Wafer transfer device

Abstract

The application provides a wafer transfer device, and belongs to the field of semiconductor processing equipment, and specifically comprises a positioning assembly, which can be connected with a wafer and used for driving the wafer to move; the positioning assembly comprises a main fork arm, a flat pulling assembly and a negative pressure vacuumizing device, and a gas flow channel is arranged in the main fork arm; the negative pressure vacuumizing device is connected with the gas flow channel and used for generating suction force at the overflow port, so that the flat pulling assembly can adsorb and position the wafer; compared with the prior art, when the fork head is moved to the position where the wafer is located in the positioning opening and the wafer is in contact with the positioning plate, the flat cylinder drives the positioning plate to move through the work of the negative pressure vacuumizing device, and then the wafer is adsorbed; while the positioning plate moves, the limiting strip cooperates with the clamping plate, so that the clamping plate applies certain auxiliary clamping force to the wafer; since the wafer is mainly positioned through adsorption force at this time, the clamping force received by the wafer is relatively small, the wafer has stability and is prevented from being deformed by clamping.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, specifically relating to a wafer transfer device. Background Technology

[0002] Wafer processing is a midstream manufacturing link in the entire semiconductor industry chain. It requires placing wafers on a processing table, then etching the wafers. After etching is completed, the wafers need to be removed from the etching table and transferred to other locations.

[0003] In existing technologies, wafers are typically held by a robotic arm and then moved to transfer them. However, when a wafer is held by a robotic arm, it is only subjected to the clamping force of the robotic arm. To ensure that the wafer does not separate from the robotic arm during the transfer process, there are certain requirements on the magnitude of the clamping force. Especially when the wafer thickness is small, the wafer is easily deformed after being subjected to the clamping force, and subsequent wafer correction is required, which affects processing efficiency. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer transfer device that enables stable transfer of wafers and reduces stress deformation.

[0005] To achieve the above objectives, the technical solution adopted is a wafer transfer device, including a positioning component that can be connected to the wafer for moving the wafer. The positioning component includes a main fork arm, a fork head, a positioning opening, a flat pulling component, and a negative pressure vacuum device. The main fork arm has a gas flow channel inside. The fork head is connected to the end of the main fork arm. The positioning opening is located on the fork head. The flat pulling component is connected to the fork head, with one end located in the gas flow channel and the other end located in the positioning opening. A flow port is located on the flat pulling component, allowing gas to pass through the flow port and enter the gas flow channel. The negative pressure vacuum device is connected to the gas flow channel to generate suction at the flow port, causing the flat pulling component to adsorb and position the wafer.

[0006] Furthermore, the flat pull assembly includes a flat cylinder, a baffle plate, and a positioning plate. The flat cylinder is movably connected to the fork head. The baffle plate is fixed at the inner end of the flat cylinder and located within the gas flow channel. The positioning plate is fixed at the outer end of the flat cylinder and located within the positioning opening. The flow port is set on the positioning plate. The notch is set on the flat cylinder so that gas can flow out from the notch and enter the gas flow channel.

[0007] Furthermore, an adsorption channel is provided on the fork head, through which the flat cylindrical body passes, and the flat cylindrical body can move axially within the adsorption channel.

[0008] Furthermore, the flat-pull assembly also includes:

[0009] The clamping plate, hinged to the end of the positioning plate, is used to apply clamping force to the wafer.

[0010] Furthermore, the clamping plate is equipped with a limiting strip, which is set inside the positioning opening. During the process of the flat cylinder moving into the gas flow channel, the clamping plate can swing inward through the limiting strip.

[0011] Furthermore, a torsion spring connects the clamping plate and the positioning plate, and the torsion spring applies a restoring force to the clamping plate. An adhesive layer is provided on the clamping plate.

[0012] Furthermore, the positioning component is connected to the detection component, and the two can move synchronously. When the positioning component drives the detection component to move, the detection component detects the wafer on the positioning component.

[0013] Furthermore, the detection assembly includes a detection disk, a light emitting element, and a photoelectric conversion disk. The detection disk is located below the fork head; the light emitting element is mounted on the detection disk and is capable of emitting light onto the wafer on the fork head; the photoelectric conversion disk is located above the wafer and is connected to the fork head.

[0014] Furthermore, a straight groove is provided on the worktable, and a mating rail is provided inside the straight groove. The detection plate can move along the length direction of the mating rail. When the detection plate moves, it can make the light emitting element perform a circular motion.

[0015] Furthermore, the testing device also includes a translation seat and a gear transmission assembly. The translation seat is connected to the testing disk and the mating rail, and can drive the testing disk to move. The gear transmission assembly is set on the translation seat. The gear transmission assembly is connected to a rack, which is located in a linear groove. During the process of the translation seat driving the testing disk to move linearly, the testing disk is rotated through the gear transmission assembly.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: when the fork head is moved to the position opening and the wafer is in contact with the positioning plate, the negative pressure vacuum device works to make the flat cylinder drive the positioning plate to move, and then the wafer is adsorbed. At the same time as the positioning plate moves, the limiting strip cooperates with the clamping plate to make the clamping plate apply a certain auxiliary clamping force to the wafer. Since the wafer is mainly positioned by adsorption force at this time, the clamping force it receives is relatively small, which can make the wafer stable and avoid deformation due to clamping. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the mechanical fork of the present invention;

[0019] Figure 3 This is a schematic diagram of the flat cylindrical structure of the present invention;

[0020] Figure 4 This is a schematic diagram showing the connection between the detection component and the workbench of the present invention;

[0021] Figure 5 This is a schematic diagram of the translation seat structure of the present invention;

[0022] Figure 6 This is a schematic diagram of the detection disc structure of the present invention;

[0023] Figure 7 This is a schematic diagram showing the connection between the photoelectric conversion disk and the fork head of the present invention;

[0024] Figure 8 This is a schematic diagram showing the connection between the translation seat and the main fork arm of the present invention;

[0025] Among them, 1-workbench, 2-moving arm, 3-main fork arm, 4-fork head, 5-positioning opening, 6-gas flow channel, 7-adsorption channel, 8-vacuum pipe, 9-negative pressure vacuum device, 10-tray, 11-flat cylinder, 12-sealing plate, 13-notch, 14-positioning plate, 15-flow port, 16-clamping plate, 17-limiting strip, 18-compression return spring, 19-straight groove, 20-fitting rail, 21-translation seat, 22-detection plate, 23-light Linear transmitter element, 24-photoelectric conversion disk, 25-hanging plate body, 26-support rod, 27-miniature cover, 28-positioning insert, 29-positioning slot, 30-square base, 31-transmission gear disk, 32-side gear disk, 33-rack, 34-lifting arm, 35-round rod, 36-hanging plate, 37-returning plate, 38-guide hole, 39-base body, 40-pushing plate, 41-positioning base plate, 42-tightening spring, 43-anti-detachment block, 44-disc body. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] See Figures 1 to 2 As shown, a wafer transfer device includes a worktable 1 and a positioning component. The positioning component is connected to the worktable 1 via a guide rail, enabling the positioning component to move on the worktable 1. The positioning component removes the etched wafer and transports it to a collection area.

[0029] The positioning component includes a movable arm 2 and a mechanical fork, which together form a positioning and picking arm. A sliding seat is provided on the worktable 1 and is connected to a guide rail. The movable arm 2 on the positioning and picking arm is fixed on the sliding seat. The sliding seat moves on the guide rail, which drives the mechanical fork to move. When the mechanical fork contacts the wafer, it can position the wafer. Then, by continuing to move the mechanical fork, the etched wafer can be removed.

[0030] The aforementioned mechanical fork includes a main fork arm 3 and a fork head 4. The main fork arm 3 is connected to the movable arm 2, and the fork head 4 is connected to the end of the main fork arm 3. The fork head 4 is provided with a positioning opening 5, which allows the wafer to enter the positioning opening 5 of the fork head 4. Then, after the fork head 4 is connected to the wafer, the wafer is positioned.

[0031] Wafer positioning can be achieved through adsorption positioning. For example, a gas flow channel 6 is provided inside the main fork arm 3, and an adsorption channel 7 is provided on the fork head 4. The adsorption channel 7 is connected to the gas flow channel 6 and the positioning opening 5. A rubber pad is provided at the adsorption channel 7 to increase the tightness of the connection between the fork head 4 and the wafer. The main fork arm 3 is connected to a negative pressure vacuum device 9 through a vacuum pipe 8. The operation of the negative pressure vacuum device 9 reduces the gas pressure in the gas flow channel 6 and the adsorption channel 7, generating suction at the port of the adsorption channel 7, which can adsorb and position the wafer. It should be noted that the negative pressure vacuum device 9 should move synchronously with the moving arm 2, so that the length of the vacuum pipe 8 does not need to be changed. For example, a tray 10 is provided on the moving arm 2, and the negative pressure vacuum device 9 is provided on the tray 10.

[0032] However, when adsorbing the wafer's circumference through adsorption channel 7, if there is excessive corrosion or other defects on the wafer's circumference, it may lead to a situation where the wafer cannot be adsorbed and positioned. (See [reference needed]). Figures 1 to 3As shown, a flat cylindrical body 11 can be installed inside the adsorption channel 7. The inner end of the flat cylindrical body 11 is located inside the gas flow channel 6. The cross-sectional area of ​​the gas flow channel 6 is larger than that of the adsorption channel 7. The flat cylindrical body 11 can move axially within the adsorption channel 7. However, a sealing gasket connects the adsorption channel 7 and the flat cylindrical body 11. A sealing baffle 12 is fixed to the inner end of the flat cylindrical body 11. The sealing baffle 12 is located inside the gas flow channel 6, and there is a gap between its edge and the inner wall of the gas flow channel 6. Initially, the sealing baffle 12 seals the adsorption channel 7, creating a negative pressure. After the vacuum device 9 is working, it can drive the flat cylinder 11 to move into the gas flow channel 6. A notch 13 is provided on the flat cylinder 11. When the baffle 12 blocks the adsorption channel 7, the notch 13 is located in the adsorption channel 7. After the flat cylinder 11 moves into the gas flow channel 6, the notch 13 can be exposed. At this time, the airflow can enter from the outer end of the flat cylinder 11, and then flow into the flow channel after passing through the notch 13. If a complete wafer is placed in the positioning opening 5 and in contact with the outer end of the flat cylinder 11, the wafer can be adsorbed and positioned.

[0033] To ensure wafer positioning, an arc-shaped positioning plate 14 is fixed to the outer end of the flat cylindrical body 11. The positioning plate 14 covers the gap between the flat cylindrical body 11 and the adsorption channel 7. An outlet 15 is provided on the positioning plate 14. After the negative pressure vacuum device 9 operates, suction is generated at the outlet 15. At this time, the flat cylindrical body 11, the positioning plate 14, and the sealing plate 12 form a flat pulling assembly, allowing air to pass through the outlet 15 and enter the flat cylindrical body 11. Clamping plates 16 are hinged at both ends of the positioning plate 14. An adhesive layer with a thickness of 1-3 mm is provided on the inner surface of the clamping plates 16. The clamping plates 16 are located within the positioning opening 5 of the fork head 4. Two limiting strips 17 are also provided within the positioning opening 5, located on the sides of the positioning plate 14. The limiting strips 17 are located on the moving path of the clamping plates 16. As the flat cylindrical body 11 flows towards the gas... During the movement within channel 6, the positioning plate 14 is moved, causing the clamping plate 16 to move synchronously. The clamping plate 16 contacts the corresponding limiting strip 17, and the limiting strip 17 limits the clamping plate 16, allowing it to swing inward, thus reducing the distance between the two clamping plates 16. At this time, the clamping plate 16 clamps the wafer, thereby increasing the wafer's stability. A torsion spring is connected at the hinge between the clamping plate 16 and the positioning plate 14, providing a restoring force to the clamping plate 16. When the two clamping plates 16 clamp the wafer, the torsion spring begins to deform and generate a restoring force. When the limiting strip 17 is no longer used, the restoring force of the torsion spring causes the two clamping plates 16 to reset, increasing the distance between them. This allows the wafer to be released, and the operation of the negative pressure vacuum device 9 is paused, stopping the wafer's adsorption and positioning.

[0034] A compression return spring 18 is fitted on the flat cylinder 11. The compression return spring 18 is located between the positioning plate 14 and the adsorption channel 7 of the fork head 4. When the negative pressure vacuum device 9 is working, the flat cylinder 11 is moved, which can compress the compression return spring 18. At this time, the compression return spring 18 has a restoring force. After the negative pressure vacuum device 9 stops working, the flat cylinder 11 is reset under the action of the restoring force of the compression return spring 18. At this time, in conjunction with the restoring force of the torsion spring, the clamping plate 16 releases the wafer.

[0035] After the wafer is positioned by the fork 4, the slide block is moved, thereby moving the wafer. During this process, the wafer's regularity can be detected by the detection component.

[0036] See Figure 1 , Figures 4 to 6 As shown, the detection component is set on the worktable 1. Specifically, a straight groove 19 is provided on the worktable 1. When the sliding seat moves, the fork 4 can move above the straight groove 19, that is, the fork 4 moves along the length direction of the straight groove 19. The detection component is set in the straight groove 19, so that the wafer on the fork 4 can be detected by the detection component.

[0037] The detection component in this technical solution is mainly used to detect the regularity of the wafer, that is, whether the wafer has warped or over-etched edges after etching.

[0038] Figures 4 to 7 As shown, the detection component includes a mating rail 20 disposed within the straight groove 19. The mating rail 20 extends along the length of the straight groove 19. A translation seat 21 is disposed on the mating rail 20. The translation seat 21 is connected to the mating rail 20 and can move on the translation rail. A detection disk 22 is detachably connected to the translation seat 21. A light emitting element 23 is disposed on the detection disk 22. The light emitting element 23 can emit light to the wafer. At the same time, it works in conjunction with the photoelectric conversion disk 24 disposed above the wafer to detect whether the wafer is round. When the wafer is detected to be not round, it indicates that the wafer is deformed or over-etched.

[0039] Specifically, the detection disk 22 includes a disk body 44, and a light emitting element 23 is mounted on the disk body 44. Light is emitted through the light emitting element 23. The straight-line distance between the light emitting element 23 and the center of the disk body 44 is equal to the radius of the wafer. At this time, the wafer and the disk body 44 are coaxial, meaning the light emitted by the light emitting element 23 can hit the edge of the wafer. However, the light is blocked by the edge of the wafer and cannot be received by the photoelectric conversion disk 24. Therefore, the photoelectric conversion disk 24 cannot generate an electrical signal output. If the wafer is deformed (…),… For example, when warping occurs, the wafer is no longer round but becomes elliptical. At this time, after the detection disk 22 rotates, the optical fiber transmitting element makes a circular motion. When the wafer is round, it can block the light. However, when the wafer is deformed, it will not be able to block the optical fiber in some positions, allowing the light to hit the photoelectric conversion disk 24. The photoelectric conversion disk 24 receives the light, converts its energy into an electrical signal, and outputs the electrical signal to the display, forming a distribution image on the display. In this way, it can be intuitively displayed whether the tested wafer is in a qualified state.

[0040] Similarly, when the wafer is over-etched, resulting in gaps at the edges, these gaps can also be detected. In this technical solution, the light emitting element 23 is preferably an infrared emitting element, and the photoelectric conversion disk 24 includes a hanging disk body 25. The hanging disk body 25 is connected to the fork head 4 via a support rod 26. A photodetector (e.g., a photodiode) is provided on the hanging disk body 25 to receive light. Since the original electrical signal generated by the photodetector is very weak (it may be a current in the microampere level or even smaller, or a voltage in the millivolt level), a miniature cover 27 can be provided on the upper surface of the hanging disk body 25. A signal amplifier is installed inside the miniature cover 27. The signal first passes through an amplifier circuit to amplify it to a level that can be processed by subsequent circuits. At the same time, the signal amplifier is connected to a processor / microcontroller, and the amplified signal is sent to the processing chip.

[0041] The aforementioned detection disk 22 and photoelectric conversion disk 24 are complementary components. When replacing the wafer, the detection disk 22 and photoelectric conversion disk 24 also need to be replaced. Therefore, a positioning pin 28 is fixed on the lower surface of the disk body 44. The cross-section of the positioning pin 28 is triangular, quadrilateral, or polygonal. A positioning slot 29 is provided on the translation base 21, and the positioning pin 28 can be inserted into the positioning slot 29. At this time, the detection disk 22 is connected to the translation base 21, and the hanging plate body 25 and the support rod 26 are connected together. The connection is detachable. For example, the base body 39 has a square seat 30 fixed at the end of the support rod 26. The square seat 30 is provided with a horizontal through hole and a limiting blind hole. The hanging plate body 25 is provided with a locking rod and a limiting post. After the locking rod is passed through the horizontal through hole, the limiting post can be inserted into the limiting blind hole. The locking rod is provided with an external thread, and a locking plate is screwed on through the external thread. At this time, the square seat 30 is clamped by the locking plate and the hanging plate body 25, thereby realizing the installation of the hanging plate body 25.

[0042] See Figures 4 to 8 As shown, and to increase the stability of the detection, the detection disk 22 rotates at a relatively slow speed. During the linear motion of the translation seat 21 within the linear groove 19, the detection disk 22 can rotate. Specifically, the translation seat 21 includes a base body 39, which is square and has a groove on its bottom surface. The base body 39 is adapted to the mating rail 20; for example, both the mating rail 20 and the groove have a "T" shaped cross-section. A central groove is provided on the upper surface of the base body 39, and a transmission gear disk 31 is provided within the central groove. An intermediate gear disk and a side gear disk 32 are provided within the base body 39. The intermediate gear disk is connected to the base body 39 via an intermediate shaft, and an outer ring pinion is fixed on the intermediate shaft. The outer ring pinion meshes with the transmission gear disk 31. A flat opening is provided on the side surface of the base body 39, and the edge of the side gear disk 32... The gear 32 extends from the flat opening and meshes with the middle gear 31. The transmission ratio between them is 5:1, meaning that when the side gear 32 rotates five times, the middle gear 32 rotates one time. The aforementioned transmission gear 31, middle gear 32, and side gear 31 form a gear transmission assembly. A rack 33 is provided on the inner surface of the straight groove 19. The rack 33 extends along the length of the straight groove 19 and meshes with the side gear 32. Thus, when the base body 39 moves along the mating rail 20, the side gear 32 can rotate, thereby driving the middle gear 32 to rotate. The positioning slot 29 is located at the center of the transmission gear 31. After the detection disk 22 is docked with the transmission gear 31, the translation seat 21 moves within the straight groove 19, thereby enabling the detection disk 22 to rotate.

[0043] When the aforementioned translation seat 21 moves within the linear groove 19, the mechanical fork simultaneously performs linear motion, meaning the mechanical fork and translation seat 21 move simultaneously. For example, a vertically arranged lifting arm 34 is connected to the lower surface of the main fork arm 3, and a horizontal push arm is connected to the lower end of the lifting arm 34. The horizontal push arm is connected to the translation seat 21. When the main fork arm 3 moves toward the wafer, a pushing force is applied to the translation seat 21 through the horizontal push arm, so that the two move synchronously and in the same direction. Conversely, when the main fork arm 3 drives the fork head 4 to reset and move, a pulling force is applied to the translation seat 21 through the horizontal push arm, so that the two reset simultaneously.

[0044] The horizontal push arm consists of two round rods 35 and a hanging plate 36. The two round rods 35 are parallel to each other and horizontally arranged. The mating rail 20 is parallel to the round rods 35. One end of each round rod 35 on the same side is fixed to the hanging plate 36. A return plate 37 is fixed between the other ends of the two round rods 35. The hanging plate 36 is fixed to the lower end of the boom 34. At the same time, two guide holes 38 are provided on the base body 39, and both guide holes 38 pass through the base body 39. The two round rods 35 are respectively set in the corresponding guide holes 38. Inside, a push plate 40 and a positioning base plate 41 are connected by two round rods 35. The push plate 40 is movably connected to the round rods 35, so that the base body 39 is located between the push plate 40 and the return plate 37. A clamping spring 42 is sleeved on each round rod 35. The clamping spring 42 is a spring with restoring force after compression. The clamping spring 42 is located between the push plate 40 and the positioning base plate 41. There is an anti-detachment block 43 at the front end of the mating rail 20, which can prevent the base body 39 from detaching from the mating rail 20 during the forward movement.

[0045] Initially, the detection disk 22 on the translation seat 21 is located directly below the fork head 4. When the fork head 4 moves towards the wafer (at this time, the wafer has completed the etching process and is located on the processing table), the fork head 4 and the detection disk 22 on the translation seat 21 move simultaneously. When the translation seat 21 abuts against the anti-detachment block 43, the translation seat 21 can no longer move. At this time, the fork head 4 can continue to move forward, causing the clamping spring 42 to be compressed. Then, the fork head 4 can be inserted into the etching chamber. After the positioning plate 14 on the fork head 4 contacts the wafer, the negative pressure vacuum device 9 works to achieve wafer positioning. Then, the sliding seat resets and moves, driving the main fork arm 3 and the fork head 4 to reset and move. Initially, the wafer detection disk 22 on the fork head 4 cannot be aligned longitudinally. As the main fork arm 3 moves back to its original position, the restoring force of the clamping spring 42 prevents the translation seat 21 from moving during its initial reset. When the return plate 37 contacts the translation seat 21, the detection disk 22 on the translation seat 21 is located directly below the wafer on the fork head 4. Then, as the main fork arm 3 continues to move back to its original position, it drives the translation seat 21 to move within the straight groove 19. During this process, the detection disk 22 on the translation seat 21 rotates, causing the light emitting element 23 to move in a circular motion, thereby detecting the wafer. In other words, wafer detection can be achieved during the wafer transfer process, improving processing efficiency.

[0046] In this technical solution, the sliding seat is moved by a drive component. The drive component is set on the worktable 1. Specifically, the drive component includes a drive motor, which is connected to a synchronous belt through a drive wheel. A synchronous pulley is also set on the worktable 1. The synchronous belt is connected to both the drive wheel and the synchronous pulley. At this time, the synchronous belt forms a closed state. The sliding seat is connected to the synchronous belt through a positioning clamp. The operation of the drive motor can drive the sliding seat to move. According to the rotation direction of the drive wheel, the movement direction of the sliding seat can be changed, and finally the linear reciprocating motion of the sliding seat is realized.

[0047] To enhance safety, a crash bar is installed on the sliding seat. The crash bar has a shock-absorbing and telescopic structure. A stop seat is also provided on the worktable 1. When the sliding seat moves close to the stop seat, the crash bar contacts the stop seat. An extreme position sensor is installed on the stop seat, which is connected to the drive motor. When the crash bar contacts the stop seat, the extreme position sensor outputs a control signal to the drive motor, at which point the drive motor stops working to avoid damage to the equipment.

[0048] In addition, the upper surface of the detection disk 22 in this technical solution is not a plane, but a sphere. Even if there is residual liquid on the wafer, the residual liquid can flow downward after dripping onto the detection disk 22. However, it should be noted that the bottom area of ​​the detection disk 22 is larger than the top area of ​​the translation seat 21. At the same time, a drain trough is provided in the straight groove 19 so that the liquid can flow into the drain trough and finally flow out from the drain trough. The specific structure of the drain trough is set in the prior art, so it will not be described in detail.

[0049] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer transfer device, characterized in that, include: Workbench (1); Positioning components, which can be connected to the wafer, are used to move the wafer; The positioning component includes: The main fork arm (3) has an internal gas flow channel (6); The fork head (4) is connected to the end of the main fork arm (3); A positioning opening (5) is provided on the fork head (4); The flat pull assembly is connected to the fork head (4) with one end located in the gas flow channel (6) and the other end located in the positioning opening (5); The flow port (15) is set on the flat pull assembly so that the gas can enter the gas flow channel (6) after passing through the flow port (15); The negative pressure vacuum device (9) is connected to the gas flow channel (6) to generate suction at the flow port (15) so that the flat pulling assembly can adsorb and position the wafer. The flattening component includes: A flat cylindrical body (11) is movably connected to the fork head (4); A baffle plate (12) is fixed to the inner end of the flat cylinder (11) and located in the gas flow channel (6); The positioning plate (14) is fixed to the outer end of the flat cylinder (11) and located inside the positioning opening (5), and the flow port (15) is provided on the positioning plate (14); A notch (13) is provided on the flat cylindrical body (11) so that gas can flow out from the notch (13) and enter the gas flow channel (6); The clamping plate (16) is hinged to the end of the positioning plate (14) and is used to apply clamping force to the wafer; The clamp (16) is fitted with a limiting strip (17), which is set inside the positioning opening (5). During the process of the flat cylinder (11) moving into the gas flow channel (6), the clamp (16) can swing inward through the limiting strip (17).

2. The wafer transfer device according to claim 1, characterized in that, The fork head (4) is provided with an adsorption channel (7), and the flat cylinder (11) passes through the adsorption channel (7). The flat cylinder (11) can move axially within the adsorption channel (7).

3. The wafer transfer device according to claim 1, characterized in that, A torsion spring is connected between the clamping plate (16) and the positioning plate (14), and a restoring force is applied to the clamping plate (16) by the torsion spring. An adhesive layer is provided on the clamping plate (16).

4. The wafer transfer device according to claim 1, characterized in that, The positioning component is connected to the detection component, and the two can move synchronously. The detection component is set on the worktable (1). When the positioning component drives the detection component to move, the wafer on the positioning component is detected by the detection component.

5. The wafer transfer device according to claim 4, characterized in that, The detection component includes: The detection plate (22) is located below the fork head (4); A light emitting element (23) is mounted on the detection disk (22) and is capable of emitting light onto the wafer on the fork (4); The photoelectric conversion disk (24) is located above the wafer and connected to the fork head (4).

6. The wafer transfer device according to claim 5, characterized in that, The worktable (1) is provided with a straight groove (19), and a mating rail (20) is provided in the straight groove (19). The detection disk (22) can move along the length direction of the mating rail (20). When the detection disk (22) moves, it can make the light emitting element (23) make a circular motion.

7. The wafer transfer device according to claim 6, characterized in that, The detection component also includes: The translation seat (21) is connected to the detection plate (22) and the mating rail (20) and can drive the detection plate (22) to move; The gear transmission assembly is mounted on the translation seat (21); The gear transmission assembly is connected to a rack (33), which is located in a straight groove (19); During the linear movement of the detection disk (22) driven by the translation seat (21), the detection disk (22) is rotated through the gear transmission assembly.

Images