Wafer uniform electroplating equipment

Abstract

The invention relates to the technical field of electroplating equipment, in particular to wafer uniform electroplating equipment which comprises a wafer moving mechanism arranged on the ground, a mounting plate is arranged on the wafer moving mechanism, a wafer clamping mechanism is arranged on the mounting plate, and a driven turnover mechanism is arranged between the mounting plate and the wafer moving mechanism. An electroplating pool is arranged at one end of the wafer moving mechanism, a wafer cleaning mechanism is arranged at the other end of the wafer moving mechanism, a collecting barrel is arranged below the wafer cleaning mechanism, the wafer moving mechanism can drive a wafer to lift and translate, and the wafer clamping mechanism can clamp the wafer and drive the wafer to rotate. The driven turnover mechanism can change the orientation of the wafer, and the wafer cleaning mechanism can clean the surface of the electroplated wafer. According to the wafer cleaning device, electroplated wafers can be directly moved to the lower portion of the wafer cleaning mechanism to be cleaned, the cleaning steps are concentrated, and the efficiency is high.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electroplating equipment, in particular to a wafer uniform electroplating equipment. BACKGROUND

[0002] High-purity polysilicon is dissolved and incorporated into silicon crystal seeds, slowly pulled out, and forms a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, which is the production process of the wafer. Silicon wafer is a typical representative of semiconductor materials. Silicon wafer still needs to be electroplated after being made into silicon wafer.

[0003] The wafer electroplating equipment in the prior art cannot continuously clean the residual electroplating solution on the wafer after electroplating, and the wafer also needs to be transferred. The subsequent multiple steps of cleaning the wafer are not concentrated enough, and the cleaning efficiency is low. SUMMARY

[0004] The purpose of the present application is to provide a wafer uniform electroplating equipment to solve the problems in the background art. To achieve the above purpose, the present application provides the following technical scheme: A wafer uniform electroplating equipment, comprising a wafer moving mechanism arranged on the ground, an installation plate arranged on the wafer moving mechanism, a wafer clamping mechanism arranged on the installation plate, a driven overturning mechanism arranged between the installation plate and the wafer moving mechanism, an electroplating tank arranged at one end of the wafer moving mechanism, a wafer cleaning mechanism arranged at the other end of the wafer moving mechanism, and a collection barrel arranged below the wafer cleaning mechanism. The wafer moving mechanism can drive the wafer to lift and translate, the wafer clamping mechanism can clamp the wafer and drive the wafer to rotate, the driven overturning mechanism can change the orientation of the wafer, and the wafer cleaning mechanism can clean the surface of the electroplated wafer.

[0005] Preferably, the wafer moving mechanism comprises two fixed supports arranged symmetrically on the ground, an L-shaped plate is fixedly connected to each of the fixed supports, an L-shaped sliding groove is formed in the L-shaped plate, a connecting frame is arranged between the two L-shaped plates, the installation plate is rotatably connected to the connecting frame, two connecting shafts are fixedly connected to the connecting frame symmetrically, the two connecting shafts are slidably connected in the two L-shaped sliding grooves respectively, a linear motor is arranged on each of the fixed supports, a connecting block is fixedly connected to the moving part of each linear motor, a connecting rod one is rotatably connected to the connecting block, the connecting rod one is rotatably connected to the connecting shaft on the same side, an angle maintaining assembly is arranged between the L-shaped plate and the connecting frame, and the angle maintaining assembly can keep the connecting frame always vertical.

[0006] Preferably, the angle retaining assembly comprises a slide rail fixedly connected to the L-shaped plate, a movable block slidably connected to the slide rail, a limiting rod fixedly connected to the movable block, the limiting rod being located directly above the connecting shaft, and two waist round through holes symmetrically formed in the connecting frame, the limiting rod being slidably connected to the waist round through hole on the same side.

[0007] Preferably, the wafer clamping mechanism comprises a fixed plate fixedly connected to the mounting plate, a drive motor one fixedly connected to the fixed plate, a rotating support rotatably connected to the mounting plate, the top end of the rotating support being fixedly connected to the output shaft of the drive motor one, four clamping claws uniformly slidably connected to the rotating support, an extension strip fixedly connected to the clamping claw, an elastic telescopic guide rod fixedly connected to the end of the extension strip, a circular block fixedly connected to the mounting plate, an inner ring groove and an outer ring groove formed in the circular block, four inclined grooves uniformly formed in the circular block, the inclined grooves being in communication with the inner ring groove and the outer ring groove, a one-way guide block one fixedly connected to the intersection of the inner ring groove and the inclined groove, a one-way guide block two fixedly connected to the intersection of the outer ring groove and the inclined groove, and the elastic telescopic guide rod being slidably connected to the inner ring groove.

[0008] Preferably, the driven overturning mechanism comprises two long strip plates, the two long strip plates being symmetrically fixedly connected to the two fixed supports, a guide groove one being formed in the long strip plate, two connecting rods two symmetrically fixedly connected to the mounting plate, a driven guide rod fixedly connected to the end of the connecting rod two, and the driven guide rod being slidably connected to the guide groove one.

[0009] Preferably, the wafer cleaning mechanism comprises a connecting support fixedly connected to the fixed support, a spraying box fixedly connected to the lower end of the connecting support, a partition plate being arranged in the spraying box to divide the spraying box into four chambers, a liquid inlet being arranged above each of the chambers, a plurality of atomizing nozzles being arranged below three of the chambers, the liquid inlet above the three chambers being connected to an acid cleaning liquid, an alkaline cleaning liquid and a chelating agent through pipelines, a plurality of shower nozzles being arranged below the last chamber, a pulse generating assembly being arranged above the liquid inlet of the shower nozzles, the pulse generating assembly being connected to pure water through a pipeline, and the connecting support being further provided with a driving assembly connected to the pulse generating assembly.

[0010] Preferably, the pulse generating assembly comprises a communication pipe fixedly connected to the liquid inlet, a swing shaft rotatably connected to the communication pipe, two sealing plates fixedly connected to the swing shaft in a symmetrical manner, a swing rod fixedly connected to the swing shaft, a movable guide rod slidably connected to the swing rod, a guide transverse groove fixedly connected to the communication pipe, one end of the movable guide rod slidably connected in the guide transverse groove, a connecting plate fixedly connected to the spraying box, a sliding support slidably connected to the connecting plate, a flat plate fixedly connected to the sliding support, a guide groove two formed in the flat plate, the other end of the movable guide rod slidably connected in the guide groove two, a spring one connected between the flat plate and the connecting plate, a cylinder rotatably connected to the connecting plate, a guide groove three formed in the cylinder, a fixed guide rod fixedly connected to the sliding support, the fixed guide rod slidably connected in the guide groove three, a connecting head one slidably connected to the upper end of the cylinder, a baffle fixedly connected to the upper end of the cylinder, and a spring two connected between the connecting head one and the baffle.

[0011] Preferably, the driving assembly comprises a driving motor two fixedly connected to the connecting support, a rotating shaft one, a rotating shaft two and a rotating shaft three rotatably connected to the connecting support, the top end of the rotating shaft one fixedly connected to the output shaft of the driving motor two, a straight gear fixedly connected to the rotating shaft one, an inner gear ring fixedly connected to the rotating shaft two, the straight gear engaged with the inner gear ring, an eccentric lever fixedly connected to the rotating shaft two, eight slot openings uniformly formed in the driven disc fixedly connected to the rotating shaft three, the eccentric lever entering one of the slot openings during rotation, the driven disc being driven to rotate one-eighth of a circle for each rotation of the eccentric lever, a ring cylinder fixedly connected to the rotating shaft three, a guide groove four formed in the outer wall of the ring cylinder, a connecting head two slidably connected to the lower end of the rotating shaft one, a driven support rotatably connected to the connecting head two, the driven support slidably connected to the connecting plate, and the end of the driven support slidably connected in the guide groove four.

[0012] Compared with the prior art, the present application has the following advantages: In the present application, after electroplating, the wafer can be directly moved to the wafer cleaning mechanism, and the wafer surface after electroplating is cleaned by introducing pure water, acidic cleaning solution, alkaline cleaning solution and chelating agent to remove the residual solution and impurities on the wafer surface. The steps are concentrated, the efficiency is high, and with the change of the cleaning steps, the spraying mode of pure water can be switched, the use of pure water can be saved while ensuring the cleaning effect.

[0013] In the application, the position of the sliding support is not locked when the cylinder stops rotating, so that the spring II can push the flat plate to the top end, and the communication pipe is always kept in an open state in the non-pulse spraying state, which does not affect the flow of pure water at other times.

[0014] In the application, the wafer clamping mechanism is arranged to drive the wafer to rotate, which can improve the uniformity of wafer electroplating during electroplating, and can uniformly distribute various sprayed liquids on the wafer surface during wafer cleaning, and can spin dry the wafer by driving the wafer to rotate quickly after wafer cleaning is completed, and the clamping and releasing of the wafer can be controlled by changing the rotating direction of the driving motor I, which is simple to operate and convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the application; Figure 2 It is a schematic diagram of the structure of the wafer moving mechanism and the driven overturning mechanism in the application; Figure 3 It is a schematic diagram of the structure of the wafer clamping mechanism in the application Figure 1 ; Figure 4 It is a schematic diagram of the structure of the wafer clamping mechanism in the application Figure 2 ; Figure 5 It is a schematic diagram of the structure of the wafer cleaning mechanism in the application Figure 1 ; Figure 6 It is a schematic diagram of the structure of the wafer cleaning mechanism in the application Figure 2 ; Figure 7 It is a schematic diagram of the structure of the wafer cleaning mechanism in the application Figure 3 ; Figure 8 It is a schematic diagram of the structure of the wafer cleaning mechanism in the application Figure 7 ; Figure 9 It is an exploded structural schematic diagram of the wafer cleaning mechanism in the application.

[0016] In the figure: 1, wafer moving mechanism; 101, fixed support; 102, L-shaped plate; 103, L-shaped sliding groove; 104, connecting frame; 1041, waist round through hole; 105, connecting shaft; 106, linear motor; 107, connecting block; 108, connecting rod one; 109, angle maintaining assembly; 1091, sliding rail; 1092, movable block; 1093, limiting rod; 2, mounting plate; 3, wafer clamping mechanism; 301, fixed plate; 302, driving motor one; 303, rotating support; 304, clamping claw; 305, extension strip plate; 306, elastic telescopic guide rod; 307, round block; 3071, inner ring groove; 3072, outer ring groove; 3073, inclined groove; 308, one-way guide block one; 309, one-way guide block two; 4, driven overturning mechanism; 401, long strip plate; 402, guide groove one; 403, connecting rod two; 404, driven guide rod; 5, electroplating tank; 6, wafer cleaning mechanism; 601, connecting support; 602, spraying box; 603, liquid inlet; 604, atomizing nozzle; 605, shower nozzle; 606, pulse generating assembly; 6061, communication pipe; 6062, swing shaft; 6063, sealing plate; 6064, swing rod; 6065, movable guide rod; 6066, guide cross groove; 6067, connecting plate; 6068, sliding support; 6069, flat plate; 60610, guide groove two; 60611, spring one; 60612, cylinder; 60613, guide groove three; 60614, fixed guide rod; 60615, connecting head one; 60616, baffle; 60617, spring two; 607, driving assembly; 6071, driving motor two; 6072, rotating shaft one; 6073, rotating shaft two; 6074, rotating shaft three; 6075, straight gear; 6076, inner ring gear; 6077, eccentric lever; 6078, driven disc; 6079, notch; 60710, ring cylinder; 60711, guide groove four; 60712, connecting head two; 60713, driven support; 7, collection barrel. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0018] Please refer to Figures 1 to 9 The present application provides a technical solution: A kind of wafer uniform electroplating equipment, including the wafer moving mechanism 1 being set on ground, installation plate 2 is provided on the wafer moving mechanism 1, wafer clamping mechanism 3 is provided on the installation plate 2, driven turnover mechanism 4 is provided between the installation plate 2 and wafer moving mechanism 1, one end of wafer moving mechanism 1 is provided with electroplating cell 5, wafer cleaning mechanism 6 is provided on the other end of wafer moving mechanism 1, collection barrel 7 is provided below wafer cleaning mechanism 6, wafer moving mechanism 1 can drive wafer to lift and translate, wafer clamping mechanism 3 can clamp wafer and drive wafer to rotate, driven turnover mechanism 4 can change the orientation of wafer, wafer cleaning mechanism 6 can clean the surface of wafer after electroplating.

[0019] In the embodiment, the wafer moving mechanism 1 includes two fixed supports 101 symmetrically arranged on the ground, one L-shaped plate 102 is fixedly connected to each of the fixed supports 101, an L-shaped sliding groove 103 is formed in the L-shaped plate 102, a connecting frame 104 is arranged between the two L-shaped plates 102, the installation plate 2 is rotatably connected to the connecting frame 104, two connecting shafts 105 are fixedly connected to the connecting frame 104 symmetrically, the two connecting shafts 105 are slidably connected in the two L-shaped sliding grooves 103 respectively, a linear motor 106 is arranged on each of the fixed supports 101, a connecting block 107 is fixedly connected to the rotor of the linear motor 106, a connecting rod 108 is rotatably connected to the connecting block 107, the connecting rod 108 is rotatably connected to the connecting shaft 105 on the same side, an angle maintaining assembly 109 is arranged between the L-shaped plate 102 and the connecting frame 104, and the connecting frame 104 can be always kept vertical by the angle maintaining assembly 109.

[0020] In the embodiment, the angle maintaining assembly 109 includes a sliding rail 1091 fixedly connected to the L-shaped plate 102, a movable block 1092 is slidably connected to the sliding rail 1091, a limiting rod 1093 is fixedly connected to the movable block 1092, the limiting rod 1093 is located directly above the connecting shaft 105, two waist round through holes 1041 are formed in the connecting frame 104 symmetrically, and the limiting rod 1093 is slidably connected in the waist round through hole 1041 on the same side.

[0021] In the embodiment, the wafer clamping mechanism 3 comprises a fixed plate 301 fixedly connected to the mounting plate 2, a drive motor 302 fixedly connected to the fixed plate 301, a rotating support 303 rotatably connected to the mounting plate 2, the top end of the rotating support 303 is fixedly connected to the output shaft of the drive motor 302, four clamping claws 304 are uniformly and slidably connected to the rotating support 303, extension strips 305 are fixedly connected to the clamping claws 304, elastic telescopic guide rods 306 are fixedly connected to the ends of the extension strips 305, a circular block 307 is fixedly connected to the mounting plate 2, an inner ring groove 3071 and an outer ring groove 3072 are formed in the circular block 307, four inclined grooves 3073 are uniformly formed in the circular block 307, the inclined grooves 3073 communicate the inner ring groove 3071 and the outer ring groove 3072, one-way guide blocks one 308 are fixedly connected to the intersection of the inner ring groove 3071 and the inclined grooves 3073, one-way guide blocks two 309 are fixedly connected to the intersection of the outer ring groove 3072 and the inclined grooves 3073, and the elastic telescopic guide rods 306 are slidably connected in the inner ring groove 3071. It should be noted that when the elastic telescopic guide rods 306 rotate, they are blocked by the one-way guide blocks one 308, the elastic telescopic guide rods 306 are guided by the one-way guide blocks one 308 to enter the outer ring groove 3072 from the inner ring groove 3071 through the inclined grooves 3073, when the elastic telescopic guide rods 306 pass through the one-way guide blocks two 309, they are contracted due to the pressure of the one-way guide blocks two 309, which enables the elastic telescopic guide rods 306 to continue to move through the one-way guide blocks two 309, and vice versa, when the elastic telescopic guide rods 306 rotate, they are blocked by the one-way guide blocks two 309, the elastic telescopic guide rods 306 enter the inner ring groove 3071, when the elastic telescopic guide rods 306 are in the outer ring groove 3072, the clamping claws 304 are in the clamping state, and when the elastic telescopic guide rods 306 are in the inner ring groove 3071, the clamping claws 304 are in the open state.

[0022] In the embodiment, the driven overturning mechanism 4 comprises two long strips 401, the two long strips 401 are fixedly connected to the two fixed supports 101 in a symmetrical manner, a guide groove one 402 is formed in each of the long strips 401, two connecting rods two 403 are fixedly connected to the mounting plate 2 in a symmetrical manner, driven guide rods 404 are fixedly connected to the ends of the connecting rods two 403, and the driven guide rods 404 are slidably connected in the guide grooves one 402. It should be noted that the movement of the driven guide rods 404 in the guide grooves one 402 drives the mounting plate 2 to upside down and overturn 180 degrees.

[0023] In this embodiment, the wafer cleaning mechanism 6 includes a connecting bracket 601 fixedly connected to the fixed bracket 101, and a spray box 602 is fixedly connected to the lower end of the connecting bracket 601. The spray box 602 is provided with a partition to divide it into four chambers, and a liquid inlet 603 is provided above each of the chambers, wherein a plurality of atomizing nozzles 604 are provided below three of the chambers, and the liquid inlets 603 above the three chambers are respectively introduced into the acidic cleaning liquid, alkaline cleaning liquid and chelating agent through pipes, and a plurality of spray nozzles 605 are provided below the last chamber, and a pulse generating component 606 is provided on the liquid inlet 603 above the spray nozzle 605, and pure water is introduced into the pulse generating component 606 through a pipe. The connecting bracket 601 is also provided with a driving component 607, and the driving component 607 is connected to the pulse generating component 606. It should be noted that: the acidic cleaning solution is used to dissolve metal oxides, usually dilute sulfuric acid or hydrochloric acid, the alkaline cleaning solution is used to remove residual organic additives, usually ammonia water, and the chelating agent is used to complex metal ions, usually EDTA. The acidic cleaning solution, alkaline cleaning solution and chelating agent are sprayed outward using an atomizing nozzle 604, which can effectively reduce the use of these solvents while ensuring the coverage effect, and can save the cost of use. Pure water is sprayed outward using a spray nozzle 605, which can ensure the flushing of materials on the wafer surface through a larger flow rate to ensure the cleaning effect.

[0024] In the embodiment, the pulse generating assembly 606 comprises a communicating pipe 6061 fixedly connected to the liquid inlet 603, an oscillating shaft 6062 rotatably connected to the communicating pipe 6061, two sealing plates 6063 fixedly connected to the oscillating shaft 6062 in a symmetrical manner, a swing rod 6064 fixedly connected to the oscillating shaft 6062, a movable guide rod 6065 slidably connected to the swing rod 6064, a guide transverse groove 6066 fixedly connected to the communicating pipe 6061, one end of the movable guide rod 6065 slidably connected in the guide transverse groove 6066, a connecting plate 6067 fixedly connected to the spraying box 602, a sliding support 6068 slidably connected to the connecting plate 6067, a flat plate 6069 fixedly connected to the sliding support 6068, a guide groove two 60610 formed in the flat plate 6069, the other end of the movable guide rod 6065 slidably connected in the guide groove two 60610, a spring one 60611 connected between the flat plate 6069 and the connecting plate 6067, a cylinder 60612 rotatably connected to the connecting plate 6067, a guide groove three 60613 formed in the cylinder 60612, a fixed guide rod 60614 fixedly connected to the sliding support 6068 and slidably connected in the guide groove three 60613, a connecting head one 60615 slidably connected to the upper end of the cylinder 60612, a baffle 60616 fixedly connected to the upper end of the cylinder 60612, and a spring two 60617 connected between the connecting head one 60615 and the baffle 60616. It should be noted that when the flat plate 6069 moves up and down, the oscillating shaft 6062 will be driven to reciprocate, and the oscillating shaft 6062 will remain stationary for a period of time between reciprocation, which makes the sealing plate 6063 intermittently close and open the communicating pipe 6061, so that the continuously input pure water can be sprayed in the form of pulse spray, which can effectively reduce the water consumption and will not reduce the flushing effect too much. When the connecting head one 60615 and the connecting head two 60712 are disconnected, the guide groove three 60613 cannot lock the position of the sliding support 6068, which makes the flat plate 6069 move to the uppermost end under the pushing of the spring two 60617, so as to ensure that the sealing plate 6063 will not close the communicating pipe 6061 and will not affect the flow of pure water at other times.

[0025] In the embodiment, the driving assembly 607 comprises a driving motor two 6071 fixedly connected to the connecting support 601, a rotating shaft one 6072, a rotating shaft two 6073 and a rotating shaft three 6074 rotatably connected to the connecting support 601, the top end of the rotating shaft one 6072 is fixedly connected with the output shaft of the driving motor two 6071, a straight gear 6075 is fixedly connected to the rotating shaft one 6072, an inner gear ring 6076 is fixedly connected to the rotating shaft two 6073, the straight gear 6075 is engaged with the inner gear ring 6076, an eccentric lever 6077 is further fixedly connected to the rotating shaft two 6073, a driven disc 6078 is fixedly connected to the rotating shaft three 6074, eight slots 6079 are uniformly formed in the driven disc 6078, the eccentric lever 6077 will enter one of the slots 6079 in the rotating process, the driven disc 6078 will be driven to rotate one eighth of a circle every one revolution of the eccentric lever 6077, a ring cylinder 60710 is further fixedly connected to the rotating shaft three 6074, a guide slot four 60711 is formed in the outer wall of the ring cylinder 60710, a connecting head two 60712 is slidably connected to the lower end of the rotating shaft one 6072, a driven support 60713 is rotatably connected to the connecting head two 60712, the driven support 60713 is further slidably connected to the connecting plate 6067, and the end portion of the driven support 60713 is slidably connected in the guide slot four 60711. It should be noted that when the pulse is not used, the guide slot four 60711 will drive the connecting head one 60615 and the connecting head two 60712 to separate, thereby reducing the abrasion of the sealing plate 6063 during back and forth rotation and prolonging the service life.

[0026] The wafer uniform electroplating equipment works as follows during work: The linear motor 106 is started, and the linear motor 106 mover moves to the electroplating tank 5 direction, the linear motor 106 mover will push the connecting shaft 105 and the connecting frame 104 to move along the L-shaped sliding groove 103 through the connecting block 107 and the connecting rod one 108; When the connecting frame 104 moves horizontally, the mounting plate 2 on the connecting frame 104 will also translate, and the mounting plate 2 will drive the driven guide rod 404 to move along the guide slot one 402 through the connecting rod two 403, when the driven guide rod 404 moves to the lowest point of the concave position of the guide slot one 402, the connecting rod two 403 is just vertical, and then the movement of the mounting plate 2 will become pulling the driven guide rod 404 to move along the guide slot one 402, the movement of the driven guide rod 404 from the front of the mounting plate 2 to the rear of the mounting plate 2 will drive the mounting plate 2 to turn over 180 degrees through the connecting rod two 403, so that the wafer is turned over from upward to downward; After the wafer is turned upside down, the linear motor 106 mover drives the connecting frame 104 and the mounting plate 2 to continue to translate, and when the connecting shaft 105 moves to the inflection point of the L-shaped sliding groove 103, the movement of the linear motor 106 mover will push the connecting shaft 105 and the connecting frame 104 to move downward through the connecting block 107 and the connecting rod I 108, and when the connecting rod I 108 becomes vertical, the linear motor 106 is turned off, at which time the surface of the wafer to be electroplated is immersed in the electroplating solution in the electroplating tank 5; Then the driving motor I 302 is started and rotates forward, which drives the rotating support 303 fixedly connected thereto to rotate, and the rotating support 303 drives the clamping jaw 304 and the wafer to rotate, and the extension strip plate 305 and the elastic telescopic guide rod 306 connected to the clamping jaw 304 are also driven to rotate, at this time the elastic telescopic guide rod 306 rotates in a direction that enables it to pass through the one-way guide block I 308, thereby enabling the elastic telescopic guide rod 306 to rotate along the inner ring groove 3071, and enabling the clamping jaw 304 to always maintain a clamping state, and enabling the wafer to be electrified for a period of time during the rotation of the wafer, thereby completing the electroplating of the wafer, and after the electroplating is completed, the driving motor I 302 is turned off. Then the linear motor 106 mover is reversely translated to reset, the wafer is turned upside down and finally moved to the lower side of the spraying box 602, the driving motor II 6071 is started, which drives the rotating shaft I 6072 connected thereto to rotate, the rotating shaft I 6072 drives the rotating shaft II 6073 to rotate through the meshing inner ring gear 6076 and spur gear 6075, and due to the transmission ratio between the inner ring gear 6076 and the spur gear 6075, the rotating shaft I 6072 rotates a certain number of turns to make the rotating shaft II 6073 rotate one turn, and the rotating shaft II 6073 rotates one turn each time to drive the driven disc 6078 and the rotating shaft III 6074 to rotate one-eighth of a turn through the eccentric lever 6077, and at the same time the driving motor I 302 is started and rotates forward to drive the wafer to rotate. When the driving motor II 6071 is just started, no liquid is introduced into the spraying box 602, and when the driven disc 6078 and the rotating shaft III 6074 rotate for the first time, pure water is introduced into the communication pipe 6061 through the pipeline, and then introduced into the spraying box 602 through the communication pipe 6061, and the pure water is sprayed downward through the plurality of spray nozzles 605 on the spraying box 602, and the water flow sprayed onto the surface of the wafer can wash away the residual electroplating solution on the surface of the wafer, and before the driven disc 6078 and the rotating shaft III 6074 are about to rotate again, the introduction of pure water into the spraying box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 are rotated for the second time, the acid cleaning solution is introduced into the spray box 602 through the pipeline, and the acid cleaning solution is sprayed downward by the atomizing nozzles 604 on the spray box 602 to uniformly disperse on the surface of the rotating wafer, and reacts with the metal oxides on the wafer surface to dissolve them. Before the driven disc 6078 and the rotating shaft three 6074 are rotated for the next time, the introduction of the pure water acid cleaning solution into the spray box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 are rotated for the third time, the pure water is introduced into the spray box 602 again, and the water flow sprayed by the spray box 602 at this time is used to flush away the acid cleaning solution on the wafer surface. Before the driven disc 6078 and the rotating shaft three 6074 are rotated for the next time, the introduction of the pure water into the spray box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 are rotated for the fourth time, the alkaline cleaning solution is introduced into the spray box 602 through the pipeline, and the alkaline cleaning solution is sprayed downward by the atomizing nozzles 604 on the spray box 602 to uniformly disperse on the surface of the rotating wafer, and reacts with the organic additives on the wafer surface to remove them. Before the driven disc 6078 and the rotating shaft three 6074 are rotated for the next time, the introduction of the alkaline cleaning solution into the spray box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 are rotated for the fifth time, the pure water is introduced into the spray box 602 again, and the water flow sprayed by the spray box 602 at this time is used to flush away the alkaline cleaning solution on the wafer surface. Before the driven disc 6078 and the rotating shaft three 6074 are rotated for the next time, the introduction of the pure water into the spray box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 are rotated for the sixth time, the chelating agent is introduced into the spray box 602 through the pipeline, and the chelating agent is sprayed downward by the atomizing nozzles 604 on the spray box 602 to uniformly disperse on the surface of the rotating wafer, and the metal ions on the wafer surface are complexed to prevent them from precipitating again. Before the driven disc 6078 and the rotating shaft three 6074 are rotated for the next time, the introduction of the chelating agent into the spray box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 are rotated for the seventh time, the pure water is introduced into the spray box 602 again, and the water flow sprayed by the spray box 602 at this time is used to flush away all the residues on the wafer surface, completing the final rinsing of the wafer surface. Before the driven disc 6078 and the rotating shaft three 6074 are rotated for the next time, the introduction of the pure water into the spray box 602 is stopped. When the driven disc 6078 and the rotating shaft three 6074 rotate for the eighth time, the driving motor two 6071 is turned off, the driving motor one 302 is high-speed forward rotated to drive the wafer to rotate at high speed to spin dry the pure water remained on the wafer surface, the wafer is spin-dried, then the driving motor one 302 is slowly stopped, and then the driving motor one 302 is reversely rotated, at this time, the elastic telescopic guide rod 306 is blocked by the one-way guide block one 308 during rotation, and then enters the outer ring groove 3072 along the inclined groove 3073, the clamping jaw 304 is moved outward to loosen the clamping of the wafer, and then the wafer can be replaced; During the third and fifth rotation of the driven disc 6078 and the rotating shaft three 6074, the driven support 60713 is driven by the guide groove four 60711 to move downward by a certain distance, and during the fourth and sixth rotation of the driven disc 6078 and the rotating shaft three 6074, the driven support 60713 is driven by the guide groove four 60711 to move upward to reset, the downward movement of the driven support 60713 drives the connecting head two 60712 to move downward, and then the connecting head two 60712 is engaged with the connecting head one 60615, at this time, the rotating shaft one 6072 can drive the cylinder 60612 to rotate through the connecting head two 60712 and the connecting head one 60615, and the cylinder 60612 rotates one circle, and then the fixed guide rod 60614 and the sliding support 6068 are driven by the guide groove three 60613 to move downward and then move upward to reset, the flat plate 6069 fixedly connected with the sliding support 6068 also moves downward and then moves upward, the movement of the flat plate 6069 drives the movable guide rod 6065 to move in the guide transverse groove 6066 in an intermittent reciprocating manner through the guide groove two 60610, the movable guide rod 6065 drives the swing shaft 6062 to move in an intermittent reciprocating manner through the swing rod 6064, the cover plate 6063 intermittently closes and opens the communication pipe 6061, so that the pure water is sprayed in a pulse spraying manner, and the water pressure of the water flow when the pure water is sprayed in the pulse spraying manner is different from that when the pure water is directly sprayed, so that the water flow when the pure water is sprayed in the pulse spraying manner can cause greater impact on the wafer surface, and the cleaning effect is better.

[0027] The basic principles, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only preferred examples of the present application, and are not intended to limit the present application, and various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A wafer uniform electroplating apparatus comprising a wafer moving mechanism (1) provided on the ground, characterized in that: The wafer moving mechanism (1) is provided with a mounting plate (2), the mounting plate (2) is provided with a wafer clamping mechanism (3), the mounting plate (2) and the wafer moving mechanism (1) are provided with a driven turnover mechanism (4), one end of the wafer moving mechanism (1) is provided with an electroplating tank (5), the other end of the wafer moving mechanism (1) is provided with a wafer cleaning mechanism (6), the wafer cleaning mechanism (6) is provided with a collecting barrel (7) below, the wafer moving mechanism (1) can drive the wafer to lift and translate, the wafer clamping mechanism (3) can clamp the wafer and drive the wafer to rotate, the driven turnover mechanism (4) can change the orientation of the wafer, and the wafer cleaning mechanism (6) can clean the surface of the wafer after electroplating.

2. The wafer uniform electroplating apparatus of claim 1, wherein: The wafer moving mechanism (1) comprises two fixedly arranged fixed supports (101), one L-shaped plate (102) is fixedly connected to each of the fixed supports (101), an L-shaped sliding groove (103) is formed in the L-shaped plate (102), a connecting frame (104) is slidably connected to the two L-shaped plates (102), a linear motor (106) is arranged on each of the fixed supports (101), a connecting block (107) is fixedly connected to the mover of the linear motor (106), a connecting rod one (108) is rotatably connected to the connecting block (107), the connecting rod one (108) is also rotatably connected with the connecting frame (104), an angle maintaining assembly (109) is arranged between the L-shaped plate (102) and the connecting frame (104), and the angle maintaining assembly (109) can always keep the connecting frame (104) vertical.

3. The wafer uniform electroplating apparatus of claim 2, wherein: The angle maintaining assembly (109) comprises a sliding rail (1091) fixedly connected to the L-shaped plate (102), a movable block (1092) is slidably connected to the sliding rail (1091), a limiting rod (1093) is fixedly connected to the movable block (1092), the limiting rod (1093) is located directly above the connecting shaft (105), two waist round through holes (1041) are symmetrically formed in the connecting frame (104), and the limiting rod (1093) is slidably connected in the same side waist round through hole (1041).

4. The wafer uniform electroplating apparatus of claim 1, wherein: The wafer clamping mechanism (3) comprises a driving motor one (302) fixedly arranged on the mounting plate (2), a rotating support (303) is rotatably connected to the mounting plate (2), the top end of the rotating support (303) is fixedly connected with the output shaft of the driving motor one (302), four clamping claws (304) are uniformly and slidably connected to the rotating support (303), an extension strip plate (305) is fixedly connected to the clamping claw (304), an elastic telescopic guide rod (306) is fixedly connected to the end of the extension strip plate (305), a circular block (307) is fixedly connected to the mounting plate (2), and the elastic telescopic guide rod (306) is connected with the circular block (307).

5. The wafer uniform electroplating apparatus of claim 4, wherein: The circular block (307) is provided with an inner ring groove (3071) and an outer ring groove (3072), and four inclined grooves (3073) are uniformly arranged on the circular block (307), the inclined grooves (3073) are communicated with the inner ring groove (3071) and the outer ring groove (3072), the inner ring groove (3071) is fixedly connected with a one-way guide block one (308) at the intersection with the inclined groove (3073), the outer ring groove (3072) is fixedly connected with a one-way guide block two (309) at the intersection with the inclined groove (3073), and the elastic telescopic guide rod (306) is slidably connected in the inner ring groove (3071).

6. The wafer uniform electroplating apparatus of claim 2, wherein: The driven overturning mechanism (4) comprises two long strip plates (401), the two long strip plates (401) are symmetrically fixedly connected on the two fixed supports (101), the long strip plate (401) is provided with a guide groove one (402), the mounting plate (2) is symmetrically fixedly connected with two connecting rods two (403), the end of the connecting rod two (403) is fixedly connected with a driven guide rod (404), and the driven guide rod (404) is slidably connected in the guide groove one (402).

7. The wafer uniform electroplating apparatus of claim 2, wherein: The wafer cleaning mechanism (6) comprises a connecting support (601) fixedly connected on the fixed support (101), the lower end of the connecting support (601) is fixedly connected with a spraying box (602), the spraying box (602) is provided with a partition plate and is divided into four chambers, the upper portion of each chamber is provided with a liquid inlet (603), the lower portion of three chambers is provided with a plurality of atomizing nozzles (604), the liquid inlets (603) above the three chambers are respectively connected with an acid cleaning liquid, an alkaline cleaning liquid and a chelating agent through pipelines, the lower portion of the last chamber is provided with a plurality of spraying nozzles (605), the liquid inlet (603) above the spraying nozzles (605) is provided with a pulse generating assembly (606), the pulse generating assembly (606) is connected with pure water through a pipeline, and the connecting support (601) is further provided with a driving assembly (607).

8. The wafer uniform electroplating apparatus of claim 7, wherein: The pulse generating assembly (606) comprises a communicating pipe (6061) fixedly connected to the liquid inlet (603), a swing shaft (6062) rotatably connected to the communicating pipe (6061), two sealing plates (6063) fixedly connected to the swing shaft (6062) in a symmetrical mode, a swing rod (6064) fixedly connected to the swing shaft (6062), a movable guide rod (6065) slidably connected to the swing rod (6064), a guide transverse groove (6066) fixedly connected to the communicating pipe (6061), one end of the movable guide rod (6065) slidably connected to the guide transverse groove (6066), a connecting plate (6067) fixedly connected to the spraying box (602), a sliding support (6068) slidably connected to the connecting plate (6067), a flat plate (6069) fixedly connected to the sliding support (6068), a guide groove two (60610) formed in the flat plate (6069), the other end of the movable guide rod (6065) slidably connected to the guide groove two (60610), a spring one (60611) connected between the flat plate (6069) and the connecting plate (6067), a cylinder (60612) rotatably connected to the connecting plate (6067), a guide groove three (60613) formed in the cylinder (60612), a fixed guide rod (60614) fixedly connected to the sliding support (6068), the fixed guide rod (60614) slidably connected to the guide groove three (60613), a connecting head one (60615) slidably connected to the upper end of the cylinder (60612), a baffle (60616) fixedly connected to the upper end of the cylinder (60612), and a spring two (60617) connected between the connecting head one (60615) and the baffle (60616).

9. The wafer uniform electroplating apparatus of claim 8, wherein: The drive assembly (607) includes drive motor two (6071) fixedly connected on the connecting support (601), the connecting support (601) is also rotatably connected with rotating shaft one (6072), rotating shaft two (6073) and rotating shaft three (6074), the top end of rotating shaft one (6072) is fixedly connected with the output shaft of drive motor two (6071), straight gear (6075) is fixedly connected on rotating shaft one (6072), inner gear ring (6076) is fixedly connected on rotating shaft two (6073), straight gear (6075) is engaged with inner gear ring (6076), eccentric lever (6077) is also fixedly connected on rotating shaft two (6073), driven disc (6078) is fixedly connected on rotating shaft three (6074), eight slots (6079) are uniformly formed on the driven disc (6078), the eccentric lever (6077) is in one of the slots (6079) in the rotating process, the driven disc (6078) is driven to rotate one-eighth of a circle every rotation of the eccentric lever (6077), ring cylinder (60710) is also fixedly connected on rotating shaft three (6074), guide groove four (60711) is formed on the outer wall of the ring cylinder (60710), the lower end of rotating shaft one (6072) is slidably connected with connecting head two (60712), driven support (60713) is rotatably connected on connecting head two (60712), the driven support (60713) is also slidably connected on the connecting plate (6067), the end of the driven support (60713) is slidably connected in the guide groove four (60711).

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