Liquid cooling plate, thermal management device and control method of thermal management device

Abstract

The invention relates to the technical field of battery cooling, and provides a liquid cooling plate, a heat management device and a control method thereof. The liquid cooling plate comprises a heat exchange plate, a flow channel substrate connected with the heat exchange plate, and a plurality of adjusting assemblies arranged on the flow channel substrate; each adjusting assembly comprises a driving part and a flow channel adjusting unit in driving connection with the driving part and is driven by the driving part, and the flow channel adjusting units can move towards the heat exchange plates in the thickness direction of the flow channel base plate to adjust the distance between the flow channel adjusting units and the heat exchange plates so as to adjust the flow direction and flow of the flow channel. According to the liquid cooling plate disclosed by the invention, the layout form and the flow volume of the flow channels can be adjusted according to different cooling or heating requirements, the problem of poor universality caused by fixed flow channels of a traditional liquid cooling plate is solved, and the liquid cooling plate has a good use effect.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of battery cooling, in particular to a liquid cooling plate, a thermal management device and a control method thereof. BACKGROUND

[0002] The water cooling plate (also known as a liquid cooling plate) is a heat exchanger for cooling the heat source to control the temperature of the heat source within the design temperature range. The heat source (such as a battery cell) is in direct contact with the heat exchange surface of the water cooling plate, and the air gap is usually filled with thermal conductive glue to reduce the thermal resistance and improve the heat dissipation.

[0003] In the prior art, the water cooling plate is usually arranged at the bottom of the lower shell of the battery, and the battery module is placed on the water cooling plate. The cooling medium inside the water cooling plate cools or heats the battery module, so that the battery cells in the battery module are within the appropriate temperature range. However, the existing water cooling plate has the problems of fixed flow channel layout and inability to adjust the flow rate of the cooling liquid in the flow channel, poor universality, and difficulty in meeting the cooling or heating requirements under different working conditions. SUMMARY

[0004] Therefore, the present application aims to provide a liquid cooling plate which is beneficial to adjust the flow channel layout and flow rate.

[0005] To achieve the above-mentioned purposes, the technical scheme of the present application is as follows:

[0006] A liquid cooling plate comprises a heat exchange plate, a flow channel base plate connected to the heat exchange plate, and a plurality of adjustment assemblies arranged on the flow channel base plate;

[0007] Each adjustment assembly comprises a driving part and a flow channel adjustment unit connected to the driving part, and the heat exchange plate, the flow channel base plate and each flow channel adjustment unit form a flow channel therebetween;

[0008] Under the driving of the driving part, the flow channel adjustment unit can move towards the heat exchange plate along the thickness direction of the flow channel base plate, adjust the spacing between the flow channel adjustment unit and the heat exchange plate, and adjust the flow direction and flow rate of the flow channel.

[0009] Further, the flow channel base plate is provided with a plurality of recessed portions, and each recessed portion is arranged along the length direction of the flow channel base plate; each recessed portion comprises a groove arranged along the thickness direction of the flow channel base plate, and the groove is a plurality of grooves arranged along the width direction of the flow channel base plate, and each groove is provided with the flow rate adjustment unit.

[0010] Further, the heat exchange plate is provided with an inlet water nozzle and an outlet water nozzle, the inlet water nozzle and the outlet water nozzle are communicated with the flow channel; the flow channel base plate is provided with a buffer groove corresponding to the inlet water nozzle and the outlet water nozzle respectively, each buffer groove is communicated with the flow channel, and on both sides of each buffer groove along the width direction of the flow channel base plate, a plurality of grooves are arranged.

[0011] Further, along the thickness direction of the flow channel base plate, the driving part and the flow channel adjusting unit are arranged on both sides of the flow channel base plate, and the driving part is located on the side of the flow channel base plate away from the heat exchange plate; the flow channel adjusting unit adopts a magnet, the driving part includes an electromagnetic driving unit for magnetically attracting the magnet, and an elastic member is arranged between the flow channel adjusting unit and the flow channel base plate.

[0012] Further, the electromagnetic driving unit includes an electromagnetic coil and a magnetic core arranged in the electromagnetic coil; and / or the elastic member adopts a spring.

[0013] Further, the bottom plate connected with the flow channel base plate is further included, and the bottom plate is located on the side of the flow channel base plate away from the heat exchange plate.

[0014] Further, the flow channel base plate and the heat exchange plate are sealed; and / or further including a stud and a nut, the stud is arranged on the heat exchange plate through a press-in process, the stud is connected with the nut after penetrating through the flow channel base plate and the bottom plate, so as to form the connection between the heat exchange plate, the flow channel base plate and the bottom plate.

[0015] Compared with the prior art, the present application has the following advantages:

[0016] (1) The liquid cooling plate drives the flow channel adjusting unit to move through the driving part, so that the distance between the flow channel adjusting unit and the heat exchange plate changes to adjust the flow direction and flow rate of the flow channel, and the layout form and flow capacity of the flow channel can be adjusted according to different cooling or heating requirements, thereby solving the problem of poor universality caused by the fixed flow channel of the traditional liquid cooling plate.

[0017] (2) By arranging a plurality of recesses along the length direction of the flow channel base plate, and by arranging a plurality of grooves along the width direction of the flow channel base plate in each recess, and by arranging a flow adjusting unit in each groove, when it is necessary to adjust the layout of the flow channel and the flow capacity, the distance between each flow adjusting unit and the heat exchange plate can be adjusted, which is convenient to operate, and since each flow adjusting unit is independently driven, it is also beneficial to realize the diversified design of the layout form and flow capacity of the flow channel.

[0018] (3) By setting the buffer tank, the cooling liquid entering the flow channel can be buffered, and the local pressure loss can be reduced, and at the same time, the cooling liquid flowing out of the flow channel can be buffered, so that the cooling liquid can flow into or out of the flow channel more smoothly.

[0019] (4) The flow channel adjusting unit adopts a magnet, the driving part includes an electromagnetic driving unit, and an elastic member is arranged between the flow channel adjusting unit and the flow channel base plate, so that the position of the flow channel adjusting unit can be flexibly adjusted, and the flow channel with different flow capacities can be adjusted.

[0020] (5) The electromagnetic driving unit includes an electromagnetic coil and a magnetic core, and the elastic member adopts a spring, so that the structure is simple and the cost can be reduced.

[0021] (6) By arranging the bottom plate, the flow channel base plate and each adjusting component can be protected.

[0022] (7) The flow channel base plate and the heat exchange plate are sealingly arranged, so that the sealing property of the flow channel can be ensured; at the same time, by pressing the stud on the heat exchange plate, the surface of the heat exchange plate can be ensured without protruding structure, so as to avoid interference with the assembly of the battery cell, so that the flatness of the heat exchange plate is not affected by the assembly process, and the problem of poor flatness after traditional liquid cooling plate brazing can be solved.

[0023] The application also provides a heat management device, which comprises a collecting part and a control part connected with each other, and the liquid cooling plate as described above;

[0024] The collecting part is arranged in the liquid cooling plate and is used for collecting the temperature and pressure of the cooling liquid in the liquid cooling plate;

[0025] The control part is connected with each driving part in the liquid cooling plate and can control the action of each driving part based on the collection signal transmitted by the collection unit;

[0026] Under the driving of each driving part, each flow channel adjusting unit can move along the thickness direction of the flow channel base plate to the heat exchange plate, so as to adjust the distance between the flow channel adjusting unit and the heat exchange plate, and to adjust the flow direction and flow capacity of the flow channel.

[0027] Further, the collecting part includes a temperature collection unit and a pressure collection unit, each flow channel adjusting unit is provided with the temperature collection unit, the inlet and outlet of the flow channel are provided with the pressure collection unit, and the temperature collection unit and the pressure collection unit are connected with the control part; and / or, the control part adopts BMS.

[0028] The heat management device provided by the application can realize real-time control of each driving part according to the temperature change in the liquid cooling plate, so that the layout and flow of the flow channel are adaptively adjusted, and the temperature management effect is good.

[0029] The application further provides a control method for the heat management device.

[0030] The acquisition part obtains temperature and pressure information in the liquid cooling plate and transmits the obtained acquisition signal to the control unit.

[0031] The control part formulates a cooling scheme according to the acquisition signal and controls each driving part to move along the thickness direction of the flow channel substrate to the heat exchange plate, so as to adjust the distance between each flow channel adjusting unit and the heat exchange plate, and adjust the flow direction and flow of the flow channel.

[0032] The control method provided by the application can realize real-time control of each driving part according to the temperature change in the liquid cooling plate, so that the layout and flow of the flow channel are adaptively adjusted, and the control logic is simple and easy to implement. BRIEF DESCRIPTION OF DRAWINGS

[0033] The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the application, and are incorporated herein for explanation by reference. In the drawings:

[0034] Figure 1 An exploded view of the liquid cooling plate according to an embodiment of the application;

[0035] Figure 2 A partial view of the structure shown in A; Figure 1 An enlarged view of A in the middle;

[0036] Figure 3 A structure schematic view of the structure shown in A from another perspective; Figure 1 A structure schematic view of the structure shown in A from another perspective;

[0037] Figure 4 A partial sectional view of the liquid cooling plate according to an embodiment of the application;

[0038] Figure 5 A structure schematic view of the structure shown in A after the movement of the partial flow channel adjusting unit; Figure 4 A structure schematic view of the structure shown in A after the movement of the partial flow channel adjusting unit;

[0039] Figure 6 A structure schematic view of the structure shown in A from another perspective; Figure 5 A structure schematic view of the structure shown in A from another perspective;

[0040] Figure 7Structure diagram of one of the flow channels described in the embodiments of the present application;

[0041] Figure 8 Structure diagram of another example of the flow channel described in the embodiments of the present application;

[0042] Figure 9 Structure diagram of the heat management device described in the embodiments of the present application;

[0043] Figure 10 Flow chart of the control method described in the embodiments of the present application;

[0044] Explanation of reference signs:

[0045] 100, heat exchange plate;

[0046] 101, liquid inlet nozzle; 102, liquid outlet nozzle; 103, press riveting hole;

[0047] 200, flow channel base plate;

[0048] 201, groove; 202, buffer groove; 203, first via hole; 204, first sealing groove; 205, first sealing ring;

[0049] 300, adjusting assembly;

[0050] 301, driving part; 3011, electromagnetic coil; 3012, magnetic core; 302, flow channel adjusting unit; 303, elastic member;

[0051] 400, bottom plate;

[0052] 401, second via hole; 402, second sealing groove; 403, second sealing ring;

[0053] 500, stud;

[0054] 600, nut;

[0055] 700, collecting part;

[0056] 701, temperature collecting unit; 702, pressure collecting unit;

[0057] 800, control part;

[0058] 900, power supply. DETAILED DESCRIPTION

[0059] In order to make the technical solutions of the present application and their advantages clearer and more understandable, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0060] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other in the case of no conflict.

[0061] In addition, in the description of the present application, it should be noted that if the terms indicating the orientation or position relationship such as "upper", "lower", "inner", "outer" and the like appear, they are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as limiting the indicated device or element to have a specific orientation, to be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, if the terms "first", "second" and the like appear, they are also only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0062] In addition, in the description of the present application, unless otherwise explicitly limited, the terms "mounting", "connection", "connection", "connector" should be understood broadly. For example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood in combination with the specific circumstances.

[0063] In the present application, the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0064] In the following, the present application will be specifically described through exemplary embodiments. However, it should be understood that the elements, structures and features in one embodiment can also be beneficially combined into other embodiments without further description.

[0065] The embodiment of the first aspect of the present application provides a liquid cooling plate which can adjust the layout form and flow capacity of the flow channel according to different cooling or heating requirements, and has good versatility.

[0066] In the prior art, the liquid cooling plate is usually arranged at the bottom of the lower shell of the battery, the battery module is placed on the liquid cooling plate, and the cooling medium inside the liquid cooling plate cools or heats the battery module, so that the battery cells in the battery module are in an appropriate temperature range. However, the existing liquid cooling plate has the problems of fixed flow channel layout and inability to adjust the flow capacity of the cooling liquid in the flow channel, poor versatility, and difficulty in meeting the cooling or heating requirements under different working conditions.

[0067] In view of this, in order to overcome the deficiencies in the prior art, in the liquid cooling plate of the embodiment, in combination with the drawings, the overall design includes a heat exchange plate 100, a flow channel base plate 200 connected to the heat exchange plate 100, and a plurality of adjusting assemblies 300 provided on the flow channel base plate 200.

[0068] Each adjusting assembly 300 includes a driving part 301 and a flow channel adjusting unit 302 connected to the driving part 301, and the heat exchange plate 100, the flow channel base plate 200, and each flow channel adjusting unit 302 form a flow channel therebetween. Under the driving of the driving part 301, the flow channel adjusting unit 302 can move along the thickness direction of the flow channel base plate 200 to the heat exchange plate 100 to adjust the spacing between the flow channel adjusting unit 302 and the heat exchange plate 100, thereby adjusting the flow direction and flow rate of the flow channel.

[0069] Therefore, by driving the flow channel adjusting unit 302 to move through the driving part 301, the spacing between the flow channel adjusting unit 302 and the heat exchange plate 100 changes, thereby adjusting the flow direction and flow rate of the flow channel. In addition, the layout form and flow rate of the flow channel can be adjusted according to different cooling or heating requirements, thereby solving the problem of poor universality caused by the fixed flow channel of the conventional liquid cooling plate.

[0070] Based on the above overall introduction, specifically, in some example embodiments, a flow channel cavity is formed between the heat exchange plate 100 and the flow channel base plate 200. When the flow channel adjusting unit 302 in each adjusting assembly 300 moves along the thickness direction of the flow channel base plate 200 to the heat exchange plate 100, that is, moves into the flow channel cavity, the flow channel arrangement form and flow rate can be changed based on the different depths of the flow channel adjusting unit 302 extending into the flow channel cavity, for example Figure 7 the flow channel is arranged in a "U" shape, Figure 8 the flow channel is arranged in a snake shape.

[0071] It should be noted that the direction-related expressions in the embodiment are only exemplary descriptions of the embodiment. In specific implementation, the direction expressions in the embodiment vary with the setting direction of the liquid cooling plate, that is, the directions in the embodiment refer to a relative coordinate system based on the liquid cooling plate.

[0072] In some example embodiments, in combination with Figure 1 , Figure 2 and Figure 4As shown, the flow channel substrate 200 of the embodiment is provided with a plurality of concave portions, which are arranged along the length direction of the flow channel substrate 200. Each of the concave portions includes a groove 201 arranged along the thickness direction of the flow channel substrate 200. The groove 201 is provided with a plurality of flow adjusting units arranged along the width direction of the flow channel substrate 200.

[0073] It can be understood that, by arranging a plurality of concave portions along the length direction of the flow channel substrate 200, and by arranging a plurality of grooves 201 along the width direction of the flow channel substrate 200 in each of the concave portions, and by arranging a flow adjusting unit in each of the grooves 201, the spacing between the flow adjusting unit and the heat exchange plate 100 can be adjusted when it is necessary to adjust the flow channel layout and the flow capacity, which is convenient to operate. In addition, since each flow adjusting unit is independently driven, the diversification design of the flow channel layout and the flow capacity can be realized.

[0074] In a specific implementation, the groove 201 of the embodiment is not arranged through the thickness direction of the flow channel substrate 200, so as to avoid the cooling liquid flowing out of the flow channel substrate 200. The flow adjusting unit of the embodiment is preferably arranged in the groove 201. For example, the projection profile of the flow adjusting unit along the thickness direction of the flow channel substrate 200 can be preferably rectangular, circular, or the like. In the embodiment, the projection profile of the flow adjusting unit along the thickness direction of the flow channel substrate 200 is taken as an example for description, and the projection profile of the groove 201 along the thickness direction of the flow channel substrate 200 is also taken as an example for description. Details are not described herein.

[0075] In addition, the flow channel adjusting unit 302 of the embodiment has a fully open state with the largest spacing from the heat exchange plate 100, for example, the first flow channel adjusting unit 302 on the left side shown in Figure 5 has a closed state with the smallest spacing from the heat exchange plate 100, for example, the second flow adjusting unit on the left side shown in Figure 5 has a half-open state with an intermediate spacing from the heat exchange plate 100, for example, the third flow adjusting unit on the left side shown in Figure 5 . That is, the flow channel adjusting unit 302 can have different opening sizes based on the driving of the driving part 301.

[0076] At this time, based on the arrangement of each of the concave portions and each of the grooves 201, the flow channel can complete the adjustment of the flow channel arrangement and the flow channel flow capacity depending on the different use states of each of the flow channel adjusting units 302. As described above, Figure 7 and Figure 8 , the blue flow channel adjusting units 302 are all in the fully open state, and the orange flow channel adjusting units 302 are all in the closed state, so that Figure 7 the flow channel in Figure 8 is arranged in a snake-like manner.

[0077] In addition, in some exemplary embodiments of the present invention, Figure 1 and Figure 2 As shown, the heat exchange plate 100 is provided with a liquid inlet nozzle 101 and a liquid outlet nozzle 102, both of which are connected to the flow channel. Simultaneously, the flow channel substrate 200 is provided with buffer grooves 202 corresponding to the liquid inlet nozzle 101 and the liquid outlet nozzle 102, respectively. Each buffer groove 202 is connected to the flow channel, and multiple grooves 201 are provided on both sides of each buffer groove 202 along the width direction of the flow channel substrate 200 in the inner recess corresponding to each buffer groove 202.

[0078] By providing the buffer groove 202, the coolant entering the flow channel can be buffered to reduce local pressure loss. At the same time, the coolant flowing out of the flow channel can also be buffered, thereby allowing the coolant to flow into or out of the flow channel more smoothly.

[0079] In this way, when the high-speed coolant rushes vertically into the liquid cooling plate through the inlet nozzle 101, it can be buffered to a certain extent in the buffer groove 202 corresponding to the inlet nozzle 101, and then flow into the flow channel after the speed is reduced and stabilized, which can reduce local pressure loss. Similarly, when the coolant in all flow channels converges and flows out of the vertical outlet nozzle 102, the coolant can also be slowed down to a certain extent in the buffer groove 202 corresponding to the outlet nozzle 102, and then flow out of the nozzle smoothly, which can effectively reduce pressure loss.

[0080] It is worth mentioning that, corresponding to the inner recess of each buffer groove 202, each buffer groove 202 is provided with multiple grooves 201 on both sides along the width direction of the flow channel substrate 200. Specifically, along the width direction of the flow channel substrate 200, each buffer groove 202 is provided with one or more grooves 201 on both sides. This can be considered as a staggered arrangement consisting of a certain number of grooves 201, one buffer groove 202, a certain number of grooves 201, another buffer groove 202, and a certain number of grooves 201. Moreover, in this embodiment, the size of each buffer groove 202 along the length direction of the flow channel substrate 200 can be appropriately increased to enhance the buffering effect. It should be noted that in this case, each buffer groove 202 corresponds to multiple inner recesses.

[0081] In the specific structure, in order to ensure the better buffering effect on the cooling liquid, the width dimension W1 of each buffering groove 202 along the length direction of the flow channel base plate 200 is preferably set between 20-100mm, and for example, can be specifically 20mm, 60mm or 100mm, etc.; the length dimension L1 of each buffering groove 202 along the width direction of the flow channel base plate 200 is preferably set between 30-150mm, and for example, can be specifically 30mm, 90mm or 150mm, etc.; the depth dimension H1 of each buffering groove 202 along the thickness direction of the flow channel base plate 200 is preferably set between 5-15mm, and for example, can be specifically 5mm, 10mm or 15mm, etc.

[0082] Furthermore, in the embodiment, in order to ensure the realization of the flow channel arrangement form for the diversification adjustment of the flow capacity, the width dimension W2 of each flow channel adjustment unit 302 along the length direction of the flow channel base plate 200 is preferably set between 3-50mm, and for example, can be specifically 3mm, 10mm, 20mm, 30mm or 50mm, etc.; the length dimension L2 of each flow channel adjustment unit 302 along the width direction of the flow channel base plate 200 is preferably set between 3-50mm, and for example, can be specifically 3mm, 10mm, 20mm, 30mm or 50mm, etc.; the thickness dimension H2 of each flow channel adjustment unit 302 along the thickness direction of the flow channel base plate 200 is preferably set between 3-10mm, and for example, can be specifically 3mm, 7mm or 10mm, etc. It is noted that the spacing (i.e. the depth of the flow channel along the thickness direction of the flow channel base plate 200) S between the heat exchange plate 100 and the flow channel base plate 200 should not be greater than H2, so as to ensure that each flow channel adjustment unit 302 has a closed state.

[0083] In some exemplary embodiments of the embodiment, as shown in Figure 3 and Figure 4 along the thickness direction of the flow channel base plate 200, the driving part 301 and the flow channel adjustment unit 302 are arranged on the two sides of the flow channel base plate 200, and the driving part 301 is located on the side of the flow channel base plate 200 away from the heat exchange plate 100. Moreover, the flow channel adjustment unit 302 adopts a magnet, the driving part 301 includes an electromagnetic driving unit for magnetically attracting the magnet, and an elastic member 303 is arranged between the flow channel adjustment unit 302 and the flow channel base plate 200.

[0084] By adopting the magnet for the flow channel adjustment unit 302, the electromagnetic driving unit for the driving part 301, and the elastic member 303 arranged between the flow channel adjustment unit 302 and the flow channel base plate 200, the flexible adjustment of the position of the flow channel adjustment unit 302 can be realized, and the adjustment of the flow capacity of the flow channel can be realized.

[0085] In some example embodiments, the electromagnetic driving unit comprises an electromagnetic coil 3011 and a magnetic core 3012 arranged in the electromagnetic coil 3011, so that the opening size of the flow channel adjusting unit 302 can be adjusted by controlling the current of the electromagnetic coil 3011. As a preferred embodiment, the elastic member 303 is a spring. In this way, the adjusting assembly 300 is simple in structure and can be designed to reduce cost.

[0086] To ensure that the spring has sufficient elastic force, the diameter D1 of the spring wire of the spring is preferably between 0.2-1mm, for example, 0.2mm, 0.6mm or 1mm, etc.; the outer diameter D2 of the spring is preferably between 4-40mm, for example, 4mm, 10mm, 20mm, 30mm or 40mm, etc.; and the stiffness of the spring is preferably between 5-10N / mm, for example, 5N / mm, 7N / mm or 10N / mm, etc.

[0087] In some example embodiments, as shown in Figure 1 and Figure 3 the liquid cooling plate further comprises a bottom plate 400 connected to the flow channel base plate 200, and the bottom plate 400 is located on the side of the flow channel base plate 200 away from the heat exchange plate 100. By arranging the bottom plate 400, the flow channel base plate 200 and the adjusting assembly 300 can be protected.

[0088] In some example embodiments, as shown in Figure 1 and Figure 3 the flow channel base plate 200 and the heat exchange plate 100 are sealed, so as to ensure the sealing of the flow channel. In some example embodiments, a first sealing groove 204 can be arranged on the flow channel base plate 200 along the circumference thereof, and a first sealing ring 205 can be arranged in the first sealing groove 204. When the flow channel base plate 200 and the heat exchange plate 100 are connected, the first sealing ring 205 is pressed and forms a seal between the two.

[0089] In some example embodiments, the flow channel base plate 200 and the bottom plate 400 are sealed. In some example embodiments, a second sealing groove 402 can be arranged on the bottom plate 400 along the circumference thereof, and a second sealing ring 403 can be arranged in the second sealing groove 402. When the flow channel base plate 200 and the bottom plate 400 are connected, the second sealing ring 403 is pressed and forms a seal between the two.

[0090] Further, the first sealing ring 205 and the second sealing ring 403 are preferably in the shape of "O" or rectangle, and each of the sealing rings is preferably made of EPDM (Ethylene Propylene Diene Monomer) or silicone rubber material to have better sealing performance.

[0091] Meanwhile, in some example embodiments, the liquid cooling plate further comprises studs 500 and nuts 600, the studs 500 are arranged on the heat exchange plate 100 through a press riveting process, and the studs 500 are connected to the nuts 600 after penetrating through the flow channel base plate 200 and the bottom plate 400 to form a connection between the heat exchange plate 100, the flow channel base plate 200 and the bottom plate 400.

[0092] It can be understood that by press riveting the studs 500 on the heat exchange plate 100, the surface of the heat exchange plate 100 can be ensured to have no protruding structure, avoiding interference with the assembly of the battery cell, so that the flatness of the heat exchange plate 100 is not affected by the assembly process, thereby solving the problem of poor flatness after traditional brazing of the liquid cooling plate.

[0093] Specifically, along the thickness direction of the flow channel base plate 200, the studs 500 press riveted on the heat exchange plate 100 penetrate through the flow channel base plate 200 and at least partially extend into the bottom plate 400, and the nuts 600 are located on the side of the bottom plate 400 away from the flow channel base plate 200. Further, the heat exchange plate 100 is provided with a press riveting hole 103 for press riveting the studs 500, the flow channel base plate 200 is provided with a first through hole 203 for the studs 500 to penetrate through, and the bottom plate 400 is provided with a second through hole 401 for the studs 500 to penetrate through, and if necessary, the side of the bottom plate 400 away from the flow channel base plate 200 can be further provided with an assembly hole in communication with the second through hole 401 to accommodate the nuts 600, avoiding the nuts 600 protruding to affect the arrangement and application of the liquid cooling plate.

[0094] The number and arrangement of the studs 500 and the nuts 600 can be set and adjusted according to the connection requirements among the heat exchange plate 100, the flow channel base plate 200 and the bottom plate 400, for example, there can be several studs 500 (and nuts 600), and the studs 500 (and nuts 600) are arranged at intervals along the circumference of the heat exchange plate 100.

[0095] In some example embodiments, to ensure that the heat exchange plate 100 has sufficient structural strength, in specific implementation, the thickness of the heat exchange plate 100 along the thickness direction of the flow channel base plate 200 is between 2-5mm, and for example, can be 2mm, 3.5mm or 5mm, etc.; at the same time, the heat exchange plate 100 can be made of metal material, for example, the metal material can be aluminum alloy, copper alloy, pure copper, stainless steel, etc.

[0096] Further, the flow channel substrate 200 and the bottom plate 400 can be preferably made of engineering plastic material, and for example, can be specifically made of ABS (acrylonitrile-butadiene-styrene copolymer) material, PPS (polyphenylene sulfide) material, etc. In this way, the total weight of the liquid cooling plate can be reduced, and the magnetic resistance can be reduced to the greatest extent, so as to ensure the normal use of the adjusting components 300. At the same time, the engineering plastic has a low thermal conductivity, which can play a heat preservation role on the liquid cooling plate, and help to improve the heat exchange performance of the liquid cooling plate. In specific implementation, the thickness of the flow channel substrate 200 of the embodiment is preferably set to 5-18 mm, and for example, can be specifically 5 mm, 10 mm, 15 mm or 18 mm, etc.

[0097] The embodiment of the second aspect of the application provides a heat management device, which comprises a collecting part 700 and a control part 800 connected thereto, and a liquid cooling plate as above.

[0098] The collecting part 700 is arranged in the liquid cooling plate and is used for collecting the temperature and pressure of the cooling liquid in the liquid cooling plate. The control part 800 is connected to each driving part 301 in the liquid cooling plate and can control the action of each driving part 301 based on the collection signal transmitted by the collection unit. Under the driving of each driving part 301, each flow channel adjusting unit 302 can move along the thickness direction of the flow channel substrate 200 to the heat exchange plate 100 to adjust the spacing between the heat exchange plate 100, so as to adjust the flow direction and flow rate of the flow channel.

[0099] The heat management device of the embodiment can realize real-time control of each driving part 301 according to the temperature change in the liquid cooling plate through the cooperation of the collecting part 700 and the control part 800, so as to adaptively adjust the layout and flow rate of the flow channel, thereby having a good temperature management effect.

[0100] In some exemplary embodiments, as shown in Figure 9 The collecting part 700 of the embodiment comprises a temperature collection unit 701 and a pressure collection unit 702, the temperature collection unit 701 is arranged on each flow channel adjusting unit 302, the pressure collection unit 702 is arranged at the inlet and outlet of the flow channel, and the temperature collection unit 701 and the pressure collection unit 702 are connected to the control part 800.

[0101] The temperature collection unit 701 can be a temperature sensor, and the pressure collection unit 702 can be a pressure sensor. As shown in Figure 2 The temperature collection unit 701 is arranged in the mounting groove on each flow channel adjusting unit 302, and the pressure collection unit 702 is arranged in each buffer groove 202. In some exemplary embodiments, the control part 800 of the embodiment adopts BMS.

[0102] And, the embodiment is further provided with a power supply 900 for supplying power to the acquisition unit 700, the control unit 800 and each driving unit 301, each driving unit 301 is connected to the control unit 800 through an internal electromagnetic coil 3011, so as to form the control of the control unit 800 to each driving unit 301, and further realize the adjustment of the opening degree of each flow channel adjusting unit 302.

[0103] The embodiment of the third aspect of the application provides a control method for the heat management device. Figure 10 As shown in the figure, the control method comprises:

[0104] S1, acquiring temperature and pressure information in the liquid cooling plate through the acquisition unit 700, and transmitting the obtained acquisition signal to the control unit.

[0105] S2, the control unit 800 formulates a cooling scheme according to the acquisition signal, and controls each driving unit 301 to move each flow channel adjusting unit 302 along the thickness direction of the flow channel substrate 200 to the heat exchange plate 100 according to the cooling scheme, so as to form the adjustment of the distance between each flow channel adjusting unit 302 and the heat exchange plate 100, so as to constitute the adjustment of the flow direction and flow rate of the flow channel.

[0106] The control method of the embodiment can realize real-time control of each driving unit 301 according to the temperature change inside the liquid cooling plate, so that the layout and flow rate of the flow channel are adaptively adjusted, and the control logic is simple and easy to realize.

[0107] In some exemplary embodiments, the cooling scheme of the embodiment includes a first cooling scheme, a second cooling scheme and a third cooling scheme. In the first cooling scheme, each flow channel adjusting unit 302 is in contact with the heat exchange plate 100 under the driving of each driving unit 301, so as to minimize the flow rate of the formed flow channel and constitute the closed state of the flow channel.

[0108] In the second cooling scheme, part of the flow channel adjusting units 302 are in contact with the heat exchange plate 100, and part of the flow channel adjusting units 302 maintain the maximum distance with the heat exchange plate 100 under the driving of each driving unit 301, so as to maximize the flow rate of the formed flow channel and constitute the fully open state of the flow channel.

[0109] In the third cooling scheme, part of the flow channel adjusting units 302 are in contact with the heat exchange plate 100, and the distance between part of the flow channel adjusting units 302 and the heat exchange plate 100 is maintained between 0 and the maximum distance under the driving of each driving unit 301, so as to make the flow rate of the formed flow channel between 0 and the maximum flow rate, and constitute the half-open state of the flow channel.

[0110] The full open state and the closed state are mainly used for the overall trend and arrangement design of the initial flow channel. For example, when a new battery pack needs to be matched, the BMS automatically arranges the initial flow channel combined with the technical requirements, experience data, and battery pack heat load information. Just like the U-shaped flow channel in Figure 7 and the snake-shaped flow channel in Figure 8 are composed of full open and closed flow channel adjusting units 302.

[0111] In the use process of the whole vehicle, in order to meet the cooling and heating requirements of different working conditions, the BMS collects and analyzes the temperature and pressure data from each temperature acquisition unit 701 and each pressure acquisition unit 702 in the liquid cooling plate, and then controls each driving part 301 (that is, controls the current size of each electromagnetic coil 3011) to indirectly adjust the opening of each flow channel adjusting unit 302 to a certain specific non-full open state, thereby optimizing the flow field and temperature field of the whole liquid cooling plate, so that the highest temperature and temperature difference inside the battery pack under different working conditions meet the technical requirements.

[0112] The above only describes some embodiments of the present application and is not used to limit the present application. The technical features or structures in the different embodiments described above can be combined as needed to form other specific technical solutions. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A liquid cooling plate, characterized in that: It includes a heat exchange plate, a flow channel substrate connected to the heat exchange plate, and a plurality of adjustment components arranged on the flow channel substrate; Each of the regulating components includes a driving portion and a flow channel regulating unit connected to the driving portion, and a flow channel is formed between the heat exchange plate, the flow channel substrate and each of the flow channel regulating units; Driven by the driving portion, the flow channel regulating unit can move toward the heat exchange plate along the thickness direction of the flow channel substrate to adjust the distance between the flow channel and the heat exchange plate, thereby regulating the flow direction and flow rate of the flow channel.

2. The liquid cooling plate according to claim 1, wherein: The flow channel substrate is provided with a plurality of inner concave portions, and the inner concave portions are arranged in sequence along the length direction of the flow channel substrate; Each of the inner concave portions includes a groove arranged along the thickness direction of the flow channel substrate. The grooves are multiple and arranged in sequence along the width direction of the flow channel substrate, and the flow regulating unit is provided in each of the grooves.

3. The liquid cooling plate according to claim 2, wherein: The heat exchange plate is provided with a liquid inlet nozzle and a liquid outlet nozzle, and the liquid inlet nozzle and the liquid outlet nozzle are both connected to the flow channel; The flow channel substrate is provided with buffer grooves corresponding to the liquid inlet nozzle and the liquid outlet nozzle respectively, each of the buffer grooves is connected to the flow channel, and in the inner recess corresponding to each buffer groove, each buffer groove is provided with multiple grooves on both sides along the width direction of the flow channel substrate.

4. The liquid cooling plate according to claim 1, wherein: Along the thickness direction of the flow channel substrate, the driving portion and the flow channel regulating unit are respectively arranged on two sides of the flow channel substrate, and the driving portion is located on a side of the flow channel substrate away from the heat exchange plate; The flow channel regulating unit adopts a magnet, the driving part includes an electromagnetic driving unit for magnetically adsorbing the magnet, and an elastic member is provided between the flow channel regulating unit and the flow channel substrate.

5. The liquid cooling plate according to claim 4, characterized in that: The electromagnetic drive unit includes an electromagnetic coil and a magnetic core arranged in the electromagnetic coil; and / or, The elastic member is a spring.

6. The liquid cooling plate according to any one of claims 1 to 5, characterized in that: It also includes a bottom plate connected to the flow channel substrate, and the bottom plate is located on a side of the flow channel substrate away from the heat exchange plate.

7. The liquid cooling plate according to claim 6, wherein: The flow channel substrate and the heat exchange plate are sealed; and / or, It also includes studs and nuts. The studs are arranged on the heat exchange plate through a riveting process. The studs pass through the flow channel substrate and the bottom plate and are connected to the nuts to form a connection between the heat exchange plate, the flow channel substrate and the bottom plate.

8. A thermal management device, characterized in that: comprising a connected collection unit and a control unit, and a liquid cooling plate according to any one of claims 1 to 7; The collecting unit is provided in the liquid cooling plate and is used to collect the temperature and pressure of the cooling liquid in the liquid cooling plate; The control unit is connected to each of the driving units in the liquid cooling plate and is capable of controlling the operation of each of the driving units based on the collected signal transmitted by the collection unit; Driven by the driving parts, the flow channel regulating units can move toward the heat exchange plate along the thickness direction of the flow channel substrate to adjust the distance between the flow channel and the heat exchange plate, thereby adjusting the flow direction and flow rate of the flow channel.

9. The thermal management device according to claim 8, characterized in that: The acquisition unit includes a temperature acquisition unit and a pressure acquisition unit, each of the flow channel regulating units is provided with the temperature acquisition unit, the liquid inlet and the liquid outlet of the flow channel are provided with the pressure acquisition unit, and the temperature acquisition unit and the pressure acquisition unit are both connected to the control unit; and / or, The control unit adopts a BMS.

10. A control method for the thermal management device according to claim 8 or 9, characterized in that: The control method includes: Acquiring temperature and pressure information in the liquid cooling plate through the acquisition unit, and transmitting the acquired acquisition signal to the control unit; The control unit formulates a cooling plan based on the collected signal, and controls the operation of each of the driving units according to the cooling plan to drive each of the flow channel adjustment units to move toward the heat exchange plate along the thickness direction of the flow channel substrate, thereby adjusting the distance between each of the flow channel adjustment units and the heat exchange plate, thereby adjusting the flow direction and flow rate of the flow channel.

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