Circuit board automatic copper deposition processing device and method

Abstract

The invention relates to the technical field of circuit board copper deposition treatment, in particular to an automatic circuit board copper deposition treatment device and method. Comprising three liquid storage tanks which are arranged in a straight line and are in contact with one another; the controller is mounted on the side surface of one liquid storage tank; the mounting frame is mounted on a hook of the suspension conveyor; the liquid discharging frames are connected to the mounting frame in an up-and-down symmetry manner; the drainage square pipe is connected to the bottom of the drainage frame and keeps communicating with the drainage frame; the lifting frame is placed at the top of the liquid discharging frame; the butt joint pipe is connected to the side face of the lifting frame and keeps communicating; the bearing plate is connected to the interior of the drainage frame, and a drainage hole is formed in the bearing plate and located over the drainage square pipe; and the cover plate is connected to the interior of the lifting frame. Through the linkage design of the lifting frame, the liquid discharging frame and the liquid discharging square pipe and the cooperation of the liquid injection assembly and the blocking assembly, the forced circulation flow of the treatment liquid in the hole of the circuit board can be realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of copper plating treatment of circuit board, and particularly relates to a device and method for automatic copper plating treatment of circuit board. BACKGROUND

[0002] In the process of manufacturing circuit board, the copper plating process is a key link to realize the conduction of internal circuit of multi-layer circuit board. The traditional copper plating treatment usually includes multiple steps: firstly, the surface of the circuit board is cleaned to remove the oil stains and oxides on the surface; then the circuit board is slightly corroded (i.e. micro-etching) using a chemical solution to increase the surface activity and improve the adhesion of subsequent processing; then the circuit board is immersed in an activation solution to make the hole wall surface adsorb catalytic active centers; finally, the circuit board is placed in a chemical plating solution for copper plating to deposit a uniform copper layer on the hole wall and surface.

[0003] However, in the prior art, the processing steps such as micro-etching, activation and copper plating are mostly carried out by immersion. Since there are a large number of holes on the circuit board, especially with the development of electronic devices towards high density and miniaturization, the hole diameter is getting smaller and the hole depth is getting deeper, so it is difficult for the traditional immersion method to make the processing solution fully penetrate into the hole. This not only leads to insufficient processing of the hole wall surface, but also may cause uneven distribution of catalytic active centers or incomplete copper layer deposition, thereby seriously affecting the quality of the copper plating layer and the conductivity of the circuit board. In addition, the poor flow of the processing solution in the hole also easily causes insufficient reaction or accumulation of reaction products in the local area, which will further reduce the stability and consistency of the copper plating process. SUMMARY

[0004] Therefore, the present application provides a device and method for automatic copper plating treatment of circuit board, which can overcome the shortcomings of the traditional immersion method that is difficult to make the processing solution fully penetrate into the hole, which leads to insufficient processing of the hole wall surface, thereby seriously affecting the quality of the copper plating layer.

[0005] The technical scheme of the present application is: an automatic copper immersion treatment device for circuit board, comprising: three liquid storage tanks arranged in a line and in contact with each other; a controller installed on the side of one of the liquid storage tanks; a mounting frame installed on the hook of a suspension conveyor; a liquid discharge frame symmetrically connected to the mounting frame; a liquid discharge square tube connected to the bottom of the liquid discharge frame and in communication; a lifting frame placed on the top of the liquid discharge frame; a butt joint pipe connected to the side of the lifting frame and in communication; a supporting plate connected to the inside of the liquid discharge frame, and the supporting plate has a liquid discharge hole opened therein, which is located directly above the liquid discharge square tube; a cover plate connected to the inside of the lifting frame, and the cover plate has first through holes opened therein at regular intervals; protrusions symmetrically connected to the top of the supporting plate and the bottom of the cover plate, respectively; a lifting assembly arranged on the mounting frame for driving the lifting frame to lift and lower; a liquid injection assembly arranged on the liquid storage tank for injecting treatment liquid into the lifting frame; and a blocking assembly arranged on the supporting plate for blocking the liquid discharge hole.

[0006] Further, the lifting assembly comprises: first electric push rods symmetrically installed on the mounting frame, and the extension rods of the first electric push rods are connected with the lifting frame on the upper side; and a connecting plate connected between the lifting frames on the upper and lower sides.

[0007] Further, the liquid injection assembly comprises: a connecting seat connected to the side of the liquid storage tank; a liquid pumping pump installed on the connecting seat, and the liquid inlet of the liquid pumping pump is connected with the liquid storage tank and in communication; a connecting pipe connected to the liquid outlet of the liquid pumping pump and in communication; a linear motor installed on the top of the liquid storage tank; a vertical frame connected to the mover of the linear motor, and the liquid outlet end of the vertical frame is located in the inside of the liquid storage tank; a liquid injection pipe connected to the vertical frame, and the end of the connecting pipe away from the liquid pumping pump is connected with the liquid injection pipe and in communication; and a butt joint mechanism arranged on the vertical frame for butt joining the liquid injection pipe and the butt joint pipe.

[0008] Further, the butt joint mechanism comprises: a second electric push rod installed on the top of the vertical frame; a mounting plate connected to the extension rod of the second electric push rod, and the mounting plate has first circular holes symmetrically opened therein, and the end of the butt joint pipe is located in the first circular hole, and the mounting plate also has a square hole, and the liquid inlet end of the vertical frame is located in the square hole; a receiver installed on the mounting plate; and a transmitter installed on the liquid discharge square tube.

[0009] Further, the blocking assembly comprises: a guide rod connected to the bottom of the supporting plate; a baffle plate slidingly connected to the guide rod, and the baffle plate blocks the bottom of the liquid discharge hole, and the baffle plate has a second circular hole opened therein; and a connecting spring wound around the outside of the guide rod, and the two ends of the connecting spring are connected with the guide rod and the baffle plate, respectively.

[0010] Further, the device further comprises a fixed cylinder connected to the inner bottom of the liquid storage tank, a liquid outlet pipe having two ends connected to the fixed cylinder and the liquid inlet of the liquid pump respectively and in communication, arc-shaped filter plates symmetrically connected to the inner wall of the fixed cylinder, a liquid inlet pipe connected to one of the arc-shaped filter plates and in communication, and an end of the liquid inlet pipe penetrating through the outer wall of the fixed cylinder, and a cleaning mechanism arranged on the fixed cylinder and used for cleaning the arc-shaped filter plates.

[0011] Further, the cleaning mechanism comprises a sliding frame placed on the fixed cylinder and located between the two arc-shaped filter plates, a handle connected to the sliding frame, a driving motor installed on the top of the sliding frame, a screw rod connected to the output shaft of the driving motor and in contact with the arc-shaped filter plates, a vertical pipe connected to the bottom of the sliding frame and in communication, and a filter frame threadedly connected to the bottom of the vertical pipe and in communication.

[0012] Further, the device further comprises a fixed pipe connected to the top of the lifting frame and in communication, a liquid level sensor installed on the fixed pipe, a hollow plate having two ends connected to the liquid discharge frame and the lifting frame respectively and in communication, third electric push rods symmetrically installed on the lifting frame, a blocking frame slidingly connected to the inside of the lifting frame, an extension rod of the third electric push rod connected to the blocking frame, second through holes uniformly and separately arranged on the blocking frame, and a blocking column connected to the top of the blocking frame.

[0013] The application further provides a use method of the automatic copper plating treatment device of the circuit board, comprising the following steps: firstly, placing the treatment liquids required by three processes of micro-etching, activation and copper plating into three liquid storage tanks respectively, then controlling the first electric push rod to drive the lifting frame to move upward through the controller, then placing the cleaned circuit board on the top of the protrusions on the supporting plate, then controlling the first electric push rod to drive the lifting frame to move downward to reset through the controller, so that the protrusions on the upper and lower sides clamp the circuit board, then slowly transporting the mounting frame through the suspension conveyor, when the receiver is longitudinally aligned with the transmitter, it means that the mounting frame has been moved to the top of the liquid storage tank, at this time, the receiver sends a signal, the controller receives the signal and controls the linear motor to drive the vertical frame to move right, and the moving speed of the vertical frame is consistent with the moving speed of the mounting frame, then the controller controls the second electric push rod to drive the mounting plate to move forward, so that the rear end of the connecting pipe is located in the first circular hole and the rear end of the liquid discharge square pipe is located in the square hole, to complete the connection between the connecting pipe and the liquid injection pipe and between the liquid discharge square pipe and the vertical frame, then the controller controls the liquid pumping pump to pump the treatment liquid in the liquid storage tank, and the treatment liquid is transported into the lifting frame through the connecting pipe, the liquid injection pipe and the connecting pipe, the treatment liquid in the lifting frame flows downward through the first through hole to the upper side of the circuit board, at this time, the pressure on the upper side of the circuit board gradually increases, under the action of the pressure, the treatment liquid flows downward through each hole on the circuit board, so that the treatment liquid flows to the lower side of the circuit board, the treatment liquid on the lower side of the circuit board slowly flows downward through the second circular hole to the liquid discharge frame, and the treatment liquid in the liquid discharge frame is discharged back to the leftmost liquid storage tank through the liquid discharge square pipe and the vertical frame, to form a circulating treatment system.

[0014] The beneficial effects are: 1. Through the linkage design of the lifting frame, the liquid discharge frame and the liquid discharge square pipe, combined with the cooperation of the liquid injection assembly and the blocking assembly, the forced circulation flow of the treatment liquid in the holes of the circuit board can be realized, specifically, the treatment liquid enters the storage space between the cover plate and the circuit board through the first through hole from the lifting frame, penetrates the holes to the storage space between the supporting plate and the circuit board under the action of the pressure, and is discharged through the liquid discharge hole or the second circular hole, to form a dynamic circulation, this design can significantly improve the penetration ability of the treatment liquid to the high-density small-aperture circuit board, ensure the uniformity and integrity of the micro-etching, activation and copper plating processes, and solve the problem of insufficient treatment in the holes in the traditional soaking method.

[0015] 2. The application utilizes the cooperative work of the connecting mechanism and the liquid level sensor to realize the accurate injection and recovery of the treatment liquid, when the transmitter is aligned with the receiver, the controller automatically starts the liquid pumping pump and the linear motor, the liquid injection is completed through the connection of the liquid injection pipe and the connecting pipe, the treatment liquid flows back to the liquid storage tank through the liquid discharge square pipe and the vertical frame, to form a closed loop system, at the same time, the liquid level sensor monitors the liquid level in the lifting frame and controls the movement of the blocking frame, to ensure the synchronization of the treatment of the upper and lower surfaces of the circuit board, this design not only can improve the process stability, but also can reduce the waste of the treatment liquid and reduce the cost.

[0016] 3、The application can effectively solve the problem of impurity accumulation in the treatment liquid by the cooperation of the arc-shaped filter plate in the fixing cylinder and the cleaning mechanism, the arc-shaped filter plate can prevent impurities from entering the liquid pump, the driving motor drives the screw rod to rotate regularly, and can scrape off the impurities adhered to the surface of the arc-shaped filter plate, the impurities fall into the detachable filter frame through the vertical pipe, which is convenient for cleaning, this design can significantly prolong the service life of the device, reduce the maintenance frequency, ensure the purity of the treatment liquid, and further improve the quality consistency of the copper deposition layer. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a three-dimensional structure schematic diagram of the application.

[0018] Figure 2 It is a mounting schematic diagram of the liquid discharge frame, liquid discharge square pipe, lifting frame and lifting assembly of the application.

[0019] Figure 3 It is a mounting schematic diagram of the butt joint pipe, supporting plate, cover plate and protruding block of the application.

[0020] Figure 4 It is a mounting schematic diagram of the liquid injection assembly of the application.

[0021] Figure 5 It is a mounting schematic diagram of the butt joint mechanism of the application.

[0022] Figure 6 It is a mounting schematic diagram of the transmitter of the application.

[0023] Figure 7 It is a mounting schematic diagram of the blocking assembly of the application.

[0024] Figure 8 It is a mounting schematic diagram of the fixed cylinder and liquid outlet pipe of the application.

[0025] Figure 9 It is a mounting schematic diagram of the arc-shaped filter plate, liquid inlet pipe, sliding frame and handle of the application.

[0026] Figure 10 It is a mounting schematic diagram of the driving motor, screw rod, vertical pipe and filter frame of the application.

[0027] Figure 11 It is a mounting schematic diagram of the fixed pipe, liquid level sensor and hollow plate of the application.

[0028] Figure 12 It is a mounting schematic diagram of the blocking frame and blocking column of the application.

[0029] Parts names and serial numbers in the figure: 1-liquid storage tank, 2-controller, 3-suspension conveyor, 4-mounting frame, 5-drainage frame, 6-drainage square pipe, 7-lifting frame, 8-butting pipe, 9-supporting plate, 901-drainage hole, 10-cover plate, 1001-first through hole, 11-bump, 12-first electric push rod, 13-connecting plate, 14-connecting seat, 15-liquid pump, 16-connecting pipe, 17-linear motor, 18-vertical frame, 19-liquid injection pipe, 20-second electric push rod, 21-mounting plate, 2101-first A circular hole, 2102-square hole, 22-receiver, 23-transmitter, 24-guide rod, 25-baffle, 2501-second circular hole, 26-connecting spring, 27-fixing cylinder, 28-liquid outlet pipe, 29-arc filter plate, 30-liquid inlet pipe, 31-sliding frame, 32-handle, 33-drive motor, 34-screw rod, 35-vertical pipe, 36-filter frame, 37-fixing pipe, 38-liquid level sensor, 39-hollow plate, 40-third electric push rod, 41-baffle frame, 4101-second through hole, 42-baffle column. DETAILED DESCRIPTION

[0030] Embodiment: A circuit board automatic copper deposition processing device and method, such as Figures 1-7 As shown, it includes a liquid storage tank 1, a controller 2, a mounting frame 4, a drainage frame 5, a drainage square pipe 6, a lifting frame 7, a docking pipe 8, a supporting plate 9, a cover plate 10, a protrusion 11, a lifting assembly, a liquid injection assembly and a blocking assembly. There are three liquid storage tanks 1, and the three liquid storage tanks 1 are arranged in a line and contact each other, and the liquid storage tank 1 is located below the hanging conveyor 3. The controller 2 is installed on the upper left front side of the liquid storage tank 1 on the left, and a mounting frame 4 is installed on each hook of the hanging conveyor 3. Each mounting frame 4 is symmetrically connected to a drainage frame 5 in the upper and lower parts, and the inner bottom of the drainage frame 5 is conical. The bottom of the drainage frame 5 is connected to the drainage square pipe 6 and remains connected, and the top of the drainage frame 5 is placed A lifting frame 7 is provided, and the rear side of the lifting frame 7 is connected to a docking pipe 8 and remains connected. The interior of the drainage frame 5 is connected to a supporting plate 9, and a drainage hole 901 is opened in the middle of the supporting plate 9, and the drainage hole 901 is located directly above the drainage square tube 6. The lower inner part of the lifting frame 7 is connected to a cover plate 10, and a plurality of first through holes 1001 are evenly spaced from left to right on the cover plate 10. Bumps 11 are connected to the corners of the top of the supporting plate 9 and the bottom of the cover plate 10. A lifting component for driving the lifting frame 7 to lift and lower is provided on the mounting frame 4, and a liquid injection component for injecting the treatment liquid into the lifting frame 7 is provided on the liquid storage tank 1. A blocking component for blocking the drainage hole 901 is provided on the supporting plate 9.

[0031] like Figure 2As shown, the lifting assembly includes a first electric push rod 12 and a connecting plate 13. Four first electric push rods 12 are installed on the upper part of each mounting frame 4, and the telescopic rod of the first electric push rod 12 is connected to the top of the upper lifting frame 7. The connecting plate 13 is symmetrically connected between the upper and lower lifting frames 7 in the front and back.

[0032] like Figures 4-6 As shown, the liquid injection assembly includes a connecting seat 14, a liquid suction pump 15, a connecting pipe 16, a linear motor 17, a vertical frame 18, a liquid injection pipe 19 and a docking mechanism. The lower rear parts of the three liquid storage tanks 1 are all connected with the connecting seat 14, the liquid suction pump 15 is installed on the connecting seat 14, and the liquid inlet of the liquid suction pump 15 is connected to the liquid storage tank 1 and kept in communication, the liquid outlet of the liquid suction pump 15 is connected with the connecting pipe 16 and kept in communication, the tops of the three liquid storage tanks 1 are all installed with a linear motor 17, the mover of the linear motor 17 is connected with a vertical frame 18, the lower end of the vertical frame 18 is the liquid outlet end, and the liquid outlet end of the vertical frame 18 is located inside the liquid storage tank 1, the front side of the vertical frame 18 is provided with two liquid inlet ends, the upper right side of the vertical frame 18 is connected with a liquid injection pipe 19, the shape of the liquid injection pipe 19 is U-shaped, and both ends of the liquid injection pipe 19 are facing the front side, the connecting pipe 16 is The upper end is connected to the middle part of the rear side of the injection pipe 19 and remains in communication. The vertical frame 18 is provided with a docking mechanism for docking the injection pipe 19 and the docking pipe 8; the docking mechanism includes a second electric push rod 20, a mounting plate 21 and a photoelectric sensor. The second electric push rod 20 is installed on the top of the vertical frame 18, and the telescopic rod of the second electric push rod 20 is connected to the mounting plate 21. Two first circular holes 2101 are symmetrically opened on the mounting plate 21, and the two ends of the docking pipe 8 are respectively located in the two first circular holes 2101. A square hole 2102 is also opened on the mounting plate 21, and the liquid inlet end of the vertical frame 18 is located in the square hole 2102. The photoelectric sensor consists of a receiver 22 and a transmitter 23. The receiver 22 is installed on the upper front side of the mounting plate 21, and the transmitter 23 is installed on the upper rear side of the discharge square pipe 6. The transmitter 23 is flush with the height of the receiver 22.

[0033] like Figure 7 As shown, the blocking assembly includes a guide rod 24, a baffle 25 and a connecting spring 26. The guide rod 24 is connected to the left side of the bottom of the support plate 9. The baffle 25 is slidably connected to the guide rod 24, and the top right side of the baffle 25 blocks the bottom of the drainage hole 901. A second circular hole 2501 is opened on the right part of the baffle 25. A connecting spring 26 is wound around the outside of the guide rod 24, and the two ends of the connecting spring 26 are respectively connected to the lower end of the guide rod 24 and the bottom of the baffle 25.

[0034] When the circuit board needs to be treated with copper deposition, first, the processing liquid required by the three processes of micro-etching, activation and copper deposition is respectively put into three liquid storage tanks 1, then the controller 2 controls the first electric push rod 12 to drive the upper lifting frame 7 to move upwards, the upper lifting frame 7 can drive the lower lifting frame 7 to move upwards through the connecting plate 13, so that the lifting frame 7 is separated from the liquid discharge frame 5, the lifting frame 7 can drive the cover plate 10 to move upwards, then the staff can place the cleaned circuit board on the top of the protrusion 11 on the supporting plate 9, and then the controller 2 controls the first electric push rod 12 to drive the lifting frame 7 to move downwards to reset, so that the bottom of the lifting frame 7 is in contact with the top of the liquid discharge frame 5, the lifting frame 7 can drive the cover plate 10 to move downwards to reset, so that the bottom of the protrusion 11 on the cover plate 10 is in contact with the circuit board, the circuit board is clamped by the cooperation of the protrusions 11 on the upper and lower sides, and the protrusions 11 can leave a liquid storage space between the supporting plate 9, the cover plate 10 and the circuit board; then the installation frame 4 is slowly transported by the suspension conveyor 3, the installation frame 4 can drive the circuit board to slowly move along the guide rail of the suspension conveyor 3, when the leftmost receiver 22 is longitudinally aligned with the transmitter 23, it means that the installation frame 4 has moved to the top of the leftmost liquid storage tank 1, and the rear end of the butt joint pipe 8 is longitudinally aligned with the end of the leftmost liquid injection pipe 19, the rear end of the liquid discharge pipe 6 is longitudinally aligned with the liquid inlet end of the leftmost vertical frame 18, at this time the receiver 22 sends a signal, after the controller 2 receives the signal, the leftmost linear motor 17 is controlled to drive the leftmost vertical frame 18 to move rightwards, and the moving speed of the vertical frame 18 is consistent with the moving speed of the installation frame 4, so that the butt joint pipe 8 and the leftmost liquid injection pipe 19 and the liquid discharge pipe 6 and the leftmost vertical frame 18 are always in alignment, then the controller 2 controls the leftmost second electric push rod 20 to drive the leftmost mounting plate 21 to move forward, so that the rear end of the butt joint pipe 8 is located in the first circular hole 2101, and the rear end of the liquid discharge pipe 6 is located in the square hole 2102, to complete the butt joint between the butt joint pipe 8 and the leftmost liquid injection pipe 19 and the liquid discharge pipe 6 and the leftmost vertical frame 18.Then the controller 2 will control the leftmost liquid pump 15 to start working, the leftmost liquid pump 15 will extract the processing liquid in the leftmost liquid tank 1, and transport the processing liquid to the lifting frame 7 through the leftmost connecting pipe 16, the leftmost liquid injection pipe 19 and the docking pipe 8, the processing liquid in the lifting frame 7 will flow down to the liquid storage space between the cover plate 10 and the circuit board through the first through hole 1001, at this time, the pressure in the liquid storage space between the cover plate 10 and the circuit board will gradually increase, under the action of the pressure, the processing liquid will flow down to the liquid storage space between the supporting plate 9 and the circuit board through the holes on the circuit board, the processing liquid in the liquid storage space between the supporting plate 9 and the circuit board will slowly flow down to the liquid discharge frame 5 through the second circular hole 2501, because the liquid inlet amount of the docking pipe 8 is much larger than the liquid discharge amount of the second circular hole 2501, so the processing liquid in the liquid storage space between the supporting plate 9 and the circuit board will be more and more, so that the top and bottom of the circuit board can be in contact with the processing liquid, and the processing liquid can flow through the holes on the circuit board to carry out comprehensive micro-etching treatment on the circuit board; as the processing liquid in the liquid storage space between the supporting plate 9 and the circuit board becomes more and more, the pressure in the liquid storage space between the supporting plate 9 and the circuit board will also gradually increase, when the pressure is greater than the elastic force of the connecting spring 26, the processing liquid will extrude the baffle 25 to move downward, the connecting spring 26 is compressed, so that the baffle 25 no longer blocks the bottom of the liquid discharge hole 901, the processing liquid in the liquid storage space between the supporting plate 9 and the circuit board will flow down to the liquid discharge frame 5 through the liquid discharge hole 901, the processing liquid in the liquid discharge frame 5 can be discharged back to the leftmost liquid tank 1 through the liquid discharge square pipe 6 and the leftmost vertical frame 18, forming a circulating system; after three minutes, the controller 2 will control the leftmost liquid pump 15 to stop working, so that the processing liquid no longer enters the lifting frame 7, at this time, the pressure in the liquid storage space will gradually decrease, and the remaining processing liquid in the liquid storage space between the cover plate 10 and the circuit board will slowly flow down through the holes on the circuit board under the action of gravity, when the pressure in the liquid storage space between the supporting plate 9 and the circuit board is less than the elastic force of the connecting spring 26, the connecting spring 26 will restore to its original state, driving the baffle 25 to move upward to reset and block the bottom of the liquid discharge hole 901, so that the remaining processing liquid in the liquid storage space between the supporting plate 9 and the circuit board can only slowly flow down to the liquid discharge frame 5 through the second circular hole 2501, so that the circuit board can still be in the process of micro-etching treatment; after two minutes, the remaining processing liquid in the liquid storage space between the supporting plate 9 and the circuit board can be completely discharged, so that the circuit board can be micro-etched for five minutes;At this time, the controller 2 controls the second electric push rod 20 on the leftmost side to drive the mounting plate 21 on the leftmost side to move backward to reset, so that the rear end of the docking pipe 8 is separated from the first circular hole 2101, and the rear end of the liquid discharge square pipe 6 is separated from the square hole 2102, to release the docking between the docking pipe 8 and the liquid injection pipe 19 on the leftmost side and the docking between the liquid discharge square pipe 6 and the vertical frame 18 on the leftmost side. Then the controller 2 controls the linear motor 17 on the leftmost side to drive the vertical frame 18 on the leftmost side to move left to reset. At this time, the suspension conveyor 3 can drive the mounting frame 4 to continue to move right, and the above operation is repeated, so that the circuit board can be activated and copper deposition processed in sequence.

[0035] As shown in Figures 8-10 The fixed cylinder 27, the liquid outlet pipe 28, the arc-shaped filter plate 29, the liquid inlet pipe 30 and the cleaning mechanism are further included. The inner bottom front side of each of the three liquid storage tanks 1 is connected with the fixed cylinder 27. The rear lower part of the fixed cylinder 27 is connected with the liquid outlet pipe 28 and keeps in communication. The rear end of the liquid outlet pipe 28 keeps in communication with the liquid inlet of the liquid pump 15. The inner wall of the fixed cylinder 27 is connected with the arc-shaped filter plate 29 in a left-right symmetrical manner. The right lower part of the right arc-shaped filter plate 29 is connected with the liquid inlet pipe 30 and keeps in communication. The right end of the liquid inlet pipe 30 penetrates out of the right lower part of the fixed cylinder 27. The fixed cylinder 27 is provided with the cleaning mechanism for cleaning the arc-shaped filter plate 29. The cleaning mechanism includes the sliding frame 31, the handle 32, the driving motor 33, the spiral rod 34, the vertical pipe 35 and the filter frame 36. The sliding frame 31 is placed on each fixed cylinder 27 and located between the two arc-shaped filter plates 29. The upper part of the sliding frame 31 is connected with the handle 32. The top of the sliding frame 31 is provided with the driving motor 33. The output shaft of the driving motor 33 is connected with the spiral rod 34, which is in contact with the arc-shaped filter plate 29. The bottom of the sliding frame 31 is connected with the vertical pipe 35 and keeps in communication. The bottom of the vertical pipe 35 is threadedly connected with the filter frame 36 and keeps in communication.

[0036] When the staff puts the processing liquid into the storage tank 1, the processing liquid in the storage tank 1 can enter the space between the two arc-shaped filter plates 29 through the liquid inlet pipe 30, fill the space between the two arc-shaped filter plates 29, and the arc-shaped filter plates 29 can filter the processing liquid to intercept impurities in the processing liquid, and the filtered processing liquid can flow to the inside of the fixed cylinder 27 through the arc-shaped filter plates 29, when the liquid pumping pump 15 starts to work, the liquid pumping pump 15 can extract the filtered processing liquid through the liquid outlet pipe 28, so as to avoid the impurities in the processing liquid entering the liquid pumping pump 15; when it is necessary to clean the impurities adhered to the inner wall of the arc-shaped filter plate 29, the controller 2 can control the driving motor 33 to work for one minute, the driving motor 33 drives the spiral rod 34 to rotate, the spiral rod 34 can scrape the impurities adhered to the inner wall of the arc-shaped filter plate 29 downward, so that the impurities fall downward to the filter frame 36 through the vertical pipe 35, after one minute, the controller 2 controls the driving motor 33 to stop working, at this time, the handle 32 can be pulled upward to drive the sliding frame 31 to move upward and away from the arc-shaped filter plate 29, the sliding frame 31 can drive the vertical pipe 35 and the filter frame 36 to move upward away from the storage tank 1, then the filter frame 36 can be rotated and unscrewed, and the impurities in the filter frame 36 can be treated, after the treatment is completed, the filter frame 36 is rotated and installed back to the bottom of the vertical pipe 35, and the sliding frame 31 is inserted back into the fixed cylinder 27.

[0037] Since the docking pipe 8 is located at the rear side of the lifting frame 7, when the docking pipe 8 delivers the processing liquid into the lifting frame 7, the processing liquid will directly fall downward to the top rear side of the circuit board through the first through hole 1001, and then the processing liquid will flow downward to the lower side of the circuit board through the hole on the circuit board, so that only the rear half of the circuit board can be treated, and the front half of the circuit board can not be treated, therefore, the shielding assembly is designed; as shown in Figure 11 and Figure 12 The shielding assembly comprises a fixed pipe 37, a liquid level sensor 38, a hollow plate 39, a third electric push rod 40, a blocking frame 41 and a blocking column 42, the top left side of the lifting frame 7 is connected with the fixed pipe 37 and keeps communication, the liquid level sensor 38 is installed on the fixed pipe 37, the hollow plate 39 is connected between the liquid discharge frame 5 and the right side of the lifting frame 7 and keeps communication, the shape of the hollow plate 39 is U-shaped, the third electric push rod 40 is symmetrically installed on the left side of the lifting frame 7, the blocking frame 41 is slidably connected to the inner side of the lifting frame 7, the extension rod of the third electric push rod 40 is connected with the blocking frame 41, the blocking frame 41 blocks the first through hole 1001, the blocking frame 41 is uniformly and spacedly provided with the second through holes 4101 corresponding to the first through hole 1001 one by one, and the blocking column 42 is connected to the top left side of the blocking frame 41.

[0038] In the initial state, the second through hole 4101 is not aligned with the first through hole 1001; when the docking pipe 8 delivers the processing liquid into the lifting frame 7, the processing liquid will flow directly into the storage space between the supporting plate 9 and the circuit board through the hollow plate 39 because the first through hole 1001 is blocked by the blocking frame 41, ensuring that the bottom of the circuit board can be in full contact with the processing liquid; when the storage space between the supporting plate 9 and the circuit board is filled with processing liquid, the processing liquid will temporarily accumulate on the upper side of the interior of the lifting frame 7; as the processing liquid in the lifting frame 7 increases, when the liquid level sensor 38 detects that the processing liquid in the interior of the lifting frame 7 enters the fixed pipe 37, it means that the upper side of the interior of the lifting frame 7 is filled with processing liquid; at this time, the liquid level sensor 38 will send a signal, and the controller 2 will receive the signal and control the third electric push rod 40 to drive the blocking frame 41 to move to the right, so that the blocking frame 41 no longer blocks the first through hole 1001, and the right end of the blocking frame 41 blocks the entrance on the left side of the upper part of the hollow plate 39; at this time, the second through hole 4101 is aligned with the first through hole 1001, and the blocking frame 41 can drive the blocking column 42 to move to the right, so that the blocking column 42 blocks the bottom of the fixed pipe 37, so that the processing liquid in the interior of the lifting frame 7 cannot enter the hollow plate 39 and the fixed pipe 37, ensuring that the processing liquid in the interior of the lifting frame 7 can only fall downward through the first through hole 1001 and the second through hole 4101 into the storage space between the cover plate 10 and the circuit board, ensuring that the top of the circuit board can be in full contact with the processing liquid, and improving the processing effect.

Claims

1. A circuit board automatic copper deposition processing device, comprising: a liquid storage tank (1), wherein three liquid storage tanks (1) are provided, and the three liquid storage tanks (1) are arranged in a line and contact each other; characterized in that: The device further comprises: a controller (2) mounted on the side of one of the liquid storage tanks (1); a mounting frame (4) mounted on a hook of the hanging conveyor (3); a liquid discharge frame (5) symmetrically connected to the mounting frame (4); a liquid discharge square pipe (6) connected to the bottom of the liquid discharge frame (5) and kept in communication; a lifting frame (7) placed on the top of the liquid discharge frame (5); a butt joint pipe (8) connected to the side of the lifting frame (7) and kept in communication; a supporting plate (9) connected to the inside of the liquid discharge frame (5), and a liquid discharge hole (901) is opened on the supporting plate (9), and the liquid discharge hole ( 901) is located just above the drainage square tube (6); the cover plate (10) is connected to the inside of the lifting frame (7), and the cover plate (10) is evenly spaced with first through holes (1001); the protrusions (11) are symmetrically connected to the top of the support plate (9) and the bottom of the cover plate (10); the lifting assembly is arranged on the mounting frame (4) and is used to drive the lifting frame (7) to move up and down; the injection assembly is arranged on the liquid storage tank (1) and is used to inject the treatment liquid into the lifting frame (7); the blocking assembly is arranged on the support plate (9) and is used to block the drainage hole (901).

2. The automatic copper plating processing device for a circuit board according to claim 1, characterized in that: The lifting assembly comprises: a first electric push rod (12) symmetrically mounted on the mounting frame (4), wherein the telescopic rod of the first electric push rod (12) is connected to the upper lifting frame (7); and a connecting plate (13) connected between the upper and lower lifting frames (7).

3. The automatic copper plating processing device for a circuit board according to claim 2, characterized in that: The liquid injection assembly includes: a connecting seat (14) connected to the side of the liquid storage tank (1); a liquid extraction pump (15) installed on the connecting seat (14), and the liquid inlet of the liquid extraction pump (15) is connected to the liquid storage tank (1) and maintained in communication; a connecting pipe (16) connected to the liquid outlet of the liquid extraction pump (15) and maintained in communication; a linear motor (17) installed on the top of the liquid storage tank (1); a vertical frame (18) connected to the mover of the linear motor (17), and the liquid outlet end of the vertical frame (18) is located inside the liquid storage tank (1); a liquid injection pipe (19) connected to the vertical frame (18), and the end of the connecting pipe (16) away from the liquid extraction pump (15) is connected to the liquid injection pipe (19) and maintained in communication; a docking mechanism is provided on the vertical frame (18) for docking the liquid injection pipe (19) and the docking pipe (8).

4. The automatic copper plating processing device for a circuit board according to claim 3, characterized in that: The docking mechanism comprises: a second electric push rod (20), which is installed on the top of the vertical frame (18); a mounting plate (21), which is connected to the telescopic rod of the second electric push rod (20), and a first circular hole (2101) is symmetrically opened on the mounting plate (21), and the end of the docking pipe (8) is located in the first circular hole (2101); a square hole (2102) is also opened on the mounting plate (21), and the liquid inlet end of the vertical frame (18) is located in the square hole (2102); a receiver (22), which is installed on the mounting plate (21); and a transmitter (23), which is installed on the liquid discharge square pipe (6).

5. The automatic copper plating processing device for a circuit board according to claim 4, characterized in that: The blocking assembly includes: a guide rod (24) connected to the bottom of the supporting plate (9); a baffle (25) slidably connected to the guide rod (24), and the baffle (25) blocks the bottom of the drainage hole (901), and a second circular hole (2501) is opened on the baffle (25); a connecting spring (26) wound around the outside of the guide rod (24), and the two ends of the connecting spring (26) are respectively connected to the guide rod (24) and the baffle (25).

6. The automatic copper plating processing device for a circuit board according to claim 3, characterized in that: The liquid storage tank (1) further comprises: a fixed cylinder (27) connected to the inner bottom of the liquid storage tank (1); a liquid outlet pipe (28) having two ends respectively connected to the fixed cylinder (27) and the liquid inlet of the liquid pump (15) and maintained in communication; an arcuate filter plate (29) symmetrically connected to the inner wall of the fixed cylinder (27); a liquid inlet pipe (30) connected to one of the arcuate filter plates (29) and maintained in communication, and an end of the liquid inlet pipe (30) passes through the outer wall of the fixed cylinder (27); and a cleaning mechanism provided on the fixed cylinder (27) for cleaning the arcuate filter plate (29).

7. The automatic copper deposition processing device for a circuit board according to claim 6, characterized in that: The cleaning mechanism includes: a sliding frame (31), which is placed on the fixed cylinder (27), and the sliding frame (31) is located between the two arc-shaped filter plates (29); a handle (32), which is connected to the sliding frame (31); a driving motor (33), which is installed on the top of the sliding frame (31); a screw rod (34), which is connected to the output shaft of the driving motor (33), and the screw rod (34) is in contact with the arc-shaped filter plates (29); a vertical pipe (35), which is connected to the bottom of the sliding frame (31) and maintains communication; and a filter frame (36), which is threadedly connected to the bottom of the vertical pipe (35) and maintains communication.

8. The automatic copper plating processing device for a circuit board according to claim 1, characterized in that: The apparatus further comprises: a fixed tube (37) connected to the top of the lifting frame (7) and maintained in communication; a liquid level sensor (38) mounted on the fixed tube (37); a hollow plate (39) having two ends respectively connected to the liquid discharge frame (5) and the lifting frame (7) and maintained in communication; a third electric push rod (40) symmetrically mounted on the lifting frame (7); a baffle frame (41) slidably connected to the interior of the lifting frame (7), and a telescopic rod of the third electric push rod (40) is connected to the baffle frame (41), and second through holes (4101) are evenly spaced on the baffle frame (41); and a baffle column (42) connected to the top of the baffle frame (41).

9. The method for using the automatic copper plating device for a circuit board according to claim 5, characterized in that: The method comprises the following steps: firstly, the treatment liquids required for the three processes of micro-etching, activation and copper deposition are placed in three liquid storage tanks (1) respectively; then, the controller (2) controls the first electric push rod (12) to drive the lifting frame (7) to move upward; then, the cleaned circuit board is placed on the top of the protrusion (11) on the support plate (9); then, the controller (2) controls the first electric push rod (12) to drive the lifting frame (7) to move downward and reset, so that the protrusions (11) on the upper and lower sides clamp the circuit board; and then, the circuit board is placed on the support plate (9) through the hanging conveyor. (3) The installation frame (4) is slowly transported. When the receiver (22) and the transmitter (23) are aligned longitudinally, it means that the installation frame (4) has moved to the top of the liquid storage tank (1). At this time, the receiver (22) sends a signal. After receiving the signal, the controller (2) controls the linear motor (17) to drive the vertical frame (18) to move to the right. The moving speed of the vertical frame (18) is consistent with the moving speed of the installation frame (4). Then the controller (2) controls the second electric push rod (20) to drive the installation plate (21) to move to the right. The rear end of the butt joint pipe (8) is positioned in the first circular hole (2101) and the rear end of the liquid discharge square pipe (6) is positioned in the square hole (2102) to complete the docking between the butt joint pipe (8) and the liquid injection pipe (19) and between the liquid discharge square pipe (6) and the vertical frame (18). Then the controller (2) controls the liquid extraction pump (15) to extract the treatment liquid in the liquid storage tank (1) and transport the treatment liquid to the lifting frame (7) through the connecting pipe (16), the liquid injection pipe (19) and the butt joint pipe (8). The treatment liquid in the lifting frame (7) will be The liquid flows downward through the first through hole (1001) to the top of the circuit board. At this time, the pressure above the circuit board will gradually increase. Under the action of the pressure, the treatment liquid will be forced to flow downward through the holes on the circuit board, so that the treatment liquid flows to the bottom of the circuit board. The treatment liquid below the circuit board will slowly flow downward through the second circular hole (2501) to the drainage frame (5). The treatment liquid in the drainage frame (5) can be discharged back to the leftmost liquid storage tank (1) through the drainage square tube (6) and the vertical frame (18), forming a circulation treatment system.

Images