Radiator

Abstract

The invention provides a radiator, which comprises a radiating substrate, a first cooling liquid inlet and outlet and a second cooling liquid inlet and outlet, and is characterized in that the radiating substrate comprises a first radiating surface and a second radiating surface which are oppositely arranged, and the first radiating surface is used for arranging a plurality of heat source units; the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are formed corresponding to the two sides of the second heat dissipation face, and the second heat dissipation face is used for making contact with cooling liquid to conduct heat exchange on a heat source; a plurality of heat dissipation areas corresponding to the plurality of heat source units are arranged on the second heat dissipation surface between the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet; the heat dissipation areas comprise the first heat dissipation area located on the first cooling liquid inlet and outlet side, the second heat dissipation area located on the second cooling liquid inlet and outlet side and at least one middle heat dissipation area located between the first heat dissipation area and the second heat dissipation area, and the first heat dissipation area, the middle heat dissipation area and the second heat dissipation area are each provided with a plurality of heat dissipation columns. The density of the heat dissipation columns in the middle heat dissipation area is smaller than the density of the heat dissipation columns in the first heat dissipation area and the second heat dissipation area.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic component heat dissipation, in particular to a heat sink. BACKGROUND

[0002] The traditional heat sink in the form of heat dissipation column is simple and rugged in design, usually the lower surface of the heat dissipation substrate is evenly arranged with heat dissipation columns, the heat dissipation column structure is regular, and it is easy to design and process. However, this usually arranges too many heat dissipation columns outside the effective heat dissipation area of the heat source, thereby causing a large pressure drop of heat dissipation.

[0003] Therefore, how to reduce the pressure drop of the heat sink has become a technical problem to be solved in the field. SUMMARY

[0004] To solve the above technical problems, the present application provides a heat sink, which comprises a heat dissipation substrate, a first cooling liquid inlet and outlet and a second cooling liquid inlet and outlet, the heat dissipation substrate comprises a first heat dissipation surface and a second heat dissipation surface arranged oppositely, a plurality of heat source units are arranged on the first heat dissipation surface, the heat source unit comprises at least one heat source, the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are arranged corresponding to the two sides of the second heat dissipation surface, the second heat dissipation surface is used for contacting the cooling liquid to exchange heat with the heat source, a plurality of heat dissipation zones are arranged on the second heat dissipation surface corresponding to a plurality of heat source units between the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet, the plurality of heat dissipation zones comprise a first heat dissipation zone located on the side of the first cooling liquid inlet and outlet, a second heat dissipation zone located on the side of the second cooling liquid inlet and outlet and at least one intermediate heat dissipation zone located between the first heat dissipation zone and the second heat dissipation zone, a plurality of heat dissipation columns are arranged on the first heat dissipation zone, the intermediate heat dissipation zone and the second heat dissipation zone, and the heat dissipation column density of the intermediate heat dissipation zone is less than that of the first heat dissipation zone and the second heat dissipation zone.

[0005] Optionally, in the direction perpendicular to the flow direction of the cooling liquid, the heat dissipation column density of the edge region of the same heat dissipation zone is greater than that of the central region.

[0006] Optionally, in the direction perpendicular to the flow direction of the cooling liquid, the heat dissipation requirement of at least one side edge region of the same heat dissipation zone is low, and a retaining wall is arranged on the side edge region.

[0007] Optionally, the retaining wall is an integral continuous structure or a discontinuous split structure.

[0008] Optionally, there is a gap between the adjacent two heat dissipation zones.

[0009] Optionally, the adjacent two heat dissipation zones are adjacent.

[0010] Optionally, the heat dissipation columns on the second heat dissipation surface are symmetrically arranged about the central axis of the heat dissipation substrate perpendicular to the flow direction of the cooling liquid.

[0011] Optionally, the density of the heat dissipation columns is adjusted by at least one of the following: changing the arrangement of the heat dissipation columns, changing the cross-sectional shape of the heat dissipation columns, and changing the spacing between two adjacent heat dissipation columns.

[0012] Optionally, the arrangement of the heat dissipation columns includes in-line arrangement and staggered arrangement, the cross-sectional shape of the heat dissipation columns includes circular shape, elliptical shape and rhombic shape, and the spacing between two adjacent heat dissipation columns is between 0.3 times and 3 times the diameter of the heat dissipation columns.

[0013] Optionally, the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are arranged on the two sides of the heat dissipation substrate, or the heat sink further comprises a flow channel base, the flow channel base is located on the side where the second heat dissipation surface of the heat dissipation substrate is located, the heat dissipation substrate and the flow channel base are sealingly connected to form a cooling liquid flow channel, and the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are arranged on the two sides of the flow channel base.

[0014] Compared with the prior art, the technical scheme of the embodiment of the present application has the following beneficial effects:

[0015] 1. Without distinguishing the cooling liquid inlet and outlet, the present application reduces the density of the heat dissipation columns in the middle heat dissipation area to fully utilize the temperature rise margin of the middle heat dissipation area to optimize the overall pressure drop of the heat sink and the consistency of the heat source temperature.

[0016] 2. In the direction perpendicular to the flow direction of the cooling liquid, the density of the heat dissipation columns in the edge region of the same heat dissipation area is greater than that in the central region by densifying the heat dissipation columns in the edge region, so as to force the cooling liquid to flow to the central high-temperature region, thereby improving the heat dissipation capacity.

[0017] 3. In the direction perpendicular to the flow direction of the cooling liquid, the edge region with low heat dissipation requirement is shielded by using a barrier wall structure, so as to increase the flow rate of the cooling liquid in the central region and strengthen heat exchange.

[0018] 4. The barrier wall is a discontinuous split structure, i.e. the barrier wall comprises a plurality of barrier wall splits, and the plurality of barrier wall splits are arranged at intervals. The present application can also enhance the disturbance of the surrounding cooling liquid by the local protrusions (barrier wall splits) and recesses (gaps between two adjacent barrier wall splits) of the barrier wall, thereby further strengthening heat dissipation.

[0019] Of course, it is not necessary for any product implementing the present application to achieve all the advantages described above at the same time. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 A schematic structural diagram of a radiator provided in one embodiment of the present invention;

[0022] Figure 2 A schematic structural diagram of a heat dissipation area provided in one embodiment of the present invention;

[0023] Figure 3 A schematic structural diagram of a radiator provided in Example 1 of the present invention;

[0024] Figure 4 A schematic structural diagram of a radiator provided in Example 2 of the present invention;

[0025] Figure 5 A schematic structural diagram of a retaining wall provided in Example 2 of the present invention;

[0026] Figure 6 A schematic structural diagram of a radiator provided in Example 3 of the present invention;

[0027] Figure 7 A schematic diagram of the structure of a heat dissipation column cross row provided in Example 3 of the present invention;

[0028] Figure 8 A schematic structural diagram of heat dissipation columns arranged in sequence according to embodiment 3 of the present invention;

[0029] Figure 9 This is a schematic structural diagram of the radiator provided in Example 4 of the present invention. DETAILED DESCRIPTION

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] The terms "first", "second", "third", "fourth" and the like in the description and in the claims of the present application, and above mentioned drawings, if any, are used to distinguish between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the use of the terms so construed can be interchanged, under appropriate circumstances, to describe the embodiments of the present application described herein in other than the given sequential or chronological order. Furthermore, the terms "comprise" and "include", and any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, product or device that comprises a list of steps or units not necessarily limited to those listed explicitly, but can include other not expressly listed steps or units inherent therein. The terms "on" and "over" and any variation thereof are intended to describe a positional relationship and do not necessarily represent a direct contact relationship between the described objects.

[0032] Referring to Figure 1 and Figure 2 , an embodiment of the present application provides a heat sink, comprising a heat dissipation substrate 1, a first cooling liquid inlet and outlet and a second cooling liquid inlet and outlet, the heat dissipation substrate 1 comprises a first heat dissipation surface and a second heat dissipation surface arranged oppositely, the first heat dissipation surface is used to arrange a plurality of heat source units, the heat source unit comprises at least one heat source; the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are arranged corresponding to the two sides of the second heat dissipation surface, the second heat dissipation surface is used to contact with the cooling liquid to exchange heat with the heat source; between the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet, a plurality of heat dissipation zones are arranged on the second heat dissipation surface corresponding to a plurality of heat source units, the plurality of heat dissipation zones comprise a first heat dissipation zone 101 located on the side of the first cooling liquid inlet and outlet, a second heat dissipation zone 103 located on the side of the second cooling liquid inlet and outlet and at least one intermediate heat dissipation zone 102 located between the first heat dissipation zone 101 and the second heat dissipation zone 103, a plurality of heat dissipation columns 2 are arranged on the first heat dissipation zone 101, the intermediate heat dissipation zone 102 and the second heat dissipation zone 103, respectively, the density of the heat dissipation columns 2 of the intermediate heat dissipation zone 102 is less than the density of the heat dissipation columns 2 of the first heat dissipation zone 101 and the second heat dissipation zone 103, respectively.

[0033] The heat sink provided by the embodiment does not need to distinguish the inlet and outlet, that is, the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet can be used as the cooling liquid inlet and outlet, if the first cooling liquid inlet and outlet are used as the cooling liquid inlet, then the second cooling liquid inlet and outlet are used as the cooling liquid outlet, the flow direction of the cooling liquid is from the first cooling liquid inlet and outlet to the second cooling liquid inlet and outlet; if the second cooling liquid inlet and outlet are used as the cooling liquid inlet, then the first cooling liquid inlet and outlet are used as the cooling liquid outlet, the flow direction of the cooling liquid is from the second cooling liquid inlet and outlet to the first cooling liquid inlet and outlet.

[0034] The specific arrangement of the first cooling liquid inlet and the second cooling liquid inlet is not limited in the embodiment, and as an embodiment, the first cooling liquid inlet and the second cooling liquid inlet are arranged on two sides of the heat dissipation substrate 1.

[0035] As another embodiment, the heat sink further comprises a flow channel base, the flow channel base is arranged on the side where the second heat dissipation surface of the heat dissipation substrate 1 is located, the heat dissipation substrate 1 and the flow channel base are sealingly connected to form a cooling liquid flow channel, and the first cooling liquid inlet and the second cooling liquid inlet are arranged on two sides of the flow channel base.

[0036] In the series flow channel heat sink, the hottest region is in the most downstream region, and there is a temperature margin in the upstream region. In order to ensure that the heat sink does not need to distinguish the inlet and outlet characteristics, the density of the heat dissipation column 2 in the middle heat dissipation region 102 is adjusted in the embodiment to fully utilize the temperature rise margin of the middle heat dissipation region 102 to reduce the overall pressure drop of the heat sink.

[0037] In the flow problem of the outer-sweeping tube bundle, the convective heat transfer coefficient is positively correlated with the flow rate of the fluid, so the reduction of the flow rate will lead to the reduction of the convective heat transfer coefficient. Under the condition that the heat dissipation amount of the middle heat dissipation region 102 is constant, the reduction of the convective heat transfer coefficient will lead to the increase of the wall surface temperature of the heat sink at the middle heat dissipation region 102, and further lead to the increase of the heat source temperature at the middle heat dissipation region 102.

[0038] In the design of the heat sink, the main concern is whether the highest temperature of the heat source exceeds the predetermined threshold. Before the improvement, the temperature of the middle heat dissipation region 102 is lower than that of the downstream heat dissipation region, and the temperature difference between the middle heat dissipation region 102 and the downstream heat dissipation region is the temperature rise margin of the middle heat dissipation region 102. By reducing the density of the heat dissipation column 2 in the middle heat dissipation region 102, the flow channel cross-sectional area of the middle heat dissipation region 102 is increased, the flow rate is reduced, and the temperature of the middle heat dissipation region 102 is increased, which is closer to the highest temperature of the downstream region, but the highest temperature of the entire heat sink remains unchanged.

[0039] In the flow problem of the outer-sweeping tube bundle, the friction loss (i.e. pressure drop) is positively correlated with the flow rate of the fluid. The reduction of the flow rate will cause the reduction of the friction loss in the heat dissipation region. In the embodiment, the flow channel cross-sectional area of the middle heat dissipation region 102 is increased to reduce the flow rate of the middle heat dissipation region 102, so that the pressure drop of the middle heat dissipation region 102 is reduced, and the overall pressure drop of the heat sink is reduced, and the consistency of the heat source temperature is optimized.

[0040] In the embodiment, the heat dissipation column 2 on the second heat dissipation surface is symmetrically arranged about the central axis of the heat dissipation substrate 1 perpendicular to the cooling liquid flow direction.

[0041] The heat source is arranged on the first heat dissipation surface of the heat dissipation substrate 1 through at least one heat conduction layer. The number of the heat conduction layers is not limited in the embodiment, which can be one, for example, the heat source is fixed on the heat dissipation substrate 1 through a welding layer, and the welding layer is the heat conduction layer. The heat conduction layer can be formed by different materials, which can be copper, aluminum, metal alloy, ceramic, various solders and the like.

[0042] The material of the heat dissipation substrate 1 and the heat dissipation column 2 is not limited in the embodiment, which can be metal or metal alloy such as copper and aluminum.

[0043] The cross-sectional shape of the heat dissipation column 2 is not limited in the embodiment, which can be oval, circular, hexagonal, octagonal, square, rhombic and the like. The heat dissipation column 2 can be formed integrally with the heat dissipation substrate 1 through forging, welding and the like.

[0044] For the case that a plurality of groups of heat sources are distributed along the flow direction of the cooling liquid, at least one group of heat sources corresponds to one heat dissipation area, and each group of heat sources includes at least one heat source arranged perpendicularly to the flow direction of the cooling liquid. Whether the plurality of heat sources arranged perpendicularly to the flow direction of the cooling liquid in each group of heat sources are on the same straight line is not limited in the embodiment, which can be approximately on the same straight line with some deviation.

[0045] The heat dissipation device provided in the embodiment includes a plurality of heat source units distributed along the flow direction of the cooling liquid, and each heat source unit includes at least one heat source. If the heat source unit includes a plurality of heat sources, the plurality of heat sources are arranged in at least one column perpendicularly to the flow direction of the cooling liquid. Each heat source unit can correspond to one heat dissipation area, or two or more heat sources can correspond to one heat dissipation area. The design with less partition is simpler in processing, but the control of the temperature consistency of the heat sources is poorer, and the number of the heat dissipation columns 2 is increased, thereby increasing the pressure drop. Therefore, it is preferred that each heat source unit corresponds to one heat dissipation area.

[0046] As an embodiment, in the direction perpendicular to the flow direction of the cooling liquid, the density of the heat dissipation columns 2 of the two side edge areas 10101 of the same heat dissipation area is greater than that of the central area 10102, so that more cooling liquid flows through the central area, thereby strengthening the local heat dissipation of the highest temperature rise area close to the central area.

[0047] As an embodiment, in the direction perpendicular to the flow direction of the cooling liquid, if the heat dissipation requirement of at least one side edge area of the same heat dissipation area is low, the heat dissipation column 2 is not arranged on the side edge area, but a retaining wall 3 is arranged, so that more cooling liquid flows to the area with high heat dissipation requirement.

[0048] The specific structure of the retaining wall 3 is not limited in the embodiment, and as an implementation manner, the retaining wall 3 is an integrated continuous structure.

[0049] As another implementation manner, the retaining wall 3 is a discontinuous split structure, that is, the retaining wall 3 comprises a plurality of retaining wall splits, and the plurality of retaining wall splits are arranged at intervals. In the embodiment, the disturbance of the surrounding cooling liquid can also be enhanced by the local protrusions (retaining wall splits) and recesses (gaps between adjacent two retaining wall splits) of the retaining wall 3, and the heat dissipation is further strengthened.

[0050] In the embodiment, the density of the heat dissipation columns 2 can be adjusted by at least one of changing the arrangement mode of the heat dissipation columns 2, the cross-sectional shape of the heat dissipation columns 2, and the interval between adjacent two heat dissipation columns 2.

[0051] The arrangement mode of the heat dissipation columns 2 can be in-line arrangement, staggered arrangement, etc., the cross-sectional shape of the heat dissipation columns 2 can be circular, elliptical, rhombic, etc., and the interval between adjacent two heat dissipation columns 2 is between 0.3 times and 3 times the diameter of the heat dissipation column 2.

[0052] The number of the heat dissipation areas on the heat dissipation substrate 1 is not less than three, and the specific number can be set according to the actual distribution of the heat source, and the embodiment does not make specific limitation.

[0053] Taking the heat dissipation substrate 1 provided with three heat dissipation areas as an example, the distribution of the heat dissipation columns 2 on the heat dissipation substrate 1 is described in detail.

[0054] Embodiment 1

[0055] Please refer to Figure 3 In the embodiment, the heat dissipation substrate 1 is provided with a first heat dissipation area 101, an intermediate heat dissipation area 102, and a second heat dissipation area 103, and the heat dissipation columns 2 on the heat dissipation substrate 1 are continuously distributed in the flow direction of the cooling liquid, that is, adjacent two heat dissipation areas are adjacent, and there is no clear boundary between adjacent two heat dissipation areas, which is convenient for processing.

[0056] In the embodiment, the cross-sectional shape and the arrangement mode of the heat dissipation columns 2 on the three heat dissipation areas are the same, and only the interval of the heat dissipation columns 2 is adjusted to adjust the density of the heat dissipation columns 2 of the heat dissipation area.

[0057] In the embodiment, the first heat dissipation area 101 and the second heat dissipation area 103 are symmetric about the central axis of the intermediate heat dissipation area 102, and the intermediate heat dissipation area 102 is also symmetric about the central axis, that is, the heat dissipation columns 2 on the heat dissipation substrate 1 are symmetric about the central axis.

[0058] The heat dissipation pillars 2 on the heat dissipation substrate 1 are continuously and gradually changed, as an embodiment, the distance between the heat dissipation pillars 2 from the first cooling liquid inlet to the middle axis and from the second cooling liquid inlet to the middle axis is uniformly changed from 0.9mm to 1.1mm along the flow direction of the cooling liquid.

[0059] Embodiment 2

[0060] Please refer to Figure 4 In this embodiment, the heat dissipation substrate 1 is provided with a first heat dissipation area 101, a middle heat dissipation area 102 and a second heat dissipation area 103, and there is a clear boundary between the adjacent two heat dissipation areas, i.e. there is a gap between the two heat dissipation areas.

[0061] As an embodiment, the first heat dissipation surface of the heat dissipation substrate 1 between the adjacent two heat dissipation areas is not arranged with heat sources, so that the heat dissipation pillars 2 are not arranged between the adjacent two heat dissipation areas, and the purpose is to reduce the pressure drop.

[0062] As another embodiment, even if the first heat dissipation surface of the heat dissipation substrate 1 between the adjacent two heat dissipation areas is arranged with heat sources, if the shape and / or arrangement of the heat dissipation pillars 2 in the two heat dissipation areas are different, there must be a boundary between the two heat dissipation areas.

[0063] This embodiment does not limit the arrangement of the heat dissipation pillars 2, the cross-sectional shape of the heat dissipation pillars 2 and the distance between the adjacent two heat dissipation pillars 2 in each heat dissipation area, which can be set according to the actual heat dissipation requirements.

[0064] As an embodiment, the distance between the heat dissipation pillars 2 in the first heat dissipation area 101 and the second heat dissipation area 103 is 0.7mm, and the distance between the heat dissipation pillars 2 in the middle heat dissipation area 102 is 0.9mm-1.1mm.

[0065] As another embodiment, in the direction perpendicular to the flow direction of the cooling liquid, the distance between the heat dissipation pillars 2 in the edge area of the middle heat dissipation area 102 is 0.9mm, and the distance between the heat dissipation pillars 2 in the central area is 1.1mm, i.e. the density of the heat dissipation pillars 2 in the edge area is greater than that in the central area.

[0066] Please refer to Figure 5 As a third embodiment, in a heat dissipation area, if the heat source is arranged below, the temperature rise of the heat dissipation pillars 2 in the upper edge area is very low, so the edge area is replaced by the baffle 3 instead of the heat dissipation pillars 2. The baffle is a continuous and integral structure.

[0067] Embodiment 3

[0068] Please refer to Figure 6 to Figure 8In this embodiment, the heat dissipation substrate 1 is provided with a first heat dissipation area 101, an intermediate heat dissipation area 102 and a second heat dissipation area 103. There is a clear boundary between two adjacent heat dissipation areas, i.e. there is a gap between the two heat dissipation areas.

[0069] The pitch and cross-sectional shape of the heat dissipation columns 2 of the three heat dissipation areas are the same, and the flow and heat dissipation are affected only by changing the arrangement of the heat dissipation columns 2.

[0070] The pitch of the heat dissipation columns 2 of the three heat dissipation areas is 0.9 mm, and the cross-sectional shape is elliptical. The heat dissipation columns 2 of the intermediate heat dissipation area 102 are arranged in a straight arrangement, and the heat dissipation columns 2 of the first heat dissipation area 101 and the second heat dissipation area 103 are arranged in a cross arrangement. Therefore, the heat dissipation performance of the intermediate heat dissipation area 102 is slightly reduced, and the flow pressure drop of this part is optimized.

[0071] In this embodiment, the heat dissipation columns 2 of the same heat dissipation area are uniformly arranged, and there is no difference in the density of the heat dissipation columns 2.

[0072] In this embodiment, since the heat sources are concentrated in the central region of the heat dissipation area, the heat dissipation columns 2 at the upper and lower edge regions of the heat dissipation area have little heat dissipation effect, and therefore the heat dissipation columns 2 at the upper and lower edge regions are replaced by the barrier wall 3 structure. The barrier wall 3 is a discontinuous split structure, i.e. the barrier wall 3 comprises a plurality of barrier wall splits, and the plurality of barrier wall splits are arranged at intervals. The partial protrusions (barrier wall splits) and recesses (gaps between two adjacent barrier wall splits) of the barrier wall 3 in this embodiment can also enhance the disturbance of the surrounding cooling liquid, further strengthening the heat dissipation.

[0073] Embodiment 4

[0074] Please refer to Figure 9 In this embodiment, the heat dissipation substrate 1 is provided with a first heat dissipation area 101, an intermediate heat dissipation area 102 and a second heat dissipation area 103. The heat dissipation columns 2 of the first heat dissipation area 101 and the second heat dissipation area 103 are elliptical in cross-section, have a pitch of 0.9 mm, and are arranged in a cross arrangement. The heat dissipation columns 2 of the intermediate heat dissipation area 102 are circular in cross-section, have a pitch of 1.0 mm, and are arranged in a straight arrangement. Therefore, even if the heat dissipation columns 2 of the three heat dissipation areas are continuously distributed, the shape and arrangement of the heat dissipation columns 2 in two adjacent heat dissipation areas are different, and there is a clear boundary between the two heat dissipation areas.

[0075] In this embodiment, the heat dissipation capacity of the intermediate heat dissipation area 102 will be lower than that of the first heat dissipation area 101 and the second heat dissipation area 103, but the flow resistance will also be reduced.

[0076] The heat dissipation columns 2 of each heat dissipation area are uniformly arranged, and there is no barrier wall structure.

[0077] The above-mentioned pitch refers to the pitch of two adjacent heat dissipation columns 2 in the flow direction of the cooling liquid.

[0078] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some or all of the technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A radiator, characterized in that: The heat dissipation device comprises a heat dissipation substrate, a first cooling liquid inlet and a second cooling liquid inlet, the heat dissipation substrate comprising a first cooling surface and a second cooling surface arranged opposite to each other, the first cooling surface being used to arrange a plurality of heat source units, the heat source units comprising at least one heat source; the first cooling liquid inlet and the second cooling liquid inlet are arranged corresponding to the two sides of the second cooling liquid inlet, the second cooling surface being used to contact with the cooling liquid to exchange heat with the heat source; between the first cooling liquid inlet and the second cooling liquid inlet, a plurality of cooling areas are arranged on the second cooling surface corresponding to the plurality of heat source units, the plurality of cooling areas comprising a first cooling area located on the first cooling liquid inlet and outlet side, a second cooling area located on the second cooling liquid inlet and outlet side, and at least one intermediate cooling area between the first cooling area and the second cooling area, the first cooling area, the intermediate cooling area and the second cooling area are each provided with a plurality of cooling columns, the cooling column density of the intermediate cooling area being less than the cooling column density of the first cooling area and the second cooling area.

2. The radiator according to claim 1, characterized in that In a direction perpendicular to the flow direction of the coolant, the density of the heat dissipation columns in the edge regions on both sides of the same heat dissipation zone is greater than the density of the heat dissipation columns in the central region.

3. The radiator according to claim 1, wherein: In a direction perpendicular to the flow direction of the coolant, at least one side edge region of the same heat dissipation zone has a low heat dissipation requirement, and a retaining wall is provided on the side edge region.

4. The radiator according to claim 3, characterized in that The retaining wall is an integrated continuous structure or a discontinuous split structure.

5. The radiator according to claim 1, wherein There is a gap between two adjacent heat dissipation areas.

6. The radiator according to claim 1, characterized in that Two adjacent heat dissipation areas are adjacent to each other.

7. The radiator according to claim 1, characterized in that The heat dissipation columns on the second heat dissipation surface are symmetrically arranged about a central axis of the heat dissipation substrate that is perpendicular to the flow direction of the coolant.

8. The radiator according to any one of claims 1 to 7, characterized in that: The density of the heat dissipation columns is adjusted by changing at least one of the arrangement of the heat dissipation columns, the cross-sectional shape of the heat dissipation columns, and the distance between two adjacent heat dissipation columns.

9. The radiator according to claim 8, characterized in that The arrangement of the heat dissipation columns includes sequential arrangement and staggered arrangement. The cross-sectional shapes of the heat dissipation columns include circular, elliptical and diamond-shaped. The distance between two adjacent heat dissipation columns is between 0.3 times and 3 times the diameter of the heat dissipation columns.

10. The heat sink according to claim 1, wherein The first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are opened on both sides of the heat dissipation substrate; alternatively, the radiator further includes a flow channel base, the flow channel base is located on the side of the second heat dissipation surface of the heat dissipation substrate, the heat dissipation substrate and the flow channel base are sealed and connected to form a cooling liquid flow channel, and the first cooling liquid inlet and outlet and the second cooling liquid inlet and outlet are opened on both sides of the flow channel base.

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