Wafer automatic supply equipment

Abstract

The invention relates to the technical field of semiconductor device production, in particular to wafer automatic supply equipment which comprises a rack, a basket mechanism, a jig taking and placing mechanism, a wafer lower recognition mechanism, a transfer mechanism, a wafer upper recognition mechanism, a turnover mechanism, a transfer platform, a wafer supply and collection mechanism and a cover plate containing assembly. The transfer platform is used for transferring wafers, the turnover mechanism is used for turning over the wafers, the wafer lower recognition mechanism is used for recognizing feature information of the wafers and cover plates, the jig taking and placing mechanism is used for taking out bearing jigs from the basket mechanism and sending jig combinations back to the basket mechanism, and the transferring mechanism is used for transferring the wafers and the cover plates. The on-wafer identification mechanism is used for taking an image of the wafer in the wafer supplying and receiving mechanism and outputting angle position information. According to the equipment provided by the invention, the wafer is automatically taken out and then placed on the bearing jig, so that the production efficiency is improved, subfissure or damage of the wafer is avoided, and the placement position is relatively accurate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor device production, in particular to a wafer automatic supply equipment. BACKGROUND

[0002] Wafer refers to a silicon wafer used for making silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and added to a silicon crystal seed, and then slowly pulled out to form a cylindrical single crystal silicon. The silicon crystal rod is ground, polished and sliced to form a silicon wafer sheet, which is processed by photolithography to obtain a wafer. Since the wafer is prone to hidden cracks or damage, it needs to be placed in a protective pad after production, then stacked into a wafer storage box, and the top layer is placed in a storage wafer storage box. The information of the optical disc between the optical disc and the top wafer is placed between the optical disc and the wafer to prevent the optical disc from contacting the wafer, and then the wafer storage box is covered with a box cover. When entering the semiconductor production process, the box cover is usually opened manually, the optical disc and the foam are taken out, and the wafer is taken out from the protective pad and manually moved to the carrier fixture. Manual wafer taking and placing not only has low production efficiency, but also is prone to hidden cracks or damage due to uneven force, and the placement position deviation is large, which affects the subsequent process precision. SUMMARY

[0003] The technical problem to be solved by the present application is to provide a wafer automatic supply equipment which can automatically take out the wafer from the wafer storage box and place it on the carrier fixture, improve the production efficiency and prevent the wafer from hidden cracks or damage, and the placement position is accurate.

[0004] The present application is realized by the following scheme: A wafer automatic supply equipment, comprising a rack, a basket mechanism, a taking and placing jig mechanism, a wafer lower identification mechanism, a transfer mechanism, a wafer upper identification mechanism, a turnover mechanism, a transfer platform, a wafer supply and collection mechanism and a cover plate storage assembly installed on the rack, the wafer supply and collection mechanism is used for providing wafer and recycling optical disc, foam and pad for packaging wafer, the transfer platform is used for transferring wafer before turnover, the turnover mechanism is used for turning over the wafer stored on the transfer platform which needs to be turned over, the wafer lower identification mechanism is used for identifying the characteristic information of the wafer and the cover plate adsorbed by the transfer mechanism, obtaining angle and position information, the taking and placing jig mechanism is used for taking the carrier fixture from the basket mechanism and sending the jig combination after clamping back to the basket mechanism, the transfer mechanism is used for flowing between the taking and placing jig mechanism, the wafer supply and collection mechanism, the transfer platform and the cover plate storage assembly, and transferring the wafer and the cover plate, the wafer upper identification mechanism is used for taking pictures of the wafer in the wafer supply and collection mechanism and outputting angle and position information.

[0005] Further, the wafer supply mechanism is arranged on the right side of the rack, and the wafer supply mechanism includes a wafer supply mechanism support, a recovery bin, a wafer storage box base, a sealed bin and a sealed bin driving device, the wafer supply mechanism support is fixedly installed on the rack, the recovery bin and the wafer storage box base are fixedly installed on the wafer supply mechanism support, the sealed bin includes a fixed plate and a movable bin body, the fixed plate is fixedly installed on the wafer supply mechanism support and located between the recovery bin and the wafer storage box base, a plurality of air holes in communication with the nitrogen supply device are formed in the fixed plate, the movable bin body is driven by the sealed bin driving device to move along the wafer supply mechanism support, and the movable bin body is located above the wafer storage box base to form a sealed bin together with the fixed plate.

[0006] Further, the transfer platform is located above the wafer supply mechanism, and the transfer platform includes a transfer platform mounting plate, a transfer platform vacuum adsorption assembly, a platform body and a platform lifting device, the transfer platform mounting plate is fixedly installed on the rack, the transfer platform vacuum adsorption assembly is fixedly installed on the lower surface of the platform body, and the platform lifting device drives the transfer platform to move up and down.

[0007] Further, the turnover mechanism is arranged above the transfer platform, and the turnover mechanism includes a turnover mechanism X-axis moving module, a turnover mechanism Y-axis moving module, a turnover mechanism R-axis rotating module and a turnover mechanism suction cup assembly, the turnover mechanism X-axis moving module is installed on the rack, the turnover mechanism Y-axis moving module is installed on the turnover mechanism X-axis moving module, the turnover mechanism R-axis rotating module includes a turnover mechanism mounting plate, a hollow rotating shaft and a hollow rotating shaft driving device, the turnover mechanism mounting plate is fixedly installed on the turnover mechanism Y-axis moving module, the hollow rotating shaft is rotatably installed on the turnover mechanism mounting plate, and the hollow rotating shaft driving device is installed on the turnover mechanism mounting plate to drive the hollow rotating shaft to rotate, the turnover mechanism suction cup assembly includes a turnover mechanism suction cup, and the turnover mechanism suction cup is fixedly installed on the end of the hollow rotating shaft.

[0008] Further, the transfer mechanism is located beside the turnover mechanism, and the transfer mechanism comprises a transfer mechanism support, a transfer mechanism X-axis moving module, a transfer mechanism Y-axis moving module, a transfer mechanism Z-axis moving module and a transfer mechanical hand assembly. The transfer mechanism support is fixedly installed on the rack. The transfer mechanism Y-axis moving module is installed on the transfer mechanism support. The transfer mechanism X-axis moving module is installed on the transfer mechanism Y-axis moving module. The transfer mechanism Z-axis moving module is installed on the transfer mechanism X-axis moving module. The transfer mechanical hand assembly comprises a transfer mechanical hand installation plate, an inner layer suction nozzle, an outer layer suction nozzle, a suction nozzle switching device and a transfer suction nozzle R-axis rotating device. The transfer mechanical hand installation plate is installed on the transfer mechanism Z-axis moving module. The transfer suction nozzle R-axis rotating device is fixedly installed on the transfer mechanical hand installation plate, and a suction nozzle support frame is installed on the rotating shaft of the transfer suction nozzle R-axis rotating device. The inner layer suction nozzle is fixedly installed at the lower end of the suction nozzle support frame. The suction nozzle switching device comprises a driving cylinder, a guide rail and a sliding block. The guide rail is arranged on the suction nozzle support frame. The sliding block is slidingly installed on the guide rail and is driven to move up and down by the driving cylinder. The sliding block is fixedly connected with the outer layer suction nozzle.

[0009] Further, the transfer mechanism further comprises a visual identification module and a laser height measuring module. The visual identification module and the laser height measuring module are both installed on the Z-axis moving module and located beside the transfer mechanical hand assembly.

[0010] Optimally, the wafer lower identification mechanism is arranged on the left side of the transfer platform, and the wafer upper identification mechanism is arranged below the wafer feeding and collecting mechanism.

[0011] Optimally, the cover plate containing assembly is arranged below the wafer lower identification mechanism, and comprises a cover plate containing box and a full material sensor installed above the cover plate containing box.

[0012] Further, the pick-and-place jig mechanism is arranged on the left side of the wafer lower identification mechanism, and comprises a pick-and-place jig mechanism Y-axis moving module, a tray, a clamping device and a limiting plate. The tray is fixedly installed on a tray installation plate and is driven to reciprocate by the pick-and-place jig mechanism Y-axis moving module. The tray is provided with a cam guide groove. The limiting plate is fixedly installed on the end of the pick-and-place jig mechanism Y-axis moving module, and the limiting plate is provided with a limiting groove. The clamping device comprises a clamping connecting plate, a cam, a clamping column, a tension spring and a limiting block. The clamping connecting plate passes through the tray installation plate in a sliding manner, and the lower part of the clamping connecting plate is provided with a limiting stopper. The cam is installed on the clamping connecting plate and passes through the cam guide groove. The clamping column is fixedly installed on the end of the tray. The tension spring is installed between the limiting stopper and the tray installation plate. The limiting block is fixedly installed on the end of the pick-and-place jig mechanism Y-axis moving module.

[0013] Further, the basket mechanism is arranged below the pick-and-place jig mechanism, and comprises a basket, a ball screw, a ball screw driving motor, a fixed plate, a movable plate and a guide shaft.

[0014] Advantages of the application: 1. The wafer automatic supply device can automatically complete wafer transfer, vision-based positioning and wafer presence detection, wafer flipping, wafer protection and wafer storage functions, realizes full automation of the wafer transfer process, effectively replaces manual operation, and significantly improves the stability and reliability of the transfer process.

[0015] 2. The double-layer suction nozzle switchable design of the transfer mechanism, the inner layer suction nozzle is dedicated to fragile wafers, and the outer layer suction nozzle handles auxiliary materials. This physical isolation design can effectively avoid contamination, which is very important in the semiconductor field. The double-layer suction nozzle switchable design also makes the structure more compact, increases the transfer stability, and provides a new idea for products with large differences in adsorption characteristics in the same process flow.

[0016] 3. Greatly reduces manual operation, realizes full automation of the transfer process, and makes the wafer clamping process controllable and stable, while reducing the risk of wafer damage or hidden cracks caused by manual clamping, thereby realizing automatic and safe wafer supply. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a schematic diagram of the overall structure of the application.

[0018] Figure 2 is a schematic diagram of the wafer supply and collection mechanism structure of the application.

[0019] Figure 3 is a schematic diagram of the structure of the wafer stored in the wafer storage box.

[0020] Figure 4 is a schematic diagram of the transfer platform structure of the application.

[0021] Figure 5 is a schematic diagram of the flipping mechanism structure of the application.

[0022] Figure 6 is a schematic diagram of the transfer mechanism structure of the application.

[0023] Figure 7 is a schematic diagram of the transfer robot assembly structure of the application.

[0024] Figure 8 is a schematic diagram of the cover plate storage assembly structure of the application.

[0025] Figure 9 is the top view structural schematic diagram of the pick-and-place jig mechanism of the present application.

[0026] Figure 10 is the front view structural schematic diagram of the pick-and-place jig mechanism of the present application.

[0027] Figure 11 is the structural schematic diagram of the basket mechanism of the present application.

[0028] Figure 12 is the exploded structural schematic diagram of the jig combination of the present application.

[0029] In the figure: 1, wafer identification mechanism on wafer; 2, wafer supply mechanism; 201, wafer supply mechanism support; 202, recycling bin; 203, wafer holding box base; 204, moving bin body; 205, sealed bin driving device; 206, fixed plate; 3, transfer platform; 301, transfer platform mounting plate; 302, transfer platform vacuum adsorption assembly; 303, platform body; 304, platform lifting device; 4, turnover mechanism; 401, turnover mechanism X-axis moving module; 402, turnover mechanism Y-axis moving module; 403, turnover mechanism R-axis rotating module; 4031, turnover mechanism mounting plate; 4032, hollow rotating shaft; 4033, hollow rotating shaft driving device; 404, turnover mechanism suction cup assembly; 4041, gas source interface; 4042, air block; 4043, adsorption air hole; 4044, turnover mechanism suction cup; 5, transfer mechanism; 501, transfer mechanism support; 502, transfer mechanism Y-axis moving module; 503, transfer mechanism X-axis moving module; 504, transfer mechanism Z-axis moving module; 505, transfer manipulator assembly; 5051, transfer manipulator mounting plate; 5052, driving cylinder; 5053, inner layer suction nozzle; 5054, outer layer suction nozzle; 5055, transfer suction nozzle R-axis rotating device; 5056, suction nozzle support frame; 5057, guide rail; 5058, sliding block; 506, visual identification module; 507, laser height measurement module; 6, wafer identification mechanism below; 7, cover plate holding assembly; 701, cover plate holding box; 702, full material sensor; 8, pick-and-place jig mechanism; 801, pick-and-place jig mechanism Y-axis moving module; 802, tray; 8021, cam guide groove; 803, limiting plate; 8031, limiting groove; 804, tray mounting plate; 805, clamping device; 8051, clamping column; 8052, cam; 8053, clamping connecting plate; 8054, tension spring; 8055, limiting block; 8056, limiting block; 9, basket mechanism; 901, basket; 902, guide shaft; 903, ball screw; 904, ball screw driving motor; 905, fixed plate; 906, movable plate; 10, rack; 11, wafer holding box; 12, gasket; 13, wafer; 1301, wafer positioning hole; 14, foam; 15, optical disc; 16, upper cover; 17, carrier jig; 1701, cover plate positioning pin; 1702, wafer positioning pin; 1703, magnet; 18, cover plate; 1801, cover plate positioning hole. DETAILED DESCRIPTION

[0030] A wafer automatic supply device, the overall structure schematic diagram is as Figure 1As shown, including rack 10 and installed on the rack basket mechanism 9, pick and place jig mechanism 8, wafer under identification mechanism 6, transfer mechanism 5, wafer on identification mechanism 1, turnover mechanism 4, transfer platform 3, wafer supply and recovery mechanism 2, cover plate storage assembly 7, the wafer supply and recovery mechanism is used for providing wafer and recycling optical disc, foam, gasket of packaged wafer, the transfer platform is used for transfer before wafer turnover, the turnover mechanism is used for turning over the wafer stored on the transfer platform, the wafer under identification mechanism is used for identifying the feature information of the wafer and cover plate adsorbed by the transfer mechanism, obtaining angle and position information, the pick and place jig mechanism is used for taking out the carrier jig from the basket mechanism, and the jig combination is sent back to the basket mechanism, the transfer mechanism is used for circulation between pick and place jig mechanism, wafer supply and recovery mechanism, transfer platform, cover plate storage assembly, wafer and cover plate, the wafer on identification mechanism is used for taking pictures of the wafer in the wafer supply and recovery mechanism, and outputting angle and position information.

[0031] The wafer automatic supply equipment provided by the application can automatically complete wafer and carrier jig transfer, vision-based positioning and wafer presence / absence detection, wafer turnover, wafer protection and wafer storage functions through cooperation of each mechanism, realizes full automation of wafer transfer process, effectively replaces manual operation, greatly reduces manual operation, realizes full automation of transfer process, significantly improves efficiency, stability and reliability of the transfer process, and makes the wafer clamping process controllable and stable, thereby reducing the risk of wafer breakage or hidden cracks caused by manual clamping.

[0032] Further, the structure schematic diagram of wafer supply and recovery mechanism is as shown in Figure 2 As shown, the wafer supply and recovery mechanism is arranged on the right side of the rack, which includes wafer supply and recovery mechanism support 201, recovery bin 202, wafer storage box base 203, sealing bin and sealing bin driving device 205, the wafer supply and recovery mechanism support is fixedly installed on the rack, the recovery bin and the wafer storage box base are fixedly installed on the wafer supply and recovery mechanism support, the sealing bin includes fixed plate 206 and movable bin body 204, the fixed plate is fixedly installed on the wafer supply and recovery mechanism support and located between the recovery bin and the wafer storage box base, a plurality of air holes communicating with the nitrogen supply device are formed in the fixed plate, the movable bin body is driven by the sealing bin driving device to move along the wafer supply and recovery mechanism support, and when the movable bin body is located above the wafer storage box base, the movable bin body and the fixed plate together enclose the sealing bin.

[0033] The wafer storage box 11 is placed on the wafer storage box base, and the structure schematic diagram of the wafer stored in the wafer storage box is as shown in Figure 3 As shown, the gasket 12 is clamped in the wafer storage box, the wafer 13 is clamped in the gasket, the wafer is covered with foam 14 and optical disc 15, and the wafer storage box is provided with an upper cover 16.

[0034] When the wafer pick-and-place operation is performed, the sealed cabin driving device drives the moving cabin body to move to the first position to expose the opening of the wafer containing box, and when the wafer containing box is in the non-working state, the sealed cabin driving device drives the moving cabin body to move to the second position to cover the opening of the wafer containing box. A plurality of air holes are formed in the fixing plate and are in communication with the nitrogen supply device. Nitrogen can be continuously supplied into the sealed cabin in the second position through the air holes to prevent the wafer surface in the wafer containing box from being oxidized.

[0035] When the wafer pick-and-place operation is performed, the sealed cabin driving device drives the moving cabin body to move to the first position to expose the opening of the wafer containing box, and when the wafer containing box is in the non-working state, the sealed cabin driving device drives the moving cabin body to move to the second position to cover the opening of the wafer containing box. A plurality of air holes are formed in the fixing plate and are in communication with the nitrogen supply device. Nitrogen can be continuously supplied into the sealed cabin in the second position through the air holes to prevent the wafer surface in the wafer containing box from being oxidized.

[0036] Further, the transfer platform is located above the wafer supply and collection mechanism, and a structural schematic diagram of the transfer platform is as shown in Figure 4 The transfer platform installation plate is fixedly installed on the rack, the transfer platform vacuum adsorption assembly is fixedly installed on the lower surface of the platform body, and the platform lifting device drives the transfer platform to move up and down.

[0037] Further, the turnover mechanism is arranged above the transfer platform, and a structural schematic diagram of the turnover mechanism is as shown in Figure 5 The turnover mechanism X-axis moving module is installed on the rack, the turnover mechanism Y-axis moving module is installed on the turnover mechanism X-axis moving module, the turnover mechanism R-axis rotating module includes a turnover mechanism installation plate 4031, a hollow rotating shaft 4032, and a hollow rotating shaft driving device 4033, The turnover mechanism installation plate is fixedly installed on the turnover mechanism Y-axis moving module, the hollow rotating shaft is rotatably installed on the turnover mechanism installation plate, and the hollow rotating shaft driving device is installed on the turnover mechanism installation plate to drive the hollow rotating shaft to rotate, and the turnover mechanism suction disc assembly includes a turnover mechanism suction disc 4044.

[0038] Specifically, the hollow rotating shaft driving device can be preferably a hollow rotating shaft driving motor. The motor shaft of the hollow rotating shaft driving motor is connected with the hollow rotating shaft through a synchronous belt to drive the hollow rotating shaft to rotate.

[0039] The air source interface 4041 can be arranged on the hollow rotating shaft, and then the hollow rotating shaft is in communication with the air passage block 4042 arranged on the turnover mechanism suction disc, and the surface of the turnover mechanism suction disc is provided with a plurality of adsorption air holes 4043 which are in communication with the air passage block through flow channels arranged in the turnover mechanism suction disc. In this way, the problem of air pipe winding during turnover is solved, and the stability during adsorption is ensured, so that the turnover mechanism suction disc can adsorb the gasket together with the wafer.

[0040] Further, the transfer mechanism is located beside the turnover mechanism, and a structural schematic diagram of the transfer mechanism is shown in Figure 6 The transfer mechanism includes a transfer mechanism support 501, a transfer mechanism X-axis movement module 503, a transfer mechanism Y-axis movement module 502, a transfer mechanism Z-axis movement module 504, and a transfer robot assembly 505. The transfer mechanism support is fixedly installed on a rack. The transfer mechanism Y-axis movement module is installed on the transfer mechanism support. The transfer mechanism X-axis movement module is installed on the transfer mechanism Y-axis movement module. The transfer mechanism Z-axis movement module is installed on the transfer mechanism X-axis movement module. A structural schematic diagram of the transfer robot assembly is shown in Figure 7 The transfer robot assembly includes a transfer robot mounting plate 5051, an inner layer suction nozzle 5053, an outer layer suction nozzle 5054, a suction nozzle switching device, and a transfer suction nozzle R-axis rotating device 5055. The transfer robot mounting plate is installed on the transfer mechanism Z-axis movement module. The transfer suction nozzle R-axis rotating device is fixedly installed on the transfer robot mounting plate, and a suction nozzle support frame 5056 is installed on the rotating shaft of the transfer suction nozzle R-axis rotating device. The inner layer suction nozzle is fixedly installed at the lower end of the suction nozzle support frame. The suction nozzle switching device includes a driving cylinder 5052, a guide rail 5057, and a sliding block 5058. The guide rail is arranged on the suction nozzle support frame. The sliding block is slidingly installed on the guide rail and is driven to move up and down by the driving cylinder. The bottom of the sliding block is fixedly connected with the outer layer suction nozzle.

[0041] The working state of the transfer robot assembly has two states. In a first working state, the inner layer suction nozzle is exposed below the outer layer suction nozzle, and the inner layer suction nozzle is configured to adsorb wafers. In a second working state, the suction nozzle switching device is actuated to expose the outer layer suction nozzle below the inner layer suction nozzle, and the outer layer suction nozzle is configured to adsorb a cover plate, a gasket, a disc, and foam.

[0042] Further, the transfer mechanism further includes a visual recognition module 506 and a laser height measurement module 507. The visual recognition module and the laser height measurement module are both installed on the Z-axis movement module and located beside the transfer robot assembly.

[0043] The visual recognition module is used to shoot images of wafers or cover plates located at a working position and output corresponding position and angle information. The laser height measurement module is used to measure the height of the surface of a wafer to be adsorbed.

[0044] The optimized wafer-under identification mechanism is arranged on the left side of the transfer platform, and the wafer-under identification mechanism is arranged below the wafer supply mechanism.

[0045] The optimized cover plate containing assembly is arranged below the wafer-under identification mechanism, and a structure diagram of the cover plate containing assembly is shown in FIG. 7. Figure 8 The cover plate containing assembly includes a cover plate containing box 701 and a full material sensor 702 arranged above the cover plate containing box.

[0046] The cover plate is placed in the cover plate containing box. When the cover plate containing box is full of cover plates, the full material sensor can send an alarm.

[0047] Further, the pick-and-place jig mechanism is arranged on the left side of the wafer-under identification mechanism, and a structure diagram of the pick-and-place jig mechanism is shown in FIG. 8. Figure 9 Figure 10 The pick-and-place jig mechanism includes a pick-and-place jig mechanism Y-axis moving module 801, a tray 802, a clamping device 805, and a limiting plate 803. The tray is fixedly arranged on a tray mounting plate 804 and is driven to reciprocate by the pick-and-place jig mechanism Y-axis moving module. The tray is provided with a cam guide groove 8021. The limiting plate is fixedly arranged on the end of the pick-and-place jig mechanism Y-axis moving module and is provided with a limiting groove 8031. The clamping device includes a clamping connecting plate 8053, a cam 8052, a clamping column 8051, a tension spring 8054, and a limiting block 8056. The clamping connecting plate is slidably arranged through the tray mounting plate, and the lower part of the clamping connecting plate is provided with a limiting block 8055. The cam is arranged on the clamping connecting plate and passes through the cam guide groove. The clamping column is fixedly arranged on the end of the tray. The tension spring is arranged between the limiting block and the tray mounting plate. The limiting block is fixedly arranged on the end of the pick-and-place jig mechanism Y-axis moving module.

[0048] The carrier jig is placed in the basket of the basket mechanism. When the carrier jig needs to be taken out, the pick-and-place jig mechanism Y-axis moving module drives the tray to extend into the basket below the top carrier jig to hold the carrier jig. At this time, the clamping connecting plate also moves with the tray. The tension spring is stretched until the limiting block collides with the limiting block. Then, the clamping connecting plate no longer moves forward with the tray. Since the basket mechanism then descends, the tray of the pick-and-place jig mechanism holds the carrier jig out of the basket mechanism. Then, the tray moves along the pick-and-place jig mechanism Y-axis moving module to the limiting groove. The limiting groove can limit the position of the carrier jig on the inside and outside. Due to the restoring force of the tension spring, the clamping connecting plate moves relative to the tray during the movement of the tray, that is, the cam slides in the cam guide groove, so that the left and right ends of the carrier jig are clamped between the cam and the clamping column. The assembly of the carrier jig, the wafer, and the cover plate is completed through the transfer robot assembly. The pick-and-place jig mechanism moves the assembled jig combination to the basket mechanism. This process is a reverse process of the process of the carrier jig.​

[0049] Specifically, the jig assembly explosion structure schematic diagram is as shown in Figure 12 The wafer is placed on the carrier jig, and the wafer is provided with two wafer positioning holes 1301 corresponding to the wafer positioning pins, the cover plate 18 is located above the wafer, and the cover plate is provided with a cover plate positioning hole 1801 corresponding to the cover plate positioning pin. After assembly, the wafer positioning pin is inserted into the wafer positioning hole, the cover plate positioning pin is inserted into the cover plate positioning hole, and the carrier jig and the cover plate are attracted together by the magnet.

[0050] Further, the basket mechanism is arranged below the taking and placing jig mechanism, and a structure schematic diagram of the basket mechanism is as shown in Figure 11 The basket mechanism includes a basket 901, a ball screw 903, a ball screw driving motor 904, a fixed plate 905, a movable plate 906 and a guide shaft 902. The ball screw driving motor is fixedly installed below the fixed plate to drive the ball screw to rotate. The movable plate is connected with the ball screw through a nut sleeve. The basket is fixedly installed on the movable plate. The guide shaft is installed between the fixed plate and the movable plate. The basket is used for containing the carrier jig, and the ball screw is driven to rotate by the ball screw driving motor, so that the basket is lifted to a target work station.

[0051] The specific work flow of the present application is as follows: Wafer transfer side flow: The full wafer containing box is placed on the wafer supply mechanism by artificial, and the upper cover is removed; during the non-material taking period, the bin body covers the wafer containing box, and nitrogen is introduced to prevent wafer oxidation; the outer suction nozzle of the transfer robot assembly sucks the optical disc and the foam, and moves to the recycling bin of the wafer supply mechanism; the camera of the wafer upper recognition mechanism shoots the gasket area, determines the wafer existence state, and determines whether the wafer needs to be flipped. If the wafer upper recognition mechanism determines that there is no wafer, the outer suction nozzle of the transfer robot assembly removes the empty gasket to the recycling bin; if it is determined that there is a wafer, the camera of the wafer upper recognition mechanism outputs the deflection angle of the wafer by positioning the two wafer positioning holes on the wafer, and the outer suction nozzle sucks the gasket and the wafer together, and the transfer suction nozzle R-axis rotating device compensates the corresponding deflection angle and moves to the transfer platform; the vacuum suction assembly of the transfer platform fixes the bottom surface of the gasket to ensure that the wafer height is in the same plane; the platform lifting device adjusts the platform to the working height; the visual recognition module and the laser height measuring module of the transfer mechanism synchronously collect the wafer position, angle, and height information; if the wafer does not need to be flipped, the inner suction nozzle directly sucks the wafer from the gasket on the transfer platform, and after the second positioning by the camera of the wafer lower recognition mechanism, angle compensation is performed again, the visual recognition module recognizes the wafer positioning pin of the wafer carried by the limiting groove of the pick-and-place jig mechanism, and the wafer positioning hole is aligned with the wafer positioning pin by the transfer mechanism and then placed; if the wafer needs to be flipped, the flipping mechanism moves to above the wafer, the transfer platform rises to make the suction disc assembly of the flipping mechanism contact and suck the wafer, then the transfer platform descends to avoid, the R-axis rotating module of the flipping mechanism performs 180° flipping; the transfer platform rises, the wafer is placed in the gasket on the transfer platform again, the wafer transfer to the transfer platform is detected repeatedly, the process of wafer without flipping is performed, the laser height measuring module confirms the wafer placement height, and the outer suction nozzle sucks the cover plate from the cover plate containing assembly; the cover plate positioning hole is positioned by the wafer lower recognition mechanism, the cover plate positioning pin on the carrying jig is positioned by the visual recognition module, the cover plate positioning hole and the cover plate positioning pin are aligned after the angle deviation is compensated by the R-axis rotating device of the transfer suction nozzle, and then placed on the carrying jig. Since the carrying jig is provided with a magnet, the cover plate and the carrying jig are attracted together to form a jig assembly, which facilitates the automatic supply of wafers for subsequent semiconductor production.

[0052] The carrying jig is provided for the receiving side process: the full carrying jig basket is placed into the basket mechanism by manual, the cover plate is placed into the cover plate containing assembly, the basket mechanism is lifted to the target work station; the tray is extended into the basket to hold the carrying jig below the top carrying jig of the basket, at this time, the clamping connecting plate also moves with the tray, the tension spring is stretched, until the limiting block collides with the limiting block, then the clamping connecting plate no longer moves forward with the tray, since then the basket mechanism is lowered, the tray of the taking and placing jig mechanism holds the carrying jig out of the basket mechanism, then the tray moves along the taking and placing jig mechanism Y-axis moving module to the limiting groove, in the process of the tray movement, the clamping connecting plate moves relative to the tray under the action of the restoring force of the tension spring, so that the cam slides in the cam guide groove, so that the left and right ends of the carrying jig are clamped between the cam and the clamping column. Then the transfer robot assembly places the wafer and the cover plate on the carrying jig according to the corresponding positioning in turn, so as to complete the assembly of the carrying jig, the wafer and the cover plate, and the taking and placing jig mechanism moves the assembled jig combination to the basket mechanism.

[0053] In summary, the wafer automatic supply equipment provided by the present application can automatically take out the wafer from the wafer containing box and place it on the carrying jig, so as to realize automatic and safe supply of the wafer, improve the production efficiency, and the wafer will not be cracked or damaged, and the placement position is relatively accurate.

[0054] The above only describes the preferred embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer automatic feeding device, characterized in that: The sled is a wafer handling device that is used to carry out wafer handling and storage, and is used to carry out wafer handling and storage.

2. The automatic wafer feeding device according to claim 1, characterized in that: The wafer supply and receiving mechanism is arranged on the right side of the frame. The wafer supply and receiving mechanism includes a wafer supply and receiving mechanism bracket, a recovery bin, a wafer box base, a sealing bin and a sealing bin driving device. The wafer supply and receiving mechanism bracket is fixedly installed on the frame. The recovery bin and the wafer box base are both fixedly installed on the wafer supply and receiving mechanism bracket. The sealing bin includes a fixed plate and a movable bin body. The fixed plate is fixedly installed on the wafer supply and receiving mechanism bracket and is located between the recovery bin and the wafer box base. A plurality of ventilation holes connected to the nitrogen supply device are provided on the fixed plate. The movable bin body is driven by the sealing bin driving device to move along the wafer supply and receiving mechanism bracket, and when the movable bin body is located above the wafer box base, it forms a sealed bin together with the fixed plate.

3. The automatic wafer feeding device according to claim 1, characterized in that: The transfer platform is located above the wafer supply and receiving mechanism. The transfer platform includes a transfer platform mounting plate, a transfer platform vacuum adsorption component, a platform body and a platform lifting device. The transfer platform mounting plate is fixedly installed on the frame, the transfer platform vacuum adsorption component is fixedly installed on the lower surface of the platform body, and the platform lifting device drives the transfer platform to move up and down.

4. The automatic wafer feeding device according to claim 1, characterized in that: The flipping mechanism is arranged above the transfer platform. The flipping mechanism includes a flipping mechanism X-axis moving module, a flipping mechanism Y-axis moving module, a flipping mechanism R-axis rotating module and a flipping mechanism suction cup assembly. The flipping mechanism X-axis moving module is installed on the frame, and the flipping mechanism Y-axis moving module is installed on the flipping mechanism X-axis moving module. The flipping mechanism R-axis rotating module includes a flipping mechanism mounting plate, a hollow rotating shaft and a hollow rotating shaft driving device. The flipping mechanism mounting plate is fixedly installed on the flipping mechanism Y-axis moving module, and the hollow rotating shaft is rotatably installed on the flipping mechanism mounting plate. The hollow rotating shaft driving device is installed on the flipping mechanism mounting plate to drive the hollow rotating shaft to rotate. The flipping mechanism suction cup assembly includes a flipping mechanism suction cup, and the flipping mechanism suction cup is fixedly installed on the end of the hollow rotating shaft.

5. The automatic wafer feeding device according to claim 1, characterized in that: The transfer mechanism is located next to the flip mechanism, and the transfer mechanism includes a transfer mechanism bracket, a transfer mechanism X-axis moving module, a transfer mechanism Y-axis moving module, a transfer mechanism Z-axis moving module and a transfer robot assembly. The transfer mechanism bracket is fixedly mounted on the frame, the transfer mechanism Y-axis moving module is mounted on the transfer mechanism bracket, the transfer mechanism X-axis moving module is mounted on the transfer mechanism Y-axis moving module, the transfer mechanism Z-axis moving module is mounted on the transfer mechanism X-axis moving module, and the transfer robot assembly includes a transfer robot mounting plate, an inner layer suction nozzle, an outer layer suction nozzle, and a transfer robot assembly. Nozzle, nozzle switching device, transfer nozzle R-axis rotating device, the transfer robot mounting plate is installed on the Z-axis moving module of the transfer mechanism, the transfer nozzle R-axis rotating device is fixedly installed on the transfer robot mounting plate, and a nozzle support frame is installed on the rotating shaft of the transfer nozzle R-axis rotating device, the inner layer nozzle is fixedly installed on the lower end of the nozzle support frame, the nozzle switching device includes a driving cylinder, a guide rail and a slider, the guide rail is provided on the nozzle support frame, the slider is slidably installed on the guide rail and is driven up and down by the driving cylinder, and the bottom of the slider is fixedly connected to the outer layer nozzle.

6. The automatic wafer feeding device according to claim 5, characterized in that: The transfer mechanism further includes a visual recognition module and a laser height measurement module, both of which are installed on the Z-axis moving module and are located next to the transfer robot assembly.

7. The automatic wafer feeding device according to claim 1, characterized in that: The wafer bottom identification mechanism is arranged on the left side of the transfer platform, and the wafer top identification mechanism is arranged below the wafer supply and receiving mechanism.

8. The automatic wafer feeding device according to claim 1, characterized in that: The cover plate holding assembly is fixedly arranged below the wafer bottom identification mechanism, and comprises a cover plate holding box and a full material sensor installed above the cover plate holding box.

9. The automatic wafer feeding device according to claim 1, characterized in that: The pick-and-place fixture mechanism is arranged on the left side of the wafer identification mechanism, and includes a Y-axis moving module of the pick-and-place fixture mechanism, a tray, a clamping device and a limit plate. The tray is fixedly mounted on the tray mounting plate and is driven to and fro by the Y-axis moving module of the pick-and-place fixture mechanism. A cam guide groove is provided on the tray, and the limit plate is fixedly mounted on the end of the Y-axis moving module of the pick-and-place fixture mechanism, and a limit groove is provided on the limit plate. The clamping device includes a clamping connecting plate, a cam, a clamping column, a tension spring and a limit block. The clamping connecting plate slides relatively through the tray mounting plate and a limit block is provided at the lower part of the clamping connecting plate. The cam is mounted on the clamping connecting plate and passes through the cam guide groove. The clamping column is fixedly mounted on the end of the tray, the tension spring is installed between the limit block and the tray mounting plate, and the limit block is fixedly mounted on the end of the Y-axis moving module of the pick-and-place fixture mechanism.

10. The automatic wafer feeding device according to claim 1, characterized in that: The basket lifting mechanism is arranged below the pick-and-place fixture mechanism, and includes a basket lifting mechanism, a ball screw, a ball screw driving motor, a fixed plate, a movable plate and a guide shaft. The ball screw driving motor is fixedly installed below the fixed plate to drive the ball screw to rotate. The movable plate and the ball screw are connected by a nut sleeve. The basket lifting mechanism is fixedly installed on the movable plate, and the guide shaft is installed between the fixed plate and the movable plate.

Images