Etching process for inner layer irregular circuit of circuit board based on adjusting etching direction structure

Abstract

The present application relates to the technical field of printed circuit manufacturing, and discloses a line board inner layer special-shaped line etching process based on adjusting etching direction structure, which comprises the following steps: S1, pretreatment; S2, preparation, adjusting the structure for adjusting the direction of line board etching liquid inside the etching machine, so that the ion movement path is changed, and the etching direction is adjusted; S3, etching; and S4, film removal. In the application, the rotating table carrying the circuit board rotates while performing cyclic tilting action at multiple angles, so that the etching liquid fully contacts the inner layer of the line board from various angles; for the multi-layer line board with complex shape and different height connecting lines, the adjusting structure can continuously change the relative position of the line board and the etching liquid, so that the etching liquid more easily enters the narrow line gap and the levels with different heights, thereby ensuring the complete performance of etching and better avoiding the emergence of etching blind area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of printed circuit manufacturing, in particular to a line board inner layer special-shaped line etching process based on adjusting etching direction structure. BACKGROUND

[0002] The line board inner layer special-shaped line etching process plays a key role in modern electronic manufacturing industry, which can accurately construct complex conductive line patterns on the inner layer of multi-layer line board, realize high-density interconnection, special function circuit and optimize power and ground plane distribution, etc., and is an important link to meet the needs of miniaturization, multifunctionalization and high performance of electronic products.

[0003] Since the etching solution will etch the copper foil from all directions, when etching the corners and other fine parts of the special-shaped line, the isotropic etching characteristics do not have effective etching direction control structure, the ions in the etching solution will freely diffuse to the surface of the copper foil and etch, for the special-shaped line with fine branches or complex shape, the etching deviation is easy to occur without guiding the etching direction, the etching solution may enter the small gap or branch which is not expected to be etched, which destroys the integrity of the line, and the etching solution will etch from two adjacent directions at the same time, so that the copper foil at the corner is over-etched, causing the line width to narrow or the corner shape to deform, deviating from the design requirements. SUMMARY

[0004] Technical problems to be solved

[0005] In view of the above shortcomings of the prior art, the present application provides a line board inner layer special-shaped line etching process based on adjusting etching direction structure, which can effectively solve the problem of over-etching caused by uncontrollable etching direction in the prior art.

[0006] To achieve the above purpose, the present application is realized by the following technical scheme:

[0007] The present application provides a line board inner layer special-shaped line etching process based on adjusting etching direction structure, which comprises:

[0008] S1, pretreatment, first cleaning and surface activation treatment are performed on the inner layer of the line board, the cleaning is to remove the surface impurities, and the surface activation treatment is to improve the adsorption capacity between the copper foil surface and the subsequent added substances;

[0009] S2, preparation work, adjust the structure inside the etching machine for adjusting the etching solution direction of the line board, so that the magnetic field adjusts the etching direction to change the motion path of the ions, and realizes the adjustment of the etching direction;

[0010] S3, etching, first coating, exposing and developing photoresist, the pattern of the special-shaped line is transferred to the surface of the copper foil, in the etching process, due to the existence of the etching direction adjusting structure, the etching liquid will etch according to the designed direction, after etching, the circuit board is washed with water to remove the residual etching liquid and prevent further corrosion of the circuit board;

[0011] S4, film removal, immerse the etched circuit board in the film removal liquid to remove the remaining photoresist and make the circuit completely exposed, then clean the circuit board again to ensure the surface is clean;

[0012] The etching machine in S2 comprises an etching machine body, a liquid drop part for adding etching liquid is arranged at the middle of the top end of the inner wall of the etching machine body, and cleaning parts are symmetrically arranged at the side edges of the inner wall of the etching machine body;

[0013] A bearing part is arranged in the inner cavity of the etching machine body, a positioning part for limiting the circuit board is arranged at the top end of the bearing part, the positioning part is in sliding connection with the inner wall of the etching machine body, the bearing part comprises a bearing table arranged below the positioning part, the bearing table is designed in a circular plate shape, a rotating block is fixedly connected to the middle of the lower surface of the bearing table, and the lower surface of the rotating block is designed in a hemispherical shape;

[0014] A rotating part is arranged below the bearing table, the rotating part comprises a supporting ring in contact with the lower surface of the bearing table, movable rods are in sliding connection with the inner side of the supporting ring, the movable rods are uniformly distributed at the peripheral positions of the bottom end of the bearing table away from the center, the movable rods can exert force on the bottom end of the bearing table by ascending in turn, the bearing table drives the positioning part of the circuit board to perform periodic tilting action, and the direction of the etching liquid on the surface of the circuit board is accurately adjusted by cyclically changing the tilting angle;

[0015] The inner wall of the positioning part is provided with a support for adjusting the limiting state of the circuit board in different states.

[0016] Further, the rotating part further comprises a telescopic spring sleeved on the outer surface of the movable rod, the upper surface of the telescopic spring is in elastic connection with the lower surface of the supporting ring, a first circular block is fixedly connected to the top end of the movable rod, a second circular block is fixedly connected to the bottom end of the movable rod, the movable rod is designed in a conical shape with the top smaller than the bottom, equidistant limit grooves in sliding connection with the movable rods are arranged in the middle of the supporting ring, and the size of the limit grooves is smaller than the diameter size of the second circular block.

[0017] Further, the rotating part further comprises a rotating table in contact with the bottom end of the second circular block, a circular groove in movable connection with the lower surface of the rotating block is arranged at the middle of the top end of the rotating table, a first positioning rod is arranged at the middle of the bottom end of the rotating table, a second positioning rod is arranged at the other end of the first positioning rod, a motor is in transmission connection with the other end of the second positioning rod, and supporting rods are symmetrically arranged on the outer wall of the supporting ring.

[0018] Further, the positioning part further comprises a positioning frame arranged on the upper surface of the supporting ring, inner walls of the positioning frame are provided with sliding grooves, and the sliding grooves are symmetrically provided with two groups, one group of the sliding grooves is provided with a positioning block on the outer side, one end of the positioning block close to the center of the positioning frame is fixedly connected with a limiting plate, and the other end of the limiting plate is fixedly connected with a positioning plate one.

[0019] Further, the supporting part comprises a positioning plate two which is dampedly slid with the other group of the sliding grooves, one end of the positioning plate two is fixedly connected with a connecting plate, the other end of the connecting plate is rotationally connected with a connecting rod, the middle part of the connecting rod is elastically connected with a spring part, and the connecting plate and the positioning plate one are both designed in L shape.

[0020] Further, the upper surface of the bearing table is provided with a positioning groove, a limiting part is arranged on the inner wall of the positioning groove, the limiting part comprises a support block whose upper surface is provided with an inclined surface, the surface of the support block is sleeved with a limiting spring, the limiting spring is embedded in the inner wall of the positioning groove, and the bottom end of the support block is fixedly connected with a fixed block.

[0021] Further, the lower surface of the positioning frame is provided with a clamping groove, the support block is slidably connected with the clamping groove, and the inclined surface of the support block is attached to the side edge of the limiting plate.

[0022] Further, the positioning grooves are symmetrically arranged, and the gap between the positioning grooves on the side of the etching machine body into which the circuit board enters is greater than the gap size between the positioning grooves on the side of the etching machine body from which the circuit board moves out.

[0023] Compared with the prior art, the technical scheme provided by the present application has the following beneficial effects:

[0024] The limiting part is arranged, after the circuit board is embedded in the inner part of the positioning part, the positioning part enters the inner wall of the etching machine body along with the conveying belt, the inclined surface of the limiting plate is provided with a magnetic part which is magnetically connected with the positioning block, along with the movement of the clamping groove on the lower surface of the positioning frame to the corresponding positioning groove, at this time, the limiting plate attracts the support block in the positioning groove, the support block drives the fixed block to move upwardly by overcoming the elastic force of the limiting spring, the bottom end of the fixed block is no longer closely attached to the upper surface of the supporting ring, but there is a gap, the bottom end of the bearing table no longer receives the overall support from the supporting ring, therefore, the bearing table can be inclined by a certain angle in the space, and the subsequent flow guiding operation of the circuit board etching liquid is facilitated.

[0025] The application is provided with a rotating table, a positioning rod II drives a positioning rod I to rotate, the positioning rod I drives the rotating table to rotate, the rotating table rotates around the fixed fulcrum at the top of the positioning rod I, and the inclination angle of the rotating table periodically changes with the included angle between the positioning rod II and the positioning rod I; the rotating table rotates while being inclined to extrude the round block II, the round block II is forced to drive the movable rod and the round block I to move upwards, the extension spring is elastically deformed under the restriction of the supporting ring, the plurality of round blocks I are sequentially moved upwards to exert a pushing force on the lower surface of the bearing table, the bearing table rotates around the rotating block as the center to rotate, and the bearing table drives the positioning part to synchronously rotate, so that the etching liquid more easily enters the narrow line gap and the levels of different heights, and the integrity of etching is ensured.

[0026] The application is provided with a positioning part, as the fixed block rises, the fixed block drives the supporting block to continue to rise against the elastic force of the limiting spring, the supporting block exerts a force on the limiting plate, the limiting plate drives the sliding groove and the positioning plate I to synchronously move, the positioning plate I moves to continue to press the side edge of the circuit board, the sliding groove moves to drive the connecting rod to deform, the connecting rod deforms to push the positioning plate II out of the sliding groove through the connecting plate, and the connecting rod deforms to exert a force on the other two sides of the circuit board, so that additional force is exerted on the circuit board in the process of guiding the etching liquid to be uniformly distributed by the inclined rotation of the bearing table, and the position deviation or even the falling of the circuit board caused by mechanical reasons in the adjustment process is avoided.

[0027] After the slow rotation for guiding the etching liquid to be uniformly distributed is completed, the motor is accelerated to rotate, the repulsive force of the electromagnet on the fixed block increases, the space below the bearing table increases as the fixed block moves upwards, and the angle through which the bearing table can rotate increases, at this time, the cleaning part is opened, the cleaning part is arranged on the side of the etching machine body, and the inclined water flow is used for washing, so that subsequent water cleaning operation is performed in the etching machine body, the circuit board does not need to be disassembled for cleaning, and the practicability of the device is improved. BRIEF DESCRIPTION OF DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0029] Figure 1 It is a schematic diagram of the line plate inner layer special-shaped line etching process flow of the embodiment of the present application;

[0030] Figure 2 It is a schematic diagram of the overall structure of the device of the embodiment of the present application;

[0031] Figure 3 It is a schematic diagram of the connecting structure of the bearing part and the rotating part of the embodiment of the present application;

[0032] Figure 4 Figure is a schematic diagram of the bearing part connection structure of the embodiment of the present application;

[0033] Figure 5 Figure is a schematic diagram of the rotating part connection structure of the embodiment of the present application;

[0034] Figure 6 Figure is a schematic diagram of the rotating part body structure of the embodiment of the present application;

[0035] Figure 7 Figure is a schematic diagram of the positioning part structure of the embodiment of the present application;

[0036] Figure 8 Figure is a schematic diagram of the positioning part body structure of the embodiment of the present application.

[0037] The numbers in the figures represent respectively: 1, etching machine main body; 2, droplet part; 3, cleaning part; 5, bearing part; 51, bearing table; 511, positioning groove; 52, rotating block; 53, limiting piece; 531, support block; 532, limiting spring; 533, fixed block; 6, positioning part; 61, positioning frame; 611, clamping groove; 62, positioning plate one; 63, positioning block; 64, limiting plate; 65, sliding groove; 66, support piece; 661, positioning plate two; 662, connecting plate; 663, connecting rod; 665, spring piece; 7, rotating part; 71, support ring; 72, movable rod; 721, round block one; 722, round block two; 73, telescopic spring; 75, rotating table; 76, positioning rod one; 77, positioning rod two; 78, motor; 79, support rod. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0039] The present application will be further described below with reference to the embodiments.

[0040] Embodiment:

[0041] Please refer to Figures 1-8 The present application provides a circuit board inner layer special-shaped circuit etching process technical scheme based on adjusting etching direction structure:

[0042] S1, pretreatment, first clean and surface activation treatment of the inner layer of the circuit board, cleaning is to remove surface impurities, surface activation treatment is to improve the adsorption capacity between the copper foil surface and the subsequent added substances;

[0043] S2, preparation, adjust the structure inside the etching machine for adjusting the direction of the etching solution of the circuit board, change the movement path of ions, and realize the adjustment of etching direction;

[0044] S3, etching, first photoresist coating, exposure and development operation, the pattern of the special-shaped circuit is transferred to the surface of the copper foil, during the etching process, due to the existence of the etching direction adjusting structure, the etching solution will etch according to the designed direction, after etching, rinse the circuit board with water to remove residual etching solution and prevent further corrosion of the circuit board;

[0045] S4, film removal, immerse the etched circuit board in the film removal solution to remove the remaining photoresist and make the circuit completely exposed, clean the circuit board again after film removal to ensure the surface is clean;

[0046] Reference Figure 2 , Figure 3 and Figure 4 , the inner wall of the main body of the etching machine 1 is provided with a bearing part 5, the upper surface of the bearing part 5 is flush with the upper surface of the transmission part for feeding and discharging the circuit board into and out of the main body of the etching machine 1, the upper surface of the bearing part 5 is provided with a positioning part 6 for limiting the circuit board, the upper surface of the bearing table 51 is provided with a positioning groove 511, the inner wall of the positioning groove 511 is provided with a limiting part 53, the limiting part 53 includes a support block 531 with a slope design on the upper surface, the support block 531 is provided with a limiting spring 532, the limiting spring 532 is embedded in the inner wall of the positioning groove 511, the bottom end of the support block 531 is fixedly connected with a fixed block 533, as shown in Figure 7 , the positioning part 6 includes a positioning block 63 slidingly connected with the main body of the etching machine 1, the positioning block 63 is located on both sides of the positioning frame 61, the inner wall of the positioning frame 61 is provided with a sliding groove 65, a plurality of clamping grooves 611 are symmetrically provided below the positioning frame 61, there are four clamping grooves 611, two clamping grooves 611 form a group, one group is close to the feeding port of the circuit board, the other group is close to the discharging port of the circuit board, the sizes of the two groups are different, the inner wall of the sliding groove 65 is respectively provided with a positioning plate one 62 and a supporting part 66, as shown in Figure 8 , the positioning plate two 661 and the positioning plate one 62 in the supporting part 66 are both designed in L shape, so as to limit the circuit board after the image transfer operation, avoid the circuit board from moving out of the cavity of the positioning frame 61, the vertical plate of the positioning plate two 661 and the positioning plate one 62 guides the circuit board, and the horizontal plate supports the falling circuit board, the inner wall of the L plate is made of rubber material, which can buffer the impact force of the downward movement of the circuit board.

[0047] After the circuit board is embedded in the positioning part 6, the positioning part 6 enters the inner wall of the etching machine body 1 with the conveying belt, the inclined surface of the limiting plate 64 is provided with a magnetic part magnetically connected with the positioning block 63, the lower surface of the positioning frame 61 is moved to the corresponding positioning groove 511, at this time the limiting plate 64 attracts the supporting block 531 in the positioning groove 511, the supporting block 531 drives the fixed block 533 to move upward against the elastic force of the limiting spring 532, the bottom end of the fixed block 533 is no longer closely attached to the upper surface of the supporting ring 71, but there is a gap, the bottom end of the bearing table 51 no longer receives comprehensive support from the supporting ring 71, so that the bearing table 51 can be inclined at a certain angle in the space, facilitating the subsequent flow guiding operation of the etching liquid on the circuit board.

[0048] Under normal circumstances, the flow of etching liquid on the plane circuit board is relatively uniform, but for special-shaped lines, such uniform flow may cause some parts to be etched unsatisfactorily, when there are inclined or curved slender lines on the circuit board, the inclined circuit board can make the etching liquid flow along the direction of the lines, like guiding the etching liquid to etch along the lines, so as to better control the etching direction, therefore, the bearing part 5 movably connected with the inner wall of the etching machine body 1 is arranged in the present application.

[0049] As shown in Figure 2 and Figure 3 , the bearing part 5 comprises a bearing table 51 arranged below the positioning part 6, the bearing table 51 is designed in a circular plate shape, a rotating block 52 is fixedly connected to the middle of the lower part of the bearing table 51, the lower surface of the rotating block 52 is designed in a hemispherical shape, the bottom end of the rotating block 52 is rotatably connected with a circular groove formed in the middle of the bottom end of the inner wall of the etching machine body 1, the rotating block 52 can rotate in the circular groove, the bearing table 51 rotates to drive the bearing table 51 to tilt in different directions, thereby realizing the effect of inclined flow guiding. By tilting, the etching liquid can be filled and etched in the lower area or inner part under the action of gravity, especially in the parts with high precision requirements such as small gaps, fine branches and sharp corners, so as to avoid the accumulation of etching liquid in the high place and cause uneven etching.

[0050] However, only relying on the gravity of inclination has certain limitations on the contact angle and coverage range of the etching liquid and the circuit board, for some multi-layer circuit boards with special shapes or complex line layout, simply relying on the inclination angle may not be able to make the etching liquid reach all line levels, the flow of etching liquid in the local area is uneven, which affects the uniformity of etching, and etching deficiency may occur in higher or lower line parts, and it may not be possible to completely avoid the occurrence of etching blind area, therefore, the rotating part 7 is arranged in the present application, which can drive the bearing part 5 to rotate and tilt, so as to uniformly transmit the etching liquid to the corresponding corners.

[0051] Referring to Figure 5 and Figure 6The rotating part 7 comprises a supporting ring 71 attached to the lower surface of the bearing table 51, the inner side of the supporting ring 71 is slidingly connected with a movable rod 72, the movable rods 72 are uniformly distributed at the peripheral positions of the bottom end of the bearing table 51 away from the center, the movable rods 72 are sequentially raised to exert a pushing force on the bottom end of the bearing table 51, so that the bearing table 51 drives the positioning part 6 of the bearing circuit board to perform a periodic tilting action, achieving the purpose of adjusting the direction of the etching liquid, the outer surface of the movable rod 72 is sleeved with a telescopic spring 73, the upper surface of the telescopic spring 73 is elastically connected with the lower surface of the supporting ring 71, the top end of the movable rod 72 is fixedly connected with a round block one 721, the bottom end of the movable rod 72 is fixedly connected with a round block two 722, the middle part of the supporting ring 71 is equidistantly provided with a limiting groove slidingly connected with the movable rod 72, the size of the limiting groove is smaller than the diameter size of the round block two 722, the bottom end of the round block two 722 is attached with a rotating table 75, the bottom end of the rotating table 75 is fixedly connected with the telescopic spring 73, the other end of the positioning rod one 76 is rotatably connected with a positioning rod two 77, the other end of the positioning rod two 77 is drivingly connected with a motor 78, there is an included angle between the positioning rod two 77 and the positioning rod one 76, the side edge of the supporting ring 71 is fixedly connected with a supporting rod 79 connected with the inner wall of the etching machine body 1, ensuring the stability of the sliding of the movable rod 72 inside the supporting ring 71.

[0052] The worker starts the motor 78, the motor 78 drives the positioning rod two 77 to rotate, the positioning rod two 77 drives the positioning rod one 76 to rotate, the positioning rod one 76 drives the rotating table 75 to rotate, the rotating table 75 rotates around the fixed fulcrum at the top end of the positioning rod one 76, the tilting angle periodically changes with the included angle between the positioning rod two 77 and the positioning rod one 76, the rotating table 75 is tilted while rotating to extrude the round block two 722, the round block two 722 is forced to drive the movable rod 72 and the round block one 721 to move upwards, the telescopic spring 73 elastically deforms under the limitation of the supporting ring 71, the plurality of round block one 721 sequentially moves upwards to exert a pushing force on the lower surface of the bearing table 51, the bearing table 51 rotates around the rotating block 52 as the center under the pushing force of the round block one 721, the bearing table 51 rotates to drive the positioning part 6 limiting the circuit board to rotate synchronously, therefore, the movement mode of the rotating table 75 is: periodically changing the tilting angle at equal angle intervals during rotation, forming a multi-angle uniform cycle tilting and rotating compound motion.

[0053] The rotating table 75 applies different position forces to the positioning part 6 carrying the circuit board, so that the circuit board is regularly and multi-angelly inclined with the carrying table 51. The initial slow rotation uniformly transmits the etching liquid to the corresponding corners, ensures the uniform distribution of the etching liquid on the entire surface of the circuit board, avoids the concentration of the etching liquid in a certain area, and enables the etching liquid to fully contact the inner layer of the circuit board from various angles. For the multi-layer circuit board with complex shape and different height connecting lines, the etching liquid can be uniformly covered to each corner, and the occurrence of etching blind area can be better avoided. During the rotation process, the movement of the circuit board produces dynamic stirring effect on the etching liquid, enhances the fluidity and mixing effect of the etching liquid, and helps to improve the uniformity of etching. The dynamic stirring can make the chemical substances in the etching liquid more uniformly distributed, so that the etching reaction is more stable and consistent. For the multi-layer circuit board with small line spacing, many line levels and complex mutual connection, the inclined rotation of the circuit board can make the etching liquid more easily enter the narrow line gap and the levels with different heights, and ensure the completeness of etching.

[0054] The upper surface of the support ring 71 is provided with an electromagnetic block at the position coinciding with the center line of the fixed block 533. When the motor 78 is energized and rotated, the electromagnetic block applies a repulsive force to the bottom end of the fixed block 533, and the repulsive force increases as the energization intensity of the motor 78 increases. Therefore, after the drop part 2 in the etching machine main body 1 adds the etching liquid to the surface of the circuit board, the motor 78 is started. When the movable rod 72 pushes the carrying table 51 to rotate and incline, the top end of the fixed block 533 first penetrates the clamping groove 611 and then inserts into the clamping groove 611 to contact with the inner wall structure of the sliding groove 65.

[0055] Reference Figure 7 And Figure 8 The positioning block 63 is slidably connected to the side edge of the positioning part 6. One end of the positioning block 63 close to the center of the positioning frame 61 is fixedly connected with a limiting plate 64. The other end of the limiting plate 64 is fixedly connected with a positioning plate one 62. The support 66 includes a positioning plate two 661 which is dampedly slid with the sliding groove 65. One end of the positioning plate two 661 is fixedly connected with a connecting plate 662. The other end of the connecting plate 662 is rotatably connected with a connecting rod 663. The middle part of the connecting rod 663 is elastically connected with a spring 665. The connecting plate 662 and the positioning plate one 62 are both designed in L shape. The lower surface of the positioning frame 61 is provided with a clamping groove 611. The support block 531 is slidably connected with the clamping groove 611. The inclined surface of the support block 531 is in contact with the limiting plate 64. The length of the sliding groove 65 is greater than that of the limiting plate 64. In the initial state, the side edge of the sliding groove 65 is in contact with the side edge of the connecting rod 663. With the movement of the sliding groove 65 to the center of the positioning frame 61, the connecting rod 663 will be deformed. The inner wall of the sliding groove 65 is provided with a groove which is slidably connected with the side edge of the connecting rod 663.

[0056] With the rising of the fixed block 533, the fixed block 533 drives the support block 531 to continue to rise against the elastic force of the limiting spring 532, the support block 531 exerts force on the limiting plate 64, the limiting plate 64 drives the sliding groove 65 and the positioning plate one 62 to move synchronously, the movement of the positioning plate one 62 continues to press the side of the circuit board, the movement of the sliding groove 65 drives the deformation of the connecting rod 663, the deformation of the connecting rod 663 pushes the positioning plate two 661 out of the sliding groove 65 through the connecting plate 662, and the other two sides of the circuit board are subjected to force, so that additional force is exerted on the circuit board in the process of tilting and rotating the bearing table 51 to guide the uniform distribution of etching liquid, thereby avoiding the position deviation or even the falling of the circuit board caused by mechanical reasons in the adjustment process.

[0057] After the slow rotation to guide the uniform distribution of etching liquid is completed within the specified rotation time, the motor 78 accelerates rotation, the repulsive force of the electromagnet on the fixed block 533 increases, with the upward movement of the fixed block 533, the space below the bearing table 51 increases, and the angle at which the bearing table 51 can rotate increases, at this time the cleaning part 3 is opened, the cleaning part 3 is arranged on the side of the etching machine body 1, and the inclined water flow is washed to perform subsequent water cleaning operation in the etching machine body 1, without the need to disassemble the circuit board for cleaning, thereby improving the practicability of the device.

[0058] At the same time, due to the increase of the space of the circuit board, the push force of the movable rod 72 makes the circuit board obtain a larger inclination angle. When the inclination operation is entered, the positioning plate one 62 and the positioning plate two 661 can further ensure the firm fixation of the circuit board, avoid the instability of the circuit board caused by vibration, liquid flow and other factors in the etching process, and affect the etching precision, and avoid the movement or inclination of the circuit board in the adjustment process, so as to prevent the physical damage of the circuit board. For some high-precision and thin circuit boards, such collision may cause the circuit board to be broken or the internal circuit to be damaged.

[0059] The above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements will not change the essence of the corresponding technical solutions out of the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. A process for etching a profiled line in an inner layer of a circuit board based on adjusting the etching direction of the profiled line, characterized in that, The application relates to a method for manufacturing a circuit board, which comprises the following steps: S1, pretreatment, first cleaning and surface activation treatment are performed on the inner layer of the circuit board, the cleaning is performed to remove surface impurities, and the surface activation treatment is performed to improve the adsorption capacity between the copper foil surface and subsequent added substances; S2, preparation, the structure for adjusting the etching liquid direction of the etching machine is adjusted, the motion path of ions is changed, and the etching direction is adjusted; S3, etching, photoresist coating, exposure and development operations are performed, the pattern of the special-shaped circuit is transferred to the copper foil surface, in the etching process, due to the existence of the etching direction adjusting structure, the etching liquid etches according to the designed direction, after the etching is completed, the circuit board is washed with clean water, the residual etching liquid is removed, and further corrosion of the circuit board is prevented; S4, film removal, the circuit board after etching is immersed into a film removal liquid, the remaining photoresist is removed, the circuit is completely exposed, and the circuit board is cleaned again after the film removal, so that the surface is clean; In S2, the etching machine comprises an etching machine body (1), a drop liquid part (2) for adding etching liquid is arranged at the middle of the top end of the inner wall of the etching machine body (1), and cleaning parts (3) are symmetrically arranged at the side edges of the inner wall of the etching machine body (1); A bearing part (5) is arranged in the inner cavity of the etching machine body (1), a positioning part (6) for limiting the circuit board is arranged at the top end of the bearing part (5), the positioning part (6) is slidably connected with the inner wall of the etching machine body (1), the bearing part (5) comprises a bearing table (51) arranged below the positioning part (6), the bearing table (51) is designed in a circular plate shape, a rotating block (52) is fixedly connected to the middle below the bearing table (51), and the lower surface of the rotating block (52) is designed in a hemispherical shape; A rotating part (7) is arranged below the bearing table (51), the rotating part (7) comprises a supporting ring (71) abutting the lower surface of the bearing table (51), movable rods (72) are slidably connected to the inner side of the supporting ring (71), the movable rods (72) are uniformly distributed at the peripheral positions away from the center of the bottom end of the bearing table (51), the movable rods (72) can sequentially ascend to exert force on the bottom end of the bearing table (51), the bearing table (51) drives the positioning part (6) bearing the circuit board to periodically tilt, and the direction of the etching liquid on the surface of the circuit board is accurately adjusted by cyclically changing the tilting angle; The inner wall of the positioning part (6) is provided with a supporting piece (66) for adjusting the limiting state of the circuit board in different states.

2. The process for etching a profiled line in an inner layer of a circuit board based on adjusting the etching direction structure according to claim 1, wherein: The rotating part (7) further comprises a telescopic spring (73) sleeved on the outer surface of the movable rod (72), the upper surface of the telescopic spring (73) is elastically connected with the lower surface of the supporting ring (71), a first circular block (721) is fixedly connected to the top end of the movable rod (72), a second circular block (722) is fixedly connected to the bottom end of the movable rod (72), the movable rod (72) is designed in a conical shape with the top smaller than the bottom, equidistant limiting grooves are arranged in the middle of the supporting ring (71) and slidably connected with the movable rod (72), and the size of the limiting grooves is smaller than the diameter size of the second circular block (722).

3. The process for etching a profiled line in an inner layer of a circuit board based on adjusting the etching direction structure according to claim 2, wherein: The rotating part (7) further includes a rotating table (75) attached to the bottom end of the second round block (722), a circular groove is arranged in the middle of the top end of the rotating table (75) and movably connected with the lower surface of the rotating block (52), a first positioning rod (76) is arranged in the middle of the bottom end of the rotating table (75), a second positioning rod (77) is arranged at the other end of the first positioning rod (76), a motor (78) is drivingly connected to the other end of the second positioning rod (77), and support rods (79) are symmetrically arranged on the outer wall of the support ring (71).

4. The process for etching a shaped line in an inner layer of a circuit board based on adjusting the etching direction structure according to claim 1, wherein: The positioning part (6) further includes a positioning frame (61) arranged on the upper surface of the support ring (71), and a sliding groove (65) is formed in the inner wall of the positioning frame (61), and two groups of sliding grooves (65) are symmetrically arranged, one group of sliding grooves (65) is provided with a positioning block (63) on the outer side, one end of the positioning block (63) close to the center of the positioning frame (61) is fixedly connected with a limiting plate (64), and the other end of the limiting plate (64) is fixedly connected with a first positioning plate (62).

5. The process for etching a profiled line in an inner layer of a circuit board based on adjusting the etching direction structure according to claim 4, wherein: The support (66) includes a second positioning plate (661) which is in damping sliding connection with the other group of sliding grooves (65), one end of the second positioning plate (661) is fixedly connected with a connecting plate (662), the other end of the connecting plate (662) is rotatably connected with a connecting rod (663), the middle part of the connecting rod (663) is elastically connected with a spring member (665), and the connecting plate (662) and the first positioning plate (62) are both designed in L shape.

6. The process of claim 5, wherein the process is characterized by: A positioning groove (511) is formed in the upper surface of the bearing table (51), a limiting member (53) is arranged on the inner wall of the positioning groove (511), the limiting member (53) includes a support block (531) with an inclined upper surface, the support block (531) is sleeved with a limiting spring (532), the limiting spring (532) is embedded in the inner wall of the positioning groove (511), and the bottom end of the support block (531) is fixedly connected with a fixed block (533).

7. The process of claim 6, wherein the process is characterized by: A clamping groove (611) is formed in the lower surface of the positioning frame (61), the support block (531) is in sliding connection with the clamping groove (611), and the inclined surface of the support block (531) is attached to the side edge of the limiting plate (64).

8. The process of claim 6, wherein the process is characterized by: The positioning grooves (511) are symmetrically arranged, and the gap between the positioning grooves (511) on the side of the etching machine body (1) through which the circuit board enters is greater than the gap between the positioning grooves (511) on the side of the etching machine body (1) through which the circuit board moves out.

Images