one side of the second fixed shell, a motor one is arranged on the mounting bracket one, the transmission end of the motor one is connected to one end of the bidirectional screw through a shaft coupling, a pair of driving blocks are symmetrically arranged in the second fixed shell and sleeved on the bidirectional screw, a nut is arranged on the driving block, the nut is threadedly arranged on the bidirectional screw, a semicircular frame is arranged on the front end of the driving block, and a plurality of rotatable clamping pieces are arranged on the semicircular frame.

[0007] As a preferred scheme of the present application, the rotatable clamping piece comprises a pair of inverted L-shaped plates, the two inverted L-shaped plates are symmetrically arranged on the upper and lower sides of the semicircular frame, a rotating shaft one is movably arranged between the two inverted L-shaped plates through a pair of bearing seats two, and a clamping wheel is arranged on the rotating shaft one.

[0008] As a preferred scheme of the present application, the gas-liquid mixing assembly comprises a liquid storage tank, the liquid storage tank is connected with the input end of a liquid pump through a first delivery pipe, the first delivery pipe extends to the inner bottom of the liquid storage tank, the liquid pump is arranged on the top of the second fixed shell, the output end of the liquid pump is communicated with the gas-liquid mixing cavity through a second delivery pipe, the gas-liquid mixing assembly further comprises a high-pressure gas tank, the high-pressure gas tank is connected with a gas pressure reducing valve through a third delivery pipe, the other end of the gas pressure reducing valve is provided with a fourth delivery pipe, the other end of the fourth delivery pipe is provided with a flow control valve, the other end of the flow control valve is communicated with the gas-liquid mixing cavity through a fifth delivery pipe, the output end of the gas-liquid mixing cavity is connected with a mixing spray head through a sixth delivery pipe, and the bottom of the mixing spray head is provided with a plurality of nozzles.

[0009] As a preferred scheme of the present application, the outer side of the U-shaped mounting body is provided with a pair of mounting ring frames, the liquid storage tank and the high-pressure gas tank are fixed on the two mounting ring frames, the top of the second fixed shell is provided with a mounting frame two, and the gas-liquid mixing cavity is arranged on the top of the mounting frame two.

[0010] As a preferred scheme of the present application, the purge assembly comprises a gas pump arranged on the top of the U-shaped mounting body, the output end of the gas pump is provided with a seventh delivery pipe, the other end of the seventh delivery pipe is provided with a U-shaped gas disc, the U-shaped gas disc is arranged on the outer side of the mixing spray head, and the bottom of the U-shaped gas disc is provided with a plurality of gas nozzles.

[0011] As a preferred scheme of the present application, the driving assembly comprises a second telescopic cylinder, the second telescopic cylinder is arranged on the outer wall of the U-shaped mounting body, the telescopic rod of the second telescopic cylinder passes through the U-shaped mounting body, the top of the telescopic rod of the second telescopic cylinder is provided with a U-shaped mounting block, a second rotating shaft is movably arranged on the U-shaped mounting block through a bearing seat three, a driving wheel is arranged on the second rotating shaft, an antiskid rubber pad is arranged on the outer wall of the driving wheel, a second motor is arranged on the top of the U-shaped mounting block, and the transmission end of the second motor is connected with the top end of the second rotating shaft.

[0012] As a preferred scheme of the present application, the surface of the wheel clamp is provided with an elastic buffer pad.

[0013] Compared with the prior art, the above technical scheme of the present application has the following beneficial technical effects: The present application adopts independent gas and liquid paths to transport gas and liquid to the gas-liquid mixing cavity, and the gas and liquid are sprayed out from the multiple nozzles in the form of uniform gas-liquid two-phase flow after being fully mixed. This design can flexibly adjust the gas-liquid mixing ratio and the spraying pressure according to different wafer materials and stain types, realize omnibearing and high-precision cleaning of the wafer surface, and effectively remove various stubborn stains and impurities.

[0014] In the blowing assembly of the application, the air pump pressurizes the gas into the U-shaped air disc, and the high-speed airflow is blown to the wafer surface through the densely distributed micro air nozzle. The centrifugal force generated by the cooperation of the driving assembly and the continuous rotation of the wafer can quickly and completely blow off the residual water stains and dirt, avoid water stains and secondary pollution, significantly improve the drying effect after wafer cleaning, and ensure that the wafer surface meets the extremely high cleanliness requirement.

[0015] The various components of the application are linked through an electrical control system. The entire process from wafer loading, fixing, cleaning, drying to unloading can be automatically completed, reducing manual intervention, reducing human operation error and labor intensity, improving production efficiency. At the same time, the running state of each component can be monitored and adjusted in real time, such as the clamping force of the clamping wheel, the gas-liquid flow, the wafer rotation speed and other parameters can be flexibly set according to the actual demand, meeting the diversified cleaning needs of different production scenes.

[0016] The application can realize accurate vertical positioning of the wafer through the cooperation of the telescopic cylinder I and the sliding sleeve in the lifting material supporting assembly, and ensure stable conveying of the wafer to the fixed area; the fixed assembly utilizes the bidirectional screw to drive the symmetric clamping wheels to move synchronously, and the elastic buffer pad can also avoid surface damage caused by excessive clamping force, ensuring the stability and safety of the wafer during the cleaning process. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the application; Figure 2 It is a schematic diagram of the U-shaped installation main body structure of the application; Figure 3 It is a side view of the lifting material supporting assembly of the application; Figure 4 It is a schematic diagram of the fixed assembly structure of the application; Figure 5 It is a schematic diagram of the fixed assembly structure of the application after removing the second fixed shell; Figure 6 It is Figure 5 It is an enlarged view of A in the application; Figure 7 It is a schematic diagram of the clamping wheel structure of the application; Figure 8 It is a schematic diagram of the gas-liquid mixing assembly structure of the application; Figure 9 It is a schematic diagram of the blowing assembly structure of the application; Figure 10 It is a schematic diagram of the driving assembly structure of the application; Figure 11 It is a schematic diagram of the driving wheel structure of the application.

[0018] The drawings are marked: U-shaped mounting body 1, mounting ring stand 10, lifting material supporting assembly 2, first fixed shell 20, telescopic cylinder one 21, sliding sleeve 22, fixed plate 23, screw 24, top shell 25, fixed assembly 3, second fixed shell 30, bearing seat one 31, bidirectional lead screw 32, mounting bracket one 33, mounting bracket two 34, motor one 35, coupling 36, semicircular frame 37, driving block 38, nut 39, rotatable clamping piece 300, inverted L-shaped plate 310, rotating shaft one 311, bearing seat two 312, clamping wheel 313, gas-liquid mixing assembly 4, liquid storage tank 40, liquid pump 41, delivery pipe one 42, delivery pipe two 43, gas-liquid mixing cavity 44, high-pressure gas tank 45, delivery pipe three 46, gas pressure reducing valve 47, delivery pipe four 48, flow control valve 49, delivery pipe five 410, delivery pipe six 411, mixing nozzle 412, nozzle 413, blowing assembly 5, air pump 50, delivery pipe seven 51, U-shaped air disc 52, air nozzle 53, driving assembly 6, telescopic cylinder two 60, U-shaped mounting block 61, motor two 62, rotating shaft two 63, bearing seat three 64, driving wheel 65, antiskid rubber pad 66. DETAILED DESCRIPTION

[0019] To make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below with specific embodiments and with reference to the drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present application. In addition, in the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0020] As Figures 1-11 shown, the present application proposes a gas-liquid mixing blowing single-piece cleaning device. The device takes U-shaped mounting body 1 as the basic frame, realizes efficient cleaning of wafers through precise mechanical structure and pipeline connection between each component, and the specific connection structure is as follows: The first fixed shell 20 is stably arranged on the inner bottom surface of the U-shaped mounting body 1, and the internal space is used for mounting the telescopic cylinder one 21. The first fixed shell 20 is provided with a sliding sleeve 22 at the top, and the telescopic rod of the telescopic cylinder one 21 is adapted to the sliding sleeve 22 and can move vertically along the sliding sleeve 22. The telescopic rod is connected to the fixed plate 23 at the top, and the fixed plate 23 is tightly connected with the top shell 25 through a plurality of screws 24, so that the top shell 25 is stably sleeved outside the first fixed shell 20, forming a lifting material supporting structure for carrying wafers; A second fixed shell 30 is installed on the inner wall of one side of the U-shaped installation body 1. A pair of bearing seats 31 is arranged in the second fixed shell 30, and a double-way screw 32 is rotatably arranged in the second fixed shell 30 through the bearing seats 31. An installation rack 33 extends from one side of the second fixed shell 30. A motor 35 is installed on the installation rack 33. The transmission end of the motor 35 is coaxially connected with one end of the double-way screw 32 through a shaft coupling 36. A pair of driving blocks 38 is symmetrically arranged in the second fixed shell 30 and is sleeved on the double-way screw 32. A screw nut 39 on the driving block 38 is in threaded transmission cooperation with the double-way screw 32. A semicircular frame 37 is connected to the front end of the driving block 38. A rotatable clamping piece 300 composed of a pair of inverted L-shaped plates 310, a pair of bearing seats 312, a rotating shaft 311 and a clamping wheel 313 is arranged on the semicircular frame 37. The inverted L-shaped plates 310 are symmetrically arranged on the upper and lower sides of the semicircular frame 37. The bearing seats 312 are installed between the two inverted L-shaped plates 310. The rotating shaft 311 penetrates through the bearing seats 312. The clamping wheel 313 is installed on the rotating shaft 311. The rotating shaft 311 and the clamping wheel 313 constitute a wafer fixing assembly 3. A gas-liquid mixing assembly 4 is arranged on the outer wall of one side of the U-shaped installation body 1. A liquid storage tank 40 is connected with the input end of a liquid pump 41 through a delivery pipe 42. The liquid pump 41 is installed on the top of the second fixed shell 30. The output end of the liquid pump 41 is communicated with a gas-liquid mixing cavity 44 through a delivery pipe 43. A high-pressure gas tank 45 is connected with a gas pressure reducing valve 47 through a delivery pipe 46. The gas pressure reducing valve 47 is connected with the gas-liquid mixing cavity 44 in sequence through a delivery pipe 48, a flow control valve 49 and a delivery pipe 410. The output end of the gas-liquid mixing cavity 44 is connected with a mixing spray head 412 through a delivery pipe 411. A plurality of nozzles 413 for spraying gas-liquid mixture are arranged on the bottom of the mixing spray head 412. In addition, a pair of installation ring frames 10 is arranged on the outer side of the U-shaped installation body 1, which is used for fixing the liquid storage tank 40 and the high-pressure gas tank 45. An installation rack 34 on the top of the second fixed shell 30 is used for placing the gas-liquid mixing cavity 44. A gas pump 50 is installed on the top of the U-shaped installation body 1 far away from the gas-liquid mixing assembly 4. The output end of the gas pump 50 is connected with a delivery pipe 51. The other end of the delivery pipe 51 is connected with a U-shaped gas disc 52. The U-shaped gas disc 52 is arranged outside the mixing spray head 412 and is provided with a plurality of gas nozzles 53 on the bottom. The U-shaped gas disc 52 constitutes a blowing assembly 5. A driving assembly 6 is arranged on the outer wall of the side of the U-shaped installation body 1 far away from the gas-liquid mixing assembly 4. A telescopic cylinder 60 is installed on the outer wall. The telescopic rod of the telescopic cylinder 60 penetrates through the U-shaped installation body 1, and the top of the telescopic rod is connected with a U-shaped installation block 61. A rotating shaft 63 is rotatably arranged on the U-shaped installation block 61 through a bearing seat 64. A driving wheel 65 is installed on the rotating shaft 63. A non-slip rubber pad 66 is arranged on the outer wall of the driving wheel 65. A motor 62 is installed on the top of the U-shaped installation block 61. The transmission end of the motor 62 is connected with the top end of the rotating shaft 63, so that the rotating shaft 63 and the driving wheel 65 can be driven to rotate.

[0021] In use, first, the wafer is placed on the top of the top shell 25, and the wafer is ensured to be closely attached to the top shell 25, and the operator starts the telescopic cylinder 21 through the control system, the telescopic arm inside the telescopic cylinder 21 is driven to extend, and the top shell 25 is vertically moved to send the wafer into the center of the clamping area composed of two semicircular frames 37; Then, the motor 35 is started to drive the bidirectional screw rod 32 to rotate, and the two side screw nuts 39 are moved inward synchronously under the meshing effect of the threads, and each clamping wheel 313 is equipped with an elastic buffer pad to firmly fix the wafer and avoid surface damage; After the wafer is fixed, the telescopic cylinder 21 is retracted to the initial position, and the telescopic cylinder 2 is started immediately, the telescopic rod pushes the driving wheel 65 assembly to translate, and the driving wheel 65 is pressed against the edge of the wafer, the motor 2 drives the driving wheel 65 to rotate through the driving shaft 2, and the wafer is uniformly rotated under the support of the clamping wheel 313 by the friction torque; Subsequently, the high-pressure gas tank 45 and the liquid pump 41 are opened, the gas and the cleaning liquid are respectively delivered to the gas-liquid mixing chamber 44 through independent pipelines, the gas and the liquid are fully mixed to form a uniform gas-liquid two-phase flow under the action of the special structure in the chamber, and the two-phase flow is introduced into the mixed nozzle 412 through the pipeline and sprayed out from the multiple nozzles 413 to wash the wafer surface in all directions; After the washing is completed, the high-pressure gas tank 45 and the liquid pump 41 are closed, and the gas pump 50 is opened, the gas pump 50 pressurizes the gas and introduces the gas into the U-shaped air disc 52, and the gas is blown to the wafer surface at a high speed through the densely distributed micro air nozzles 53, under the action of the centrifugal force generated by the continuous rotation of the wafer, the remaining dirt and water stains are quickly blown off and thrown away, and the final drying and cleaning are completed, and after the process is completed, each component is reset in turn, and the wafer after the cleaning is completed can be taken out.

[0022] It should be understood that the above specific embodiments of the present application are only used for illustrative or explanatory purposes of the principles of the present application, and do not constitute a limitation on the present application. Therefore, any modification, equivalent replacement, improvement, etc. made without departing from the spirit and scope of the present application shall be included in the protection scope of the present application. In addition, the appended claims of the present application are intended to cover all changes and modifications falling within the scope and boundary of the appended claims, or the equivalent forms of such scope and boundary.

Claims

1. A gas-liquid mixed purge single-wafer cleaning device, comprising a U-shaped mounting body (1), characterized in that: A lifting and supporting component (2) is provided on the inner bottom surface of the U-shaped installation body (1), a fixing component (3) is provided on the inner wall of one side of the U-shaped installation body (1), a gas-liquid mixing component (4) is provided on the outer wall of the same side of the U-shaped installation body (1), a purge component (5) is provided on the top of the side of the U-shaped installation body (1) away from the gas-liquid mixing component (4), and a driving component (6) is provided on the outer wall of the side of the U-shaped installation body (1) away from the gas-liquid mixing component (4).

2. A gas-liquid mixed purge single-wafer cleaning device according to claim 1, characterized in that: The lifting support assembly (2) includes a first fixed shell (20) arranged on a U-shaped mounting body (1), a telescopic cylinder (21) is arranged in the first fixed shell (20), a sliding sleeve (22) is arranged on the top of the first fixed shell (20), a telescopic rod of the telescopic cylinder (21) is arranged in the sliding sleeve (22), and a fixing plate (23) is arranged on the top of the telescopic rod, the fixing plate (23) is fixed to the top shell (25) by a plurality of screws (24), and the top shell (25) is sleeved on the outside of the first fixed shell (20).

3. A gas-liquid mixed purge single wafer cleaning device according to claim 1, characterized in that: The fixing assembly (3) includes a second fixing (30) arranged on the inner wall of the U-shaped mounting body (1), a bidirectional lead screw (32) is movably arranged in the second fixing shell (30) through a pair of bearing seats (31), a mounting frame (33) is arranged on one side of the second fixing shell (30), a motor (35) is arranged on the mounting frame (33), a transmission end of the motor (35) is connected to one end of the bidirectional lead screw (32) through a coupling (36), a pair of driving blocks (38) are symmetrically arranged in the second fixing shell (30), and the driving blocks (38) are sleeved on the bidirectional lead screw (32), a nut (39) is arranged on the driving block (38), and the nut (39) is threadedly arranged on the bidirectional lead screw (32), a semicircular frame (37) is arranged at the front end of the driving block (38), and a plurality of rotatable clamping members (300) are arranged on the semicircular frame (37).

4. A gas-liquid mixed purge single wafer cleaning device according to claim 3, characterized in that: The rotatable clamping member (300) includes a pair of inverted L-shaped plates (310), the two inverted L-shaped plates (310) are symmetrically arranged on the upper and lower sides of the semicircular frame (37), and a rotating shaft (311) is movably arranged between the two inverted L-shaped plates (310) through a pair of bearing seats (312), and a clamping wheel (313) is arranged on the rotating shaft (311).

5. A gas-liquid mixed purge single wafer cleaning device according to claim 1, characterized in that: The gas-liquid mixing assembly (4) includes a liquid storage tank (40), the liquid storage tank (40) is connected to the input end of the liquid pump (41) through a first delivery pipe (42), and the first delivery pipe (42) extends to the inner bottom of the liquid storage tank (40), the liquid pump (41) is arranged on the top of the second fixed shell (30), and the output end of the liquid pump (41) is connected to the gas-liquid mixing chamber (44) through a second delivery pipe (43), and the gas-liquid mixing assembly (4) also includes a high-pressure gas tank (45), and the high-pressure gas tank (45) is connected to the gas-liquid mixing chamber (44) through a third delivery pipe ( 46) is connected to the gas pressure reducing valve (47), the other end of the gas pressure reducing valve (47) is provided with a delivery pipe four (48), the other end of the delivery pipe four (48) is provided with a flow control valve (49), the other end of the flow control valve (49) is connected to the gas-liquid mixing chamber (44) through the delivery pipe five (410), the output end of the gas-liquid mixing chamber (44) is connected to the mixing nozzle (412) through the delivery pipe six (411), and the bottom of the mixing nozzle (412) is provided with a plurality of nozzles (413).

6. A gas-liquid mixed purge single wafer cleaning device according to claim 5, characterized in that: A pair of mounting ring frames (10) are provided on the outside of the U-shaped mounting body (1), the liquid storage tank (40) and the high-pressure gas tank (45) are both fixed on the two mounting ring frames (10), a second mounting frame (34) is provided on the top of the second fixed shell (30), and the gas-liquid mixing chamber (44) is provided on the top of the second mounting frame (34).

7. A gas-liquid mixed purge single wafer cleaning device according to claim 5, characterized in that: The purge assembly (5) comprises an air pump (50) arranged on the top of the U-shaped mounting body (1), a delivery pipe (51) being provided at the output end of the air pump (50), a U-shaped air disc (52) being provided at the other end of the delivery pipe (51), the U-shaped air disc (52) being arranged outside the mixing nozzle (412), and a plurality of air nozzles (53) being provided at the bottom of the U-shaped air disc (52).

8. A gas-liquid mixed purge single-wafer cleaning device according to claim 1, characterized in that: The driving assembly (6) includes a second telescopic cylinder (60), which is arranged on the outer wall of the U-shaped mounting body (1). After the telescopic rod of the second telescopic cylinder (60) passes through the U-shaped mounting body (1), a U-shaped mounting block (61) is arranged on the top of the telescopic rod. A second rotating shaft (63) is movably arranged on the U-shaped mounting block (61) through a third bearing seat (64). A driving wheel (65) is arranged on the second rotating shaft (63). An anti-slip rubber pad (66) is arranged on the outer wall of the driving wheel (65). A second motor (62) is arranged on the top of the U-shaped mounting block (61), and a transmission end of the second motor (62) is connected to the top of the second rotating shaft (63).

9. A gas-liquid mixed purge single wafer cleaning device according to claim 4, characterized in that: An elastic buffer pad is provided on the surface of the clamping wheel (313).

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