Wafer cleaning apparatus with flow rate regulation function

Abstract

The application discloses a wafer cleaning equipment with a flow rate regulating function, and relates to the technical field of cleaning equipment.The cleaning equipment comprises an ultrasonic strong-acid cleaning mechanism, a circulating waterway cleaning mechanism, a drying cleaning mechanism, a temperature control mechanism and a cleaning body, the ultrasonic strong-acid cleaning mechanism is fastened to the cleaning body, the circulating waterway cleaning mechanism is fastened to the cleaning body, the drying cleaning mechanism is fastened to the cleaning body, the temperature control mechanism is fastened to the cleaning body, the strong-acid cleaning mechanism is located at the lowermost position, preliminary decontamination is completed, and acid liquid leakage is avoided; the middle circulating waterway cleaning mechanism realizes constant-temperature ultrapure water rinsing, and ensures complete cleaning; the upper drying mechanism utilizes hot air to dry the wafer surface, and prevents water stain residue; and the temperature control mechanism maintains the stability of the cleaning temperature.The vertical process design conforms to the gravity flow direction, the structure is compact and high in sealing performance, and the cleaning efficiency and reliability are significantly improved.

Description

Technical Field

[0001] This invention relates to the field of cleaning equipment technology, specifically a wafer cleaning device with flow rate control function. Background Technology

[0002] As semiconductor manufacturing processes continue to shrink, the cleanliness of the wafer surface has an increasingly significant impact on the performance of the final device, making the cleaning process a critical link in process control. Currently, wafer cleaning technology widely adopts a multi-stage process, including pre-cleaning, acid washing, rinsing, and drying, combined with ultrapure water, high-efficiency chemical solutions, and ultrasonic methods to comprehensively remove particles, organic matter, and metal ions.

[0003] In existing wafer cleaning equipment, some systems use a combination of fixed spray devices and static liquid tanks to achieve segmented cleaning with strong acid and ultrapure water.

[0004] First, existing technologies generally lack the ability to adjust the direction, velocity, and temperature of liquid flow in a multi-variable manner, and lack adaptive and controllable flow rate adjustment. Second, the cleaning medium switching structure in traditional devices does not adopt a design that combines a strong acid-resistant spherical segment switching plate with a hydraulic lifting device, making it impossible to achieve high-sealing vertical switching in strong acid and ultrapure water environments. Therefore, those skilled in the art have provided a wafer cleaning device with flow rate regulation function to solve the problems mentioned in the background. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer cleaning device with flow rate regulation function to solve the problems mentioned in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] The cleaning equipment includes an ultrasonic strong acid cleaning mechanism, a circulating water cleaning mechanism, a drying cleaning mechanism, a temperature control mechanism, and a cleaning body. The ultrasonic strong acid cleaning mechanism is securely connected to the cleaning body, the circulating water cleaning mechanism is securely connected to the cleaning body, the drying cleaning mechanism is securely connected to the cleaning body, and the temperature control mechanism is securely connected to the cleaning body. The ultrasonic strong acid cleaning mechanism is located below the circulating water cleaning mechanism, and the drying cleaning mechanism is located above the circulating water cleaning mechanism. The cleaning equipment also includes a pre-cleaning frame, a cleaning rack, a cleaning gear set, and a pre-cleaning motor. The pre-cleaning frame is securely connected to the drying cleaning mechanism, the pre-cleaning motor is securely connected to the pre-cleaning frame, the pre-cleaning motor is driven by the cleaning gear set, and the cleaning gear set is driven by the cleaning rack.

[0008] By adopting the above technical solutions, the cleaning equipment achieves a vertical flow arrangement from strong acid pre-cleaning, ultrapure water circulating cleaning to hot air drying, improving wafer cleaning efficiency and contamination isolation capabilities. The ultrasonic strong acid cleaning mechanism is located at the bottom for initial strong acid removal; it is firmly connected to the cleaning body, ensuring the stability of the acid tank structure and preventing strong acid leakage and vibration interference. A circulating water cleaning mechanism is located in the middle, enabling ultrapure water rinsing of the wafers after strong acid cleaning. It is firmly connected to the cleaning body and provides a constant temperature rinsing environment under temperature control, ensuring thorough cleaning and uniform water temperature. A drying cleaning mechanism is located at the top, using a hot air fan to quickly dry the surface of the cleaned wafers, effectively preventing water residue from causing contamination or corrosion. This structure is also rigidly connected to the cleaning body, improving the overall machine's shock resistance and rigidity. A temperature control mechanism is located on one side of the machine and firmly connected to it, maintaining the temperature stability of each cleaning medium throughout the cleaning process through circulating water or a heating module, effectively preventing thermal stress damage to the wafers caused by temperature differences. The pre-cleaning motor drives the cleaning gear set through the motor shaft, which in turn drives the cleaning rack on it to rotate, thereby rotating the wafer. Centrifugal force is used to effectively remove impurities and droplets attached to the wafer surface, improving cleaning and drying efficiency. The wafer connected to the cleaning rack continues to rotate, achieving "cleaning while rotating". This creates a bottom-up cleaning-rinsing-drying process flow in the cleaning equipment, which conforms to the gravity-coordinated conveying logic, improving cleaning efficiency and system compactness. At the same time, the rigid connection between multiple mechanisms improves the overall structural stability and sealing, significantly enhancing the cleaning quality, consistency and reliability of the equipment.

[0009] Furthermore, the ultrasonic strong acid cleaning mechanism includes a wafer cleaning glass tank, an ultrasonic cleaning tank, an ultrasonic device, and a wafer lifting assembly. The wafer cleaning glass tank and the ultrasonic cleaning tank are securely connected. The ultrasonic cleaning tank has an ultrapure water inlet and an ultrapure water outlet. The cross-sectional area of ​​the ultrapure water inlet is larger than that of the ultrapure water outlet. The wafer cleaning glass tank is used to contain the strong acid cleaning solution, and the ultrasonic cleaning tank is used to contain the ultrapure water medium. The ultrapure water inlet and the ultrasonic cleaning tank are connected, and the ultrasonic cleaning tank and the ultrapure water outlet are connected. The wafer lifting assembly and the ultrasonic cleaning tank are securely connected, and the ultrasonic device and the ultrasonic cleaning tank are securely connected. The ultrasonic device is located inside the ultrasonic cleaning tank.

[0010] By adopting the above technical solution, the ultrasonic strong acid cleaning mechanism achieves efficient switching and segmented cleaning operations for wafers in both strong acid and ultrapure water media. The wafer cleaning glass tank, used to hold the strong acid cleaning solution, is made of acid-resistant and transparent material, facilitating observation of the cleaning process and withstanding highly corrosive liquids. The ultrasonic cleaning tank holds the ultrapure water medium and has an ultrapure water inlet and outlet. The inlet cross-sectional area is larger than the outlet cross-sectional area, creating an internal pressure difference during cleaning. This promotes a stable top-down flow of ultrapure water, improving rinsing efficiency and preventing liquid stagnation. The ultrapure water inlet is connected to the ultrasonic cleaning tank, ensuring rapid injection of high-purity water into the tank, while the outlet connects to an external drainage channel. This design facilitates the timely removal of impurities by the water flow; the ultrasonic device is securely installed inside the ultrasonic cleaning tank, using high-frequency oscillation to generate cavitation effects in the liquid, thus peeling and dispersing microparticles and residues on the wafer surface; the wafer lifting assembly is securely connected to the ultrasonic cleaning tank, enabling the wafer to switch between the glass tank and the ultrasonic cleaning tank for segmented cleaning in different liquid environments, improving the multi-layered cleaning and thoroughness of contamination removal; the rigid support structure between the various components ensures structural stability and sealing reliability during the cleaning process, thereby achieving the combined removal of particulate contamination, organic contamination, and chemical residues on the wafer surface, significantly improving the overall cleaning accuracy and cleanliness level.

[0011] Furthermore, the wafer lifting assembly includes a lifting rod, a lifting hydraulic cylinder, a switching plate, and a first suction cup. The lifting rod, the switching plate, and the first suction cup are made of acid-resistant material. The lifting hydraulic cylinder is fastened to the ultrasonic cleaning tank, the lifting hydraulic cylinder is driven to the lifting rod, the lifting rod is driven to the first suction cup, the switching plate is fastened to the lifting rod, and the switching plate abuts against the circulating water cleaning mechanism. The switching plate is spherical in shape.

[0012] By adopting the above technical solution, the wafer lifting assembly achieves high-precision vertical switching and positioning between the strong acid cleaning tank and the circulating water cleaning mechanism, improving the continuity and linkage efficiency of the cleaning process. The lifting hydraulic cylinder is firmly connected to the ultrasonic cleaning tank, serving as the core drive. It hydraulically drives the lifting rod up and down. The lifting rod is made of a strong acid-resistant material, ensuring it will not corrode or deform during long-term operation in a strong acid environment. One end is connected to the hydraulic cylinder, and the other end is connected to the first suction cup, allowing the suction cup to rise and fall synchronously with the lifting rod. The first suction cup is also made of a strong acid-resistant material and has a vacuum adsorption function, used to firmly clamp the wafer and prevent displacement or damage during the cleaning process. The switching plate is firmly connected to the lifting rod and moves with it. Its shape is similar to a spherical cap, allowing it to precisely engage with the circulating water cleaning mechanism above during vertical lifting, achieving liquid environment conversion and structural alignment during the cleaning process. The spherical cap structure of the switching plate gives it self-guiding capability during docking and disengagement, improving the stability and sealing of the linkage transition. The overall structure ensures efficient lifting and sealing of the wafer in the multi-media cleaning path, achieving the technical effects of improving cleaning efficiency, reducing the risk of contamination transfer, and enhancing the system's automated control.

[0013] Furthermore, the circulating water cleaning mechanism includes an iris module, a circulation tank, and an adjustment module. The iris module and the adjustment module are fastened together, the adjustment module is connected to the circulation tank, the adjustment module is connected to the temperature control mechanism, the circulation tank is fastened together with the cleaning body, and the circulation tank is provided with a circulation chamber, which is spherical in shape. The adjustment module is located inside the circulation chamber.

[0014] By adopting the above technical solution, the circulating water cleaning mechanism can achieve precise control of the cleaning fluid flow rate, direction, and temperature, thereby ensuring the stability and cleanliness of the wafers during the rinsing process. The circulation tank, as the main structure, is firmly connected to the cleaning machine body, providing rigid support and carrying the cleaning fluid circulation system. It has a circulation chamber with a spherical cap structure, ensuring a uniform distribution of the internal liquid flow path and avoiding turbulent accumulation, thus contributing to flow field stability and efficient rinsing. The regulating component is located inside the circulation chamber, achieving internal flow regulation through spatial coordination with the chamber. This component is connected to the circulation tank and simultaneously to the temperature control mechanism, enabling temperature regulation of the cleaning fluid entering the circulation chamber. The iris assembly is firmly connected to the regulating assembly, serving to change the aperture and precisely control the flow rate, allowing for real-time adjustment of the rinsing intensity according to cleaning requirements. The overall structure achieves multi-variable linkage control of the ultrapure water rinsing path by adjusting the dynamic response of the components in the circulation chamber. Combined with the mechanical flow limiting function of the iris component and the thermal regulation capability of the temperature control mechanism, the entire rinsing process is carried out under stable temperature, constant flow rate and uniform distribution, thereby effectively improving the efficiency of residual liquid removal from the wafer surface, reducing the risk of particulate deposition, and improving the controllability and repeatability of the cleaning process.

[0015] Furthermore, the adjustment assembly includes a rotating block, a sliding block, a rotating motor, and a magnetostrictive element. The rotating block is spherical in shape and is rotatably connected to the circulation chamber. The sliding block is slidably connected to the rotating block. The iris assembly is fastened to the sliding block. The rotating block is provided with a sliding groove, which is arc-shaped. The sliding block is located in the sliding groove. There are four sliding blocks. Every two sliding blocks are fastened to the magnetostrictive element. The sliding block is connected to the circulation chamber. The rotating motor is fastened to the circulation box. The rotating motor is driven by the rotating block.

[0016] By adopting the above technical solution, the regulating component achieves dynamic and controllable adjustment of the circulating water flow cross-section and flow rate through mechanical linkage and magnetoelastic adjustment mechanism, thereby further improving the consistency of flow rate and temperature control accuracy during the cleaning process. The rotating block has a spherical notch structure and is rotatably connected to the circulation chamber. As the core rotating shaft component of the regulating component, its rotation will drive the internal structure to achieve flow channel adjustment. The rotating block is equipped with an arc-shaped sliding groove, in which four sliding blocks are arranged. The sliding blocks can slide tangentially along the arc-shaped groove, forming a radial displacement unit of the regulating structure. Every two sliding blocks are rigidly connected by a magnetoelastic element. When the magnetoelastic element expands and contracts under the action of an external temperature control signal, it drives the connected sliding blocks to slide synchronously, thereby achieving precise control of the flow channel opening. The sliding block is connected to the circulation chamber and can directly affect the liquid flow cross-section. Together with the flow-limiting orifice of the iris component, it completes the graded control of the rinsing intensity. The iris component is fixed to the sliding block by a fastening method, so that the position of the iris orifice moves precisely with the sliding block, forming a dynamic variable diameter of the flow channel. A rotating motor is fixedly mounted on the circulation tank, serving as a power source and driving the rotating block to rotate. This, in turn, drives the sliding block to achieve initial positioning and coarse adjustment. Fine adjustment is achieved by a magnetostrictive element that corrects micro-displacement. This structure forms a multi-level coordinated adjustment mechanism of "rotating block drive + sliding block displacement + magnetostrictive response + iris flow restriction," which not only achieves composite control of the cleaning fluid flow rate, channel angle, and cross-sectional shape, but also improves the system's response speed and flexible adjustment capability at different cleaning stages, effectively enhancing cleaning uniformity and liquid thermal field stability.

[0017] Furthermore, the circulation chamber is equipped with a baffle plate, and the section of the baffle plate is located at the center of the circulation chamber.

[0018] By adopting the above technical solution, the baffle structure on the circulation tank creates a stable flow distribution of the internal liquid as it flows through the circulation chamber, effectively improving the uniform distribution of the cleaning liquid. This baffle is located at the spherical center of the circulation chamber, serving as a geometric reference plane for flow field symmetry. It divides the liquid, regulated by the adjustment component, into two symmetrical flow zones (upper and lower, left and right), avoiding localized turbulence accumulation or impact displacement. Specifically, the baffle is made of rigid, heat-resistant material and fixed to the inner wall of the circulation tank via grooves or welding. Its position is precisely at the spherical center of the circulation chamber, ensuring its role in stabilizing the central flow direction and guiding the flow. During operation, the cleaning liquid, after being regulated by the adjustment component and entering the circulation chamber, is guided by the baffle into multiple uniform paths, thereby improving the hydraulic symmetry and surface coverage during rinsing, effectively avoiding cleaning dead zones or uneven rinsing. This structure further enhances the control precision of the adjustment component over the fluid direction and velocity, forming a spatial multi-point distributed spray pattern in conjunction with the iris component, significantly improving cleaning efficiency and repeatability, and ensuring uniform force and consistent cleanliness across all areas of the wafer surface.

[0019] Furthermore, the drying and cleaning mechanism includes a rotary motor, a rotating rod, a second suction cup, a downward hydraulic cylinder, a gear set, a gear frame, a fan, and a drying chamber. The rotary motor and the gear frame are fastened together, the rotary motor and the gear set are rotatably connected, the gear set and the rotating rod are drive-connected, the second suction cup and the rotating rod are fastened together, the downward hydraulic cylinder and the drying chamber are fastened together, the downward hydraulic cylinder and the gear frame are drive-connected, and the drying chamber and the cleaning machine body are fastened together.

[0020] By adopting the above technical solution, the drying and cleaning mechanism achieves rapid, efficient, and uniform drying of the cleaned wafers through a combination of rotary clamping and hot air-linked drying. A rotary motor, fixed to a gear carrier, serves as the power source and is rotatably connected to a gear set via a rotary output shaft. The gear set transmits rotational power to a rotating rod, which drives a second suction cup, tightly connected to it, to rotate, thus achieving synchronous rotation of the clamped wafers. This rotational action allows liquid on the wafer surface to be quickly discharged under centrifugal force, reducing drying time and residual liquid volume. A downward hydraulic cylinder is tightly connected to the drying chamber and is driven by the gear carrier, undertaking the lifting and lowering action of vertically moving the gear carrier and its connected rotating structure into or out of the drying chamber, achieving precise positioning and height adjustment of the wafers from the cleaning position to the drying chamber. A fan, acting as a hot air supply device, is located on one side of the drying chamber, providing directional airflow into the drying chamber to promote the evaporation and removal of residual moisture on the wafer surface, achieving uniform drying of the entire surface in conjunction with the rotational action. The drying chamber and cleaning unit are securely connected to form a closed drying space with excellent thermal insulation and dustproof performance, effectively preventing secondary contamination during the drying process. The overall structure forms a multi-effect linkage drying system of "vertical transfer + rotary drive + hot air drying", which not only improves drying efficiency and uniformity, but also ensures stable operation of the equipment through a compact mechanical layout, further guaranteeing the cleanliness and integrity of the wafers at the end of the cleaning process.

[0021] Furthermore, the temperature control mechanism includes a temperature sensor, a circulation pipe, a cooling tank, a circulation pump, and a heating tank. The temperature sensor is securely connected to the cleaning machine body. The circulation pipe is spiral-shaped and connected to a sliding block, a circulation pump, a heating tank, a cooling tank, and a circulation pipe.

[0022] By adopting the above technical solution, the temperature sensor is firmly connected to the cleaning machine body, monitoring the temperature status of key areas of the equipment in real time and feeding the data back to the control system for closed-loop regulation. The circulation pipe has a spiral structure, increasing the heat transfer area and extending the heat exchange path to improve cooling or heating efficiency. One end of the pipe is connected to the sliding block, allowing the flowing heat-regulating liquid to directly act on the regulating components, achieving fine-tuning control of the cleaning liquid channel temperature. The circulation pipe is also connected to the circulation pump, which provides continuous power to drive the temperature-controlled liquid in a closed loop within the system. The circulation pump is connected to the heating box, which acts as a high-temperature source to heat the circulation liquid. When the temperature is lower than the set value, heating is activated to raise the overall system temperature. The heating box is then connected to the cooling box, which achieves a cooling effect through built-in refrigerant or heat exchange plates. When the system temperature is too high, the circulation liquid is guided into the cooling section to release heat. Finally, the cooled liquid returns to the circulation pipe, forming a constant-temperature closed-loop regulation loop. This structure utilizes a local feedback node composed of a temperature sensor and a spiral circulation tube, combined with dual-channel heat source regulation of the heating and cooling chambers. While improving temperature control accuracy, it also has good response speed and thermal inertia control capabilities, thereby effectively avoiding thermal stress impact on the wafer caused by temperature fluctuations in the cleaning solution, and further improving cleaning stability and process consistency.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] This cleaning equipment utilizes a dynamic adjustment assembly comprised of a circulation chamber, a spherical notch-shaped rotating block, and sliding blocks in an arc-shaped sliding groove. This, combined with an iris module and a magnetostrictive element, forms a linked control system. Four sliding blocks are connected in pairs via the magnetostrictive element, and under the rotational drive of the rotating block, they synchronously displace along the sliding groove, achieving gradual adjustment of the flow channel opening. The sliding blocks connect to the circulation chamber and precisely drive the iris module to change the morphology of the flushing orifice. Combined with the heat exchange effect of the spiral circulation tube, this allows for linked adjustment in three aspects: liquid flow direction, velocity, and heat conduction path, significantly improving flow field uniformity and temperature control stability. This multi-layered structure, with the spherical notch-shaped rotating block at its core, outperforms traditional linear throttling plates in terms of control precision and flexible response. The wafer lifting assembly uses a lifting hydraulic cylinder to drive the lifting rod vertically. The first suction cup clamps the wafer and connects to the circulating water cleaning mechanism via a switching plate. The switching plate, with its spherical notch design and rigid contact with the circulation chamber, forms a stable, self-guided sealed positioning during wafer movement and switching, ensuring seamless transition between cleaning media and minimizing positioning error. This structure relies on geometric self-fitting and anti-interference spherical notch positioning to replace photoelectric or sensor recognition methods, achieving precise transfer of wafers from strong acid to pure water environments. This effectively avoids cross-contamination and liquid interference, making it suitable for multi-stage liquid phase processing scenarios. The rotary motor in the drying and cleaning mechanism drives a gear set to rotate a rod, causing the second suction cup to hold the wafer and rotate at high speed. Combined with a fan providing directional hot air from one side of the drying chamber, this forms a "rotational centrifugal + hot air convection" composite drying mode. The rotational motion centrifugally ejects moisture, and the drying airflow covers the wafer radially, significantly improving drying efficiency. The gear frame is connected to a downward-moving hydraulic cylinder, allowing for precise movement of the wafer assembly into the enclosed space inside the drying chamber, preventing hot air escape and reducing the risk of external particulate contamination. Compared to static hot air drying devices, this mechanical linkage structure offers advantages such as shorter drying time, more uniform coverage, and lower contamination risk, making it particularly suitable for wafer manufacturing scenarios with extremely high cleanliness requirements. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the cleaning rack structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the ultrasonic strong acid cleaning mechanism of the present invention;

[0028] Figure 4 This is a schematic diagram of the ultrasonic cleaning tank structure of the present invention;

[0029] Figure 5 This is a schematic diagram of the wafer lifting component structure of the present invention;

[0030] Figure 6This is a schematic diagram of the circulating water cleaning mechanism of the present invention;

[0031] Figure 7 This is a schematic diagram of the adjustment component structure of the present invention;

[0032] Figure 8 This is a schematic diagram of the rotating motor structure of the present invention;

[0033] Figure 9 This is a schematic diagram of the drying and cleaning mechanism of the present invention.

[0034] In the diagram: 1. Ultrasonic strong acid cleaning mechanism; 11. Wafer cleaning glass tank; 12. Ultrasonic cleaning tank; 121. Ultrapure water inlet; 122. Ultrapure water outlet; 13. Ultrasonic device; 14. Wafer lifting assembly; 141. Lifting rod; 142. Lifting hydraulic cylinder; 143. Switching plate; 144. First suction cup; 2. Circulating water cleaning mechanism; 21. Iris assembly; 22. Circulation tank; 221. Circulation chamber; 222. Baffle; 23. Adjustment assembly; 231. Rotating block; 2311. Sliding groove 232. Sliding block; 233. Rotary motor; 234. Magnetostrictive element; 3. Drying and cleaning mechanism; 31. Rotary motor; 32. Rotating rod; 33. Second suction cup; 34. Lowering hydraulic cylinder; 35. Gear set; 36. Gear frame; 37. Fan; 38. Drying oven; 4. Temperature control mechanism; 41. Temperature sensor; 42. Circulation pipe; 43. Cooling box; 44. Circulation pump; 45. Heating box; 5. Cleaning body; 6. Cleaning rack; 7. Cleaning rack; 8. Cleaning gear set; 9. Pre-cleaning motor. Detailed Implementation

[0035] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see Figure 1 - Figure 9 As shown, the present invention provides a wafer cleaning equipment technical solution with flow rate regulation function:

[0037] The cleaning equipment includes an ultrasonic strong acid cleaning mechanism 1, a circulating water cleaning mechanism 2, a drying cleaning mechanism 3, a temperature control mechanism 4, and a cleaning body 5. The ultrasonic strong acid cleaning mechanism 1 and the cleaning body 5 are securely connected. The circulating water cleaning mechanism 2 and the cleaning body 5 are securely connected. The drying cleaning mechanism 3 and the cleaning body 5 are securely connected. The temperature control mechanism 4 and the cleaning body 5 are securely connected. The ultrasonic strong acid cleaning mechanism 1 is located below the circulating water cleaning mechanism 2, and the drying cleaning mechanism 3 is located above the circulating water cleaning mechanism 2. The cleaning equipment also includes a pre-cleaning frame 6, a cleaning rack 7, a cleaning gear set 8, and a pre-cleaning motor 9. The pre-cleaning frame 6 and the drying cleaning mechanism 3 are securely connected. The pre-cleaning motor 9 and the pre-cleaning frame 6 are securely connected. The pre-cleaning motor 9 and the cleaning gear set 8 are connected in a driving connection. The cleaning gear set 8 and the cleaning rack 7 are connected in a driving connection.

[0038] By adopting the above technical solutions, the cleaning equipment achieves a vertical process layout from strong acid pre-cleaning, ultrapure water circulation cleaning to hot air drying in its structural configuration, improving wafer cleaning efficiency and contamination isolation capabilities. The ultrasonic strong acid cleaning mechanism 1 is located at the bottom for initial strong acid removal. It is firmly connected to the cleaning body 5, ensuring the stability of the acid washing tank structure and preventing strong acid leakage and vibration interference. The circulating water cleaning mechanism 2 is located in the middle, enabling ultrapure water rinsing of the wafers after strong acid cleaning. It is firmly connected to the cleaning body 5 and can provide a constant temperature rinsing environment under temperature control, ensuring thorough cleaning and uniform water temperature. The top is equipped with a drying cleaning mechanism 3, which uses a hot air fan 37 to quickly dry the surface of the cleaned wafers, effectively preventing water stains from causing contamination or corrosion. This structure is also rigidly fixed to the cleaning body 5, improving the overall machine's shock resistance and rigidity. The temperature control mechanism 4 is located on one side of the machine body and is securely connected to it. It is used to maintain the temperature stability of each cleaning medium throughout the cleaning process through circulating water or a heating module, effectively preventing thermal stress damage to the wafer caused by temperature difference shocks. The pre-cleaning motor 9 drives the cleaning gear set 8 through the motor shaft, thereby driving the cleaning rack 7 on it to rotate, which in turn drives the wafer to rotate. Centrifugal force is used to effectively throw off impurities and droplets attached to the wafer surface, improving cleaning and drying efficiency. The wafer connected to the cleaning rack 7 continues to rotate, realizing "cleaning while rotating". This makes the cleaning equipment form a bottom-up cleaning-rinsing-drying process flow, which conforms to the gravity-coordinated conveying logic, improves cleaning efficiency and system compactness. At the same time, the rigid connection between multiple mechanisms improves the overall structural stability and sealing, significantly enhancing the cleaning quality, consistency and reliability of the equipment.

[0039] Furthermore, the ultrasonic strong acid cleaning mechanism 1 includes a wafer cleaning glass tank 11, an ultrasonic cleaning tank 12, an ultrasonic device 13, and a wafer lifting assembly 14. The wafer cleaning glass tank 11 and the ultrasonic cleaning tank 12 are fastened together. The ultrasonic cleaning tank 12 is provided with an ultrapure water inlet 121 and an ultrapure water outlet 122. The cross-sectional area of ​​the ultrapure water inlet 121 is larger than the cross-sectional area of ​​the ultrapure water outlet 122. The wafer cleaning glass tank 11 is used to contain the strong acid cleaning solution, and the ultrasonic cleaning tank 12 is used to contain the ultrapure water medium. The ultrapure water inlet 121 is connected to the ultrasonic cleaning tank 12, and the ultrasonic cleaning tank 12 is connected to the ultrapure water outlet 122. The wafer lifting assembly 14 is fastened together with the ultrasonic cleaning tank 12, and the ultrasonic device 13 is fastened together with the ultrasonic cleaning tank 12. The ultrasonic device 13 is located inside the ultrasonic cleaning tank 12.

[0040] By adopting the above technical solution, the ultrasonic strong acid cleaning mechanism 1 achieves efficient switching and segmented cleaning operations for wafers in both strong acid and ultrapure water media. The wafer cleaning glass tank 11, serving as the container for the strong acid cleaning solution, is made of acid-resistant transparent material, facilitating observation of the cleaning process and withstanding highly corrosive liquids. The ultrasonic cleaning tank 12 holds the ultrapure water medium and is equipped with an ultrapure water inlet 121 and an ultrapure water outlet 122. The inlet cross-sectional area is larger than the outlet cross-sectional area, creating an internal pressure difference during the cleaning process. This promotes a stable top-to-bottom flow of ultrapure water, improving rinsing efficiency and preventing liquid stagnation. The ultrapure water inlet 121 is connected to the ultrasonic cleaning tank 12, ensuring rapid injection of high-purity water into the cleaning tank. The outlet is connected to the external... The drainage channel facilitates the timely removal of impurities by the water flow; the ultrasonic device 13 is securely installed inside the ultrasonic cleaning tank 12, and uses high-frequency oscillation to excite the liquid to generate a cavitation effect, which peels and disperses microparticles and residues on the wafer surface; the wafer lifting assembly 14 is securely connected to the ultrasonic cleaning tank 12, enabling the wafer to switch up and down between the glass tank and the ultrasonic cleaning tank 12, and to be cleaned in stages under different liquid environments, improving the multi-level cleaning and the thoroughness of decontamination; the rigid support between the various parts is constructed by a secure connection to ensure the structural stability and sealing reliability during the cleaning process, thereby achieving the combined removal of particulate contamination, organic contamination and chemical residues on the wafer surface, significantly improving the overall cleaning accuracy and cleanliness level.

[0041] Furthermore, the wafer lifting assembly 14 includes a lifting rod 141, a lifting hydraulic cylinder 142, a switching plate 143, and a first suction cup 144. The lifting rod 141, the switching plate 143, and the first suction cup 144 are made of acid-resistant material. The lifting hydraulic cylinder 142 is fastened to the ultrasonic cleaning tank 12. The lifting hydraulic cylinder 142 is driven to the lifting rod 141. The lifting rod 141 is driven to the first suction cup 144. The switching plate 143 is fastened to the lifting rod 141. The switching plate 143 abuts against the circulating water cleaning mechanism 2. The switching plate 143 is spherical in shape.

[0042] By adopting the above technical solution, the wafer lifting assembly 14 achieves high-precision vertical switching and positioning between the strong acid cleaning tank and the circulating water cleaning mechanism 2, improving the continuity and linkage efficiency of the cleaning process. The lifting hydraulic cylinder 142 is firmly connected to the ultrasonic cleaning tank 12, serving as the driving core. It drives the lifting rod 141 up and down via hydraulic drive. The lifting rod 141 is made of a strong acid-resistant material, ensuring it will not corrode or deform during long-term operation in a strong acid environment. One end is connected to the hydraulic cylinder, and the other end is connected to the first suction cup 144, allowing the suction cup to rise and fall synchronously with the lifting rod 141. The first suction cup 144 is also made of a strong acid-resistant material and has a vacuum adsorption function, used to firmly clamp the wafer and prevent displacement or damage during the cleaning process. The switching disk 143 is securely connected to the lifting rod 141 and moves together with it. Its shape is similar to a spherical cap, allowing it to precisely engage with the circulating water cleaning mechanism 2 above during vertical lifting. This enables liquid environment conversion and structural alignment during the cleaning process. The spherical cap structure of the switching disk 143 provides self-guiding capability during docking and disengagement, improving the stability and sealing of the linkage transition. The overall structure ensures efficient lifting, lowering, and sealing of the wafer in the multi-media cleaning path, achieving the technical effects of improved cleaning efficiency, reduced contamination transfer risk, and enhanced system automation control.

[0043] Furthermore, the circulating water cleaning mechanism 2 includes an iris assembly 21, a circulation tank 22, and an adjustment assembly 23. The iris assembly 21 and the adjustment assembly 23 are fastened together. The adjustment assembly 23 is connected to the circulation tank 22 and to the temperature control mechanism 4. The circulation tank 22 is fastened to the cleaning body 5. The circulation tank 22 is provided with a circulation cavity 221, which is spherical. The adjustment assembly 23 is located inside the circulation cavity 221.

[0044] By adopting the above technical solution, the circulating water cleaning mechanism 2 can achieve precise control of the cleaning fluid flow rate, direction, and temperature, thereby ensuring the stability and cleanliness of the wafer during the rinsing process. The circulation tank 22, as the main structure, is firmly connected to the cleaning machine body 5, providing rigid support and carrying the cleaning fluid circulation system. It has a circulation chamber 221, which has a spherical cap structure, ensuring a uniform distribution of the internal liquid flow path and avoiding turbulent accumulation, thus contributing to flow field stability and efficient rinsing. The regulating component 23 is located inside the circulation chamber 221, achieving internal flow regulation through spatial cooperation with the circulation chamber 221. This component is connected to the circulation tank 22 and simultaneously to the temperature control mechanism 4, enabling temperature regulation of the cleaning fluid entering the circulation chamber 221. The iris component 21 is firmly connected to the regulating component 23, playing a role in aperture transformation and precise flow control, allowing real-time adjustment of the rinsing intensity according to cleaning requirements. The overall structure achieves multi-variable linkage control of the ultrapure water rinsing path by adjusting the dynamic response of component 23 in the circulation chamber 221. Combined with the mechanical flow limiting function of iris component 21 and the thermal regulation capability of temperature control mechanism 4, the entire rinsing process is carried out under stable temperature, constant flow rate and uniform distribution, thereby effectively improving the efficiency of residual liquid removal on the wafer surface, reducing the risk of particulate deposition, and improving the controllability and repeatability of the cleaning process.

[0045] Furthermore, the adjustment component 23 includes a rotating block 231, a sliding block 232, a rotating motor 233, and a magnetostrictive element 234. The rotating block 231 is spherical in shape and is rotatably connected to the circulation chamber 221. The sliding block 232 is slidably connected to the rotating block 231. The iris component 21 is fastened to the sliding block 232. The rotating block 231 is provided with a sliding groove 2311, which is arc-shaped. The sliding block 232 is located in the sliding groove 2311. There are four sliding blocks 232. Every two sliding blocks 232 are fastened to the magnetostrictive element 234. The sliding block 232 is connected to the circulation chamber 221. The rotating motor 233 is fastened to the circulation box 22. The rotating motor 233 is drivenly connected to the rotating block 231.

[0046] By adopting the above technical solution, the regulating component 23 achieves dynamic and controllable adjustment of the circulating water flow cross section and flow rate through mechanical linkage and magnetostrictive adjustment mechanism, thereby further improving the consistency of flow rate and temperature control accuracy during the cleaning process. The rotating block 231 has a spherical notch structure and is rotatably connected to the circulation chamber 221. As the core rotating shaft component of the regulating component 23, its rotation will drive the internal structure to achieve flow channel adjustment. The rotating block 231 is provided with an arc-shaped sliding groove 2311, in which four sliding blocks 232 are arranged. The sliding blocks 232 can be tangentially slid along the arc-shaped groove, forming a radial displacement unit of the regulating structure. Every two sliding blocks 232 are rigidly connected through a magnetostrictive element 234. When the magnetostrictive element 234 expands and contracts under the action of an external temperature control signal, it drives the connected sliding blocks 232 to slide synchronously, thereby achieving precise control of the flow channel opening. The sliding block 232 is connected to the circulation chamber 221 and can directly affect the liquid flow cross-section. Working in conjunction with the flow-limiting orifice of the iris assembly 21, it achieves graded control of the rinsing intensity. The iris assembly 21 is fixed to the sliding block 232 by a fastening method, allowing the iris orifice position to move precisely with the sliding block 232, forming a dynamic variable diameter flow channel. The rotating motor 233 is fixedly installed on the circulation tank 22, serving as a power source and driving the rotating block 231 to rotate, thereby driving the sliding block 232 to achieve initial positioning and coarse adjustment; fine adjustment is achieved by the magnetostrictive element 234 completing micro-displacement correction. This structure forms a multi-level coordinated adjustment mechanism of "rotating block 231 driving + sliding block 232 displacement + magnetostrictive response + iris flow limiting," which not only achieves composite control of the cleaning fluid flow rate, channel angle, and cross-sectional shape, but also improves the system's response speed and flexible adjustment capability at different cleaning stages, effectively enhancing cleaning uniformity and liquid thermal field stability.

[0047] Furthermore, the circulation box 22 is provided with a partition 222, and the section of the partition 222 is located at the center of the circulation cavity 221.

[0048] By adopting the above technical solution, the baffle 222 structure on the circulation tank 22 enables the internal liquid flow to form a stable diversion when flowing through the circulation chamber 221, effectively improving the uniform distribution of the cleaning liquid. The baffle 222 is located at the spherical center section of the circulation chamber 221, serving as a geometric reference plane for flow field symmetry. It can divide the liquid from the regulating component 23 into two symmetrical flow zones, either vertically or horizontally, avoiding local turbulence accumulation or impact displacement. In specific implementation, the baffle 222 is made of rigid, heat-resistant material and is fixed to the inner wall of the circulation tank 22 by embedding or welding. Its position is precisely located at the spherical center section of the circulation chamber 221, ensuring that it plays a role in stabilizing the central flow direction and guiding the flow in the flow path. During operation, after the cleaning liquid enters the circulation chamber 221 through the regulating component 23, it is guided and diverted by the baffle 222 into multiple uniform paths, thereby improving the hydraulic symmetry and surface coverage during the rinsing process and effectively avoiding cleaning dead zones or uneven rinsing. This structure further improves the control precision of the regulating component 23 on the direction and velocity of the fluid, and works with the iris component 21 to form a spatial multi-point distributed spray mode, which significantly improves cleaning efficiency and repeatability, and ensures uniform force and cleanliness consistency in all areas of the wafer surface.

[0049] Furthermore, the drying and cleaning mechanism 3 includes a rotary motor 31, a rotating rod 32, a second suction cup 33, a downward hydraulic cylinder 34, a gear set 35, a gear frame 36, a fan 37, and a drying chamber 38. The rotary motor 31 and the gear frame 36 are fastened together, the rotary motor 31 and the gear set 35 are rotatably connected, the gear set 35 and the rotating rod 32 are drive-connected, the second suction cup 33 and the rotating rod 32 are fastened together, the downward hydraulic cylinder 34 and the drying chamber 38 are fastened together, the downward hydraulic cylinder 34 and the gear frame 36 are drive-connected, and the drying chamber 38 and the cleaning machine body 5 are fastened together.

[0050] By adopting the above technical solution, the drying and cleaning mechanism 3 achieves rapid, efficient, and uniform drying of the cleaned wafers through a combination of rotary clamping and hot air-linked drying. A rotary motor 31, fixed to the gear carrier 36, serves as a power source and is rotatably connected to the gear set 35 via a rotary output shaft. The gear set 35 transmits rotational power to the rotating rod 32, causing it to rotate the second suction cup 33, which is tightly connected to it, thereby achieving synchronous rotation of the clamped wafers. This rotational action allows the liquid on the wafer surface to be quickly discharged under centrifugal force, reducing drying time and residual liquid volume. A downward hydraulic cylinder 34 is tightly connected to the drying chamber 38 and is driven by the gear carrier 36, undertaking the lifting and lowering action of vertically moving the gear carrier 36 and its connected rotating structure into or out of the drying chamber 38, achieving precise positioning and height adjustment of the wafers from the cleaning position to the drying chamber. A fan 37, acting as a hot air supply device, is located on one side of the drying chamber 38, providing directional airflow into the drying chamber to promote the evaporation and removal of residual moisture on the wafer surface, achieving uniform drying of the entire surface in conjunction with the rotational action. The drying chamber 38 and the cleaning unit 5 are securely connected to form a closed drying space with excellent heat preservation and dust prevention performance, effectively avoiding secondary contamination during the drying process. The overall structure forms a multi-effect linkage drying system of "vertical transfer + rotary drive + hot air drying", which not only improves drying efficiency and uniformity, but also ensures stable operation of the equipment through a compact mechanical layout, further guaranteeing the cleanliness and integrity of the wafers at the end of the cleaning process.

[0051] Furthermore, the temperature control mechanism 4 includes a temperature sensor 41, a circulation pipe 42, a cooling tank 43, a circulation pump 44, and a heating tank 45. The temperature sensor 41 is fastened to the cleaning body 5. The circulation pipe 42 is spiral-shaped and is connected to the sliding block 232. The circulation pipe 42 is connected to the circulation pump 44, the circulation pump 44 is connected to the heating tank 45, the heating tank 45 is connected to the cooling tank 43, and the cooling tank 43 is connected to the circulation pipe 42.

[0052] By adopting the above technical solution, the temperature sensor 41 is firmly connected to the cleaning machine body 5, which monitors the temperature status of key areas of the equipment in real time and feeds the data back to the control system for closed-loop regulation. The circulation pipe 42 has a spiral structure, which increases the heat transfer area and extends the heat exchange path, thereby improving the cooling or heating efficiency. One end of the circulation pipe is connected to the sliding block 232, so that the flowing heat-regulating liquid can directly act on the regulating component 23 to achieve fine-tuning control of the temperature of the cleaning liquid channel. The circulation pipe 42 is also connected to the circulation pump 44, which provides continuous power to drive the temperature-controlled liquid to circulate in a closed loop within the system. The circulation pump 44 is connected to the heating box 45, which serves as a high-temperature source for heating the circulation liquid. When the temperature is lower than the set value, heating is activated to raise the overall system temperature. The heating box 45 is then connected to the cooling box 43, which achieves a cooling effect through built-in refrigerant or heat exchange plates. When the system temperature is too high, the circulation liquid is guided into the cooling section to release heat. Finally, the cooled liquid returns to the circulation pipe 42, forming a constant temperature closed-loop regulation loop. This structure utilizes a local feedback node formed by a temperature sensor 41 and a spiral circulation tube 42, combined with dual-channel heat source regulation of a heating box 45 and a cooling box 43. This improves temperature control accuracy while providing good response speed and thermal inertia control capabilities, thereby effectively avoiding thermal stress impact on the wafer caused by temperature fluctuations in the cleaning solution, and further improving cleaning stability and process consistency.

[0053] Working principle of the invention:

[0054] The cleaning equipment features a bottom-up flow sequence of cleaning, rinsing, and drying. The ultrasonic strong acid cleaning mechanism 1 is located at the bottom, enabling the removal of stubborn contaminants from the wafers via ultrasonic waves in a strong acid solution. The circulating water cleaning mechanism 2 is located above it, facilitating immediate ultrapure water rinsing after strong acid cleaning to prevent acid residue from causing corrosion or contamination. The drying cleaning mechanism 3 is located at the top, using a fan 37 and rotating components to rapidly dry the cleaned wafers, preventing water stains. The wafer cleaning glass tank 11 holds the strong acid cleaning solution and possesses good acid resistance and visibility. The ultrasonic cleaning tank 12 holds ultrapure water and contains an ultrasonic device 13. The liquid generates high-frequency vibrations, which, in conjunction with the ultrapure water inlet 121 and outlet, form a directional flow. The inlet cross-sectional area is larger than the outlet cross-sectional area, creating a liquid pressure difference that improves the cleaning flow rate and impurity removal efficiency. The lifting rod 141 in the wafer lifting assembly 14 is driven up and down by the lifting hydraulic cylinder 142, causing the acid-resistant first suction cup 144 to rise and fall to grip the wafer. The switching disk 143 is fastened to the lifting rod 141 and is spherical in shape, ensuring sealing and positioning with the circulating water cleaning mechanism 2. In the circulating water cleaning mechanism 2, the iris assembly 21 is used to adjust the size of the rinsing orifice, working with the adjustment assembly 23 to achieve dynamic water flow control. The adjustment assembly 23 consists of a rotating block 231 and a sliding block 232. The device consists of a rotating block 231 and a magnetostrictive element 234. The rotating block 231 is spherical and rotatably connected to the circulation cavity 221. The sliding block 232 is embedded in its arc-shaped sliding groove 2311. Driven by the magnetostrictive element 234, the four sliding blocks move in coordination to achieve the linkage adjustment of the aperture of the iris assembly 21. The rotating motor 233 provides continuous power. The sliding block 232 and the circulation cavity 221 are connected to form a complete water channel. The circulation cavity 221 is provided with a baffle 222. The cross-section of the baffle 222 is located at the center of the sphere and is used for flow diversion and pressure stabilization to achieve flow field symmetry. The drying and cleaning mechanism 3 drives the rotating rod 32 through the gear set 35 driven by the rotating motor 31, so that the second suction cup 33 clamps the wafer and rotates it for drying. The downward-moving hydraulic cylinder 34 drives the gear frame 36 to move the wafer into and out of the drying chamber 38. The fan 37 provides drying airflow to ensure that there are no residual droplets on the wafer surface. The temperature control mechanism 4 detects the temperature of the cleaning zone in real time through the temperature sensor 41. The circulation pipe 42 is spirally arranged in the cleaning path and connected to the cooling box 43 and the heating box 45 to form a bidirectional temperature regulation path. The circulation pump 44 drives the medium circulation to ensure that the cleaning fluid is always in the ideal temperature range. With the help of the iris adjustment component 23, the cleaning temperature is closed-loop controlled. In summary, the cleaning equipment can realize a multi-stage, quantitative, and constant-temperature high-efficiency wafer cleaning process, and has many advantages such as strong acid resistance, uniform cleaning, strong automatic adjustment capability, and high drying efficiency.

[0055] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A wafer cleaning device with flow rate regulation function, characterized in that: The cleaning equipment includes an ultrasonic strong acid cleaning mechanism (1), a circulating water cleaning mechanism (2), a drying cleaning mechanism (3), a temperature control mechanism (4), and a cleaning body (5). The ultrasonic strong acid cleaning mechanism (1) and the cleaning body (5) are fastened together. The circulating water cleaning mechanism (2) and the cleaning body (5) are fastened together. The drying cleaning mechanism (3) and the cleaning body (5) are fastened together. The temperature control mechanism (4) and the cleaning body (5) are fastened together. The ultrasonic strong acid cleaning mechanism (1) is located in the circulating water system. Below the water cleaning mechanism (2), the drying cleaning mechanism (3) is located above the circulating water cleaning mechanism (2). The cleaning equipment also includes a pre-cleaning frame (6), a cleaning rack (7), a cleaning gear set (8), and a pre-cleaning motor (9). The pre-cleaning frame (6) and the drying cleaning mechanism (3) are fastened together. The pre-cleaning motor (9) and the pre-cleaning frame (6) are fastened together. The pre-cleaning motor (9) and the cleaning gear set (8) are connected in a driving manner. The cleaning gear set (8) and the cleaning rack (7) are connected in a driving manner.

2. The wafer cleaning equipment with flow rate regulation function according to claim 1, characterized in that: The ultrasonic strong acid cleaning mechanism (1) includes a wafer cleaning glass tank (11), an ultrasonic cleaning tank (12), an ultrasonic device (13), and a wafer lifting assembly (14). The wafer cleaning glass tank (11) and the ultrasonic cleaning tank (12) are fastened together. The ultrasonic cleaning tank (12) is provided with an ultrapure water inlet (121) and an ultrapure water outlet (122). The cross-sectional area of ​​the ultrapure water inlet (121) is larger than the cross-sectional area of ​​the ultrapure water outlet (122). The wafer cleaning glass tank (11) is used to contain strong acid cleaning solution, the ultrasonic cleaning tank (12) is used to contain ultrapure water medium, the ultrapure water inlet (121) is connected to the ultrasonic cleaning tank (12), the ultrasonic cleaning tank (12) is connected to the ultrapure water outlet (122), the wafer lifting assembly (14) is fastened to the ultrasonic cleaning tank (12), the ultrasonic device (13) is fastened to the ultrasonic cleaning tank (12), and the ultrasonic device (13) is located inside the ultrasonic cleaning tank (12).

3. The wafer cleaning equipment with flow rate regulation function according to claim 2, characterized in that: The wafer lifting assembly (14) includes a lifting rod (141), a lifting hydraulic cylinder (142), a switching disk (143), and a first suction cup (144). The lifting rod (141), the switching disk (143), and the first suction cup (144) are all made of acid-resistant material. The lifting hydraulic cylinder (142) is fastened to the ultrasonic cleaning tank (12). The lifting hydraulic cylinder (142) is driven to the lifting rod (141). The lifting rod (141) is driven to the first suction cup (144). The switching disk (143) is fastened to the lifting rod (141). The switching disk (143) abuts against the circulating water cleaning mechanism (2). The switching disk (143) is spherical in shape.

4. A wafer cleaning device with flow rate regulation function according to claim 3, characterized in that: The circulating water cleaning mechanism (2) includes an iris assembly (21), a circulation tank (22), and an adjustment assembly (23). The iris assembly (21) and the adjustment assembly (23) are fastened together. The adjustment assembly (23) is connected to the circulation tank (22). The adjustment assembly (23) is connected to the temperature control mechanism (4). The circulation tank (22) is fastened to the cleaning body (5). The circulation tank (22) is provided with a circulation cavity (221). The circulation cavity (221) is spherical. The adjustment assembly (23) is located inside the circulation cavity (221).

5. A wafer cleaning device with flow rate regulation function according to claim 4, characterized in that: The adjustment component (23) includes a rotating block (231), a sliding block (232), a rotating motor (233), and a magnetostrictive element (234). The rotating block (231) is spherical in shape. The rotating block (231) and the circulation chamber (221) are rotatably connected. The sliding block (232) and the rotating block (231) are slidably connected. The iris component (21) and the sliding block (232) are fastened together. The rotating block (231) is provided with a sliding groove (234). 311), the sliding groove (2311) is arc-shaped, the sliding block (232) is located in the sliding groove (2311), there are four sliding blocks (232), every two sliding blocks (232) are fastened to the magnetostrictive element (234), the sliding block (232) is connected to the circulation chamber (221), the rotating motor (233) is fastened to the circulation box (22), and the rotating motor (233) is driven to the rotating block (231).

6. A wafer cleaning device with flow rate regulation function according to claim 5, characterized in that: The circulation box (22) is provided with a partition (222), and the cross section of the partition (222) is located at the center of the circulation cavity (221).

7. A wafer cleaning device with flow rate regulation function according to claim 6, characterized in that: The drying and cleaning mechanism (3) includes a rotary motor (31), a rotating rod (32), a second suction cup (33), a downward hydraulic cylinder (34), a gear set (35), a gear frame (36), a fan (37), and a drying chamber (38). The rotary motor (31) and the gear frame (36) are fastened together. The rotary motor (31) and the gear set (35) are rotatably connected. The gear set (35) and the rotating rod (32) are driven together. The second suction cup (33) and the rotating rod (32) are fastened together. The downward hydraulic cylinder (34) and the drying chamber (38) are fastened together. The downward hydraulic cylinder (34) and the gear frame (36) are driven together. The drying chamber (38) and the cleaning machine body (5) are fastened together.

8. A wafer cleaning device with flow rate regulation function according to claim 7, characterized in that: The temperature control mechanism (4) includes a temperature sensor (41), a circulation pipe (42), a cooling tank (43), a circulation pump (44), and a heating tank (45). The temperature sensor (41) is fastened to the cleaning body (5). The circulation pipe (42) is spiral-shaped. The circulation pipe (42) is connected to the sliding block (232). The circulation pipe (42) is connected to the circulation pump (44). The circulation pump (44) is connected to the heating tank (45). The heating tank (45) is connected to the cooling tank (43). The cooling tank (43) is connected to the circulation pipe (42).

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