Wafer cleaning method and cleaning apparatus

Abstract

The invention provides a cleaning method capable of obtaining cleaning efficiency with good reproducibility by forcibly controlling the shape of a wafer with a roller-type cleaning member. The brushing cleaning operation of the wafer (W) includes: a reference cleaning operation in which the wafer (W) is brushed and cleaned by a first roller-type cleaning member (7) and a second roller-type cleaning member (8) located at a reference cleaning position; a first offset cleaning operation in which the wafer (W) is brushed and cleaned by a first roller cleaning member (7) and a second roller cleaning member (8) which are located at a first offset cleaning position offset from the reference cleaning position in a direction toward the first roller cleaning member (7); and a second offset cleaning operation in which the wafer (W) is brushed and cleaned by the first roller cleaning member (7) and the second roller cleaning member (8) at a second offset cleaning position offset from the reference cleaning position in a direction toward the second roller cleaning member (8).

Description

TECHNICAL FIELD

[0001] The present application relates to a wafer cleaning method and a cleaning apparatus, and particularly relates to a wafer cleaning method and a cleaning apparatus that brush clean both surfaces of a wafer having a laminated wiring structure. BACKGROUND

[0002] In recent years, with the development of high integration of semiconductor devices, the wiring of the circuit is gradually miniaturized, and the distance between the wirings becomes narrower. In the manufacturing of semiconductor devices, various kinds of materials are repeatedly formed in a film shape on a silicon wafer, and a laminated structure is formed. In order to form this laminated structure, a technique for making the surface of the wafer flat is particularly important. As a means for planarizing the surface of such a wafer, a polishing apparatus (also referred to as a chemical mechanical polishing apparatus) that performs chemical mechanical polishing (CMP) is widely used.

[0003] Generally, this chemical mechanical polishing (CMP) apparatus has a polishing table on which a polishing pad is mounted, a polishing head that holds a wafer, and a nozzle that supplies a polishing liquid (slurry) to the polishing pad. By supplying the polishing liquid from the nozzle to the polishing pad while pressing the wafer on the polishing pad with the polishing head, and further moving the polishing head and the polishing table relative to each other, the wafer is polished.

[0004] After CMP, the polishing liquid, a product in polishing, or the like remains on the surface, the back surface, and the side surface (bevel portion) of the wafer. In the manufacturing process of semiconductor wafers, the cleanliness of the device formation surface is particularly important. Therefore, the wafer after polishing is transported from the polishing apparatus to a cleaning apparatus, and the wafer is cleaned by the cleaning apparatus. The cleaning apparatus brush cleans both surfaces of the wafer with a roll-type cleaning member while supplying a cleaning liquid to both surfaces of the wafer.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2023-45821

[0006] In recent years, the multilayer and three-dimensional development of wafers have progressed, and a phenomenon in which the wafer is warped has been reported. If the wafer is warped, the following problems occur: the roll-type cleaning member cannot properly contact the surface of the wafer, and the adhering matter on the wafer cannot be efficiently removed. The wafer is warped in a convex shape or in a concave shape depending on the kind of the wafer and the manufacturing process of the wafer. The current cleaning apparatus cleans wafers according to the same cleaning method regardless of the different warped shapes of the wafers, and it is difficult to ensure the cleaning efficiency for all wafers with different warped conditions. SUMMARY

[0007] An object of the present application is to provide a cleaning method and a cleaning apparatus that can obtain a cleaning efficiency with good reproducibility by forcibly controlling the shape of the wafer with a roll-type cleaning member regardless of the shape of the wafer.

[0008] In one embodiment, a cleaning method is provided, which is a cleaning method of cleaning a wafer, the cleaning method performing a brushing cleaning operation of brushing cleaning a first surface and a second surface of the wafer with a first roller cleaning member and a second roller cleaning member while rotating the wafer about a central axis with a plurality of holding rollers in contact with a peripheral portion of the wafer, the brushing cleaning operation including: a reference cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a reference cleaning position; a first offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a first offset cleaning position offset from the reference cleaning position in a direction toward the first roller cleaning member; and a second offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a second offset cleaning position offset from the reference cleaning position in a direction toward the second roller cleaning member.

[0009] In one embodiment, the reference cleaning operation, the first offset cleaning operation, and the second offset cleaning operation are performed in a predetermined order.

[0010] In one embodiment, the brushing cleaning operation further includes a first intermediate offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a first intermediate offset position between the reference cleaning position and the first offset cleaning position.

[0011] In one embodiment, the brushing cleaning operation further includes a second intermediate offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a second intermediate offset position between the reference cleaning position and the second offset cleaning position.

[0012] In one embodiment, a cleaning apparatus is provided, which is a cleaning apparatus that cleans a wafer, the cleaning apparatus including: a plurality of rotatable holding rollers that contact a peripheral portion of the wafer and rotate the wafer about a central axis; first and second roller cleaning members that scrub clean first and second surfaces of the wafer; a first actuator that links to the first roller cleaning member and moves the first roller cleaning member; a second actuator that links to the second roller cleaning member and moves the second roller cleaning member; and an operation control section that controls operation of the first and second actuators, the operation control section configured to provide instructions to the first and second actuators to move the first and second roller cleaning members to a reference cleaning position, a first offset cleaning position, and a second offset cleaning position, the cleaning apparatus configured to perform a scrub cleaning operation that includes a combination of a reference cleaning operation, a first offset cleaning operation, and a second offset cleaning operation, the reference cleaning operation using the first and second roller cleaning members positioned at the reference cleaning position to scrub clean the first and second surfaces of the wafer, the first offset cleaning operation using the first and second roller cleaning members positioned at the first offset cleaning position that is offset from the reference cleaning position in a direction toward the first roller cleaning member to scrub clean the first and second surfaces of the wafer, and the second offset cleaning operation using the first and second roller cleaning members positioned at the second offset cleaning position that is offset from the reference cleaning position in a direction toward the second roller cleaning member to scrub clean the first and second surfaces of the wafer.

[0013] In one embodiment, the operation control section is configured to provide instructions to the first and second actuators to move the first and second roller cleaning members to the reference cleaning position, the first offset cleaning position, and the second offset cleaning position in a predetermined order.

[0014] In one embodiment, the operation control section is configured to provide instructions to the first and second actuators to move the first and second roller cleaning members to a first intermediate offset position that is between the reference cleaning position and the first offset cleaning position, and the cleaning apparatus is further configured to perform a first intermediate offset cleaning operation that uses the first and second roller cleaning members positioned at the first intermediate offset position to scrub clean the first and second surfaces of the wafer.

[0015] In one mode, the above-mentioned action control section is configured to provide instructions to the above-mentioned first actuator and the above-mentioned second actuator to move the above-mentioned first roller cleaning member and the above-mentioned second roller cleaning member to a second intermediate offset cleaning position between the above-mentioned reference cleaning position and the above-mentioned second offset cleaning position, and the above-mentioned cleaning device is configured to further perform a second intermediate offset cleaning action of brushing and cleaning the above-mentioned first face and the above-mentioned second face of the above-mentioned wafer using the above-mentioned first roller cleaning member and the above-mentioned second roller cleaning member at the above-mentioned second intermediate offset cleaning position.

[0016] The first and second roller cleaning members are moved between the reference cleaning position, the first offset cleaning position, and the second offset cleaning position, thereby forcibly deforming the wafer in the first and second directions symmetrical with respect to the reference cleaning position during cleaning of the wafer. The pressure distribution applied to the wafer from the first and second roller cleaning members changes during cleaning of the wafer. As a result, cleaning can be performed with the same cleaning efficiency for wafers of arbitrary shapes. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a perspective view showing one embodiment of a cleaning device for cleaning a wafer.

[0018] Figure 2 is a view showing Figure 1 a detailed structure of the cleaning device shown in FIG. 1.

[0019] Figure 3 is a view explaining an action of cleaning a wafer.

[0020] Figure 4 is a view explaining a reference cleaning position of the first and second roller cleaning members.

[0021] Figure 5 is a view explaining a first offset cleaning position of the first and second roller cleaning members.

[0022] Figure 6 is a view explaining a second offset cleaning position of the first and second roller cleaning members.

[0023] Figure 7 is a view showing one embodiment of a brushing cleaning action of cleaning a wafer having a flat shape.

[0024] Figure 8 is a view showing one embodiment of a brushing cleaning action of cleaning a wafer having a convex shape on the first face.

[0025] Figure 9is a schematic view showing one embodiment of a scrubbing cleaning operation for cleaning a wafer having a concave shape on a first surface.

[0026] Figure 10 is a graph showing a distribution of pressure applied to a wafer from a first roller cleaning member and a second roller cleaning member during a first offset cleaning operation.

[0027] Figure 11 is a graph showing a distribution of pressure applied to a wafer from a first roller cleaning member and a second roller cleaning member during a second offset cleaning operation.

[0028] Figure 12 is a graph showing one embodiment of a first intermediate offset position between a reference cleaning position and a first offset cleaning position.

[0029] Figure 13 is a graph showing one embodiment of a second intermediate offset position between a reference cleaning position and a second offset cleaning position.

[0030] Figure 14 is a perspective view showing another embodiment of a cleaning apparatus.

[0031] Explanation of Reference Numerals

[0032] W... wafer; la... first surface; lb... second surface; 5... holding roller; 7... first roller cleaning member; 8... second roller cleaning member; 11... first cleaning liquid nozzle; 12... second cleaning liquid nozzle; 15... first rotating device; 16... second rotating device; 21... first actuator; 22... second actuator; 25... first support table; 26... second support table; 31... first rotating shaft; 32... second rotating shaft; 40... operation control section. DETAILED DESCRIPTION

[0033] Embodiments of the present application will be described below with reference to the drawings. Figure 1 is a perspective view showing one embodiment of a cleaning apparatus for cleaning a wafer. As shown in Figure 1 the cleaning apparatus is provided with: a plurality of holding rollers 5 that are rotatable, contact a peripheral portion of a wafer W, and rotate the wafer W about a center axis CL; and a first roller cleaning member 7 and a second roller cleaning member 8 that scrub clean a first surface la and a second surface lb of the wafer W.

[0034] The first surface la and the second surface lb of the wafer W are circular surfaces. The first surface la of the wafer W is, for example, a device surface on which a device or a device to be formed is formed. The second surface lb of the wafer W is, for example, a non-device surface on which a device or a device to be formed is not formed. The second surface lb is located on the side opposite to the first surface la.

[0035] The plurality of holding rollers 5 are disposed around the central axis CL. The plurality of holding rollers 5 when holding the wafer W are at the same distance from the central axis CL. The center of the wafer W held by the plurality of holding rollers 5 is located on the central axis CL. In the present embodiment, four holding rollers 5 are disposed, but five or more holding rollers 5 can be disposed. The plurality of holding rollers 5 are connected to a roller rotation device not shown, and are rotated at the same rotational speed in the same direction by the roller rotation device as shown. Figure 1 Each holding roller 5 has a wafer holding groove 5a formed on the outer circumferential surface thereof. The wafer holding groove 5a is a circular ring-shaped groove extending in the circumferential direction of the outer circumferential surface of each holding roller 5. The width of the wafer holding groove 5a is larger than the thickness of the wafer W, and the peripheral edge portion of the wafer W is in contact with the plurality of wafer holding grooves 5a of the plurality of holding rollers 5. These wafer holding grooves 5a stabilize the posture of the rotating wafer W.

[0036] The first and second roller-type cleaning members 7 and 8 each have a cylindrical shape. The first and second roller-type cleaning members 7 and 8 are connected to the first and second rotation devices described later, and are rotated about the center of the axis thereof by the first and second rotation devices. The first and second roller-type cleaning members 7 and 8 are each made of an elastic material such as a sponge. The first and second roller-type cleaning members 7 and 8 are in sliding contact with the first and second surfaces la and lb of the wafer W while rotating, thereby performing scrub cleaning of the first and second surfaces la and lb.

[0037] In the cleaning process of the wafer W, the first roller-type cleaning member 7 is in contact with the center of the first surface la of the wafer W, and the second roller-type cleaning member 8 is in contact with the center of the second surface lb of the wafer W. In one embodiment, the central axis Rl of the first roller-type cleaning member 7 passes through the central axis CL, and the central axis R2 of the second roller-type cleaning member 8 also passes through the central axis CL. The axial length of each of the first and second roller-type cleaning members 7 and 8 is the same as or larger than the diameter of the wafer W. In one embodiment, as shown in FIG. 2, both ends of each of the first and second roller-type cleaning members 7 and 8 protrude from the wafer W. The first and second roller-type cleaning members 7 and 8 can be in contact with the entire first surface la and the entire second surface lb of the wafer W. Figure 1

[0038] ​The cleaning device has a first cleaning liquid nozzle 11 that is adjacent to the first roller cleaning member 7, and a second cleaning liquid nozzle 12 that is adjacent to the second roller cleaning member 8. The first cleaning liquid nozzle 11 supplies cleaning liquid to the first surface la of the wafer W held and rotated by the plurality of holding rollers 5, and the second cleaning liquid nozzle 12 supplies cleaning liquid to the second surface lb of the wafer W held and rotated by the plurality of holding rollers 5. The first roller cleaning member 7 and the second roller cleaning member 8 brush clean the first surface la and the second surface lb of the wafer W in the presence of cleaning liquid. As examples of the cleaning liquid, a chemical liquid, pure water, and a combination thereof can be listed.

[0039] Figure 2 is a view that shows one embodiment of the detailed structure of the cleaning device shown in Figure 1 As shown in Figure 2 , the cleaning device has a first rotation device 15 that rotates the first roller cleaning member 7 with its axis as the center, a second rotation device 16 that rotates the second roller cleaning member 8 with its axis as the center, a first actuator 21 that moves the first roller cleaning member 7, a second actuator 22 that moves the second roller cleaning member 8, a first support table 25 that supports the first roller cleaning member 7 so as to be rotatable, and a second support table 26 that supports the second roller cleaning member 8 so as to be rotatable.

[0040] The first rotation device 15 is fixed to the first support table 25, and the second rotation device 16 is fixed to the second support table 26. The first rotation device 15 is linked to the first roller cleaning member 7 via a first rotation shaft 31, and the second rotation device 16 is linked to the second roller cleaning member 8 via a second rotation shaft 32. The detailed structure of the first rotation device 15 and the second rotation device 16 is not particularly limited, and for example, a motor or a combination of a motor and a torque transmission mechanism (for example, a belt or a gear) can be listed.

[0041] The first actuator 21 is linked to the first roller cleaning member 7 via the first support table 25, and the second actuator 22 is linked to the second roller cleaning member 8 via the second support table 26. More specifically, the first actuator 21 is linked to the first support table 25 that supports the first roller cleaning member 7 so as to be rotatable, and the second actuator 22 is linked to the second support table 26 that supports the second roller cleaning member 8 so as to be rotatable.

[0042] As shown by the arrow in Figure 2 , the first actuator 21 integrally moves the first roller cleaning member 7, the first support table 25, and the first rotation device 15 in a direction that approaches the first surface la of the wafer W and a direction that is away from the first surface la. As shown by the arrow in Figure 2As indicated by an arrow, the second actuator 22 moves the second roller cleaning member 8, the second support table 26, and the second rotating device 16 integrally in a direction approaching the second surface lb of the wafer W and a direction away from the second surface lb.

[0043] The specific structure of the first actuator 21 and the second actuator 22 is not particularly limited, and for example, a combination of a cylinder and a pressure regulator, a combination of a ball screw mechanism and a servo motor can be cited.

[0044] The cleaning device is provided with an action control section 40 that controls the actions of the roller rotating device (not shown), the first rotating device 15, the second rotating device 16, the first actuator 21, and the second actuator 22. The roller rotating device (not shown), the first rotating device 15, the second rotating device 16, the first actuator 21, and the second actuator 22 are electrically connected to the action control section 40.

[0045] The action control section 40 is provided with a storage device 40a in which a program is stored and an arithmetic device 40b that performs an operation according to a command included in the program. The action control section 40 is constituted by at least one computer. The storage device 40a is provided with a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD), a solid state drive (SSD). As an example of the arithmetic device 40b, a CPU (central processing unit), a GPU (graphics processing unit) can be cited. However, the specific structure of the action control section 40 is not limited to these examples.

[0046] The cleaning of the wafer W is performed as follows. The wafer W is held by the plurality of holding rollers 5. Thereafter, while the cleaning liquid is supplied from the first cleaning liquid nozzle 11 and the second cleaning liquid nozzle 12 to the first surface la and the second surface lb of the wafer W, the wafer W is rotated by the plurality of holding rollers 5, and the first roller cleaning member 7 and the second roller cleaning member 8 are rotated by the first rotating device 15 and the second rotating device 16. When the rotation speed of the wafer W reaches a prescribed rotation speed, as shown in FIG. 2, the first actuator 21 and the second actuator 22 bring the first roller cleaning member 7 and the second roller cleaning member 8 into contact with the first surface la and the second surface lb of the rotating wafer W. Figure 3

[0047] The action control section 40 is configured to provide an instruction to the first actuator 21 and the second actuator 22 so that the first roller cleaning member 7 and the second roller cleaning member 8 are moved to the reference cleaning position, the first offset cleaning position, and the second offset cleaning position in a predetermined order during the cleaning of the wafer W.

[0048] ​Figure 4 is a view that illustrates a reference cleaning position of the first roll cleaning member 7 and the second roll cleaning member 8. The reference cleaning position is a position at which the center point CP of the wafer W exists within a plane (imaginary plane) ST passing through the plurality of wafer holding grooves 5a of the plurality of holding rollers 5. When the wafer W is clamped by the first roll cleaning member 7 and the second roll cleaning member 8 located at the reference cleaning position, as shown in Figure 4 , the wafer W is held in a flat shape. In the present specification, the scrub cleaning of the wafer W by the first roll cleaning member 7 and the second roll cleaning member 8 located at the reference cleaning position will be defined as a reference cleaning operation.

[0049] Figure 5 is a view that illustrates a first offset cleaning position of the first roll cleaning member 7 and the second roll cleaning member 8. The first offset cleaning position is a position that is offset in a direction toward the first roll cleaning member 7 from the reference cleaning position shown in Figure 4 . The center point CP of the wafer W is separated from the plane ST and is located between the first roll cleaning member 7 and the plane ST. When the wafer W is clamped by the first roll cleaning member 7 and the second roll cleaning member 8 located at the first offset cleaning position, as shown in Figure 5 , the first surface la of the wafer W is held in a convex shape and the second surface lb of the wafer W is held in a concave shape. In the present specification, the scrub cleaning of the wafer W by the first roll cleaning member 7 and the second roll cleaning member 8 located at the first offset cleaning position will be defined as a first offset cleaning operation.

[0050] Figure 6 is a view that illustrates a second offset cleaning position of the first roll cleaning member 7 and the second roll cleaning member 8. The second offset cleaning position is a position that is offset in a direction toward the second roll cleaning member 8 from the reference cleaning position shown in Figure 4 . The center point CP of the wafer W is separated from the plane ST and is located between the second roll cleaning member 8 and the plane ST. When the wafer W is clamped by the first roll cleaning member 7 and the second roll cleaning member 8 located at the second offset cleaning position, as shown in Figure 6 , the first surface la of the wafer W is held in a concave shape and the second surface lb of the wafer W is held in a convex shape. In the present specification, the scrub cleaning of the wafer W by the first roll cleaning member 7 and the second roll cleaning member 8 located at the second offset cleaning position will be defined as a second offset cleaning operation.

[0051] The cleaning device is configured to perform a scrub cleaning operation including a combination of the reference cleaning operation, the first offset cleaning operation, and the second offset cleaning operation.

[0052] Hereinafter, embodiments of the scrub cleaning operation of the cleaning device will be described in detail. Figure 7is a schematic view showing one embodiment of a scrub cleaning operation for cleaning a wafer W having a flat shape. In this embodiment, the scrub cleaning operation of the wafer W is performed in the order of a first bias cleaning operation, a reference cleaning operation, and a second bias cleaning operation. In one embodiment, the first bias cleaning operation, the reference cleaning operation, and the second bias cleaning operation are performed for the same time.

[0053] Figure 8 is a schematic view showing one embodiment of a scrub cleaning operation for cleaning a wafer W having a convex shape on the first surface la, Figure 9 is a schematic view showing one embodiment of a scrub cleaning operation for cleaning a wafer W having a concave shape on the first surface la. In these embodiments, the scrub cleaning operation of the wafer W is also performed in the order of a first bias cleaning operation, a reference cleaning operation, and a second bias cleaning operation. In one embodiment, the first bias cleaning operation, the reference cleaning operation, and the second bias cleaning operation are performed for the same time.

[0054] Figure 10 is a graph showing the distribution of the pressure applied to the wafer W from the first and second roll cleaning members 7 and 8 during the first bias cleaning operation. As shown in Figure 10 , the pressure PC1 applied to the center portion of the first surface la of the wafer W from the first roll cleaning member 7 is greater than the pressure PE1 applied to the edge portion of the first surface la of the wafer W from the first roll cleaning member 7. On the other hand, the pressure PC2 applied to the center portion of the second surface lb of the wafer W from the second roll cleaning member 8 is smaller than the pressure PE2 applied to the edge portion of the second surface lb of the wafer W from the second roll cleaning member 8.

[0055] Figure 11 is a graph showing the distribution of the pressure applied to the wafer W from the first and second roll cleaning members 7 and 8 during the second bias cleaning operation. As shown in Figure 11 , the pressure PC1 applied to the center portion of the first surface la of the wafer W from the first roll cleaning member 7 is smaller than the pressure PE1 applied to the edge portion of the first surface la of the wafer W from the first roll cleaning member 7. On the other hand, the pressure PC2 applied to the center portion of the second surface lb of the wafer W from the second roll cleaning member 8 is greater than the pressure PE2 applied to the edge portion of the second surface lb of the wafer W from the second roll cleaning member 8.

[0056] From Figure 10 and Figure 11 , it is understood that the distribution of the pressure applied to the wafer W from the first and second roll cleaning members 7 and 8 is different between the first bias cleaning operation and the second bias cleaning operation. For Figure 7 to Figure 9The different shapes of the wafer W also similarly cause the difference in the pressure distribution. The cleaning apparatus is able to clean the wafer W with the same cleaning efficiency (improvement in reproducibility of cleaning) for any shape of the wafer W by causing the difference in the pressure distribution during the scrubbing cleaning operation of the wafer W. That is, the cleaning apparatus is able to clean the wafer W with the same cleaning efficiency for any shape of the wafer W, regardless of whether the first surface la of the wafer W is a convex shape, whether the second surface lb of the wafer W is a convex shape, or whether the wafer W is a wavy shape. The cleaning apparatus is able to clean the wafer W with the same cleaning efficiency for any shape of the wafer W by causing the difference in the pressure distribution during the scrubbing cleaning operation of the wafer W. Figure 10 and Figure 11 The different pressure distributions shown clean the wafer W. As a result, it is possible to reduce the unevenness of cleaning caused by the shape of the wafer W.

[0057] The order of the first bias cleaning operation, the reference cleaning operation, and the second bias cleaning operation is not limited to the above-described embodiment. As examples of the order of the first bias cleaning operation, the reference cleaning operation, and the second bias cleaning operation, the following can be listed.

[0058] • The first bias cleaning operation → the reference cleaning operation → the second bias cleaning operation

[0059] • The second bias cleaning operation → the reference cleaning operation → the first bias cleaning operation

[0060] • The reference cleaning operation → the first bias cleaning operation → the second bias cleaning operation

[0061] • The reference cleaning operation → the second bias cleaning operation → the first bias cleaning operation

[0062] • The first bias cleaning operation → the second bias cleaning operation → the reference cleaning operation

[0063] • The second bias cleaning operation → the first bias cleaning operation → the reference cleaning operation

[0064] In one embodiment, as shown in Figure 12 The operation control section 40 is configured to provide an instruction to the first actuator 21 and the second actuator 22 to move the first roll-type cleaning member 7 and the second roll-type cleaning member 8 to a first intermediate bias cleaning position that is located between the reference cleaning position and the first bias cleaning position. The cleaning apparatus is configured to further perform a first intermediate bias cleaning operation that performs scrubbing cleaning of the first surface la and the second surface lb of the wafer W with the first roll-type cleaning member 7 and the second roll-type cleaning member 8 located at the first intermediate bias cleaning position. In this specification, the scrubbing cleaning of the wafer W with the first roll-type cleaning member 7 and the second roll-type cleaning member 8 located at the first intermediate bias cleaning position is defined as the first intermediate bias cleaning operation.

[0065] In one embodiment, the first intermediate offset cleaning operation is performed for the same time as the reference cleaning operation, the first offset cleaning operation, and the second offset cleaning operation. The first intermediate offset cleaning operation can form a pressure distribution different from that of the first offset cleaning operation. In particular, the first intermediate offset cleaning operation can increase the pressure at an intermediate portion between the center portion and the edge portion of the first surface la of the wafer W. As a result, the cleaning apparatus can clean wafers W of various shapes with the same cleaning efficiency.

[0066] The order of the reference cleaning operation, the first offset cleaning operation, the first intermediate offset cleaning operation, and the second offset cleaning operation is not particularly limited. For example, the first intermediate offset cleaning operation can be performed before the first offset cleaning operation, or can be performed after the first offset cleaning operation.

[0067] In one embodiment, as shown in FIG. 6, the operation control section 40 is configured to provide instructions to the first actuator 21 and the second actuator 22 to move the first roller cleaning member 7 and the second roller cleaning member 8 to a second intermediate offset position between the reference cleaning position and the second offset cleaning position. The cleaning apparatus is configured to further perform a second intermediate offset cleaning operation in which the first roller cleaning member 7 and the second roller cleaning member 8 at the second intermediate offset position are used to brush clean the first surface la and the second surface lb of the wafer W. In this specification, the brush cleaning of the wafer W using the first roller cleaning member 7 and the second roller cleaning member 8 at the second intermediate offset cleaning position is defined as the second intermediate offset cleaning operation. Figure 13 In one embodiment, the second intermediate offset cleaning operation is performed for the same time as the reference cleaning operation, the first offset cleaning operation, and the second offset cleaning operation. The second intermediate offset cleaning operation can form a pressure distribution different from that of the second offset cleaning operation. In particular, the second intermediate offset cleaning operation can increase the pressure at an intermediate portion between the center portion and the edge portion of the second surface lb of the wafer W. As a result, the cleaning apparatus can clean wafers W of various shapes with the same cleaning efficiency.

[0068] The order of the reference cleaning operation, the first offset cleaning operation, the second intermediate offset cleaning operation, and the second offset cleaning operation is not particularly limited. For example, the second intermediate offset cleaning operation can be performed before the second offset cleaning operation, or can be performed after the second offset cleaning operation.

[0069]

[0070] ​In one embodiment, the cleaning apparatus is configured to perform a scrub cleaning operation including a combination of a reference cleaning operation, a first offset cleaning operation, a first intermediate offset cleaning operation, a second offset cleaning operation, and a second intermediate offset cleaning operation. The order of the reference cleaning operation, the first offset cleaning operation, the first intermediate offset cleaning operation, the second offset cleaning operation, and the second intermediate offset cleaning operation is not particularly limited. Examples of the order are described below, but the order of the scrub cleaning operation is not limited to the examples below.

[0071] • the first offset cleaning operation → the first intermediate offset cleaning operation → the reference cleaning operation → the second intermediate offset cleaning operation → the second offset cleaning operation

[0072] • the second offset cleaning operation → the second intermediate offset cleaning operation → the reference cleaning operation → the first intermediate offset cleaning operation → the first offset cleaning operation

[0073] • the reference cleaning operation → the first offset cleaning operation → the first intermediate offset cleaning operation → the second intermediate offset cleaning operation → the second offset cleaning operation

[0074] • the reference cleaning operation → the second offset cleaning operation → the second intermediate offset cleaning operation → the first intermediate offset cleaning operation → the first offset cleaning operation

[0075] • the first intermediate offset cleaning operation → the first offset cleaning operation → the second offset cleaning operation → the second intermediate offset cleaning operation → the reference cleaning operation

[0076] • the second intermediate offset cleaning operation → the second offset cleaning operation → the first offset cleaning operation → the first intermediate offset cleaning operation → the reference cleaning operation

[0077] In the embodiment described with reference to Figure 1 to Figure 13 the wafer W is cleaned in a horizontal attitude. In one embodiment, as shown in Figure 14 the cleaning apparatus can also be configured to clean the wafer W in a vertical attitude. In other embodiments, although not shown, the wafer W can also be cleaned in an inclined attitude.

[0078] The above-described embodiments are described for the purpose of enabling those skilled in the art to carry out the present application. If those skilled in the art, of course, can carry out various modifications of the above-described embodiments, the technical idea of the present application can also be applied to other embodiments. Therefore, the present application is not limited to the described embodiments, and can be interpreted as the largest range according to the technical idea defined by the claims.

Claims

1. A cleaning method which is a cleaning method of a wafer, the cleaning method characterized by, performing a brushing cleaning operation of brushing cleaning a first surface and a second surface of the wafer with a first roller cleaning member and a second roller cleaning member, while rotating the wafer with a plurality of holding rollers in contact with a peripheral edge portion of the wafer about a center axis, the brushing cleaning operation including: a reference cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a reference cleaning position; a first offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a first offset cleaning position offset from the reference cleaning position toward a direction of the first roller cleaning member; and a second offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a second offset cleaning position offset from the reference cleaning position toward a direction of the second roller cleaning member.

2. The cleaning method according to claim 1, characterized in that, the reference cleaning operation, the first offset cleaning operation, and the second offset cleaning operation are performed in a predetermined order.

3. The cleaning method according to claim 1, characterized in that, the brushing cleaning operation further includes a first intermediate offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a first intermediate offset position, the first intermediate offset position is between the reference cleaning position and the first offset cleaning position.

4. The cleaning method according to claim 1, characterized in that, the brushing cleaning operation further includes a second intermediate offset cleaning operation of brushing cleaning the first surface and the second surface of the wafer with the first roller cleaning member and the second roller cleaning member positioned at a second intermediate offset position, the second intermediate offset position is between the reference cleaning position and the second offset cleaning position.

5. A cleaning apparatus which is a cleaning apparatus of a wafer, the cleaning apparatus characterized by, a plurality of holding rollers capable of rotating, which are in contact with a peripheral edge portion of the wafer, and which rotate the wafer about a center axis; a first roller cleaning member and a second roller cleaning member which brush clean a first surface and a second surface of the wafer; a first actuator which is linked to the first roller cleaning member, and which moves the first roller cleaning member; a second actuator which is linked to the second roller cleaning member, and which moves the second roller cleaning member; and an operation control section which controls operations of the first actuator and the second actuator. ​ ​ The action control section is configured to provide instructions to the first actuator and the second actuator to move the first roll cleaning member and the second roll cleaning member to the reference cleaning position, the first offset cleaning position, and the second offset cleaning position, The cleaning device is configured to perform a scrub cleaning action that includes a combination of a reference cleaning action, a first offset cleaning action, and a second offset cleaning action, wherein The reference cleaning action uses the first roll cleaning member and the second roll cleaning member positioned at the reference cleaning position to scrub clean the first side and the second side of the wafer, The first offset cleaning action uses the first roll cleaning member and the second roll cleaning member positioned at the first offset cleaning position that is offset from the reference cleaning position in a direction toward the first roll cleaning member to scrub clean the first side and the second side of the wafer, The second offset cleaning action uses the first roll cleaning member and the second roll cleaning member positioned at the second offset cleaning position that is offset from the reference cleaning position in a direction toward the second roll cleaning member to scrub clean the first side and the second side of the wafer.

6. The cleaning device of claim 5, wherein The action control section is configured to provide instructions to the first actuator and the second actuator to move the first roll cleaning member and the second roll cleaning member to the reference cleaning position, the first offset cleaning position, and the second offset cleaning position in a predetermined order.

7. The cleaning device of claim 5, wherein The action control section is configured to provide instructions to the first actuator and the second actuator to move the first roll cleaning member and the second roll cleaning member to a first intermediate offset position that is positioned between the reference cleaning position and the first offset cleaning position, The cleaning device is configured to further perform a first intermediate offset cleaning action that uses the first roll cleaning member and the second roll cleaning member positioned at the first intermediate offset position to scrub clean the first side and the second side of the wafer.

8. The cleaning device of claim 5, wherein The action control section is configured to provide instructions to the first actuator and the second actuator to move the first roll cleaning member and the second roll cleaning member to a second intermediate offset position that is positioned between the reference cleaning position and the second offset cleaning position, The cleaning device is configured to further perform a second intermediate offset cleaning action that uses the first roll cleaning member and the second roll cleaning member positioned at the second intermediate offset position to scrub clean the first side and the second side of the wafer.

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