End effector, robot, transfer apparatus, and semiconductor system

By using memory alloy adsorbents and flexible seals that expand when heated and contract when cooled, the problem of wafer deformation under high temperature conditions is solved, and efficient and safe wafer handling and adaptive handling of wafers in high-density wafer boats are achieved.

CN120809659AActive Publication Date: 2025-10-17SHANGHAI BANGXIN SEMI TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202511323904.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-17
Publication Date
2025-10-17
Estimated Expiration
2045-09-17

AI Technical Summary

Technical Problem

Under high temperature conditions, wafers are prone to deformation during the handling process of the robot, resulting in adsorption failure and possible damage. The existing technology solves this problem by increasing the height of the suction cup, which leads to a reduction in the number of wafers in the wafer boat.

Method used

The adsorbent is made of a memory alloy material that expands when heated and contracts when cooled, combined with a flexible material seal with a melting point greater than or equal to 200°C. The adsorbent expands at high temperatures to avoid contact with the wafer, and contracts at low temperatures to increase sealing, adapting to wafer handling in different temperature environments.

Benefits of technology

It effectively avoids deformation and contact of wafers during transportation, improves the success rate of adsorption, allows high-density wafer transportation in wafer boats, enhances the sealing between the adsorption parts and the wafers, and prevents the appearance of gaps.

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Abstract

The invention provides an end effector, a manipulator, a conveying device and a semiconductor system.The end effector comprises an extension part, an adsorption part and a sealing part, the adsorption part is made of memory alloy which expands after being heated and contracts after being cooled, when wafers in high-temperature environments such as a process cavity are carried, the environment temperature is high, and due to the influence of the environment temperature, the sealing part can be used for sealing the sealing part; the adsorption part is heated to expand, so that the distance between the wafer and the extension part can be increased when the wafer is adsorbed, the edge of the wafer is prevented from being in contact with the extension part when the wafer deforms, and when the wafer in a normal-temperature environment such as a wafer boat is carried, the environment temperature is lower than the high-temperature environment temperature such as a process cavity, and the adsorption part shrinks. The second opening is provided with the adsorption part, so that the wafer in the high-density wafer boat can be carried, the sealing part is arranged on the second opening, the sealing part is made of the flexible material, the sealing performance between the adsorption part and the wafer can be improved, and a gap between the adsorption part and the wafer when the adsorption part deforms due to the temperature is avoided.
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Citation Information

Patent Citations

  • Ultralow-temperature wafer injection platform

    CN113990727A

  • Wafer carrying assembly, robot and transmission device

    CN219404297U

  • Wafer conveying protection device and wafer conveying equipment

    CN222653931U

  • Dry etching apparatus

    JP1994151366A

  • Substrate transport apparatus and substrate transport method

    JP2004079569A