Water-cooling heat dissipation method, system and device based on modular design

Abstract

The invention discloses a water-cooling heat dissipation method, system and device based on modular design, and belongs to the technical field of water-cooling heat dissipation, and the method comprises the steps: analyzing the blocking coefficient of each water-cooling heat dissipation module, determining the blocking information of each water-cooling heat dissipation module, determining a first blocking adjustment execution strategy of each water-cooling heat dissipation module, and determining a second blocking adjustment execution strategy of each water-cooling heat dissipation module; after the first blockage adjustment execution strategy is executed, the corresponding water-cooling heat dissipation module is marked as a first adjustment module, a second blockage adjustment execution strategy of each first adjustment module is determined, and when blockage information of the water-cooling heat dissipation module is light blockage or heavy blockage, the corresponding module is marked as a delay monitoring module; and determining a hysteresis adjustment execution strategy of each hysteresis monitoring module. The heat dissipation efficiency and the operation stability of the system are improved, the phenomena of heat accumulation and local overheating are avoided, the service life of equipment is prolonged, and the comprehensiveness and the response speed of the heat dissipation system are enhanced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of water-cooled heat dissipation, and in particular to a water-cooled heat dissipation method, system and device based on modular design. BACKGROUND

[0002] With the wide application of high-power semiconductor lasers (Laser Diode, LD) in laser processing, optical communication, medical irradiation, ultraviolet exposure and spectral detection, the heat power density per unit area continues to rise, and higher requirements are put forward for the structure design and heat control ability of the heat dissipation system. In order to effectively control the temperature of the laser chip, maintain the stability of the output wavelength of the laser, the power continuity and prolong the service life of the chip, the high performance and intelligence of the heat dissipation system has become a key link in system design.

[0003] At present, water-cooled heat dissipation modules are widely used in semiconductor laser array systems as a high-efficiency heat management means. Such modules usually use high-thermal-conductivity metal bases combined with micro-channel structures, and through the circulation of deionized water or special cooling liquid inside the module, a large amount of heat generated by the chip during operation is taken away, ensuring that it works stably within the safe temperature window. In terms of chip packaging structure, flip-chip soldering is usually used, and metalized ceramic heat-conducting sheets or heat sink structures are used to reduce thermal resistance and improve heat dissipation efficiency; in the optical path design, in order to adapt to the output requirements of high directivity and high power density, micro-lens arrays, collimating optical components and protective glasses are often used to form a complete laser emission structure; in terms of structure, the laser chip water-cooled module usually includes a metal heat-conducting base, a cooling flow channel structure, an inlet and outlet water interface, an adjustable pump or a water distributor, a power connection copper bar and a signal control interface. In order to realize multi-module integration, array light emission and partition management, the system can use modular combination, cooperate with the driving power supply and the upper computer control platform, and realize the power control, flow distribution, temperature feedback and fault adjustment of each module.

[0004] For example, the power semiconductor water-cooled packaging device and water-cooled control method disclosed in the Chinese patent with publication number CN119480823B include a substrate and a chip, the chip includes a first surface and a second surface opposite to the first surface, the first surface is mounted on the substrate, and further includes a heat dissipation member and a shell, the heat dissipation member includes an evaporation side, a liquid storage cavity and a condensation side, the liquid storage cavity is used to store a cooling medium, the cooling medium is configured to evaporate at the evaporation side under heating and condense at the condensation side under cooling, the condensation side includes a plurality of protrusions arranged at intervals, the protrusions extend to the outside of the condensation side, the inside of the protrusions is hollow and communicates with the liquid storage cavity, the shell is arranged at the outer periphery of the plurality of protrusions to enclose the plurality of protrusions, and the space enclosed by the plurality of protrusions and the shell forms a cooling cavity, the cooling cavity is used to store the water-cooled medium, at least one water inlet is arranged at the first end of the shell, and at least one water outlet is arranged at the second end of the shell.

[0005] For example, the Chinese invention patent with publication number CN118213338A discloses a multi-stage composite water cooling heat dissipation system, control method and control device. The system is used for dissipating heat of a load unit. The system includes a water cooling head, which includes a first heat exchange mechanism and a second heat exchange mechanism. The bottom of the first heat exchange mechanism is fixed on the load unit, and the bottom of the second heat exchange mechanism is fixed on the top of the first heat exchange mechanism, and the second heat exchange mechanism can dissipate heat of the fluid flowing therethrough.

[0006] The above technology at least has the following technical problems: During long-term operation of the water cooling module, particles, bubbles or microorganisms may be mixed in the cooling liquid, which is easy to accumulate in the microchannels, causing local blockage or flow reduction. The heat dissipation capacity of the module will change with the use time, structure state or cooling efficiency. When the power of the chip suddenly rises, if the heat dissipation response is lagging, heat accumulation is easy to occur, which affects the system stability. At the same time, part of the blockage will reduce the heat exchange efficiency. When the chip thermal load increases, the cooling system is difficult to take away the heat in time, resulting in lagging temperature rise response. SUMMARY

[0007] The first aspect of the present application provides a water cooling heat dissipation method based on modular design, comprising the following steps: Collecting the blockage characteristic data of each water cooling heat dissipation module, analyzing the blockage coefficients of each water cooling heat dissipation module, thereby determining the blockage information of each water cooling heat dissipation module, and synchronously determining the first blockage adjustment execution strategy of each water cooling heat dissipation module.

[0008] After executing the first blockage adjustment execution strategy, the corresponding water cooling heat dissipation module is recorded as a first adjustment module, the blockage coefficients of each first adjustment module are reanalyzed, thereby determining the second blockage adjustment execution strategy of each first adjustment module.

[0009] When the blockage information of the water cooling heat dissipation module is mild blockage or severe blockage, the corresponding module is recorded as a lag monitoring module, and the thermal lag monitoring of each lag monitoring module is synchronously performed, the thermal lag coefficients of each lag monitoring module are analyzed, and the lag adjustment execution strategy of each lag monitoring module is determined.

[0010] The second aspect of the present application provides a water cooling heat dissipation system based on modular design, comprising: A first blockage adjustment execution strategy determination module is configured to collect the blockage characteristic data of each water cooling heat dissipation module, analyze the blockage coefficients of each water cooling heat dissipation module, thereby determine the blockage information of each water cooling heat dissipation module, and synchronously determine the first blockage adjustment execution strategy of each water cooling heat dissipation module.

[0011] The second blockage adjustment execution strategy determination module is configured to, after the execution of the first blockage adjustment execution strategy, record the water-cooled heat dissipation module as a first adjustment module, re-analyze the blockage coefficients of each first adjustment module, and determine the second blockage adjustment execution strategy of each first adjustment module.

[0012] The hysteresis adjustment execution strategy determination module is configured to, when the blockage information of the water-cooled heat dissipation module is mild blockage or severe blockage, record the corresponding module as a hysteresis monitoring module, synchronously perform thermal hysteresis monitoring on each hysteresis monitoring module, analyze the thermal hysteresis coefficients of each hysteresis monitoring module, and determine the hysteresis adjustment execution strategy of each hysteresis monitoring module.

[0013] The third aspect of the present application provides a water-cooled heat dissipation device based on modular design, comprising: a heat sink, a power supply, a sensor array and a controller.

[0014] The heat sink is composed of a water inlet pipe connector, a water outlet pipe connector, a water inlet, a water outlet, a water tank accommodating cavity, a sealing member, a heat dissipation plate and a sealing and fixing device.

[0015] The power supply is used to provide stable direct current power for the water-cooled heat dissipation module and related electronic elements.

[0016] The sensor array is used to collect related parameters of the water-cooled heat dissipation module.

[0017] The controller is used to receive real-time monitoring data from the sensor, perform blockage coefficient and thermal hysteresis coefficient calculation of the water-cooled heat dissipation module, and generate an adjustment strategy.

[0018] The one or more technical solutions provided in the present application have at least the following technical effects or advantages: 1. The water-cooled heat dissipation method based on modular design provided by the present application can realize real-time monitoring and accurate evaluation of the blockage state and thermal response characteristics of each water-cooled heat dissipation module, automatically adjust the cooling liquid flow rate and chip power output based on the quantified blockage coefficient and thermal hysteresis coefficient, coordinate the joint adjustment of the cooling side and the heat source side, improve the heat dissipation efficiency and operation stability of the system, avoid heat accumulation and local overheating, prolong the service life of the equipment, and enhance the comprehensiveness and response speed of the heat dissipation system.

[0019] 2. The first blockage adjustment execution strategy of each water-cooled heat dissipation module can realize rapid response and hierarchical management of the module blockage state, automatically match the corresponding adjustment scheme according to different blockage degrees, alleviate the problem of cooling efficiency decline caused by flow passage blockage, improve the identification accuracy of the system to blockage risk, and can also take corresponding measures in time to prevent the blockage condition from deteriorating, ensure uniform distribution of cooling flow, improve the overall heat dissipation effect and equipment stability, and reduce the maintenance frequency.

[0020] 3、The second blockage adjustment execution strategy of each first adjustment module is determined, further accurate evaluation and optimization control of the water-cooled heat dissipation module after preliminary adjustment can be carried out, joint supplementary adjustment or backflush adjustment is implemented for the unsolved blockage problem, the blockage removal efficiency and heat dissipation performance are improved, the repeated occurrence of blockage is prevented, the service life of the module is prolonged, and the stability and efficiency of system operation are further ensured.

[0021] 4、The hysteresis adjustment execution strategy of each hysteresis monitoring module is determined, the thermal response hysteresis condition of the module can be identified and quantified in real time, the thermal hysteresis definition standard is dynamically adjusted in combination with the blockage factor, and it is accurately judged whether the module has abnormal heat accumulation. Based on the strategy, the system can intelligently select and execute joint adjustment or continuous monitoring of the cooling side and the heat source side, ensure the dynamic balance of the heat dissipation efficiency and the chip power, quickly respond to temperature fluctuations, effectively prevent local overheating and thermal damage, and improve the stability and reliability of the overall heat dissipation system. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A water-cooled heat dissipation method flow chart based on modular design is provided for the embodiments of the present application.

[0023] Figure 2 A structure schematic diagram of a water-cooled heat dissipation system based on modular design is provided for the embodiments of the present application.

[0024] Figure 3 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 1 .

[0025] Figure 4 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 2 .

[0026] Figure 5 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 3 .

[0027] Figure 6 The water-cooled heat dissipation module main architecture involved in the embodiments of the present application Figure 4 .

[0028] The drawings show that: 1, signal plate; 2, connecting copper bar; 3, water distributor; 4, driving plate; 5, array module; 6, communication serial port; 7, control serial port; 8, water inlet and outlet; 9, electrode copper bar +; 10, electrode copper bar-; 11, protective glass; 12, protective glass frame; 13, power supply; 14, chip lamp bead. DETAILED DESCRIPTION

[0029] Clearly, the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative labor fall within the scope of the present application.

[0030] Referring to Figure 1 The first aspect of the present application provides a water-cooling heat dissipation method based on modular design, comprising the following steps: Collecting the blockage characterization data of each water-cooling heat dissipation module, analyzing the blockage coefficients of each water-cooling heat dissipation module, thereby determining the blockage information of each water-cooling heat dissipation module, and synchronously determining the first blockage adjustment execution strategy of each water-cooling heat dissipation module.

[0031] Further, the blockage information of each water-cooling heat dissipation module is determined, and the first blockage adjustment execution strategy of each water-cooling heat dissipation module is synchronously determined. The specific analysis method is as follows: The blockage characterization data of each water-cooling heat dissipation module includes the pressure difference, fluid flow rate and liquid flow rate of each water-cooling heat dissipation module.

[0032] The pressure difference refers to the pressure difference between the water inlet and the water outlet of each water-cooling heat dissipation module. A micro pressure sensor is installed at the water inlet and the water outlet of each water-cooling heat dissipation module, and the pressure value is collected in real time through the sensor. The system determines the blockage degree of the module flow channel and the change of fluid resistance according to the change of the pressure difference.

[0033] The fluid flow rate is the volume flow rate of the cooling liquid through the water-cooling heat dissipation module per unit time, usually in units of liters per minute (L / min) or milliliters per second (mL / s). The flow rate data is obtained through a micro flow sensor arranged at the module inlet. In specific embodiments, the flow sensor can be of the thermal, turbine or ultrasonic type, and can realize continuous and accurate flow monitoring.

[0034] The liquid flow rate refers to the linear velocity of the cooling liquid in the internal cooling channel of the module, usually expressed in meters per second (m / s), and the liquid flow rate data can be directly collected through a micro flow rate sensor.

[0035] The pressure difference, fluid flow rate and liquid flow rate are closely related. The size of the pressure difference as the driving force directly affects the flow rate. An increase in the pressure difference usually leads to an increase in the flow rate and the liquid flow rate. The change in the fluid flow rate reflects the delivery amount of the cooling liquid per unit time. When the flow rate increases, the liquid flow rate also increases under the condition of a fixed channel cross-sectional area. The change in the liquid flow rate affects the pressure loss in the pipeline, and thus affects the size of the pressure difference. Therefore, the three parameters interact with each other to form a dynamic balance relationship, and any change in one parameter will cause a corresponding adjustment in the remaining parameters.

[0036] extracting a preset reference pressure difference, a reference fluid flow rate and a reference liquid flow rate in the database.

[0037] extracting a pressure difference metric factor, a fluid flow rate metric factor and a liquid flow rate metric factor.

[0038] It should be noted that a plurality of mapping relationships are pre-established in the system database for associating the metric factors of the parameters. These mapping relationships are stored in the form of a structured data table (such as a weight configuration table) and combined with the monitoring data and experimental data of the water-cooled heat dissipation modules through an associated query to build a complete water-cooled heat dissipation module blockage evaluation system. Based on the system, the metric factors corresponding to the pressure difference, the fluid flow rate and the liquid flow rate can be directly obtained from the database, and the metric factor values are limited in the range of 0 to 1 and the sum is 1.

[0039] analyzing the blockage coefficients of the water-cooled heat dissipation modules based on the blockage characterization data of the water-cooled heat dissipation modules.

[0040] The blockage coefficients of the water-cooled heat dissipation modules are quantitative indexes of the influence of the pressure difference, the fluid flow rate and the liquid flow rate of the water-cooled heat dissipation modules on the blockage degree of the water-cooled modules, and the specific analysis process is as follows: comparing the pressure difference of the water outlet and the water inlet with the corresponding reference value, comparing the reference values of the fluid flow rate and the liquid flow rate with the corresponding fluid flow rate and liquid flow rate, and coupling the results of the comparison processing with the corresponding metric factors for weighting to obtain the blockage coefficients of the water-cooled heat dissipation modules.

[0041] In specific embodiments, the blockage coefficients of the water-cooled heat dissipation modules are specifically represented as: wherein, A i is the blockage coefficient of the i-th water-cooled heat dissipation module, a i is the pressure difference of the i-th water-cooled heat dissipation module, b i is the fluid flow rate of the i-th water-cooled heat dissipation module, c i is the liquid flow rate of the i-th water-cooled heat dissipation module, a0 is the reference pressure difference, b0 is the reference fluid flow rate, c0 is the reference liquid flow rate, x1 is the pressure difference metric factor, x2 is the fluid flow rate metric factor, x3 is the liquid flow rate metric factor, i is the number of the water-cooled heat dissipation module, i = 1, 2,..., n, and n is the number of the water-cooled heat dissipation modules.

[0042] ​It needs to be understood that if the pressure difference between the inlet and outlet increases significantly, it often indicates that the resistance in the middle passage has increased, and factors such as particle deposition, bubble blockage, or microbial membrane may cause local flow passage contraction or blockage. The greater the pressure difference, the greater the degree of blockage. Under normal conditions, the water pump provides stable pressure. If the flow rate of a certain water-cooled heat dissipation module abnormally decreases, it indicates that the passage resistance has increased or the effective passage area has decreased, i.e., there is a blockage. In the case of fixed structure size, the decrease in flow rate also reflects the decrease in passage smoothness, especially at the chip micro-channel and bending structure, blockage will more directly lead to a decrease in flow rate.

[0043] The first threshold value of the blockage coefficient and the second threshold value of the blockage coefficient preset in the database are extracted.

[0044] It needs to be supplemented that the first threshold value of the blockage coefficient is less than the second threshold value of the blockage coefficient.

[0045] If the blockage coefficient of a certain water-cooled heat dissipation module is less than the first threshold value of the blockage coefficient, the blockage information of the water-cooled heat dissipation module is marked as normal, and the first blockage adjustment execution strategy of the water-cooled heat dissipation module is simultaneously marked as continuous monitoring.

[0046] It needs to be supplemented that the blockage information of the water-cooled heat dissipation module includes normal state, slight blockage, and severe blockage.

[0047] In this embodiment, when the blockage coefficient of a certain water-cooled heat dissipation module is lower than the first threshold value, it indicates that the flow passage of the module is unobstructed, the cooling liquid flows smoothly, the pressure loss and flow resistance are within a reasonable range, and the module has normal and stable heat dissipation performance. At this time, the system does not need to perform additional adjustment, but only maintains a continuous monitoring state to ensure real-time feedback of the module operating state, timely discovery of abnormal changes, and protection of the stability and high-efficiency heat dissipation effect of the entire water-cooled system.

[0048] If the blockage coefficient of a certain water-cooled heat dissipation module is greater than or equal to the first threshold value of the blockage coefficient and less than or equal to the second threshold value of the blockage coefficient, the blockage information of the water-cooled heat dissipation module is marked as slight blockage, and the first blockage adjustment execution strategy of the water-cooled heat dissipation module is simultaneously marked as executing water pump power adjustment.

[0049] When the blockage coefficient of a certain water-cooled heat dissipation module is greater than or equal to the first threshold value and less than or equal to the second threshold value, it indicates that there is a certain degree of blockage or flow passage abnormality inside the module, which causes the fluid flow to be obstructed and the pressure difference to increase, and the heat dissipation efficiency may slightly decrease. In order to avoid the blockage from further intensifying and affecting the overall cooling performance of the system, the system will automatically adjust the water pump power, increase the flow rate and flow velocity, enhance the circulation of the cooling liquid, and improve the module heat dissipation condition, thereby effectively delaying the development of the blockage and improving the reliability and service life of the module and the system.

[0050] Further, water pump power adjustment is performed, and the specific analysis process is as follows: Traverse each water-cooled heat dissipation module to obtain each slightly blocked water-cooled heat dissipation module.

[0051] Based on the blockage coefficients of each water-cooled heat dissipation module, the blockage coefficients of each slightly blocked water-cooled heat dissipation module are extracted.

[0052] The blockage coefficients of each slightly blocked water-cooled heat dissipation module are subjected to deviation processing with the first threshold value of the blockage coefficient to obtain the blockage coefficient deviation factor of each slightly blocked water-cooled heat dissipation module.

[0053] Based on the blockage coefficient deviation factors of each slightly blocked water-cooled heat dissipation module, the water pump power supplement values of each slightly blocked water-cooled heat dissipation module are matched.

[0054] In this embodiment, the mapping relationship between the blockage coefficient deviation factor and the corresponding water pump power supplement value is pre-stored in the database, and the mapping relationship is managed through a structured mapping table (such as a power adjustment mapping table). In the matching process, first, the blockage coefficient deviation factor of each slightly blocked water-cooled heat dissipation module is extracted, and then the deviation factor is used as a key value to query the corresponding water pump power supplement value in the mapping table, so as to quickly and accurately obtain the power adjustment parameter. The mapping table is pre-set according to actual operation data and an experience model, and the value can be dynamically adjusted to ensure accurate and efficient adjustment effect.

[0055] The blockage coefficients of each slightly blocked water-cooled heat dissipation module are arranged in descending order, and the arrangement order is used as the adjustment order of the corresponding slightly blocked water-cooled heat dissipation module.

[0056] In this embodiment, the blockage coefficients of each slightly blocked water-cooled heat dissipation module are arranged in descending order, and the arrangement order is used as the adjustment order of the corresponding slightly blocked water-cooled heat dissipation module. This can ensure that the system preferentially adjusts the power supplement of the slightly blocked module with a higher blockage degree, so as to more effectively alleviate the blockage condition and prevent further deterioration. This ordering adjustment strategy based on the blockage severity helps to accurately manage the slightly blocked module under limited adjustment resources and improve the heat dissipation efficiency and stability of the overall water-cooled system.

[0057] Based on the water pump power supplement values of each slightly blocked water-cooled heat dissipation module, water pump power adjustment is performed in the adjustment order of the corresponding slightly blocked water-cooled heat dissipation module. Specifically, the system sets the water pump power supplement value of each module in the order of the adjustment order of the slightly blocked water-cooled heat dissipation module. First, the power supplement value of the corresponding module in the mapping table is read, and then the output power of the corresponding water pump is adjusted through the control driving unit.

[0058] If the clogging coefficient of a water-cooled heat dissipation module is greater than the second threshold value of the clogging coefficient, the clogging information of the water-cooled heat dissipation module is marked as severe clogging, and the first clogging adjustment execution strategy of the water-cooled heat dissipation module is marked as execution of joint adjustment.

[0059] When the clogging coefficient of a water-cooled heat dissipation module exceeds the second threshold value, it indicates that the module is severely clogged, the fluid flow resistance increases significantly, the cooling effect decreases significantly, and there is a risk of heat accumulation and local overheating. In view of this situation, the system will execute the joint adjustment strategy, in addition to increasing the power of the water pump to increase the flow, it will also enable acoustic descaling to quickly remove the clogging material, restore the flow passage, ensure the stability of the module temperature, prevent equipment failure due to insufficient heat dissipation, and improve the self-healing ability and safety of the system.

[0060] Further, the joint adjustment is executed, and the specific process is as follows: Each water-cooled heat dissipation module is traversed to obtain each severely clogged water-cooled heat dissipation module, and the clogging coefficient of each severely clogged water-cooled heat dissipation module is extracted based on the clogging coefficient of each water-cooled heat dissipation module.

[0061] An acoustic descaling start instruction is generated.

[0062] The clogging coefficient deviation factor of each severely clogged water-cooled heat dissipation module is obtained, that is, the clogging coefficient of each water-cooled heat dissipation module is subtracted from the second threshold value of the clogging coefficient.

[0063] Based on the clogging coefficient deviation factor of each severely clogged water-cooled heat dissipation module, the joint adjustment execution parameter is matched, and the joint adjustment of each severely clogged water-cooled heat dissipation module is executed.

[0064] The joint adjustment execution parameter includes a water pump power supplement value and an acoustic descaling execution time length.

[0065] In this embodiment, a severe clogging parameter mapping table is pre-established in the database, which stores the mapping relationship between the clogging coefficient deviation factor and the corresponding joint adjustment execution parameter. The mapping relationship is constructed by historical experimental data, simulation results or expert experience, and has clear parameter interval division and adjustment response logic. The system first extracts the clogging coefficient deviation factor of each severely clogged water-cooled heat dissipation module as an index item, and then queries the joint adjustment execution parameter group corresponding to the deviation factor in the database, that is, the corresponding water pump power supplement value (used to increase the flow to enhance the channel flushing effect), and the corresponding acoustic descaling execution time length (used for the working time length of the acoustic excitation device to achieve the stripping or breaking of the clogging material).

[0066] It should be noted that in this embodiment, the matching logic adopts interval matching (setting that the deviation factor falls within a certain range corresponds to a certain parameter group).

[0067] After the matching is completed, the following steps are performed to perform joint adjustment: the power supplement value obtained by matching is issued to the corresponding water pump by the control unit to increase the flow rate and impact force of the target module; the acoustic descaling device is started synchronously, and the action time is set according to the matching parameters to make the acoustic waves produce micro-oscillation or cavitation effect inside the flow channel, thereby destroying the blockage structure and promoting the deposition to fall off.

[0068] After the first blockage adjustment execution strategy is executed, the corresponding water-cooled heat dissipation module is recorded as a first adjustment module, and the blockage coefficients of each first adjustment module are reanalyzed to determine the second blockage adjustment execution strategy of each first adjustment module.

[0069] Further, the second blockage adjustment execution strategy of each first adjustment module is determined, and the specific analysis process is as follows: The blockage coefficients of each first adjustment module are reanalyzed.

[0070] The blockage coefficients of each first adjustment module are extracted based on the blockage coefficients of each water-cooled heat dissipation module, and are recorded as the prior blockage coefficients of each first adjustment module, from which the blockage correction factors of each first adjustment module are extracted from the corresponding mapping table.

[0071] The blockage coefficient correction value of each first adjustment module is obtained by multiplying the blockage coefficient of each first adjustment module by the blockage correction factor of the corresponding first adjustment module.

[0072] It should be noted that the introduction of the blockage correction factor is to quantitatively correct the change trend of the blockage state of the first adjustment module after the adjustment is executed, thereby improving the accuracy of subsequent strategy judgment. Since the initial adjustment may not completely eliminate the blockage inside the module or there may be an adjustment delay effect, directly using the blockage coefficient after the adjustment may underestimate the actual blockage risk. Therefore, by multiplying the preset blockage correction factor, the real blockage degree of the current module can be more reasonably reflected, and a more representative blockage coefficient correction value is generated. This correction value provides a more accurate numerical basis for subsequent judgment of whether to continue adjustment and execution of which adjustment strategy, thereby enhancing the perception ability of the system to the change trend of the blockage and the adjustment accuracy.

[0073] The blockage coefficient deviation value of each first adjustment module is obtained by subtracting the blockage coefficient first threshold value from the blockage coefficient correction value of each first adjustment module. If the corresponding first adjustment module has not executed the joint adjustment strategy, the blockage coefficient deviation value of the first adjustment module is recorded as the blockage coefficient first deviation value. If the corresponding first adjustment module has executed the joint adjustment strategy, the blockage coefficient deviation value of the first adjustment module is recorded as the blockage coefficient second deviation value.

[0074] If the first adjustment module's clogging coefficient correction value is between the first clogging coefficient threshold value and the second clogging coefficient threshold value, if the first adjustment module has not executed the joint adjustment strategy, the second clogging adjustment execution strategy of the first adjustment module is recorded as executing the joint supplemental adjustment, a sonic wave flushing instruction is generated, the first clogging coefficient first deviation value of the first adjustment module is obtained, the sonic wave flushing time length is extracted from the self-mapping table based on this, and the joint supplemental adjustment is executed.

[0075] If the first adjustment module's clogging coefficient correction value is between the first clogging coefficient threshold value and the second clogging coefficient threshold value, if the first adjustment module has executed the joint adjustment strategy, the second clogging adjustment execution strategy of the first adjustment module is recorded as executing the backflushing adjustment, a prompt information is generated, a backflushing water pump start instruction is generated, the first clogging coefficient second deviation value of the first adjustment module is obtained, the backflushing water pump execution pressure and the backflushing water pump execution time length are matched, and the backflushing adjustment is executed.

[0076] If the first adjustment module's clogging coefficient correction value is between the first clogging coefficient threshold value and the second clogging coefficient threshold value, it indicates that the first adjustment module has not completely recovered to the normal range after executing the initial adjustment (such as water pump power supplement or sonic wave descaling), and therefore further strategy supplement or enhancement needs to be taken according to its historical adjustment record.

[0077] If the module has not previously adopted the composite adjustment means and only power adjustment has been performed, there is still a slight clogging risk at present, and therefore the system marks the module as joint supplemental adjustment, performs supplemental cleaning through additional sonic wave flushing operation, and extracts the sonic wave flushing time length corresponding to the first clogging coefficient first deviation value of the module from the database, to realize more targeted secondary adjustment.

[0078] If the first adjustment module has executed the joint adjustment strategy at this time, the module has not recovered to the normal range even after joint adjustment (water pump power enhancement and sonic wave descaling are performed at the same time), and there is a possibility of adjustment response lag, deep clogging or local structural defects. At this time, the system marks the module as executing the backflushing adjustment, and further cleans the residual clogging through the reverse flow. The system will match the adaptive backflushing execution pressure and time length according to the second clogging coefficient deviation value of the module, to ensure that the intensity and effect of the backflushing adjustment are controllable, and simultaneously generates a prompt information.

[0079] If the first adjustment module's clogging coefficient correction value is less than the first clogging coefficient threshold value, the second clogging adjustment execution strategy of the first adjustment module is recorded as continuous monitoring, and a regulation completion signal is generated.

[0080] If the clogging coefficient correction value of a first adjustment module is less than the clogging coefficient first threshold value, the module has basically recovered to the normal operating state after initial adjustment, and the clogging effect is effectively alleviated. At this time, no further intervention is needed, and the system marks it as a continuous monitoring state and generates an adjustment completion signal to prompt that the module currently does not need to participate in the adjustment process again, and only the subsequent monitoring mechanism needs to be retained to prevent the recurrence of clogging.

[0081] If the clogging coefficient correction value of a first adjustment module is greater than the clogging coefficient second threshold value, the second clogging adjustment execution strategy of the first adjustment module is recorded as generating a warning prompt information.

[0082] If the clogging coefficient correction value of a first adjustment module is greater than the clogging coefficient second threshold value, even after preliminary adjustment, the clogging of the module is still abnormally serious and has exceeded the range that can be recovered by conventional adjustment, and there is a significant operating risk. A warning prompt information is generated to prompt that immediate evaluation of whether to take higher-level repair measures (such as long-term backflushing, shutdown maintenance, replacement of parts, etc.) is needed to ensure the operating safety and thermal management stability of the entire water cooling system.

[0083] When the clogging information of the water cooling heat dissipation module is mild clogging or severe clogging, the corresponding module is recorded as a hysteresis monitoring module, and the thermal hysteresis monitoring of each hysteresis monitoring module is performed synchronously, the thermal hysteresis coefficient of each hysteresis monitoring module is analyzed, and the hysteresis adjustment execution strategy of each hysteresis monitoring module is determined.

[0084] Further, the thermal hysteresis coefficient of each hysteresis monitoring module is analyzed, and the specific analysis process is as follows: The thermal hysteresis monitoring data of each hysteresis monitoring module is collected, including the chip temperature rise rate, temperature lag time length, and temperature rise time constant of each hysteresis monitoring module.

[0085] The chip temperature rise rate refers to the temperature rise speed of the chip per unit time after power-on heating, which is used to reflect the response ability of the chip to heat input. Its value can be calculated based on the slope of the temperature change curve in the initial time period after the power of the chip suddenly changes, usually extracted and quantified by a thermal sensor combined with sampling software.

[0086] The temperature lag time length refers to the delay time of the temperature of the chip or the temperature-sensitive area after the power input suddenly changes, which is used to represent the degree of thermal response delay of the module. This parameter can be extracted by comparing the power change signal with the temperature curve trend, and calculating the time difference between the starting time when the temperature first enters the rapid rising interval and the time when the power suddenly changes.

[0087] The temperature rise time constant refers to a time required for a temperature of a chip to reach 63.2% of a final steady-state temperature under a heated condition, and is used to evaluate overall thermal inertia and response speed of a module. The parameter can be obtained by collecting a temperature change curve of the chip, calculating a final temperature value, and determining a time point at which the curve first reaches 63.2% of the value. The temperature rise time constant is taken as a time interval.

[0088] The chip temperature rise rate, the temperature lag duration and the temperature rise time constant show a certain coupling trend: when the temperature lag duration is long, it is often indicated that there is a delay in the thermal contact interface or the thermal resistance of the cooling path is large, which may further cause the temperature rise rate to decrease; and the decrease in the temperature rise rate may prolong the temperature rise time constant, causing the thermal response efficiency of the entire system to decrease. Therefore, when evaluating whether the module has a thermal lag problem, the coordinated variation characteristics of the three types of parameters need to be comprehensively analyzed. A single parameter may not accurately reflect the real thermal state of the module, and joint judgment can improve the identification accuracy and adjustment pertinence.

[0089] The preset defined chip temperature rise rate, the preset defined temperature lag duration and the preset defined temperature rise time constant in the database are extracted.

[0090] The chip temperature rise rate characteristic measurement coefficient, the temperature lag duration characteristic measurement coefficient and the temperature rise time constant characteristic measurement coefficient stored in the database are extracted.

[0091] The characteristic measurement coefficients are extracted from the database to quantify the influence degree of the proportion coefficient between the preset defined chip temperature rise rate and the chip temperature rise rate, the proportion coefficient between the temperature lag duration and the preset defined temperature lag duration in the database, and the proportion coefficient between the temperature rise time constant and the preset temperature rise time constant in the database on the thermal lag response of the lag monitoring module. The influence degrees are summarized to obtain the thermal lag coefficient of the lag monitoring module.

[0092] It should be noted that a plurality of mapping relationships are pre-established in the database for associating the characteristic measurement coefficients of the parameters. These mapping relationships are stored in the form of a structured data table (such as a weight configuration table), and are combined with the monitoring data and experimental data of the lag monitoring module through an associated query to build a complete lag evaluation system of the lag monitoring module. Based on the system, the characteristic measurement coefficients corresponding to the chip temperature rise rate, the temperature lag duration and the temperature rise time constant can be directly obtained from the database. The characteristic measurement coefficient values are limited in the range of 0 to 1 and the sum is 1.

[0093] The thermal lag coefficients of the lag monitoring modules are obtained by traversing the lag monitoring modules.

[0094] The thermal hysteresis coefficient of each hysteresis monitoring module is a quantitative representation of the degree of thermal hysteresis response of the chip temperature rise rate, the temperature lag duration and the temperature rise time constant of each hysteresis monitoring module to the corresponding hysteresis monitoring module.

[0095] In specific embodiments, the thermal hysteresis coefficient of each hysteresis monitoring module is specifically represented as: ; Wherein, B j is the thermal hysteresis coefficient of the jth hysteresis monitoring module, d j is the chip temperature rise rate of the jth hysteresis monitoring module, f j is the temperature lag duration of the jth hysteresis monitoring module, g j is the temperature rise time constant of the jth hysteresis monitoring module, d0 is the chip temperature rise rate, f0 is the temperature lag duration, g0 is the temperature rise time constant, y1 is the chip temperature rise rate characteristic measurement coefficient, y2 is the temperature lag duration characteristic measurement coefficient, y3 is the temperature rise time constant characteristic measurement coefficient, j is the number of hysteresis monitoring modules, j = 1, 2, …, m, and m is the number of hysteresis monitoring modules.

[0096] Further, the hysteresis adjustment execution strategy of each hysteresis monitoring module is determined, and the specific analysis process is as follows: Extract the preset thermal hysteresis defining coefficient in the database.

[0097] Extract the clogging coefficient of each hysteresis monitoring module, and correct the thermal hysteresis defining coefficient of each hysteresis monitoring module to obtain the thermal hysteresis defining correction coefficient of each hysteresis monitoring module.

[0098] It should be noted that the database stores a corresponding mapping set of the clogging coefficient of the hysteresis monitoring module and the thermal hysteresis defining correction factor of the hysteresis monitoring module, and when used, the clogging coefficient of each hysteresis monitoring module is input into the mapping set to obtain the thermal hysteresis defining correction factor of each hysteresis monitoring module.

[0099] The product of the thermal hysteresis defining correction factor and the thermal hysteresis defining coefficient of each hysteresis monitoring module is taken as the thermal hysteresis defining correction coefficient of each hysteresis monitoring module.

[0100] It should be noted that since the module clogging condition can significantly affect the heat conduction and heat dissipation efficiency, the clogging coefficient is introduced to correct the original thermal hysteresis defining coefficient when determining the thermal hysteresis adjustment strategy, which can more accurately reflect the real thermal response capability of the current module under the coupled working condition. By taking the clogging coefficient as the adjustment factor to generate the thermal hysteresis defining correction coefficient, it is helpful to avoid misjudgment caused by clogging interference, thereby improving the robustness and effectiveness of the thermal hysteresis adjustment judgment.

[0101] If the thermal hysteresis coefficient of a certain hysteresis monitoring module is greater than or equal to the thermal hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as executing the joint adjustment of the cooling side and the heat source measurement.

[0102] In this embodiment, if the thermal hysteresis coefficient of a certain hysteresis monitoring module is greater than or equal to the thermal hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, it indicates that the module has obvious thermal response hysteresis phenomenon, and its thermal hysteresis behavior still exceeds the normal response range after considering the blocking factor, which has a potential impact on the heat dissipation efficiency of the system. At this time, the cooling path and the heat source input need to be adjusted synchronously, and measures are taken from both sides of the cold source and the heat source to enhance the adjustment strength and the adjustment effect, and to avoid local thermal damage to the structure caused by heat accumulation.

[0103] Further, the joint adjustment of the cooling side and the heat source measurement is executed, and the specific analysis steps are as follows: The thermal hysteresis deviation coefficient of each hysteresis monitoring module is extracted, and the cooling side adjustment parameter and the heat source side adjustment parameter of each hysteresis monitoring module are matched.

[0104] It should be noted that the thermal hysteresis deviation coefficient of each hysteresis monitoring module is the value obtained by subtracting the thermal hysteresis defined correction coefficient of the corresponding hysteresis monitoring module from the thermal hysteresis coefficient of the hysteresis monitoring module.

[0105] The cooling side adjustment parameter is a cooling liquid flow rate supplement value.

[0106] The heat source side adjustment parameter is a PWM duty cycle reduction value.

[0107] It should be noted that the system presets a set of adjustment strategy mapping relationship table, in which according to different levels of thermal hysteresis deviation coefficient intervals, corresponding cooling side and heat source side joint adjustment parameter combinations are configured, the greater the thermal hysteresis deviation coefficient, the higher the matching adjustment strength, until the highest threshold is triggered, and the highest threshold is executed. The mapping relationship table can be stored in the form of a structured database table, and the system automatically calls the table before adjustment execution and completes parameter table lookup matching according to the thermal hysteresis deviation coefficient interval. After the matching is completed, the corresponding flow rate supplement value and PWM duty cycle reduction value are respectively sent to the cooling side and the heat source side to realize the synchronous adjustment of the cooling side and the heat source side.

[0108] Based on the cooling side adjustment parameter and the heat source side adjustment parameter of each hysteresis monitoring module, the joint adjustment of the cooling side and the heat source measurement is executed.

[0109] First, according to the matched cooling liquid flow rate supplement value, the flow instruction is sent, the cooling liquid flow rate of the loop where the hysteresis monitoring module is located is dynamically improved, the local heat exchange capacity is enhanced, the heat hysteresis accumulation effect is reduced, and meanwhile, according to the matched PWM duty cycle reduction value, the PWM signal duty cycle of the chip power supply is controlled, the process is realized by adjusting the lower limit of the duty cycle parameter, the heat source power is accurately reduced, the heat load of the chip in unit time is reduced, the module heat response speed and the heat dissipation capacity are matched, and the instantaneous overheating phenomenon is inhibited.

[0110] It also needs to be supplemented that the joint regulation process of the cooling side and the heat source side is uniformly coordinated by the main control platform, so that the flow rate regulation and the power regulation are completed in the same scheduling period, and after regulation, the thermal hysteresis coefficient of the corresponding hysteresis monitoring module is reanalyzed.

[0111] If the thermal hysteresis coefficient of a hysteresis monitoring module is less than the thermal hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, the hysteresis regulation execution strategy of the hysteresis monitoring module is recorded as continuous monitoring.

[0112] In this embodiment, if the thermal hysteresis coefficient of a hysteresis monitoring module is less than the thermal hysteresis defined correction coefficient of the corresponding hysteresis monitoring module, it indicates that the heat response capability of the module after considering the blockage effect is still in an acceptable range, and the hysteresis behavior has not constituted a system operation exception, and additional regulation does not need to be forcibly executed. At this time, the module is only marked as a continuous monitoring state, and dynamic tracking is maintained through subsequent data acquisition, so that the heat response characteristics are ensured not to appear a deterioration trend, and resource reasonable allocation and optimization of the regulation strategy are realized.

[0113] Referring to Figure 2 The second aspect of the present application provides a water-cooling heat dissipation system based on modular design, comprising: A first blockage regulation execution strategy determination module is used for collecting blockage characteristic data of each water-cooling heat dissipation module, analyzing blockage coefficients of each water-cooling heat dissipation module, determining blockage information of each water-cooling heat dissipation module, and synchronously determining first blockage regulation execution strategies of each water-cooling heat dissipation module.

[0114] A second blockage regulation execution strategy determination module is used for recording corresponding water-cooling heat dissipation modules as first regulation modules after the first blockage regulation execution strategy is executed, reanalyzing blockage coefficients of each first regulation module, and determining second blockage regulation execution strategies of each first regulation module.

[0115] The hysteresis regulation execution strategy determination module is used for recording the corresponding module as a hysteresis monitoring module when the blockage information of the water-cooling heat dissipation module is slight blockage or severe blockage, synchronously performing thermal hysteresis monitoring of each hysteresis monitoring module, analyzing the thermal hysteresis coefficient of each hysteresis monitoring module, and determining the hysteresis regulation execution strategy of each hysteresis monitoring module.

[0116] The third aspect of the present application provides a water-cooling heat dissipation device based on modular design, comprising: a heat sink, a power supply, a sensor array and a controller.

[0117] The heat sink is composed of a water inlet pipe connector, a water outlet pipe connector, a water inlet, a water outlet, a water tank accommodating cavity, a sealing member, a heat dissipation plate and a sealing and fixing device.

[0118] The power supply is used to provide stable direct current power for the water-cooling heat dissipation module and related electronic elements.

[0119] The sensor array is used to collect related parameters of the water-cooling heat dissipation module.

[0120] The controller is used to receive real-time monitoring data from the sensor, perform blockage coefficient and thermal hysteresis coefficient calculation of the water-cooling heat dissipation module, and generate a regulation strategy.

[0121] It should be further supplemented that the water inlet pipe connector and the water outlet pipe connector of the heat sink adopt a quick assembly and disassembly interface design to ensure the assembly and splicing application of the unit module water-cooling heat sink. The water tank accommodating cavity is not limited to cavity, fin, heat dissipation column array and other structures, and a mechanical interface (such as a screw hole, a clamping groove and a pin position) is arranged on the application device (such as a light source lampshade) outside the accommodating cavity. The sealing member material is not limited to silicone, rubber, polytetrafluoroethylene, fluorine rubber, fluorosilicone, perfluoroether, rubber or plastic, low-melting-point metal (not limited to tin), and soft metal. The heat dissipation plate is not limited to a flat plate and a groove plate.

[0122] Referring to Figure 3 , Figure 4 , Figure 5 and Figure 6 , they respectively show a water-cooling heat dissipation module main structure Figure 1 involved in the embodiment of the present application, a water-cooling heat dissipation module main structure Figure 2 involved in the embodiment of the present application, a water-cooling heat dissipation module main structure Figure 3 involved in the embodiment of the present application and a water-cooling heat dissipation module main structure Figure 4 involved in the embodiment of the present application.

[0123] The signal plate 1 is connected with the driving plate 4 through the signal line with a shielding layer, and the driving plate 4 is connected with the electrode copper bar on the array module 5 through the connecting copper bar 2. The array module 5 is placed on the water distributor 3, the water distributor 3 is provided with water distribution grooves according to the number of the array module 5, so that each array module 5 can be distributed to a water channel, and the number of the array module 5 is added according to actual use requirements. The driving plate 4 is also placed on the water distributor 3, so that the water distributor 3 can cool the array module 5 and the related heating devices of the driving plate 4 at the same time, thereby prolonging the service life. The electrode copper bar +9 is connected with the electrode copper bar -10 through a metal wire and is placed on the array module 5, the protection glass 11 is below the array module 5, and the protection glass frame 12 is arranged below the protection glass 11. The water-cooled heat dissipation module is also provided with a communication serial port 6 and a control serial port 7, the communication serial port 6 is connected with an upper computer, so that the upper computer is convenient to debug, the control serial port 7 is provided to control the array module 5, the power supply 13 is provided to realize power supply, and the chip lamp bead 14 is placed on the protection glass frame 12.

[0124] The inlet and outlet ports 8 of each water-cooled heat dissipation module are connected in sequence, that is, the outlet port of the i-th water-cooled heat dissipation module is the inlet port of the (i+1)-th water-cooled heat dissipation module, i is the number of the water-cooled heat dissipation module, i=1, 2,..., n, and n is the number of the water-cooled heat dissipation module.

[0125] It should be noted that a square grid with the size of the chip is etched on the heat-conducting base of the high-thermal-conductivity material, the metal ceramic sheet is placed according to the square grid, the chip is packaged on the metal ceramic sheet after being fixed by a fixing material, and the array lens is packaged on the chip, so that an independent flip-chip array module 5 is formed.

[0126] It should be noted that the water-cooled heat dissipation module in the embodiment is designed in a unit modularization, and different sizes of water-cooled heat dissipation modules can be realized after the water-cooled heat dissipation modules are closely and linearly arranged, different applications are met, and after the water-cooled heat dissipation modules are arranged and combined, all the inlet and outlet pipes are assembled and connected, cold water enters the total inlet pipe and flows into the independent unit module heat dissipation module, small unit independent cooling is realized, hot water flows out through the unit outlet port and is collected to the total outlet port, and the problem that the temperatures at the front end and the tail end of the integrated large-size conventional water-cooled heat dissipation module are different is avoided.

[0127] In the embodiment, the water pump is centrally arranged on the upstream end of the total inlet pipe, as a main water supply device of the plurality of modules, and the water pump and the water distributor 3 are used to uniformly control the water inflow. The ceramic sheet is attached to the outer wall of the water distribution groove cavity, so that the coupling excitation is realized. The chip is a flip-chip, the cooling side refers to the cooling liquid flowing part in the water-cooled heat dissipation module, and the heat source side refers to the heating part of the chip, which is connected with the electrode copper bar and the power supply 14.

[0128] Those skilled in the art will appreciate that embodiments of the present application can be devised for a variety of applications. It is intended that the present application be limited only by the scope of the appended claims, and it is intended that various modifications and alterations made by those skilled in the art be considered as within the scope of the present application. The embodiments of the present application will be described with reference to the attached drawings, wherein:

[0129] The present application is described in reference to the drawings using a flowchart and / or a block diagram of the method, apparatus (system) and computer program product according to embodiments of the application. It will be understood that each block of the flowchart and / or block diagram, and combinations of blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general purpose computer, special purpose computer, embedded processing device or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks.

[0130] These computer program instructions can also be stored in a computer- readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instructions which implement the function specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks.

[0131] These computer program instructions can also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks. Figure 1 one or more functions specified in the flowchart and / or block diagram block or blocks.

[0132] While the preferred embodiments of the application have been described, additional variations and modifications can be made to the embodiments by those skilled in the art once they learn of the basic inventive concepts. Therefore, the appended claims are intended to cover all such modifications and variations as fall within the scope of the present application.

[0133] Obviously, many modifications and variations of the present application are possible in light of the above teachings. It is, therefore, to be understood that within the scope of the appended claims and their equivalents, the application can be practiced otherwise than as specifically described.

Claims

1. A water cooling method based on modular design, characterized in that: The following steps are involved: Collecting blockage characterization data of each water-cooling and heat dissipation module, analyzing the blockage coefficient of each water-cooling and heat dissipation module, thereby determining the blockage information of each water-cooling and heat dissipation module, and simultaneously determining the first blockage adjustment execution strategy of each water-cooling and heat dissipation module; After executing the first congestion adjustment execution strategy, the corresponding water cooling module is recorded as the first adjustment module, and the congestion coefficient of each first adjustment module is re-analyzed to thereby determine the second congestion adjustment execution strategy of each first adjustment module; When the blockage information of the water-cooling heat dissipation module is light blockage or heavy blockage, the corresponding module is recorded as a hysteresis monitoring module, and thermal hysteresis monitoring of each hysteresis monitoring module is performed simultaneously, the thermal hysteresis coefficient of each hysteresis monitoring module is analyzed, and the hysteresis adjustment execution strategy of each hysteresis monitoring module is determined.

2. The water cooling method based on modular design according to claim 1, characterized in that: The blockage information of each water-cooling heat dissipation module is determined, and the first blockage adjustment execution strategy of each water-cooling heat dissipation module is simultaneously determined. The specific analysis method is as follows: The blockage characterization data of each water-cooling and heat dissipation module includes the pressure difference, fluid flow rate and liquid flow rate of each water-cooling and heat dissipation module; Analyze the blockage coefficient of each water-cooling heat dissipation module based on the blockage characterization data of each water-cooling heat dissipation module; The blockage coefficient of each water-cooling heat dissipation module is a quantitative indicator of the influence of the pressure difference, fluid flow rate, and liquid flow rate of each water-cooling heat dissipation module on the blockage degree of each water-cooling heat dissipation module. The specific analysis process is as follows: comparing the pressure difference between the water outlet and the water inlet with the corresponding reference value, comparing the reference value of the fluid flow rate and liquid flow rate with the corresponding fluid flow rate and liquid flow rate, and combining the results of each comparison process with the corresponding measurement factor for weighted coupling processing to obtain the blockage coefficient of each water-cooling heat dissipation module; Extracting a first congestion coefficient threshold and a second congestion coefficient threshold preset in a database; If the blockage coefficient of a water-cooling heat dissipation module is less than the first blockage coefficient threshold, the blockage information of the water-cooling heat dissipation module is marked as normal, and the first blockage adjustment execution strategy of the water-cooling heat dissipation module is simultaneously marked as continuous monitoring; If the blockage coefficient of a water-cooling heat dissipation module is greater than or equal to the first blockage coefficient threshold and less than or equal to the second blockage coefficient threshold, the blockage information of the water-cooling heat dissipation module is marked as slightly blocked, and the first blockage adjustment execution strategy of the water-cooling heat dissipation module is recorded as executing water pump power adjustment; If the congestion coefficient of a water-cooling heat dissipation module is greater than the second congestion coefficient threshold, the congestion information of the water-cooling heat dissipation module is marked as severe congestion, and the first congestion adjustment execution strategy of the water-cooling heat dissipation module is simultaneously recorded as executing joint adjustment.

3. The water cooling method based on modular design as claimed in claim 2, characterized in that: The specific analysis process of performing water pump power regulation is as follows: Traverse each water-cooling heat dissipation module to obtain each slightly blocked water-cooling heat dissipation module; Extracting the blockage coefficient of each slightly blocked water-cooling heat dissipation module based on the blockage coefficient of each water-cooling heat dissipation module; Performing deviation processing on the blockage coefficient of each slightly blocked water-cooling and heat dissipation module and the first blockage coefficient threshold to obtain a blockage coefficient deviation factor of each slightly blocked water-cooling and heat dissipation module; Matching the water pump power supplement value of each slightly blocked water cooling module based on the blockage coefficient deviation factor of each slightly blocked water cooling module; Arrange the blockage coefficients of the slightly blocked water-cooling heat dissipation modules in descending order, and use the arrangement order as the adjustment order of the corresponding slightly blocked water-cooling heat dissipation modules; The water pump power is adjusted based on the water pump power supplement value of each lightly blocked water cooling and heat dissipation module in an adjustment order corresponding to the lightly blocked water cooling and heat dissipation module.

4. The water cooling method based on modular design as claimed in claim 2, characterized in that: The specific process of performing joint adjustment is as follows: Traversing each water-cooling and heat dissipation module to obtain each severely blocked water-cooling and heat dissipation module, and extracting the blockage coefficient of each severely blocked water-cooling and heat dissipation module based on the blockage coefficient of each water-cooling and heat dissipation module; Generate sonic descaling start instruction; Obtaining the blockage coefficient deviation factor of each severely blocked water cooling module; Matching joint adjustment execution parameters based on the blockage coefficient deviation factors of each severely blocked water cooling and heat dissipation module, and performing joint adjustment of each severely blocked water cooling and heat dissipation module; The joint adjustment execution parameters include the water pump power supplement value and the acoustic descaling execution time.

5. The water cooling method based on modular design as claimed in claim 1, characterized in that: The specific analysis process of determining the second congestion regulation execution strategy of each first regulation module is as follows: Reanalyzing the blocking coefficient of each first regulating module; Extracting the blockage coefficient of each first adjustment module based on the blockage coefficient of each water-cooling heat dissipation module, recording it as the priori blockage coefficient of each first adjustment module, and extracting the blockage correction factor of each first adjustment module from the corresponding mapping table; Obtaining a congestion coefficient correction value of each first regulating module through the congestion coefficient of each first regulating module and the congestion correction factor of each first regulating module; If the blockage coefficient correction value of a first regulation module is between the first blockage coefficient threshold and the second blockage coefficient threshold, if the first regulation module has not executed the joint regulation strategy, then the second blockage regulation execution strategy of the first regulation module is recorded as executing joint supplementary regulation, an acoustic flushing instruction is generated, the first deviation value of the blockage coefficient of the first regulation module is obtained, and the acoustic flushing duration is extracted from the mapping table based on the deviation value, so as to execute the joint supplementary regulation; if the first regulation module has already executed the joint regulation strategy, then the second blockage regulation execution strategy of the first regulation module is recorded as executing backwash regulation, a prompt message is generated, a backwash pump start instruction is generated, the second deviation value of the blockage coefficient of the first regulation module is obtained, the backwash pump execution pressure and the backwash pump execution duration are matched, and the backwash regulation is executed; If the congestion coefficient correction value of a first regulating module is less than the first congestion coefficient threshold, the second congestion regulation execution strategy of the first regulating module is recorded as continuous monitoring, and a regulation completion signal is generated; If the congestion coefficient correction value of a first regulating module is greater than the second congestion coefficient threshold, the second congestion regulating execution strategy of the first regulating module is recorded as generating early warning prompt information.

6. The water cooling method based on modular design as claimed in claim 1, characterized in that: The thermal hysteresis coefficient of each hysteresis monitoring module is analyzed, and the specific analysis process is as follows: Collect thermal hysteresis monitoring data of each hysteresis monitoring module, including the chip temperature rise rate, temperature hysteresis duration and temperature rise time constant of each hysteresis monitoring module; Extracting characteristic metric coefficients from a database to quantify the degree of influence of a proportional coefficient between a defined chip temperature rise rate and the chip temperature rise rate preset in the database, a proportional coefficient between a temperature hysteresis time and a defined temperature hysteresis time preset in the database, and a proportional coefficient between a temperature rise time constant and a temperature rise time constant preset in the database on the thermal hysteresis response of the hysteresis monitoring module, summarizing the respective influence degrees to obtain a thermal hysteresis coefficient of the hysteresis monitoring module; Traversing each hysteresis monitoring module to obtain the thermal hysteresis coefficient of each hysteresis monitoring module; The thermal hysteresis coefficient of each hysteresis monitoring module is a quantitative representation of the thermal hysteresis response degree of the corresponding hysteresis monitoring module by combining the chip temperature rise rate, temperature hysteresis duration and temperature rise time constant of each hysteresis monitoring module.

7. The water cooling method based on modular design according to claim 6, characterized in that: The specific analysis process of determining the hysteresis adjustment execution strategy of each hysteresis monitoring module is as follows: Extract the thermal hysteresis definition coefficient preset in the database; Extracting the blocking coefficient of each hysteresis monitoring module, and correcting the thermal hysteresis definition coefficient of each hysteresis monitoring module based on the blocking coefficient to obtain the thermal hysteresis definition correction coefficient of each hysteresis monitoring module; If the thermal hysteresis coefficient of a hysteresis monitoring module is greater than or equal to the thermal hysteresis limit correction coefficient of the corresponding hysteresis monitoring module, the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as executing the joint adjustment of the cooling side and the heat source measurement; If the thermal hysteresis coefficient of a hysteresis monitoring module is less than the thermal hysteresis definition correction coefficient of the corresponding hysteresis monitoring module, the hysteresis adjustment execution strategy of the hysteresis monitoring module is recorded as continuous monitoring.

8. The water cooling method based on modular design as claimed in claim 7, characterized in that: The specific analysis steps for the joint regulation of the cooling side and the heat source are as follows: Extract the thermal hysteresis deviation coefficient of each hysteresis monitoring module and match the cooling side adjustment parameters and heat source side adjustment parameters of each hysteresis monitoring module; The cooling side adjustment parameter is a coolant flow rate supplement value; The heat source side adjustment parameter is a PWM duty cycle reduction value; Joint adjustment of the cooling side and the heat source is performed based on the cooling side adjustment parameters and the heat source side adjustment parameters of each hysteresis monitoring module.

9. A system using the modular design-based water cooling method according to any one of claims 1 to 8, characterized in that: include: a first congestion adjustment execution strategy determination module, configured to collect congestion characterization data of each water-cooling and heat dissipation module, analyze the congestion coefficient of each water-cooling and heat dissipation module, thereby determining congestion information of each water-cooling and heat dissipation module, and simultaneously determine a first congestion adjustment execution strategy for each water-cooling and heat dissipation module; a second congestion adjustment execution strategy determination module, configured to, after executing the first congestion adjustment execution strategy, record the corresponding water cooling and heat dissipation module as the first adjustment module, reanalyze the congestion coefficient of each first adjustment module, and thereby determine a second congestion adjustment execution strategy for each first adjustment module; The hysteresis adjustment execution strategy determination module is used to record the corresponding module as a hysteresis monitoring module when the blockage information of the water-cooling heat dissipation module is light blockage or heavy blockage, synchronously perform thermal hysteresis monitoring of each hysteresis monitoring module, analyze the thermal hysteresis coefficient of each hysteresis monitoring module, and determine the hysteresis adjustment execution strategy of each hysteresis monitoring module.

10. A device using the modular design-based water cooling method according to any one of claims 1 to 8, characterized in that: include: heat sink, power supply, sensor array, and controller; The radiator is composed of a water inlet pipe connector, a water outlet pipe connector, a water inlet, a water outlet, a water tank accommodating cavity, a sealing component, a heat dissipation plate and a sealing fixing device; The power supply is used to provide stable DC power to the water cooling module and related electronic components; The sensor array is used to collect parameters related to the water cooling module; The controller is used to receive real-time monitoring data from the sensor, calculate the blocking coefficient and thermal hysteresis coefficient of the water-cooling heat dissipation module, and generate an adjustment strategy.

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