Light source packaging structure and matrix vehicle lamp

Abstract

The embodiment of the invention discloses a light source packaging structure. The light source packaging structure comprises a substrate; the number of the chips is multiple, the multiple chips are arranged on one side of the substrate at intervals, and a first interval exists between every two adjacent chips; the plurality of fluorescent diaphragms are arranged, the plurality of fluorescent diaphragms and the plurality of chips are arranged on the sides, far away from the substrate, of the plurality of chips in a one-to-one correspondence manner, and a second interval exists between every two adjacent fluorescent diaphragms; the reflecting layer is positioned in the first interval and is used for reflecting light emitted by the chip; and the blocking layer is positioned in the second interval and is used for preventing mutual crosstalk of light emitted by the chips. The embodiment of the invention further relates to the matrix car lamp. According to the embodiment of the invention, the reflecting layer is arranged between the chips, and the blocking layer is arranged between the fluorescent diaphragms, so that the reflectivity is improved, the mutual crosstalk of light emitted by the chips can be prevented, and the practicability of the light source packaging structure is improved.

Description

Technical Field

[0001] The present invention relates to the field of LED technology, and in particular to a light source packaging structure and a matrix vehicle lamp. Background Art

[0002] With the advancement of automotive intelligence, headlights are evolving from traditional lighting tools and functional safety components to electronic and intelligent technologies, and are likely to become one of the primary drivers of future automotive interaction. Next-generation headlight designs are expected to be brighter, more controllable, and more intelligent, enabling them to be used in a variety of applications. Adaptive Driving Beam (ADB) is an intelligent high-beam system that uses video camera signals to determine the position and distance of oncoming vehicles and adjusts the lighting area accordingly, such as turning off or dimming the lighting in areas near oncoming vehicles to avoid glare. The performance of ADB headlights depends on the number of LED light elements in the integrated LED light source and their resolution. Fewer LED light elements reduce the performance of the intelligent driving lighting function, while larger LED light elements and lower resolution result in reduced precision and effectiveness. Conversely, achieving more intelligent headlights requires more and finer matrix-like segments in the LED light source, as well as a smaller size. Based on the above requirements, the spacing between LED light-emitting units needs to be designed to be closer, but in this way, the crosstalk between the light-emitting units will become more serious, which is not conducive to the design of the headlight lens, and the lighting accuracy and resolution will be worse. Summary of the Invention

[0003] Therefore, in order to overcome at least some of the defects and shortcomings in the prior art, an embodiment of the present invention provides a light source packaging structure and a matrix car light. By setting a reflective layer between the chips and a barrier layer between the fluorescent films, the reflective layer is used to reflect the light emitted by the chip, and the barrier layer is used to prevent the light emitted by the chip from crosstalking with each other. This setting can improve the reflectivity while preventing the light emitted by the chip from crosstalking with each other, thereby improving the practicality of the light source packaging structure.

[0004] On the one hand, an embodiment of the present invention provides a light source packaging structure, for example, including: a substrate; a plurality of chips, wherein the plurality of chips are arranged at intervals on one side of the substrate, and a first spacing exists between two adjacent chips; a plurality of fluorescent diaphragms, wherein the plurality of fluorescent diaphragms are arranged one-to-one with the plurality of chips on a side of the plurality of chips away from the substrate, and a second spacing exists between two adjacent fluorescent diaphragms; a reflective layer, located within the first spacing, for reflecting light emitted by the chips; and a barrier layer, located within the second spacing, for preventing light emitted by the chips from crosstalking with each other.

[0005] In one embodiment of the present invention, the first distance is greater than the second distance.

[0006] In one embodiment of the present invention, the reflective layer includes one or more of a white reflective layer, a metal film layer, or a distributed Bragg reflector layer.

[0007] In one embodiment of the present invention, the barrier layer is a black light-absorbing layer.

[0008] In one embodiment of the present invention, the reflective layer has a concave portion on a side away from the substrate, and the barrier layer has a convex portion on a side close to the substrate corresponding to the concave portion, and the convex portion is located in the concave portion.

[0009] In one embodiment of the present invention, in a direction extending from the substrate toward the fluorescent film, a maximum height of the barrier layer is greater than a thickness of the fluorescent film.

[0010] In one embodiment of the present invention, the barrier layer has a protrusion on a side away from the substrate, the protrusion has a first surface, the fluorescent film has a second surface on a side close to the substrate, and the distance from the first surface to the second surface is greater than the thickness of the fluorescent film.

[0011] In one embodiment of the present invention, the reflective layer and the barrier layer are metal film layers or distributed Bragg reflector layers, and the reflective layer and the barrier layer cover the sides of the chip and the fluorescent film.

[0012] In one embodiment of the present invention, the reflective layer and the barrier layer enclose a receiving space, and a white reflective layer is disposed in the receiving space.

[0013] On the other hand, an embodiment of the present invention provides a matrix vehicle lamp, for example, including: a light source packaging structure as described in any one of the above items.

[0014] As can be seen from the above, the above technical solution has at least one or more of the following beneficial effects:

[0015] In an embodiment of the present invention, a reflective layer is provided between the chips and a barrier layer is provided between the fluorescent films. The reflective layer is used to reflect the light emitted by the chips, and the barrier layer is used to prevent the light emitted by the chips from crosstalking with each other. This arrangement can improve the reflectivity while preventing the light emitted by the chips from crosstalking with each other, thereby improving the practicality of the light source packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0017] Figure 1This is a structural schematic diagram of a first light source packaging structure provided by an embodiment of the present invention.

[0018] Figure 2 This is a structural schematic diagram of a second light source packaging structure provided by an embodiment of the present invention.

[0019] Figure 3 for Figure 1 The schematic diagram of the structure of the first partial light source packaging structure is shown.

[0020] Figure 4 for Figure 1 The diagram shows a structural diagram of a second partial light source packaging structure.

[0021] Figure 5 for Figure 1 The schematic diagram of the structure of the third partial light source packaging structure is shown.

[0022] Figure 6 This is a structural schematic diagram of a third light source packaging structure provided by an embodiment of the present invention.

[0023] Figure 7 for Figure 6 A schematic structural diagram of a portion of a light source packaging structure is shown.

[0024] Figure 8 This is a structural schematic diagram of a fourth light source packaging structure provided by an embodiment of the present invention.

[0025] Figure 9 This is a structural schematic diagram of a fifth light source packaging structure provided by an embodiment of the present invention.

[0026] Figure 10 for Figure 2 A schematic structural diagram of a portion of a light source packaging structure is shown.

[0027] Figure 11 for Figure 2 A schematic structural diagram of another partial light source packaging structure is shown. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts should fall within the scope of protection of the present invention.

[0030] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable where appropriate so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0031] It should also be noted that the division of multiple embodiments in the present invention is only for the convenience of description and should not constitute a special limitation. The features in various embodiments can be combined and referenced to each other without contradiction.

[0032] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a light source package structure 10. The light source package structure 10 is, for example, an LED package structure. Specifically, the light source package structure 10 includes, for example: a substrate 100, a chip 200 (i.e., a light-emitting unit), a fluorescent film 300, a reflective layer 400, and a barrier layer 500.

[0033] Specifically, if Figure 1 and Figure 3 As shown, the substrate 100 is, for example, a ceramic substrate with a circuit. There are multiple chips 200, for example, two or more. The multiple chips 200 are spaced apart on one side of the substrate 100, and there is a first spacing 600 between two adjacent chips 200. The multiple chips 200 are, for example, flip-chip mounted on the substrate 100 in a dense manner. Figure 1 and Figure 5As shown, there are multiple fluorescent films 300, for example, two or more, and the number of fluorescent films 300 is the same as the number of chips 200. The multiple fluorescent films 300 and the multiple chips 200 are arranged on the side of the multiple chips 200 away from the substrate 100 in a one-to-one correspondence, and a second spacing 700 exists between two adjacent fluorescent films 300. Figure 1 and Figure 4 As shown, the reflective layer 400 is located within a first spacing 600 to reflect light emitted by the chip 200. The barrier layer 500 is located within a second spacing 700 to prevent crosstalk between the light emitted by the chips 200. The first spacing 600 is, for example, less than 120 μm, and the second spacing 700 is, for example, less than 180 μm.

[0034] In an embodiment of the present invention, a reflective layer 400 is provided between the chips 200 and a barrier layer 500 is provided between the fluorescent films 300. The reflective layer 400 is used to reflect the light emitted by the chips 200, and the barrier layer 500 is used to prevent the light emitted by the chips 200 from crosstalking with each other. This arrangement can improve the reflectivity while preventing the light emitted by the chips 200 from crosstalking with each other, thereby improving the practicality of the light source packaging structure 10.

[0035] Alternatively, as Figure 1 and Figure 2 As shown, the first spacing 600 is, for example, greater than the second spacing 700. The reflective layer 400 includes, for example, one or more of a white reflective layer, a metal film layer, or a distributed Bragg reflector layer (DBR). The white reflective layer is, for example, white glue, such as a silicone resin mixed colloid containing one or more white substances such as TiO2 (titanium dioxide / titanium oxide), Al2O3 (aluminum oxide), SiO2 (silicon dioxide), BaSO4 (barium sulfate), or CaSO4 (calcium sulfate). The metal film layer is, for example, a metal material containing one or more of Ag (silver), Al (aluminum), Ni (nickel), Cr (chromium), Au (gold), Pt (platinum), Pd (palladium), Sn (tin), W (tungsten), Rh (rhodium), Ir (iridium), Ru (ruthenium), Mg (magnesium), or Zn (zinc). The distributed Bragg reflector layer is, for example, a metal material containing SiO2 (silicon dioxide), SiN (silicon nitride), SiO x N yThe reflective layer 400 is filled in the first gap 600 between two adjacent chips 200 to increase the reflectivity, thereby increasing the brightness of the light emitted by the chips 200 and improving their practicality.

[0036] Specifically, if Figure 1 As shown, in one embodiment of the present invention, a white reflective layer is filled in the first spacing 600 between two adjacent chips 200, and a barrier layer is provided in the second spacing 700 between two adjacent fluorescent films 300. The barrier layer 500 is, for example, a black light-absorbing layer. The black light-absorbing layer is, for example, a black glue, such as a silicone resin mixed colloid containing one or more black substances such as graphite, carbon powder, iron powder, FeS (ferrous sulfide), CuS (copper sulfide), CuO (copper oxide), MnO2 (manganese dioxide) or Fe3O4 (ferroferric oxide). For example, as Figure 1 and Figure 4 As shown, the space between two adjacent chips 200, i.e., the first spacing 600, is entirely filled with white glue. The white glue can improve the reflectivity, i.e., increase the luminous brightness of the chip 200; the space between two adjacent fluorescent films 300, i.e., the second spacing 700, is entirely filled with black glue. The black glue has the function of absorbing light. The black glue is arranged between the fluorescent films 300 to prevent the light emitted by the chips 200 from crosstalking with each other. The black glue and the white glue are filled, for example, by dispensing or molding. White glue is arranged between two adjacent chips 200, and black glue is arranged between two adjacent fluorescent films 300. This arrangement can effectively prevent crosstalk while improving the reflectivity, thereby improving the practicality of the light source packaging structure 10.

[0037] Alternatively, as Figure 6 and Figure 7As shown, the reflective layer 400 has a recessed portion 410 on the side away from the substrate 100, and a raised portion 520 is provided on the side of the barrier layer 500 close to the substrate 100, corresponding to the recessed portion 410. The raised portion 520 is located within the recessed portion 410. For example, the reflective layer 400 has a recessed portion 410 formed near the center of the side away from the substrate 100. When the barrier layer 500 is filled, the barrier layer 500 is disposed within the recessed portion 410, i.e., the barrier layer 500 has a raised portion 520 formed corresponding to the recessed portion 410. The arrangement of the recessed portion 410 and the raised portion 520 causes the side of the barrier layer 500 close to the substrate 100 to protrude beyond the surface of the fluorescent film 300 close to the substrate 100. This arrangement improves the anti-crosstalk effect without affecting the reflective effect of the reflective layer 400, thereby enhancing the practicality of the light source package structure 10.

[0038] like Figure 8 and Figure 9 As shown, in the direction extending from the substrate 100 toward the fluorescent film 300, the maximum height of the barrier layer 500 is greater than the thickness of the fluorescent film 300. Specifically, the barrier layer 500 has a protrusion 510 on the side away from the substrate 100, and the protrusion 510 has a first surface 511. The fluorescent film 300 has a second surface 310 on the side close to the substrate 100. The distance from the first surface 511 to the second surface 310 is greater than the thickness of the fluorescent film 300. This arrangement can enhance the anti-crosstalk effect without affecting the reflective effect of the reflective layer 400, thereby improving the practicality of the light source packaging structure 10. Optionally, the first surface 511 is, for example, arc-shaped, or the first surface 511 is parallel to the second surface 310. The protrusion 510 can have a variety of shapes, which are not limited here.

[0039] like Figure 10 and Figure 11 As shown, in another embodiment of the present invention, the reflective layer 400 and the barrier layer 500 are, for example, metal film layers or distributed Bragg reflector layers. The reflective layer 400 and the barrier layer 500 cover the sides of the chip 200 and the fluorescent film 300. The thickness of the metal film layer or the distributed Bragg reflector layer is less than 5 μm. Specifically, as Figure 2 and Figure 11As shown, the reflective layer 400 and the barrier layer 500 enclose a housing space 800, and a white reflective layer is provided in the housing space 800. For example, the fluorescent film 300 covers the side of the chip 200 away from the substrate 100, and a metal film layer or a distributed Bragg reflector layer is plated on the sides of the chip 200 and the fluorescent film 300. The metal film layer or the distributed Bragg reflector layer can improve the reflectivity and also prevent crosstalk. After the metal film layer or the distributed Bragg reflector layer is plated on the sides of the chip 200 and the fluorescent film 300, the metal film layer or the distributed Bragg reflector layer can enclose a housing space 800, and the housing space 800 is filled with a white reflective layer, i.e., white glue, to improve the luminous effect of the chip 200. This configuration involves coating the sides of the chip 200 and the fluorescent film 300 with a metal film layer or a distributed Bragg reflector layer, and then filling the accommodating space 800 enclosed by the metal film layer or the distributed Bragg reflector layer with a white reflective layer, i.e., white glue. This improves reflectivity while also effectively preventing crosstalk, thereby enhancing the practicality of the light source package structure 10. Of course, the accommodating space 800 can also be filled with a black light-absorbing layer, i.e., black glue, without limitation.

[0040] An embodiment of the present invention further provides a matrix vehicle lamp, comprising the aforementioned light source packaging structure 10 .

[0041] An embodiment of the present invention further provides a light source packaging method for manufacturing the aforementioned light source packaging structure 10. The light source packaging method includes, for example:

[0042] S1: Provide a substrate 100;

[0043] S2: Fix the chip 200; a plurality of chips 200 are provided, and the plurality of chips 200 are spaced apart and arranged on one side of the substrate 100, with a first distance 600 existing between two adjacent chips 200;

[0044] S3: Covering the fluorescent film 300; a plurality of fluorescent films 300 are provided, and the plurality of fluorescent films 300 are arranged on a side of the plurality of chips 200 away from the substrate 100 in a one-to-one correspondence, and a second distance 700 exists between two adjacent fluorescent films 300;

[0045] S4: forming a barrier; the barrier includes a reflective layer 400 located within the first interval 600 and a barrier layer 500 located within the second interval 700 .

[0046] Specifically, in one implementation of the present embodiment, step S4 specifically includes step S41: filling the reflective layer 400 within the first spacing 600, and the reflective layer 400 is a white reflective layer 400. Step S3 is specifically step S31: after forming the reflective layer 400, covering the chip 200 and the reflective layer 400 on the side away from the substrate 100 with the fluorescent film 300. Step S4 specifically also includes step S42: after covering the fluorescent film 300, filling the barrier layer 500 within the second spacing 700, and the barrier layer 500 is a black light-absorbing layer. In this implementation, the specific step sequence of the light source packaging method is: step S1, step S2, step S41, step S31 and step S42. For example, first, as Figure 3 As shown, on a substrate 100 designed with a circuit, multiple chips 200 are flip-chip mounted in a dense manner, with a first spacing 600 between two adjacent chips 200; then, as shown in FIG. Figure 4 As shown, the reflective layer 400 is filled in the first spacing 600 by dispensing or molding; then, as shown Figure 5 As shown, the side of the chip 200 away from the substrate 100 is covered with a fluorescent film 300, and a second distance 700 is provided between two adjacent fluorescent films 300; finally, as shown in FIG. Figure 1 As shown, the barrier layer 500 is filled within the second spacing 700 by dispensing or molding. The reflective layer 400 is, for example, white glue, and the barrier layer 500 is, for example, black glue. This arrangement improves reflectivity while preventing crosstalk between the light emitted by the chips 200, thereby enhancing the practicality of the light source package structure 10.

[0047] Furthermore, in another implementation of this embodiment, step S3 is specifically step S32: covering the fluorescent film 300 on the side of the chip 200 away from the substrate 100. Step S4 is specifically: coating the side of the chip 200 and the fluorescent film 300 with a reflective layer 400 and a barrier layer 500, and the reflective layer 400 and the barrier layer 500 are metal film layers or distributed Bragg reflector layers. In this embodiment, the specific steps of the light source packaging method are as follows: step S1, step S2, step S32 and step S4. For example, if Figure 10 As shown, first, on a substrate 100 designed with a circuit, multiple chips 200 are flip-chipped in a dense manner, with a first spacing of 600 between two adjacent chips 200; then, a fluorescent film 300 is covered on the side of the chip 200 away from the substrate 100, with a second spacing of 700 between two adjacent fluorescent films 300; then, as shown in FIG. Figure 11 As shown, a reflective layer 400 and a barrier layer 500 are plated on the sides of the chip 200 and the fluorescent film 300, wherein the reflective layer 400 and the barrier layer 500 are, for example, metal film layers or distributed Bragg reflector layers; finally, as shown Figure 2As shown, a white reflective layer is filled into the accommodation space 800 formed by the reflective layer 400 and the barrier layer 500 by dispensing or molding. Alternatively, a black light-absorbing layer can be filled into the accommodation space 800 by dispensing or molding, without limitation. This arrangement improves reflectivity while preventing crosstalk between the light emitted by the chips 200, thereby enhancing the practicality of the light source package structure 10.

[0048] In an embodiment of the present invention, a reflective layer 400 is provided between the chips 200 and a barrier layer 500 is provided between the fluorescent films 300. The reflective layer 400 is used to reflect the light emitted by the chips 200, and the barrier layer 500 is used to prevent the light emitted by the chips 200 from crosstalking with each other. This arrangement can improve the reflectivity while preventing the light emitted by the chips 200 from crosstalking with each other, thereby improving the practicality of the light source packaging structure 10.

[0049] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment, it is not intended to limit the present invention. Any technician familiar with the present profession can make some changes or modifications to equivalent embodiments of equivalent changes using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A light source packaging structure, characterized in that: include: substrate; There are multiple chips, and the multiple chips are spaced apart and arranged on one side of the substrate, with a first distance between two adjacent chips; There are multiple fluorescent films, each of which corresponds to the multiple chips and is arranged on a side of the multiple chips away from the substrate, with a second distance between two adjacent fluorescent films. a reflective layer, located within the first spacing, and configured to reflect light emitted by the chip; The barrier layer is located within the second interval and is used to prevent the light emitted by the chips from crosstalking with each other.

2. The light source packaging structure according to claim 1, wherein: The first spacing is greater than the second spacing.

3. The light source packaging structure according to claim 1, wherein: The reflective layer includes one or more of a white reflective layer, a metal film layer, and a distributed Bragg reflector layer.

4. The light source packaging structure according to claim 1, wherein: The barrier layer is a black light-absorbing layer.

5. The light source packaging structure according to claim 4, wherein: The reflective layer has a concave portion on a side away from the substrate, and the barrier layer has a convex portion on a side close to the substrate corresponding to the concave portion, and the convex portion is located in the concave portion.

6. The light source packaging structure according to claim 4, wherein: In a direction extending from the substrate toward the fluorescent film, a maximum height of the barrier layer is greater than a thickness of the fluorescent film.

7. The light source packaging structure according to claim 6, wherein: The barrier layer has a protrusion on a side away from the substrate, the protrusion has a first surface, the fluorescent film has a second surface on a side close to the substrate, and the distance from the first surface to the second surface is greater than the thickness of the fluorescent film.

8. The light source packaging structure according to claim 1, wherein: The reflective layer and the barrier layer are metal film layers or distributed Bragg reflector layers, and the reflective layer and the barrier layer cover the sides of the chip and the fluorescent film.

9. The light source packaging structure according to claim 8, wherein: The reflective layer and the barrier layer enclose a containing space, and a white reflective layer is arranged in the containing space.

10. A matrix car light, characterized in that: include: The light source packaging structure according to any one of claims 1 to 9.

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