A high surge ESD static suppressor

Abstract

The application discloses a kind of high surge ESD static electricity suppressors, it is related to static electricity suppressor technical field, including insulating substrate, end electrode is symmetrically arranged in the two sides of substrate;Multiple internal electrodes are embedded in the inside of insulating substrate, and internal electrode is electrically connected with conductive polymer layer;Conductive polymer layer is arranged between multiple internal electrodes, for ESD energy absorption and conduction;Conductive polymer layer and internal electrode are provided with array arrangement between the convex point unit;The connecting interface between insulating substrate and conductive polymer layer is respectively provided with transition interface;The upper portion of insulating substrate is provided with frame unit that is covered in the outside of conductive polymer layer, and the both ends of frame unit are overlapped on the top of end electrode, and frame unit and insulating substrate are connected with each other by connecting piece, and end electrode and internal electrode are respectively provided with through hole at the position corresponding to connecting piece;The application improves the long-term ESD suppression stability and reliability of device.

Description

Technical Field

[0001] This invention relates to the field of electrostatic discharge (ESD) suppressor technology, specifically a high surge ESD suppressor. Background Technology

[0002] ESD stands for Electrostatic Discharge. When an electrostatic discharge source comes into contact with another object, charge flows based on the mechanism of charge neutralization. Sufficient charge is transferred to offset the voltage. During the high-speed transfer of charge, potentially damaging voltage, current, and electromagnetic fields are generated, which can destroy the object in severe cases. The two destructive mechanisms of ESD are thermal failure of equipment caused by heat generated by ESD current and insulation breakdown caused by excessive voltage induced by ESD. In electronic products such as mobile phones, computers, LCD TVs, and digital cameras, ESD static electricity suppressors are used to suppress static electricity and protect the electronic products. They have advantages such as ultra-low capacitance, fast response speed, and high surge current withstand capability.

[0003] Patent document CN215073574U discloses a high-surge ESD suppressor, relating to the field of ESD suppressor technology. This high-surge ESD suppressor includes a suppressor body. An upper heat-conducting plate and a lower heat-conducting plate are fixedly connected to the top and bottom of the suppressor body, respectively. An upper heat dissipation plate is fixedly connected to the upper surface of the upper heat-conducting plate, and a heat dissipation strip is provided on the top of the upper heat dissipation plate. A lower heat dissipation plate is fixedly connected to the lower surface of the lower heat-conducting plate. By setting up the upper heat-conducting plate, the upper heat dissipation plate, the lower heat-conducting plate, and the lower heat dissipation plate, the heat dissipation capacity of the suppressor body is improved, effectively preventing the suppressor body from aging due to high temperature, thus achieving the effect of extending its service life. This solves the problem in the prior art where common ESD suppressors have slow heat dissipation during use, easily accelerating the aging of the ESD suppressor and reducing its service life.

[0004] However, in highly integrated electronic packaging, poor interface adhesion and microstructure deformation are key factors leading to the degradation of thermal and electrical performance. Especially in high-power devices using ceramic or metal heat dissipation layers, insufficient adhesion between the TIM (thermal interface material) layer and the packaging / heat dissipation substrate can form microbubbles or peel off during operation, severely affecting the heat conduction path and causing local heat dissipation failure. This is particularly problematic during ESD (electrostatic discharge) release, causing abnormal temperature rise and even ablation of the polymer center. Furthermore, for polymer-type ESD devices, under repeated thermal cycling, micro-delamination can occur at the interface between the conductive polymer layer and the electrode or substrate. This is due to the difference in thermal expansion and contraction between multiple heterogeneous materials and uneven interfacial bonding, affecting the normal operation of the ESD suppressor. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a high surge ESD suppressor.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0007] This invention provides a high surge ESD suppressor, comprising:

[0008] Insulating substrate;

[0009] Terminal electrodes are symmetrically disposed on both sides of the substrate;

[0010] Multiple internal electrodes are embedded within the insulating substrate, and the internal electrodes are electrically connected to the conductive polymer layer.

[0011] A conductive polymer layer is disposed between multiple internal electrodes for ESD energy absorption and conduction;

[0012] An array of protrusion units is provided between the conductive polymer layer and the internal electrode.

[0013] The connection interface between the insulating substrate and the conductive polymer layer is respectively provided with a transition interface.

[0014] A frame unit is disposed above the insulating substrate and covers the outside of the conductive polymer layer. The two ends of the frame unit overlap the top of the end electrode. The frame unit and the insulating substrate are connected to each other by a connector. The end electrode and the internal electrode are respectively provided with through holes at the positions corresponding to the connectors.

[0015] As a preferred embodiment of the present invention, the bump unit is made of polydimethylsiloxane material.

[0016] As a preferred embodiment of the present invention, the bump unit is columnar or spherical, and the maximum cross-sectional diameter of the bump unit is 3~10μm, distributed in the contact area between the conductive polymer and the internal electrode.

[0017] As a preferred embodiment of the present invention, the transition interface is a sawtooth or corrugated shape with a periodic structure. In each period, the length of the transition interface is 10~50μm and the height is 3~10μm.

[0018] As a preferred embodiment of the present invention, the frame unit is made of polyimide composite material and has an internal structure of honeycomb or cross-shaped grid.

[0019] As a preferred embodiment of the present invention, the connector is a metal heat-conducting column.

[0020] As a preferred embodiment of the present invention, the connector is a nickel-plated copper pillar with a diameter of 50~150μm.

[0021] As a preferred embodiment of the present invention, the conductive polymer layer has a uniformly embedded conductive filler, which includes carbon nanotubes, conductive polymer composite particles or metal micro powders.

[0022] The beneficial effects of this invention are:

[0023] 1. In this invention, by introducing arrayed bump units between the conductive polymer layer and the internal electrodes, and utilizing the columnar / spherical structure made of flexible material (polydimethylsiloxane), an elastic buffer interface is formed at the contact surface. This not only significantly alleviates the microstructural stress caused by thermal expansion and contraction, but also maintains reliable contact between the electrodes and the polymer, thereby suppressing the "micro-delamination" problem during thermal cycling and improving the long-term ESD suppression stability and reliability of the device.

[0024] 2. In this invention, a transition interface with a periodic structure (serrated / corrugated) is provided between the insulating substrate and the conductive polymer layer. This microstructure significantly improves the mechanical interlocking strength between the materials and plays a role in dispersing stress and providing thermal buffering. It can effectively prevent interface peeling under high current release or repeated thermal shock. At the same time, the metal thermally conductive connector provided between the frame unit and the insulating substrate not only provides structural fixation but also forms a continuous thermal conduction path, reducing thermal bottlenecks and improving thermal conduction efficiency. Attached Figure Description

[0025] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0026] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of a power component.

[0028] Figure 3 This is a structural diagram of the foot buckle unit.

[0029] In the figure: 1. Insulating substrate; 2. End electrode; 3. Internal electrode; 4. Conductive polymer layer; 5. Bump unit; 6. Transition interface; 7. Frame unit; 8. Connector. Detailed Implementation

[0030] The technical solutions of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this application, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0032] like Figures 1-3 As shown, a high-surge ESD suppressor includes an insulating substrate 1, end electrodes 2, internal electrodes 3, and a conductive polymer layer 4. The end electrodes 2 are symmetrically arranged on both sides of the substrate. Multiple internal electrodes 3 are embedded inside the insulating substrate 1 and are electrically connected to the conductive polymer layer 4. The conductive polymer layer 4 is disposed between the multiple internal electrodes 3 for ESD energy absorption and conduction. An array of bump units 5 is provided between the conductive polymer layer 4 and the internal electrodes 3 to achieve flexible bonding and mitigate encapsulation stress. The connection interface between the insulating substrate 1 and the conductive polymer layer 4 is provided with transition interfaces 6 to improve the interface bonding strength and buffer thermal stress concentration. A frame unit 7 is provided on the upper part of the insulating substrate 1, covering the outside of the conductive polymer layer 4. The two ends of the frame unit 7 overlap the top of the end electrodes 2. The frame unit 7 and the insulating substrate 1 are connected to each other through connectors 8. The end electrodes 2 and the internal electrodes 3 are respectively provided with through holes at positions corresponding to the connectors 8.

[0033] Among them, the convex unit 5 refers to the elastic support structure distributed on the contact surface between the conductive polymer and the electrode. Specifically, it can be made of polydimethylsiloxane material into columnar or spherical shapes, which absorb the stress generated by the difference in thermal expansion through elastic deformation; the transition interface 6 refers to the microstructure bonding surface between the substrate and the polymer layer. Specifically, it can adopt a periodic corrugated or sawtooth shape, which enhances mechanical interlocking by increasing the contact area; the frame unit 7 refers to the support structure covering the conductive layer. Specifically, it can be made of honeycomb polyimide composite material, which is fixed to the substrate as a whole through the connector 8; the through hole refers to the heat conduction channel that runs through the electrode. Specifically, it can be formed by laser drilling, which, together with the connector 8, establishes a longitudinal heat conduction path.

[0034] Specifically, the insulating substrate 1 serves as the supporting body, carrying the electrodes and functional layers, while the end electrodes 2 provide external electrical connections. The internal electrodes 3 are embedded within the substrate and form a charge conduction network with the conductive polymer layer 4. The bump unit 5 forms an elastic buffer layer at the electrode-polymer contact surface. When temperature changes cause material expansion, the bumps undergo compression or tensile deformation to absorb stress and maintain a tight fit at the contact surface. The transition interface 6 forms a mechanical interlocking structure at the substrate-polymer interface, dispersing thermal stress through periodic undulations and preventing interface crack propagation. The frame unit 7 wraps around the edge of the conductive polymer layer 4 and is fixed to the substrate by metal connectors 8, forming a constraint and protection structure. Through-holes allow the connectors 8 to penetrate the electrodes, establishing a continuous thermal conduction channel from the internal electrodes 3 to the outside of the package.

[0035] Through the above technical solutions, this application effectively suppresses the interface peeling phenomenon of high-power ESD devices during thermal cycling and maintains reliable contact between the conductive polymer layer 4 and the electrode; the transition interface 6 structure enhances the bonding strength between heterogeneous materials, and the frame unit 7 and the connector 8 form a stable packaging support system; the through-hole design optimizes the longitudinal heat conduction path and reduces the risk of local overheating; the overall structure achieves a synergistic improvement in interface stress relief and heat conduction efficiency while maintaining a compact packaging size.

[0036] Furthermore, such as Figures 2-3 As shown, the bump unit 5 is made of polydimethylsiloxane material. The bump unit 5 is columnar or spherical. The maximum cross-sectional diameter of the bump unit 5 is 3~10μm and it is distributed in the contact area between the conductive polymer and the internal electrode 3.

[0037] Polydimethylsiloxane material refers to an organosilicon compound with low elastic modulus and high deformation recovery capability. Specifically, it can be produced by thermosetting a liquid precursor, forming an elastomer structure after curing. This material forms a deformable buffer interface in the contact area between the conductive polymer layer 4 and the internal electrode 3, absorbing thermal stress deformation through its flexible properties.

[0038] Among them, columnar or spherical shape refers to the axially or spherically symmetrical geometric shape of the bump unit 5 in three-dimensional space. Specifically, it can be formed by photolithography or micro-molding process on the surface of polydimethylsiloxane material to form a regularly arranged columnar structure, or by spraying process to form spherical particles on the electrode surface. This symmetrical shape can uniformly disperse stress from different directions and avoid local stress concentration.

[0039] The maximum cross-sectional diameter of 3 to 10 micrometers refers to the maximum size range of a single bump unit 5 perpendicular to the stress transmission direction. Specifically, the diameter of the bump unit 5 can be controlled by adjusting the micromachining process parameters so that it has sufficient mechanical strength to maintain physical contact between electrodes, while avoiding insufficient contact area due to excessive size.

[0040] The distribution in the contact area between the conductive polymer and the internal electrode 3 refers to the concentrated arrangement of the bump units 5 at the interface between the conductive polymer layer 4 and the internal electrode 3. Specifically, the bump units 5 can be precisely set at the interface of heterogeneous materials through mask positioning technology to form a continuous stress buffer zone.

[0041] Specifically, at the interface between the conductive polymer and the internal electrode 3, the columnar or spherical bump units 5 undergo reversible deformation under thermal expansion or mechanical load due to their symmetrical geometry and elastic deformation capability. When the material has size differences due to temperature changes, the flexible support of the bump units 5 can absorb the interfacial shear stress and prevent crack propagation caused by rigid contact. At the same time, the arrayed bump units 5 disperse local stress peaks through synergistic effect, making the interfacial stress distribution more uniform, thereby suppressing the formation of micro-delamination. By limiting the diameter range of the bump units 5, it is ensured that they have sufficient deformation space while maintaining the contact area, avoiding a decrease in stress buffering capacity due to excessively large or small size.

[0042] Furthermore, such as Figure 3 As shown, the transition interface 6 has a serrated or corrugated shape with a periodic structure, and each period has a specific length and height range. Preferably, in each period, the length of the transition interface 6 is 10~50μm and the height is 3~10μm.

[0043] Among them, the transition interface 6 refers to the intermediate layer structure located in the contact area of ​​the two materials. Specifically, a preset geometric shape can be formed on the surface of the insulating substrate 1 by laser micro-etching or chemical etching process to establish mechanical interlock between the substrate and the polymer.

[0044] Among them, periodic structure refers to geometric units that are repeatedly arranged along the extension direction of the interface. Specifically, it can be formed by CNC micromachining equipment to form a uniformly distributed corrugated or sawtooth profile, and its continuous undulating shape can be used to increase the contact area between heterogeneous materials.

[0045] The serrated or corrugated shape refers to a continuous surface morphology with alternating convex and concave sections. Specifically, it can be achieved using a trapezoidal or circular cross section, forming a multi-level stress buffer zone through a regularly distributed concave-convex structure.

[0046] Specifically, the transition interface 6 forms a mechanical interlocking effect through a periodically arranged geometric structure, which enables the insulating substrate 1 and the conductive polymer layer 4 to form a three-dimensional interlocking bond during the curing process. The undulating shape of the sawtooth or corrugated pattern forms a multi-directional stress dispersion path at the interface. When the material deforms due to thermal expansion, the periodic structure absorbs the transverse shear stress through local deformation, avoiding the propagation of interface cracks caused by stress concentration. At the same time, the continuously distributed concave and convex structure forms a gradient contact in the vertical direction, so that the longitudinal stress generated by the difference in thermal expansion is released step by step, maintaining the stability of the interface bonding state.

[0047] Furthermore, the frame unit 7 is made of high-modulus polyimide composite material, and its internal structure is honeycomb or cross-shaped grid.

[0048] Among them, high modulus polyimide composite material refers to a composite system formed by adding reinforcing fillers to polyimide resin as the matrix, such as a composite of polyimide resin and carbon fiber or ceramic particles. This material achieves high mechanical strength and thermal stability through the rigid structure of molecular chains and the synergistic effect of fillers, and can suppress the deformation of frame unit 7 during high-temperature encapsulation, thereby maintaining a stable connection with the insulating substrate 1.

[0049] Honeycomb or cross-grid internal structures refer to porous support systems formed by regularly arranged pores or grid units. For example, hexagonal honeycomb holes or orthogonal cross grids are prepared by laser etching or molding processes. Such structures form multi-level support through geometric topology design, which reduces self-weight while improving compressive and shear resistance. Its continuous cavity can disperse the encapsulation stress and avoid interface cracking caused by local stress concentration.

[0050] Specifically, the frame unit 7 uses high-modulus polyimide composite material as the main body, which can withstand external mechanical stress and maintain structural integrity during the encapsulation process, avoiding connection failure caused by material softening or deformation. The honeycomb or cross-grid internal structure increases the contact area between the frame unit 7 and the insulating substrate 1, optimizing the heat conduction path, so that the heat generated during the encapsulation process can be quickly dissipated through the high thermal conductivity of the composite material. In addition, the regularly arranged pores or grid units uniformly disperse thermal stress, reducing the shear stress caused by the difference in thermal expansion coefficients at the interface, thereby suppressing the interface peeling phenomenon.

[0051] Furthermore, such as Figure 2As shown, the connector 8 is a metal heat-conducting column, which is a nickel-plated copper column with a diameter of 50~150μm. The metal heat-conducting column can be configured as a spiral pin structure, with a spiral groove opened on the outer wall of the metal heat-conducting column to form a spiral structure with the insulating substrate 1, thereby enhancing the interlocking force and heat conduction capacity. Alternatively, the metal heat-conducting column can be fixed to the insulating substrate 1 by bonding or other methods. Similarly, the other end of the metal heat-conducting column can also be fixedly connected to the frame unit 7 by bonding or other methods.

[0052] Among them, the metal heat-conducting column refers to a columnar heat-conducting component made of metal material, specifically a nickel-plated copper column. Its cylindrical structure forms a continuous heat-conducting channel while achieving mechanical fixation. The spiral pin structure refers to a column with spiral grooves on its outer wall. It forms a spiral interlocking interface with the insulating substrate 1 by rotating insertion. The geometric features of the spiral groove increase the contact area and produce a mechanical interlocking effect. The spiral groove refers to a groove structure distributed circumferentially along the outer surface of the column. It can be formed by machining or etching. The spiral distribution makes the heat conduction path form a continuous gradient. The adhesive fixing method refers to using conductive adhesive or solder to combine the metal heat-conducting column with the insulating substrate 1. Specifically, it can be achieved by using silver paste or epoxy resin. Fixation is achieved through interfacial adhesion.

[0053] Specifically, when the metal heat-conducting column adopts a spiral pin structure, the spiral groove and the inner wall thread of the insulating substrate 1 form a spiral engagement, generating a radial expansion force under axial pressure, so that a multi-point contact mechanical interlocking structure is formed between the metal heat-conducting column and the insulating substrate 1. This interlocking structure effectively resists the shear stress caused by thermal cycling or mechanical vibration by increasing the friction contact area.

[0054] Meanwhile, the continuous spiral thermal interface formed by the spiral groove allows heat to spread evenly along the spiral path, avoiding local heat accumulation caused by traditional planar contact. When the adhesive fixing method is adopted, the metal thermally conductive pillar forms a chemical bond with the insulating substrate 1 through the adhesive. After the adhesive layer is cured, it forms a uniform interface bonding layer, which is suitable for packaging scenarios with low mechanical strength requirements.

[0055] It should be noted that nickel-plated copper pillars refer to columnar structures with copper as the base material and a nickel layer plated on the surface. This is achieved through an electroplating process to form a dense nickel layer on the copper pillar surface. The nickel layer improves oxidation resistance and enhances the bonding strength with adjacent materials. The diameter of 50 to 150 micrometers refers to the cross-sectional size range of the copper pillar. The diameter can be controlled through precision machining or micro-forming processes. This size range allows for a balance between thermal conductivity and mechanical support requirements within a limited space.

[0056] Specifically, when the nickel-plated copper pillar is used as the connector 8, the high thermal conductivity of the copper substrate allows heat to be quickly transferred from the conductive polymer layer 4 to the frame unit 7. The nickel plating layer effectively prevents the copper from oxidizing and forming an insulating layer at high temperatures, thus avoiding interruption of the heat conduction path. The pillar diameter is controlled within the range of 50 to 150 micrometers, ensuring sufficient cross-sectional area to maintain low thermal resistance while avoiding stress concentration due to excessive diameter or insufficient mechanical strength due to insufficient diameter. Under high temperature or high current conditions, the nickel-plated copper pillar forms a stable heat conduction channel through its metallic properties, while providing reliable mechanical fixation through physical contact between the pillar and the insulating substrate 1, suppressing interface delamination caused by thermal expansion differences.

[0057] Furthermore, the conductive polymer layer 4 has uniformly embedded conductive fillers, which include carbon nanotubes, conductive polymer composite particles, or metal micropowders.

[0058] Conductive filler refers to conductive material dispersed in a polymer matrix. Specifically, it can be achieved by one or more combinations of carbon nanotubes, conductive polymer composite particles, or metal micro powders. It is embedded in the polymer layer through physical mixing or in-situ polymerization. Uniform embedding means that the conductive filler presents a non-aggregated and continuously distributed form in the polymer matrix. Specifically, it can be achieved through solution blending, ultrasonic dispersion, or mechanical stirring processes, so that the filler spacing is controlled within the range of nanometers to micrometers.

[0059] Carbon nanotubes refer to one-dimensional nanomaterials with a high aspect ratio, which can be achieved using single-walled or multi-walled carbon nanotubes. Surface modification can enhance their dispersibility in polymers. Conductive polymer composite particles refer to conductive polymer microparticles composed of polyaniline, polypyrrole, or polythiophene. They can be prepared through chemical oxidative polymerization or emulsion polymerization processes to form a core-shell structure to improve interfacial compatibility. Metal micropowders refer to micron-sized powders of silver, copper, or nickel, which can be prepared using ball milling or vapor deposition methods. An insulating layer is coated on the surface to prevent oxidation.

[0060] Specifically, conductive fillers are uniformly dispersed within the polymer matrix to form a three-dimensional conductive network. Carbon nanotubes, with their high aspect ratio, interlock within the matrix, forming continuous electron migration pathways and reducing charge transport impedance. Conductive polymer composite particles promote carrier hopping and conduction through the conjugation of molecular chains, improving local conductivity. Metal micropowders, with their intrinsic high conductivity, establish low-resistance channels, accelerating the dissipation of electrostatic energy. The synergistic effect of these three fillers disperses the Joule heat generated during discharge in multiple dimensions, preventing excessive heat accumulation in a single area. The uniformly distributed filler layout ensures continuous spatial coverage of the conductive network, maintaining the mechanical flexibility of the polymer layer while avoiding response delays caused by the breakage of local conductive pathways.

[0061] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high surge ESD static suppressor characterized by, The application relates to an ESD protection device, which comprises the following parts: an insulating substrate (1); terminal electrodes (2) symmetrically arranged on both sides of the substrate; a plurality of internal electrodes (3) embedded in the insulating substrate (1), the internal electrodes (3) being electrically connected with a conductive polymer layer (4); the conductive polymer layer (4) is arranged between the plurality of internal electrodes (3) and used for ESD energy absorption and conduction; a plurality of convex units (5) are arranged in an array between the conductive polymer layer (4) and the internal electrodes (3); transition interfaces (6) are respectively arranged at the connecting interfaces between the insulating substrate (1) and the conductive polymer layer (4), and the transition interfaces (6) are in the form of sawtooth or corrugation with a periodic structure; a frame unit (7) is arranged above the insulating substrate (1) and covers the outer side of the conductive polymer layer (4), the frame unit (7) is overlapped at the top of the terminal electrodes (2) at both ends, the frame unit (7) and the insulating substrate (1) are connected with each other through connecting pieces (8), and the terminal electrodes (2) and the internal electrodes (3) are respectively provided with through holes at positions corresponding to the connecting pieces (8).

2. A high inrush ESD static suppressor as defined in claim 1, wherein, The convex units (5) are made of polydimethylsiloxane material.

3. A high inrush ESD static suppressor according to claim 2, wherein, The convex units (5) are in the form of column or sphere, the maximum cross-section diameter of the convex units (5) is 3-10 mu m, and the convex units (5) are distributed in the contact area of the conductive polymer and the internal electrodes (3).

4. A high inrush ESD static suppressor as defined in claim 1, wherein, In each period, the length of the transition interface (6) is 10-50 mu m, and the height is 3-10 mu m.

5. A high inrush ESD static suppressor as defined in claim 1, wherein, The frame unit (7) is composed of polyimide composite material, and the internal structure is in the form of honeycomb or cross grid.

6. A high inrush ESD static suppressor as defined in claim 1, wherein, The connecting pieces (8) are metal heat-conducting columns.

7. A high inrush ESD static suppressor as defined in claim 6 wherein, The connecting pieces (8) are nickel-plated copper columns with a diameter of 50-150 mu m.

8. A high inrush ESD static suppressor as defined in claim 1, wherein, The conductive polymer layer (4) is provided with uniformly embedded conductive fillers, the conductive fillers include carbon nanotubes, conductive polymer composite particles or metal micropowder.

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