Die ejector pin structure optimization method

Abstract

The invention is suitable for the technical field of mold ejector pins, and particularly relates to a mold ejector pin structure optimization method which comprises the steps that a product model and a mold model are obtained; determining a key area according to the product model; obtaining a thimble density thermodynamic diagram according to the product model and the mold model; determining a thimble layout according to the thimble density thermodynamic diagram and the key area; determining cooling water channel information of the mold model according to the ejector pin layout; obtaining a thimble trace area according to the thimble layout and the cooling water channel information; and adjusting thimble layout and cooling water channel information according to the thimble trace area. The mold ejector pin structure optimization method provided by the invention can solve the problem that the ejector pin and the cooling water channel of the mold ejector pin structure are lack of collaborative optimization.

Description

Technical Field

[0001] The present application belongs to the technical field of mold ejector pins, and in particular to a method for optimizing the structure of mold ejector pins. Background Art

[0002] Mold ejectors are critical components used in injection molds to eject the finished plastic product from the mold cavity. They are typically installed in the movable mold portion of the mold. At the end of the injection molding cycle, the ejector mechanism drives the product out of the mold, separating it from the mold.

[0003] In existing technologies, the layout of ejector pins is designed to ensure stable product ejection; simultaneously, the cooling channels are designed to quickly and evenly reduce mold temperature, ensuring product cooling efficiency and molding quality. However, the layout of the cooling channels affects the mold's temperature distribution, which in turn affects the temperature of the contact area between the ejector pin and the product. If the temperature of the contact area between the ejector pin and the product is not appropriate during product ejection, defects such as white ejection and ejection marks may appear on the product surface. Therefore, existing mold ejector pin structures lack coordinated optimization of the ejector pin and cooling channels. Summary of the Invention

[0004] An embodiment of the present application provides a method for optimizing a mold ejector pin structure, which can solve the problem of lack of coordinated optimization between the ejector pin and the cooling water channel of the mold ejector pin structure.

[0005] In a first aspect, an embodiment of the present application provides a method for optimizing a mold ejector pin structure, comprising: Obtain product models and mold models; Determining key areas based on the product model; wherein the key areas include rib areas and easily deformed areas of the product model; Obtaining an ejector pin density heat map according to the product model and the mold model; Determining a pin layout based on the pin density heat map and the key area; wherein the pin layout includes the type, quantity, position, and movement trajectory of the pins; Determining cooling water channel information of the mold model according to the ejector pin layout; wherein the cooling water channel information includes the position and size of the cooling water channel; Obtaining an ejector pin mark area according to the ejector pin layout and the cooling water channel information; wherein the ejector pin mark area refers to an area on the product surface where the ejector pin leaves a mark; The ejector pin layout and the cooling water channel information are adjusted according to the ejector pin trace area.

[0006] The above technical solutions in the embodiments of the present application have at least the following technical effects: The mold ejector structure optimization method provided in the embodiment of the present application obtains a product model and a mold model; determines a key area based on the product model; obtains an ejector density heat map based on the product model and the mold model; determines an ejector layout based on the ejector density heat map and the key area; determines the cooling water channel information of the mold model based on the ejector layout; obtains an ejector trace area based on the ejector layout and the cooling water channel information; and adjusts the ejector layout and the cooling water channel information based on the ejector trace area. Therefore, the mold ejector structure optimization method provided in the embodiment of the present application reasonably determines the ejector layout and cooling water channel information by comprehensively considering factors such as the product model, the mold model, the key area, and the ejector density heat map, and continuously coordinates the optimization of the ejector and the cooling water channel based on the ejector trace area, which can effectively reduce defects such as deformation, warping, and shrinkage of the product, improve the dimensional accuracy and appearance quality of the product, and make the product more in line with the design requirements.

[0007] In a possible implementation of the first aspect, determining the key area according to the product model includes: Obtaining vertex coordinates and vertex curvatures of each triangular facet according to the product model; Obtaining a Voronoi diagram according to the vertex coordinates; Obtaining the thickness of each triangle according to the Voronoi diagram; A critical area is determined according to the vertex curvatures and the thicknesses.

[0008] In a possible implementation of the first aspect, determining the key area according to the vertex curvatures and the thicknesses includes: When the vertex curvature is less than a first curvature threshold and the thickness is greater than a first thickness threshold, determining the corresponding triangular facet as the reinforcement rib area; When the vertex curvature is greater than a second curvature threshold or the gradient of the vertex curvature is greater than a gradient threshold, and the thickness is less than a second thickness threshold, the corresponding triangular facet is determined as the easily deformable area.

[0009] In a possible implementation of the first aspect, obtaining an ejector pin density heat map according to the product model and the mold model includes: Extracting the normal stress distribution of the contact surface according to the product model and the mold model, and generating a stress cloud map; Obtaining the ejection force requirement of each area in the contact surface according to the stress cloud map; A corresponding ejector pin density is obtained according to each ejector force requirement, and each ejector pin density is mapped to a contact surface to obtain the ejector pin density heat map.

[0010] In a possible implementation of the first aspect, determining the ejector pin layout according to the ejector pin density heat map and the key area includes: Obtaining a low-density area and a high-density area according to the ejector pin density heat map; A pin layout is obtained according to the key area, the low-density area and the high-density area.

[0011] In a possible implementation of the first aspect, obtaining a pin layout according to the key area, the low-density area, and the high-density area includes: According to the reinforcing rib region, the low-density region, and the high-density region, a first overlapping region where the contact surface of the low-density region and the reinforcing rib region overlaps, a second overlapping region where the contact surface of the high-density region and the reinforcing rib region overlap, and a first independent region where the contact surface of the reinforcing rib region overlaps with neither the low-density region nor the high-density region; The ejector pin layout is determined according to the first overlapping area, the second overlapping area, and the first independent area.

[0012] In a possible implementation of the first aspect, obtaining the ejector pin layout according to the key area, the low-density area, and the high-density area further includes: According to the easily deformable region, the low-density region, and the high-density region, a third overlapping region where the contact surface of the low-density region and the easily deformable region overlaps, a fourth overlapping region where the contact surface of the high-density region and the easily deformable region overlap, and a second independent region where the contact surface of the easily deformable region overlaps with neither the low-density region nor the high-density region; The ejector pin layout is determined according to the third overlapping area, the fourth overlapping area, and the second independent area.

[0013] In a possible implementation of the first aspect, determining the cooling water channel information of the mold model according to the ejector pin layout includes: Obtaining a high-temperature area of ​​the mold according to the ejector pin layout; The cooling water channel information is obtained according to the high-temperature area and the positions of the ejector pins in the ejector pin layout.

[0014] In a possible implementation of the first aspect, adjusting the ejector pin layout and the cooling water channel information according to the ejector pin trace area includes: When the wear depth of the ejector pin mark area is greater than the wear threshold, adjusting the ejector pin type; When the area of ​​the ejector pin mark region is smaller than the area threshold, and the temperature of the ejector pin mark region is greater than a first temperature threshold and less than a second temperature threshold, increasing the number of ejector pins; In the case where the ejector pin trace area is offset, adjusting the position of the ejector pin; When the temperature of the ejector mark area is greater than or equal to the second temperature threshold, or the deformation of the ejector mark area is greater than the deformation threshold, adjusting the movement trajectory of the ejector; The cooling water channel information is adjusted according to the adjusted ejector pin layout.

[0015] In a possible implementation of the first aspect, the motion trajectory of the ejector includes an ejection speed, an ejection time, and an ejection sequence. When the temperature of the ejector mark area is greater than a second temperature threshold or the deformation of the ejector mark area is greater than a deformation threshold, adjusting the motion trajectory of the ejector includes: When the temperature of the ejector pin mark area is greater than the second temperature threshold, reducing the ejection speed; When the deformation amount of the ejector mark area is greater than the deformation amount threshold, the ejection order is adjusted.

[0016] In a second aspect, an embodiment of the present application provides a mold ejector structure optimization device, comprising: Acquisition module, used to obtain product model and mold model; A key area module, configured to determine key areas according to the product model; wherein the key areas include the reinforcing rib area and the easily deformable area of ​​the product model; An ejector pin density module, configured to obtain an ejector pin density heat map based on the product model and the mold model; an ejector pin layout module, configured to determine an ejector pin layout based on the ejector pin density heat map and the key area; wherein the ejector pin layout includes the type, quantity, position, and movement trajectory of the ejector pins; A cooling water channel information module, configured to determine the cooling water channel information of the mold model according to the ejector pin layout; wherein the cooling water channel information includes the position and size of the cooling water channel; an ejector mark area module, configured to obtain an ejector mark area based on the ejector layout and the cooling water channel information; wherein the ejector mark area refers to an area where the ejector leaves a mark on the product surface; An adjustment module is used to adjust the ejector pin layout and the cooling water channel information according to the ejector pin trace area.

[0017] In a third aspect, an embodiment of the present application provides a mold ejector pin structure optimization device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements a method as described in any one of the first aspects above when executing the computer program.

[0018] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the method described in any one of the first aspects above is implemented.

[0019] In a fifth aspect, an embodiment of the present application provides a computer program product. When the computer program product is run on a mold ejector pin structure optimization device, the mold ejector pin structure optimization device executes any one of the methods described in the first aspect above.

[0020] It can be understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] Figure 1 1 is a flow chart of a method for optimizing a mold ejector pin structure according to an embodiment of the present application; Figure 2 1 is a schematic diagram of the implementation process of steps S200, S240, S300, S400, S420 and S500 in the mold ejector pin structure optimization method provided in one embodiment of the present application; Figure 3 1 is a schematic diagram of the implementation process of steps S700 and S740 in the mold ejector pin structure optimization method provided in one embodiment of the present application; Figure 4 Schematic diagram of the structure of the mold ejector pin structure optimization device provided in an embodiment of the present application; Figure 5 It is a structural schematic diagram of the mold ejector structure optimization device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0023] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0024] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0025] It will also be understood that the term "and / or" used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0026] As used in this specification and the appended claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0027] In addition, in the description of the present application specification and the appended claims, the terms "first", "second", "third", etc. are only used to distinguish the descriptions and cannot be understood as indicating or implying relative importance.

[0028] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0029] In related technologies, the layout of ejector pins is designed to achieve stable product ejection; at the same time, the cooling water channels are designed to quickly and evenly reduce the mold temperature to ensure product cooling efficiency and molding quality. However, the layout of the cooling water channels affects the temperature distribution of the mold, which in turn affects the temperature of the contact area between the ejector pin and the product. If the temperature of the contact area between the ejector pin and the product is not appropriate when ejecting the product, defects such as white ejection and ejection marks may appear on the product surface. Therefore, the ejector pin and cooling water channels of existing mold ejector pin structures lack coordinated optimization.

[0030] In order to solve the above problems, an embodiment of the present application provides a method for optimizing the structure of a mold ejector pin. In this method, by obtaining a product model and a mold model; determining a key area based on the product model; obtaining an ejector pin density heat map based on the product model and the mold model; determining an ejector pin layout based on the ejector pin density heat map and the key area; determining the cooling water channel information of the mold model based on the ejector pin layout; obtaining an ejector pin trace area based on the ejector pin layout and the cooling water channel information; and adjusting the ejector pin layout and the cooling water channel information based on the ejector pin trace area. Therefore, the method for optimizing the structure of a mold ejector pin provided in an embodiment of the present application rationally determines the ejector pin layout and the cooling water channel information by comprehensively considering factors such as the product model, the mold model, the key area, and the ejector pin density heat map, and continuously coordinates and optimizes the ejector pins and the cooling water channel based on the ejector pin trace area, which can effectively reduce defects such as deformation, warping, and shrinkage cavities of the product, improve the dimensional accuracy and appearance quality of the product, and make the product more in line with the design requirements.

[0031] The mold ejector pin structure optimization method provided in the embodiment of the present application can be applied to a mold ejector pin structure optimization device. In this case, the mold ejector pin structure optimization device is the executor of the mold ejector pin structure optimization method provided in the embodiment of the present application. The embodiment of the present application does not impose any restrictions on the specific type of the mold ejector pin structure optimization device.

[0032] For example, the mold ejector pin structure optimization device can be a mobile phone, a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a personal digital assistant (PDA), a desktop computer, a handheld device with wireless communication capabilities, a computing device or other processing device connected to a wireless modem, a computer, a laptop computer, a handheld communication device, a handheld computing device, a satellite wireless device, etc., but is not limited thereto.

[0033] In order to better understand the mold ejector pin structure optimization method provided in the embodiment of the present application, the specific implementation process of the mold ejector pin structure optimization method provided in the embodiment of the present application is exemplarily introduced below.

[0034] Figure 1 A schematic flow chart of a mold ejector pin structure optimization method provided in an embodiment of the present application is shown. The mold ejector pin structure optimization method includes: S100, obtaining a product model and a mold model.

[0035] For example, the product model can be imported through CAD software (such as UG NX, SolidWorks, etc.) to simultaneously obtain or build the mold model.

[0036] S200: Determine key areas based on the product model, wherein the key areas include rib areas and easily deformed areas of the product model.

[0037] For example, finite element analysis (FEA) can be used to simulate the stress on the product (e.g., a 50N uniform load) to identify stress concentration areas. For example, if the stress in a certain area is greater than 70% of the material yield strength, the area is identified as a rib area. Based on Moldex3D injection molding simulation, the shear rate during the filling phase and the volume shrinkage after holding pressure are analyzed. For example, if the shear rate in a certain area is greater than 1000 s -¹ Or the volume shrinkage rate is greater than 5%, the area is determined as an easily deformed area.

[0038] In one possible implementation, see Figure 2 , S200, determine the key areas based on the product model, including: S210 , obtaining vertex coordinates and vertex curvatures of each triangular facet according to the product model.

[0039] It can be understood that the vertex curvature includes mean curvature and Gaussian curvature.

[0040] For example, the triangular face data of the product model can be read through STL file parsing or CAD software API (such as OpenCASCADE), where each triangular face consists of three vertices (such as V1 (x1, y1, z1), V2 (x2, y2, z2), V3 (x3, y3, z3)); the average curvature and Gaussian curvature of each vertex are calculated using a curvature estimation algorithm (such as PCA principal component analysis).

[0041] S220, obtaining a Voronoi diagram according to the vertex coordinates.

[0042] For example, a Voronoi diagram can be constructed based on vertex coordinates using the Fortune algorithm or the Bowyer-Watson algorithm to divide the plane into multiple Voronoi cells, each cell containing all points closest to the corresponding vertex, and the Voronoi edges are determined by solving the perpendicular bisector equations between the vertices.

[0043] S230: Obtain the thickness of each triangle according to the Voronoi diagram.

[0044] For example, the Voronoi diagram can be superimposed on the triangular patch, and the Voronoi unit area corresponding to each triangular patch can be calculated to obtain the thickness of each triangular patch, for example, the thickness t= , where V is the volume of a triangle and A is the area of ​​the corresponding Voronoi cell.

[0045] S240: Determine a key area according to the curvature of each vertex and each thickness.

[0046] For example, the area with a curvature absolute value greater than a threshold (such as 0.01) can be marked as a high curvature area, and the area with a thickness less than the average thickness (such as 80%) can be marked as a thin-walled area. The union of the high curvature area and the thin-walled area is the key area.

[0047] Through the above steps S210 to S240, discrete triangular facets are converted into a continuous thickness distribution field through the Voronoi diagram, breaking through the limitations of traditional grid-based uniform analysis; high curvature areas are usually accompanied by stress concentration, while thin-walled areas are prone to deformation. The superposition of the two can accurately identify injection defect risk points (such as weld marks and sink marks).

[0048] Optionally, see Figure 2 , S240, determining the key area according to the curvature of each vertex and each thickness, including: S241: When the vertex curvature is less than a first curvature threshold and the thickness is greater than a first thickness threshold, determine the corresponding triangular facet as a reinforcement rib area.

[0049] For example, the average curvature H of each vertex can be calculated. If H < H' (the first curvature threshold, such as 0.005), the curvature of the area near the vertex is considered to be gentle. If the thickness of the triangle t > t' (the first thickness threshold, such as 0.8 mm), the wall thickness of the area is considered to be large, and the triangles that meet both the curvature and thickness conditions are marked as reinforcement areas.

[0050] S242: When the vertex curvature is greater than the second curvature threshold or the gradient of the vertex curvature is greater than the gradient threshold, and the thickness is less than the second thickness threshold, determine the corresponding triangular facet as an easily deformable area.

[0051] For example, for each vertex, the spatial gradient of the curvature in its neighborhood can be calculated H=( ), if the vertex curvature H>H'' (the second curvature threshold, such as 0.01) or the curvature gradient ‖ If H‖>G (gradient threshold, such as 0.01) and thickness t<t'' (second thickness threshold, such as 0.5 mm), it is marked as a deformable area.

[0052] Through steps S241 and S242, the dual conditions of gentle curvature and high thickness are used to precisely locate areas within the product that provide mechanical support (such as the reinforcing ribs of electronic product casings). By combining sudden changes in curvature or high gradients with thin walls, areas prone to sink marks and warping during the injection molding process (such as around the button holes in mobile phone cases) are identified, guiding subsequent process optimization. This correlation of geometric features (curvature and thickness) with physical properties (deformation risk) overcomes the limitations of traditional single-parameter analysis. For example, a region of pure high curvature may be less susceptible to deformation due to sufficient thickness.

[0053] S300: Obtain ejector pin density heat map based on the product model and mold model.

[0054] For example, the demolding force can be calculated based on the product model and the mold model, mapped to the product surface, and the required ejector pin density of each grid is calculated through mesh division (such as 10 mm × 10 mm) to obtain an ejector pin density heat map.

[0055] In one possible implementation, see Figure 2 , S300, obtains ejector density heat map based on product model and mold model, including: S310: extract the normal stress distribution of the contact surface based on the product model and the mold model, and generate a stress cloud map.

[0056] For example, the contact surface between the product model and the mold core / cavity (usually the surface in the demolding direction of the product) can be extracted through CAD software (such as NX, CATIA, etc.), and stress simulation after injection cooling can be performed using Ansys or Abaqus. Material parameters (such as elastic modulus, etc.) and process parameters (such as mold temperature, cooling time, etc.) are input, and the normal stress of the contact surface is calculated and mapped to the contact surface mesh (such as 1mm×1mm). The stress distribution is visualized through color gradient to obtain a stress cloud map.

[0057] S320: Obtain ejection force requirements of each region in the contact surface according to the stress cloud map.

[0058] For example, the contact surface can be divided into several areas, each area is regarded as an independent ejection unit, and the ejection force requirement of each area in the contact surface is calculated based on the stress determined by the stress cloud map. For example, the ejection force F= ,in, is the normal stress, is the infinitesimal area of ​​the contact surface.

[0059] S330 , obtaining corresponding ejector pin densities according to respective ejector force requirements, and mapping the respective ejector pin densities to the contact surface to obtain an ejector pin density heat map.

[0060] For example, the corresponding ejector pin density can be calculated according to each ejector force requirement, and the ejector pin density can be mapped to each grid unit of the contact surface, and a pin density heat map can be obtained through color gradient.

[0061] Through steps S310 to S330, the stress cloud map directly correlates to ejection force requirements, avoiding localized under- or over-ejection caused by traditional empirical formulas (such as equal distribution by area). The ejector pin density heat map visually identifies areas of high demand, guiding ejector pin type selection (e.g., flat ejector pins for high-stress areas) and spacing adjustments.

[0062] S400: Determine ejector pin layout based on the ejector pin density heat map and key areas. The ejector pin layout includes the ejector pin type, quantity, location, and movement trajectory.

[0063] For example, flat ejector pins can be used in critical areas and round ejector pins in non-critical areas; the ejector pins should be arranged along the edge of the easily deformed area, avoiding the center of the rib area, and the spacing between the ejector pins should not exceed 2 times the wall thickness; the ejector pin ejection sequence can be simulated by CAM software to ensure that there is no interference in the demolding angle (3°~5°).

[0064] In one possible implementation, see Figure 2 , S400, determines the ejector pin layout based on the ejector pin density heat map and key areas, including: S410 , obtaining a low-density area and a high-density area according to the ejector density heat map.

[0065] For example, the pin density of each grid cell can be read from the pin density heat map, and low-density and high-density regions can be obtained through threshold segmentation. Image processing algorithms (such as OpenCV's threshold function) can be used to binarize the pin density heat map to generate low-density (blue) and high-density (red) region masks.

[0066] S420 , obtaining a pin layout according to the key area, the low-density area, and the high-density area.

[0067] For example, a dense grid layout (e.g., 5mm pin spacing) can be used in high-density areas, with large-diameter pins (e.g., 6mm diameter) prioritized. A sparse grid layout (e.g., 15mm pin spacing) can be used in low-density areas, with small-diameter pins (e.g., 4mm diameter) prioritized. Interpolation algorithms can be used to smoothly transition pin spacing in transitional areas to avoid sudden local stress changes. Furthermore, critical areas (e.g., ribbed areas and areas prone to deformation) can be overlaid with low- and high-density areas. In high-density, critical areas, pins are prioritized, with a 20% increase in density. In low-density, critical areas, basic pins are retained, with a minimum density of 0.8 pins / cm². Non-critical areas are treated according to the original density distribution. Ejector pins can be checked for interference with product features (e.g., holes, ribs, etc.). If so, the pin positions can be fine-tuned or flat pins can be used instead.

[0068] Through steps S410 to S420, low- and high-density areas are divided to avoid excessive or sparse concentration of ejector pins. Appropriately adjusting ejector pin density in areas prone to deformation or high curvature (such as around the button holes in a phone case) helps reduce the risk of white marks and deformation. By coupling ejector pin density heat maps with analysis of key areas, the ejector pin layout is refined, shifting from "uniform distribution" to "on-demand distribution," improving ejection efficiency.

[0069] Optionally, see Figure 2 , S420, obtains ejector pin layout according to key areas, low-density areas and high-density areas, including: S421, based on the reinforcement rib area, the low-density area and the high-density area, obtain a first overlapping area where the contact surface of the low-density area coincides with the reinforcement rib area, a second overlapping area where the contact surface of the high-density area coincides with the reinforcement rib area, and a first independent area where the contact surface of the reinforcement rib area coincides with neither the low-density area nor the high-density area.

[0070] For example, the CAD model can be used to extract the rib features on the surface of the product (such as a strip area with a thickness of >2mm) to generate a polygonal boundary. The intersection of the contact surface between the low-density area and the rib area is calculated based on the boundary of the rib area and the boundary of the low-density area to obtain the first overlapping area, and the intersection of the contact surface between the high-density area and the rib area is calculated to obtain the second overlapping area. The part of the rib area that is neither low-density nor high-density is the first independent area.

[0071] S422: Determine an ejector pin layout according to the first overlapping area, the second overlapping area, and the first independent area.

[0072] For example, in the first overlapping region, the density lower limit is 0.8 pins / cm², and the ejector pin type is a small-diameter (e.g., 4mm diameter) flat pin. In the second overlapping region, the density increases (e.g., from the original high density of 3.5 pins / cm² to 4.2 pins / cm²), and the ejector pin type is a large-diameter (e.g., 6mm diameter) round pin. In the first independent region, the density is arranged according to the global average density (e.g., 2.0 pins / cm²), and the ejector pin type is a standard-diameter (e.g., 5mm diameter) round pin. The ejector pins can be checked to ensure they are within a safe distance of 2mm from the rib edge. If interference occurs, the position can be fine-tuned or angled pins can be used. At the intersection of each region, an interpolation algorithm is used to smoothly transition the ejector pin spacing (e.g., from 5mm to 8mm).

[0073] Through steps S421 and S422, the density of ejector pins in the second overlapping area is increased to prevent fracture at the base of the rib due to insufficient ejection force. Smaller-diameter ejector pins are used in the first overlapping area to reduce deformation caused by extrusion of thin-walled structures. Ejector pins are arranged as needed in the first independent area to avoid over-design. By dynamically adjusting regional classification and ejector pin density, we shift from "global uniformity" to "regional differentiation," improving ejection efficiency and product quality.

[0074] Optionally, see Figure 2 , S420, obtains ejector pin layout according to key areas, low-density areas and high-density areas, and also includes: S423, based on the easily deformable area, the low-density area and the high-density area, obtain a third overlapping area where the contact surface of the low-density area and the easily deformable area overlaps, a fourth overlapping area where the contact surface of the high-density area and the easily deformable area overlaps, and a second independent area where the contact surface of the easily deformable area neither overlaps with the low-density area nor with the high-density area.

[0075] For example, the intersection of the contact surface between the low-density area and the easily deformed area can be determined as the third overlapping area, the intersection of the contact surface between the high-density area and the reinforcement area can be determined as the fourth overlapping area, and the part of the reinforcement area that is neither low-density nor high-density is the second independent area.

[0076] S424 , determining an ejector pin layout according to the third overlapping area, the fourth overlapping area, and the second independent area.

[0077] For example, in the third overlapping region, the density lower limit is 1.0 pins / cm², and the ejector type is a small-diameter (e.g., 4mm diameter) flat pin. In the fourth overlapping region, the density increases (e.g., from the original high density of 3.5 pins / cm² to 5.25 pins / cm²), and the ejector type is a large-diameter (e.g., 6mm diameter) round pin. In the second independent region, the density is arranged according to the global average density (e.g., 2.0 pins / cm²), and the ejector type is a standard-diameter (e.g., 5mm diameter) round pin. Ejector pins can be checked for interference with product features (e.g., holes, ribs). If so, beveled pins are used or their positions are adjusted (e.g., offset by 1mm). At the intersection of each region, an interpolation algorithm is used to smoothly transition the ejector pin spacing (e.g., from 6mm to 10mm).

[0078] Through steps S423 and S424 above, the density of ejector pins is increased in the fourth overlapping area to prevent product warping or breakage due to insufficient ejection force. Smaller-diameter ejector pins are used in the third overlapping area to reduce deformation of thin walls. In the second independent area, ejector pins are arranged as needed to avoid over-design. By dynamically adjusting regional classification and ejector pin density, we shift from "global uniformity" to "regional differentiation," improving ejection efficiency and product quality.

[0079] S500: Determine cooling water channel information of the mold model based on the ejector pin layout, wherein the cooling water channel information includes the position and size of the cooling water channel.

[0080] For example, the cooling water channel may be designed to be located away from the ejector pin, and the size of the cooling water channel may be designed to be 1.5 to 2 times the wall thickness of the product.

[0081] In one possible implementation, see Figure 2 , S500, determines the cooling water channel information of the mold model according to the ejector pin layout, including: S510, obtaining the high temperature area of ​​the mold according to the ejector pin layout.

[0082] For example, the friction heat generated by the ejector pins during the ejection process can be obtained based on the ejector pin layout, the heat-affected zone around the ejector pins can be estimated based on the friction heat, and the heat-affected zones of all ejector pins can be superimposed through Boolean operations to obtain the high-temperature zone of the mold.

[0083] S520 , obtaining cooling water channel information according to the high-temperature area and the positions of the ejector pins in the ejector pin layout.

[0084] For example, the size of the mold can be determined based on the mold model, thereby obtaining the diameter and spacing of the cooling water channel, that is, the size of the cooling water channel in the cooling water channel information; then, the boundary of the high-temperature area is expanded outward by a certain distance (such as 2.5 mm) to generate a water channel candidate area, and the A* algorithm or genetic algorithm is used to generate the optimal water channel path within the water channel candidate area (the water channel covers all high-temperature areas and the path is the shortest), and the three-dimensional coordinates of the high-temperature area are Boolean operated with the ejector position, excluding the space occupied by the ejector so that the optimal water channel path maintains a certain distance (such as 5 mm) from the ejector, thereby obtaining the position of the cooling water channel in the cooling water channel information.

[0085] Through steps S510 to S520, the thermal effects of ejector pins are modeled, improving the positioning accuracy of high-temperature areas by 50%, avoiding over-coverage or omission of cooling channels in traditional methods. The resulting cooling channel layout can be directly imported into CAM software to generate machining paths, automating the entire process from ejector pin layout to high-temperature areas to cooling channels.

[0086] S600: Obtain an ejector pin mark area based on the ejector pin layout and cooling water channel information. The ejector pin mark area refers to an area on the product surface where the ejector pin leaves a mark.

[0087] For example, demolding can be performed based on the ejector pin layout and cooling water channel information to obtain the ejector pin mark area.

[0088] S700, adjust ejector pin layout and cooling water channel information based on ejector pin trace area.

[0089] For example, if the ejector mark area is located on the appearance surface (such as the product's Class A curved surface), a hydraulic ejector is used or the ejector diameter is reduced, and the cooling water channel information is adjusted according to the adjusted ejector layout. For example, the distance between the cooling water channel and the ejector needs to be greater than 10 mm.

[0090] In one possible implementation, see Figure 3 , S700, adjust the ejector layout and cooling water channel information according to the ejector mark area, including: S710: When the wear depth of the ejector pin mark area is greater than the wear threshold, adjust the ejector pin type.

[0091] For example, a 3D profilometer (such as the Keyence VR series) or a white light interferometer can be used to measure the wear depth of the ejector pin mark area. If the wear depth of the ejector pin mark area is greater than a wear threshold (such as 0.015 mm), the ejector pins in the corresponding area are replaced with ejector pins with higher hardness or surface coating.

[0092] S720 : When the area of ​​the ejector pin mark region is smaller than the area threshold and the temperature of the ejector pin mark region is greater than a first temperature threshold and less than a second temperature threshold, increase the number of ejector pins.

[0093] For example, the area of ​​the ejector pin mark region can be extracted through image processing (such as OpenCV), and the temperature of the ejector pin mark region can be measured using a thermocouple or an infrared thermal imager. If the area of ​​the ejector pin mark region is smaller than an area threshold, and the temperature of the ejector pin mark region is greater than a first temperature threshold and less than a second temperature threshold, then new ejector pins are added around the original ejector pins.

[0094] S730: If the ejector pin trace area is offset, adjust the ejector pin position.

[0095] For example, the offset (e.g., ), if the offset > (such as 0.5mm), adjust the position of the ejector pin to the center of the ejector pin mark area.

[0096] S740 , when the temperature of the ejector mark region is greater than or equal to a second temperature threshold, or the deformation of the ejector mark region is greater than a deformation threshold, adjusting the motion trajectory of the ejector.

[0097] For example, the temperature of the ejector mark area can be measured by a thermocouple or an infrared thermal imager, and the deformation of the product after ejection can be measured by a three-coordinate measuring machine. If the temperature of the ejector mark area is greater than or equal to a second temperature threshold (such as 100°C), or the deformation of the ejector mark area is greater than the deformation threshold (such as 0.05mm), the trajectory adjustment is triggered. For example, segmented ejection: the ejection process is divided into two sections (such as the ejection speed of 50mm / s in the first section and 20mm / s in the second section) to reduce the ejection impact; inclined ejector design: if the deformation is concentrated in a local area, use an inclined ejector (such as an inclination angle of 5°) to disperse the ejection force.

[0098] Optionally, see Figure 3 The motion trajectory of the ejector includes ejection speed, ejection time, and ejection sequence. In step S740, when the temperature of the ejector mark area is greater than a second temperature threshold or the deformation of the ejector mark area is greater than a deformation threshold, adjusting the motion trajectory of the ejector includes: S741: When the temperature of the ejector pin mark area is greater than a second temperature threshold, reduce the ejection speed.

[0099] For example, the temperature in the ejector pin mark area can be monitored in real time using a thermocouple or infrared thermal imager. The relationship between ejection speed and temperature can be fitted using an empirical formula or simulation data. If the temperature in the ejector pin mark area exceeds a second temperature threshold, the ejection speed can be reduced. For example, the ejection process can be divided into two stages: the first stage ejects at the initial speed to 90% of the stroke, and the second stage completes the remaining 10% at an adjusted speed. Alternatively, the ejection speed can be adjusted in real time using a PID controller to ensure that the temperature remains stable below the second temperature threshold.

[0100] S742: When the deformation amount of the ejector mark area is greater than the deformation amount threshold, adjust the ejection order.

[0101] For example, the deformation of the product after ejection can be measured by a three-dimensional coordinate measuring machine (CMM) or an optical scanner, and the ejectors can be divided into several groups (such as group A and group B), with the groups corresponding to the areas with larger deformation being ejected first.

[0102] Through steps S741 to S742, the ejection speed is reduced, frictional heat during the ejection process is reduced, and the temperature in the ejector pin trace area is lowered. By adjusting the ejection sequence, the ejection force is more evenly distributed, local stress concentration is reduced, and product deformation is reduced. Controlling temperature and deformation helps reduce wear and fatigue on the ejector pins and mold, extending mold life. Automated adjustment of the ejection trajectory helps reduce mold trials and manual intervention, improving production efficiency and achieving closed-loop control of "temperature / deformation detection → ejection trajectory adjustment," thereby enhancing production stability and product quality consistency.

[0103] S750: Adjust the cooling water channel information according to the adjusted ejector pin layout.

[0104] For example, the cooling water channels can be replanned around the newly added ejector pins based on the adjusted ejector pin layout, ensuring that the water channels are 2-3 mm away from the ejector pin edges. If the ejector pin trajectory adjustment causes the ejection force distribution to change, the high-temperature area is recalculated and the water channel layout is optimized. The water channel diameter is adjusted according to the number of newly added ejector pins (for example, if two ejector pins are added, the water channel diameter increases from 5 mm to 6 mm), and the water channel spacing is maintained at 1.5-2 times the diameter (for example, a spacing of 9 mm).

[0105] Through steps S710 to S750, wear detection and ejector type adjustment help reduce product surface roughness. Trace offset adjustment helps improve product dimensional consistency. Optimizing ejector trajectories and cooling channels helps shorten cooling time and production cycle time. This fully automated process of "wear detection → ejector adjustment → cooling optimization" reduces manual intervention and improves production stability and product quality.

[0106] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0107] Corresponding to the mold ejector pin structure optimization method described in the above embodiment, the embodiment of the present application further provides a mold ejector pin structure optimization device, and each module of the device can implement each step of the mold ejector pin structure optimization method. Figure 4 A structural block diagram of a mold ejector pin structure optimization device provided in an embodiment of the present application is shown. For ease of explanation, only the parts related to the embodiment of the present application are shown.

[0108] Reference Figure 4 , the device comprises: Acquisition module, used to obtain product model and mold model; A key area module, configured to determine key areas according to the product model; wherein the key areas include the reinforcing rib area and the easily deformable area of ​​the product model; An ejector pin density module, configured to obtain an ejector pin density heat map based on the product model and the mold model; an ejector pin layout module, configured to determine an ejector pin layout based on the ejector pin density heat map and the key area; wherein the ejector pin layout includes the type, quantity, position, and movement trajectory of the ejector pins; A cooling water channel information module, configured to determine the cooling water channel information of the mold model according to the ejector pin layout; wherein the cooling water channel information includes the position and size of the cooling water channel; an ejector mark area module, configured to obtain an ejector mark area based on the ejector layout and the cooling water channel information; wherein the ejector mark area refers to an area where the ejector leaves a mark on the product surface; An adjustment module is used to adjust the ejector pin layout and the cooling water channel information according to the ejector pin trace area.

[0109] It should be noted that the information interaction, execution process and other contents between the above modules are based on the same concept as the method embodiment of this application. Their specific functions and technical effects can be found in the method embodiment part and will not be repeated here.

[0110] Those skilled in the art can clearly understand that, for the convenience and brevity of description, only the division of the above-mentioned functional units and modules is used as an example for illustration. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiment can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of software functional units. In addition, the specific names of the functional units and modules are only for the convenience of distinguishing each other, and are not used to limit the scope of protection of this application. The specific working process of the units and modules in the above-mentioned device can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0111] The present application also provides a mold ejector structure optimization device. Figure 5 This is a schematic diagram of the structure of the mold ejector pin structure optimization device provided in one embodiment of the present application. Figure 5 As shown, the mold ejector pin structure optimization device 5 of this embodiment includes: at least one processor 50 ( Figure 5 Only one is shown), at least one memory 51 ( Figure 5 Only one is shown in the figure) and a computer program 52 stored in the at least one memory 51 and executable on the at least one processor 50. When the processor 50 executes the computer program 52, the mold ejector structure optimization device 5 implements the steps of any of the above-mentioned mold ejector structure optimization method embodiments, or implements the functions of each module / unit in the above-mentioned device embodiments.

[0112] For example, the computer program 52 may be divided into one or more modules / units, which are stored in the memory 51 and executed by the processor 50 to implement the present application. The one or more modules / units may be a series of computer program instruction segments capable of performing specific functions, and the instruction segments are used to describe the execution process of the computer program 52 in the mold ejector pin structure optimization device 5.

[0113] The mold ejector pin structure optimization device 5 can be a computing device such as a desktop computer, a notebook, a palmtop computer, a cloud server, etc. The mold ejector pin structure optimization device can include, but is not limited to, a processor 50 and a memory 51. Those skilled in the art will understand that Figure 5It is only an example of the mold ejector pin structure optimization device 5 and does not constitute a limitation on the mold ejector pin structure optimization device 5. It may include more or fewer components than shown in the figure, or a combination of certain components, or different components. For example, it may also include input and output devices, network access devices, buses, etc.

[0114] The processor 50 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. A general-purpose processor may be a microprocessor or any conventional processor.

[0115] In some embodiments, the memory 51 may be an internal storage unit of the mold ejector structure optimization device 5, such as a hard drive or memory of the mold ejector structure optimization device 5. In other embodiments, the memory 51 may also be an external storage device of the mold ejector structure optimization device 5, such as a plug-in hard drive, a Smart Media Card (SMC), a Secure Digital (SD) card, a flash memory card, etc. equipped with the mold ejector structure optimization device 5. Furthermore, the memory 51 may include both the internal storage unit of the mold ejector structure optimization device 5 and an external storage device. The memory 51 is used to store an operating system, application programs, a boot loader, data, and other programs, such as the program code of the computer program. The memory 51 may also be used to temporarily store data that has been output or is about to be output.

[0116] An embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in any of the above method embodiments are implemented.

[0117] An embodiment of the present application provides a computer program product. When the computer program product is run on a mold ejector pin structure optimization device, the mold ejector pin structure optimization device implements the steps of any of the above method embodiments.

[0118] If the integrated unit is implemented as a software functional unit and sold or used as a standalone product, it can be stored in a computer-readable storage medium. Based on this understanding, the present application implements all or part of the process steps in the above-mentioned method embodiments by instructing the relevant hardware through a computer program. The computer program can be stored in a computer-readable storage medium. When executed by a processor, the computer program can implement the steps of each of the above-mentioned method embodiments. The computer program includes computer program code, which can be in source code form, object code form, executable file, or some intermediate form. The computer-readable medium can include at least: any entity or device capable of carrying the computer program code to the mold ejector pin structure optimization device, a recording medium, computer memory, read-only memory (ROM), random access memory (RAM), an electrical carrier signal, a telecommunications signal, and a software distribution medium. Examples include a USB flash drive, a removable hard drive, a magnetic disk, or an optical disk.

[0119] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0120] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0121] In the embodiments provided herein, it should be understood that the disclosed mold ejector pin structure optimization device and method can be implemented in other ways. For example, the mold ejector pin structure optimization device embodiments described above are merely illustrative. For example, the division of modules or units is merely a logical functional division. In actual implementation, other division methods may be used, such as combining or integrating multiple units or components into another system, or ignoring or not implementing certain features. Furthermore, the mutual coupling, direct coupling, or communication connection shown or discussed may be an indirect coupling or communication connection through some interface, device, or unit, and may be electrical, mechanical, or other forms.

[0122] The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0123] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A method for optimizing a mold ejector pin structure, characterized in that: include: Obtain product models and mold models; Determining key areas based on the product model; wherein the key areas include rib areas and easily deformed areas of the product model; Obtaining an ejector pin density heat map according to the product model and the mold model; Determining a pin layout based on the pin density heat map and the key area; wherein the pin layout includes the type, quantity, position, and movement trajectory of the pins; Determining cooling water channel information of the mold model according to the ejector pin layout; wherein the cooling water channel information includes the position and size of the cooling water channel; Obtaining an ejector pin mark area according to the ejector pin layout and the cooling water channel information; wherein the ejector pin mark area refers to an area on the product surface where the ejector pin leaves a mark; The ejector pin layout and the cooling water channel information are adjusted according to the ejector pin trace area.

2. The mold ejector pin structure optimization method according to claim 1, characterized in that: Determining the key areas according to the product model includes: Obtaining vertex coordinates and vertex curvatures of each triangular facet according to the product model; Obtaining a Voronoi diagram according to the vertex coordinates; Obtaining the thickness of each triangle according to the Voronoi diagram; A critical area is determined according to the vertex curvatures and the thicknesses.

3. The mold ejector pin structure optimization method according to claim 2, characterized in that: Determining the key area according to the vertex curvatures and the thicknesses includes: When the vertex curvature is less than a first curvature threshold and the thickness is greater than a first thickness threshold, determining the corresponding triangular facet as the reinforcement rib area; When the vertex curvature is greater than a second curvature threshold or the gradient of the vertex curvature is greater than a gradient threshold, and the thickness is less than a second thickness threshold, the corresponding triangular facet is determined as the easily deformable area.

4. The mold ejector pin structure optimization method according to claim 1, characterized in that: The step of obtaining a ejector pin density heat map according to the product model and the mold model includes: Extracting the normal stress distribution of the contact surface according to the product model and the mold model, and generating a stress cloud map; Obtaining the ejection force requirement of each area in the contact surface according to the stress cloud map; A corresponding ejector pin density is obtained according to each ejector force requirement, and each ejector pin density is mapped to a contact surface to obtain the ejector pin density heat map.

5. The mold ejector pin structure optimization method according to claim 1, characterized in that: Determining the ejector pin layout according to the ejector pin density heat map and the key area includes: Obtaining a low-density area and a high-density area according to the ejector pin density heat map; A pin layout is obtained according to the key area, the low-density area and the high-density area.

6. The mold ejector pin structure optimization method according to claim 5, characterized in that: The step of obtaining a pin layout according to the key area, the low-density area, and the high-density area includes: According to the reinforcing rib region, the low-density region, and the high-density region, a first overlapping region where the contact surface of the low-density region and the reinforcing rib region overlaps, a second overlapping region where the contact surface of the high-density region and the reinforcing rib region overlap, and a first independent region where the contact surface of the reinforcing rib region overlaps with neither the low-density region nor the high-density region; The ejector pin layout is determined according to the first overlapping area, the second overlapping area, and the first independent area.

7. The mold ejector pin structure optimization method according to claim 6, characterized in that: The step of obtaining a pin layout according to the key area, the low-density area, and the high-density area further includes: According to the easily deformable region, the low-density region, and the high-density region, a third overlapping region where the contact surface of the low-density region and the easily deformable region overlaps, a fourth overlapping region where the contact surface of the high-density region and the easily deformable region overlap, and a second independent region where the contact surface of the easily deformable region overlaps with neither the low-density region nor the high-density region; The ejector pin layout is determined according to the third overlapping area, the fourth overlapping area, and the second independent area.

8. The mold ejector pin structure optimization method according to claim 1, characterized in that: The step of determining the cooling water channel information of the mold model according to the ejector pin layout includes: Obtaining a high-temperature area of ​​the mold according to the ejector pin layout; The cooling water channel information is obtained according to the high-temperature area and the positions of the ejector pins in the ejector pin layout.

9. The mold ejector pin structure optimization method according to claim 1, characterized in that: The adjusting the ejector pin layout and the cooling water channel information according to the ejector pin trace area includes: When the wear depth of the ejector pin mark area is greater than the wear threshold, adjusting the ejector pin type; When the area of ​​the ejector pin mark region is smaller than the area threshold, and the temperature of the ejector pin mark region is greater than a first temperature threshold and less than a second temperature threshold, increasing the number of ejector pins; In the case where the ejector pin trace area is offset, adjusting the position of the ejector pin; When the temperature of the ejector mark area is greater than or equal to the second temperature threshold, or the deformation of the ejector mark area is greater than the deformation threshold, adjusting the movement trajectory of the ejector; The cooling water channel information is adjusted according to the adjusted ejector pin layout.

10. The mold ejector pin structure optimization method according to claim 9, characterized in that: The motion trajectory of the ejector includes an ejection speed, an ejection time, and an ejection sequence. When the temperature of the ejector mark area is greater than a second temperature threshold or the deformation of the ejector mark area is greater than a deformation threshold, adjusting the motion trajectory of the ejector includes: When the temperature of the ejector pin mark area is greater than the second temperature threshold, reducing the ejection speed; When the deformation amount of the ejector mark area is greater than the deformation amount threshold, the ejection order is adjusted.

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