Electronic equipment

Abstract

The application discloses an electronic device, comprising: a heating component having a first position; the heat conduction component exchanges heat with the heating component and is provided with a second position; the heat dissipation channel is used for guiding heat dissipation fluid to flow; the switching assembly is used for controlling the heat dissipation channel to be switched between a first form and a second form; wherein in the first form, the heat dissipation channel guides the heat dissipation fluid to flow to the first position and / or the second position, and the flow of the heat dissipation fluid reaching the first position is a first flow; and in the second form, the heat dissipation channel guides the heat dissipation fluid to flow to the first position and / or the second position, the flow of the heat dissipation fluid reaching the first position is second flow, and the second flow is larger than the first flow.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to an electronic device. BACKGROUND

[0002] Electronic devices have heat dissipation structures. At present, the heat dissipation structures in electronic devices are difficult to adapt to multiple application scenarios and performance requirements. SUMMARY

[0003] Therefore, the present application provides an electronic device.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical solutions.

[0005] An electronic device comprises:

[0006] A heat generating component, which has a first position;

[0007] A heat conducting component, which is in heat exchange with the heat generating component and has a second position;

[0008] A heat dissipation channel, which is used to guide the flow of heat dissipation fluid;

[0009] A switching assembly, which is used to control the switching of the heat dissipation channel between a first mode and a second mode;

[0010] Wherein,

[0011] In the first mode, the heat dissipation channel guides the flow of heat dissipation fluid to the first position and / or the second position, and the flow rate of the heat dissipation fluid reaching the first position is a first flow rate;

[0012] In the second mode, the heat dissipation channel guides the flow of heat dissipation fluid to the first position and / or the second position, and the flow rate of the heat dissipation fluid reaching the first position is a second flow rate, which is greater than the first flow rate.

[0013] Optionally, in the above-mentioned electronic device, in the first mode and the second mode, the total flow rate of the heat dissipation fluid guided by the heat dissipation channel satisfies the same condition.

[0014] Optionally, in the above-mentioned electronic device, the heat generating component generates different amounts of heat in different operating modes of the electronic device.

[0015] Wherein, the switching assembly controls the switching of the heat dissipation channel between different modes according to the operating mode of the electronic device.

[0016] Optionally, in the electronic device, the electronic device has a functional component, and the functional component has different heat exchange efficiencies with the first position and the second position.

[0017] The switching assembly controls the heat dissipation channel to switch between different forms according to the use state of the functional component.

[0018] Optionally, in the electronic device, the switching assembly includes an operating component located at least partially outside the shell of the electronic device, and the operating component can be controlled by the outside of the electronic device to switch between different states, so that the heat dissipation channel switches between different forms.

[0019] Optionally, in the electronic device, the heat dissipation channel includes a channel body and an adjusting piece, the channel body has a first opening facing the second position, and the adjusting piece and the channel body can form an adjusting opening facing the first position, and the operating component controls the adjusting piece to move relative to the channel body.

[0020] The switching assembly controls the heat dissipation channel to switch between different forms according to the use state of the functional component.

[0021] When the operating component is in the first state, the operating component controls the adjusting piece and the channel body to be in a first relative position, so that the heat dissipation channel is in the first form, and the opening area of the adjusting opening is a first area.

[0022] When the operating component is in the second state, the operating component controls the adjusting piece and the channel body to be in a second relative position, so that the heat dissipation channel is in the second form, and the opening area of the adjusting opening is a second area, and the second area is greater than the first area.

[0023] Optionally, in the electronic device, the switching assembly includes a linkage assembly, and the linkage assembly connects the operating component and the adjusting piece.

[0024] The switching assembly controls the heat dissipation channel to switch between different forms according to the use state of the functional component.

[0025] The operating component has a first stroke between the first state and the second state, the linkage assembly and the connecting part of the adjusting piece have a second stroke, and the second stroke is greater than the first stroke.

[0026] Optionally, in the electronic device, the operating component is in sliding fit with the shell of the electronic device.

[0027] The linkage assembly includes:

[0028] A first link part has a first end and a second end opposite to each other, and the first end is hinged to the operating component.

[0029] a second link part hingedly connected with the second end, the second link part being hingedly connected with a third end of the adjusting member, a fourth end of the adjusting member opposite to the third end being hingedly connected with the passage body;

[0030] Wherein, the operation part drives the first link part to rotate along the first end and drives the second link part to move through the second end in the process of sliding relative to the shell, so that the adjusting member rotates relative to the passage body to adjust the opening area of the adjusting opening.

[0031] Optionally, in the electronic device, the electronic device has a first body, and the first body is a plate structure.

[0032] In the thickness direction of the first body, the operation part and the heat generating part satisfy alignment adjustment.

[0033] Optionally, in the electronic device, the electronic device includes a heat dissipation module arranged in the shell of the electronic device, and the heat dissipation module includes the heat dissipation passage and a driving device for driving the driving force of the heat dissipation fluid.

[0034] The number of the heat dissipation modules is multiple, and the switching assembly is used for synchronously controlling the shape switching of the heat dissipation passages of the multiple heat dissipation modules. BRIEF DESCRIPTION OF DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0036] Figure 1 The structure schematic diagram of the heat generating part and the heat conducting part provided by the embodiment of the present application;

[0037] Figure 2 The structure schematic diagram of the first form of the electronic device provided by the embodiment of the present application;

[0038] Figure 3 The structure schematic diagram of the intermediate form between the first form and the second form of the electronic device provided by the embodiment of the present application;

[0039] Figure 4 The structure schematic diagram of the second form of the electronic device provided by the embodiment of the present application;

[0040] Figure 5A first structural schematic view of the heat dissipation channel and the switching assembly provided by the embodiment of the present application is shown in FIG. 1.

[0041] Figure 6 A second structural schematic view of the heat dissipation channel and the switching assembly provided by the embodiment of the present application is shown in FIG. 2.

[0042] wherein,

[0043] heating component 100, first position 101, heat-conducting component 200, second position 201, heat dissipation channel 300, channel body 310, adjusting member 320, adjusting opening 330, switching assembly 400, third connecting rod part 410, second connecting rod part 420, first connecting rod part 430, operating component 440, housing 500, fan 600. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0045] The applicant has found that the heat dissipation requirements of electronic devices are different in different application scenarios. The heating component in the electronic device can be a chip or other component capable of generating heat during the operation of the electronic device. The heat generated by the heating component is different in different operation modes of the electronic device. The heat dissipation structure not only needs to meet the heat dissipation requirement of the heating component, but also needs to meet the heat dissipation requirement of different positions of the heating component, so as to adjust the heat dissipation direction requirement of the heat generated by the heating component in the electronic device. For example, in the case that the user needs to frequently operate the contact functional assembly (such as a keyboard or a touch screen) of the electronic device, in order to avoid the temperature of the contact functional assembly being too high, the heat transferred from the heating component (such as a chip) to the contact functional assembly needs to be reduced.

[0046] The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these embodiments should be interpreted as merely exemplary, and not as a limitation.

[0047] It should be noted that in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; The orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like is only for the purpose of facilitating the description of the present disclosure and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0048] In addition, "first", "second", and similar words used in the present disclosure do not indicate any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0049] It should also be noted that in the description of the present disclosure, unless otherwise specified and limited, the terms "mounting", "connecting", "connecting" should be understood in a broad sense, for example, it can be fixedly connected, It can also be detachably connected, or integrally connected; It can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0050] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or extremely formalized sense, unless otherwise defined explicitly herein.

[0051] Techniques, methods and equipment known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the techniques, methods and equipment should be considered as part of the specification.

[0052] As Figures 1-4 The embodiment of the present application provides an electronic device, which comprises:

[0053] The heat-generating component 100 can have a first position 101. The heat-generating component 100 can generate heat during the operation of the electronic device, such as a wafer, a hard disk, a memory, etc. The first position 101 can be one side of the heat-generating component 100, one surface of the heat-generating component 100, or a certain point on the surface, etc.

[0054] The heat-conducting component 200 can exchange heat with the heat-generating component 100. The heat-conducting component 200 can have a second position 201. The heat-conducting component 200 can exchange heat with the heat-generating component 100. The position where the heat-conducting component 200 exchanges heat with the heat-generating component 100 can be a position other than the first position 101 of the heat-generating component 100, or the first position 101 of the heat-generating component 100. The second position 201 can be a side of the heat-conducting component 200 away from the heat-generating component 100, or a side of the heat-conducting component 200 close to the heat-generating component 100, etc.

[0055] The heat-dissipating channel 300 can be used to guide the flow of heat-dissipating fluid. The heat-dissipating channel 300 can be a guide component for guiding the flow of heat-dissipating fluid. The heat-dissipating channel 300 can be a relatively closed channel to guide the flow of heat-dissipating fluid under the constraint of the channel wall. The heat-dissipating channel 300 can also be a semi-open channel, and the entity structure constituting the heat-dissipating channel 300 can block and guide the flow of heat-dissipating fluid. The heat-dissipating fluid can be a gas or a liquid, depending on the type of heat-dissipating module of the electronic device. For example, the heat-dissipating fluid can be a gas in a fan-cooled heat-dissipating module, and the heat-dissipating channel 300 can include the side wall structure of the fan 600 in the fan-cooled heat-dissipating module. The electronic device can also have a liquid-cooled heat-dissipating module, and the heat-dissipating fluid can be a liquid.

[0056] The switching assembly 400 can be used to control the switching of the heat-dissipating channel 300 between the first mode and the second mode. The switching assembly 400 controls the change of the mode of the heat-dissipating channel 300, so that the heat-dissipating channel 300 can have different guiding effects on the heat-dissipating fluid.

[0057] In the first mode, the heat-dissipating channel 300 can guide the flow of heat-dissipating fluid to the first position 101 and / or the second position 201. The flow rate of the heat-dissipating fluid reaching the first position 101 can be a first flow rate.

[0058] The first flow rate can be 0, that is, the heat-dissipating channel 300 can guide all the heat-dissipating fluid it can guide to the second position 201. The first flow rate can also be a small value, such as 1 cm 3 / s or 5 cm 3 / s, etc.

[0059] The heat dissipation passage 300 can also guide the heat dissipation fluid to flow to the first position 101 and the second position 201, and the heat dissipation fluid guided by the heat dissipation passage 300 to flow to the second position 201 is less than or equal to the total flow of the heat dissipation fluid that can be guided by the heat dissipation passage 300 minus the first flow. The heat dissipation passage 300 can also guide all the heat dissipation fluid that can be guided by the heat dissipation passage 300 to flow to the second position 201.

[0060] In the second mode, the heat dissipation passage 300 can guide the heat dissipation fluid to flow to the first position 101 and / or the second position 201, and the flow of the heat dissipation fluid to the first position 101 can be a second flow. The second flow can be greater than the first flow. Since the second flow is greater than the first flow, the second flow can be greater than 0. The first flow can be 1 cm 3 / s, and the second flow can be 50 cm 3 / s. The first flow can also be 3 cm 3 / s, and the second flow can be 100 cm 3 / s. The first flow can also be 0, and the second flow can be 30 cm 3 / s or 60 cm 3 / s, etc., which are not limited in detail herein and are within the scope of protection.

[0061] The heat dissipation passage 300 can also guide all the heat dissipation fluid that can be guided by the heat dissipation passage 300 to flow to the second position 201, and the heat dissipation fluid to the first position 101 can be the heat dissipation fluid that flows to the first position 101 after passing through the second position 201, or can be part of the heat dissipation fluid lost during the guidance of the heat dissipation passage 300. The heat dissipation passage 300 can also guide all the heat dissipation fluid that can be guided by the heat dissipation passage 300 to flow to the first position 101. The heat dissipation passage 300 can also guide the heat dissipation fluid to flow to the first position 101 and the second position 201, and the heat dissipation fluid guided by the heat dissipation passage 300 to flow to the second position 201 is less than or equal to the total flow of the heat dissipation fluid that can be guided by the heat dissipation passage 300 minus the second flow.

[0062] In some embodiments, in the first mode, the heat dissipation passage 300 can guide the heat dissipation fluid to flow to the second position 201, and the flow of the heat dissipation fluid to the first position 101 can be a first flow. In the second mode, the heat dissipation passage 300 guides the heat dissipation fluid to flow to the first position 101 and the second position 201, and the flow of the heat dissipation fluid to the first position 101 can be a second flow. That is, in the first mode, the heat dissipation passage 300 can guide all the heat dissipation fluid that can be guided by the heat dissipation passage 300 to flow to the second position 201; in the second mode, the heat dissipation passage 300 divides all the heat dissipation fluid that can be guided by the heat dissipation passage 300, a part of which flows to the second position 201, and another part of which flows to the first position 101.

[0063] The total flow of the heat dissipation fluid that the heat dissipation channel 300 can guide can be the same or different in different morphologies.

[0064] In some embodiments, the total flow of the heat dissipation fluid that the heat dissipation channel 300 guides can satisfy the same condition in the first morphology and the second morphology. That is, the total flow of all the heat dissipation fluid that the heat dissipation channel 300 can guide does not change with the change of the morphology of the heat dissipation channel 300. Wherein, the total flow satisfying the same condition includes being exactly the same and being substantially the same, and the substantially the same has an error caused by the change of the morphology of the heat dissipation channel 300, such as the size of the gap formed by the heat dissipation channel 300 for the heat dissipation fluid to expose is different in different morphologies, so that the flow of the heat dissipation fluid overflowing from the gap under the guidance of the heat dissipation channel 300 is not the same.

[0065] Wherein, the motion state of the driving component that drives the heat dissipation fluid to flow under the guidance of the heat dissipation channel 300 can be unchanged. Taking the electronic device with an air-cooled heat dissipation module as an example, the rotation speed (power) of the fan 600 in the air-cooled heat dissipation module does not change in the process of switching the heat dissipation channel 300 between the first morphology and the second morphology, so that the total flow of the heat dissipation fluid guided by the heat dissipation channel 300 satisfies the same condition.

[0066] The total flow of the heat dissipation fluid guided by the heat dissipation channel 300 in the first morphology and the second morphology can also not satisfy the same condition. The change of the morphology of the heat dissipation channel 300 can affect the total flow of the heat dissipation fluid that the heat dissipation channel 300 can guide, that is, in the process of driving all the heat dissipation fluid to flow by the driving component, due to the change of the morphology of the heat dissipation channel 300, the flow of the heat dissipation fluid guided by the heat dissipation channel 300 is different (such as all the heat dissipation fluid or 90% of all the heat dissipation fluid, etc.). The motion state of the driving component can also change with the change of the morphology of the heat dissipation channel 300, so that the total flow of the heat dissipation fluid guided by the heat dissipation channel 300 changes.

[0067] The heat generated by the heat generating component 100 can be different when the electronic device is in different running modes. Therefore, the heat dissipation demand of the heat generating component 100 is also different. Wherein, the switching assembly 400 can control the heat dissipation channel 300 to switch between different morphologies according to the running mode of the electronic device; or can actively control according to the user's demand, control the heat dissipation channel 300 to switch between different morphologies.

[0068] In some embodiments, taking the heat conducting component 200 as a heat pipe fin and the heat generating component 100 as a wafer as an example, the heat conducting component 200 can be a heat pipe fin, and the second location 201 can be the heat dissipation surface of the heat pipe fin. The heat generating component 100 can be a wafer, and the first location 101 can be a side surface of the wafer. Although the heat conducting component 200 indirectly dissipates heat from the heat generating component 100, because the heat dissipation area of ​​the second location 201 is much larger than that of the first location 101, the heat exchange efficiency of the heat dissipating fluid passing through the second location 201 is greater than that passing through the first location 101 for the same flow rate. Therefore, when the heat generated by the heat generating component 100 is high, the heat dissipating channel 300 can be switched to the first mode. Under the same conditions, by reducing the flow rate of the heat dissipating fluid directed by the heat dissipating channel 300 to the first location 101 (e.g., the first flow rate, which can be 0 or the second flow rate, etc.), the heat dissipating fluid directed by the heat dissipating channel 300 to the second location 201 is increased.

[0069] Among them, the heat dissipation channel 300 is in the first form and can correspond to the electronic device being in a non-inner blowing mode, that is, the heat dissipation channel 300 can guide all the heat dissipation fluid it can guide to flow to the second position 201, so as to improve the heat dissipation effect of the heat-generating component 100 through the high heat exchange efficiency of the second position 201, so that the core temperature of the heat-generating component 100 (chip) has strict requirements in high-performance computing scenarios, thereby improving its stability and performance.

[0070] The heat dissipation channel 300 is in the second form and can correspond to the electronic device being in the internal blowing mode, that is, the heat dissipation channel 300 can at least partially guide the heat dissipation fluid to flow to the first position 101. Although the heat dissipation fluid flowing to the second position 201 is reduced, the temperature of the first position 101 (such as the surface of the chip or the surface of the hard disk, etc.) can be increased. On the basis of reducing the amount of heat dissipated to the functional components, it also avoids the situation where the (local) temperature of the first position 101 is too high and affects the service life of the heat-generating component 100 (chip).

[0071] In other embodiments, since the heat dissipation fluid reaching the first position 101 of the heat-generating component 100 can have a direct heat dissipation effect on the heat-generating component 100, and the heat dissipation fluid reaching the second position 201 of the heat-conducting component 200 can have an indirect heat dissipation effect on the heat-generating component 100, therefore, when the contact areas of the first position 101 and the second position 201 for heat exchange with the heat dissipation fluid are the same or have a small difference, when the heat generated by the heat-generating component 100 is high, the heat dissipation channel 300 can be switched to the second form, and the flow rate of the heat dissipation fluid flowing to the first position 101 can be increased, so as to improve the heat dissipation effect on the heat-generating component 100.

[0072] The electronic device can have functional components, the heat exchange efficiency of which with the first position 101 and the second position 201 can be different. The functional components can be components whose temperature is more sensitive to the user, such as input devices for inputting information, for example, a keyboard, a touchpad, or a touch screen, and the like.

[0073] The switching assembly 400 can control the heat dissipation channel 300 to switch between different forms according to the use state of the functional components. The use state of the functional components can include non-use, normal use, and high-frequency use, and the like. Taking the electronic device as a notebook computer and the functional components as the keyboard area of the notebook computer itself as an example, in the state that the user is in the office mode and needs to input information through the keyboard area, the heat transferred to the functional components by the heat generating component 100 can be reduced by controlling the form of the heat dissipation channel 300 (such as guiding the heat dissipation fluid to the first position 101 or increasing the heat dissipation fluid reaching the first position 101, and the like), so as to avoid the user's contact with the keyboard area with too high temperature affecting the use comfort. In the state that the user is in the game mode and needs to use an external keyboard, the user does not need to frequently contact the keyboard area of the notebook computer itself and needs higher running power, which makes the heat of the heat generating component 100 higher, and the heat dissipation effect of the heat generating component 100 can be improved by controlling the form of the heat dissipation channel 300 (such as increasing the flow or flow rate of the heat dissipation fluid reaching the second position 201, and the like).

[0074] Taking the efficiency of the heat exchange between the functional components and the first position 101 being higher than that between the functional components and the second position 201 as an example, the first position 101 can be made closer to the functional components than the second position 201, so that the heat exchange efficiency between the first position 101 and the functional components is greater than that between the second position 201 and the functional components. For example, the heat generating component 100 is a wafer, which has a first surface and a second surface opposite to each other, the first position 101 is located on the first surface and faces the functional components (such as a keyboard, a touchpad, or a touch screen, and the like), and the second surface is in heat exchange connection with the heat conducting component 200. When the temperature of the first position 101 is higher, the temperature of the functional components will be higher, and in the case of using the functional components or the frequency of using the functional components being higher, the temperature of the functional components will be more sensitive to the user, which will affect the use comfort. Therefore, the heat dissipation channel 300 can be switched to the second form, and the flow of the heat dissipation fluid flowing to the first position 101 can be increased, so as to reduce the heat exchange efficiency between the heat generating component 100 and the functional components.

[0075] Of course, the efficiency of the heat exchange between the functional components and the second position 201 can also be made higher than that between the functional components and the first position 101. In order to avoid the temperature of the functional components being too high, the heat dissipation channel 300 can be switched to the first form, and the flow of the heat dissipation fluid flowing to the second position 201 can be increased, so as to reduce the heat exchange efficiency between the heat generating component 100 and the functional components.

[0076] The switching component 400 may be an electrically controlled component, that is, it controls the heat dissipation channel 300 to switch between different states by receiving a control signal generated by the electronic device according to the usage status of the functional components.

[0077] The switching component 400 can also be a manual control component. Figure 5 and Figure 6 As shown, in order to facilitate manual control, the switching component 400 includes an operating component 440 that is at least partially located outside the housing 500 of the electronic device. The operating component 440 can be controlled from the outside of the electronic device to switch between different states, so that the heat dissipation channel 300 can switch between different forms.

[0078] like Figure 2 、 Figure 3 and Figure 4 As shown, in some embodiments, the heat dissipation channel 300 may include a channel body 310 and an adjustment member 320. The channel body 310 may have a first opening facing the second position 201. An adjustment opening 330 facing the first position 101 may be formed between the adjustment member 320 and the channel body 310. The operating component 440 may control the movement of the adjustment member 320 relative to the channel body 310. It is understood that the structure of the first opening may remain unchanged. By controlling the movement of the adjustment member 320 relative to the channel body 310 through the operating component 440, the opening and closing and the opening degree of the adjustment opening 330 are adjusted, thereby achieving flow adjustment of the heat dissipation fluid guided through the heat dissipation channel 300 and reaching the first position 101.

[0079] in,

[0080] When the operating component 440 is in the first state, the operating component 440 can control the adjustment member 320 and the channel body 310 to be in the first relative position, so that the heat dissipation channel 300 can be in the first state, and the opening area of ​​the adjustment opening 330 is the first area; wherein the opening area can be the cross-sectional area of ​​the adjustment opening 330 for the heat dissipation fluid to flow through. wherein the first area can be 0, such as Figure 2 As shown, the channel body 310 is connected to the adjustment member 320, and the adjustment opening 330 cannot be formed. Figure 3 As shown, a smaller adjustment opening 330 may also be formed between the channel body 310 and the adjustment member 320 . In this state, the opening area of ​​the adjustment opening 330 is the first area.

[0081] When the operating component 440 is in the second state, the operating component 440 can control the adjustment member 320 and the channel body 310 to be in the second relative position, so that the heat dissipation channel 300 can be in the second state, and the opening area of ​​the adjustment opening 330 is the second area, which is larger than the first area.Figure 3 As shown, the adjusting member 320 can be connected to the channel body 310, and the adjusting opening 330 can be formed between the channel body 310 and the adjusting member 320. In the second state, the adjusting opening 330 can have a second area. In the second state, more heat dissipation fluid can be guided to the first position 101 due to the second area being larger than the first area.

[0082] The switching assembly 400 can include a linkage assembly, which can be connected to the operating component 440 and the adjusting member 320. The operating component 440 can have a first stroke in switching between the first state and the second state, and the linkage assembly can have a second stroke at the connection part of the adjusting member 320. The second stroke can be greater than the first stroke. That is, the linkage assembly can be used as a transmission component between the operating component 440 and the adjusting member 320, and can amplify the stroke to facilitate manual operation. The amplification ratio of the first stroke and the second stroke can be 5-10 times. For example, the first stroke of the operating component 440 relative to the shell 500 is 0-10 mm, and the second stroke of the connection part of the adjusting member 320 is 0-200 mm through the linkage assembly. The first stroke and the second stroke can have a certain ratio, that is, the operating component 440 moves 2 mm relative to the shell 500, and the connection part of the adjusting member 320 moves 10-20 mm relative to the initial position (for example, the channel body 310 and the adjusting member 320 are connected and do not have the adjusting opening 330 or have the adjusting opening 330 with the minimum opening area). The operating component 440 moves 5 mm relative to the shell 500, and the connection part of the adjusting member 320 moves 25-50 mm relative to the initial position (for example, the channel body 310 and the adjusting member 320 are connected and do not have the adjusting opening 330 or have the adjusting opening 330 with the minimum opening area). The amplification ratio of the first stroke and the second stroke can also be other values, which are not limited here.

[0083] As shown in FIG. 4A and FIG. 4B, the operating component 440 can be connected to the linkage assembly, and the linkage assembly can be connected to the adjusting member 320. Figure 5 As shown in FIG. 4A and FIG. 4B, the operating component 440 can be connected to the linkage assembly, and the linkage assembly can be connected to the adjusting member 320. Figure 6 As shown in FIG. 4A and FIG. 4B, the operating component 440 can be connected to the linkage assembly, and the linkage assembly can be connected to the adjusting member 320.

[0084] The linkage assembly can include a first linkage part 430 and a second linkage part 420. The first linkage part 430 can have a first end and a second end opposite to each other. The first end can be hinged to the operating component 440. The second linkage part 420 can be hinged to the second end and the third end of the adjusting member 320. The fourth end of the adjusting member 320 opposite to the third end can be hinged to the channel body 310. That is, the linkage assembly can be a linkage group, and the movement stroke of the operating component 440 can be amplified through at least two linkage parts (the first linkage part 430 and the second linkage part 420).

[0085] In the process of sliding relative to the shell 500, the operation component 440 drives the first link part 430 to rotate along the first end and drives the second link part 420 to move through the second end, so that the adjusting part 320 rotates relative to the channel body 310 to adjust the opening area of the adjusting opening 330. That is, the stroke is amplified by the relative rotation of at least the link part.

[0086] The shell 500 can have a sliding groove structure, and the operation component 440 is slidingly arranged in the sliding groove.

[0087] The stroke can also be amplified by other structures, such as a gear transmission set or a gear and rack structure.

[0088] The electronic device can have a first body, the heat generating component can be located in the first body, and the arrangement direction of the operation component and the heat generating component can satisfy perpendicular adjustment with the thickness direction of the first body.

[0089] In order to improve stability, the first link part 430 can be hinged to the shell 500, and the hinge position of the first link part 430 and the shell 500 has a certain distance from the first end thereof. The linkage assembly can also include a third link part 410 hinged between the second link part 420 and the adjusting part 320. The axis direction of the hinge can be the thickness direction of the electronic device, that is, in the process of switching the switching assembly 400 to switch the heat dissipation channel 300 between different forms, the adjacent two link parts rotate relative to the rotation plane, and the rotation plane and the thickness direction of the electronic device satisfy perpendicular adjustment, that is, the heat dissipation channel 300 does not occupy the thickness space of the electronic device when switching between different forms, which facilitates the thin design of the electronic device. Therefore, it is suitable for the embodiment that the electronic device is a tablet computer or a notebook computer.

[0090] The electronic device can have a first body, and the first body can be a plate structure. Taking the electronic device as a tablet computer as an example, the first body can be the body of the tablet computer. Taking the electronic device as a notebook computer as an example, the first body can be the body of the notebook computer with a keyboard. Along the thickness direction of the first body, the operation component 440 and the heat generating component 100 can satisfy alignment adjustment. That is, the projection of the operation component 440 and the heat generating component 100 in the direction perpendicular to the thickness direction of the first body can at least partially overlap. The operation component 440 can be located on the side wall of the shell (shell 500) of the first body, and the heat generating component 100 can be located in the shell of the first body.

[0091] In some embodiments, the operation component 440 can have different gears when the operation component 440 is in the second state; the operation component 440 in different gears can have different opening areas of the opening 330. In which, the gear marks can be arranged on the outer surface of the shell 500 of the electronic device as the basis for gear switching of the operation component 440, so that the user can control the operation component 440 according to the gear marks. It can be understood that the above-mentioned hinged axis direction can be the thickness direction of the electronic device (first body).

[0092] The electronic device can include a heat dissipation module arranged in the shell 500 of the electronic device, and the heat dissipation module can include a heat dissipation channel 300 and a driving device for driving the flow of the heat dissipation fluid. Taking the air-cooled heat dissipation module as an example, the driving device can be a fan 600, and the heat dissipation channel 300 can be a side wall structure of the fan 600. The rotation of the fan 600 drives the flow of the gas in the heat dissipation channel 300, and the switching assembly 400 also changes the form of the side wall structure of the fan 600.

[0093] The number of heat dissipation modules can be one, and the number of heat dissipation channels 300 can be one or more. In the embodiment that the heat dissipation module has a plurality of heat dissipation channels 300, the plurality of heat dissipation channels 300 can guide the heat dissipation fluid driven by the rotation of the same fan 600 (driving device) to perform heat dissipation operation on different heat generating components 100. Of course, the heat dissipation fluid guided by the plurality of heat dissipation channels 300 can also perform heat dissipation operation on different positions of the same heat generating component 100.

[0094] The number of heat dissipation modules can also be multiple, and the plurality of heat dissipation modules can respectively perform heat dissipation operation on different heat generating components 100 in the electronic device, or the plurality of heat dissipation modules can perform heat dissipation operation on the same heat generating component 100.

[0095] The switching assembly 400 can be used to synchronously control the form switching of the heat dissipation channels 300 of the plurality of heat dissipation modules. That is, the form of the heat dissipation channels 300 of the plurality of heat modules can be switched by the switching assembly 400, so that only one switching assembly 400 needs to be arranged in the electronic device, reducing the number of parts and simplifying the structure. A plurality of switching assemblies 400 can also be arranged, and at least two switching assemblies 400 control the form switching of the heat dissipation channels 300 of different heat dissipation modules.

[0096] In some embodiments, the number of heat dissipation modules can be two, and used for heat dissipation operation on the same heat generating component 100. The two heat dissipation modules can be symmetrically arranged relative to the heat generating component 100, so that the heat dissipation channels 300 of the two heat dissipation modules can be switched in form to adjust the flow of the heat dissipation fluid to the first position 101 of the heat generating component 100 and the second position 201 of the heat conducting component 200 in thermal exchange with the heat generating component 100.

[0097] The number of switching assemblies 400 can be one, and the heat dissipation channels 300 of the two heat dissipation modules are synchronously controlled to switch in form.

[0098] The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0099] The above description of the disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to the embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device comprising: a heat generating component having a first position; a heat-conducting component, the heat-conducting component exchanging heat with the heat-generating component and having a second position; a heat dissipation channel, the heat dissipation channel being used to guide the flow of heat dissipation fluid; a switching component, the switching component being used to control the heat dissipation channel to switch between a first state and a second state; in, In the first state, the heat dissipation channel guides the heat dissipation fluid to flow toward the first position and / or the second position, and the flow rate of the heat dissipation fluid reaching the first position is a first flow rate; In the second form, the heat dissipation channel guides the heat dissipation fluid to flow toward the first position and / or the second position, and the flow rate of the heat dissipation fluid reaching the first position is a second flow rate, which is greater than the first flow rate. 2 . The electronic device according to claim 1 , wherein in the first state and the second state, the total flow rate of the heat dissipation fluid guided by the heat dissipation channel satisfies the same condition.

3. The electronic device according to claim 1, wherein the heat generated by the heat generating component is different when the electronic device is in different operating modes; in, The switching component controls the heat dissipation channel to switch between different forms according to the operation mode of the electronic device.

4. The electronic device according to claim 1, comprising a functional component, wherein the functional component has different heat exchange efficiencies with the first position and the second position; in, The switching component controls the heat dissipation channel to switch between different forms according to the use status of the functional component.

5. The electronic device as described in claim 1, wherein the switching component includes an operating component that is at least partially located outside the housing of the electronic device, and the operating component can be controlled from the outside of the electronic device to switch between different states, so that the heat dissipation channel switches between different forms.

6. The electronic device according to claim 5, wherein the heat dissipation channel comprises a channel body and an adjustment member, the channel body having a first opening facing the second position, an adjustment opening facing the first position being formed between the adjustment member and the channel body, and the operating component controlling the movement of the adjustment member relative to the channel body; in, When the operating component is in the first state, the operating component controls the adjusting member and the channel body to be located at a first relative position, so that the heat dissipation channel is in the first form, and the opening area of ​​the adjusting opening is the first area; When the operating component is in the second state, the operating component controls the adjustment member and the channel body to be located at a second relative position, so that the heat dissipation channel is in the second form, and the opening area of ​​the adjustment opening is a second area, which is larger than the first area.

7. The electronic device according to claim 6, wherein the switching assembly comprises a linkage assembly, wherein the linkage assembly connects the operating component and the adjusting member; in, The movement stroke of the operating component when switching between the first state and the second state is a first stroke, and the movement stroke of the connection portion between the linkage assembly and the adjustment member is a second stroke, which is greater than the first stroke.

8. The electronic device according to claim 7, wherein the operating component is slidably engaged with a housing of the electronic device; The linkage component includes: a first connecting rod portion, the first connecting rod portion having a first end and a second end opposite to each other, the first end being hinged to the operating component; a second connecting rod portion, the second connecting rod portion being hinged to the second end, the second connecting rod portion being hinged to the third end of the adjusting member, and a fourth end of the adjusting member opposite to the third end being hinged to the channel body; In which, when the operating component slides relative to the shell, it drives the first connecting rod part to rotate along the first end and drives the second connecting rod part to move through the second end, so that the adjusting member rotates relative to the channel body to adjust the opening area of ​​the adjusting opening.

9. The electronic device according to claim 5, comprising a first body, wherein the first body is a plate-shaped structure; Along the thickness direction of the first body, the operating component and the heat-generating component meet alignment adjustment.

10. The electronic device according to claim 1, comprising a heat dissipation module disposed in a housing of the electronic device, the heat dissipation module comprising the heat dissipation channel and a driving device for driving the heat dissipation fluid to flow; There are multiple heat dissipation modules, and the switching component is used to synchronously control the switching of the heat dissipation channels of the multiple heat dissipation modules.

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