Processing method

Abstract

The invention relates to a processing method applied to a processing device and used for processing a circuit board, the processing device comprises a clamping assembly, a processing assembly and an abutting assembly, the clamping assembly can generate relative sliding in a first direction and a second direction, and the clamping assembly and the circuit board move synchronously. The first direction and the second direction are both perpendicular to the thickness direction of the circuit board, and one of the first direction and the second direction is the gravity direction. The machining method comprises the following steps that the circuit board is fixed to the clamping assembly in a vertically-placed mode; the clamping assembly is controlled to drive the circuit board to move to enable any machining area of the circuit board to be aligned with the machining range of the machining assembly, and the abutting assembly abuts against the circuit board in the thickness direction of the circuit board to define part of the edge of the machining area; controlling the processing assembly to process the processing area of the circuit board; and the clamping assembly slides in the first direction and / or the second direction, so that the processing assembly processes the circuit board in the post-processing area. Therefore, the processing efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, in particular to a processing method. BACKGROUND

[0002] The processing method is used for processing a circuit board. In the processing process, the circuit board is first clamped and fixed by a processing platform, and then the circuit board is processed. However, for the traditional processing method, the circuit board is usually carried on the processing platform in a horizontal placement manner for processing, which will affect the working efficiency of the circuit board processing. SUMMARY

[0003] One of the technical problems solved by the present application is how to improve the working efficiency of the circuit board processing.

[0004] A processing method is applied to a processing device and used for processing a circuit board. The processing device comprises a clamping assembly, a processing assembly and an abutting assembly. The clamping assembly can generate relative sliding in a first direction and a second direction. The clamping assembly and the circuit board move synchronously. The first direction and the second direction are both perpendicular to the thickness direction of the circuit board, and one of them is the direction of gravity. The processing method comprises the following steps:

[0005] The circuit board is fixed on the clamping assembly in a vertical placement manner;

[0006] The clamping assembly is controlled to drive the circuit board to move so that any processing area of the circuit board is aligned with the processing range of the processing assembly, and the abutting assembly abuts against the circuit board along the thickness direction of the circuit board to define part of the edge of the processing area;

[0007] The processing assembly is controlled to process the processing area of the circuit board; and

[0008] After the processing assembly finishes processing the previous processing area of the circuit board, the clamping assembly is controlled to slide along the first direction and / or the second direction, so that the processing assembly processes the subsequent processing area of the circuit board.

[0009] In one of the embodiments, in the step of processing the processing area of the circuit board by the processing assembly, the processing assembly is controlled to process two surfaces in the thickness direction of the circuit board simultaneously or successively.

[0010] In one of the embodiments, two surfaces of the circuit board in the thickness direction need to be processed with different structures, and in the step of processing the two surfaces of the circuit board in the thickness direction by the processing assembly simultaneously or sequentially, the processing assembly is controlled to process the two surfaces of the circuit board in the thickness direction by different processing parameters respectively, so as to process different structures on the two surfaces of the circuit board in the thickness direction.

[0011] In one of the embodiments, the processing parameters include at least one of processing speed, processing power and processing path.

[0012] In one of the embodiments, in the step of processing the processing area of the circuit board by the processing assembly,

[0013] The processing assembly is a laser processing assembly which processes the circuit board by a laser beam; or

[0014] The processing assembly is a mechanical processing assembly which processes the circuit board by a tool.

[0015] In one of the embodiments, in the step of processing the circuit board by the processing assembly in the laser processing mode, the processing assembly is controlled to slide along the thickness direction of the circuit board to adjust the focal length of the laser beam.

[0016] In one of the embodiments, in the step of processing the circuit board by the processing assembly in the laser processing mode, the processing device further comprises a light splitting assembly, and the same laser beam is controlled to generate multiple branch lasers which are transmitted to different processing assemblies by the light splitting assembly.

[0017] In one of the embodiments, in the step of processing the processing area of the circuit board by the processing assembly, the processing device further comprises a suction mechanism, the suction mechanism comprises a suction port and a suction pipe, the suction port is located between the processing assembly and the circuit board in the thickness direction of the circuit board, the lumen of the suction pipe extends along the gravity direction and communicates with the suction port, and the suction mechanism is controlled to provide suction force along the gravity direction to suck away the dust in the processing area.

[0018] In one of the embodiments, when the processing of the circuit board is completed, the clamping assembly is controlled to move to a discharging position along the gravity direction, and the clamping assembly drives the circuit board to move to separate from the clamping assembly.

[0019] In one of the embodiments, before the step of processing the circuit board by the processing assembly, the clamping assembly is controlled to clamp the circuit board from the feeding position and drive the circuit board to move to a designated position.

[0020] In one of the embodiments, in the step of processing the processing area of the circuit board by the processing assembly, the abutting assembly comprises two abutting units, and the two abutting units are located on opposite sides in the thickness direction of the circuit board, and the abutting members of the two abutting units are controlled to slide along the thickness direction of the circuit board to abut the circuit board.

[0021] A processing method applied to a processing system, the processing system comprising a front production line, a rear production line and a processing device for processing a circuit board; the processing method comprising the following steps:

[0022] The circuit board is vertically placed on the front production line for front processing;

[0023] The circuit board after the front processing is vertically transported to the processing device for vertical placement and processing;

[0024] The circuit board after the processing of the processing device is vertically transported to the rear production line for vertical placement and rear processing.

[0025] One technical effect of one embodiment of the present application is that, since the circuit board is vertically placed during processing, when the circuit board is transferred from the front production line to the processing device for processing by the processing method, or when the circuit board is transferred from the processing device after being processed by the processing method to the rear production line, the circuit board can always remain in a vertically placed state, without the need to change the placement of the circuit board multiple times, thereby improving the work efficiency of the circuit board processing. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A perspective structural schematic diagram of the processing device provided for one embodiment.

[0027] Figure 2 A perspective structural schematic diagram of the processing device provided for one embodiment. Figure 1

[0028] A side structural schematic diagram of the processing device provided for one embodiment. Figure 3 Figure 2 A side structural schematic diagram of the processing device provided for one embodiment.

[0029] Figure 4 Figure 3 An enlarged structural schematic diagram of position A in the processing device provided for one embodiment.

[0030] Figure 5 An enlarged structural schematic diagram of position B in the processing device provided for one embodiment. Figure 3

[0031] An enlarged structural schematic diagram of position B in the processing device provided for one embodiment. Figure 6 Figure 1 Another partial perspective structural schematic diagram of the processing device provided for one embodiment.

[0032] ​​​Figure 7 for Figure 1 Schematic diagram of the three-dimensional structure of the clamping unit in the processing device shown.

[0033] Figure 8 A process flow chart of a processing method provided in one embodiment.

[0034] Figure 9 A process flow chart of a processing method provided in another embodiment.

[0035] Reference numerals: processing device 10, circuit board 20, base 100, accommodating space 110, opening 111, clamping mechanism 200, sliding assembly 210, first sliding portion 211, second sliding portion 212, supporting assembly 220, first supporting portion 221, second supporting portion 222, adjusting hole 223, clamping assembly 230, clamping unit 231, first clamping member 2311, fixing rod 2311a, first boss 2311b, first clamping plate 23 11c, second clamping member 2312, sliding rod 2312a, second boss 2312b, second clamping plate 2312c, driving member 2313, connecting member 2314, roller 240, processing mechanism 300, processing assembly 310, laser 320, branched laser 321, spectrometer 330, suction mechanism 400, suction port 410, suction tube 420, abutment assembly 260, abutment unit 261, driver 261a, abutment member 261b. DETAILED DESCRIPTION

[0036] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0037] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0038] In addition, the terms "first", "second", and the like, if any, are used herein for descriptive purposes only and should not be construed as indicating or implying relative importance or implicating the number of indicated technical features. Thus, a feature defined with "first" or "second" can include at least one of the features explicitly or implicitly. In the description of the present application, the term "plurality" means at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0039] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0040] In the present application, unless otherwise explicitly specified and limited, if the first feature is described as "on" or "under" the second feature and the like, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or it can only mean that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or it can only mean that the first feature is lower than the second feature in horizontal height.

[0041] It should be noted that if an element is referred to as "fixed to" or "disposed to" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for illustrative purposes and do not represent the only implementation.

[0042] Referring to Figure 1 , Figure 2 and Figure 3An embodiment of the present application provides a processing device 10 for processing a plate-shaped circuit board 20. The circuit board 20 can be a circuit board, including a common multilayer board, a high multilayer board, an HDI, an FPC, a rigid-flexible combined board, an IC packaging substrate, and the like in the PCB field. The processing device 10 is not limited to processing the circuit board 20 in types, including drilling processing, slotting processing, and the like. When processing the circuit board 20, the thickness direction of the circuit board 20 is perpendicular to the gravity direction of the circuit board 20, so that the circuit board 20 is vertically placed instead of being horizontally arranged.

[0043] Referring to Figure 1 , Figure 2 and Figure 3 , the processing device 10 includes a base 100, a clamping mechanism 200, and a processing mechanism 300. The clamping mechanism 200 includes a sliding assembly 210, a supporting assembly 220, and a clamping assembly 230. The sliding assembly 210 is slidably connected with the base 100 in a first direction, so that the sliding assembly 210 can slide relative to the base 100 in the first direction. For example, the clamping mechanism 200 can further include a guide rail 250 fixedly connected with the base 100. The guide rail 250 extends in the first direction, and the sliding assembly 210 is slidably connected with the guide rail 250, so that the sliding assembly 210 is slidably connected with the base 100 in the first direction.

[0044] The supporting assembly 220 is slidably connected with the sliding assembly 210 in a second direction, so that the supporting assembly 220 can slide relative to the sliding assembly 210 in the second direction. The first direction and the second direction are both perpendicular to the thickness direction of the circuit board 20, and one of the first direction and the second direction is the gravity direction. The clamping assembly 230 is arranged on the supporting assembly 220, and is used to apply a force in the thickness direction of the circuit board 20 to clamp the circuit board 20. The clamping assembly 230 and the circuit board 20 are synchronously moved and cannot relatively move, that is, the clamping assembly 230 is only used to clamp the circuit board 20 and cannot drive the circuit board 20 to relatively move relative to the clamping assembly 230. When the sliding assembly 210 and the supporting assembly 220 slide, the clamping assembly 230 can slide relative to the base 100 in the first direction and the second direction, that is, the circuit board 20 slides relative to the base 100 in the first direction and the second direction along with the clamping assembly 230, so that the processing mechanism 300 can process each processing area of the circuit board 20.

[0045] The thickness direction of the circuit board 20 can be understood as a third direction, and the first direction, the second direction, and the third direction are extensions of three coordinate axes in a spatial orthogonal coordinate system. For example, the first direction can be an X-axis direction, the second direction can be a Z-axis direction, and the third direction can be a Y-axis direction.

[0046] During the processing of the circuit board 20, the sliding assembly 210 can slide relative to the base 100 along the first direction, the supporting assembly 220 can slide relative to the sliding assembly 210 along the second direction, and the clamping assembly 230 for clamping the circuit board 20 can move synchronously with the supporting assembly 220, so that the clamping assembly 230 and the circuit board 20 can slide along the first direction and the second direction relative to the base 100 with two degrees of freedom, which facilitates the processing of each processing area of the circuit board 20.

[0047] In the prior art, the circuit board is usually processed in a horizontal placement manner, in which the thickness direction of the circuit board is parallel to the gravity direction of the circuit board. In some manufacturing processes of the circuit board, the circuit board is vertically placed in a front production line before being processed, i.e., the thickness direction of the circuit board is perpendicular to the gravity direction of the circuit board. The front production line is used to perform front processing on the circuit board, and the front production line includes a blackening or brownening production line. After processing, the circuit board needs to be vertically placed in a rear production line for rear processing, i.e., the circuit board is vertically placed in the rear production line so that the rear production line performs rear processing on the processed circuit board. Therefore, when the circuit board is transferred from the front production line to the processing device, the circuit board needs to be changed from vertical placement to horizontal placement, and when the circuit board is transferred from the processing device to the rear production line, the circuit board needs to be changed from horizontal placement to vertical placement. Therefore, the placement manner of the circuit board needs to be changed multiple times, which reduces the working efficiency of the circuit board processing and is not conducive to the simplification and integration of the production lines for different processing procedures of the circuit board.

[0048] Referring to Figure 1 , Figure 2 and Figure 3 For the processing device 10 in the embodiment of the present disclosure, since the circuit board 20 is vertically placed in the processing device 10, when the circuit board 20 is transferred from the front production line to the processing device 10 or from the processing device 10 to the rear production line, the circuit board 20 is vertically placed without the need to change the placement manner of the circuit board 20 multiple times, thereby improving the working efficiency of the circuit board 20 processing and facilitating the simplification and integration of the processing device 10 with the front production line before processing and the rear production line after processing according to needs, reducing the space occupied by the production line, and facilitating the automatic design and control of the production line.

[0049] Referring to Figure 1In some embodiments, the base 100 is provided with a receiving space 110, in which the clamping mechanism 200 and the circuit board 20 can be accommodated. In a direction perpendicular to the third direction and the direction of gravity, both ends of the receiving space 110 are provided with openings 111, which provide a transmission channel for the transfer of the circuit board 20, thereby facilitating the movement of the circuit board 20 into or out of the base 100 and the entire processing device 10 through the openings 111. For example, the circuit board 20 can be transferred between the front-end production line and the processing device 10 through the openings 111, and the circuit board 20 can also be transferred between the back-end production line and the processing device 10 through the openings 111. It can be understood that in actual work, the receiving space 110 is in a closed state, i.e., the above-mentioned openings 111 will be closed.

[0050] Referring to Figure 2 and Figure 6 In some embodiments, the first direction can be a horizontal direction, and the second direction can be a direction of gravity. In other embodiments, the first direction can be a direction of gravity, and the second direction can be a horizontal direction. The support assembly 220 includes a first support portion 221 and a second support portion 222, which are spaced apart along the direction of gravity, and the first support portion 221 is located above the second support portion 222. The clamping assembly 230 is arranged on the first support portion 221 and the second support portion 222, so that the clamping assembly 230 clamps both ends of the circuit board 20 in the direction of gravity, respectively.

[0051] Referring to Figure 2 and Figure 6 In some embodiments, the sliding assembly 210 includes a first sliding portion 211 and a second sliding portion 212, which are spaced apart from each other and arranged along the first direction. In this way, there is a gap between the first sliding portion 211 and the second sliding portion 212, which avoids the first sliding portion 211 and the second sliding portion 212 from blocking the laser, and ensures that the laser of the processing assembly 310 can smoothly reach the circuit board 20 through the gap.

[0052] Referring to Figure 2 , Figure 6 and Figure 7In some embodiments, the clamping assembly 230 comprises a clamping unit 231, the number of clamping units 231 can be two, and the two clamping units 231 can be respectively arranged on the first support part 221 and the second support part 222, so that the two clamping units 231 clamp the two ends of the circuit board 20 in the direction of gravity, thereby realizing the clamping of the clamping assembly 230 to the circuit board 20. The clamping unit 231 comprises a first clamping piece 2311 and a second clamping piece 2312, the first clamping piece 2311 is fixedly connected with the support assembly 220, and the second clamping piece 2312 is slidingly connected with the support assembly 220 along the third direction. In this way, the distance between the first clamping piece 2311 and the second clamping piece 2312 along the third direction can be changed, so that the first clamping piece 2311 and the second clamping piece 2312 can clamp circuit boards 20 of different thicknesses, thereby improving the applicability of the processing device 10 to different circuit boards 20.

[0053] Referring to Figure 2 , Figure 6 and Figure 7 , for example, an adjusting hole 223 can be formed on the support assembly 220, the adjusting hole 223 extends along the third direction for a certain length, and the second clamping piece 2312 is slidingly connected with the adjusting hole 223, so as to realize the sliding connection relationship between the second clamping piece 2312 and the support assembly 220. For another example, the groove on the second clamping piece 2312 can be slidingly connected with the sliding rail on the support assembly 220, so as to also realize the sliding connection relationship between the second clamping piece 2312 and the support assembly 220.

[0054] Referring to Figure 2 , Figure 6 and Figure 7 , in some embodiments, the first clamping piece 2311 comprises a first clamping plate 2311c, and the second clamping piece 2312 comprises a second clamping plate 2312c, both the first clamping plate 2311c and the second clamping plate 2312c are used to clamp the circuit board 20. Since the first clamping plate 2311c and the second clamping plate 2312c are both plate-shaped structures; when the first clamping plate 2311c and the second clamping plate 2312c are used to clamp the circuit board 20, the clamping area between the first clamping plate 2311c and the second clamping plate 2312c and the circuit board 20 can be reasonably improved, thereby improving the stability and reliability of the clamping unit 231 clamping the circuit board 20.

[0055] The first clamping member 2311 further comprises fixing rods 2311a and first bosses 2311b. The fixing rods 2311a are fixedly connected with the support assembly 220, the fixing rods 2311a and the first bosses 2311b are equal in number and in a one-to-one correspondence, and the first bosses 2311b are protrudingly arranged on the fixing rods 2311a, that is, each fixing rod 2311a can be provided with one first boss 2311b. The first clamping plates 2311c are connected with all the first bosses 2311b. The second clamping member 2312 further comprises sliding rods 2312a and second bosses 2312b, the sliding rods 2312a are slidably connected with the support assembly 220, the sliding rods 2312a and the second bosses 2312b are equal in number and in a one-to-one correspondence, and the second bosses 2312b are protrudingly arranged on the sliding rods 2312a, that is, each sliding rod 2312a can be provided with one second boss 2312b. The second clamping plates 2312c are connected with all the second bosses 2312b.

[0056] In other embodiments, according to the lengths of the first clamping plates 2311c and the second clamping plates 2312c, the number of the first clamping members 2311 and the second clamping members 2312 can be adjusted, for example, when the first clamping plates 2311c and the second clamping plates 2312c are short in length, the first clamping members 2311 and the second clamping members 2312 can be multiple.

[0057] Referring to Figure 2 , Figure 6 and Figure 7 , in some embodiments, the clamping unit 231 further comprises driving members 2313 and connecting members 2314, the driving members 2313 can be air cylinders or the like. The connecting members 2314 are connected with two adjacent sliding rods 2312a, and the driving members 2313 are arranged on the support assembly 220 and connected with the connecting members 2314. Thus, the driving members 2313 drive the sliding rods 2312a to slide through the connecting members 2314, that is, the connecting members 2314 can simultaneously drive two sliding rods 2312a to slide, so that the number of the driving members 2313 can be reasonably reduced.

[0058] In some embodiments, the clamping unit 231 further comprises elastic members connected between the fixing rods 2311a and the sliding rods 2312a. Through the action of the elastic members, the first clamping plates 2311c and the second clamping plates 2312c can be provided with a buffering effect during contact with the circuit board 20, so as to avoid hard collision between the first clamping plates 2311c and the second clamping plates 2312c and the circuit board 20, thereby avoiding damage to the circuit board 20.

[0059] Referring to Figure 2 , Figure 6 andFigure 7 In some embodiments, the clamping mechanism 200 further comprises a roller 240 rotatable about an axis extending along the third direction, the roller 240 can be rotatably connected with the second support portion 222, and the roller 240 is configured to support the circuit board 20 and guide the movement of the circuit board 20 along the first direction so as to be fixed on the clamping mechanism 200. For example, the roller 240 is directly rotatably connected with the mounting base, such that the roller 240 is rotatable about the axis extending along the third direction relative to the mounting base, and the mounting base is directly fixedly connected with the second support portion 222 in a detachable manner, so that when the roller 240 rotates relative to the mounting base, the roller 240 also rotates relative to the second support portion 222, thereby achieving the rotatable connection between the roller 240 and the second support portion 222. Through the rotation of the roller 240, the circuit board 20 can be smoothly moved into or out of the processing device 10 through the opening 111 of the accommodating space 110, thereby reducing the movement resistance of the circuit board 20 during the moving-in or moving-out process, and thus improving the working efficiency of the processing of the circuit board 20. For example, the roller 240 can be actively rotated by a power source, so that the roller 240 drives the movement of the circuit board 20. For another example, the roller 240 is not driven by the power source, and in the process of the movement of the circuit board 20, the circuit board 20 passively rotates the roller 240.

[0060] In some embodiments, the number of the rollers 240 is multiple, and the multiple rollers 240 are arranged at intervals along the first direction. By arranging multiple rollers 240, the resistance of the movement of the circuit board 20 along the first direction can be further reduced, and the balance and stability of the circuit board 20 during processing can be improved, thereby avoiding or reducing the vibration problem of the circuit board 20 during processing. When the roller 240 is actively rotated, the multiple rollers 240 can be driven by a chain, a belt or a gear, so that the multiple rollers 240 are driven by the same power source to rotate synchronously.

[0061] Referring to Figure 3 , Figure 4 and Figure 5In some embodiments, the clamping mechanism 200 further comprises an abutting assembly 260, and the number of the abutting assemblies 260 can be multiple, and the multiple abutting assemblies 260 can be arranged in a horizontal direction. Each abutting assembly 260 comprises two abutting units 261, and the two abutting units 261 are located on opposite sides in the thickness direction of the circuit board 20, that is, the two abutting units 261 are arranged in the thickness direction of the circuit board 20. The abutting unit 261 comprises a driver 261a and an abutting piece 261b, the driver 261a is connected with the base 100, and the abutting piece 261b is connected with the driver 261a. The driver 261a drives the abutting piece 261b to slide in the thickness direction of the circuit board 20. The two abutting pieces 261b of the same abutting assembly 260 respectively abut the two surfaces in the thickness direction of the circuit board 20, so that the two abutting pieces 261b can clamp the circuit board 20. The abutting assembly 260 can be located between the two clamping units 231 in the direction of gravity, so that the two clamping units 231 clamp the two ends of the circuit board 20 in the thickness direction, and the abutting assembly 260 can clamp the middle part of the circuit board 20 in the thickness direction. Therefore, the arrangement of the abutting assembly 260 can further improve the stability and reliability of the clamping of the circuit board 20. Especially for the circuit board 20 with small thickness, the abutting assembly 260 can effectively prevent the circuit board 20 from vibrating during processing, thereby improving the processing efficiency and processing accuracy of the circuit board 20.

[0062] For example, the driver 261a can be a pneumatic cylinder, and the cylinder barrel of the driver 261a can be directly fixed on the suction mechanism 400 which will be mentioned later. The piston rod of the driver 261a extends in the thickness direction of the circuit board 20, and the abutting piece 261b is fixedly connected with the piston rod of the driver 261a. Therefore, the driver 261a drives the abutting piece 261b to move towards or away from the circuit board 20 in the thickness direction of the circuit board 20, so that the abutting assembly 260 can clamp the circuit board 20 with different thicknesses. It can be understood that when the circuit board 20 needs to move to process the next processing area, the abutting piece 261b can be moved away from the circuit board 20 to stop abutting the circuit board 20. At this time, the circuit board 20 can move smoothly without friction and interference with the abutting piece 261b. After the circuit board 20 moves to the specified position, the abutting piece 261b moves towards the circuit board 20 to abut the circuit board 20 again, so as to prevent the circuit board 20 from vibrating during processing of the processing area. It can be understood that the abutting piece 261b of the abutting assembly 260 abuts the circuit board 20, so that the part of the circuit board 20 in contact with the abutting piece 261b cannot be processed. Therefore, the processing area is located between the two adjacent abutting pieces 261b, so that the two adjacent abutting pieces 261b define part of the edge of the processing area.

[0063] In some embodiments, the processing mechanism 300 comprises a processing assembly 310 disposed on the base 100 and configured to process the circuit board 20, and the processing assembly 310 is located at one side of the circuit board 20 in the third direction. The number of the processing mechanism 300 comprises two, and the processing assemblies 310 of the two processing mechanisms 300 are respectively located at opposite sides in the third direction. In this way, the processing assemblies 310 of the two processing mechanisms 300 can process the two surfaces of the circuit board 20 in the third direction at the same time, thereby improving the working efficiency of processing the circuit board 20. In other embodiments, after one of the processing assemblies 310 finishes processing one surface of the circuit board 20 in the thickness direction, the other processing assembly 310 can process the other surface of the circuit board 20 in the thickness direction. That is, although the two surfaces of the circuit board 20 in the thickness direction are not processed at the same time, the clamping mechanism 200 does not need to flip or re-clamp the circuit board 20 to make the unprocessed surface of the circuit board 20 face the processing assembly 310, thereby also improving the processing efficiency. It can be understood that the structures to be processed on the two surfaces of the circuit board 20 can be different, so that the two processing assemblies 310 can process the two surfaces of the circuit board 20 by using different processing parameters such as processing speed, processing power and processing path.

[0064] In some embodiments, the processing mechanism 300 can be a laser processing mechanism, or can also be a mechanical processing mechanism. Obviously, the laser processing mechanism processes the circuit board 20 by a laser beam, and the mechanical processing mechanism processes the circuit board 20 by a tool. Therefore, according to actual needs, the processing mechanism 300 can adopt a laser processing mechanism or a mechanical processing mechanism, or other processing methods can be used to process the circuit board 20.

[0065] Referring to Figure 1In some embodiments, the processing assembly 310 is slidingly connected with the base 100 along a third direction. For example, the processing assembly 310 can be fixed on a sliding plate which is slidingly connected with the base 100 along the third direction. The sliding plate can be driven by a power source such as a linear motor or a motor lead screw, so that the processing assembly 310 slides relative to the base 100 along the third direction to move towards or away from the circuit board 20. When the processing mechanism 300 is a laser processing mechanism, the focal length of the laser beam of the processing assembly 310 can be adjusted so that the laser beam processes the circuit board 20 in different ways such as focusing processing or defocusing processing. It can be understood that when the focusing processing is adopted, the focal point is located at the processing position of the circuit board 20, so as to improve the energy of the laser beam at the processing position to improve the processing efficiency and the processing precision. For example, the focusing processing can be adopted to process a high-precision micro-blind-hole structure on the circuit board 20. When the defocusing processing is adopted, the focal point is located outside the processing position of the circuit board 20, which can avoid damage or deformation of the circuit board 20 due to local overheating at the processing position, and is also beneficial to appropriately increase the size of the processing spot. For example, the defocusing processing can be adopted to process a large-size structure on the circuit board 20. When the processing mechanism 300 can be a mechanical processing mechanism, the relative displacement speed and the pressing force between the tool and the circuit board 20 can be reasonably adjusted to ensure that the tool processes the circuit board 20 at a reasonable processing speed and feeding pressure, thereby improving the processing efficiency while ensuring the processing precision.

[0066] In some embodiments, when the processing mechanism 300 is a laser processing mechanism, the processing assembly 310 includes a deflection member and a focusing member. The deflection member is used to control the deflection direction of the laser beam, and the focusing member is used to focus the laser beam to adjust the focal spot size and the focal position of the laser beam acting on the circuit board 20. By arranging the deflection member, the laser beam emitted by the processing assembly 310 can scan the processing area of the circuit board 20 within the deflection range to realize processing. The deflection member can include a mechanical control type galvanometer or a rotating mirror, or can include an electrically controlled type acousto optical deflector (AOD) or acousto-optic modulator (AOM).

[0067] Referring to Figure 1 and Figure 2In some embodiments, the processing mechanism 300 further comprises a laser 320 and a light splitting assembly 330, the laser 320 and the light splitting assembly 330 can be fixedly arranged on the base 100, the number of the laser 320 is greater than or equal to one, and the number of the light splitting assembly 330 is greater than or equal to the number of the laser 320. The same laser 320 can correspond to multiple processing assemblies 310, and the multiple processing assemblies 310 are arranged at intervals in a plane parallel to the vertically placed circuit board 20, so that the multiple processing assemblies 310 can simultaneously process different processing areas of at least one surface of the circuit board 20, thereby improving the processing efficiency of the circuit board 20. The laser beam emitted by the laser 320 passes through the light splitting assembly 330 to form multiple branch lasers 321, and the number of the branch lasers 321 is equal to the number of the processing assemblies 310 to form a one-to-one correspondence, so that different branch lasers 321 enter different processing assemblies 310. In this way, at least one surface of the circuit board 20 can be processed simultaneously by multiple processing assemblies 310, which can also improve the working efficiency of the circuit board 20 processing. Of course, the same laser 320 can also correspond to multiple light splitting assemblies 330, and the multiple light splitting assemblies 330 can split the laser beam generated by the same laser 320 into multiple branch lasers 321, so that different branch lasers 321 enter different processing assemblies 310.

[0068] Referring to Figure 2 , Figure 3 and Figure 4 In some embodiments, the processing device 10 further comprises a suction mechanism 400, and the suction port 410 of the suction mechanism 400 is located between the processing assembly 410 and the circuit board 20 along the thickness direction of the circuit board 20, and the suction mechanism 400 can be fixedly connected with the base 100. By arranging the suction mechanism 400, the dust and other impurities generated during the laser processing of the circuit board 20 can be timely sucked away by negative pressure, avoiding the dust from adhering to the focusing assembly and other optical mechanisms to affect the processing, thereby improving the processing efficiency and processing precision of the circuit board 20. The suction mechanism 400 comprises a suction pipe 420, and the lumen of the suction pipe 420 extends along the gravity direction and communicates with the suction port 410. During operation, the suction mechanism 400 provides a downward suction force along the suction pipe 420 to the suction port 410, Figure 3 and the direction indicated by the dotted arrow in the figure is the direction of the suction force. The dust and other impurities in the suction port 410 are discharged through the lumen of the suction pipe 420. Since the lumen of the suction pipe 420 extends along the gravity direction, the dust and other impurities in the lumen can be accelerated to quickly discharge from the lumen under the action of gravity, thereby improving the working efficiency of the suction mechanism 400. It can be understood that, since the circuit board 20 is vertically placed during the processing, the dust can be quickly separated from the circuit board 20 under the dual action of gravity and the suction force generated by the suction mechanism 400, thereby improving the suction effect of the suction mechanism 400 on the dust.

[0069] The application also provides a processing system, which comprises a front production line, a rear production line and the processing device 10 described above, the processing device 10 is located between the front production line and the rear production line, and both the front production line and the rear production line are used for processing the circuit board 20 vertically placed. Therefore, when the circuit board 20 is transferred from the front production line to the processing device 10, or the circuit board 20 is transferred from the processing device 10 to the rear production line, the circuit board 20 is vertically placed, and the placement mode of the circuit board 20 does not need to be changed multiple times, thereby improving the working efficiency of the processing of the circuit board 20, and being beneficial to simplifying and integrating the processing device 10 with the front production line before processing and the rear production line after processing according to needs, reducing the occupied space of the entire processing system, and facilitating the automatic design and control of the processing system. The front production line can comprise a blackening or brownening production line of the circuit board, etc., and the rear production line can comprise a cleaning production line of the circuit board, etc.

[0070] Referring to Figure 8 The application also provides a processing method, which can be executed by using the processing device 10 described above, so that the processing method can process the circuit board 20 described above. The processing method mainly comprises the following steps:

[0071] S610, fixing the circuit board 20 on the clamping assembly 220 in a vertically placed manner.

[0072] S620, controlling the clamping assembly 220 to drive the circuit board 20 to move to align any processing area of the circuit board 20 with the processing range of the processing assembly 410, and controlling the abutting assembly 260 to abut against the circuit board 20 along the thickness direction of the circuit board 20 to define part of the edge of the processing area.

[0073] S630, controlling the processing assembly 410 to process the processing area of the circuit board 20.

[0074] S640, after the processing assembly 410 finishes processing the previous processing area of the circuit board 20, controlling the clamping assembly 220 to slide along the first direction and / or the second direction, so that the processing assembly 410 processes the subsequent processing area of the circuit board 20.

[0075] In view of the fact that the circuit board 20 is vertically placed during the processing, when the circuit board 20 is transferred from the previous production line to the processing device 10 for processing by the processing method, or when the circuit board 20 is transferred from the processing device 10 to the subsequent production line, the circuit board 20 can always remain in a vertically placed state, without the need to change the placement mode of the circuit board 20 multiple times, thereby improving the work efficiency of the processing of the circuit board 20. Moreover, through the action of the clamping assembly 220, the circuit board 20 can move along the first direction and the second direction, and the processing assembly 310 is relatively fixed along the first direction and the second direction, so that in the first direction and the second direction, the circuit board 20 can move while the processing assembly 310 cannot move, that is, through the movement of the circuit board 20, each processing area of the circuit board 20 is aligned with the processing assembly 310 in the third direction, so that the processing assembly 310 can accurately and smoothly process each processing area; it can also effectively avoid affecting the position accuracy of the processing assembly 310 due to the movement of the processing assembly 310 in the first direction and the second direction, thereby improving the processing accuracy of the processing assembly 310 on the circuit board 20.

[0076] In some embodiments, the abutting piece 261b of the abutting assembly 260 abuts against the circuit board 20, so that the part of the circuit board 20 in contact with the abutting piece 261b cannot be processed, and the processing area is located between two adjacent abutting pieces 261b, so that the two adjacent abutting pieces 261b define part of the edge of the processing area. During the processing of the processing area of the circuit board 20 by the processing assembly 310, there are processing assemblies 310 on both sides of the circuit board 20 in the thickness direction, so that the processing assemblies 310 on both sides of the circuit board 20 can process both surfaces in the thickness direction of the circuit board 20. For example, the processing assemblies 310 can process both surfaces in the thickness direction of the circuit board 20 at the same time, so that the intermediate waiting time can be eliminated, thereby improving the processing efficiency. For another example, the processing assemblies 310 can process both surfaces in the thickness direction of the circuit board 20 in sequence, so that the processing mode in sequence can be adopted according to the actual processing requirements of the two surfaces, thereby improving the processing accuracy of the circuit board 20.

[0077] In some embodiments, during the processing of both surfaces in the thickness direction of the circuit board 20 by the processing assembly 310, the processing assembly 310 can process the two surfaces by different processing parameters respectively, so that the processing requirements of the two surfaces in structure such as shape and size can be met, thereby ensuring the processing accuracy of the circuit board 20. For example, the processing parameters can include processing speed, processing power, or processing path, etc., that is, according to actual needs, the processing assemblies 310 on both sides of the circuit board 20 can process the two surfaces by different processing speeds, processing powers, or processing paths respectively.

[0078] In some embodiments, during the processing of the processing area of the circuit board 20 by the processing assembly 310, the processing assembly 310 can process the circuit board 20 by laser processing, i.e., the laser beam emitted by the processing assembly 310 processes the circuit board 20. It can be understood that the processing assembly 310 at this time is a laser processing assembly. Alternatively, the processing assembly 310 can process the circuit board 20 by mechanical processing, i.e., the tool of the processing assembly 310 directly contacts the circuit board 20 to process the circuit board 20. It can be understood that the processing assembly 310 at this time is a mechanical processing assembly. In this way, the diversity of the processing method used for processing the circuit board 20 can be improved.

[0079] In some embodiments, during the processing of the circuit board 20 by the processing assembly 310 through laser processing, the laser beam generated by the processing assembly 310 can be deflected to cover the processing area of the circuit board 20. Specifically, through the movement of the circuit board 20 in the first direction and the second direction, the processing area of the circuit board 20 can be aligned with the processing assembly 310 in the third direction. At this time, since the processing assembly 310 remains stationary in the first direction and the second direction, the laser beam emitted by the processing assembly 310 can be deflected to cover the entire processing area of the circuit board 20 under the action of the deflection member arranged inside the processing assembly 310, i.e., the laser beam is deflected to scan the processing area to process the circuit board 20.

[0080] In some embodiments, during the processing of the circuit board 20 by the processing assembly 310 through laser processing, the processing assembly 310 can slide along the thickness direction of the circuit board 20, so that the focal length of the laser beam can be improved, i.e., the focal point position of the laser beam can be adjusted according to the processing needs, so that the laser beam processes the circuit board 20 by focusing processing or defocusing processing. It can be understood that when focusing processing is used, the focal point falls on the processing position of the circuit board 20, so that the energy utilization rate of the laser beam at the processing position is improved to improve the processing efficiency. For example, a circuit board 20 with a large thickness can use focusing processing. When defocusing processing is used, the focal point falls outside the processing position of the circuit board 20, which can avoid damage or deformation of the circuit board 20 due to local overheating at the processing position. For example, a circuit board 20 with a small thickness can use focusing processing. During the processing of the circuit board 20 by the processing assembly 310 through mechanical processing, the processing assembly 310 can slide along the thickness direction of the circuit board 20, so as to adjust the low pressure between the tool and the circuit board 20, ensure that the tool processes the circuit board 20 with reasonable feed pressure, and improve the processing efficiency on the basis of ensuring the processing accuracy.

[0081] In some embodiments, during the processing of the processing area of the circuit board 20 by the processing assembly 310, the negative pressure generated by the suction mechanism 400 described above can suck away the dust in the processing area. On the one hand, this can prevent dust from entering the outside environment and affecting the processing environment, and on the other hand, it can prevent dust from adhering to the optical elements of the laser processing assembly 310 to affect the transmission efficiency and accuracy of the laser beam, and it can also prevent dust from adhering to the core mechanical components of the mechanical processing assembly 310, causing the performance of the mechanical processing assembly 310 to decline or even fail. In this way, the processing efficiency and accuracy of the circuit board 20 can be improved. Since the circuit board 20 is vertically placed during processing, the gravity of the dust can also provide good assistance under the action of negative pressure, so that the dust is quickly removed from the circuit board 20 under the action of negative pressure and gravity, thereby improving the dust removal effect.

[0082] In some embodiments, after the processing of the circuit board 20 is completed, the clamping assembly 220 can first be moved in the direction of gravity to a suitable unloading position, in a simple way, so that the clamping assembly 220 and the circuit board 20 are at a reasonable height, and then the clamping assembly 220 drives the circuit board 20 to move, so that the circuit board 20 is separated from the clamping assembly 220 and the entire processing device 10, so that the circuit board 20 is transferred to the subsequent production line for processing.

[0083] In some embodiments, before the processing assembly 310 processes the processing area of the circuit board 20, that is, before the processing of the circuit board 20, the circuit board 20 needs to be transferred from the previous production line to the processing device 10 for processing. At this time, the clamping assembly 220 can also be first moved in the direction of gravity to a loading position, in a simple way, so that the clamping assembly 220 and the circuit board 20 are at a reasonable height, and then the clamping assembly 220 drives the circuit board 20 to move, so that the circuit board 20 is transferred from the previous production line to the processing device 10, so that the processing assembly 310 subsequently processes the circuit board 20.

[0084] Therefore, when the processing assembly 310 completely processes the circuit board 20, the clamping assembly 220 will move to the unloading position, so that the circuit board 20 is transferred from the unloading position to the subsequent production line. After the circuit board 20 completely separates from the clamping assembly 220 at the unloading position, the clamping assembly 220 will return from the unloading position to the loading position, so that the circuit board 20 is transferred from the previous production line and the loading position to the clamping assembly 220, so that the clamping assembly 220 moves to the specified position to process the circuit board 20 by the processing assembly 310.

[0085] In some embodiments, the two abutting units 261 of the abutting assembly 260 are located on opposite sides of the circuit board 20 in the thickness direction, i.e., the two abutting units 261 are spaced apart along the thickness direction of the circuit board 20. The abutting unit 261 includes a driver 261a and an abutting piece 261b, the driver 261a drives the abutting piece 261b to slide along the thickness direction of the circuit board 20, and the two abutting pieces 261b of the same abutting assembly 260 abut the two surfaces of the circuit board 20 in the thickness direction, so that the two abutting pieces 261b can clamp the circuit board 20. The abutting assembly 260 can be located between the two clamping units 231 in the direction of gravity, so that the two clamping units 231 clamp the two ends of the circuit board 20 in the thickness direction, and the abutting assembly 260 can clamp the middle part of the circuit board 20 in the thickness direction. Therefore, the arrangement of the abutting assembly 260 can further improve the stability and reliability of the clamping of the circuit board 20. Especially for the circuit board 20 with small thickness, the abutting assembly 260 can effectively prevent the circuit board 20 from vibrating during processing, thereby improving the processing efficiency and processing accuracy of the circuit board 20.

[0086] Referring to Figure 9 In some embodiments, the application also provides a processing method, which is applied to the processing system described above, and the processing method includes the following steps:

[0087] S710, the circuit board 20 is vertically placed on the front production line for front processing;

[0088] S720, the circuit board 20 after the front processing is vertically transported to the processing device 10 for vertical placement and processing;

[0089] S730, the circuit board 20 after the processing of the processing device 10 is vertically transported to the rear production line for vertical placement and rear processing. Therefore, when the circuit board 20 is transferred from the front production line to the processing device 10, or the circuit board 20 is transferred from the processing device 10 to the rear production line, the circuit board 20 is vertically placed, and the placement mode of the circuit board 20 does not need to be changed multiple times, thereby improving the working efficiency of the processing of the circuit board 20, and facilitating the simplification and integration of the processing device 10 with the front production line before processing and the rear production line after processing according to needs, reducing the occupied space of the entire processing system, and facilitating the automatic design and control of the processing system.

[0090] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the description.

[0091] The above embodiments only express several implementation ways of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A processing method, applied to a processing device and used to process a circuit board, wherein the processing device includes a clamping assembly, a processing assembly, and an abutting assembly, wherein the clamping assembly is capable of relative sliding in a first direction and a second direction, and the clamping assembly and the circuit board move synchronously, wherein the first direction and the second direction are both perpendicular to the thickness direction of the circuit board, and one of the directions is the direction of gravity, and wherein: The processing method comprises the following steps: Fixing the circuit board on the clamping assembly in a vertical manner; Controlling the clamping assembly to drive the circuit board to move until any processing area thereof is aligned with the processing range of the processing assembly, and the abutting assembly abuts against the circuit board along the thickness direction of the circuit board to define a portion of the edge of the processing area; controlling the processing assembly to process the processing area of ​​the circuit board; and After the processing assembly completes processing of the first processing area of ​​the circuit board, the clamping assembly is slid along the first direction and / or the second direction to enable the processing assembly to process the subsequent processing area of ​​the circuit board.

2. The processing method according to claim 1, characterized in that: In the step of causing the processing component to process the processing area of ​​the circuit board, the processing component is controlled to process the two surfaces in the thickness direction of the circuit board simultaneously or successively.

3. The processing method according to claim 2, characterized in that: The two surfaces in the thickness direction of the circuit board need to be processed with different structures. In the step of making the processing component process the two surfaces in the thickness direction of the circuit board simultaneously or successively, the processing component is controlled to process the two surfaces in the thickness direction of the circuit board using different processing parameters respectively, so as to process different structures on the two surfaces in the thickness direction of the circuit board.

4. The processing method according to claim 3, characterized in that: The processing parameters include at least one of a processing speed, a processing power and a processing path.

5. The processing method according to claim 1, characterized in that: In the step of causing the processing component to process the processing area of ​​the circuit board, The processing component is a laser processing component, and the laser processing component processes the circuit board by using a laser beam; or The processing component is a mechanical processing component, and the mechanical processing component processes the circuit board through a tool.

6. The processing method according to claim 5, characterized in that: In the step of causing the processing component to process the circuit board by laser processing, the processing component is slid along the thickness direction of the circuit board to adjust the focal length of the laser beam.

7. The processing method according to claim 5, characterized in that: In the step of causing the processing component to process the circuit board by laser processing, the processing device further includes a spectroscopic component for controlling the same laser beam to generate a plurality of branch lasers transmitted to different processing components respectively through the spectroscopic component.

8. The processing method according to claim 1, characterized in that: In the step of causing the processing component to process the processing area of ​​the circuit board, the processing device also includes a suction mechanism, which includes a suction port and a suction tube. The suction port is located between the processing component and the circuit board along the thickness direction of the circuit board, and the lumen of the suction tube extends along the direction of gravity and is connected to the suction port. The suction mechanism is controlled to provide adsorption force along the direction of gravity to remove dust in the processing area.

9. The processing method according to claim 1, characterized in that: After the circuit board is processed, the clamping assembly is controlled to move to a material unloading position along the direction of gravity, and the clamping assembly drives the circuit board to move so as to separate from the clamping assembly.

10. The processing method according to claim 1, characterized in that: Before the step of causing the processing assembly to process the circuit board, the clamping assembly is controlled to clamp the circuit board from a loading position and drive the circuit board to move to a specified position.

11. The processing method according to claim 1, characterized in that: In the step of causing the processing assembly to process the processing area of ​​the circuit board, the abutment assembly includes two abutment units, which are located on opposite sides of the thickness direction of the circuit board, and the abutment parts of the two abutment units are controlled to slide along the thickness direction of the circuit board to abut the circuit board.

12. A processing method, applied to a processing system, the processing system comprising a front-end production line, a back-end production line, and a processing device, the processing device being used to process circuit boards; characterized in that: The processing method comprises the following steps: The circuit board is placed vertically on the front-end production line for front-end processing; The circuit board after the front-end processing is transported to the processing device in a vertical placement manner for vertical placement and processing; The circuit boards processed by the processing device are transported vertically to the downstream production line for vertical placement and downstream processing.

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